Testing device for SMT patch production

Abstract

The invention belongs to the technical field of chip processing, and particularly relates to a testing device for SMT patch production, which comprises a base, one side of the upper end surface of the base is fixedly connected with a workbench, the workbench is also provided with a pressure detector, the pressure detector is also provided with an infrared sensor, and the infrared sensor is connected with the base. The infrared sensor can detect whether an object exists on the workbench or not, and a feeding assembly is arranged on one side of the base. According to the invention, the feeding assembly is utilized to realize sequential feeding of a plurality of chips, the process of manually taking the chips and placing the chips in a test area is omitted, the operation is convenient and labor-saving, meanwhile, the situation that the chips are not easy to clamp and feed due to the fact that the chips are accumulated in a container in a concentrated manner and clamping structures such as a manipulator is avoided, and the working efficiency is improved. And the efficiency of continuously testing a plurality of chips is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of chip processing, in particular to a testing device for SMT patch production. Background Art

[0002] During the SMT patch production process, the chip is often damaged due to excessive stress, and this damage is irreversible, resulting in losses. Therefore, in order to avoid losses, the chip needs to be stress tested to accurately define the maximum stress that the chip can withstand during SMT patch production.

[0003] The patent with announcement number CN211860985U discloses a chip maximum stress testing mechanism for SMT patches, including a processing table, a bottom substrate is provided on the top of the processing table, a rectangular pressing groove for placing the chip is provided on the top of the bottom substrate, an upper pressing plate that can move into the rectangular pressing groove on the bottom substrate is provided directly above the bottom substrate, a pressure detector is provided above the upper pressing plate, the pressure detector is fixedly connected to the top of the processing table through a fixed bracket, the output end of the pressure detector is set downward, a buffer guide extrusion mechanism is provided between the pressure detector and the upper pressing plate, the output end of the pressure detector is fixedly connected to the internal top end of the buffer guide extrusion mechanism, and the top of the upper pressing plate is fixedly connected to the internal lower end of the buffer guide extrusion mechanism. The device can accurately define the maximum stress that a chip or SOC can withstand in the SMT patch process production and perform tests to improve the processing quality.

[0004] However, the above technical solution still has the following deficiencies in practical application:

[0005] The chip is squeezed by a pressure detector, and the value displayed by the pressure detector when the chip is fractured is observed to determine the maximum stress that the chip can withstand during the SMT patch production process. However, usually, in order to improve the accuracy of the test results, multiple chips are tested in sequence. When workers manually place multiple chips in the test area in sequence, the labor intensity is high. When a clamping mechanism such as a manipulator is used to automatically place the chip in the test area, since multiple chips may be concentrated in a container, it is not easy for a clamping structure such as a manipulator to clamp the chips one by one, which affects the continuous progress of the chip testing work. Summary of the invention

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem raised in the background technology, the present invention proposes a testing device for SMT patch production.

[0007] The technical solution adopted by the present invention to solve the technical problem is: a test device for SMT patch production, comprising a base, a workbench is fixedly connected to one side of the upper end surface of the base, a pressure detector is also arranged on the workbench, an infrared sensor is also arranged on the pressure detector, and the infrared sensor detects whether there is an object on the workbench, and a feeding component is arranged on one side of the base;

[0008] The feeding assembly includes a slot plate 1 fixedly connected to both sides of the upper end surface of the base, the slot plate 1 is slidably connected to a frame, the frame is provided with a conveyor belt, one side of the frame is fixedly connected to a frame body, one side of the frame body is symmetrically distributed and slidably connected to two material gathering plates, and one side of the material gathering plate is plugged and slidably connected to a plug plate;

[0009] The base is also provided with a material moving assembly for moving the tested chip away from the workbench;

[0010] The material moving assembly includes a groove plate two fixedly connected to one side of the upper end surface of the base, a transverse plate slidably connected to the sliding groove of the groove plate two, a connecting ring fixedly connected to one end of the transverse plate, a plurality of sliding rods radially distributed and slidably connected to the connecting ring, a connecting column fixedly connected to one end of the sliding rod, a winding roller rotatably provided on one side of the inner cavity of the connecting column, a polymer cloth wound on the winding roller, the polymer cloth extending from the inner cavity of the connecting column, and an end portion of the polymer cloth is fixedly connected to the outer wall of the connecting column on the other side.

[0011] Preferably, threaded rods three are rotatably provided at both ends of the sliding groove of the slot plate on one side, the threaded rod three is threadedly connected to one side of the frame, a motor six is ​​fixedly connected to one side of the slot plate, and the output end of the motor six is ​​fixedly connected to one end of the threaded rod three.

[0012] Preferably, a cylinder is fixedly connected to one side of the upper end surface of the frame, and the piston end of the cylinder is fixedly connected to the upper end surface of the plug plate.

[0013] Preferably, bidirectional threaded rods are rotatably arranged on both sides of the upper end of the frame, both sides of the bidirectional threaded rods are threadedly connected to the gathering plate, one side of the upper end of the frame is fixedly connected to a motor five, and the output end of the motor five is fixedly connected to one end of the bidirectional threaded rod.

[0014] Preferably, a second connecting rod is rotatably provided at one end of the sliding rod, a first connecting rod is rotatably provided at one end of the second connecting rod, and one end of the first connecting rod is rotatably provided on a connecting ring.

[0015] Preferably, a gear ring is sleeved and rotatably mounted on the outer ring of the connecting ring, one end of the connecting rod is fixedly connected to a gear, the gear is rotatably mounted on the connecting ring, and the gear is meshed with a tooth block on the inner side of the gear ring.

[0016] Preferably, one side of the connecting ring is fixedly connected to the motor 2, and the output end of the motor 2 is fixedly connected to the gear.

[0017] Preferably, a motor three is fixedly connected to one side of the inner cavity of the connecting column, and an output end of the motor three is fixedly connected to one end of the roller.

[0018] Preferably, one end of the transverse plate is threadedly connected to a threaded rod 2, both ends of the threaded rod 2 are rotatably arranged on the slot plate 2, one side of the slot plate 2 is fixedly connected to a motor 4, and the output end of the motor 4 is fixedly connected to one end of the threaded rod 2.

[0019] Preferably, a sliding column is slidably connected to one side of the upper end surface of the base, and a telescopic plate is slidably connected to the inner side of the sliding column. The upper end of the telescopic plate is fixedly connected to a platform, the upper end surface of the platform is flush with the upper end surface of the workbench, an electric push rod is fixedly connected to one side of the inner cavity of the sliding column, and the piston end of the electric push rod is fixedly connected to the bottom of the telescopic plate, a threaded rod 1 is threadedly connected to the lower end of the platform, both ends of the threaded rod 1 are rotatably arranged on the base, a motor 1 is fixedly connected to one side of the upper end surface of the base, and the output end of the motor 1 is fixedly connected to one end of the threaded rod 1.

[0020] The beneficial effects of the present invention are as follows:

[0021] 1. The test device for SMT patch production described in the present invention utilizes a feeding assembly to realize sequential feeding of multiple chips, eliminating the process of manually taking the chips and placing them in the test area, which is more convenient and labor-saving. At the same time, it also avoids the situation where the chips are concentrated in a container and it is difficult for a clamping structure such as a robot to clamp and feed the chips, thereby improving the efficiency of continuous testing of multiple chips.

[0022] 2. The test device for SMT patch production described in the present invention utilizes a material transfer assembly to place multiple chips after testing on a platform in a compact and uniform state, thereby facilitating comparative analysis of the chips after fracturing, facilitating locating the root cause of the problem, and avoiding the situation in which, after the chips are fractured, the fragments are relatively scattered, making it difficult to pick up and observe the chips, thus affecting subsequent comparative analysis. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the three-dimensional structure at the workbench;

[0026] Figure 3 It is a schematic diagram of the three-dimensional structure at the connecting ring;

[0027] Figure 4 1 is a schematic diagram of the three-dimensional structure at the sliding rod;

[0028] Figure 5 yes Figure 4 A partial enlarged view of the middle part;

[0029] Figure 6 It is a schematic diagram of the three-dimensional structure at the conveyor belt;

[0030] Figure 7 It is a schematic diagram of the three-dimensional structure at the plug board;

[0031] Figure 8 It is a schematic diagram of the three-dimensional structure of the slot plate at two locations;

[0032] Fig. 9 It is a schematic diagram of the three-dimensional structure of the frame;

[0033] Fig.10 It is a schematic diagram of the three-dimensional structure at the platform.

[0034] In the figure: 1. base; 2. platform; 3. pressure detector; 4. conveyor belt; 5. frame; 6. material gathering plate; 7. frame; 8. workbench; 9. slot plate one; 10. slot plate two; 11. motor one; 12. threaded rod one; 13. transverse plate; 14. connecting ring; 15. gear ring; 16. material gathering cloth; 17. connecting column; 18. connecting rod one; 19. connecting rod two; 20. sliding rod; 21. motor two; 22. gear; 23. roller; 24. motor three; 25. motor four; 26. threaded rod two; 27. cylinder; 28. plug plate; 29. ​​motor five; 30. bidirectional threaded rod; 31. threaded rod three; 32. motor six; 33. infrared sensor; 34. sliding column; 35. telescopic plate; 36. electric push rod. DETAILED DESCRIPTION

[0035] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] Please refer to Figure 1-Figure 10 The present invention provides a technical solution: a testing device for SMT patch production, comprising a base 1, a workbench 8 is fixedly connected to one side of the upper end surface of the base 1, a pressure detector 3 is also provided on the workbench 8, an infrared sensor 33 is also provided on the pressure detector 3, the infrared sensor 33 detects whether there is an object on the workbench 8, and a feeding component is provided on one side of the base 1;

[0037] The feeding assembly includes a slot plate 9 fixedly connected to both sides of the upper end surface of the base 1, the slot of the slot plate 9 is slidably connected to a frame 5, the frame 5 is provided with a conveyor belt 4, one side of the frame 5 is fixedly connected to a frame body 7, one side of the frame body 7 is symmetrically distributed and slidably connected to two material gathering plates 6, and one side of the material gathering plate 6 is plugged and slidably connected to an insert plate 28;

[0038] The base 1 is also provided with a material moving assembly for moving the tested chip away from the workbench 8;

[0039] The material moving assembly includes a groove plate 10 fixedly connected to one side of the upper end surface of the base 1, a transverse plate 13 is slidably connected to the groove of the groove plate 10, one end of the transverse plate 13 is fixedly connected to a connecting ring 14, a plurality of sliding rods 20 are radially distributed and slidably connected to the connecting ring 14, one end of the sliding rod 20 is fixedly connected to a connecting column 17, a winding roller 23 is rotatably provided on one side of the inner cavity of the connecting column 17, a polymer cloth 16 is wound on the winding roller 23, the polymer cloth 16 extends from the inner cavity of the connecting column 17, and the end is fixedly connected to the outer wall of the connecting column 17 on the other side.

[0040] In this embodiment, Figure 1 , Figure 6 , Figure 7 , Fig. 9 As shown, threaded rods 31 are rotatably provided at both ends of the sliding groove of one side slot plate 9, and the threaded rods 31 are threadedly connected to one side of the frame 5. A motor 6 32 is fixedly connected to one side of the slot plate 9, and the output end of the motor 6 32 is fixedly connected to one end of the threaded rod 31.

[0041] A cylinder 27 is fixedly connected to one side of the upper end surface of the frame body 7 , and a piston end of the cylinder 27 is fixedly connected to the upper end surface of the insert plate 28 .

[0042] Bidirectional threaded rods 30 are rotatably arranged on both sides of the upper end of the frame 7, and both sides of the bidirectional threaded rods 30 are threadedly connected to the gathering plate 6. A motor 5 29 is fixedly connected to one side of the upper end of the frame 7, and the output end of the motor 5 29 is fixedly connected to one end of the bidirectional threaded rod 30.

[0043] Specifically, in the prior art, the chip is squeezed by the pressure detector 3, and the value displayed by the pressure detector 3 when the chip is fractured is observed to determine the maximum stress that the chip can withstand during the SMT patch production process. However, usually, in order to improve the accuracy of the test results, multiple chips are tested in sequence. When workers manually place multiple chips in the test area in sequence, the labor intensity is high. When a clamping mechanism such as a manipulator is used to automatically place the chip in the test area, since multiple chips may be concentrated in a container, it is not easy for a clamping structure such as a manipulator to clamp the chips one by one, thereby affecting the continuous progress of the chip testing work.

[0044] Therefore, in order to solve the above problems, this embodiment is used for the same batch of chips with the same specifications; when multiple chips to be tested are concentrated in a container, the chips can be poured onto the conveyor belt 4, and then the cylinder 27 and the motor 5 29 are started respectively according to the thickness and width of the chips. The cylinder 27 drives the plug plate 28 to move up and down, and the plug plate 28 and the gathering plate 6 move relative to each other until the distance between the lower end surface of the plug plate 28 and the upper surface of the conveyor belt 4 is greater than the thickness of a single chip and less than the thickness of two chips. When the motor 5 29 drives the bidirectional threaded rod 30 to rotate, the two can be adjusted. The spacing of the aggregation plates 6 is such that a channel is formed at the minimum spacing between the two aggregation plates 6, and the width of the channel is greater than the width of a chip and less than the width of two chips. Then, the motor 6 32 drives the threaded rod 3 31 to rotate to drive the frame 5 to move in the slide groove of the groove plate 9 until the end of the aggregation plate 6 is above the workbench 8. In addition, since the extrusion end of the pressure detector 3 is on the upper side when not extruding the chip, the extrusion end of the pressure detector 3 will not conflict with the aggregation plate 6. Then, the conveyor belt 4 is driven to operate, and the conveyor belt 4 drives the chips on its surface to move, and the chips are moved to the two aggregation plates 6. The conveyor belt 4 moves along the channel, and when the chip reaches the channel mouth, since the channel mouth can only pass one flat chip at a time, multiple chips will be arranged in sequence at the channel, making the originally messy multiple chips regular and neat, and as the conveyor belt 4 runs, the chip falls onto the workbench 8. When a chip falls onto the workbench 8, the infrared sensor 33 detects a signal, the conveyor belt 4 stops running, and the rack 5 moves horizontally and moves away from the workbench 8. At this time, the extrusion end of the pressure detector 3 moves downward and squeezes the chip on the workbench 8, and the digital display screen of the pressure detector 3 The pressure value can be displayed, and the pressure value of the pressure detector 3 can be recorded when the chip is fractured, thereby realizing the test of a single chip. When the test of a single chip is completed, the chip is removed from the workbench 8, and the extrusion end of the pressure detector 3 is reset upward. The above operation is repeated, so that the subsequent multiple chips can be pressure tested in turn, thereby realizing the sequential feeding of multiple chips, eliminating the process of manually taking the chips and placing them in the test area, which is more convenient and labor-saving. At the same time, it also avoids the situation where the chips are concentrated in the container and the clamping structure such as the robot is not easy to clamp and feed the chips.

[0045] In this embodiment, Figure 1-Figure 5 , Figure 8 , Fig.10 As shown, a second connecting rod 19 is rotatably provided at one end of the sliding rod 20 , a first connecting rod 18 is rotatably provided at one end of the connecting rod 19 , and one end of the connecting rod 18 is rotatably provided on the connecting ring 14 .

[0046] The outer ring of the connecting ring 14 is sleeved with a gear ring 15 and rotatably arranged thereon. One end of the connecting rod 18 is fixedly connected with a gear 22 , which is rotatably arranged on the connecting ring 14 , and the gear 22 is meshed with the tooth block inside the gear ring 15 .

[0047] A second motor 21 is fixedly connected to one side of the connecting ring 14 , and an output end of the second motor 21 is fixedly connected to a gear 22 .

[0048] A motor 3 24 is fixedly connected to one side of the inner cavity of the connecting column 17 , and an output end of the motor 3 24 is fixedly connected to one end of the winding roller 23 .

[0049] One end of the transverse plate 13 is threadedly connected to a threaded rod 26, both ends of the threaded rod 26 are rotatably set on the slot plate 2 10, one side of the slot plate 2 10 is fixedly connected to a motor 4 25, and the output end of the motor 4 25 is fixedly connected to one end of the threaded rod 26.

[0050] A sliding column 34 is slidably connected to one side of the upper end surface of the base 1, and a telescopic plate 35 is slidably connected to the inner side of the sliding column 34. The upper end of the telescopic plate 35 is fixedly connected to the platform 2, and the upper end surface of the platform 2 is flush with the upper end surface of the workbench 8. An electric push rod 36 is fixedly connected to one side of the inner cavity of the sliding column 34, and the piston end of the electric push rod 36 is fixedly connected to the bottom of the telescopic plate 35. A threaded rod 12 is threadedly connected to the lower end of the platform 2, and both ends of the threaded rod 12 are rotatably set on the base 1. A motor 11 is fixedly connected to one side of the upper end surface of the base 1, and the output end of the motor 11 is fixedly connected to one end of the threaded rod 12.

[0051] Specifically, in the above embodiment, although multiple chips can be automatically fed in sequence, the degree of fracture of multiple chips may be different when they are fractured. Therefore, in order to further obtain the test parameters of the chips, it is necessary to compare and analyze the multiple fractured chips. Concentrated observation can quickly identify common defects such as edge crack concentration or abnormal cases such as single-point overload damage, so as to locate the root cause of the problem. In the above embodiment, when the chip is fractured, there may be flying chip fragments. When the fragments are relatively scattered, it is not easy to pick up and observe the chip, which affects the subsequent observation and analysis of the chip.

[0052] Therefore, in order to solve the above problem, when the present embodiment is in use, since the chip is placed between a plurality of polymer cloths 16 during the pressure test, when the chip is fractured, even if there are flying fragments, the fragments will be stopped by the polymer cloths 16. When a chip completes the test, the motor 21 drives the connecting rod 18 on one side to rotate, so that the gear 22 drives the gear ring 15 to rotate, so that the connecting rod 18 and the connecting rod 2 19 rotate. When the angle between the two changes, the sliding rod 20 slides on the connecting ring 14, driving the connecting column 17 to move toward the central area of ​​the workbench 8. At the same time, the motor 3 24 drives the winding roller 23 to rotate, and reels the polymer cloth 16, so that the portion of each polymer cloth 16 located outside the connecting column 17 is always in a taut state. Then, the chip fragments will gather toward the center of the workbench 8 under the action of the polymer cloth 16 until the chip is completely crushed. When the chip fragments are in a compact state, the motor 4 25 drives the threaded rod 26 to rotate, so as to drive the transverse plate 13 to slide horizontally, and push the chip fragments on the workbench 8 onto the platform 2. Then the electric push rod 36 drives the telescopic plate 35 and the platform 2 to move downward, so that the platform 2 is away from the polymer cloth 16, and the transverse plate 13 can be driven to reset, and the above operation is repeated. In addition, the motor 11 drives the threaded rod 12 to rotate, so that the slide column 34 can slide on the base 1 to change the position of the chip on the platform 2, so that the multiple chips after the test can be placed on the platform 2 in a compact and uniform state, which is convenient for comparative analysis of the chips after fracturing, which is conducive to locating the root cause of the problem and avoiding the situation that the chips are not easy to pick up due to the scattered fragments after the chips are fracturing, affecting the subsequent comparative analysis.

[0053] Working principle: when multiple chips to be tested are concentrated in a container, the chips can be poured onto the conveyor belt 4, and then the cylinder 27 and the motor 5 29 are started respectively according to the thickness and width of the chips. The cylinder 27 drives the plug plate 28 to move up and down, and the plug plate 28 and the gathering plate 6 move relative to each other until the distance between the lower end surface of the plug plate 28 and the upper surface of the conveyor belt 4 is greater than the thickness of a single chip and less than the thickness of two chips. When the motor 5 29 drives the bidirectional threaded rod 30 to rotate, the distance between the two gathering plates 6 can be adjusted. A channel is formed at the minimum distance between the two gathering plates 6, and the width of the channel is greater than the width of a chip and less than the width of two chips. Then, the motor 6 32 drives the threaded rod 31 to rotate to drive the frame 5 in the slide groove of the slot plate 1 9. The conveyor belt 4 is moved until the end of the material gathering plate 6 is above the workbench 8, and because the extrusion end of the pressure detector 3 is on the upper side when not extruding the chip, the extrusion end of the pressure detector 3 will not conflict with the material gathering plate 6, and then the conveyor belt 4 is driven to operate, and the conveyor belt 4 drives the chips on its surface to move, and the chips move to the channel formed by the two material gathering plates 6, and when the chips arrive at the channel mouth, because the channel mouth can only pass one flat chip at a time, multiple chips will be arranged in sequence at the channel, so that the originally messy multiple chips become regular and neat, and as the conveyor belt 4 operates, the chips fall above the workbench 8. When a chip falls above the workbench 8, the infrared sensor 33 detects a signal, the conveyor belt 4 stops operating, and the rack 5 is horizontally moved. The pressure detector 3 moves upward and moves away from the top of the workbench 8. At this time, the extrusion end of the pressure detector 3 moves downward and squeezes the chip on the workbench 8. The digital display screen of the pressure detector 3 can display the pressure value and record the pressure value of the pressure detector 3 when the chip is fractured, thereby realizing the test of a single chip. When the test of a single chip is completed, the chip is removed from the workbench 8, and the extrusion end of the pressure detector 3 is reset upward. The above operation is repeated, so that the subsequent multiple chips can be pressure tested in turn, thereby realizing the sequential feeding of multiple chips, eliminating the process of manually taking the chips and placing them in the test area, which is more convenient and labor-saving. At the same time, it also avoids the problem that the chips are concentrated in the container, and the clamping structure such as the robot is not easy to clamp and feed the chips In this case, since the chip is between multiple polymer cloths 16 during the pressure test, when the chip is fractured, even if there are flying fragments, the fragments will be stopped by the polymer cloth 16. When a chip completes the test, the motor 21 drives the connecting rod 1 18 on one side to rotate, so that the gear 22 drives the gear ring 15 to rotate, so that the connecting rod 1 18 and the connecting rod 2 19 rotate. When the angle between the two changes, the sliding rod 20 slides on the connecting ring 14, driving the connecting column 17 to move toward the central area of ​​the workbench 8. At the same time, the motor 3 24 drives the winding roller 23 to rotate and rewind the polymer cloth 16, so that the part of each polymer cloth 16 located outside the connecting column 17 is always in a taut state. Then, the chip fragments will gather toward the center of the workbench 8 under the action of the polymer cloth 16.Until the chip fragments are in a compact state, then the motor 4 25 drives the threaded rod 26 to rotate, driving the transverse plate 13 to slide horizontally, pushing the chip fragments on the workbench 8 onto the platform 2, and then the electric push rod 36 drives the telescopic plate 35 and the platform 2 to move downward, so that the platform 2 is away from the poly cloth 16, and then the transverse plate 13 can be driven to reset, and the above operation is repeated. In addition, the motor 11 drives the threaded rod 12 to rotate, so that the slide column 34 can slide on the base 1 to change the position of the chip placed on the platform 2, so that the multiple chips after testing can be placed on the platform 2 in a compact and uniform state, which is convenient for comparative analysis of the chips after fracturing, which is conducive to locating the root cause of the problem and avoiding the situation that the chips are not easy to pick up due to the scattered fragments after the chips are fracturing, which affects the subsequent comparative analysis.

[0054] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A test device for SMT patch production, comprising a base (1), characterized in that: A workbench (8) is fixedly connected to one side of the upper end surface of the base (1); a pressure detector (3) is also provided on the workbench (8); an infrared sensor (33) is also provided on the pressure detector (3); the infrared sensor (33) detects whether there is an object on the workbench (8); and a feeding assembly is provided on one side of the base (1); The feeding assembly comprises a groove plate (9) fixedly connected to both sides of the upper end surface of the base (1); the groove of the groove plate (9) is slidably connected to a frame (5); a conveyor belt (4) is arranged on the frame (5); one side of the frame (5) is fixedly connected to a frame body (7); one side of the frame body (7) is symmetrically distributed and slidably connected to two material gathering plates (6); one side of the material gathering plate (6) is plugged and slidably connected to a plug plate (28); The base (1) is also provided with a material moving component for moving the tested chip away from the workbench (8); The material shifting assembly comprises a groove plate 2 (10) fixedly connected to one side of the upper end surface of the base (1); a transverse plate (13) is slidably connected to the groove of the groove plate 2 (10); a connecting ring (14) is fixedly connected to one end of the transverse plate (13); a plurality of sliding rods (20) are radially distributed and slidably connected to the connecting ring (14); a connecting column (17) is fixedly connected to one end of the sliding rod (20); a roller (23) is rotatably provided on one side of the inner cavity of the connecting column (17); a polymer cloth (16) is wound around the roller (23); the polymer cloth (16) extends from the inner cavity of the connecting column (17), and an end portion is fixedly connected to the outer wall of the connecting column (17) on the other side.

2. A test device for SMT patch production according to claim 1, characterized in that: Threaded rods (31) are rotatably arranged at both ends of the sliding groove of the slot plate (9) on one side, and the threaded rods (31) are threadedly connected to one side of the frame (5). A motor (32) is fixedly connected to one side of the slot plate (9), and the output end of the motor (32) is fixedly connected to one end of the threaded rod (31).

3. A test device for SMT patch production according to claim 1, characterized in that: A cylinder (27) is fixedly connected to one side of the upper end surface of the frame (7), and a piston end of the cylinder (27) is fixedly connected to the upper end surface of the plug plate (28).

4. A test device for SMT patch production according to claim 1, characterized in that: Bidirectional threaded rods (30) are rotatably provided on both sides of the upper end of the frame (7), and both sides of the bidirectional threaded rods (30) are threadedly connected to the material gathering plate (6). A motor five (29) is fixedly connected to one side of the upper end of the frame (7), and the output end of the motor five (29) is fixedly connected to one end of the bidirectional threaded rod (30).

5. A test device for SMT patch production according to claim 1, characterized in that: One end of the sliding rod (20) is rotatably provided with a second connecting rod (19), one end of the second connecting rod (19) is rotatably provided with a first connecting rod (18), and one end of the first connecting rod (18) is rotatably provided on the connecting ring (14).

6. A test device for SMT patch production according to claim 5, characterized in that: The outer ring of the connecting ring (14) is sleeved with a gear ring (15) which is rotatably arranged thereon. One end of the connecting rod (18) is fixedly connected to a gear (22). The gear (22) is rotatably arranged on the connecting ring (14). The gear (22) is meshed with a tooth block on the inner side of the gear ring (15).

7. A test device for SMT patch production according to claim 6, characterized in that: A second motor (21) is fixedly connected to one side of the connecting ring (14), and an output end of the second motor (21) is fixedly connected to a gear (22).

8. A test device for SMT patch production according to claim 1, characterized in that: A third motor (24) is fixedly connected to one side of the inner cavity of the connecting column (17), and an output end of the third motor (24) is fixedly connected to one end of the winding roller (23).

9. A test device for SMT patch production according to claim 1, characterized in that: One end of the transverse plate (13) is threadedly connected to a threaded rod (26), both ends of the threaded rod (26) are rotatably arranged on the groove plate (10), one side of the groove plate (10) is fixedly connected to a motor (25), and the output end of the motor (25) is fixedly connected to one end of the threaded rod (26).

10. A test device for SMT patch production according to claim 1, characterized in that: A sliding column (34) is slidably connected to one side of the upper end surface of the base (1), and a telescopic plate (35) is slidably connected to the inner side of the sliding column (34). The upper end of the telescopic plate (35) is fixedly connected to a platform (2), and the upper end surface of the platform (2) is flush with the upper end surface of the workbench (8). An electric push rod (36) is fixedly connected to one side of the inner cavity of the sliding column (34), and the piston end of the electric push rod (36) is fixedly connected to the bottom of the telescopic plate (35). A threaded rod (12) is threadedly connected to the lower end of the platform (2), and both ends of the threaded rod (12) are rotatably arranged on the base (1). A motor (11) is fixedly connected to one side of the upper end surface of the base (1), and the output end of the motor (11) is fixedly connected to one end of the threaded rod (12).

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