Thickness cooling air device for overflow method substrate glass forming and use method of thickness cooling air device

Abstract

The invention discloses a thickness cooling air device for overflow method substrate glass forming and a using method thereof.The thickness cooling air device comprises two soaking box bodies and a cooling mechanism which are arranged at the bottom of an overflow brick, the soaking box bodies are located on the two sides of substrate glass correspondingly, and the cooling mechanism comprises a plurality of first cooling air pipes, a plurality of second cooling air pipes and a fixing assembly; the first cooling air pipe is arranged outside the soaking box body, and an air inlet of the first cooling air pipe is used for being communicated with cooling air; the second cooling air pipe penetrates through the soaking box body, an air outlet of the second cooling air pipe is close to the substrate glass, and the second cooling air pipe is made of a high-temperature-resistant material; and the first cooling air pipe and the second cooling air pipe are communicated through a fixing assembly. The problems that the thickness of the glass plate is repeatedly adjusted, the efficiency is low and the precision is poor due to the fact that the relative position between cooling air and the glass plate cannot be accurately adjusted due to the fact that a thickness air pipe is prone to deformation after long-term use can be solved.

Description

Technical Field

[0001] The present application belongs to the technical field of glass manufacturing, and in particular relates to a thickness cooling air device for overflow method substrate glass molding and a method of using the same. Background Art

[0002] In the development of the flat panel display industry, the overflow down-draw method is an important process for the production of substrate glass. The molten glass flows down from the overflow brick and needs to pass through the thickness forming area, stress control area and warp adjustment area to form a glass plate with uniform thickness and smooth surface. Among them, the thickness forming area is crucial. In order to ensure that the glass plate is quickly cooled and formed, a thickness air duct is set in the heat-saturating box to perform heat exchange on the glass plate through the cooling air volume to adjust the thickness.

[0003] However, as display technology develops towards higher definition, thinner and larger size, the requirements for controlling the thickness uniformity of glass substrates are becoming increasingly stringent.

[0004] However, due to the long-term use of traditional technologies, the thickness of the air duct is prone to deformation, which makes it impossible to accurately adjust the relative position of the cooling air to the glass plate, resulting in repeated adjustment of the thickness of the glass plate, low efficiency, and poor accuracy. Summary of the invention

[0005] The purpose of the embodiment of the present application is to provide a thickness cooling air device for overflow method substrate glass molding and its use method, so as to solve the problem that the thickness air duct is easily deformed after long-term use, which makes it impossible to accurately adjust the relative position of the cooling air to the glass plate, and then the glass plate thickness adjustment is repeated, the efficiency is low, and the precision is poor.

[0006] In order to achieve the above objectives, this application adopts the following technical solutions: In a first aspect, a thickness cooling wind device for overflow method substrate glass molding is provided, comprising two heat equalizing boxes and a cooling mechanism arranged at the bottom of the overflow brick; The heat-saturating boxes are respectively located on both sides of the substrate glass; The cooling mechanism includes a plurality of first cooling air ducts, a second cooling air duct and a fixing assembly; The first cooling air duct is arranged outside the heat equalizing box, and the air inlet of the first cooling air duct is connected to the cooling air; The second cooling air duct is arranged to penetrate the heat equalizing box, the air outlet of the second cooling air duct is arranged close to the substrate glass, and the second cooling air duct is arranged to be made of high temperature resistant material; The first cooling air duct and the second cooling air duct are both connected via a fixing component.

[0007] In a possible implementation, the fixing assembly includes a fixing seat, a mounting step and a fixing member; The fixing seat and the mounting step are respectively arranged between the first cooling air duct and the second cooling air duct; The fixing seat is connected and arranged on the first cooling air duct, and the mounting step is connected and arranged on the second cooling air duct; The fixing piece passes through one end of the fixing seat and is fixed on the heat equalizing box body, so as to realize the connection setting between the first cooling air duct and the second cooling air duct.

[0008] In a possible implementation, the installation step protrudes from the surface of the heat equalizing box by 5-15 mm.

[0009] In a possible implementation, a mounting groove for accommodating the mounting step is formed on the fixing seat.

[0010] In a possible implementation, a sealing member is disposed in the mounting groove.

[0011] In a possible implementation manner, the first cooling air duct is made of metal material.

[0012] In a possible implementation, the second cooling air duct is made of corundum.

[0013] In a possible implementation manner, it further includes a first crossbeam for fixing the first cooling air duct.

[0014] In a possible implementation, a second cross beam is disposed inside the heat equalizing box, and the second cooling air ducts are disposed through the second cross beam.

[0015] In a second aspect, a method for using a thickness cooling air device for overflow method substrate glass molding is provided, comprising the following steps: The first cooling air duct and the second cooling air duct are connected and fixed by a fixing component; The cooling air is blown in through the first cooling air duct and blown toward the equalizing box through the air outlet of the second cooling air duct, so that the cooling air exchanges heat with the equalizing box and the substrate glass, thereby reducing the temperature of the corresponding position of the substrate glass, increasing the viscosity, and alleviating the mutual influence of the lateral tension of the substrate glass, thereby adjusting the thickness of the substrate glass.

[0016] Compared with the prior art, this application has the following beneficial effects: The present application provides a thickness cooling air device for overflow method substrate glass molding. A first cooling air duct and a second cooling air duct can be assembled through a fixing component, and the second cooling air duct is made of high temperature resistant material, which can reduce the situation where the second cooling air duct is ablated or deformed during long-term use, and is convenient for accurately adjusting the relative position of the cooling air and the substrate glass, thereby facilitating the adjustment of the thickness of the substrate glass, thereby improving the adjustment accuracy and efficiency of the substrate glass; at the same time, the increase in the size of the heat equalizing air box requires a longer air duct, and the difficulty of installation increases dramatically. By assembling the first cooling air duct and the second cooling air duct, installation is facilitated and production costs are reduced.

[0017] In one possible implementation, the fixing parts are easy to operate and facilitate assembly between the first cooling air duct and the second cooling air duct, thereby achieving fixation of the first cooling air duct and the second cooling air duct on the heat equalizing box, facilitating blowing the cooling air into the heat equalizing box through the first cooling air duct and the second cooling air duct, thereby enabling heat exchange between the cooling air and the heat equalizing box.

[0018] In a possible implementation, the installation step is made to protrude 5-15 mm from the surface of the heat equalizing box, which can enhance the installation strength of the second cooling air duct on the heat equalizing box, thereby improving the installation stability of the second cooling air duct.

[0019] In a possible implementation, a mounting groove for accommodating the mounting step is provided on the fixing seat, which is simple to operate and convenient to install, and can improve the mounting stability between the fixing seat and the mounting step, thereby improving the adaptability.

[0020] In one possible implementation, by providing a seal in the installation groove, the sealing performance between the first cooling air duct and the second cooling air duct can be enhanced, the connection stability can be improved, the energy loss can be reduced, and the maintenance and replacement can be simplified, thereby improving the overall performance and reliability.

[0021] In one possible implementation, by setting the second cooling air duct to be a corundum material, the high temperature resistance of the second cooling air duct can be improved, and the ablation or deformation of the second cooling air duct in the heat equalization box can be reduced, which facilitates the precise adjustment of the relative position of the cooling air and the substrate glass, and then facilitates the adjustment of the thickness of the substrate glass, which can improve the adjustment accuracy and efficiency of the substrate glass.

[0022] In a possible implementation, the first crossbeam is provided to support the first cooling air duct, and can provide a certain supporting effect on the first cooling air duct, thereby improving the stability of the first cooling air duct.

[0023] In a possible implementation, by setting a second cross beam in the heat equalizing box, the second cooling air duct runs through the second cross beam, which can provide a certain support effect for the second cooling air duct and improve the stability of the second cooling air duct in the heat equalizing box.

[0024] In a possible implementation, a method for using a thickness cooling air device for overflow method substrate glass molding has significant beneficial effects, and can improve product quality, reduce production costs, improve production efficiency, and save energy and protect the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A cross-sectional view of a thickness cooling air device for overflow method substrate glass molding provided in the present application; Figure 2 for Figure 1 An enlarged schematic diagram of the fixed components.

[0026] Reference numerals in the figure: 1. heat-averaging box; 2. cooling mechanism; 21. first cooling air duct; 22. second cooling air duct; 23. fixing assembly; 231. fixing seat; 232. mounting step; 233. fixing member; 234. mounting groove; 235. sealing member; 24. first crossbeam; 25. second crossbeam; 3. substrate glass. DETAILED DESCRIPTION

[0027] The specific implementation methods of the present application are further described in detail below in conjunction with the accompanying drawings.

[0028] like Figure 1 and Figure 2 As shown, the present application provides a thickness cooling wind device for overflow method substrate glass molding, which may include two heat equalizing boxes 1 and a cooling mechanism 2 arranged at the bottom of the overflow brick.

[0029] The heat equalizing box 1 is respectively located on both sides of the substrate glass 3, and cools down the corresponding positions on both sides of the substrate glass 3 during the overflow and downward pulling process of the substrate glass 3. The heat equalizing box 1 can be set to silicon carbide material, which has high thermal conductivity and is convenient for quickly forming heat exchange with the substrate glass 3, thereby achieving rapid cooling of the substrate glass 3, changing the glass shrinkage, and achieving the purpose of adjusting the glass thickness.

[0030] The cooling mechanism 2 may include a plurality of first cooling air ducts 21 , a second cooling air duct 22 and a fixing assembly 23 .

[0031] The first cooling air duct 21 is disposed outside the heat equalizing box 1 , and an air inlet of the first cooling air duct 21 is in communication with the cooling air.

[0032] The second cooling air duct 22 is arranged to penetrate the heat equalizing box 1, and the air outlet of the second cooling air duct 22 is arranged close to the substrate glass 3, and the second cooling air duct 22 is made of high temperature resistant material.

[0033] The first cooling air duct 21 and the second cooling air duct 22 are both connected via a fixing assembly 23 .

[0034] The fixing assembly 23 is adjusted to fix the first cooling air duct 21 and the second cooling air duct 22, and a certain amount of cooling air is blown into the heat equalizing box 1 through the first cooling air duct 21 and the second cooling air duct 22. Heat exchange occurs between the heat equalizing box 1 and the substrate glass 3, thereby reducing the temperature of the corresponding position of the substrate glass 3. The increase in viscosity reduces the influence of the shrinkage force on both sides of the corresponding position of the substrate glass 3, thereby achieving the purpose of adjusting the basic thickness of the substrate glass 3.

[0035] In the embodiment of the present application, the fixing component 23 is used to facilitate the assembly of the first cooling air duct 21 and the second cooling air duct 22, and the second cooling air duct 22 is made of high-temperature resistant material, which can reduce the situation where the second cooling air duct 22 is ablated or deformed during long-term use in the heat equalizing box 1, and is convenient for accurately adjusting the relative position of the cooling air and the substrate glass 3, and then facilitating the adjustment of the thickness of the substrate glass 3, thereby improving the adjustment accuracy and efficiency of the substrate glass 3; at the same time, the increase in the size of the heat equalizing air box requires a longer air duct, and the difficulty of installation increases dramatically. By assembling the first cooling air duct 21 and the second cooling air duct 22, installation is facilitated and production costs are reduced.

[0036] In a possible implementation, the fixing assembly 23 may include a fixing seat 231 , a mounting step 232 , and a fixing member 233 .

[0037] The fixing seat 231 and the mounting step 232 are respectively disposed between the first cooling air duct 21 and the second cooling air duct 22 . The fixing seat 231 is disposed on the first cooling air duct 21 and is integrally connected with the first cooling air duct 21 .

[0038] The installation step 232 is disposed on the second cooling air duct 22 and is integrally connected to the second cooling air duct 22 .

[0039] The fixing member 233 passes through one end of the fixing seat 231 and is fixed to the heat equalizing box 1, so as to fix the first cooling air duct 21 and the second cooling air duct 22, and the cooling air can be sequentially blown into the heat equalizing box 1 through the first cooling air duct 21 and the second cooling air duct 22. Specifically, the fixing member 233 can be set as a fixing bolt, and the fixing bolt passes through one end of the fixing seat 231 and is threadedly connected to the heat equalizing box 1.

[0040] In the embodiment of the present application, the fixing member 233 is used for simple operation, and the assembly between the first cooling air duct 21 and the second cooling air duct 22 is facilitated, so as to fix the first cooling air duct 21 and the second cooling air duct 22 on the heat equalizing box 1, so as to facilitate the cooling air to be blown into the heat equalizing box 1 through the first cooling air duct 21 and the second cooling air duct 22, so as to make the cooling air exchange with the heat equalizing box 1.

[0041] In a possible embodiment, the installation step 232 protrudes from the surface of the heat equalizing box 1 by 5-15 mm. Optionally, the installation step 232 protrudes from the surface of the heat equalizing box 1 by 10 mm.

[0042] In the embodiment of the present application, the installation step 232 protrudes 5-15 mm from the surface of the heat equalizing box 1, which can enhance the installation strength of the second cooling air duct 22 on the heat equalizing box 1, thereby improving the installation stability of the second cooling air duct 22.

[0043] In a possible embodiment, a mounting groove 234 for accommodating the mounting step 232 is defined on the fixing seat 231 .

[0044] Optionally, the mounting groove 234 is adapted to the cross-sectional shape of the mounting step 232 , so that the outer side of the cross-sectional view of the mounting step 232 may be circular or polygonal.

[0045] In the embodiment of the present application, a mounting groove 234 for accommodating the mounting step 232 is provided on the fixing seat 231 , which is simple to operate and convenient to install, and can improve the installation stability between the fixing seat 231 and the mounting step 232 , thereby improving the adaptability.

[0046] In a possible embodiment, a sealing member 235 is disposed in the mounting groove 234 .

[0047] Optionally, the seal 235 can be made of tetrafluororubber, aluminum silicate or other high temperature resistant materials.

[0048] In the embodiment of the present application, by arranging a seal 235 in the installation groove 234, the sealing performance between the first cooling air duct and the second cooling air duct 22 can be enhanced, the connection stability can be improved, the energy loss can be reduced, and the maintenance and replacement can be simplified, thereby improving the overall performance and reliability.

[0049] In a possible embodiment, the first cooling air duct 21 is made of metal material.

[0050] In the embodiment of the present application, the first cooling air duct 21 is made of metal material, which can improve the strength and high temperature resistance of the first cooling air duct 21.

[0051] In a possible embodiment, the second cooling air duct 22 can be made of corundum, and can be made of silicon carbide or other high-temperature resistant ceramic materials at a high temperature exceeding 1200°C.

[0052] Optionally, the second cooling air duct 22 is 5-10 mm away from the heat equalizing box 1 close to the substrate glass 3, which further improves the heat exchange efficiency.

[0053] In the embodiment of the present application, by setting the second cooling air duct 22 to a corundum material, the high temperature resistance of the second cooling air duct 22 can be improved, and the ablation or deformation of the second cooling air duct 22 in the heat equalizing box 1 can be reduced, which facilitates the precise adjustment of the relative position of the cooling air and the substrate glass 3, and then facilitates the adjustment of the thickness of the substrate glass 3, which can improve the adjustment accuracy and efficiency of the substrate glass 3.

[0054] In a possible embodiment, a first crossbeam 24 for fixing the first cooling air duct 21 may also be included.

[0055] Specifically, in order to improve the supporting stability of the first cooling air duct 21 , a first crossbeam 24 is provided so that the first cooling air duct 21 passes through the first crossbeam 24 .

[0056] In the embodiment of the present application, the first crossbeam 24 is provided to support the first cooling air duct 21 , and can provide a certain supporting effect on the first cooling air duct 21 , thereby improving the stability of the first cooling air duct 21 .

[0057] In a possible embodiment, a second cross beam 25 is disposed inside the heat equalizing box 1 , and the second cooling air ducts 22 are disposed through the second cross beam 25 .

[0058] In the embodiment of the present application, a second cross beam 25 is arranged in the heat equalizing box 1, and the second cooling air duct 22 is arranged to pass through the second cross beam 25, which can provide a certain support effect for the second cooling air duct 22 and improve the stability of the second cooling air duct 22 in the heat equalizing box 1.

[0059] A method for using a thickness cooling air device for overflow method substrate glass molding comprises the following steps: First, according to the design requirements, two heat equalization boxes 1 are respectively installed on both sides of the substrate glass 3 to ensure that they are positioned accurately and firmly. Then, the first cooling air duct 21 and the second cooling air duct 22 are connected and fixed by using the fixing assembly 23 .

[0060] After the assembly is completed, the cooling air is blown in through the air inlet of the first cooling air duct 21. When the cooling air flows in the first cooling air duct 21, it absorbs a certain amount of heat, thereby reducing its temperature. Then, the cooling air enters the second cooling air duct 22 through the connection of the fixing component 23, continues to flow and accelerates, and finally blows toward the heat-matching box 1 from the air outlet. In this process, the cooling air exchanges heat with the heat-matching box 1 and the substrate glass 3, takes away the heat of the substrate glass 3, and thus reduces the temperature of the substrate glass 3.

[0061] As the temperature of the substrate glass 3 decreases, its fluidity will also slow down. During the overflow method substrate glass 3 forming process, the fluidity of the substrate glass 3 has a direct impact on its thickness. Therefore, by adjusting the flow rate, speed and temperature of the cooling air, the fluidity of the substrate glass 3 can be accurately controlled, thereby achieving the adjustment of the thickness of the substrate glass 3.

[0062] In the embodiment of the present application, by precisely controlling the fluidity of the substrate glass 3, the thickness of the substrate glass 3 can be precisely adjusted, thereby improving the quality stability and consistency of the product. Since the device can achieve precise control of the thickness of the substrate glass 3, the scrap rate caused by uneven thickness can be reduced, thereby reducing production costs. The operation of the device is simple and convenient, and the thickness of the substrate glass 3 can be quickly adjusted, thereby improving production efficiency. By using cooling air for heat exchange, the device can effectively reduce the temperature of the substrate glass 3, while reducing energy consumption and environmental pollution.

[0063] In summary, the method for using the thickness cooling air device for overflow method substrate glass molding has significant beneficial effects, and can improve product quality, reduce production costs, improve production efficiency, and save energy and protect the environment.

[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, a person of ordinary skill in the art should understand that modifying the technical solutions described in the aforementioned embodiments, or replacing part or all of the technical features therein by equivalents, does not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thickness cooling air device for overflow method substrate glass molding, characterized in that: It comprises two heat-saturating boxes (1) and a cooling mechanism (2) arranged at the bottom of the overflow brick; The heat-saturating boxes (1) are respectively located on both sides of the substrate glass (3); The cooling mechanism (2) comprises a plurality of first cooling air ducts (21), a second cooling air duct (22) and a fixing assembly (23); The first cooling air duct (21) is arranged outside the heat equalizing box (1), and the air inlet of the first cooling air duct (21) is used to communicate with the cooling air; The second cooling air duct (22) is arranged to penetrate the heat equalizing box (1), the air outlet of the second cooling air duct (22) is arranged close to the substrate glass (3), and the second cooling air duct (22) is made of high temperature resistant material; The first cooling air duct (21) and the second cooling air duct (22) are both connected via a fixing component (23).

2. The thickness cooling air device for overflow method substrate glass molding according to claim 1, characterized in that: The fixing assembly (23) comprises a fixing seat (231), a mounting step (232) and a fixing member (233); The fixing seat (231) and the installation step (232) are respectively arranged between the first cooling air duct (21) and the second cooling air duct (22); The fixing seat (231) is disposed in communication with the first cooling air duct (21), and the mounting step (232) is disposed in communication with the second cooling air duct (22); The fixing member (233) passes through one end of the fixing seat (231) and is fixed on the heat equalizing box (1), so as to realize the connection between the first cooling air duct (21) and the second cooling air duct (22).

3. The thickness cooling air device for overflow method substrate glass molding according to claim 2, characterized in that: The installation step (232) protrudes from the surface of the heat equalizing box (1) by 5-15 mm.

4. The thickness cooling air device for overflow method substrate glass molding according to claim 2, characterized in that: The fixing seat (231) is provided with a mounting groove (234) for accommodating the mounting step (232).

5. The thickness cooling air device for overflow method substrate glass molding according to claim 4, characterized in that: A sealing member (235) is disposed in the installation groove (234).

6. The thickness cooling air device for overflow method substrate glass molding according to claim 1, characterized in that: The first cooling air duct (21) is made of metal material.

7. The thickness cooling air device for overflow method substrate glass molding according to claim 1, characterized in that: The second cooling air duct (22) is made of corundum.

8. The thickness cooling air device for overflow method substrate glass molding according to claim 1, characterized in that: It also includes a first crossbeam (24) for fixing the first cooling air duct (21).

9. The thickness cooling air device for overflow method substrate glass molding according to claim 1, characterized in that: A second cross beam (25) is arranged inside the heat equalizing box (1), and the second cooling air duct (22) is arranged to pass through the second cross beam (25).

10. A method for using the thickness cooling air device for overflow method substrate glass molding according to any one of claims 1 to 9, characterized in that: The following steps are involved: The first cooling air duct (21) and the second cooling air duct (22) are connected and fixed via a fixing assembly (23); Cooling air is blown in through the first cooling air duct (21) and blown toward the heat equalizing box (1) through the air outlet of the second cooling air duct (22), so that heat exchange occurs between the cooling air and the heat equalizing box (1) and the substrate glass (3), thereby reducing the temperature of the corresponding position of the substrate glass (3), alleviating the mutual influence of the lateral tension of the substrate glass (3), and achieving adjustment of the thickness of the substrate glass (3).

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