Optical fiber packaging test device and test method

Abstract

The invention provides an optical fiber packaging testing device and method, and relates to the technical field of silicon photon testing, and the device comprises a packaging chip which is provided with an optical gate; and the testing machine is embedded with an optical fiber interface, and the optical fiber interface and the optical gate are correspondingly arranged, so that the optical gate of the packaging chip is aligned with the optical fiber interface of the testing machine, and the testing of the packaging chip is completed. According to the test device and the test method provided by the invention, the test after the packaging of the chip or die or CoWOS / SOIC / ASIC can be realized, and the mass production packaging test production can also be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon photon testing, and in particular to an optical fiber packaging testing device and a testing method. Background Art

[0002] With the rise of generative artificial intelligence, the demand for data transmission has surged, and silicon photonics technology has attracted much attention. Silicon photonics uses silicon wafers to make miniaturized chips, which can replace traditional optical transceiver modules and are used for short-distance transmission in data centers or long-distance fiber optic networks. In the future, silicon photonics is expected to replace copper wires to achieve optical signal transmission between chips, improve component density, reduce size, increase speed and reliability. With the rise of generative artificial intelligence, the demand for data transmission has also shown explosive growth. Silicon photonics technology uses laser beams instead of electronic signals to transmit data. It is a low-cost, high-speed optical communication technology based on silicon photonics. Intel Labs has achieved the first data connection based on silicon photonics through an integrated laser that hybridizes silicon laser technology.

[0003] Existing silicon photonics (SiPh) testing only performs terminal testing or system testing, and cannot be performed after the chip or die or CoWOS / SOIC / ASIC / FOPLP is packaged. Summary of the invention

[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide an optical fiber packaging testing device and a testing method, which are used to solve the problem that the silicon photonics (SiPh) test in the prior art is only a terminal test or a system test, but the test cannot be realized after the chip (chip or die) or CoWOS / SOIC / ASIC / FOPLP is packaged.

[0005] To achieve the above-mentioned purpose and other related purposes, the present invention provides a fiber optic packaging testing device, including: a packaging chip, the packaging chip is provided with an optical gate; and a testing machine, the testing machine is embedded with an optical fiber interface, the optical fiber interface and the optical gate are arranged correspondingly to align the optical gate of the packaging chip with the optical fiber interface of the testing machine to complete the testing of the packaging chip.

[0006] In one embodiment of the present invention, the test machine comprises: a test sorter kit, a test seat and a test seat cover, and the optical fiber interface is embedded in the test sorter kit.

[0007] In one embodiment of the present invention, the test machine includes: a test sorter kit, a test seat and a test seat cover, and the optical fiber interface is embedded in the test seat, wherein the design architecture composed of the test seat and the test seat cover is one of a single-layer and multi-layer design architecture.

[0008] In one embodiment of the present invention, the test machine includes: a test sorter kit, a test seat and a test seat cover, the optical fiber interface is embedded in the test seat cover, wherein the design architecture composed of the test seat and the test seat cover is one of a single-layer and multi-layer design architecture.

[0009] In one embodiment of the present invention, the optical fiber packaging test device further includes: a fixing mechanism, wherein the fixing mechanism is disposed on the test machine, and the optical fiber interface is disposed on the fixing mechanism; wherein the fixing mechanism and the test machine are an integrated structure.

[0010] In one embodiment of the present invention, the optical fiber packaging test device further includes: an adjuster, which is disposed on the test machine, and an adjusting end of the adjuster is connected to the fixing device to adjust the position, height and angle of the optical fiber interface.

[0011] To achieve the above-mentioned object and other related objects, the present invention also provides a testing method of an optical fiber packaging testing device, comprising:

[0012] Providing a packaged chip, wherein the packaged chip is provided with an optical gate;

[0013] Provide a test machine, wherein the test machine is embedded with an optical fiber interface, and the optical fiber interface is arranged corresponding to the optical gate;

[0014] The optical gate of the packaged chip is aligned with the optical fiber interface of the testing machine to complete the testing of the packaged chip.

[0015] In one embodiment of the present invention, the optical gate of the packaged chip is aligned with the optical fiber interface of the test machine to complete the test of the packaged chip, including: aligning the optical gate of the packaged chip with the optical fiber interface of the test sorter kit of the test machine to complete the test of the packaged chip.

[0016] In one embodiment of the present invention, the optical gate of the packaged chip is aligned with the optical fiber interface of the test machine to complete the test of the packaged chip, including: aligning the optical gate of the packaged chip with the optical fiber interface on the test socket of the test machine to complete the test of the packaged chip.

[0017] In one embodiment of the present invention, the optical gate of the packaged chip is aligned with the optical fiber interface of the test machine to complete the test of the packaged chip, including: aligning the optical gate of the packaged chip with the optical fiber interface on the upper cover of the test seat of the test machine to complete the test of the packaged chip.

[0018] As described above, the optical fiber packaging test device and test method of the present invention have the following beneficial effects: through the integrated design of the optical fiber interface on the test machine, the packaging test production is realized, and it is also easy to realize the design and manufacture of multi-site (multiple arrays), and it is easy to realize the setup (on the machine) when executing engineering or mass production. And through the connection between the adjustment end of the adjuster and the fixed mechanism, the position, height, angle (theta) of the optical fiber interface and the DUT can be fine-tuned, and after the adjustment is completed, the adjuster can be removed from the test machine, so as to achieve the purpose of retaining only the optical fiber interface for testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Shown is a structural framework diagram of the optical fiber packaging test device of the present invention.

[0020] Figure 2 It is a schematic diagram showing the structure of an optical fiber interface provided in an embodiment of the present invention being arranged on a test seat cover.

[0021] Figure 3 It is a schematic diagram showing the structure of an optical fiber interface provided in a test socket according to an embodiment of the present invention.

[0022] Figure 4 The diagram shows a top view of an optical fiber interface provided by an embodiment of the present invention disposed on a test seat cover.

[0023] Figure 5 It is a schematic diagram showing the structure of an optical fiber interface provided in a test sorter kit according to an embodiment of the present invention.

[0024] Figure 6 It is a schematic diagram of the structure between the regulator and the fixing member provided by one embodiment of the present invention.

[0025] Figure 7 Shown is a schematic structural diagram of a regulator provided by an embodiment of the present invention.

[0026] Component number description

[0027] Packaged chip 10; test machine 20; fixing mechanism 30; adjuster 40; optical gate 101; optical fiber interface 201; test sorter kit 21; test seat 22; test seat cover 23. DETAILED DESCRIPTION

[0028] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the features in the following embodiments and the embodiments can be combined with each other without conflict. It should also be understood that the terms used in the embodiments of the present invention are intended to describe specific embodiments, rather than to limit the scope of protection of the present invention. The test methods for which specific conditions are not specified in the following examples are usually carried out under conventional conditions or according to the conditions recommended by the manufacturers.

[0029] See also Figures 1 to 7 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0030] See also Figure 1 In one embodiment of the present invention, the present invention provides an optical fiber packaging test device, including: a packaging chip 10, wherein the packaging chip 10 is provided with an optical gate 101; and a test machine 20, wherein the test machine 20 is embedded with an optical fiber interface 201, and the optical fiber interface 201 is arranged corresponding to the optical gate 101, so as to align the optical gate 101 of the packaging chip 10 with the optical fiber interface 201 of the test machine 20 to complete the test of the packaging chip 10.

[0031] In this embodiment, after the chip (chip or die) or CoWOS / SOIC / ASIC / FOPLP is packaged, if it is necessary to test the transmission capacity and transmission data correctness between the external silicon photonic (SiPh) interface and the corresponding packaged chip 10 optical gate after packaging, the optical fiber interface 201 corresponding to the silicon photonic interface can be designed on the test machine. During the test, by connecting the optical gate port 101 of the packaged chip 10 with the optical fiber interface 201 integrated in the test machine 20, it is convenient to realize packaging test production, and it is also easy to realize multi-site (multi-array) design and manufacturing, and it is easy to realize setup (installation) when executing engineering or mass production.

[0032] In one embodiment of the present invention, the optical fiber interface 201 includes a silicon photon sensor interface, a silicon photon receiver interface, and a silicon photon transceiver interface. In this embodiment, the optical fiber interface 201 may also be other interfaces that implement silicon photon (SiPh) transmission.

[0033] It is worth noting that silicon photonic sensors are optical sensors based on silicon materials, which use silicon photonic technology to achieve high sensitivity and high precision measurements. The main components of silicon photonic sensors include photonic integrated circuits (PICs), which are usually integrated on silicon wafers and connected to external components through optical coupling. Silicon photonic receivers are optoelectronic integrated devices based on silicon chips, which are mainly used to convert optical signals into electrical signals; their working principle is to control the transmission and coupling of light through optical waveguides on silicon chips to achieve the conversion between optical signals and electrical signals. Silicon photonic transceivers are optoelectronic integrated devices based on silicon chips, which are mainly used to achieve the conversion between optical signals and electrical signals. The core principle is to control the transmission and coupling of light through optical waveguides on silicon chips. Silicon photonic transceivers include two main components: photodetectors and lasers. Photodetectors convert optical signals into electrical signals, while lasers convert electrical signals into optical signals.

[0034] See also Figure 2, the test machine 20 includes: a test sorter kit 21, a test seat 22 and a test seat cover 23, the optical fiber interface 201 is embedded in the test seat cover 23, wherein the design architecture composed of the test seat 22 and the test seat cover 23 is one of the single-layer and multi-layer design architectures. In this embodiment, the test seat cover 23 is an important component of the test seat structure, and its main function is to protect the device under test and the contacts to prevent dust and other pollutants from entering. The test seat cover 23 can usually adopt a spin-type structure, which is stable when pressed down, and can ensure that the pressure of the IC is uniform and does not shift. The test seat cover 23 is located above the test seat 22, and a PCB board is provided below the test seat 22, and the packaged chip 10 is located between the test seat cover 23 and the test seat 22. The optical fiber interface 201 can be further integrated into the test seat cover 23, thereby realizing the transmission capacity and transmission data correctness test of the optical gate 101 of the corresponding packaged chip 10 after packaging.

[0035] See also Figure 3 and Figure 4 In one embodiment of the present invention, the test machine 20 includes: a test sorter kit 21, a test seat 22 and a test seat cover 23, and the optical fiber interface 201 is embedded in the test seat 22, wherein the design architecture composed of the test seat 22 and the test seat cover 23 is one of a single-layer and a multi-layer design architecture. In this embodiment, the test seat 22 is used for integrated circuit application function verification and is a static connector between the PCB board and the packaged chip 10 (IC). It allows the replacement and testing of the chip to be more convenient, reduces the damage to the IC and PCB, and achieves a fast and efficient test effect. Therefore, the optical fiber interface 201 can also be designed on the test seat 22, so as to realize the transmission capacity and transmission data correctness test of the optical gate 101 of the corresponding packaged chip 10 after packaging.

[0036] See also Figure 5 In one embodiment of the present invention, the test machine 20 includes: a test sorter kit 21, a test seat 22 and a test seat cover 23, and the optical fiber interface 201 is embedded in the test sorter kit 21. In this embodiment, the test sorter implements the test by installing the packaged chip 10 at the bottom of the test sorter kit 21 during the test. Therefore, the optical fiber interface 201 can also be designed on the test sorter kit 21 to implement the transmission capacity and transmission data correctness test of the optical gate 101 of the corresponding packaged chip 10 after packaging.

[0037] It can be seen from the above examples that:

[0038] In the manual test engineering, the CoWOS / SOIC / ASIC of the silicon photonics (SiPh) component obtains the packaged chip 10 after packaging, and the optical gate interface will be retained for post-packaging testing, that is, the optical gate port 101. Therefore, the optical fiber interface 201 can be fixedly embedded in the socket (test socket 22) to achieve connection with the optical gate port 101. Specifically, the socket can be a single-layer structure or a sandwich structure socket (multi-layer architecture socket). Of course, in the manual test engineering, the optical fiber interface 201 can also be a lid fixedly embedded in the socket, that is, the test socket lid 23.

[0039] In mass production testing, the CoWOS / SOIC / ASIC of the silicon photonics (SiPh) component obtains the packaged chip 10 after packaging, and the optical gate interface will be retained for post-packaging testing, that is, the optical gate port 101. Therefore, the optical fiber interface 201 can be embedded and fixed in the test sorter kit 21, such as the pressure block (Handler press contact kit) of the test sorter (handler). Of course, in mass production testing, the optical fiber interface 201 can also be fixedly embedded in the socket (test seat 22), which may be a single-layer structure or a sandwich structure socket (multi-layer architecture socket).

[0040] Please refer to 2 to Figure 6 In one embodiment of the present invention, the optical fiber packaging test device further includes: a fixing mechanism 30, the fixing mechanism 30 is arranged on the test machine 20, and the optical fiber interface 201 is arranged on the fixing mechanism 30; wherein the fixing mechanism 30 and the test machine 20 are an integrated structure. In this embodiment, the fixing mechanism 30 for fixing the optical fiber interface 201 and the test machine 2 are an integrated structure, thereby realizing the embedded installation of the optical fiber interface 201 on the test machine 2.

[0041] See also Figure 2 , Figure 2 In the embodiment shown, the fixing mechanism 30 may be disposed on the test seat cover 23, so that before the packaged chip 10 is installed in the test seat 22, the fixing mechanism 30 of the optical fiber interface 201 on the test seat 22 may be adjusted to correspond to the position of the optical gate 101 on the packaged chip 10, and then the optical gate 101 on the packaged chip 10 may be connected to the optical fiber interface 201 corresponding to the fixing mechanism 30 on the test seat cover 23 for testing.

[0042] See also Figure 3 and Figure 4 , Figure 3 and Figure 4In the embodiment shown, the fixing mechanism 30 may be disposed in the test seat 22 and located above the packaged chip 10. That is, before the packaged chip 10 is loaded into the test seat 22 and the test seat cover 23 is closed, the optical fiber interface 201 on the test seat 22 may be first adjusted to the corresponding position of the fixing mechanism 30 according to the position of the optical gate 101 on the packaged chip 10, and then, when testing, the optical gate 101 on the packaged chip 10 is connected to the optical fiber interface 201 corresponding to the fixing mechanism 30 on the test seat 22 to perform the test.

[0043] See also Figure 5 , Figure 5 In the embodiment shown, the fixing mechanism 30 may be disposed on one side of the test sorter kit 21, such as a test sorter block. When the test sorter block is installed with the packaged chip 10, the optical gate 101 on the packaged chip 10 may be connected to the optical fiber interface 201 corresponding to the fixing mechanism 30 on one side of the test sorter block for testing.

[0044] In one embodiment of the present invention, the optical fiber packaging test device further includes: an adjuster 40, the adjuster 40 is arranged on the test machine 20, and the adjustment end of the adjuster 40 is connected to the fixed mechanism 30 to adjust the position, height and angle of the optical fiber interface 201. In this embodiment, by using the adjuster 40, the position adjustment of the fixed mechanism 30 can be achieved, so that the optical fiber interface 201 on the fixed mechanism 30 can be adjusted to correspond to the position of the optical gate 101 on the packaging chip 10, thereby achieving the connection between the optical fiber interface 201 and the optical gate 101.

[0045] See also Figure 6 , Figure 6 In the embodiment shown, the position of the fixing member 30 on one side of the test seat 22 can be adjusted by the adjuster 40, so as to adjust the position, height and angle of the optical fiber interface 201. It is worth noting that the adjuster 40 can be detachable, or fixed. That is, after the adjuster 40 has adjusted the position of the fixing member 30 and the optical fiber interface 201 on the test seat 22, the adjuster 40 can be removed from the test seat 22, or it can be kept on the test seat 22.

[0046] See also Figure 7 , Figure 7 In the illustrated embodiment, the adjuster 40 is an X / Y / Z / Theta position height angle adjuster, which can adjust the position, height and angle of the optical fiber interface 201 by adjusting the fixing member 30 .

[0047] In one embodiment of the present invention, the present invention further provides a testing method of an optical fiber packaging testing device, comprising:

[0048] A packaged chip 10 is provided, wherein the packaged chip 10 is provided with an optical gate 101;

[0049] A test machine 20 is provided, wherein the test machine 20 is embedded with an optical fiber interface 201, and the optical fiber interface 201 is arranged corresponding to the optical gate 101;

[0050] The optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 of the testing machine 20 to complete the test of the packaged chip 10 .

[0051] In this embodiment, it can be seen that when testing the packaged chip 10 , the optical gate 101 of the packaged chip 10 can be connected to the optical fiber interface 201 on the tester 20 to complete the test of the packaged chip 10 .

[0052] In a preferred embodiment of the present invention, the optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 of the test machine 20 to complete the test of the packaged chip 10, including: aligning the optical gate 101 of the packaged chip 10 with the optical fiber interface 201 of the test sorter kit 21 of the test machine 20 to complete the test of the packaged chip 10. In this embodiment, it can be seen that when testing the packaged chip 10, the optical fiber interface 201 can be configured on the test sorter kit 21 of the test machine 20, so that when the packaged chip 10 is installed on the test sorter kit 21, such as the test sorter pressing block, the optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 of the test sorter kit 21 of the test machine 20, so that the optical gate 101 and the optical fiber interface 201 are connected.

[0053] In one embodiment of the present invention, the optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 of the test machine 20 to complete the test of the packaged chip 10, including: aligning the optical gate 101 of the packaged chip 10 with the optical fiber interface 201 on the test seat 22 of the test machine 20 to complete the test of the packaged chip 10. In this embodiment, it can be seen that when testing the packaged chip 10, the optical fiber interface 201 can be configured on the test seat 22 of the test machine 20, so that when the packaged chip 10 is installed on the test seat 22 below the test seat cover 23, the optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 on the test seat 22, so that the optical gate 101 and the optical fiber interface 201 are connected.

[0054] In one embodiment of the present invention, the optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 of the test machine 20 to complete the test of the packaged chip 10, including: aligning the optical gate 101 of the packaged chip 10 with the optical fiber interface 201 on the test seat upper cover 23 of the test machine 20 to complete the test of the packaged chip 10. In this embodiment, it can be seen that when testing the packaged chip 10, the optical fiber interface 201 can be configured on the test seat upper cover 23 of the test machine 20, so that when the packaged chip 10 is installed between the test seat upper cover 23 and the test seat 22, the optical gate 101 of the packaged chip 10 is aligned with the optical fiber interface 201 on the test seat upper cover 23, so that the optical gate 101 and the optical fiber interface 201 are connected.

[0055] In summary, the optical fiber packaging test device and test method disclosed in the present invention realizes packaging test production through the integrated design of the optical fiber interface 201 on the test machine 20, and is also easy to realize multi-site (multi-array) design and manufacturing, and is easy to realize setup (on the machine) when executing engineering or mass production. And through the connection between the adjustment end of the adjuster and the fixed mechanism 30, the optical fiber interface 201 and the DUT position, height, angle (theta), etc. can be fine-tuned, and after the adjustment is completed, the adjuster can be removed from the test machine 20, so as to achieve the purpose of retaining only the optical fiber interface 201 for testing. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.

[0056] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. An optical fiber packaging test device, characterized in that: include: A packaged chip, wherein the packaged chip is provided with an optical gate; as well as A testing machine is provided with an optical fiber interface, and the optical fiber interface is arranged corresponding to the optical gate, so that the optical gate of the packaged chip is aligned with the optical fiber interface of the testing machine to complete the test of the packaged chip.

2. The optical fiber packaging test device according to claim 1, characterized in that: The test machine comprises: a test sorter kit, a test seat and a test seat cover, and the optical fiber interface is embedded in the test sorter kit.

3. The optical fiber packaging test device according to claim 1, characterized in that: The test machine includes: a test sorter kit, a test seat and a test seat cover, the optical fiber interface is embedded in the test seat, wherein the design architecture composed of the test seat and the test seat cover is one of a single-layer and a multi-layer design architecture.

4. The optical fiber packaging test device according to claim 1, characterized in that: The test machine includes: a test sorter kit, a test seat and a test seat cover, the optical fiber interface is embedded in the test seat cover, wherein the design architecture composed of the test seat and the test seat cover is one of a single-layer and a multi-layer design architecture.

5. The optical fiber packaging test device according to claim 1, characterized in that: The optical fiber packaging test device further comprises: a fixing mechanism, wherein the fixing mechanism is arranged on the test machine, and the optical fiber interface is arranged on the fixing mechanism; wherein the fixing mechanism and the test machine are an integrated structure.

6. The optical fiber packaging test device according to claim 5, characterized in that: The optical fiber packaging test device further comprises: an adjuster, which is arranged on the test machine, and an adjusting end of the adjuster is connected to the fixing component to adjust the position, height and angle of the optical fiber interface.

7. A method for testing the optical fiber packaging test device according to any one of claims 1 to 6, characterized in that: include: Providing a packaged chip, wherein the packaged chip is provided with an optical gate; Provide a test machine, wherein the test machine is embedded with an optical fiber interface, and the optical fiber interface is arranged corresponding to the optical gate; The optical gate of the packaged chip is aligned with the optical fiber interface of the testing machine to complete the testing of the packaged chip.

8. The optical fiber packaging test device according to claim 7, characterized in that: Aligning the optical gate of the packaged chip with the optical fiber interface of the tester to complete the test of the packaged chip, including: The optical gate of the packaged chip is aligned with the optical fiber interface of the test sorter kit of the test machine to complete the test of the packaged chip.

9. The optical fiber packaging test device according to claim 7, characterized in that: Aligning the optical gate of the packaged chip with the optical fiber interface of the tester to complete the test of the packaged chip, including: The optical gate of the packaged chip is aligned with the optical fiber interface on the test seat of the test machine to complete the test of the packaged chip.

10. The optical fiber packaging test device according to claim 7, characterized in that: Aligning the optical gate of the packaged chip with the optical fiber interface of the tester to complete the test of the packaged chip, including: The optical gate of the packaged chip is aligned with the optical fiber interface on the upper cover of the test seat of the test machine to complete the test of the packaged chip.

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