Cationic ultraviolet curing adhesive

Abstract

The invention discloses a cationic ultraviolet curing adhesive, and relates to the technical field of photocuring materials, and the cationic ultraviolet curing adhesive comprises the following components by weight: 35-55 parts of epoxy resin, 1-3 parts of a photoinitiator, 20-30 parts of an active diluent, 5-10 parts of other functional monomers, 0.2-1 part of a stabilizer, 1-3 parts of a coupling agent, 0.1-1 part of a photosensitizer, and 0.3-0.6 part of a leveling wetting agent. The cationic ultraviolet curing adhesive is high in curing speed, good in moisture resistance, good in heat aging resistance, small in curing shrinkage rate and sufficient in adhesive force.

Description

Technical Field

[0001] The invention relates to the technical field of photocurable materials, and in particular to a cationic ultraviolet light-curable adhesive. Background Art

[0002] Ultraviolet light curing (UV curing) adhesive has the characteristics of fast curing speed at room temperature, energy saving, no need for solvents, environmental protection, long service life, high bonding strength, etc. It is widely used in medical and health, aviation, electronic assembly, printing, optical instruments, packaging, national defense and military industries, etc., especially suitable for bonding substrates with high light transmittance such as quartz glass and polyester film. With the increasing awareness of environmental protection and energy saving, the development and application of UV curing adhesives have received more attention.

[0003] Cationic UV-curing adhesive is a typical UV-curing adhesive. Compared with free radical UV-curing adhesive, it has the advantages of small curing shrinkage, strong adhesion, good weather resistance, etc. However, cationic UV-curing adhesives on the market still have more or less technical problems such as slow curing speed, poor moisture resistance and heat aging resistance, dimensional stability and insufficient adhesion.

[0004] In order to solve the above technical problems, the Chinese invention patent with the authorization announcement number CN102925094B discloses a UV-curing adhesive suitable for ultra-low temperature environments, and the mass fraction of the formula composition is: epoxy acrylate 10%-15%; epoxy resin A 15%-22%; epoxy resin B 38%-47%; diluent 10%-20%; free radical initiator 1-3%; cationic initiator 2-4%. The invention also discloses a preparation method of the UV-curing adhesive. The UV-curing adhesive prepared by the invention has good flexibility and bonding strength properties at both room temperature and ultra-low temperature, further broadening the application of UV-curing adhesive under extreme conditions. The adhesive of the invention can be widely used in the bonding of precision devices under low temperature and ultra-low temperature conditions, especially for the bonding of inertial confinement low-temperature laser targets. However, its moisture resistance still needs to be further improved.

[0005] It can be seen that the development of a cationic UV-curing adhesive with fast curing speed, good moisture resistance, good heat aging resistance, small curing shrinkage and sufficient adhesion meets market demand, has broad market value and application prospects, and is of great significance to promoting the development of the UV curing agent field. Summary of the invention

[0006] The main purpose of the present invention is to provide a cationic ultraviolet curing adhesive with fast curing speed, good moisture resistance, good heat aging resistance, small curing shrinkage and sufficient adhesion.

[0007] To achieve the above purpose, the present invention provides a cationic UV curing adhesive, which comprises the following components by weight: 35-55 parts of epoxy resin, 1-3 parts of photoinitiator, 20-30 parts of reactive diluent, 5-10 parts of other functional monomers, 0.2-1 parts of stabilizer, 1-3 parts of coupling agent, 0.1-1 parts of photosensitizer, and 0.3-0.6 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]decanoic acid. The invention is prepared by mixing oxane, 9,9-di[(2,3-epoxypropoxy)phenyl]fluorene, 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinylcycloboroxane, N-[4-cyano-3-(trifluoromethyl)phenyl]methylepoxyacrylamide and 4-epoxypropoxycarbazole in a mass ratio of 1:(0.8-1.2):1:(0.8-1.2):(1-2):(0.3-0.5).

[0008] Preferably, the epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:(1-2):(0.8-1.2).

[0009] Preferably, the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; and the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin.

[0010] Preferably, the photoinitiator is a mixture of a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:(1-3).

[0011] Preferably, the free radical photoinitiator is one or more of photoinitiator 184, photoinitiator 1173, photoinitiator 819, photoinitiator 651, and photoinitiator 2020.

[0012] Preferably, the cationic photoinitiator is at least one of diaryliodonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, and photoinitiator 262.

[0013] Preferably, the active diluent is at least one of 3-ethyl-3-oxetanol, 3,3'-(oxybismethylene)bis(3-ethyl)oxetane, and glycidyl methacrylate.

[0014] Preferably, the stabilizer is Vicbase TC3602H.

[0015] Preferably, the coupling agent is at least one of silane coupling agent KH550, silane coupling agent KH560, and silane coupling agent KH570.

[0016] Preferably, the photosensitizer is at least one of 1-hydroxycyclohexyl phenyl ketone, isopropyl thioxanthone, and 2-hydroxy-2-methyl-1-phenyl-1-propanone.

[0017] Preferably, the leveling wetting agent is one of TEGO-410, TEGO-432, TEGO-4000, BYK-306, BYK-307, or a mixture of several thereof.

[0018] Another object of the present invention is to provide a method for preparing the cationic UV-curing adhesive, comprising the following steps: mixing the components uniformly by weight under light-proof conditions, filtering and vacuum degassing in sequence to obtain the cationic UV-curing adhesive.

[0019] Due to the application of the above technical solution, the present invention has the following beneficial effects: (1) The preparation method of the cationic UV-curing adhesive disclosed in the present invention has a simple preparation process, a short process, convenient operation and control, low dependence on equipment and labor intensity, small impact on the environment, high qualified rate of finished products, is suitable for continuous large-scale production, and has high promotion and application value.

[0020] (2) The cationic UV curing adhesive disclosed in the present invention comprises the following components by weight: 35-55 parts of epoxy resin, 1-3 parts of photoinitiator, 20-30 parts of active diluent, 5-10 parts of other functional monomers, 0.2-1 parts of stabilizer, 1-3 parts of coupling agent, 0.1-1 parts of photosensitizer, and 0.3-0.6 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-bis[(2,3-epoxypropoxy)phenyl]fluorene, 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinylcycloboroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methylepoxyacrylamide, 4-epoxypropoxycarbazole are mixed in a mass ratio of 1:(0.8-1.2):1:(0.8-1.2):(1-2):(0.3-0.5). Through the mutual cooperation between the components, the prepared cationic UV curing adhesive has fast curing speed, good moisture resistance, sufficient adhesion and small curing shrinkage. The other functional monomers simultaneously introduce fluorene, triazinetrione, cycloboroxane, cyano, trifluoromethylphenyl, amide, and carbazole structures into the formed adhesive film. These structures cooperate with each other under the multiple effects of electronic effect, steric effect, and conjugation effect, further improving moisture resistance and heat aging resistance, further reducing curing shrinkage, and thereby improving bonding reliability and dimensional stability.

[0021] (3) The cationic UV-curable adhesive disclosed in the present invention improves the curing speed and shortens the production cycle by optimizing the content of each component and the type of photoinitiator; and by limiting the type of epoxy resin (the epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin, and naphthalene epoxy resin in a mass ratio of 1:(1-2):(0.8-1.2)), the adhesion of the adhesive to different substrates can be further improved. DETAILED DESCRIPTION

[0022] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0023] The silicon-containing hyperbranched epoxy resin involved in each embodiment of the present invention is prepared according to the method of Example 3 of the Chinese invention patent with authorization announcement number CN101475682B. Example 1

[0024] A cationic ultraviolet curing adhesive, comprising the following components by weight: 35 parts of epoxy resin, 1 part of photoinitiator, 20 parts of active diluent, 5 parts of other functional monomers, 0.2 parts of stabilizer, 1 part of coupling agent, 0.1 parts of photosensitizer, and 0.3 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-di[(2,3 The invention is prepared by mixing 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinylcycloboroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methyl epoxyacrylamide and 4-epoxypropaneoxycarbazole in a mass ratio of 1:0.8:1:0.8:1:0.3.

[0025] The epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:1:0.8; the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin; the photoinitiator is a mixture of a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:1; the free radical photoinitiator is photoinitiator 184; the cationic photoinitiator is diaryliodonium hexafluorophosphate; the active diluent is 3-ethyl-3-oxetane methanol; the stabilizer is Vicbase TC3602H; the coupling agent is silane coupling agent KH550; the photosensitizer is 1-hydroxycyclohexyl phenyl ketone; and the leveling wetting agent is TEGO-410.

[0026] A method for preparing the cationic ultraviolet light-curing adhesive comprises the following steps: in a light-proof condition, mixing the components uniformly by weight, filtering and vacuum degassing in sequence to obtain the cationic ultraviolet light-curing adhesive. Example 2

[0027] A cationic ultraviolet curing adhesive comprises the following components by weight: 40 parts of epoxy resin, 1.5 parts of photoinitiator, 23 parts of active diluent, 6 parts of other functional monomers, 0.4 parts of stabilizer, 1.5 parts of coupling agent, 0.3 parts of photosensitizer, and 0.4 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-di[(2, The invention is prepared by mixing 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinyl boroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methyl epoxyacrylamide and 4-epoxypropaneoxycarbazole in a mass ratio of 1:0.9:1:0.9:1.2:0.35.

[0028] The epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:1.3:0.9; the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin; the photoinitiator is a mixture of a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:1.5; the free radical photoinitiator is photoinitiator 1173; the cationic photoinitiator is triarylsulfonium hexafluoroantimonate; the active diluent is 3,3'-(oxybismethylene)bis(3-ethyl)oxetane; the stabilizer is Vicbase TC3602H; the coupling agent is silane coupling agent KH560; the photosensitizer is isopropylthioxanthone; and the leveling wetting agent is TEGO-432.

[0029] A method for preparing the cationic ultraviolet light-curing adhesive comprises the following steps: in a light-proof condition, mixing the components uniformly by weight, filtering and vacuum degassing in sequence to obtain the cationic ultraviolet light-curing adhesive. Example 3

[0030] A cationic ultraviolet curing adhesive comprises the following components by weight: 45 parts of epoxy resin, 2 parts of photoinitiator, 25 parts of active diluent, 7.5 parts of other functional monomers, 0.7 parts of stabilizer, 2 parts of coupling agent, 0.6 parts of photosensitizer, and 0.45 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-di[( The invention is prepared by mixing 2,3-epoxypropoxy)phenyl]fluorene, 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinylcycloboroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methyl epoxyacrylamide and 4-epoxypropoxycarbazole in a mass ratio of 1:1:1:1:1.5:0.4.

[0031] The epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:1.5:1; the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin; the photoinitiator is a mixture of a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:2; the free radical photoinitiator is photoinitiator 819; the cationic photoinitiator is triarylsulfonium hexafluoroantimonate; the active diluent is glycidyl methacrylate; the stabilizer is Vicbase TC3602H; the coupling agent is silane coupling agent KH570; the photosensitizer is 2-hydroxy-2-methyl-1-phenyl-1-propanone; and the leveling wetting agent is TEGO-4000.

[0032] A method for preparing the cationic ultraviolet light-curing adhesive comprises the following steps: in a light-proof condition, mixing the components uniformly by weight, filtering and vacuum degassing in sequence to obtain the cationic ultraviolet light-curing adhesive. Example 4

[0033] A cationic ultraviolet curing adhesive comprises the following components by weight: 50 parts of epoxy resin, 2.5 parts of photoinitiator, 28 parts of active diluent, 9 parts of other functional monomers, 0.9 parts of stabilizer, 2.5 parts of coupling agent, 0.8 parts of photosensitizer, and 0.5 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-di[(2, The invention is prepared by mixing 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinylcycloboroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methyl epoxyacrylamide and 4-epoxypropaneoxycarbazole in a mass ratio of 1:1.1:1:1.1:1.9:0.45.

[0034] The epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin, and naphthalene epoxy resin in a mass ratio of 1:1.8:1.1; the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin; the photoinitiator is a mixture of a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:2.5; the free radical photoinitiator is photoinitiator 184, photoinitiator 1173, photoinitiator 819, ... Initiator 651 and photoinitiator 2020 are mixed in a mass ratio of 1:2:1:3:2; the cationic photoinitiator is a mixture of diaryliodonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, and photoinitiator 262 in a mass ratio of 1:3:5; the active diluent is a mixture of 3-ethyl-3-oxetane methanol, 3,3'-(oxybismethylene)bis(3-ethyl)oxetane, and methacrylate glycidyl ether in a mass ratio of 2:3:1; the stabilizer is Vicbase TC3602H; the coupling agent is a mixture of silane coupling agent KH550, silane coupling agent KH560 and silane coupling agent KH570 in a mass ratio of 2:3:5; the photosensitizer is a mixture of 1-hydroxycyclohexyl phenyl ketone, isopropyl thioxanthone and 2-hydroxy-2-methyl-1-phenyl-1-propanone in a mass ratio of 3:1:4; the leveling wetting agent is a mixture of TEGO-410, TEGO-432, TEGO-4000, BYK-306 and BYK-307 in a mass ratio of 1:2:2:1:3.

[0035] A method for preparing the cationic ultraviolet light-curing adhesive comprises the following steps: in a light-proof condition, mixing the components uniformly by weight, filtering and vacuum degassing in sequence to obtain the cationic ultraviolet light-curing adhesive. Example 5

[0036] A cationic ultraviolet curing adhesive comprises the following components by weight: 55 parts of epoxy resin, 3 parts of photoinitiator, 30 parts of active diluent, 10 parts of other functional monomers, 1 part of stabilizer, 3 parts of coupling agent, 1 part of photosensitizer, and 0.6 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-di[(2,3- The invention is prepared by mixing 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinylcycloboroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methyl epoxyacrylamide and 4-epoxypropaneoxycarbazole in a mass ratio of 1:1.2:1:1.2:2:0.5.

[0037] The epoxy resin is a mixture of silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:2:1.2; the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin; the photoinitiator is a mixture of a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:3; the free radical photoinitiator is photoinitiator 2020; the cationic photoinitiator is diaryliodonium hexafluorophosphate; the active diluent is 3,3'-(oxybismethylene)bis(3-ethyl)oxetane; the stabilizer is Vicbase TC3602H; the coupling agent is silane coupling agent KH560; the photosensitizer is 1-hydroxycyclohexyl phenyl ketone; and the leveling and wetting agent is BYK-306.

[0038] A method for preparing the cationic ultraviolet light-curing adhesive comprises the following steps: in a light-proof condition, mixing the components uniformly by weight, filtering and vacuum degassing in sequence to obtain the cationic ultraviolet light-curing adhesive.

[0039] Comparative Example 1 A cationic ultraviolet light-curing adhesive is basically the same as Example 1, except that the epoxy resin is a mixture of biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:0.8; the biphenyl epoxy resin is HCE-YX4000 biphenyl epoxy resin; and the naphthalene epoxy resin is EBA-65 naphthalene epoxy resin.

[0040] Comparative Example 2 A cationic ultraviolet curing adhesive is basically the same as Example 1, except that an equal amount of epoxy resin is used to replace other functional monomers.

[0041] In order to further illustrate the beneficial technical effects of the cationic UV-curable adhesives involved in the embodiments of the present invention, the cationic UV-curable adhesives involved in Examples 1-5 and Comparative Examples 1-2 were tested for relevant performances. The test results are shown in Table 1. The test method is as follows: (1) Tensile shear strength: Each cationic UV curing adhesive was coated on the bonded test piece to form a uniform film layer with a thickness of 0.2 mm. After curing, the tensile shear strength at room temperature of 20°C was measured using GB / T 7124-2008. The curing method was 30 mW / cm 2 The samples were irradiated with UV for 70 s.

[0042] (2) Moisture resistance: Place the cured adhesive samples at 85°C and 85% relative humidity for 1000 hours and observe the color change of the adhesive. If there is no change, the moisture resistance is qualified. The curing method is 30mW / cm 2 The samples were irradiated with UV for 70 s.

[0043] (3) Heat aging resistance: The cured adhesive samples were placed in an artificial accelerated aging chamber at 90°C for 90 h. After being taken out, the tensile shear strength was tested again according to the method in (1). The retention rate of the tensile shear strength was calculated. The larger the value, the better the heat aging resistance. The curing method was 30 mW / cm 2 The samples were irradiated with UV for 70 s.

[0044] (4) Curing shrinkage: Each cationic UV curing adhesive was inkjet printed on a glass substrate and heated at 30 mW / cm 2 The sample was subjected to UV curing for 70 seconds by UV irradiation to produce a sample with a size of 5 mm × 3 cm × 1 mm (width × length × thickness); the curing shrinkage η = (V b -V a ) / V b × 100%; where V b is the volume before solidification, V a is the volume after curing.

[0045] Table 1 project Tensile shear strength Moisture resistance Heat aging resistance Curing shrinkage unit MPa — % % Example 1 14.3 No change 98.8 3.2 Example 2 16.5 No change 99.2 3.0 Example 3 17.7 No change 99.4 2.7 Example 4 19.1 No change 99.7 2.6 Example 5 20.4 No change 99.8 2.4 Comparative Example 1 12.5 Slightly whitish 96.7 4.3 Comparative Example 2 11.7 Obvious yellowing 95.1 5.0 As can be seen from Table 1, the cationic UV-curing adhesive disclosed in the embodiment of the present invention has higher tensile shear strength, better heat aging resistance and moisture resistance, and lower curing shrinkage than the comparative example product; the combined use of silicon-containing hyperbranched epoxy resin and other functional monomers is beneficial to improving the above properties.

[0046] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A cationic UV curing adhesive, characterized in that: The invention comprises the following components in parts by weight: 35-55 parts of epoxy resin, 1-3 parts of photoinitiator, 20-30 parts of active diluent, 5-10 parts of other functional monomers, 0.2-1 parts of stabilizer, 1-3 parts of coupling agent, 0.1-1 parts of photosensitizer, and 0.3-0.6 parts of leveling wetting agent; the other functional monomers are 3,9-divinyl-2,4,8,10-tetraoxaspiro[5.5]undecane, 9,9-di[(2,3 The invention discloses a method for preparing the present invention which is prepared by mixing 1,3-bis(oxiranylmethyl)-5-(2-propenyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6-trivinyl cycloboroxine, N-[4-cyano-3-(trifluoromethyl)phenyl]methyl epoxyacrylamide and 4-epoxypropaneoxycarbazole in a mass ratio of 1:(0.8-1.2):1:(0.8-1.2):(1-2):(0.3-0.5).

2. The cationic UV curing adhesive according to claim 1, characterized in that: The epoxy resin is prepared by mixing silicon-containing hyperbranched epoxy resin, biphenyl epoxy resin and naphthalene epoxy resin in a mass ratio of 1:(1-2):(0.8-1.2).

3. The cationic UV curing adhesive according to claim 2, characterized in that: The biphenyl type epoxy resin is HCE-YX4000 biphenyl epoxy resin; the naphthalene type epoxy resin is EBA-65 naphthalene type epoxy resin.

4. The cationic UV curing adhesive according to claim 1, characterized in that: The photoinitiator is prepared by mixing a free radical photoinitiator and a cationic photoinitiator in a mass ratio of 1:(1-3).

5. The cationic UV curing adhesive according to claim 4, characterized in that: The free radical photoinitiator is one or more of photoinitiator 184, photoinitiator 1173, photoinitiator 819, photoinitiator 651, and photoinitiator 2020; the cationic photoinitiator is at least one of diaryl iodonium hexafluorophosphate, triaryl sulfonium hexafluoroantimonate, and photoinitiator 262.

6. The cationic UV curing adhesive according to claim 1, characterized in that: The active diluent is at least one of 3-ethyl-3-oxetane methanol, 3,3'-(oxybismethylene)bis(3-ethyl)oxetane, and glycidyl methacrylate.

7. The cationic UV curing adhesive according to claim 1, characterized in that: The stabilizer is Vicbase TC3602H; the coupling agent is at least one of silane coupling agent KH550, silane coupling agent KH560, and silane coupling agent KH570.

8. The cationic UV curing adhesive according to claim 1, characterized in that: The photosensitizer is at least one of 1-hydroxycyclohexyl phenyl ketone, isopropyl thioxanthone, and 2-hydroxy-2-methyl-1-phenyl-1-propanone.

9. The cationic UV curing adhesive according to claim 1, characterized in that: The leveling wetting agent is one of TEGO-410, TEGO-432, TEGO-4000, BYK-306 and BYK-307 or a mixture of several thereof.

10. A method for preparing a cationic UV curing adhesive according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: mixing the components uniformly by weight under light-proof conditions, filtering and vacuum degassing in sequence to obtain a cationic ultraviolet light curing adhesive.