Intelligent heat exchanger capable of achieving self-diagnosis, self-adjustment and self-cleaning

Abstract

The invention provides an intelligent heat exchanger capable of achieving self-diagnosis, self-adjustment and self-cleaning, relates to the technical field of heat exchangers, and solves the problems that a traditional heat exchanger cannot achieve self-treatment and causes the increase of the maintenance workloads The device comprises a heat exchanger body, detection equipment, adjustment equipment, cleaning equipment and an intelligent control module. And the intelligent control module is electrically connected with all the devices, so that the functions of data collection, regulation and control and self-cleaning are realized. Execution equipment such as an edge server, an algorithm, an instrument and a pump valve is combined with the heat exchanger, the health state of the heat exchanger is diagnosed in real time under different operation conditions, the operation conditions can be automatically adjusted, and the heat exchanger is always in a safe and stable operation condition; the degree of heat resistance increase caused by heat exchanger dirt can be monitored in real time, when the control boundary is reached, the chemical cleaning agent can be used for automatically controlling dirt removal, and the heat resistance of the heat exchanger dirt is reduced to the initial cleaning state value.

Description

Technical Field

[0001] The present invention relates to the technical field of heat exchangers, and in particular to an intelligent heat exchanger capable of self-diagnosis, self-regulation and self-cleaning. Background Art

[0002] Heat exchangers are one of the key components of industrial production energy efficiency, which can realize the recovery and transfer of heat energy. However, poor operation and scaling problems will affect their performance, leading to increased production energy consumption and even failure, thus affecting the normal production. The reduced service life of heat exchanger equipment will also increase the maintenance workload and increase labor costs. Summary of the invention

[0003] To this end, the present invention provides an intelligent heat exchanger that can self-diagnose, self-regulate and self-clean, which is used to solve the problems that traditional heat exchangers cannot self-process and cause increased maintenance workload.

[0004] In order to achieve the above-mentioned object, the present invention provides the following technical solution: an intelligent heat exchanger capable of self-diagnosis, self-adjustment and self-cleaning, comprising a heat exchanger body, wherein a material inlet and a material outlet are respectively arranged on opposite sides of the heat exchanger body, and a cooling water outlet pipe and a cooling water inlet pipe are arranged at one end of the heat exchanger body;

[0005] Detection equipment, the detection equipment includes a material inlet thermometer, a material outlet thermometer, a water outlet thermometer, a water inlet thermometer, a water outlet pressure gauge, a water inlet pressure gauge, a cooling water flow meter and a probe;

[0006] A regulating device, the regulating device comprising a heat reflux pump, a heat reflux regulating valve, a water inlet regulating valve, a boosting electric valve and a water inlet boosting pump;

[0007] A cleaning device, wherein the cleaning device is connected to the cooling water inlet pipe;

[0008] An intelligent control module, the intelligent control module is electrically connected to the detection device, the adjustment device, and the cleaning device;

[0009] Wherein, a material inlet thermometer is provided at the material inlet, and a material outlet thermometer is provided at the material outlet; the outlet water thermometer and the outlet water pressure gauge are provided at the connection between the cooling water outlet pipe and the heat exchanger body, and the inlet water thermometer and the inlet water pressure gauge are provided at the connection between the cooling water inlet pipe and the heat exchanger body; the probe is also provided at the connection between the cooling water outlet pipe and the heat exchanger body; the cooling water flowmeter is provided at the cooling water inlet pipe;

[0010] The cooling water outlet pipe is provided with the heat reflux pump and the heat reflux regulating valve, and the cooling water inlet pipe is provided with the water inlet regulating valve, the water inlet boosting electric valve and the water inlet boosting valve;

[0011] The cleaning equipment is provided with a cleaning and dosing ejector, a cleaning agent electric valve, a dosing barrel and an ultrasonic level meter. The cleaning and dosing ejector is arranged in the cooling water inlet pipe, the cleaning and dosing ejector is connected to the dosing barrel pipeline, the ultrasonic level meter is arranged in the dosing barrel, and the cleaning agent electric valve is arranged in the pipeline between the cleaning and dosing ejector and the dosing barrel.

[0012] Preferably, the intelligent control module includes a business mainboard, an analog quantity acquisition module and an analog quantity output module. The business mainboard is provided with an MCU processor, a communication module, a power supply module, a storage module, a switch quantity acquisition module, a relay control module, an analog quantity acquisition module connector and an analog quantity output module connector; the analog quantity acquisition module is electrically connected to the analog quantity acquisition module connector, and the analog quantity output module is electrically connected to the analog quantity output module connector.

[0013] Preferably, the communication module is provided with a first RS485 communication module and a second RS485 communication module, the first RS485 communication module is connected to the MCU processor for upper communication, and the second RS485 communication module is used to collect the measurement values ​​of the cooling water flow meter, the ultrasonic level meter and the probe.

[0014] Preferably, the power supply module is provided with a mainboard power supply module, an MCU power supply module, an analog quantity acquisition power supply module and an analog quantity output power supply module, the MCU power supply module is electrically connected to the MCU processor, the analog quantity acquisition power supply module is electrically connected to the analog quantity acquisition module, and the analog quantity output module is electrically connected to the analog quantity output power supply module.

[0015] Preferably, the storage module is configured as an EEPROM storage module.

[0016] Preferably, the switch quantity acquisition module and the relay control module are electrically connected to the heat reflux pump, the boost electric valve, the water inlet boost pump and the detergent electric valve respectively; the switch quantity acquisition module can collect the switch status of the heat reflux pump, the boost electric valve, the water inlet boost pump and the detergent electric valve; and the relay control module can control the switch of the heat reflux pump, the boost electric valve, the water inlet boost pump and the detergent electric valve.

[0017] Preferably, the MCU processor can perform heat exchanger flow rate diagnosis, and the flow rate calculation formula is:

[0018]

[0019] Where, F is the flow rate, n is the number of heat exchange tubes in a single-pass heat exchange tube bundle, and s is the cross-sectional area of ​​the heat exchange tube;

[0020] When the flow rate is between 0.9-1.8m / s, it is diagnosed as a good state; when the flow rate is between 0.6-0.9m / s or 1.8-3.65m / s, it is diagnosed as an alarm state; when the flow rate is between 0.3-0.6m / s or >3.65m / s, it is diagnosed as a serious state; when the flow rate is less than 0.3m / s, it is diagnosed as an extreme state.

[0021] Preferably, the MCU processor can perform heat flux diagnosis of the heat exchanger, and the heat flux calculation formula is:

[0022]

[0023] Wherein, q is heat flux, Q is heat transfer amount, and S is heat transfer area;

[0024] The calculation formula of the heat transfer is:

[0025] Q=F*C*(T 出 -T 进 ) / 3.6

[0026] Wherein, F is the flow rate, C is the specific heat capacity of water, T 出 is the cooling water outlet temperature, T 进 is the cooling water inlet temperature;

[0027] When the heat flux is less than 6780 kcal / h / m 2 Diagnosed as good condition, when the heat flux is between 6780-20338kcal / h / m 2 Diagnosed as alarm state, when the heat flux is between 20338-33896kcal / h / m 2 Diagnosed as a severe condition, when the heat flux is greater than 33890kcal / h / m 2 Diagnosed as an extreme condition.

[0028] Preferably, the MCU processor can perform fouling thermal resistance diagnosis, and the calculation formula of fouling thermal resistance is:

[0029] Dirt thermal resistance = real-time thermal resistance value - initial thermal resistance value

[0030] Wherein, the calculation formula of the real-time thermal resistance value is:

[0031] R=1 / K

[0032] K is the conduction coefficient, and the calculation formula of the conduction coefficient is:

[0033] K=Q / AΔt

[0034] Among them, Q is the total heat, A is the heat exchange area, and Δt is the logarithmic mean temperature difference;

[0035] The calculation formula of total heat Q is:

[0036] Q=Cp*m*(T 冷出 -T 冷进 )

[0037] Cp is the heat capacity of water at constant pressure, 4187 J / kg·℃, m is the water flow rate*1000 / 3600, T 冷出 is the cooling water outlet temperature, T 冷进 is the cooling water inlet temperature;

[0038] The calculation method of heat exchange area A is:

[0039] A=n*π*D*d

[0040] n is the total number of heat exchangers in the heat exchanger bundle; tube diameter (diameter) D, tube length d in square meters;

[0041] Δt=

(T 热进 -T 冷出 )-(T 热出 -T 冷进 )

(T 热进 -T 冷出 ) / (T 热出 -T 冷进 )

[0042] T 热进 is the hot water inlet speed, T 热出 is the hot water outlet speed, T 冷进 is the cooling water inlet speed, T 冷出 is the cooling water outlet speed.

[0043] Preferably, the MCU processor can monitor the wall temperature, and diagnose it as a good state when the wall temperature is less than 48°C, diagnose it as a moderate state when the wall temperature is between 48-60°C, diagnose it as a severe state when the wall temperature is between 60-70°C, and diagnose it as an extreme state when the wall temperature is greater than 70°C.

[0044] This application adopts the above technical solution, which has at least the following beneficial effects:

[0045] By using edge servers, algorithms, instruments, pumps, valves and other execution devices in combination with heat exchangers, a new type of intelligent heat exchanger is created. It can diagnose the health status of the heat exchanger in real time under different operating conditions, and can autonomously adjust the operating conditions to ensure that the heat exchanger is always in a safe and stable operating condition. It can also monitor in real time the degree of increase in thermal resistance caused by heat exchanger fouling. When the control boundary is reached, chemical cleaning agents can be used to automatically control the removal of dirt, reducing the heat exchanger fouling thermal resistance to the initial clean state value.

[0046] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0048] Figure 1 It is a schematic diagram of the structure provided by an embodiment of the present invention;

[0049] Figure 2 It is a schematic diagram of the structure of a business mainboard provided by an embodiment of the present invention;

[0050] Figure 3 It is a schematic diagram of the structure of an analog quantity acquisition module provided by an embodiment of the present invention;

[0051] Figure 4 It is a schematic diagram of the structure of an analog output module provided by an embodiment of the present invention;

[0052] In the figure: 1. Material inlet thermometer; 2. Material outlet thermometer; 3. Water outlet pressure gauge; 4. Water outlet thermometer; 5. Water inlet pressure gauge; 6. Water inlet thermometer; 7. Heat reflux pump; 8. Heat reflux regulating valve; 9. Water inlet regulating valve; 10. Booster electric valve; 11. Water inlet booster pump; 12. Cleaning and dosing ejector; 13. Cooling water flow meter; 14. Cleaning agent electric valve; 15. Dosing barrel; 16. Ultrasonic level meter; 17. Probe; A. Business mainboard; B. Analog acquisition module; C. Analog output module; A1. Mainboard power supply module; A2, real-time clock module; A3, first RS485 communication module; A4, second RS485 communication module; A5, switch quantity acquisition module; A6, relay control module; A7, MCU power supply module; A8, EEPROM storage module; A9, MCU processor; A10, analog quantity acquisition power supply module; A11, analog quantity output power supply module; A12, first analog quantity acquisition module connector; A13, second analog quantity acquisition module connector; A14, analog quantity output module connector. DETAILED DESCRIPTION

[0053] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0054] The specific embodiment of the present invention provides a smart heat exchanger capable of self-diagnosis, self-regulation and self-cleaning. Figure 1 As shown, it mainly includes a heat exchanger body, detection equipment, adjustment equipment, cleaning equipment and an intelligent control module, wherein a material inlet and a material outlet are respectively arranged on opposite sides of the heat exchanger body, and a cooling water outlet pipe and a cooling water inlet pipe are arranged at one end of the heat exchanger body, wherein the cooling water outlet pipe and the cooling water inlet pipe are also provided with a return pipe.

[0055] Specifically, the detection equipment includes a material inlet thermometer 1, a material outlet thermometer 2, a water outlet thermometer 4, a water inlet thermometer 6, a water outlet pressure gauge 3, a water inlet pressure gauge 5, a cooling water flow meter 13 and a probe 17. The material inlet thermometer 1 is used to measure the material temperature at the process material inlet, the material outlet thermometer 2 is used to measure the material temperature at the process material outlet, the water outlet pressure gauge 3 is used to measure the pressure value of the circulating cooling water exchanged from the heat exchanger body, the water outlet thermometer 4 is used to measure the temperature of the circulating cooling water exchanged from the heat exchanger body, the water inlet pressure gauge 5 is used to measure the pressure value of the circulating cooling water when it enters the heat exchanger body, and the water inlet thermometer 6 is used to measure the temperature of the circulating cooling water when it enters the heat exchanger body.

[0056] Specifically, the regulating equipment includes a heat reflux pump 7, a heat reflux regulating valve 8, a water inlet regulating valve 9, a boosting electric valve 10 and a water inlet boosting pump 11; when the heat reflux pump 7 is turned on, the circulating cooling water exchanged at the heat exchanger body can be returned to the heat exchanger body through the heat reflux pump 7; when the heat reflux regulating valve 8 is turned on, the opening can be adjusted to determine the amount of reflux water exchanged by the heat exchanger body; when the water inlet regulating valve 9 is turned on, the opening can be adjusted to determine the cooling water inlet flow rate of the heat exchanger body; when the boosting electric valve 10 is turned on, the opening can be adjusted to determine the cooling water increment; when the water inlet boosting pump 11 is turned on, it can be determined to increase the flow rate of cooling water entering the heat exchanger body.

[0057] Specifically, the cleaning equipment includes a cleaning dosing ejector 12, a detergent electric valve 14, a dosing barrel 15 and an ultrasonic level meter 16; the cleaning dosing ejector 12 is arranged in a cooling water inlet pipe, and can spray detergent so that the detergent can enter the heat exchanger with the cooling water; the cleaning dosing ejector 12 and the dosing barrel 15 are connected by a pipeline, and the pipeline is provided with a detergent electric valve 14. When the detergent electric valve 14 is opened, the opening can be adjusted to determine the dosage of the detergent; the dosing barrel 15 is used to place the detergent; an ultrasonic level meter 16 is arranged in the dosing barrel 15, and the ultrasonic level meter 16 is used to monitor the usage of the detergent in the dosing barrel 15.

[0058] Specifically, a cooling water flow meter 13 is also provided in the cooling water inlet pipe, and a probe is provided at a position where the heat exchanger is prone to scaling. The probe can be heated and detects the temperature change amplitude by measuring the change in resistance, which is used for scaling thickness detection; the cooling water flow meter 13 is used to measure the flow of cooling water.

[0059] Specifically, a material inlet thermometer 1 is provided at the material inlet, and a material outlet thermometer 2 is provided at the material outlet; an outlet water thermometer 4 and an outlet water pressure gauge 3 are provided at the connection between the cooling water outlet pipe and the heat exchanger body, and an inlet water thermometer 6 and an inlet water pressure gauge 5 are provided at the connection between the cooling water inlet pipe and the heat exchanger body; a probe 17 is also provided at the connection between the cooling water outlet pipe and the heat exchanger body; a cooling water flowmeter 13 is provided at the cooling water inlet pipe;

[0060] The cooling water outlet pipe is provided with a heat reflux pump 7 and a heat reflux regulating valve 8, and the cooling water inlet pipe is provided with an inlet regulating valve 9, a boosting electric valve 10 and an inlet boosting valve 11;

[0061] The cleaning equipment is provided with a cleaning and dosing ejector 12, a cleaning agent electric valve 14, a dosing barrel 15 and an ultrasonic level meter 16. The cleaning and dosing ejector 12 is arranged in a cooling water inlet pipe, the cleaning and dosing ejector 12 is connected to the dosing barrel 15 by a pipeline, the ultrasonic level meter 16 is arranged in the dosing barrel 15, and the cleaning agent electric valve 14 is arranged in the pipeline between the cleaning and dosing ejector 12 and the dosing barrel 15.

[0062] Specifically, the intelligent control module includes a business mainboard A, an analog quantity acquisition module B and an analog quantity acquisition module C, wherein the business mainboard A is provided with an MCU processor A9, a real-time clock module A2, a communication module, a power supply module, a storage module, a switch quantity acquisition module A5, a relay control module A6, an analog quantity acquisition module connector and an analog quantity output module connector A14; the analog quantity output module C is electrically connected to the analog quantity output module connector A14; wherein the analog quantity acquisition module connector includes a first analog quantity acquisition module connector A12 and a second analog quantity acquisition module connector A13, the analog quantity acquisition module B is electrically connected to the first analog quantity acquisition module connector A12 and the second analog quantity acquisition module connector A13 respectively, the analog quantity acquisition module B adopts a four-channel 4-20mA analog quantity acquisition circuit, and the analog quantity output module C adopts a four-channel 4-20mA analog quantity output circuit.

[0063] Specifically, the first analog quantity acquisition module connector A12 can collect temperature data of the material inlet thermometer 1, the material outlet thermometer 2, the water outlet thermometer 4 and the water inlet thermometer 6; the second analog quantity acquisition module connector A13 can collect the pressure values ​​of the water outlet pressure gauge 3 and the water inlet pressure gauge 5, and at the same time can collect the feedback signals of the heat reflux regulating valve 8 and the water inlet regulating valve 9; the analog quantity output module connector can control the heat reflux regulating valve 8 and the water inlet regulating valve 9.

[0064] Specifically, the MCU processor A9 can handle the execution of programs such as communication, data collection, equipment control, logic deduction and algorithm calculation; the real-time clock module A2 can provide real-time and accurate time; the switch quantity acquisition module A5 is provided with four switch quantity information acquisition channels for collecting the operating status of the heat reflux pump, the operating status of the water inlet booster pump, the status of the booster electric valve and the operating status of the detergent electric valve; the relay control module A6 is provided with four relay control channels for controlling the opening amount of the heat reflux pump 7, the opening amount of the booster electric valve 10, the opening amount of the water inlet booster pump 11 and the opening amount of the detergent electric valve 14.

[0065] Specifically, the communication module is provided with a first RS485 communication module A3 and a second RS485 communication module A4, the first RS485 communication module A3 is connected to the MCU processor A9 for upper communication, and the second RS485 communication module A4 is used to collect the measured values ​​of the cooling water flow meter, the ultrasonic level meter and the probe;

[0066] The power supply module is provided with a mainboard power supply module A1, an MCU power supply module A7, an analog quantity acquisition power supply module A10 and an analog quantity output power supply module A11. The MCU power supply module A7 is electrically connected to the MCU processor A9, the analog quantity acquisition power supply module A10 is electrically connected to the analog quantity acquisition module B, and the analog quantity output module C is electrically connected to the analog quantity output power supply module A11; the power supply module provides a stable voltage for each connection module.

[0067] The storage module is set to be an EEPROM storage module A8, which is used to store various control parameter configuration data and can ensure the normal operation of the system after power failure and restart.

[0068] The data or signals collected or output by each module of the business mainboard A are all real-time data of the real-time time provided by the real-time clock module.

[0069] Specifically, the MCU processor A9 can perform flow rate diagnosis, heat flux diagnosis, fouling thermal resistance diagnosis and wall temperature monitoring, and output processing signals according to the diagnosis results.

[0070] The flow rate calculation formula is:

[0071]

[0072] Where, F is the flow rate, n is the number of heat exchange tubes in a single-pass heat exchange tube bundle, and s is the cross-sectional area of ​​the heat exchange tube;

[0073] When the flow rate is between 0.9-1.8m / s, it is diagnosed as a good state; when the flow rate is between 0.6-0.9m / s or 1.8-3.65m / s, it is diagnosed as an alarm state; when the flow rate is between 0.3-0.6m / s or >3.65m / s, it is diagnosed as a serious state. In the serious state, if the flow rate is too low, the MCU processor A9 processes the information and issues an instruction to start the water inlet booster pump 11. If the flow rate is too high, an instruction to adjust the water inlet booster valve 9 is issued to reduce the flow rate. When the flow rate is less than 0.3m / s, it is diagnosed as an extreme state. In the extreme state, if the flow rate is too low, the MCU processor A9 processes the information and issues an instruction to start the water inlet booster pump 11.

[0074] The heat flux calculation formula is:

[0075]

[0076] Wherein, q is heat flux, Q is heat transfer amount, and S is heat transfer area;

[0077] The calculation formula of the heat transfer is:

[0078] Q=F*C*(T 出 -T 进 ) / 3.6

[0079] Wherein, F is the flow rate, C is the specific heat capacity of water, T 出 is the cooling water outlet temperature, T 进 is the cooling water inlet temperature;

[0080] When the heat flux is less than 6780 kcal / h / m 2 Diagnosed as good condition, when the heat flux is between 6780-20338kcal / h / m 2 Diagnosed as alarm state, when the heat flux is between 20338-33896kcal / h / m 2 The diagnosis is a serious state. In this state, the MCU processor A9 can issue an instruction to start the water inlet booster pump 11. When the heat flux is greater than 33890 kcal / h / m 2 The diagnosis is an extreme state, in which the MCU processor A9 can automatically issue an instruction to start the water inlet booster pump 11 to increase the flow rate.

[0081] The calculation formula of fouling thermal resistance is:

[0082] Dirt thermal resistance = real-time thermal resistance value - initial thermal resistance value

[0083] Wherein, the calculation formula of the real-time thermal resistance value is:

[0084] R=1 / K

[0085] K is the conduction coefficient, and the calculation formula of the conduction coefficient is:

[0086] K=Q / AΔt

[0087] Among them, Q is the total heat, A is the heat exchange area, and Δt is the logarithmic mean temperature difference;

[0088] The calculation formula of total heat Q is:

[0089] Q=Cp*m*(T 冷出 -T 冷进 )

[0090] Cp is the heat capacity of water at constant pressure, 4187 J / kg·℃, m is the water flow rate*1000 / 3600, T 冷出 is the cooling water outlet temperature, T 冷进 is the cooling water inlet temperature;

[0091] The calculation method of heat exchange area A is:

[0092] A=n*π*D*d

[0093] n is the total number of heat exchangers in the heat exchanger bundle; tube diameter (diameter) D, tube length d unit ㎡; Δt = [(T 热进 -T 冷出)-(T 热出 -T 冷进 )】 / ln

(T 热进 -T 冷出 ) / (T 热出 -T 冷进 )

[0094] T 热进 is the hot water inlet speed, T 热出 is the hot water outlet speed, T 冷进 is the cooling water inlet speed, T 冷出 is the cooling water outlet speed.

[0095] When the heat resistance of dirt increases by more than 10-20%, the MCU processor A9 issues a command to start the cleaning agent electric valve 14 for automatic cleaning of the dirt in the heat exchanger.

[0096] Process side wall temperature

[0097]

[0098] Cooling water wall temperature measurement

[0099]

[0100] Where: r s,1 、r s,2 : Measure the fouling thermal resistance on the process side and cooling side respectively;

[0101] q: heat flux.

[0102] T1 and T2: 1 and 2 in the figure, process material feed and discharge temperatures

[0103] t1 and t2: 4 and 6 in the figure, cooling water inlet and outlet temperatures

[0104] Using an iterative algorithm:

[0105] 1. Assume that the wall temperature on one side (e.g. t w, 1 ),

[0106] 2. Calculate the heat transfer coefficient (α1) on this side.

[0107] 3. Calculate the heat transfer per unit area on this side (q1) by the following formula:

[0108] q1=α1(t1-t w1 );

[0109] 4. Calculate the wall temperature on the other side (t w, 2 ),

[0110]

[0111] 5. Calculate the heat transfer coefficient α2 on the other side;

[0112] 6. Calculate the heat transfer per unit area on the other side (q2), that is

[0113] q2=α2(t w2 -t2).

[0114] If the assumed wall temperature is correct, q1 = q2. Therefore, when q1 ≠ q2, the wall temperature should be re-assumed until they are equal.

[0115] When the wall temperature is less than 48°C, it is diagnosed as a good state; when the wall temperature is between 48-60°C, it is diagnosed as a moderate state; when the wall temperature is between 60-70°C, it is diagnosed as a severe state. At this time, the MCU processor A9 issues an instruction to start the water inlet booster pump 11 to increase the flow rate; when the wall temperature is greater than 70°C, it is diagnosed as an extreme state. At this time, the MCU processor A9 automatically issues an instruction to start the water inlet booster pump 11 to increase the cooling water flow rate.

[0116] The embodiment of the present invention is to use edge servers, algorithms, instruments, pumps and valves and other execution devices in combination with heat exchangers to manufacture a new type of intelligent heat exchanger, which can realize real-time diagnosis of the health status of the heat exchanger under different operating conditions, and can autonomously adjust the operating conditions to ensure that the heat exchanger is always in a safe and stable operating condition; and can monitor in real time the degree of increase in thermal resistance caused by heat exchanger fouling. When the control boundary is reached, chemical cleaning agents can be used to automatically control the removal of dirt, so that the heat exchanger fouling thermal resistance is reduced to the initial cleaning state value.

[0117] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An intelligent heat exchanger capable of self-diagnosis, self-adjustment and self-cleaning, characterized in that: include: A heat exchanger body, wherein a material inlet and a material outlet are respectively arranged on opposite sides of the heat exchanger body, and a cooling water outlet pipe and a cooling water inlet pipe are arranged at one end of the heat exchanger body; Detection equipment, the detection equipment includes a material inlet thermometer, a material outlet thermometer, a water outlet thermometer, a water inlet thermometer, a water outlet pressure gauge, a water inlet pressure gauge, a cooling water flow meter and a probe; A regulating device, the regulating device comprising a heat reflux pump, a heat reflux regulating valve, a water inlet regulating valve, a boosting electric valve and a water inlet boosting pump; A cleaning device, wherein the cleaning device is connected to the cooling water inlet pipe; An intelligent control module, the intelligent control module is electrically connected to the detection device, the adjustment device, and the cleaning device; Wherein, a material inlet thermometer is provided at the material inlet, and a material outlet thermometer is provided at the material outlet; the outlet water thermometer and the outlet water pressure gauge are provided at the connection between the cooling water outlet pipe and the heat exchanger body, and the inlet water thermometer and the inlet water pressure gauge are provided at the connection between the cooling water inlet pipe and the heat exchanger body; the probe is also provided at the connection between the cooling water outlet pipe and the heat exchanger body; the cooling water flowmeter is provided at the cooling water inlet pipe; The cooling water outlet pipe is provided with the heat reflux pump and the heat reflux regulating valve, and the cooling water inlet pipe is provided with the water inlet regulating valve, the boosting electric valve and the water inlet boosting valve; The cleaning equipment is provided with a cleaning and dosing ejector, a cleaning agent electric valve, a dosing barrel and an ultrasonic level meter. The cleaning and dosing ejector is arranged in the cooling water inlet pipe, the cleaning and dosing ejector is connected to the dosing barrel pipeline, the ultrasonic level meter is arranged in the dosing barrel, and the cleaning agent electric valve is arranged in the pipeline between the cleaning and dosing ejector and the dosing barrel.

2. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 1, characterized in that: The intelligent control module includes a business mainboard, an analog quantity acquisition module and an analog quantity output module. The business mainboard is provided with an MCU processor, a real-time clock module, a communication module, a power supply module, a storage module, a switch quantity acquisition module, a relay control module, an analog quantity acquisition module connector and an analog quantity output module connector; the analog quantity acquisition module is electrically connected to the analog quantity acquisition module connector, and the analog quantity output module is electrically connected to the analog quantity output module connector.

3. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The communication module is provided with a first RS485 communication module and a second RS485 communication module. The first RS485 communication module is connected to the MCU processor for upper communication, and the second RS485 communication module is used to collect the measurement values ​​of the cooling water flow meter, the ultrasonic level meter and the probe.

4. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The power supply module is provided with a mainboard power supply module, an MCU power supply module, an analog quantity acquisition power supply module and an analog quantity output power supply module. The MCU power supply module is electrically connected to the MCU processor, the analog quantity acquisition power supply module is electrically connected to the analog quantity acquisition module, and the analog quantity output module is electrically connected to the analog quantity output power supply module.

5. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The storage module is configured as an EEPROM storage module.

6. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The switch quantity acquisition module and the relay control module are electrically connected to the heat reflux pump, the boost electric valve, the water inlet boost pump, and the detergent electric valve respectively. The switch quantity acquisition module can collect the switch status of the heat reflux pump, the boost electric valve, the water inlet boost pump, and the detergent electric valve, and the relay control module can control the switch of the heat reflux pump, the boost electric valve, the water inlet boost pump, and the detergent electric valve.

7. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The MCU processor can perform heat exchanger flow rate diagnosis, and the flow rate calculation formula is: Among them, F is the flow rate, n is the number of heat exchange tubes in a single-pass heat exchange tube bundle, and s is the cross-sectional area of ​​the heat exchange tube; When the flow rate is between 0.9-1.8m / s, the diagnosis is good. 0.6-0.9m / s or 1.8-3.65m / s is diagnosed as an alarm state. 0.3-0.6m / s or >3.65m / s is diagnosed as a severe condition, and when the flow rate is less than 0.3m / s it is diagnosed as an extreme condition.

8. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The MCU processor can perform heat flux diagnosis of the heat exchanger, and the heat flux calculation formula is: Wherein, q is heat flux, Q is heat transfer amount, and S is heat transfer area; The calculation formula of the heat transfer is: Q=F*C*(T 出 -T 进 ) / 3.6 Wherein, F is the flow rate, C is the specific heat capacity of water, T 出 is the cooling water outlet temperature, T 进 is the cooling water inlet temperature; When the heat flux is less than 6780 kcal / h / m 2 Diagnosed as good condition, when the heat flux is between 6780-20338kcal / h / m 2 Diagnosed as alarm state, when the heat flux is between 20338-33896kcal / h / m 2 Diagnosed as a severe condition, when the heat flux is greater than 33890kcal / h / m 2 Diagnosed as an extreme condition.

9. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The MCU processor can perform fouling thermal resistance diagnosis, and the calculation formula of fouling thermal resistance is: Dirt thermal resistance = real-time thermal resistance value - initial thermal resistance value Wherein, the calculation formula of the real-time thermal resistance value is: R=1 / K K is the conduction coefficient, and the calculation formula of the conduction coefficient is: K=Q / AΔt Among them, Q is the total heat, A is the heat exchange area, and Δt is the logarithmic mean temperature difference; The calculation formula of total heat Q is: Q=Cp*m*(T 冷出 -T 冷进 ) Cp is the heat capacity of water at constant pressure, 4187 J / kg·℃, m is the water flow rate*1000 / 3600, T 冷出 is the cooling water outlet temperature, T 冷进 is the cooling water inlet temperature; The calculation method of heat exchange area A is: A=n*π*D*d n is the total number of heat exchangers in the heat exchanger bundle; tube diameter (diameter) D, tube length d in square meters; Δt=【(T 热进 -T 冷出 )-(T 热出 -T 冷进 )】 / ln【(T 热进 -T 冷出 ) / (T 热出 -T 冷进 )】 T 热进 is the hot water inlet speed, T 热出 is the hot water outlet speed, T 冷进 is the cooling water inlet speed, T 冷出 is the cooling water outlet speed.

10. The self-diagnosing, self-adjusting and self-cleaning intelligent heat exchanger according to claim 2, characterized in that: The MCU processor can monitor the wall temperature, and diagnose it as a good state when the wall temperature is less than 48°C, diagnose it as a moderate state when the wall temperature is between 48-60°C, diagnose it as a severe state when the wall temperature is between 60-70°C, and diagnose it as an extreme state when the wall temperature is greater than 70°C.

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