High-performance latent curing solvent-free adhesive for bonding EPDM heat insulation layer and carbon fiber composite material

Abstract

The invention discloses a high-performance latent curing solvent-free adhesive for bonding an EPDM (Ethylene-Propylene-Diene Monomer) heat insulation layer and a carbon fiber composite material, and belongs to the technical field of advanced high polymer material science. Comprising the following components: epoxy-terminated modified hydroxyl-terminated rubber, epoxy resin, a curing agent and a vulcanizing agent, the epoxy-terminated modified hydroxyl-terminated polybutadiene rubber comprises the following components: isophorone diisocyanate (IPDI), hydroxyl-terminated polybutadiene rubber (HTPB), epoxy resin and a catalyst. Compared with adhesives widely used in the spaceflight industry in China at present, the high-performance latent-curing solvent-free adhesive has the characteristics of high adhesive strength and latent curing solvent-free property, the adhesive does not need to be prepared at present, the high-performance latent-curing solvent-free adhesive only needs to be coated on an EPDM heat insulation layer, is subjected to heating and pre-curing, and is covered with a release film to form a self-adhesive sheet, so that the self-adhesive sheet is formed; and during use, the release film covering the surface is torn off, the EPDM heat insulation layer is attached to the carbon fiber composite material, hot-pressing vulcanization is performed, and bonding is completed.

Description

Technical Field

[0001] The invention relates to the field of advanced polymer material science and technology, and in particular to a high-performance latent-curing solvent-free adhesive for bonding an EPDM thermal insulation layer and a carbon fiber composite material. Background Art

[0003] As the demand for solid rockets grows, ethylene propylene diene monomer (EPDM) has shown its advantages as the core material of the rocket engine insulation layer. Its main chain is a saturated hydrocarbon structure, and the side chain contains a small amount of double bonds. It has excellent heat resistance and aging resistance, and is low in cost. It can effectively protect the engine casing from high-temperature gas erosion. However, it is difficult to bond this material to the engine casing made of carbon fiber composite materials. Although the adhesives widely used in my country's aerospace industry can meet the high adhesion required between the EPDM insulation layer and the solid rocket engine casing, the adhesives require a large amount of solvent to be used and prepared on the spot, and cannot be made into self-adhesive sheets. There are problems such as poor production environment and inability to scale production. Therefore, it is of great significance to develop a high-performance latent-curing solvent-free adhesive that can meet the high adhesion required between the EPDM insulation layer and the carbon fiber composite material, has latent-curing solvent-free characteristics, can be made into self-adhesive sheets, and can be safely stored while achieving large-scale production, which will help promote the development of my country's aerospace industry. Summary of the invention

[0004] Purpose of the invention: The purpose of the present invention is to provide a high-performance latent-curing solvent-free adhesive for bonding EPDM insulation layers and carbon fiber composite materials; it can solve the problems that the adhesives currently widely used in my country's aerospace industry require a large amount of solvent to be prepared before use, cannot be made into self-adhesive sheets, have a poor production environment, serious pollution, and cannot be mass-produced.

[0005] Technical solution: To solve the above technical problems, according to one aspect of the present invention, more specifically, a high-performance latent-curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material, comprising the following components: epoxy-terminated modified butyl hydroxyl rubber, epoxy resin, curing agent and vulcanizing agent;

[0006] The epoxy-terminated modified hydroxybutadiene rubber comprises the following components: isophorone diisocyanate (IPDI), hydroxybutadiene rubber (HTPB), epoxy resin and a catalyst.

[0007] Furthermore, the high-performance latent curing solvent-free adhesive comprises the following components by weight percentage: 34-71% of epoxy-terminated modified hydroxybutyl rubber, 24-58% of epoxy resin, 3.5-6.4% of curing agent, and 0.4-0.9% of vulcanizing agent;

[0008] The epoxy-terminated modified hydroxybutadiene rubber comprises the following components by weight: 13.2% of isophorone diisocyanate (IPDI), 59.5% of hydroxybutadiene rubber (HTPB), 26.7% of epoxy resin and 0.6% of catalyst.

[0009] Furthermore, the curing agent is one of dicyandiamide and adipic acid dihydrazide ground into powder; the vulcanizing agent is one of sulfur and TT vulcanizing agent ground into powder; and the catalyst is one of dibutyltin dilaurate and triphenylbismuth.

[0010] Furthermore, the molecular weight of the hydroxybutyric acid butyl rubber (HTPB) is one of 2000 g / mol, 3000 g / mol and 4000 g / mol.

[0011] According to another aspect of the present invention, a method for preparing a high-performance latent-curing solvent-free adhesive for bonding an EPDM insulation layer and a carbon fiber composite material is provided. The method is based on the components in the high-performance latent-curing solvent-free adhesive for bonding an EPDM insulation layer and a carbon fiber composite material described above, and specifically comprises the following steps:

[0012] S1. Synthesis of epoxy-terminated modified hydroxybutane rubber: preparing epoxy-terminated modified hydroxybutane rubber by using isophorone diisocyanate (IPDI), hydroxybutane rubber (HTPB), epoxy resin and catalyst;

[0013] S2. Preparation of high-performance latent-curing solvent-free adhesive: fully mixing epoxy-terminated modified butyl hydroxyl rubber, epoxy resin, curing agent and vulcanizing agent to prepare high-performance latent-curing solvent-free adhesive;

[0014] S3, making a self-adhesive sheet: applying a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer, pre-curing it by heating, and then covering it with a release film to form a self-adhesive sheet;

[0015] S4. Use of self-adhesive sheet: Tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material, hot press vulcanize and complete the bonding.

[0016] Furthermore, in step S1, the method for synthesizing epoxy-terminated modified HTPB rubber is:

[0017] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of catalyst and add them into a three-necked flask;

[0018] ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0019] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and a catalyst through a dropping funnel;

[0020] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0021] ⑤ After the reaction in step ④ is completed, add an appropriate amount of epoxy resin into the three-necked flask and react at 80°C for 2-3 hours.

[0022] Furthermore, in step S2, the preparation method of the high-performance latent curing solvent-free adhesive is to fully mix 34-71% of epoxy-terminated modified hydroxybutyl rubber, 24-58% of epoxy resin, 3.5-6.4% of curing agent, and 0.4-0.9% of vulcanizing agent in a grinder to obtain the high-performance latent curing solvent-free adhesive.

[0023] Furthermore, in step S3, the pre-curing method is heating at 100° C. for 30 minutes.

[0024] Furthermore, in step S4, the conditions of the hot pressing vulcanization process are: temperature 140-160° C., pressure 0.5-1 MPa, and 1-3 hours.

[0025] Beneficial effects: Although the adhesive widely used in my country's aerospace industry can meet the high bonding strength required between the EPDM insulation layer and the solid rocket engine casing, the adhesive requires a large amount of solvent to be prepared on the spot during use and cannot be made into a self-adhesive sheet. It has problems such as poor production environment, serious pollution, and inability to scale production. The high-performance latent-curing solvent-free adhesive of the present invention is a modified butyl hydroxyl rubber prepared by reacting butyl hydroxyl rubber (HTPB), isophorone diisocyanate (IPDI) and epoxy resin as raw materials in a specific ratio. The epoxy-terminated modified butyl hydroxyl rubber prepared by the participation of low-molecular-weight HTPB is most conducive to improving the bonding ability of the adhesive. Although the time required for synthesis is increased by not adding a solvent, the problem of decreased bonding force caused by bubbles generated by volatilization of residual solvent during vulcanization can be avoided, thereby significantly improving the bonding force. Moreover, not adding a solvent can avoid the situation that the solvent volatilizes and pollutes the environment during hot pressing vulcanization, thereby making the high-performance latent-curing adhesive more green and environmentally friendly. The most favorable curing agent for improving the bonding performance is one of dicyandiamide and adipic acid dihydrazide, and the vulcanizing agent is one of sulfur and TT vulcanizing agent. The ratio of the curing agent, the vulcanizing agent and the epoxy resin main agent is determined, and the average peeling force can reach 4kN / m at most. At the same time, compared with the adhesives widely used in my country's aerospace industry, this high-performance latent-curing solvent-free adhesive has high adhesion and latent-curing solvent-free properties. It does not need to be prepared on the spot. It only needs to be applied to the EPDM insulation layer and pre-cured by heating, and then covered with a release film to form a self-adhesive sheet, which is convenient for large-scale storage. When in use, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material, hot press vulcanize, and complete the bonding. Therefore, it is of great significance and helps to promote the development of my country's aerospace industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a record table of the peeling force of carbon fiber composite materials compared with the content ratio of different epoxy resin main agent and epoxy-terminated modified hydroxybutane rubber. DETAILED DESCRIPTION

[0027] In order to make the technical solution of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Example 1

[0029] The first step is to synthesize epoxy-terminated modified HTPB rubber: using isophorone diisocyanate (IPDI), HTPB rubber (HTPB), epoxy resin (E-51) and dibutyltin dilaurate to prepare epoxy-terminated modified HTPB rubber, which specifically includes the following steps:

[0030] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of dibutyltin dilaurate and add them into a three-necked flask;

[0031] ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0032] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and dibutyltin dilaurate through a dropping funnel;

[0033] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0034] ⑤ After the reaction in step ④ is completed, add 225g of epoxy resin (E-51) into the three-necked flask and react at 80°C for 2-3 hours.

[0035] The second step is the preparation of a high-performance latent curing solvent-free adhesive: The preparation method of the high-performance latent curing solvent-free adhesive is as follows: 600 g of epoxy-terminated modified hydroxybutane glue, 200 g of epoxy resin (E-51), 29.6 g of dicyandiamide, and 7.3 g of sulfur are fully mixed in a grinder to obtain a high-performance latent curing solvent-free adhesive.

[0036] The third step is to make a self-adhesive sheet: apply a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer and pre-cure it at 100°C for 30 minutes, then cover it with a release film to form a self-adhesive sheet.

[0037] Step 4: Use of self-adhesive sheet: When using, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material. The conditions of the hot pressing vulcanization process are: temperature 140°C, pressure 0.5Mpa, 1 hour.

[0038] The average peel force of the high-performance latent curing adhesive prepared according to this step is 87N.

[0039] Example 2

[0040] The first step is to synthesize epoxy-terminated modified hydroxybutane rubber: using isophorone diisocyanate (IPDI), hydroxybutane rubber (HTPB), epoxy resin (E-51) and triphenyl bismuth to prepare epoxy-terminated modified hydroxybutane rubber, which specifically includes the following steps:

[0041] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of triphenylbismuth into a three-necked flask;

[0042] ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0043] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and triphenylbismuth through a dropping funnel;

[0044] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0045] ⑤ After the reaction in step ④ is completed, add 225g of epoxy resin (E-51) into the three-necked flask and react at 80°C for 2-3 hours.

[0046] The second step is the preparation of a high-performance latent curing solvent-free adhesive: The preparation method of the high-performance latent curing solvent-free adhesive is as follows: 600 g of epoxy-terminated modified butyl hydroxyl rubber, 400 g of epoxy resin (E-51), 49.6 g of adipic acid dihydrazide, and 7.3 g of TT vulcanizing agent are fully mixed in a grinder to obtain a high-performance latent curing solvent-free adhesive.

[0047] The third step is to make a self-adhesive sheet: apply a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer and pre-cure it at 100°C for 30 minutes, then cover it with a release film to form a self-adhesive sheet.

[0048] Step 4: Use of self-adhesive sheet: When using, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material. The conditions of the hot pressing vulcanization process are: temperature 145°C, pressure 0.6Mpa, 1.5 hours.

[0049] The average peel force of the high-performance latent curing adhesive prepared according to this step is 89N.

[0050] Example 3

[0051] The first step is to synthesize epoxy-terminated modified HTPB rubber: using isophorone diisocyanate (IPDI), HTPB rubber (HTPB), epoxy resin (E-51) and dibutyltin dilaurate to prepare epoxy-terminated modified HTPB rubber, which specifically includes the following steps:

[0052] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of dibutyltin dilaurate and add them into a three-necked flask;

[0053] ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0054] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and dibutyltin dilaurate through a dropping funnel;

[0055] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0056] ⑤ After the reaction in step ④ is completed, add 225g of epoxy resin (E-51) into the three-necked flask and react at 80°C for 2-3 hours.

[0057] The second step is the preparation of a high-performance latent curing solvent-free adhesive: The preparation method of the high-performance latent curing solvent-free adhesive is as follows: 600 g of epoxy-terminated modified hydroxybutyl glue, 600 g of epoxy resin (E-51), 69.6 g of dicyandiamide, and 7.3 g of sulfur are fully mixed in a grinder to obtain a high-performance latent curing solvent-free adhesive.

[0058] The third step is to make a self-adhesive sheet: apply a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer and pre-cure it at 100°C for 30 minutes, then cover it with a release film to form a self-adhesive sheet.

[0059] Step 4: Use of self-adhesive sheet: When using, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material. The conditions of the hot pressing vulcanization process are: temperature 150°C, pressure 0.7Mpa, 2 hours.

[0060] The average peel force of the high-performance latent curing adhesive prepared according to this step is 92N.

[0061] Example 4

[0062] The first step is to synthesize epoxy-terminated modified hydroxybutane rubber: using isophorone diisocyanate (IPDI), hydroxybutane rubber (HTPB), epoxy resin (E-51) and triphenyl bismuth to prepare epoxy-terminated modified hydroxybutane rubber, which specifically includes the following steps:

[0063] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of triphenylbismuth into a three-necked flask;

[0064] ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0065] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and triphenylbismuth through a dropping funnel;

[0066] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0067] ⑤ After the reaction in step ④ is completed, add 225g of epoxy resin (E-51) into the three-necked flask and react at 80°C for 2-3 hours.

[0068] The second step is the preparation of a high-performance latent curing solvent-free adhesive: The preparation method of the high-performance latent curing solvent-free adhesive is as follows: 600 g of epoxy-terminated modified hydroxybutane glue, 800 g of epoxy resin (E-51), 89.6 g of dicyandiamide, and 7.3 g of sulfur are fully mixed in a grinder to obtain a high-performance latent curing solvent-free adhesive.

[0069] The third step is to make a self-adhesive sheet: apply a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer and pre-cure it at 100°C for 30 minutes, then cover it with a release film to form a self-adhesive sheet.

[0070] Step 4: Use of self-adhesive sheet: When using, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material. The conditions of the hot pressing vulcanization process are: temperature 150°C, pressure 0.7Mpa, 2 hours.

[0071] The average peel force of the high-performance latent curing adhesive prepared according to this step is 100N.

[0072] Example 5

[0073] The first step is to synthesize epoxy-terminated modified HTPB rubber: using isophorone diisocyanate (IPDI), HTPB rubber (HTPB), epoxy resin (E-51) and dibutyltin dilaurate to prepare epoxy-terminated modified HTPB rubber, which specifically includes the following steps:

[0074] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of dibutyltin dilaurate and add them into a three-necked flask;

[0075] ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel;

[0076] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and dibutyltin dilaurate through a dropping funnel;

[0077] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0078] ⑤ After the reaction in step ④ is completed, add 225g of epoxy resin (E-51) into the three-necked flask and react at 80°C for 2-3 hours.

[0079] The second step is the preparation of a high-performance latent curing solvent-free adhesive: The preparation method of the high-performance latent curing solvent-free adhesive is as follows: 600 g of epoxy-terminated modified butyl hydroxyl rubber, 1000 g of epoxy resin (E-51), 109.6 g of adipic acid dihydrazide, and 7.3 g of TT vulcanizing agent are fully mixed in a grinder to obtain a high-performance latent curing solvent-free adhesive.

[0080] The third step is to make a self-adhesive sheet: apply a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer and pre-cure it at 100°C for 30 minutes, then cover it with a release film to form a self-adhesive sheet.

[0081] Step 4: Use of self-adhesive sheet: When using, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material. The conditions of the hot pressing vulcanization process are: temperature 160°C, pressure 1Mpa, 3 hours.

[0082] The average peel force of the high-performance latent curing adhesive prepared according to this step is 94N.

[0083] Example 6

[0084] The first step is to synthesize epoxy-terminated modified hydroxybutane rubber: using isophorone diisocyanate (IPDI), hydroxybutane rubber (HTPB), epoxy resin (E-51) and triphenyl bismuth to prepare epoxy-terminated modified hydroxybutane rubber, which specifically includes the following steps:

[0085] ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of triphenylbismuth into a three-necked flask;

[0086] ② Weigh 500g of hydroxybutane rubber (HTPB) with a molecular weight of 4000 and place it in a dropping funnel;

[0087] ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and triphenylbismuth through a dropping funnel;

[0088] ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours;

[0089] ⑤ After the reaction in step ④ is completed, add 225g of epoxy resin (E-51) into the three-necked flask and react at 80°C for 2-3 hours.

[0090] The second step is the preparation of a high-performance latent curing solvent-free adhesive: The preparation method of the high-performance latent curing solvent-free adhesive is as follows: 600 g of epoxy-terminated modified hydroxybutane glue, 800 g of epoxy resin (E-51), 89.6 g of dicyandiamide, and 7.3 g of sulfur are fully mixed in a grinder to obtain a high-performance latent curing solvent-free adhesive.

[0091] The third step is to make a self-adhesive sheet: apply a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer and pre-cure it at 100°C for 30 minutes, then cover it with a release film to form a self-adhesive sheet.

[0092] Step 4: Use of self-adhesive sheet: When using, tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material. The conditions of the hot pressing vulcanization process are: temperature 160°C, pressure 1Mpa, 3 hours.

[0093] The average peel force of the high-performance latent curing adhesive prepared according to this step is 82N.

[0094] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A high-performance latent-curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material, characterized in that: The invention comprises the following components: epoxy-terminated modified butyl hydroxy rubber, epoxy resin, curing agent and vulcanizing agent; The epoxy-terminated modified hydroxybutadiene rubber comprises the following components: isophorone diisocyanate (IPDI), hydroxybutadiene rubber (HTPB), epoxy resin and a catalyst.

2. The high-performance latent-curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 1, characterized in that: The high-performance latent curing solvent-free adhesive comprises the following components by weight percentage: 34-71% of epoxy-terminated modified hydroxybutyl rubber, 24-58% of epoxy resin, 3.5-6.4% of curing agent, and 0.4-0.9% of vulcanizing agent; The epoxy-terminated modified hydroxybutadiene rubber comprises the following components by weight: 13.2% of isophorone diisocyanate (IPDI), 59.5% of hydroxybutadiene rubber (HTPB), 26.7% of epoxy resin and 0.6% of catalyst.

3. The high-performance latent-curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 1, characterized in that: The curing agent is one of dicyandiamide and adipic acid dihydrazide ground into powder; the vulcanizing agent is one of sulfur and TT vulcanizing agent ground into powder; and the catalyst is one of dibutyltin dilaurate and triphenylbismuth.

4. The high-performance latent-curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 1, characterized in that: The molecular weight of the hydroxybutadiene rubber (HTPB) is one of 2000 g / mol, 3000 g / mol and 4000 g / mol.

5. A method for preparing a high-performance latent curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material, characterized in that: The method is implemented based on the components in a high-performance latent-curing solvent-free adhesive for bonding an EPDM insulation layer and a carbon fiber composite material according to any one of claims 1 to 4, and specifically comprises the following steps: S1. Synthesis of epoxy-terminated modified hydroxybutane rubber: preparing epoxy-terminated modified hydroxybutane rubber by using isophorone diisocyanate (IPDI), hydroxybutane rubber (HTPB), epoxy resin and catalyst; S2. Preparation of high-performance latent-curing solvent-free adhesive: fully mixing epoxy-terminated modified butyl hydroxyl rubber, epoxy resin, curing agent and vulcanizing agent to prepare high-performance latent-curing solvent-free adhesive; S3, making a self-adhesive sheet: applying a high-performance latent-curing solvent-free adhesive to the EPDM insulation layer, pre-curing it by heating, and then covering it with a release film to form a self-adhesive sheet; S4. Use of self-adhesive sheet: Tear off the release film covering the surface and stick the EPDM insulation layer on the carbon fiber composite material, hot press vulcanize and complete the bonding.

6. The method for preparing a high-performance latent curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 5, characterized in that: In the step S1, the method for synthesizing epoxy-terminated modified HTPB rubber is: ① Weigh 111 g of isophorone diisocyanate (IPDI) and 5 g of catalyst and add them into a three-necked flask; ② Weigh 500 g of hydroxybutyl rubber (HTPB) with a molecular weight of 2000 and place it in a dropping funnel; ③ At 60°C, slowly drip HTPB into a three-necked flask containing isophorone diisocyanate (IPDI) and a catalyst through a dropping funnel; ④ After the addition of HTPB is completed, the reaction temperature is raised to 80°C and the reaction is maintained at this temperature for 2-3 hours; ⑤ After the reaction in step ④ is completed, add an appropriate amount of epoxy resin into the three-necked flask and react at 80°C for 2-3 hours.

7. The method for preparing a high-performance latent curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 5, characterized in that: In step S2, the preparation method of the high-performance latent curing solvent-free adhesive is to mix 34-71% of epoxy-terminated modified hydroxybutyl rubber, 24-58% of epoxy resin, 3.5-6.4% of curing agent, and 0.4-0.9% of vulcanizing agent in a grinder to obtain the high-performance latent curing solvent-free adhesive.

8. The method for preparing a high-performance latent curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 5, characterized in that: In the step S3, the pre-curing method is to heat at 100° C. for 30 minutes.

9. The method for preparing a high-performance latent curing solvent-free adhesive for bonding EPDM insulation layer and carbon fiber composite material according to claim 5, characterized in that: In step S4, the conditions of the hot pressing vulcanization process are: temperature 140-160° C., pressure 0.5-1 MPa, and 1-3 hours.

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