Lamp panel detection method and device, storage medium and equipment

Abstract

The invention provides a lamp panel detection method and device, a storage medium and equipment, and the method comprises the steps: carrying out the transformation of furnace rear AOI equipment and lens AOI equipment, enabling the data of the two equipment to be communicated, calculating the coordinate value of a central point of a light-emitting chip when the furnace rear AOI equipment carries out the detection of a Mini LED lamp panel, and carrying out the calculation of the coordinate value of the central point of the light-emitting chip; and the lens AOI equipment acquires the coordinate value of the central point of the light-emitting chip from the furnace rear AOI equipment, automatically calculates the eccentric value between the light-emitting chip and the lens in combination with the coordinate value of the central point of the lens detected by the lens AOI equipment, and judges whether the corresponding light-emitting unit is qualified or not according to the calculated eccentric value. Therefore, automatic detection of the eccentric value between the light-emitting chip and the lens on the Mini LED lamp panel is realized, and subjective judgment errors in manual visual inspection are avoided, so that the shipment quality and the production efficiency are improved.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic testing technology, and in particular to a light board detection method, device, storage medium and equipment. Background Art

[0002] Mini LED backlight is a technology that uses tiny LED lamp beads as backlight sources. Compared with traditional LED backlight, Mini LED uses a backlight area composed of multiple smaller LED chips. By independently controlling the brightness of each LED chip, it achieves more sophisticated local dimming and high dynamic range display, which greatly improves the brightness and contrast of the display screen, providing better picture quality and higher color accuracy.

[0003] There are multiple light-emitting units on the Mini LED light board, and each light-emitting unit includes a light-emitting chip and a lens. In the production process of Mini LED light boards, there is a detection parameter, which is the linear offset between the center point of the light-emitting chip and the center point of the lens, also known as the eccentricity value. If the eccentricity value is too large, it will affect the light-emitting effect of the light board. In the related art, the method of detecting the eccentricity value is mainly manual visual inspection, which has a large error, resulting in poor delivery quality and affecting production efficiency. Summary of the invention

[0004] The purpose of the present application is to provide a light board detection method, device, storage medium and equipment, aiming to solve the problem that the error rate of the detection result of the method of detecting the eccentricity value between the light-emitting chip and the lens of the Mini LED light board in the related art is large, resulting in poor shipment quality and affecting production efficiency.

[0005] In the first aspect, a lamp board detection method provided in the present application is applied to a lens AOI device; the method comprises: obtaining the coordinate value of the center point of the light-emitting chip on the Mini LED lamp board from the post-furnace AOI device; obtaining the coordinate value of the center point of the lens attached to the Mini LED lamp board by detecting the MiniLED light board; calculating the eccentricity value between the light-emitting chip and the lens according to the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens, and judging whether the light-emitting unit corresponding to the light-emitting chip is qualified according to the eccentricity value.

[0006] In the above implementation process, the post-furnace AOI equipment and the lens AOI equipment are modified so that the data of the two devices are connected. In addition, when the post-furnace AOI equipment detects the Mini LED light board, it calculates the coordinate value of the center point of the light-emitting chip. The lens AOI equipment obtains the coordinate value of the center point of the light-emitting chip from the post-furnace AOI equipment, and combines the coordinate value of the center point of the lens detected by itself to calculate the eccentricity between the light-emitting chip and the lens. Then, according to the calculated eccentricity, it determines whether the corresponding light-emitting unit is qualified. In this way, the automatic detection of the eccentricity between the light-emitting chip and the lens on the Mini LED light board is realized, avoiding the subjective judgment error in manual visual inspection, thereby improving the delivery quality and production efficiency.

[0007] Furthermore, in some examples, a test point is provided on each side of the light-emitting chip; the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens are calculated with the midpoint of the line connecting the two test points of the light-emitting chip as the coordinate origin; the midpoint of the line is at the center point of the chip solder pin.

[0008] In the above implementation process, an equipment detection point is added on both sides of the light-emitting chip. The equipment detection point is used as the test point of the chip, and the midpoint of the line connecting the two test points is used as the coordinate origin, so that the post-furnace AOI equipment and the lens AOI equipment can accurately calculate the coordinates of the chip center point and the coordinates of the lens center point respectively.

[0009] Furthermore, in some examples, the detecting of the Mini LED light board to obtain the coordinate value of the center point of the lens attached to the Mini LED light board includes: performing image acquisition on the Mini LED light board; identifying the position of the test point and the position of the center point of the lens attached to the Mini LED light board in the acquired image; determining the coordinate origin according to the position of the test point, and converting the position of the center point of the lens into a coordinate value relative to the coordinate origin.

[0010] In the above implementation process, a specific method for the lens AOI device to calculate the center coordinates of the lens is provided.

[0011] Further, in some examples, the calculating the eccentricity between the light-emitting chip and the lens based on the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens includes: calculating the lateral offset distance and the longitudinal offset distance between the center point of the light-emitting chip and the center point of the lens based on the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens; calculating the eccentricity between the light-emitting chip and the lens based on the lateral offset distance and the longitudinal offset distance.

[0012] In the above implementation process, when calculating the eccentricity between the light-emitting chip and the lens, the absolute offset distance between the actual chip center and the actual lens center in the X direction and the Y direction is first calculated based on the chip center coordinates and the lens center coordinates, and then the eccentricity is calculated based on this. In this way, the eccentricity between the chip and the lens is quickly calculated.

[0013] Further, in some examples, judging whether the light-emitting unit corresponding to the light-emitting chip is qualified based on the eccentricity value includes: if the eccentricity value is less than or equal to the target setting value, judging that the light-emitting unit corresponding to the light-emitting chip is qualified; if the eccentricity value is greater than the target setting value, judging that the light-emitting unit corresponding to the light-emitting chip is unqualified.

[0014] In the above implementation process, the calculated eccentricity value is compared with the target setting value. When the eccentricity value between the light-emitting chip and the lens is less than or equal to the target setting value, the light-emitting unit composed of the light-emitting chip and the lens is judged to be qualified, otherwise it is judged to be unqualified, thereby improving the shipment quality of the Mini LED light board.

[0015] Further, in some examples, the target setting value is 0.1 mm.

[0016] In the above implementation process, the qualification standard of the light-emitting unit includes that the eccentricity between the light-emitting chip and the lens is less than or equal to 0.1 mm, so as to ensure the light-emitting effect of the corresponding light-emitting unit, thereby effectively improving the shipment quality of the Mini LED light board.

[0017] Furthermore, in some examples, it also includes: generating and outputting a test report; and recording the eccentricity value corresponding to each light-emitting unit on the Mini LED lamp board in the test report.

[0018] In the above implementation process, after determining whether each light-emitting unit is qualified, the lens AOI equipment can generate a test report and display it to the tester, so that the tester can clearly grasp the quality of the currently produced Mini LED light boards.

[0019] In the second aspect, a light board detection device provided in the present application is applied to a lens AOI device; the device includes: an acquisition module, used to obtain the coordinate value of the center point of the light-emitting chip on the Mini LED light board from the post-furnace AOI device; a detection module, used to obtain the coordinate value of the center point of the lens attached to the Mini LED light board by detecting the Mini LED light board; a calculation module, used to calculate the eccentricity value between the light-emitting chip and the lens according to the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens, and judge whether the light-emitting unit corresponding to the light-emitting chip is qualified according to the eccentricity value.

[0020] In a third aspect, the present application provides an electronic device, comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method described in any one of the first aspects when executing the computer program.

[0021] In a fourth aspect, the present application provides a computer-readable storage medium, on which instructions are stored. When the instructions are executed on a computer, the computer executes the method as described in any one of the first aspects.

[0022] In a fifth aspect, the present application provides a computer program product, which, when running on a computer, enables the computer to execute the method as described in any one of the first aspects.

[0023] Other features and advantages disclosed in the present application will be described in the following description, or some features and advantages can be inferred or determined without doubt from the description, or can be learned by implementing the above-mentioned technology disclosed in the present application.

[0024] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A flow chart of a light board detection method provided in an embodiment of the present application;

[0027] Figure 2 A schematic diagram of a Mini LED light board provided in an embodiment of the present application;

[0028] Figure 3 A partial enlarged view of a Mini LED light board provided in an embodiment of the present application;

[0029] Figure 4 A schematic diagram of a calculation process of the eccentricity value between the light-emitting chip and the lens provided in an embodiment of the present application;

[0030] Figure 5 A block diagram of a light board detection device provided in an embodiment of the present application;

[0031] Figure 6 A structural block diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0033] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0034] As described in the background technology, the related art method of detecting the eccentricity between the light-emitting chip and the lens of the Mini LED light board has a large error rate in the detection result, resulting in poor shipping quality and affecting production efficiency. Based on this, the embodiment of the present application provides a light board detection solution to solve the above problem.

[0035] Next, the embodiments of the present application are introduced:

[0036] like Figure 1 As shown, Figure 1 It is a flow chart of a lamp board detection method provided in an embodiment of the present application. The method can be applied to lens AOI (Automated Optical Inspection) equipment. The current SMT process flow of Mini LED lamp boards is generally: incoming material detection-voltage test-board loading-cleaning-inking-printing-SPI-solidification-chip mounting-reflow soldering-cooling cache-normal temperature lighting-post-furnace AOI-plasma cleaning-glue dispensing-glue AOI-lens mounting-curing-cooling cache-lens AOI-luminescence detection-aging-panel detection-OQC-packaging and warehousing. The lens AOI equipment is a device used for the lens AOI step. By capturing images and performing high-precision analysis, it can accurately identify various defects of lamp boards with lenses attached.

[0037] The method comprises:

[0038] Step 101, obtaining the coordinate value of the center point of the light-emitting chip on the Mini LED lamp board from the AOI equipment after the furnace;

[0039] The post-furnace AOI equipment mentioned in this step may refer to the AOI equipment located after reflow soldering in the production process of the Mini LED light board, and its main function is to detect quality defects after soldering. In this embodiment, the post-furnace AOI equipment and the lens AOI equipment are modified so that the data of the two devices are connected and the eccentricity between the chip and the lens is calculated automatically. Specifically, when the post-furnace AOI equipment detects the Mini LED light board, it will calculate the coordinate value of the center point of the light-emitting chip with a solid crystal, and the lens AOI equipment obtains the coordinate value through data communication.

[0040] The coordinate value of the center point of the light-emitting chip can be calculated by taking the vertex at the corner of the light board as the coordinate origin. In order to improve the detection accuracy, in some embodiments, a test point is set on each side of the light-emitting chip mentioned in this step; the coordinate value of the center point of the light-emitting chip is calculated by taking the midpoint of the line connecting the two test points of the light-emitting chip as the coordinate origin; the midpoint of the line is at the center point of the chip solder pin. In other words, when designing the product, a device detection point can be added on both sides of each light-emitting chip on the PCB board of the Mini LED light board. The device detection point serves as the test point of the chip, and the midpoint of the line connecting the two test points falls on the center point of the chip solder pin. In this way, when the post-furnace AOI equipment detects a certain light-emitting chip, it can use the midpoint of the line connecting the test points on both sides of the light-emitting chip as the coordinate origin, and then calculate the relative coordinate value of the center point of the actual solid-crystal chip relative to the coordinate origin. In this way, the automatic detection of the coordinate value of the center point of the light-emitting chip is realized, and the accuracy of the detection is improved. The specific process of calculating the coordinate value of the center point of the light-emitting chip by the post-furnace AOI equipment can refer to the implementation process of calculating the coordinate value of the center point of the lens by the subsequent lens AOI equipment.

[0041] Step 102: Detect the Mini LED light board to obtain the coordinate value of the center point of the lens attached to the Mini LED light board;

[0042] This step means that when the lens AOI equipment detects the Mini LED light board, in addition to the original detection content, it will also calculate the coordinate value of the center point of the lens attached to the Mini LED light board according to the set program to detect the eccentricity between the light-emitting chip and the lens. Correspondingly, the coordinate value of the center point of the lens can also be calculated with the midpoint of the line connecting the two test points of the light-emitting chip as the coordinate origin.

[0043] In some embodiments, this step may include: performing image acquisition on the Mini LED light board; identifying the position of the test point and the position of the center point of the lens attached to the Mini LED light board on the acquired image; determining the coordinate origin according to the position of the test point, and converting the position of the center point of the lens into a coordinate value relative to the coordinate origin. That is to say, during detection, the lens AOI device can perform image acquisition on the Mini LED light board through an imaging photosensitive element, such as CCD (Charge Coupled Device), CMOS (Complementary Metal Oxide Semiconductor), etc., and the AOI area covers the entire light board. Then, through the image processing algorithm, the position of the test point and the lens in the image is identified, and for each light-emitting chip, the position of the connecting midpoint of the two test points on both sides is determined as the coordinate origin, and the position of the center point of the lens is converted into a coordinate value compared to the coordinate origin, wherein, during the coordinate conversion, the coordinate value of the center point of the lens in the physical coordinate system can be calculated by applying mathematical transformation according to the calibration parameters of the lens AOI device and the conversion relationship between the image coordinate system and the physical coordinate system, and the unit can be millimeters. In this way, the automatic detection of the coordinate value of the center point of the lens is achieved.

[0044] Step 103: Calculate the eccentricity between the light emitting chip and the lens according to the coordinate values ​​of the center points of the light emitting chip and the lens, and determine whether the light emitting unit corresponding to the light emitting chip is qualified according to the eccentricity.

[0045] In this embodiment, the lens AOI equipment calculates the eccentricity between the light-emitting chip and the lens according to the coordinate values ​​of the chip center and the lens center, and then determines whether the corresponding light-emitting unit is qualified according to the calculated eccentricity value, thereby realizing automatic detection of the eccentricity between the chip and the lens on the Mini LED lamp board and reducing labor costs.

[0046] In some embodiments, the calculation of the eccentricity between the light-emitting chip and the lens according to the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens mentioned in this step may include: calculating the lateral offset distance and the longitudinal offset distance between the center point of the light-emitting chip and the center point of the lens according to the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens; calculating the eccentricity between the light-emitting chip and the lens according to the lateral offset distance and the longitudinal offset distance. That is, when calculating the eccentricity value D, the absolute offset distance between the actual chip center and the actual lens center in the X direction and the Y direction, that is, the lateral offset distance D, can be calculated according to the coordinate value (X1, Y1) of the center point of the light-emitting chip and the coordinate value (X2, Y2) of the center point of the lens. X =X2-X1 and longitudinal offset distance D Y =Y2-Y1, and then calculate the eccentricity between the light-emitting chip and the lens In this way, the eccentricity value between the chip and the lens can be quickly calculated.

[0047] The Mini LED lamp board can include multiple light-emitting units, one light-emitting unit corresponds to a light-emitting chip and a lens. During implementation, each light-emitting unit can be numbered in advance, and the lens AOI equipment obtains the coordinate values ​​of the center points of all lenses, and obtains the coordinate values ​​of the center points of all light-emitting chips from the post-furnace AOI equipment through data communication. Then, the eccentricity value between each light-emitting chip and the corresponding lens is calculated according to the number.

[0048] In some embodiments, judging whether the light-emitting unit corresponding to the light-emitting chip is qualified according to the eccentricity value mentioned in this step may include: if the eccentricity value is less than or equal to the target setting value, judging that the light-emitting unit corresponding to the light-emitting chip is qualified; if the eccentricity value is greater than the target setting value, judging that the light-emitting unit corresponding to the light-emitting chip is unqualified. That is to say, the calculated eccentricity value is compared with the target setting value. When the eccentricity value between the light-emitting chip and the lens is less than or equal to the target setting value, the light-emitting unit composed of the light-emitting chip and the lens is qualified, otherwise it is judged to be unqualified. Optionally, the target setting value can be 0.1 mm, so as to improve the delivery quality of the Mini LED light board. Of course, in other embodiments, this target setting value can also be set differently according to the needs of the specific scene.

[0049] In addition, in some embodiments, it also includes: generating and outputting a test report; the test report records the eccentricity value corresponding to each light-emitting unit on the Mini LED lamp board. That is to say, after determining whether each light-emitting unit is qualified, the lens AOI device can generate a test report, and the test report records the eccentricity value corresponding to each light-emitting unit on the lamp board. The lens AOI device can display the test report to the tester through a display screen or the like, so that the tester can clearly understand the quality of the currently produced Mini LED lamp boards.

[0050] In the embodiment of the present application, the post-furnace AOI equipment and the lens AOI equipment are modified so that the data of the two equipments are interconnected, and the post-furnace AOI equipment calculates the coordinate value of the center point of the light-emitting chip when detecting the Mini LED light board, and the lens AOI equipment obtains the coordinate value of the center point of the light-emitting chip from the post-furnace AOI equipment, and calculates the eccentricity between the light-emitting chip and the lens by itself in combination with the coordinate value of the center point of the lens detected by itself, and then determines whether the corresponding light-emitting unit is qualified based on the calculated eccentricity. In this way, the automatic detection of the eccentricity between the light-emitting chip and the lens on the Mini LED light board is realized, avoiding the subjective judgment error in manual visual inspection, thereby improving the delivery quality and production efficiency.

[0051] In order to explain the solution of this application in more detail, a specific embodiment is introduced below:

[0052] This embodiment provides an automatic test solution for the eccentricity of the lens of a Mini LED light board. In this embodiment, the structure of the Mini LED light board is as follows: Figure 2 As shown, it includes a PCB board 21, a light-emitting unit 22 and a CNT connector 23; when the MiniLED lamp board has a partitioning scheme, there will also be capacitors, resistors, control chips and other chip components on the lamp board. Figure 3 This is a partial enlarged picture of the MiniLED light board. Figure 3 As shown, each light-emitting unit 22 includes a light-emitting chip 221 and a lens 222, and, in product design, a test point 223 is set on both sides of each light-emitting chip 221 on the PCB board 21. The test point 223 is a circular detection point, which is convenient for equipment to grasp the point detection. The midpoint of the line connecting the centers of the two test points 223 falls on the center point of the chip solder foot, and the distance from the center of the two test points 223 to the center point of the chip solder foot is equal.

[0053] The solution also transforms the post-furnace AOI equipment and lens AOI equipment, including:

[0054] When the post-furnace AOI equipment is testing, the midpoint of the line connecting the two test points is used as the coordinate origin (0,0), and the coordinate value (X1, Y1) of the center point of the chip with actual die bonding is calculated;

[0055] When testing, the lens AOI equipment uses the midpoint of the line connecting the two test points as the coordinate origin (0,0) to calculate the coordinate value (X2, Y2) of the center point of the lens that has actually been attached. At the same time, the lens AOI equipment obtains the coordinate value (X1, Y1) of the center point of the chip from the AOI equipment after the furnace through data communication.

[0056] The lens AOI equipment automatically calculates the eccentricity value D between the light-emitting chip and the lens. Figure 4 Schematic diagram of the calculation process of the eccentricity between the light-emitting chip and the lens, wherein the midpoint 41 of the line connecting the two test points 223 of the light-emitting chip 221 is used as the coordinate origin (0,0), and the lens AOI device uses the coordinate value (X1, Y1) of the chip center 42 and the coordinate value (X2, Y2) of the lens center 43 to obtain the absolute offset distance (X3, Y3) of the chip center 42 and the lens center 43 in the X direction and the Y direction according to the algorithm, and then calculates the eccentricity D between the light-emitting chip and the lens. Finally, the lens AOI device compares the calculated eccentricity value with the set range value. When the eccentricity value is within the set range value, the corresponding light-emitting unit is determined to be qualified, otherwise the corresponding light-emitting unit is determined to be unqualified.

[0057] Through the solution of this embodiment, it is possible to realize automatic detection of equipment, reduce labor costs, and improve production efficiency and product quality.

[0058] Corresponding to the embodiments of the aforementioned method, the present application also provides embodiments of a light board detection device and a terminal using the same:

[0059] like Figure 5 As shown, Figure 5 : is a block diagram of a light board detection device provided in an embodiment of the present application, the device is applied to a lens AOI device; the device includes:

[0060] An acquisition module 51 is used to acquire the coordinate value of the center point of the light-emitting chip on the Mini LED lamp board from the post-furnace AOI equipment;

[0061] A detection module 52 is used to obtain the coordinate value of the center point of the lens attached to the Mini LED light board by detecting the Mini LED light board;

[0062] The calculation module 53 is used to calculate the eccentricity between the light emitting chip and the lens according to the coordinate value of the center point of the light emitting chip and the coordinate value of the center point of the lens, and judge whether the light emitting unit corresponding to the light emitting chip is qualified according to the eccentricity.

[0063] The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, which will not be repeated here.

[0064] This application also provides an electronic device, see Figure 6 , Figure 6 A block diagram of an electronic device provided in an embodiment of the present application. The electronic device may include a processor 610, a communication interface 620, a memory 630, and at least one communication bus 640. The communication bus 640 is used to realize direct connection and communication between these components. The communication interface 620 of the electronic device in the embodiment of the present application is used to communicate signaling or data with other node devices. The processor 610 may be an integrated circuit chip with signal processing capabilities.

[0065] The processor 610 mentioned above can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application can be implemented or executed. The general-purpose processor can be a microprocessor or the processor 610 can also be any conventional processor, etc.

[0066] The memory 630 may be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electric erasable programmable read-only memory (EEPROM), etc. The memory 630 stores computer-readable instructions. When the computer-readable instructions are executed by the processor 610, the electronic device can execute the above-mentioned Figure 1 The method embodiment involves various steps.

[0067] Optionally, the electronic device may further include a storage controller and an input / output unit.

[0068] The memory 630, storage controller, processor 610, peripheral interface, input and output unit components are directly or indirectly electrically connected to each other to achieve data transmission or interaction. For example, these components can be electrically connected to each other via one or more communication buses 640. The processor 610 is used to execute executable modules stored in the memory 630, such as software function modules or computer programs included in the electronic device.

[0069] The input and output unit is used to provide users with the task creation and to create a start optional time period or preset execution time for the task to realize the interaction between the user and the server. The input and output unit can be, but is not limited to, a mouse and a keyboard.

[0070] Understandably, Figure 6 The structure shown is for illustration only, and the electronic device may also include Figure 6 More or fewer components as shown, or with Figure 6 Different configurations are shown. Figure 6 Each component shown in the figure can be implemented by hardware, software or a combination thereof.

[0071] An embodiment of the present application further provides a storage medium having instructions stored thereon. When the instructions are run on a computer, the computer program is executed by a processor to implement the method described in the method embodiment. To avoid repetition, the method will not be described here.

[0072] The present application also provides a computer program product, which, when executed on a computer, enables the computer to execute the method described in the method embodiment.

[0073] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, a program segment or a part of a code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0074] In addition, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0075] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0076] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0077] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0078] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A light board detection method, characterized in that: Applied to lens AOI equipment; the method comprises: Obtain the coordinate value of the center point of the light-emitting chip on the Mini LED light board from the AOI equipment after the furnace; By detecting the Mini LED light board, the coordinate value of the center point of the lens attached to the Mini LED light board is obtained; The eccentricity between the light emitting chip and the lens is calculated according to the coordinate values ​​of the center points of the light emitting chip and the lens, and whether the light emitting unit corresponding to the light emitting chip is qualified is judged according to the eccentricity.

2. The method according to claim 1, characterized in that: A test point is set on each side of the light-emitting chip; the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens are calculated with the midpoint of the line connecting the two test points of the light-emitting chip as the coordinate origin; the midpoint of the line is at the center point of the chip solder pin.

3. The method according to claim 2, characterized in that The step of detecting the Mini LED light board to obtain the coordinate value of the center point of the lens attached to the Mini LED light board includes: Capturing an image of the Mini LED light board; Identify the position of the test point and the center point of the lens attached to the Mini LED light board on the acquired image; The coordinate origin is determined according to the position of the test point, and the position of the center point of the lens is converted into a coordinate value relative to the coordinate origin.

4. The method according to claim 3, characterized in that The calculating the eccentricity between the light emitting chip and the lens according to the coordinate value of the center point of the light emitting chip and the coordinate value of the center point of the lens comprises: Calculating a lateral offset distance and a longitudinal offset distance between the center point of the light emitting chip and the center point of the lens according to the coordinate values ​​of the center point of the light emitting chip and the coordinate values ​​of the center point of the lens; The eccentricity value between the light emitting chip and the lens is calculated according to the lateral offset distance and the longitudinal offset distance.

5. The method according to claim 1, characterized in that The step of judging whether the light-emitting unit corresponding to the light-emitting chip is qualified according to the eccentricity value includes: If the eccentricity value is less than or equal to the target setting value, the light-emitting unit corresponding to the light-emitting chip is determined to be qualified; If the eccentricity value is greater than the target setting value, it is determined that the light-emitting unit corresponding to the light-emitting chip is unqualified.

6. The method according to claim 1, characterized in that The target setting value is 0.1 mm.

7. The method according to claim 1, characterized in that Also includes: Generate and output a test report; the test report records the eccentricity value corresponding to each light-emitting unit on the Mini LED lamp board.

8. A light board detection device, characterized in that: Applicable to lens AOI equipment; the device comprises: An acquisition module is used to obtain the coordinate value of the center point of the light-emitting chip on the Mini LED lamp board from the AOI equipment after the furnace; A detection module, used for acquiring the coordinate value of the center point of the lens attached to the Mini LED light board by detecting the Mini LED light board; The calculation module is used to calculate the eccentricity between the light-emitting chip and the lens according to the coordinate value of the center point of the light-emitting chip and the coordinate value of the center point of the lens, and judge whether the light-emitting unit corresponding to the light-emitting chip is qualified according to the eccentricity.

9. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, the method according to any one of claims 1 to 7 is implemented.

10. An electronic device, characterized in that: The method comprises a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, the method according to any one of claims 1 to 7 is implemented.

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