Semiconductor processing equipment

Abstract

The invention provides semiconductor processing equipment which comprises a reaction chamber, an upper cover and a flange arranged on the upper cover; the guide piece is fixed with the reaction chamber; the first guide assembly is fixed relative to the upper cover and abuts against the first side face of the guide part; the second guide assembly is fixed relative to the upper cover and abuts against the second side face of the guide part, and the second side face and the first side face are not coplanar; the driving assembly comprises a power source and a first shaft, the power source is used for driving the first shaft to drive the flange and driving the upper cover to do lifting motion through the flange so as to expose or seal the opening of the reaction chamber, and the upper cover drives the first guide assembly and the second guide assembly to synchronously lift on the first side face and the second side face respectively. The rotating probability of the upper cover in the lifting process can be reduced or even completely avoided, the lifting stability is ensured, and the cost and the jamming risk are low.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor processing equipment. Background Art

[0002] For reaction chambers for atomic layer deposition and other processes, an opening / closing cover structure is generally provided, which is usually realized by an electric cylinder or a lead screw guide arranged on the wall of the reaction chamber. The electric cylinder or the lead screw guide controls the upper cover (Lid) to perform lifting and lowering movements, thereby realizing the sealing or opening of the reaction chamber. The current mainstream is to set a single electric cylinder or lead screw guide, which has a single force application point on the upper cover, which easily causes the upper cover to rotate clockwise or counterclockwise during the lifting process, and the lifting stability is poor; and if two or more electric cylinders or lead screw guides are set to provide multiple force application points for the upper cover to ensure the lifting stability, it will not only increase the cost, but also occupy the maintenance space of the reaction chamber. More importantly, these electric cylinders or lead screw guides need to maintain synchronous movement to prevent jamming, which makes the operation difficult. Summary of the invention

[0003] In view of this, the present application provides a semiconductor processing equipment, which can improve the problem that the prior art is difficult to achieve stable lifting and lowering of the upper cover of the reaction chamber through low cost and easy operation.

[0004] The present application provides a semiconductor processing device, comprising a reaction chamber and an upper cover, and further comprising:

[0005] A flange is arranged on the upper cover;

[0006] A guide member, fixed to the reaction chamber;

[0007] A first guide assembly is fixed relative to the upper cover and abuts against a first side surface of the guide member;

[0008] A second guide assembly is fixed relative to the upper cover and abuts against a second side surface of the guide member, wherein the second side surface is not coplanar with the first side surface;

[0009] The driving assembly includes a power source and a first shaft, wherein the power source is used to drive the first shaft to transmit the flange, and drive the upper cover to perform lifting movement through the flange, and the upper cover drives the first guide assembly and the second guide assembly to synchronously lift and lower on the first side surface and the second side surface respectively, when the flange rises to the first target position, the upper cover exposes the opening of the reaction chamber, and when the flange descends to the second target position, the upper cover seals the opening of the reaction chamber.

[0010] Optionally, when the flange descends to the second target position, the first shaft is arranged opposite to the flange plate of the flange.

[0011] Optionally, the flange is provided with a flange shaft, and the flange shaft is arranged on the side of the flange plate facing the reaction chamber; the first shaft is a hollow shaft; when the flange moves between the first target position and the second target position, the flange shaft always extends and is inserted into the first shaft.

[0012] Optionally, the flange plate of the flange is embedded in the upper cover, and the flange plate includes a first flange side, a second flange side, a third flange side and a fourth flange side which are connected in sequence end to end, the first flange side and the third flange side are arranged opposite to each other and are both planes, the second flange side and the fourth flange side are arranged opposite to each other and are both arc-shaped surfaces; the first flange side and the third flange side are both parallel to the second side of the guide member.

[0013] Optionally, the semiconductor processing equipment further comprises at least one first linear bearing, wherein the at least one first linear bearing is fixed to a cavity wall of the reaction chamber, and the first axis is passed through the first linear bearing along a lifting direction.

[0014] Optionally, any one of the first guide assembly and the second guide assembly includes:

[0015] A base, comprising a mounting portion and a bearing portion, wherein the mounting portion is used to be relatively fixed to the upper cover, and the bearing portion is disposed adjacent to a side surface corresponding to the guide member;

[0016] Guides;

[0017] A mounting member, for mounting the roller of the guide member on the bearing portion;

[0018] An elastic member is sleeved outside the mounting member, and the elastic member abuts against the roller of the guide member to provide a preset force to the roller when the upper cover is lifted or lowered, and the preset force is perpendicular to the side surface corresponding to the guide member.

[0019] Optionally, a slide groove is provided on the first side and / or the second side of the guide member, and an extension direction of the slide groove is parallel to the lifting direction of the upper cover. The roller is arranged in the slide groove and is lifted and lowered synchronously with the upper cover along the slide groove.

[0020] Optionally, the semiconductor processing equipment further comprises an outer cover disposed on the upper cover, and the first guide assembly is fixed on the outer cover so that the first guide assembly is higher than the second guide assembly.

[0021] Optionally, the semiconductor processing equipment also includes a second linear bearing and a second shaft, the second linear bearing is fixed to the cavity wall of the reaction chamber, one end of the second shaft is connected to the upper cover, and the other end is passed through the second linear bearing along the lifting direction.

[0022] Optionally, along a line of sight perpendicular to the upper cover, the second axis, the first guide assembly and an orthographic projection of the second guide assembly are interconnected to form a triangle.

[0023] As described above, in the process of the driving component driving the upper cover to perform lifting movement, the upper cover drives the first guide component and the second guide component to rise and fall synchronously on the first side surface and the second side surface of the guide member respectively, and on the plane perpendicular to the first side surface and the second side surface, that is, on the plane where the upper cover is located, one of the first guide component and the second guide component can limit the clockwise rotation of the upper cover, and the other can limit the counterclockwise rotation of the upper cover, thereby reducing or even completely avoiding the probability of the upper cover rotating during the lifting process, thereby ensuring the lifting stability; at the same time, compared with the structural design of setting two or more electric cylinders or screw guides, the present application can realize the lifting and lowering of the upper cover through only one driving source, and there is no problem of synchronous movement of multiple driving sources, thereby reducing costs and simplifying operation, and the risk of jamming is extremely low. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is an xy cross-sectional view of a semiconductor processing device according to an example;

[0025] Figure 2 is an xy cross-sectional view of a semiconductor processing device according to another example;

[0026] Figure 3 is an xy cross-sectional schematic diagram of a semiconductor processing device provided in an embodiment of the present application;

[0027] Figure 4 is a schematic diagram of the cooperation between the first guide assembly and the second guide assembly and the guide member when viewed from above;

[0028] Figure 5 It is a schematic structural diagram of a flange according to an embodiment of the present application;

[0029] Figure 6 is a schematic structural diagram of a driving assembly according to an embodiment of the present application;

[0030] Figure 7 yes Figure 6 An xy cross-sectional schematic diagram of the drive assembly shown;

[0031] Figure 8 is a partial cross-sectional view of the semiconductor processing equipment of the present application in a closed state;

[0032] Fig. 9 yes Figure 3 A schematic diagram of opening the cover of the semiconductor processing equipment shown;

[0033] Fig.10 It is a partial cross-sectional view of the semiconductor processing equipment of the present application during the process of opening the cover;

[0034] Fig.11 is another partial cross-sectional view of the semiconductor processing equipment of the present application during the cover opening process;

[0035] Fig.12 is a schematic structural diagram of the first guide assembly of the present application;

[0036] Fig.13 yes Fig.12 an xz cross-sectional view of the first guide assembly shown;

[0037] Fig.14 It is an xy cross-sectional schematic diagram of another semiconductor processing equipment provided in an embodiment of the present application.

[0038] First direction x Second direction y Third direction z Lifting direction y0

[0039] Reaction chamber 100 Electric cylinder 101 Fixing plate 102 Shaft 103 Upper cover 104 Connector 105

[0040] Screw guide 200 Screw 201 Ball nut 202

[0041] Reaction chamber 1

[0042] Upper cover 2 mounting groove 2a mounting hole 2b screw 20

[0043] Flange 3 flange plate 31 flange shaft 32 through hole 310 first flange side 311 second flange side 312 third flange side 313 fourth flange side 314

[0044] Guide member 4 First side surface 41 Second side surface 42

[0045] First guide assembly 5

[0046] Base 50 Guide 51 Mounting 52 Elastic 53 Retaining ring 54

[0047] Mounting part 501 Carrying part 502 Clearance area 503 Rolling element 511 Rolling shaft 512

[0048] Second guide assembly 6

[0049] Driving assembly 7 Power source 70 First shaft 71

[0050] Bracket 8 Cover 9

[0051] First linear bearing 11 Second linear bearing 12 Second shaft 13 Guide cylinder 14 DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only part of the embodiments of the present application, not all of the embodiments. In the absence of conflict, the following embodiments and their technical features can be combined with each other and also belong to the technical solutions of the present application.

[0053] In the description of the embodiments of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the corresponding embodiments, rather than indicating or implying that a device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0054] See also Figure 1 In a semiconductor processing device of a related example, two electric cylinders 101 are arranged opposite to each other outside the cavity wall of the reaction chamber 100. The two electric cylinders 101 are respectively fixed on a fixing plate 102, and the fixing plate 102 is fixed outside the cavity wall of the reaction chamber 100. The shaft 103 of the electric cylinder 101 is extended and retracted up and down to drive the connecting piece 105 connected to the upper cover 104 to perform lifting and lowering movements, thereby driving the upper cover 104 to perform lifting and lowering movements to realize the opening or closing of the reaction chamber 100. The two electric cylinders 101 need to keep synchronous movement during the lifting process to prevent jamming, which is difficult to operate and prone to uneven force, which will also increase the risk of jamming, and at the same time, the cost is high and the maintenance space of the reaction chamber 100 is occupied.

[0055] See also Figure 2 In another related example, a lead screw guide 200 is disposed outside the cavity wall of the reaction chamber 100, the lower end of the lead screw 201 of the lead screw guide 200 is fixed on the fixing plate 102, the fixing plate 102 is fixed outside the cavity wall of the reaction chamber 100, and the ball nut 202 of the lead screw guide 200 slides up and down along the lead screw 201 to drive the connecting piece 105 connected to the upper cover 104 to move up and down, so as to drive the upper cover 104 to move up and down, and realize the opening or closing of the reaction chamber 100. Although there is only one driving source for driving the upper cover 104 to move up and down, which reduces the cost, the lead screw guide 200 has a single force point on the upper cover 104, which easily causes the upper cover 104 to rotate during the lifting process, and the lifting stability is poor.

[0056] In order to solve the above problems existing in the related art, the semiconductor processing equipment of the embodiment of the present application can realize the lifting and lowering of the upper cover by only one driving source. Figure 1 The related examples of this application have lower costs, no problem of synchronous movement of multiple drive sources, easy operation, and extremely low risk of jamming; compared with Figure 2 According to the related examples described above, in the process of driving the upper cover to perform lifting movement, the upper cover drives the first guide assembly and the second guide assembly to rise and fall synchronously on the first side surface and the second side surface of the guide member that are not coplanar, respectively. On the plane perpendicular to the first side surface and the second side surface, one of the first guide assembly and the second guide assembly can limit the clockwise rotation of the upper cover, and the other can limit the counterclockwise rotation of the upper cover. The two work together to prevent the upper cover from rotating, and the lifting stability is better.

[0057] The reaction chamber includes but is not limited to a chamber for preparing a deposition layer for etching barrier, such as a PDT (PreDeposition treatment) chamber, an ALD AlN (Atomic Layer Deposition AlN) chamber, and an ODC (Oxygen Doped Carbon) chamber. The reaction carried out in the chamber and the deposition layer prepared are also not limited, for example, it can be a silicon oxide layer.

[0058] For different application scenarios, different manufacturers, etc., the specific forms of the structural parts of the semiconductor processing equipment, including the driving source, the guide, the first guide assembly and the second guide assembly, are adaptable, and the drawings and the following descriptions are only for exemplary display and explanation.

[0059] Please also read Figures 3 to 13 As shown, the semiconductor processing equipment of one embodiment of the present application includes a reaction chamber 1, an upper cover 2, a flange 3, a guide 4, a first guide assembly 5, a second guide assembly 6 and a drive assembly 7. As a complete device, the semiconductor processing equipment may also include other necessary or non-essential structural parts, such as Figure 3 The bracket 8 shown is used to support the reaction chamber 1. The arrangement and functions of these structural components can be found in the relevant technology and will not be described in detail here.

[0060] For ease of description, the width direction of the semiconductor processing equipment is referred to as the first direction x, the height direction is referred to as the second direction y, and the thickness direction is referred to as the third direction z. The first direction x, the second direction y, and the third direction z are perpendicular to each other and can be regarded as the three coordinate axes of the three-dimensional rectangular coordinate system. It should be understood that the so-called perpendicularity in this article does not require that the angle between the two must be 90°, but allows a deviation of, for example, ±10°, that is, the angle between the two perpendicular directions is 80° to 100°; similarly, the so-called parallelism does not require that the angle between the two must be 0° or 180°, but allows a deviation of, for example, ±10°, that is, the angle between the two parallel directions is 0° to 10° or 170° to 190°.

[0061] The upper cover 2 is disposed above the reaction chamber 1 , namely, located on one side of the opening of the reaction chamber 1 .

[0062] The guide member 4 is fixed to the reaction chamber 1, for example, it can be fixed to the wall of the reaction chamber 1 by screwing. In actual scenarios, the guide member 4 can be a wiring groove member, for example, for accommodating wiring connecting the reaction chamber 1 and the upper cover 2. The guide member 4 is provided with a first side surface 41 and a second side surface 42 connected vertically, and the guide member 4 is provided with a first side surface 41 and a second side surface 42 connected vertically, and the guide member 4 can be fixed to the wall of the reaction chamber 1 by screwing. Figure 3 and Figure 4 As shown, the first side surface 41 is parallel to the yz plane, and the second side surface 42 is parallel to the xy plane.

[0063] Combination Figure 3 and Figure 5 As shown, the flange 3 includes a flange plate 31 and a flange shaft 32, and the flange shaft 32 is arranged on the side of the flange plate 31 facing the reaction chamber 1. The flange 3 is arranged on the upper cover 2. For example, a mounting groove 2a can be provided at the lower part of the upper cover 2. The mounting groove 2a can at least accommodate the flange plate 31 of the flange 3. The lower surface of the flange plate 31 can be flush with the lower surface of the upper cover 2. At this time, the flange shaft 32 is completely exposed or protrudes from the lower surface of the upper cover 2; each side of the flange plate 31 contacts the corresponding surface of the groove wall of the mounting groove 2a. At this time, the flange 3 is arranged in the upper cover 2 in an embedded manner. The flange plate 31 is provided with a plurality of through holes 310, such as threaded holes, and the screws 20 are inserted into the corresponding through holes 310, and are screwed together with the corresponding positions of the upper cover 2 by screw locking, so as to achieve the fixation between the flange 3 and the upper cover 2.

[0064] exist Figure 3 In the example, the mounting groove 2a penetrates the upper cover 2 along the second direction y. When observed in the opposite direction of the second direction y, that is, when looking down at the upper cover 2, the mounting groove 2a does not expose the multiple through holes 310. The upper part of the upper cover 2 can be provided with multiple mounting holes 2b, each mounting hole 2b is aligned with each through hole 310, and the screw 20 is inserted and screwed into the corresponding through hole 310 from the upper surface of the upper cover 2 downward.

[0065] In other examples, the mounting groove 2a may not penetrate the upper cover 2, and the screw 20 is inserted upward from the lower surface of the upper cover 2 into the corresponding through hole 310 and screwed into the mounting hole at the corresponding position of the upper cover 2. After screwing, the screw 20 may be sunken or flush with the lower surface of the upper cover 2.

[0066] The first guide assembly 5 is relatively fixed to the upper cover 2. Figure 3 In the example shown, the semiconductor processing equipment further includes an outer cover 9, which is fixed to the upper surface of the upper cover 2 and can be used to accommodate and cover structural elements such as wiring arranged on the upper cover 2. The first guide assembly 5 is fixed to the outer cover 9 to achieve relative fixation with the upper cover 2. In other examples, for example, in a scenario where the outer cover 9 is not provided, the first guide assembly 5 can be directly fixed to the upper surface of the upper cover 2. The first guide assembly 5 also abuts against the first side surface 41 of the guide member 4 and can move up and down along the first side surface 41.

[0067] The second guide assembly 6 is fixed relatively to the upper cover 2, for example, Figure 3 The second guide assembly 6 is directly fixed to the upper surface of the upper cover 2. The second guide assembly 6 also abuts against the second side surface 42 of the guide member 4 and can move up and down along the second side surface 42. Since the second side surface 42 is vertically connected to the first side surface 41, the second guide assembly 6 and the first guide assembly 5 can be regarded as being sandwiched on both sides of an edge of the guide member 4.

[0068] Combined Figure 3 , Figure 6 and Figure 7 As shown, the driving assembly 7 includes a power source 70 and a first shaft 71. The driving assembly 7 can actually be an electric cylinder. The power source 70 can be installed and fixed on the bracket 8. One end of the first shaft 71 is connected to the power source 70, and the other end passes through the reaction chamber 1 and extends toward the flange 3. The power source 70 is used to drive the first shaft 71 to extend and retract up and down to drive the flange 3, and drive the upper cover 2 to move up and down through the flange 3, that is, to move up and down along the second direction y, so that the upper cover 2 drives the first guide assembly 5 and the second guide assembly 6 to move up and down synchronously on the first side surface 41 and the second side surface 42 of the guide member 4 respectively.

[0069] It should be noted that the first shaft 71, the flange 3 and the matching structure between the two and the reaction chamber 1 and the upper cover 2 are all located outside the effective reaction chamber of the reaction chamber 1. The so-called effective reaction chamber refers to the cavity where the reaction is carried out, which is isolated from external structural elements after being sealed by the upper cover 2.

[0070] The working principle and process of the semiconductor processing equipment are as follows:

[0071] from Figure 3 and Figure 8The reaction chamber 1 shown in the figure is in the closed state, the power source 70 drives the first shaft 71 to move upward, and the first shaft 71 contacts the flange 3 (as shown in FIG. Fig.10 The flange 3 is driven to move upward (as shown in the dotted line of the rectangle) Fig.11 As shown in FIG. 1 , the upper cover 2 is driven upward by the flange 3, and the upper cover 2 drives the first guide assembly 5 and the second guide assembly 6 to move upward synchronously on the first side surface 41 and the second side surface 42 of the guide member 4, respectively, until the flange 3 rises to the first target position. At this time, the reaction chamber 1 is in the state as shown in FIG. Fig. 9 It should be understood that the first target position may be a position point along the second direction y, or a position range along the second direction y.

[0072] When the flange 3 is located at the first target position, the first shaft 71 of the driving assembly 7 abuts against the lower surface of the flange 31 of the flange 3 and applies an upward lifting force to the flange 31. The lower surface of the flange 31 is not in contact with the upper surface (or "opening surface") of the reaction chamber 1. For example, the entire lower surface of the upper cover 2 is out of contact with the reaction chamber 1. Here, the upper cover 3 can expose the opening of the reaction chamber 1, and the reaction chamber 1 is in a state as shown in FIG. Fig. 9 Shown in open cover state.

[0073] Continue to combine Figure 3 , Figures 8 to 10 As shown, from Fig. 9 Starting from the cover opening state shown in the figure, the power source 70 drives the first shaft 71 to move downward, the first shaft 71 can still be in contact with the flange 3, the flange 3 presses the first shaft 71 downward under its own gravity, the flange 3 moves downward, and the upper cover 2 moves downward through the flange 3, and the upper cover 2 drives the first guide assembly 5 and the second guide assembly 6 to move downward synchronously on the first side surface 41 and the second side surface 42 of the guide member 4 respectively, until the flange 3 drops to the second target position, at which time the reaction chamber 1 is in the state as shown in the figure. Figure 3 and Figure 8 It should be understood that the second target position may be a position point along the second direction y, or a position range along the second direction y.

[0074] When the flange 3 is located at the second target position, the first shaft 71 of the driving assembly 7 may or may not contact the lower surface of the flange 31 of the flange 3, the lower surface of the flange 31 is parallel to the upper surface of the reaction chamber 1, and the entire lower surface of the upper cover 2 is parallel to and completely in contact with the reaction chamber 1. At this point, the upper cover 3 can cover the opening of the reaction chamber 1, and the reaction chamber 1 is in a closed state.

[0075] In the process of the driving assembly 7 driving the upper cover 2 to perform the lifting movement, on the plane perpendicular to the first side surface 41 and the second side surface 42 of the guide member 4, that is, on the xz plane where the upper cover 2 is located, one of the first guide assembly 5 and the second guide assembly 6 can limit the clockwise rotation of the upper cover 2, and the other can limit the counterclockwise rotation of the upper cover 2. Figure 3 and Figure 4 As shown, when the first guide assembly 5 limits the upper cover 2 to rotate counterclockwise, the second guide assembly 6 can limit the upper cover 2 to rotate clockwise. The first guide assembly 5 and the second guide assembly 6 can work together to limit the upper cover 2 from rotating relative to the guide member 4, and the guide member 4 is fixed to the reaction chamber 1. Therefore, the probability of the upper cover 2 rotating relative to the reaction chamber 1 during the lifting process can be reduced or even completely avoided, thereby ensuring the lifting stability. At the same time, the present application can realize the lifting and lowering of the upper cover 2 through only one power source 70, and there is no problem of synchronous movement of multiple drive sources, which can not only reduce costs but also simplify operation, making the risk of jamming extremely low.

[0076] Please continue reading Figure 3 and Figure 8 As shown in FIG. 1 , when the flange 3 is lowered to the second target position, for example, the driving assembly 7 is in the extreme contraction state and the first shaft 71 is in the lowest position, the upper end of the first shaft 71 can be arranged relative to the flange plate 31 of the flange 3 along the second direction y. The so-called relative arrangement can be understood as: a gap is formed between the lower surface of the flange plate 31 and the upper end of the first shaft 71, such as Figure 8 The area shown by the dotted line in the middle rectangle can form an "empty stroke" during the lifting process.

[0077] Here, in the process of opening the reaction chamber 1, the first shaft 71 does not contact the lower surface of the flange 31 in the idle stroke stage, and continues to move upward until it contacts the lower surface of the flange 31, which is the idle stroke stage. In the process of closing the reaction chamber 1, the first shaft 71 supports the flange 31 and moves downward. When the lower surfaces of the upper cover 2 and the flange 31 contact the reaction chamber 1 and no longer move downward due to the shielding of the reaction chamber 1, the first shaft 71 and the flange 31 are separated from each other in the idle stroke stage. Due to the existence of the idle stroke, the upper cover 2 and the flange 31 will not be subjected to any force from the first shaft 71, but will compress the sealing ring between the upper cover 2 and the reaction chamber 1 under the action of their own gravity, so that the sealing between the upper cover 2 and the reaction chamber 1 is better.

[0078] In one example, the first shaft 71 of the driving assembly 7 may be a hollow shaft, which may be referred to as a "shaft cylinder". When the flange 3 moves between the first target position and the second target position, including when it moves to the first target position and the second target position, the flange shaft 32 always extends and is inserted into the first shaft 71. Here, the first shaft 71 can always limit the flange 3 and its flange shaft 32 to perform lifting and lowering movements along the second direction y, and try not to deviate, which is conducive to further limiting the rotation of the upper cover 2.

[0079] Further optionally, the flange shaft 32 may be tightly fitted with the first shaft 71 to reduce the probability of relative rotation between the flange shaft 32 and the first shaft 71 , which is also beneficial to restricting the upper cover 2 from rotating.

[0080] The flange 31 can also limit the rotation of the upper cover 2 through its own structural design. Figure 3 and Figure 5 As shown, the flange 31 includes a first flange side 311, a second flange side 312, a third flange side 313 and a fourth flange side 314 connected end to end in sequence. The first flange side 311 and the third flange side 313 are arranged oppositely along the third direction z and are both planes. The fourth flange side 314 and the second flange side 312 are arranged oppositely along the first direction x and are both arc-shaped surfaces. The first flange side 311, the third flange side 313 and the second side 42 of the guide member 4 are parallel to each other. In this regard, during the lifting process of the flange 3 and the flange 31, the groove wall of the mounting groove 2a of the upper cover 2 will provide a blocking force to the connection of each side (i.e., the connection between the first flange side 311 and the second flange side 312, the connection between the first flange side 311 and the fourth flange side 314, the connection between the third flange side 313 and the second flange side 312, and the connection between the third flange side 313 and the fourth flange side 314), thereby blocking the flange 3 and the flange 31 from rotating on the xz plane, which is conducive to further limiting the rotation of the upper cover 2.

[0081] Please continue reading Figure 3 As shown, the semiconductor processing equipment can also be provided with at least one first linear bearing 11 on the cavity wall of the reaction chamber 1, and any first linear bearing 11 can be fixed to the cavity wall of the reaction chamber 1 by, for example, screw locking. The figure shows the setting of two identical first linear bearings 11 as an example, and other examples can be adaptively set according to actual needs, for example, according to the height of the reaction chamber 1, and other numbers of first linear bearings 11 can be set. Only one can also be set, or more than two can be set. When two or more first linear bearings 11 are provided, these first linear bearings 11 are aligned along the second direction y, that is, their respective bearing holes are aligned up and down, so as to ensure that the first shaft 71 of the drive assembly 7 is passed through each first linear bearing 11 along the lifting direction y0.

[0082] When the first shaft 71 of the driving assembly 7 drives the upper cover 2 to move up and down, the fixed first linear bearing 11 can only allow the first shaft 71 to move up and down along the lifting direction y0 without deviating to the left or right side, which is beneficial to limit the rotation of the upper cover 2.

[0083] In an example of the present application, the first guide assembly 5 and the second guide assembly 6 may have different heights relative to the upper surface of the upper cover 2, that is, the first guide assembly 5 and the second guide assembly 6 may have a height difference relative to the upper cover 2 along the second direction y. Figure 3 As shown in the example, the first guide assembly 5 is fixed on the outer cover 9 to be relatively fixed with the upper cover 2, and the second guide assembly 6 is directly fixed on the upper surface of the upper cover 2. At this time, the first guide assembly 5 is higher than the second guide assembly 6 relative to the upper cover 2. For any position of the upper cover 2, the connection line between the first guide assembly 5 and the second guide assembly 6 will be arranged in a triangle. Based on the high structural stability of the triangle, the first guide assembly 5 and the second guide assembly 6 are not easy to deviate from the guide member 4 except along the lifting direction y0, which is conducive to limiting the rotation of the upper cover 2.

[0084] The structures of the first guide assembly 5 and the second guide assembly 6 may be the same or different. Fig.12 and Fig.13 As shown, the first guide assembly 5 includes a base 50 , a guide member 51 , a mounting member 52 and an elastic member 53 .

[0085] The base 50 includes a mounting portion 501 and a bearing portion 502, both of which may be plate-shaped or block-shaped structures. The mounting portion 501 is parallel to the xz plane, and the bearing portion 502 is parallel to the yz plane, that is, the mounting portion 501 and the bearing portion 502 are vertically connected to make the base 50 L-shaped. The mounting portion 501 is relatively fixed to the upper surface of the upper cover 2; for example, Figure 3 In the example, the mounting portion 501 can be fixed to the outer cover 9 by screwing so as to be fixed relatively to the upper cover 2. In other examples, the mounting portion 501 can be directly fixed to the upper surface of the upper cover 2 by screwing. The bearing portion 502 is arranged adjacent to the side corresponding to the guide member 4, that is, the bearing portion 502 of the first guide assembly 5 is arranged adjacent to the first side 41 of the guide member 4, and the bearing portion 502 of the second guide assembly 6 is arranged adjacent to the second side 42 of the guide member 4; the adjacent arrangement includes but is not limited to the two being arranged parallel to each other and opposite to each other. The bearing portion 502 is provided with a clearance area 503.

[0086] The guide member 51 is arranged in the clearance area 503 of the bearing part 502. The guide member 51 is provided with a roller 511 and a roller 512. The roller 511 can be a roller or a bearing. The roller 512 passes through the roller 511; along the direction perpendicular to the corresponding side of the guide member 4, two mounting members 52 pass through the two ends of the roller 512 respectively and are fixed to the bearing part 502, so that the roller 512 and the roller 511 are installed on the bearing part 502. One side of the roller 511 passes through the bearing part 502 through the clearance area 503 and abuts against the side corresponding to the guide member 4, and the other side passes through the bearing part 502 and is located between the two mounting members 52. The mounting member 52 is provided with a limiting part, which can be a structural member for screwing the mounting member 52 to fix it to the bearing part 502. For example, in the scenario where the mounting member 52 is a screw or a pin, the limiting part can be a nut of the screw or a pin cap of the pin.

[0087] The two elastic members 53 are respectively mounted on the corresponding mounting members 52. Fig.12 and Fig.13 As shown, each mounting member 52 can be arranged in a rod shape, for example, a screw, one end of the mounting member 52 is fixed to the bearing portion 502 of the base 50, and the other end is provided with a limiting portion and extends toward the outer cover 9 (i.e., in the opposite direction of the first direction x), and the elastic member 53 is sleeved outside the corresponding mounting member 52 and located between the limiting portion of the mounting member 52 and the roller 512, and the elastic member 53 includes but is not limited to a rubber sleeve. Retaining rings 54 can be respectively arranged between the two sides of the roller 511 and the two elastic members 53 to prevent the roller 511 from squeezing the elastic member 53 and causing the elastic member 53 to deform when rolling. One end of each elastic member 53 abuts against the roller 512 of the guide member 51, and the other end abuts against the limiting portion of the mounting member 52, so as to provide a preset force on the roller 512 when the upper cover 2 is lifted and lowered, and the preset force is perpendicular to the corresponding side of the guide member 4, so as to ensure that the roller 511 is always in contact with the corresponding side of the guide member 4.

[0088] Taking the first guide assembly 5 as an example, when there is a pit on the first side surface 41 of the guide member 4, the elastic member 53 is in an extended state, and the preset force is a force toward the first side surface 41 at this time, and the roller 512 and the rolling element 511 are pushed toward the first side surface 41 of the guide member 4, thereby ensuring that the rolling element 511 is always in contact with the first side surface 41; when a protrusion appears on the first side surface 41 of the guide member 4, the rolling element 511 and the roller 512 are exerted with a force away from the first side surface 41 by the protrusion, and the roller 512 compresses the elastic member 53 so that the elastic member 53 is compressed. The compressed elastic member 53 needs to be restored to its original state due to deformation, so a preset force toward the first side surface 41 is applied to the roller 512 and the rolling element 511, thereby ensuring that the rolling element 511 is always in contact with the first side surface 41. The working principle and process of the second guide assembly 6 can be referred to here.

[0089] It can be seen that this example can eliminate the assembly error between the guide member 4 and the guide component, and the impact caused by the unevenness of the corresponding side of the guide member 4, ensuring that during the lifting and lowering process of the upper cover 2, each guide component always maintains contact with the corresponding side of the guide member 4 and effectively performs its respective functions.

[0090] In one example, the first side surface 41 and / or the second side surface 42 of the guide member 4 may be provided with a slide groove, the extension direction of which is parallel to the lifting direction y0 of the upper cover 2, and the rollers 511 of each guide assembly are provided in the slide groove and are lifted and lowered synchronously with the upper cover 2 along the slide groove. The slide groove can limit the corresponding guide assembly to always move along the lifting direction y0 without deviation, which is conducive to limiting the rotation of the upper cover 2.

[0091] See also Fig.14 As shown, the semiconductor processing equipment may further include a second linear bearing 12 and a second shaft 13, wherein the second linear bearing 12 is fixed to the cavity wall of the reaction chamber 1, one end of the second shaft 13 is connected to the lower surface of the upper cover 2, and the other end is arranged in the second linear bearing 12 along the lifting direction y0. Optionally, a guide cylinder 14 may be provided below the second linear bearing 12, wherein the guide cylinder 14 extends along the lifting direction y0 and is aligned with the bearing hole of the second linear bearing 12 from top to bottom, and the guide cylinder 14 may be fixed to the cavity wall of the reaction chamber 1 or to the bracket 8, and the second shaft 13 is arranged in the guide cylinder 14 after passing through the second linear bearing 12, and is limited by the guide cylinder 14 to move along the lifting direction y0. It should be understood that the second linear bearing 12 and the second shaft 13 are both located outside the effective reaction chamber of the reaction chamber 1.

[0092] When the first shaft 71 of the driving assembly 7 drives the upper cover 2 to perform lifting and lowering movements, the fixed second linear bearing 12 can only allow the second shaft 13 to move up and down along the lifting direction y0 without deviating to the left or right side. The second linear bearing 12 and the second shaft 13 cooperate with the aforementioned first guide assembly 5 and the second guide assembly 6, which is more conducive to limiting the rotation of the upper cover 2.

[0093] Along the line of sight perpendicular to the upper cover 2, that is, when looking down at the upper cover 2, the orthographic projections of the second axis 13, the first guide assembly 5, and the second guide assembly 6 are connected to each other to form a triangle. Due to the high structural stability of the triangle, the first guide assembly 5 and the second guide assembly 6 are not likely to deviate from the guide member 4 except along the lifting direction y0, which is conducive to limiting the rotation of the upper cover 2.

[0094] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. For ordinary technicians in this field, all equivalent structural changes made using the contents of this specification and drawings are also included in the patent protection scope of the present application.

[0095] Although the terms "first, second", etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. In addition, the singular forms "one", "an", and "the" are intended to include plural forms as well. The terms "or" and "and / or" are interpreted as inclusive, or mean any one or any combination. Only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way, an exception to this definition will occur.

Claims

1. A semiconductor processing device, comprising a reaction chamber and an upper cover, characterized in that: Also includes: A flange is arranged on the upper cover; A guide member, fixed to the reaction chamber; A first guide assembly is fixed relative to the upper cover and abuts against a first side surface of the guide member; A second guide assembly is fixed relative to the upper cover and abuts against a second side surface of the guide member, wherein the second side surface is not coplanar with the first side surface; The driving assembly includes a power source and a first shaft, wherein the power source is used to drive the first shaft to transmit the flange, and drive the upper cover to perform lifting movement through the flange, and the upper cover drives the first guide assembly and the second guide assembly to synchronously lift and lower on the first side surface and the second side surface respectively, when the flange rises to the first target position, the upper cover exposes the opening of the reaction chamber, and when the flange descends to the second target position, the upper cover seals the opening of the reaction chamber.

2. The semiconductor processing equipment according to claim 1, characterized in that When the flange descends to the second target position, the first shaft is arranged opposite to the flange plate of the flange.

3. The semiconductor processing equipment according to claim 2, characterized in that: The flange is provided with a flange shaft, and the flange shaft is arranged on a side of the flange plate facing the reaction chamber; The first shaft is a hollow shaft; When the flange moves between the first target position and the second target position, the flange shaft always extends and is inserted into the first shaft.

4. The semiconductor processing equipment according to any one of claims 1 to 3, characterized in that: The flange plate of the flange is embedded in the upper cover, and the flange plate includes a first flange side, a second flange side, a third flange side and a fourth flange side connected in sequence end to end, the first flange side and the third flange side are arranged opposite to each other and are both planes, the second flange side and the fourth flange side are arranged opposite to each other and are both arc-shaped surfaces; the first flange side and the third flange side are both parallel to the second side of the guide member.

5. The semiconductor processing equipment according to claim 1, characterized in that The semiconductor processing equipment further includes at least one first linear bearing, which is fixed to the cavity wall of the reaction chamber, and the first shaft is disposed in the first linear bearing along the lifting direction.

6. The semiconductor processing equipment according to claim 1, characterized in that Any one of the first guide assembly and the second guide assembly comprises: A base, comprising a mounting portion and a bearing portion, wherein the mounting portion is used to be relatively fixed to the upper cover, and the bearing portion is disposed adjacent to a side surface corresponding to the guide member; Guides; A mounting member, for mounting the roller of the guide member on the bearing portion; An elastic member is sleeved outside the mounting member, and the elastic member abuts against the roller of the guide member to provide a preset force to the roller when the upper cover is lifted or lowered, and the preset force is perpendicular to the side surface corresponding to the guide member.

7. The semiconductor processing equipment according to claim 6, characterized in that A slide groove is provided on the first side and / or the second side of the guide member, and the extending direction of the slide groove is parallel to the lifting direction of the upper cover. The roller is arranged in the slide groove and rises and falls synchronously with the upper cover along the slide groove.

8. The semiconductor processing equipment according to claim 1, 6 or 7, characterized in that: The semiconductor processing equipment further includes an outer cover, which is disposed on the upper cover, and the first guide component is fixed on the outer cover so that the first guide component is higher than the second guide component.

9. The semiconductor processing equipment according to claim 1, characterized in that The semiconductor processing equipment also includes a second linear bearing and a second shaft, wherein the second linear bearing is fixed to the cavity wall of the reaction chamber, one end of the second shaft is connected to the upper cover, and the other end is inserted into the second linear bearing along the lifting direction.

10. The semiconductor processing equipment according to claim 9, characterized in that Along a line of sight perpendicular to the upper cover, the second axis, the first guide assembly and the orthographic projection of the second guide assembly are connected to each other to form a triangle.

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