Semiconductor processing apparatus

Abstract

The application provides a semiconductor processing equipment, which comprises a reaction chamber, an upper cover and a flange arranged on the upper cover, a guide fixed with the reaction chamber, a first guide assembly fixed with the upper cover and abutting against a first side surface of the guide, a second guide assembly fixed with the upper cover and abutting against a second side surface of the guide, wherein the second side surface is not coplanar with the first side surface, and a driving assembly comprising a power source and a first shaft, wherein the power source is used to drive the first shaft to drive the flange and drive the upper cover to perform lifting movement through the flange, so as to expose or cover an opening of the reaction chamber, and the upper cover drives the first guide assembly and the second guide assembly to synchronously perform lifting movement on the first side surface and the second side surface respectively. The application can reduce or even completely avoid the rotation of the upper cover during the lifting process, ensure the lifting stability, and has low cost and low risk of being stuck.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically to a semiconductor processing equipment. Background Technology

[0002] For reaction chambers used in processes such as atomic layer deposition, an opening / closing structure is typically installed. This is usually achieved using electric cylinders or lead screws mounted on the chamber wall. The cylinders or lead screws control the lifting and lowering of the lid, thus sealing or opening the reaction chamber. Currently, the mainstream approach is to use a single electric cylinder or lead screw, which provides a single point of force to the lid, making it prone to clockwise or counterclockwise rotation during lifting, resulting in poor stability. Using two or more electric cylinders or lead screws to provide multiple points of force to ensure stability not only increases costs but also occupies maintenance space within the reaction chamber. More importantly, these cylinders or lead screws need to move synchronously to prevent jamming, making operation difficult. Summary of the Invention

[0003] In view of this, this application provides a semiconductor processing apparatus that can improve the problem that the existing technology is unable to achieve stable lifting and lowering of the top cover of the reaction chamber through low cost and easy operation.

[0004] This application provides a semiconductor processing apparatus, including a reaction chamber and a top cover, and further comprising:

[0005] A flange is provided on the upper cover;

[0006] The guide component is fixed to the reaction chamber;

[0007] The first guide component is fixed relative to the upper cover and abuts against the first side of the guide member;

[0008] The second guide component is fixed relative to the upper cover and abuts against the second side of the guide member, wherein the second side is not coplanar with the first side.

[0009] The drive assembly includes a power source and a first shaft. The power source drives the first shaft to drive the flange and, through the flange, drives the upper cover to move up and down. The upper cover drives the first guide assembly and the second guide assembly to move up and down synchronously on the first side and the second side, respectively. When the flange rises to the first target position, the upper cover exposes the opening of the reaction chamber, and when the flange falls to the second target position, the upper cover seals the opening of the reaction chamber.

[0010] Optionally, when the flange is lowered to the second target position, the first shaft is positioned opposite the flange plate of the flange.

[0011] Optionally, the flange is provided with a flange shaft, which is located on the side of the flange facing the reaction chamber; the first shaft is a hollow shaft; when the flange moves between the first target position and the second target position, the flange shaft always extends and is inserted into the first shaft.

[0012] Optionally, the flange is embedded in the upper cover. The flange includes a first flange side, a second flange side, a third flange side, and a fourth flange side connected end to end. The first flange side and the third flange side are opposite to each other and are both planar. The second flange side and the fourth flange side are opposite to each other and are both arc-shaped surfaces. The first flange side and the third flange side are both parallel to the second side of the guide member.

[0013] Optionally, the semiconductor processing equipment further includes at least one first linear bearing, which is fixed to the cavity wall of the reaction chamber, and the first shaft passes through the first linear bearing in the lifting direction.

[0014] Optionally, either the first guide component or the second guide component includes:

[0015] The base includes a mounting part and a supporting part. The mounting part is used to be fixed relative to the upper cover, and the supporting part is disposed adjacent to the side of the guide member.

[0016] The guide component is provided with rollers and a roller shaft;

[0017] The mounting component is used to mount the roller of the guide component to the bearing portion;

[0018] An elastic element is sleeved outside the mounting component, and the elastic element abuts against the roller of the guide component to provide a preset force to the roller when the upper cover moves up and down. The preset force is perpendicular to the side of the guide component.

[0019] Optionally, the guide member has a groove on its first side and / or second side, the groove extending in a direction parallel to the lifting direction of the upper cover, and the roller is disposed in the groove and moves up and down synchronously with the upper cover along the groove.

[0020] Optionally, the semiconductor processing equipment further includes an outer cover disposed on the upper cover, wherein the first guide component is fixed on the outer cover so that the first guide component is higher than the second guide component.

[0021] Optionally, the semiconductor processing equipment further includes a second linear bearing and a second shaft. The second linear bearing is fixed to the cavity wall of the reaction chamber, and one end of the second shaft is connected to the upper cover, while the other end passes through the second linear bearing along the lifting direction.

[0022] Optionally, along a line of sight perpendicular to the top cover, the second axis, the first guide component, and the orthographic projection of the second guide component are interconnected to form a triangle.

[0023] As described above, during the lifting and lowering movement of the upper cover driven by the drive assembly, the upper cover drives the first guide assembly and the second guide assembly to lift and lower synchronously on the first and second sides of the guide member, respectively. On the plane perpendicular to the first and second sides, that is, on the plane where the upper cover is located, one of the first guide assembly and the second guide assembly can restrict the clockwise rotation of the upper cover, and the other can restrict the counterclockwise rotation of the upper cover, thereby reducing or even completely avoiding the probability of the upper cover rotating during the lifting and lowering process, and ensuring lifting and lowering stability. At the same time, compared with the structural design of setting two or more electric cylinders or lead screw guides, this application can realize the lifting and lowering of the upper cover with only one drive source, and there is no problem of multiple drive sources moving synchronously. This can reduce costs, simplify operation, and reduce the risk of jamming. Attached Figure Description

[0024] Figure 1 This is a cross-sectional view of the xy section of a semiconductor processing apparatus as an example.

[0025] Figure 2 This is a cross-sectional view of the xy section of a semiconductor processing apparatus, which is another related example.

[0026] Figure 3 This is a schematic diagram of the xy cross-section of a semiconductor processing apparatus provided in an embodiment of this application;

[0027] Figure 4 This is a top-down view showing the interaction between the first and second guide components and the guide elements.

[0028] Figure 5 This is a schematic diagram of the flange structure according to an embodiment of this application;

[0029] Figure 6 This is a schematic diagram of the structure of a driving component according to an embodiment of this application;

[0030] Figure 7 yes Figure 6 A schematic diagram of the xy-section of the driving component shown;

[0031] Figure 8 This is a partial cross-sectional view of the semiconductor processing equipment of this application in the closed state;

[0032] Figure 9 yes Figure 3 A schematic diagram of the semiconductor processing equipment being opened;

[0033] Figure 10 This is a partial cross-sectional view of the semiconductor processing equipment of this application during the opening process;

[0034] Figure 11 This is another partial cross-sectional view of the semiconductor processing equipment of this application during the opening process;

[0035] Figure 12 This is a schematic diagram of the structure of the first guiding component of this application;

[0036] Figure 13 yes Figure 12 The image shows a cross-sectional view of the first guide component at the xz section.

[0037] Figure 14 This is a schematic diagram of the xy cross-section of another semiconductor processing device provided in an embodiment of this application.

[0038] First direction x, second direction y, third direction z, ascending / descending direction y0

[0039] 100 Reaction chamber, 101 Electric cylinder, 101 Fixing plate, 102 Shaft, 103 Upper cover, 104 Connector, 105

[0040] Lead screw guide 200, lead screw 201, ball nut 202

[0041] Reaction chamber 1

[0042] Top cover 2 mounting slots 2a mounting holes 2b screws 20

[0043] Flange 3, Flange 31, Flange Shaft 32, Through Hole 310, First Flange Side 311, Second Flange Side 312, Third Flange Side 313, Fourth Flange Side 314

[0044] Guide component 4 First side 41 Second side 42

[0045] First guiding component 5

[0046] 50 Base, 51 Guide component, 52 Mounting component, 53 Elastic component, 54 Retaining ring

[0047] 501 Mounting section 502 Bearing section 502 Clearance area 503 Roller component 511 Roller 512

[0048] Second guide component 6

[0049] Drive component 7 Power source 70 First shaft 71

[0050] 8 brackets, 9 outer covers

[0051] First linear bearing 11, second linear bearing 12, second shaft 13, guide cylinder 14 Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only a part of the embodiments of this application, and not all of them. Unless otherwise specified, the following embodiments and their technical features can be combined with each other, and also belong to the technical solutions of this application.

[0053] In the description of the embodiments of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the technical solutions of the corresponding embodiments, and are not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limitations on this application.

[0054] See Figure 1 In one example of a semiconductor processing apparatus, two opposing electric cylinders 101 are disposed outside the wall of a reaction chamber 100. These two electric cylinders 101 are fixed to a fixing plate 102, which is also fixed outside the wall of the reaction chamber 100. The shaft 103 of the electric cylinders 101 extends and retracts vertically to drive a connecting piece 105 connected to a top cover 104 to move up and down, thereby causing the top cover 104 to move up and down, thus opening or closing the reaction chamber 100. The two electric cylinders 101 need to maintain synchronized movement during the lifting and lowering process to prevent jamming, which is difficult to operate and prone to uneven force distribution, increasing the risk of jamming. Furthermore, it is costly and occupies maintenance space in the reaction chamber 100.

[0055] See Figure 2 In another related example, a lead screw guide 200 is provided outside the cavity wall of the reaction chamber 100. The lower end of the lead screw 201 of the lead screw guide 200 is fixed to a fixing plate 102, which is fixed outside the cavity wall of the reaction chamber 100. The ball nut 202 of the lead screw guide 200 slides up and down along the lead screw 201 to drive the connecting piece 105 connected to the upper cover 104 to move up and down, thereby driving the upper cover 104 to move up and down, realizing the opening or closing of the reaction chamber 100. Although there is only one drive source to drive the upper cover 104 to move up and down, reducing costs, the lead screw guide 200 has only one point of force on the upper cover 104, which can easily cause the upper cover 104 to rotate during the lifting process, resulting in poor lifting stability.

[0056] To address the aforementioned problems in related technologies, the semiconductor processing equipment of this application embodiment can achieve the lifting and lowering of the top cover using only a single driving source, compared to... Figure 1 Compared to related examples, this application has lower costs, eliminates the problem of multiple drive sources moving synchronously, is easy to operate, and has an extremely low risk of jamming; compared to... Figure 2 In the aforementioned example, during the lifting and lowering movement of the upper cover, the upper cover drives the first guide component and the second guide component to lift and lower synchronously on the non-coplanar first and second side surfaces of the guide component. On a plane perpendicular to the first and second side surfaces, one of the first guide component and the second guide component can restrict the clockwise rotation of the upper cover, and the other can restrict the counterclockwise rotation of the upper cover. The two work together to prevent the upper cover from rotating, resulting in good lifting and lowering stability.

[0057] The reaction chamber includes, but is not limited to, chambers used to prepare etch-blocking deposited layers, such as PDT (PreDeposition treatment) chambers, ALD AlN (Atomic Layer Deposition AlN) chambers, and ODC (Oxygen Doped Carbon) chambers. The reactions carried out in the chambers and the deposited layers obtained are not limited, for example, they can be silicon oxide layers.

[0058] The specific form of the structural components of semiconductor processing equipment, including the drive source, guide, first guide assembly, and second guide assembly, varies depending on the application scenario and the manufacturer. The accompanying drawings and descriptions below are for illustrative purposes only.

[0059] Please refer to the following: Figures 3 to 13 As shown, a semiconductor processing apparatus according to an embodiment of this application includes a reaction chamber 1, a top cover 2, a flange 3, a guide 4, a first guide assembly 5, a second guide assembly 6, and a drive assembly 7. As a complete device, this semiconductor processing apparatus may also include other necessary or unnecessary structural components, such as... Figure 3 The support 8 shown is used to support the reaction chamber 1. The arrangement and function of these structural components can be found in relevant technologies and will not be described in detail here.

[0060] For ease of description, this paper refers to the width direction of semiconductor processing equipment as the first direction x, the height direction as the second direction y, and the thickness direction as the third direction z. The first direction x, the second direction y, and the third direction z are all perpendicular to each other and can be regarded as the three coordinate axes of a three-dimensional rectangular coordinate system. It should be understood that the perpendicularity mentioned in this paper does not require that the angle between the two directions must be 90°, but allows for deviations of, for example, ±10°, that is, the angle between two perpendicular directions is 80° to 100°. Similarly, the parallelism mentioned does not require that the angle between the two directions must be 0° or 180°, but allows for deviations of, for example, ±10°, that is, the angle between two parallel directions is 0° to 10° or 170° to 190°.

[0061] The top cover 2 is located above the reaction chamber 1, that is, on one side of the opening of the reaction chamber 1.

[0062] The guide member 4 is fixed to the reaction chamber 1, for example, by screw fastening to the chamber wall of the reaction chamber 1. In practical scenarios, the guide member 4 can be a cable tray to accommodate, for example, the cable connecting the reaction chamber 1 and the upper cover 2. The guide member 4 is provided with a vertically connected first side 41 and a second side 42, combined with... Figure 3 and Figure 4 As shown, the first side 41 is parallel to the yz plane, and the second side 42 is parallel to the xy plane.

[0063] Combination Figure 3 and Figure 5 As shown, flange 3 includes a flange plate 31 and a flange shaft 32, with the flange shaft 32 positioned on the side of flange plate 31 facing reaction chamber 1. Flange 3 is mounted on top cover 2. For example, a mounting groove 2a can be formed in the lower part of top cover 2, which can at least accommodate the flange plate 31 of flange 3. The lower surface of flange plate 31 can be flush with the lower surface of top cover 2, at which point flange shaft 32 is fully exposed or protrudes from the lower surface of top cover 2. Each side of flange plate 31 contacts the corresponding surface of the groove wall of mounting groove 2a, thus flange 3 is embedded in top cover 2. Flange plate 31 has multiple through holes 310, such as threaded holes. Screws 20 are inserted into the corresponding through holes 310 and screwed into the corresponding positions on top cover 2, thereby fixing flange 3 to top cover 2.

[0064] exist Figure 3 In the example, the mounting groove 2a penetrates the upper cover 2 along the second direction y. When viewed from the opposite direction of the second direction y, i.e. when looking down at the upper cover 2, the mounting groove 2a does not expose multiple through holes 310. The upper part of the upper cover 2 can be provided with multiple mounting holes 2b, each mounting hole 2b is aligned with each through hole 310, and the screw 20 is inserted and screwed into the corresponding through hole 310 from the upper surface of the upper cover 2 downwards.

[0065] In other examples, the mounting slot 2a may not penetrate the upper cover 2, and the screw 20 is inserted upward from the lower surface of the upper cover 2 into the corresponding through hole 310 and screwed into the mounting hole at the corresponding position on the upper cover 2. After screwing, the screw 20 may be recessed or flush with the lower surface of the upper cover 2.

[0066] The first guide component 5 is fixed relative to the upper cover 2. For example, in Figure 3 In the example shown, the semiconductor processing equipment also includes an outer cover 9, which is fixed to the upper surface of the upper cover 2. The outer cover 9 can accommodate and cover structural components such as wiring disposed on the upper cover 2. The first guide assembly 5 is fixed to the outer cover 9 to achieve relative fixation with the upper cover 2. In other examples, such as scenarios where the outer cover 9 is not provided, the first guide assembly 5 can be directly fixed to the upper surface of the upper cover 2. The first guide assembly 5 also abuts against the first side 41 of the guide member 4 and can move up and down along the first side 41.

[0067] The second guide component 6 is fixed relative to the upper cover 2, for example, as Figure 3 The second guide assembly 6 is directly fixed to the upper surface of the cover 2. It also abuts against the second side 42 of the guide member 4 and can move up and down along this side 42. Since the second side 42 is perpendicularly connected to the first side 41, the second guide assembly 6 and the first guide assembly 5 can be considered as being sandwiched between two sides of one edge of the guide member 4.

[0068] Combined Figure 3 , Figure 6 and Figure 7 As shown, the drive assembly 7 includes a power source 70 and a first shaft 71. The drive assembly 7 can be practically represented as an electric cylinder. The power source 70 can be mounted and fixed on the bracket 8. One end of the first shaft 71 is connected to the power source 70, and the other end passes through the reaction chamber 1 and extends toward the flange 3. The power source 70 is used to drive the first shaft 71 to extend and retract vertically to transmit power to the flange 3, and through the flange 3, to drive the upper cover 2 to move up and down, that is, to move up and down along the second direction y, so that the upper cover 2 drives the first guide assembly 5 and the second guide assembly 6 to move up and down synchronously on the first side 41 and the second side 42 of the guide member 4, respectively.

[0069] It should be noted that the first shaft 71, flange 3, and the mating structure between the two and the reaction chamber 1 and the upper cover 2 are all located outside the effective reaction chamber of the reaction chamber 1. The so-called effective reaction chamber refers to the chamber in which the reaction takes place. This chamber is isolated from the external structural elements after being covered by the upper cover 2.

[0070] The working principle and process of the semiconductor processing equipment are as follows:

[0071] from Figure 3 and Figure 8When the reaction chamber 1 is in the closed position, the power source 70 drives the first shaft 71 to move upward, and the first shaft 71 contacts the flange 3 (as shown). Figure 10 (As shown by the dashed rectangular line) and drive the flange 3 to move upward (as shown by the dashed rectangular line). Figure 11 As shown), the flange 3 drives the upper cover 2 to move upward. The upper cover 2 drives the first guide assembly 5 and the second guide assembly 6 to move upward synchronously on the first side 41 and the second side 42 of the guide member 4, respectively, until the flange 3 rises to the first target position. At this time, the reaction chamber 1 is in the position shown. Figure 9 The diagram shows the open position. It should be understood that the first target position can be a point along the second direction y, or a range of positions along the second direction y.

[0072] When flange 3 is located at the first target position, the first shaft 71 of drive assembly 7 abuts against the lower surface of flange 31 and applies an upward lifting force to flange 31. The lower surface of flange 31 is not in contact with the upper surface (or "opening surface") of reaction chamber 1; for example, the entire lower surface of cover 2 is out of contact with reaction chamber 1. Thus, cover 3 exposes the opening of reaction chamber 1, which is positioned as follows: Figure 9 The lid is shown in the open position.

[0073] Continue to combine Figure 3 , Figures 8 to 10 As shown, from Figure 9 Starting from the open state shown, the power source 70 drives the first shaft 71 to move downwards. The first shaft 71 can still contact the flange 3. The flange 3, under its own weight, presses down on the first shaft 71. The flange 3 moves downwards, which in turn drives the upper cover 2 to move downwards. The upper cover 2 drives the first guide assembly 5 and the second guide assembly 6 to move downwards synchronously on the first side 41 and the second side 42 of the guide member 4, until the flange 3 descends to the second target position. At this time, the reaction chamber 1 is in the state shown. Figure 3 and Figure 8 The diagram shows the closed state. It should be understood that the second target position can be a point along the second direction y, or a range of positions along the second direction y.

[0074] When flange 3 is located at the second target position, the first shaft 71 of drive assembly 7 may or may not abut against the lower surface of flange 31 of flange 3. The lower surface of flange 31 is parallel to the upper surface of reaction chamber 1, and the entire lower surface of upper cover 2 is parallel to and in complete surface contact with reaction chamber 1. Thus, upper cover 3 can seal the opening of reaction chamber 1, and reaction chamber 1 is in a closed state.

[0075] During the lifting and lowering movement of the upper cover 2 driven by the drive assembly 7, on the plane perpendicular to the first side 41 and the second side 42 of the guide member 4, that is, on the xz plane where the upper cover 2 is located, one of the first guide assembly 5 and the second guide assembly 6 can restrict the clockwise rotation of the upper cover 2, and the other can restrict the counterclockwise rotation of the upper cover 2. For example, combined with Figure 3 and Figure 4 As shown, when the first guide component 5 restricts the upper cover 2 to rotate counterclockwise, the second guide component 6 can restrict the upper cover 2 to rotate clockwise. The first guide component 5 and the second guide component 6 work together to restrict the upper cover 2 from rotating relative to the guide component 4. Since the guide component 4 is fixed to the reaction chamber 1, the probability of the upper cover 2 rotating relative to the reaction chamber 1 during the lifting and lowering process can be reduced or even completely avoided, ensuring the stability of the lifting and lowering. At the same time, this application can realize the lifting and lowering of the upper cover 2 with only one power source 70, and there is no problem of multiple drive sources moving synchronously. This can reduce costs and simplify operation, making the risk of jamming extremely low.

[0076] Please continue reading. Figure 3 and Figure 8 As shown, when flange 3 descends to the second target position, for example, when drive assembly 7 is in its ultimate retracted state and first shaft 71 is in its lowest position, the upper end of first shaft 71 can be positioned relative to flange 31 of flange 3 along the second direction y. This relative positioning can be understood as: a gap is formed between the lower surface of flange 31 and the upper end of first shaft 71, such as... Figure 8 The area indicated by the dashed rectangular line is a gap that can create a "free travel" during the lifting and lowering process.

[0077] Therefore, during the opening of the reaction chamber 1, the first shaft 71 does not contact the lower surface of the flange 31 during the idle stroke phase. It continues to move upward until it contacts the lower surface of the flange 31, at which point the idle stroke phase contacts the flange 31. During the closing of the reaction chamber 1, the first shaft 71 supports the flange 31 and moves downward. When the lower surfaces of the upper cover 2 and the flange 31 contact the reaction chamber 1 and cease to move downward due to the obstruction of the reaction chamber 1, the first shaft 71 disengages from the flange 31 during the idle stroke phase. Due to the existence of the idle stroke, the upper cover 2 and the flange 31 are not subjected to any force from the first shaft 71. Instead, under their own weight, they compress the sealing ring between the upper cover 2 and the reaction chamber 1, resulting in a good seal between the upper cover 2 and the reaction chamber 1.

[0078] In one example, the first shaft 71 of the drive assembly 7 can be a hollow shaft, referred to as a "shaft cylinder." When the flange 3 moves between the first target position and the second target position, including when moving to both the first and second target positions, the flange shaft 32 always extends and is inserted into the first shaft 71. Thus, the first shaft 71 can always limit the lifting and lowering movement of the flange 3 and its flange shaft 32 along the second direction y, minimizing deviation and further limiting the rotation of the upper cover 2.

[0079] Alternatively, the flange shaft 32 can be tightly fitted with the first shaft 71 to reduce the probability of relative rotation between the flange shaft 32 and the first shaft 71, which also helps to limit the rotation of the upper cover 2.

[0080] The flange 31 can also limit the rotation of the upper cover 2 through its own structural design. Figure 3 and Figure 5 As shown, flange 31 includes a first flange side 311, a second flange side 312, a third flange side 313, and a fourth flange side 314 connected end to end. The first flange side 311 and the third flange side 313 are arranged opposite each other along the third direction z and are both planar. The fourth flange side 314 and the second flange side 312 are arranged opposite each other along the first direction x and are both arc-shaped surfaces. The first flange side 311, the third flange side 313, and the second side 42 of the guide member 4 are parallel to each other. Therefore, during the lifting and lowering of flange 3 and flange 31, the groove wall of the mounting groove 2a of the upper cover 2 provides a blocking force to the connection points of each side (i.e., the connection points of the first flange side 311 and the second flange side 312, the first flange side 311 and the fourth flange side 314, the third flange side 313 and the second flange side 312, and the third flange side 313 and the fourth flange side 314), thereby preventing flange 3 and flange 31 from rotating in the xz plane, which helps to further limit the rotation of the upper cover 2.

[0081] Please continue reading. Figure 3 As shown, the semiconductor processing equipment can also provide at least one first linear bearing 11 on the cavity wall of the reaction chamber 1. Any one of the first linear bearings 11 can be fixed to the cavity wall of the reaction chamber 1 by means of, for example, screw fastening. The figure shows an example of providing two identical first linear bearings 11. Other examples can be provided with other numbers of first linear bearings 11 according to actual needs, such as the height of the reaction chamber 1. Only one or more first linear bearings can be provided. When two or more first linear bearings 11 are provided, these first linear bearings 11 are aligned along the second direction y, that is, their respective bearing holes are aligned vertically, so as to ensure that the first shaft 71 of the drive assembly 7 passes through each first linear bearing 11 along the lifting direction y0.

[0082] During the process of the first shaft 71 of the drive assembly 7 driving the upper cover 2 to move up and down, the fixed first linear bearing 11 can only allow the first shaft 71 to move up and down along the lifting direction y0, without deviating to the left or right, which helps to limit the rotation of the upper cover 2.

[0083] In one example of this application, the first guide component 5 and the second guide component 6 may be at different heights relative to the upper surface of the upper cover 2; that is, they have a height difference relative to the upper cover 2 along the second direction y. Figure 3 As shown in the example, the first guide component 5 is fixed to the outer cover 9 to be relatively fixed to the upper cover 2, and the second guide component 6 is directly fixed to the upper surface of the upper cover 2. At this time, the first guide component 5 is higher than the second guide component 6 relative to the upper cover 2. For any position of the upper cover 2, the line connecting the first guide component 5 and the second guide component 6 will form a triangle. Based on the high structural stability of the triangle, the first guide component 5 and the second guide component 6 are less likely to deviate from the guide component 4 except along the lifting direction y0, which helps to limit the rotation of the upper cover 2.

[0084] The structures of the first guide component 5 and the second guide component 6 may be the same or different. This description will focus on the case where both have the same structure, using the first guide component 5 as an example. Figure 12 and Figure 13 As shown, the first guide assembly 5 includes a base 50, a guide component 51, a mounting component 52, and an elastic component 53.

[0085] The base 50 includes a mounting portion 501 and a supporting portion 502, both of which can be plate-like or block-like structures. The mounting portion 501 is parallel to the xz plane, and the supporting portion 502 is parallel to the yz plane, meaning the mounting portion 501 and the supporting portion 502 are perpendicularly connected, making the base 50 L-shaped. The mounting portion 501 is fixed relative to the upper surface of the upper cover 2; for example, in... Figure 3 In one example, the mounting part 501 can be fixed to the outer cover 9 by screws, thus fixing it relative to the upper cover 2. In other examples, the mounting part 501 can be directly fixed to the upper surface of the upper cover 2 by screws. The supporting part 502 is arranged adjacent to the side of the guide member 4, that is, the supporting part 502 of the first guide assembly 5 is arranged adjacent to the first side 41 of the guide member 4, and the supporting part 502 of the second guide assembly 6 is arranged adjacent to the second side 42 of the guide member 4; the adjacent arrangement includes, but is not limited to, the two being parallel to each other and opposite to each other. The supporting part 502 is provided with a clearance area 503.

[0086] A guide component 51 is disposed within the clearance area 503 of the support portion 502. The guide component 51 includes a roller 511 and a roller shaft 512. The roller 511 can be a roller or a bearing. The roller shaft 512 passes through the roller 511. Along a direction perpendicular to the corresponding side of the guide component 4, two mounting members 52 pass through both ends of the roller shaft 512 and are fixed to the support portion 502, thereby mounting the roller shaft 512 and the roller 511 to the support portion 502. One side of the roller 511 passes through the clearance area 503 and abuts against the corresponding side of the guide component 4 in the support portion 502, while the other side passes through the support portion 502 and is located between the two mounting members 52. The mounting member 52 is provided with a limiting part. This limiting part can be a structural component that screws the mounting member 52 to fix it to the support portion 502. For example, in the scenario where the mounting member 52 is a screw or a pin, the limiting part can be the nut of the screw or the pin of the pin.

[0087] Two elastic elements 53 are respectively fitted onto the corresponding mounting elements 52, such as Figure 12 and Figure 13 As shown, each mounting component 52 can be rod-shaped, such as a screw. One end of the mounting component 52 is fixed to the bearing portion 502 of the base 50, and the other end is provided with a limiting portion and extends towards the outer cover 9 (i.e., in the opposite direction of the first direction x). The elastic element 53 is sleeved on the corresponding mounting component 52 and located between the limiting portion of the mounting component 52 and the roller 512. The elastic element 53 includes, but is not limited to, a rubber sleeve. Retaining rings 54 can be provided between the two sides of the roller 511 and the two elastic elements 53 to prevent the elastic elements 53 from being squeezed and deformed when the roller 511 rolls again. One end of each elastic element 53 abuts against the roller 512 of the guide component 51, and the other end abuts against the limiting portion of the mounting component 52, so as to provide a preset force to the roller 512 when the upper cover 2 moves up and down. The preset force is perpendicular to the side of the guide component 4, thereby ensuring that the roller 511 and the side of the guide component 4 are always in contact.

[0088] Taking the first guide assembly 5 as an example, when the first side 41 of the guide member 4 has a pit, the elastic member 53 is in an extended state. At this time, the preset force is a force towards the first side 41, and the roller 512 and the roller 511 are pushed towards the first side 41 of the guide member 4, thereby ensuring that the roller 511 is always in contact with the first side 41. When the first side 41 of the guide member 4 has a protrusion, the roller 511 and the roller 512 are subjected to a force away from the first side 41 by the protrusion. The roller 512 compresses the elastic member 53 so that the elastic member 53 is compressed. The compressed elastic member 53 needs to return to its original state due to deformation, so it will apply a preset force towards the first side 41 to the roller 512 and the roller 511, thereby ensuring that the roller 511 is always in contact with the first side 41. The working principle and process of the second guide assembly 6 can be referred to here.

[0089] As can be seen, this example can eliminate the effects of assembly errors between guide 4 and guide components, as well as unevenness on the corresponding side of guide 4, ensuring that each guide component always maintains contact with the corresponding side of guide 4 and effectively performs its function during the lifting and lowering of the upper cover 2.

[0090] In one example, the first side 41 and / or the second side 42 of the guide member 4 may be provided with a groove, the groove extending in a direction parallel to the lifting direction y0 of the upper cover 2. The rollers 511 of each guide component are disposed in the groove and move synchronously with the upper cover 2 along the groove. The groove can restrict the corresponding guide component to always move along the lifting direction y0 without deviating, which is beneficial for restricting the rotation of the upper cover 2.

[0091] Please see Figure 14 As shown, the semiconductor processing equipment may further include a second linear bearing 12 and a second shaft 13. The second linear bearing 12 is fixed to the cavity wall of the reaction chamber 1. One end of the second shaft 13 is connected to the lower surface of the upper cover 2, and the other end passes through the second linear bearing 12 along the lifting direction y0. Optionally, a guide cylinder 14 may be provided below the second linear bearing 12. The guide cylinder 14 extends along the lifting direction y0 and is vertically aligned with the bearing hole of the second linear bearing 12. The guide cylinder 14 may be fixed to the cavity wall of the reaction chamber 1 or to the support 8. The second shaft 13 passes through the second linear bearing 12 and then passes through the guide cylinder 14, and is limited by the guide cylinder 14 to move along the lifting direction y0. It should be understood that both the second linear bearing 12 and the second shaft 13 are located outside the effective reaction cavity of the reaction chamber 1.

[0092] During the process of the first shaft 71 of the drive assembly 7 driving the upper cover 2 to move up and down, the fixed second linear bearing 12 can only allow the second shaft 13 to move up and down along the lifting direction y0, without deviating to the left or right. The second linear bearing 12 and the second shaft 13 cooperate with the aforementioned first guide assembly 5 and second guide assembly 6 to further restrict the rotation of the upper cover 2.

[0093] Along the line of sight perpendicular to the top cover 2, i.e., when viewing the top cover 2 from above, the second axis 13, the first guide component 5, and the second guide component 6 are interconnected in a triangular arrangement. Because the triangle structure has high stability, the first guide component 5 and the second guide component 6 are less likely to deviate from the guide member 4 except along the lifting direction y0, which helps to limit the rotation of the top cover 2.

[0094] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. For those skilled in the art, any equivalent structural transformations made using the content of this specification and drawings are similarly included within the patent protection scope of this application.

[0095] Although this document uses terms such as "first," "second," etc., to describe various types of information, this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. Furthermore, the singular forms "a," "an," and "the" are intended to also include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or meaning either one or any combination thereof. Exceptions to this definition only arise when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

Claims

1. A semiconductor processing apparatus, comprising a reaction chamber and a top cover, characterized in that, Also includes: A flange is provided on the upper cover; The guide member is fixed to the reaction chamber; The first guide component is fixed relative to the upper cover and abuts against the first side of the guide member; The second guide component is fixed relative to the upper cover and abuts against the second side of the guide member, wherein the second side is not coplanar with the first side. The drive assembly includes a power source and a first shaft. The power source drives the first shaft to drive the flange and, through the flange, drives the upper cover to move up and down. The upper cover drives the first guide assembly and the second guide assembly to move up and down synchronously on the first side and the second side, respectively. When the flange rises to the first target position, the upper cover exposes the opening of the reaction chamber, and when the flange falls to the second target position, the upper cover seals the opening of the reaction chamber.

2. The semiconductor processing equipment according to claim 1, characterized in that, When the flange is lowered to the second target position, the first shaft is positioned opposite the flange plate of the flange.

3. The semiconductor processing equipment according to claim 2, characterized in that, The flange is provided with a flange shaft, which is located on the side of the flange facing the reaction chamber; The first shaft is a hollow shaft; When the flange moves between the first target position and the second target position, the flange shaft always extends and is inserted into the first shaft.

4. The semiconductor processing equipment according to any one of claims 1-3, characterized in that, The flange is embedded in the upper cover. The flange includes a first flange side, a second flange side, a third flange side, and a fourth flange side connected end to end. The first flange side and the third flange side are arranged opposite each other and are both planar. The second flange side and the fourth flange side are arranged opposite each other and are both arc-shaped surfaces. The first flange side and the third flange side are both parallel to the second side of the guide member.

5. The semiconductor processing equipment according to claim 1, characterized in that, The semiconductor processing equipment further includes at least one first linear bearing, which is fixed to the cavity wall of the reaction chamber, and the first shaft passes through the first linear bearing in the lifting direction.

6. The semiconductor processing equipment according to claim 1, characterized in that, Either the first guide component or the second guide component includes: The base includes a mounting part and a supporting part. The mounting part is used to be fixed relative to the upper cover, and the supporting part is disposed adjacent to the side of the guide member. The guide component is provided with rollers and a roller shaft; The mounting component is used to mount the roller of the guide component to the bearing portion; An elastic element is sleeved outside the mounting component, and the elastic element abuts against the roller of the guide component to provide a preset force to the roller when the upper cover moves up and down. The preset force is perpendicular to the side of the guide component.

7. The semiconductor processing equipment according to claim 6, characterized in that, The guide member has a sliding groove on its first and / or second side, the sliding groove extending in a direction parallel to the lifting direction of the upper cover, and the roller is disposed in the sliding groove and moves up and down synchronously with the upper cover along the sliding groove.

8. The semiconductor processing equipment according to claim 1, 6, or 7, characterized in that, The semiconductor processing equipment also includes an outer cover, which is disposed on the upper cover, and the first guide component is fixed on the outer cover so that the first guide component is higher than the second guide component.

9. The semiconductor processing equipment according to claim 1, characterized in that, The semiconductor processing equipment further includes a second linear bearing and a second shaft. The second linear bearing is fixed to the cavity wall of the reaction chamber. One end of the second shaft is connected to the upper cover, and the other end passes through the second linear bearing along the lifting direction.

10. The semiconductor processing equipment according to claim 9, characterized in that, Along a line of sight perpendicular to the top cover, the second axis, the first guide component, and the orthographic projection of the second guide component are interconnected and arranged in a triangle.

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