Three-dimensional imaging method and device of ultrasonic two-dimensional phased array
By dividing the two-dimensional array and simulating the virtual wave source, combined with frequency domain analysis technology, the high cost and complexity of three-dimensional ultrasonic imaging of two-dimensional arrays is solved, and the three-dimensional imaging effect with low cost and high frame rate is achieved.
Patent Information
- Application Number
- CN202510473835.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2025-05-13
- Estimated Expiration
- 2045-04-16
AI Technical Summary
The three-dimensional ultrasonic imaging technology of two-dimensional arrays has high cost and complexity problems, mainly because the number of array elements increases in square relationship with the size, resulting in extremely high costs of circuit wiring, data transmission and storage.
By dividing the original array, several subarrays are obtained, and the number and location of virtual wave sources are determined based on the information of the imaging target. When each subarray simulates a virtual wave source, it combines the excitation pulses of each array element and constructs a three-dimensional image through frequency domain analysis.
Three-dimensional ultrasonic imaging of two-dimensional arrays is realized at low cost. Through time-sharing multiplexing and encoding excitation technology, the overall cost of the system is reduced and the imaging effect with high frame rate and high signal-to-noise ratio is ensured.
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Figure CN119986671A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of ultrasonic imaging, and in particular to a three-dimensional imaging method and device of an ultrasonic two-dimensional phased array. Background Art
[0002] Three-dimensional ultrasound imaging has high use value in many fields, but its technical complexity and implementation cost are also relatively high. At present, one of the main implementation methods of three-dimensional ultrasound imaging is to use a two-dimensional array to control the emission and acquisition of array elements with electronic focusing, thereby realizing three-dimensional regional imaging. This imaging method has a very short switching time between different focus scans, and theoretically can achieve a high imaging frame rate, which can be effectively applied to scenes with fast three-dimensional motion that require precise capture.
[0003] However, three-dimensional imaging of two-dimensional arrays is extremely challenging. The main reason is that the number of array elements in a two-dimensional array increases in a square relationship with its size. In the case of traditional technology using a fully connected method, the imaging system of a two-dimensional array probe requires an extremely high number of channels, which makes circuit wiring, data transmission and storage extremely costly and poses huge difficulties.
[0004] Therefore, how to realize three-dimensional ultrasound imaging of a two-dimensional array at a low cost is an urgent problem to be solved. Summary of the invention
[0005] The present specification provides a three-dimensional imaging method, device, storage medium and electronic device to at least partially solve the above-mentioned problems existing in the prior art.
[0006] This manual adopts the following technical solutions: This specification provides a three-dimensional imaging method, comprising: Dividing an original array including a plurality of array elements to obtain a plurality of sub-arrays, wherein both the original array and the sub-arrays are two-dimensional arrays; Determine the number of virtual wave sources and the position of each virtual wave source according to the information of the imaging target and the imaging requirements; For each virtual wave source, determining an excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source; For each sub-array in turn, the excitation pulses of each array element included in the sub-array are combined to simulate each virtual wave source in a preset order; Perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each subarray corresponding to each virtual wave source; A target three-dimensional image is constructed according to the frequency domain echo data.
[0007] Optionally, each array element included in the original array exists in only one sub-array after division, and the sub-arrays do not include overlapping parts.
[0008] Optionally, the sizes of the sub-arrays obtained by dividing the original array are the same.
[0009] Optionally, the number of virtual wave sources is determined according to the information of the imaging target and the imaging requirement, specifically including: The number of virtual wave sources is determined according to the imaging depth, imaging frame rate and average sound velocity of the imaging area of the target three-dimensional image to be constructed.
[0010] Optionally, determining the excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source specifically includes: For each sub-array, the size and delay of the excitation pulse of each array element included in the sub-array when simulating the virtual wave source are determined.
[0011] Optionally, combining the excitation pulses of each array element included in the subarray to simulate each virtual wave source in a preset order specifically includes: The excitation pulses of each array element included in the subarray are combined in a round-robin inversion coding manner, and each virtual wave source is simulated repeatedly for a specified number of times in a preset order, wherein the signal polarity of the excitation pulses of each array element corresponding to a virtual wave source is reversed each time the simulation is performed.
[0012] Optionally, performing frequency domain analysis on the received echo signal to obtain frequency domain echo data of each subarray corresponding to each virtual wave source specifically includes: For each subarray, performing Fourier transform on the echo signal received by the subarray to obtain transformed echo data; The frequency domain echo data of the sub-array corresponding to each virtual wave source is obtained according to the transformed echo data, the signal frequency band and the angular frequency of the original array.
[0013] This specification provides a three-dimensional imaging device, the device comprising: A division module, used for dividing an original array including a plurality of array elements into a plurality of sub-arrays, wherein both the original array and the sub-arrays are two-dimensional arrays; A first determination module is used to determine the number of virtual wave sources and the position of each virtual wave source according to the information of the imaging target and the imaging requirements; A second determination module is used to determine, for each virtual wave source, an excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source; A simulation module, used for combining the excitation pulses of each array element included in each sub-array in turn, and simulating each virtual wave source in a preset order; An analysis module is used to perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each subarray corresponding to each virtual wave source; A construction module is used to construct a target three-dimensional image according to the frequency domain echo data.
[0014] This specification provides a computer-readable storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned three-dimensional imaging method is implemented.
[0015] This specification provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the above-mentioned three-dimensional imaging method when executing the program.
[0016] At least one of the above technical solutions adopted in this specification can achieve the following beneficial effects: In the three-dimensional imaging method provided in the present specification, an original array including a plurality of array elements is divided to obtain a plurality of sub-arrays, wherein the original array and the sub-arrays are both two-dimensional arrays; the number of virtual wave sources is determined according to the information of the imaging target and the imaging requirements, and the position of each virtual wave source is determined; for each virtual wave source, the excitation pulse of each array element included in each sub-array is determined when the sub-array simulates the virtual wave source; for each sub-array in turn, the excitation pulse of each array element included in the sub-array is combined to simulate each virtual wave source in a preset order; the received echo signal is analyzed in the frequency domain to obtain the frequency domain echo data of each sub-array corresponding to each virtual wave source; and a target three-dimensional image is constructed according to the frequency domain echo data.
[0017] When using the three-dimensional imaging method for ultrasonic two-dimensional phased array provided in this specification to construct a target three-dimensional image, based on the idea of time-division multiplexing, the original array is divided into multiple sub-arrays, each sub-array successively simulates different virtual wave sources in a coded transmission manner, and performs frequency domain analysis on the collected echo signals, and constructs the target three-dimensional image based on the obtained frequency domain echo data. This method uses time-division multiplexing to control a high-element array with a low number of channels for imaging, effectively controlling the overall cost of the system; the high frame rate of imaging is ensured by the diffusion wave emission and beam synthesis of the virtual wave source; the average energy of the sub-array emission is increased by coded excitation, ensuring the signal-to-noise ratio of the sub-array acquisition; at the same time, frequency domain decoding and beam synthesis are performed within the working frequency band of the original array, greatly simplifying the calculation process. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The drawings described herein are used to provide a further understanding of this specification and constitute a part of this specification. The illustrative embodiments and descriptions of this specification are used to explain this specification and do not constitute an improper limitation on this specification. In the drawings: Figure 1 A schematic diagram of a three-dimensional imaging method in this specification; Figure 2 A schematic diagram of dividing an original array into blocks provided in this specification; Figure 3 A schematic diagram of a process of simulating a virtual wave source provided in this specification; Figure 4 A schematic diagram of transmitting excitation pulses in a round-robin inversion coding manner provided in this specification; Figure 5 A schematic diagram of a three-dimensional imaging device provided in this specification; Figure 6 The corresponding Figure 1 Schematic diagram of electronic equipment. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solutions and advantages of this specification more clear, the technical solutions of this specification will be clearly and completely described below in combination with the specific embodiments of this specification and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0020] The technical solutions provided by the embodiments of this specification are described in detail below in conjunction with the accompanying drawings.
[0021] Figure 1 The following is a flow chart of a three-dimensional imaging method in this specification, which specifically includes the following steps: S100: Divide an original array including a plurality of array elements to obtain a plurality of sub-arrays, wherein both the original array and the sub-arrays are two-dimensional arrays.
[0022] All steps in the three-dimensional imaging method provided in this specification can be implemented by any electronic device with computing functions, such as a terminal, a server, and the like.
[0023] In this method, an ultrasonic two-dimensional phased array is used for three-dimensional imaging. The ultrasonic two-dimensional phased array can realize flexible control and multi-dimensional scanning of the sound beam through two-dimensionally arranged array elements, and has many advantages such as no complex mechanical structure and high imaging frame rate. However, the array elements of the two-dimensional array are dense, and the use of a fully connected mode will lead to a comprehensive increase in system complexity and cost. To solve this problem, in this method, three-dimensional imaging of the two-dimensional array is realized based on time-division multiplexing. Time-division multiplexing is a technology that allows multiple signals to multiplex the same transmission medium. This method applies it to the ultrasound system, which can realize the control of the emission and acquisition of a large number of array elements with a small number of channels, significantly reducing the number of channels required, effectively reducing the complexity and cost of the system, and greatly improving the practical application value of three-dimensional ultrasonic imaging technology.
[0024] Based on the above idea, in this step, the two-dimensional phased array used for ultrasonic imaging, that is, the original array, is first divided. The original array contains a number of array elements that can emit excitation signals. After the original array is divided, several sub-arrays can be obtained, each of which contains a number of array elements.
[0025] The sub-arrays obtained after the division do not overlap each other, that is, no two sub-arrays contain repeated array elements. At the same time, each array element contained in the original array will exist in and only exist in one sub-array after the division, and there will be no undivided array elements.
[0026] In a more preferred embodiment, the sub-arrays obtained after dividing the original array have the same size, so that the modes of transmitting and receiving signals of each sub-array can be the same, further reducing the complexity of the method and the amount of calculation required.
[0027] Specifically, the N×N original array can be divided into K M×M sub-arrays. For example, Figure 2 A schematic diagram of dividing the original array into blocks is provided in this specification, such as Figure 2 As shown, each small square represents an array element, and the original 6×6 array is divided into four 3×3 sub-arrays, each of which is independent and non-overlapping.
[0028] S102: Determine the number of virtual wave sources according to the imaging target information and the imaging requirement, and determine the position of each virtual wave source.
[0029] After multiple sub-arrays are obtained by division in step S100, several virtual wave sources can be determined in this step. In this method, the virtual wave source is an imaginary wave source located behind the array. The ultrasonic wave emitted by the virtual wave source is simulated by setting the pulse excitation delay of each array element, thereby realizing diffuse wave emission. With diffuse waves, each emission can almost cover the entire imaging field of view, that is, complete a scan, thereby ensuring high frame rate imaging.
[0030] Figure 3 This is a schematic diagram of the process of simulating a virtual wave source provided in this manual. Figure 3 As shown in the figure, the array surface is used as the boundary, the imaging area is regarded as the front of the array, and the opposite direction is regarded as the back of the array. If there is a wave source behind the array, there will be a time difference between the wave source reaching each array element. By setting the pulse excitation delay of each array element according to this time difference, the ultrasonic wave emitted by the virtual wave source can be simulated, thereby realizing the diffusion wave emission.
[0031] In this method, each virtual wave source can be simulated by an excitation pulse emitted by an array element contained in any subarray. Each subarray works independently and does not affect each other.
[0032] In this step, the number of virtual wave sources can be determined first. In this method, the number of virtual wave sources can be determined according to the imaging depth, imaging frame rate and average sound velocity of the imaging area of the target three-dimensional image to be constructed. Specifically, it can be expressed as the following formula:
[0033] Wherein, c represents the average sound velocity in the imaging area, K represents the number of subarrays, D represents the imaging depth, F represents the imaging frame rate, and P represents the number of virtual wave sources.
[0034] The principle of the above formula is that each acquisition must wait for the ultrasound to complete a complete round trip within the specified imaging range. The round trip time is determined by the sound speed and the depth of the imaging range, that is, 2D / c. The more times the acquisition is transmitted, the longer it takes to complete an imaging, and the lower the corresponding frame rate. For example, if a 6×6 (N=6) two-dimensional array is divided into 4 (K=4) 3×3 (M=3) sub-arrays, the imaging depth is 60 mm, the average sound speed is 1500 m / s, and the required imaging frame rate is not less than 200 fps, then the number of virtual wave sources allowed for each sub-array cannot exceed 15.
[0035] After determining the number of virtual wave elements, the position of each virtual wave source can be further determined. The position of each virtual wave source can be set according to the number of virtual wave sources determined and the specific requirements of imaging, and this specification does not impose specific restrictions on this.
[0036] S104: for each virtual wave source, determining an excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source.
[0037] After the position of each virtual wave source is determined, the excitation pulses of each array element included in each subarray when each subarray simulates different virtual wave sources can be further determined. The excitation pulse of an array element can specifically consist of two aspects of information: the size and delay of the excitation pulse. Based on this, when determining the excitation pulses of each subarray simulating different virtual wave sources, the size and delay of the excitation pulse of each array element included in the subarray when simulating the virtual wave source can be specifically determined for each subarray.
[0038] When the array elements in each subarray simulate each different virtual wave source, the excitation pulse may be different. The size of the excitation pulse can be set according to the specific requirements of the energy required for imaging, and this specification does not impose specific restrictions on this. The delay of the excitation pulse is the time from the moment of starting to simulate the virtual wave source to the time of waiting for the excitation pulse to be emitted. When a subarray simulates a virtual wave source, the delay of the excitation pulse of each array element contained in the subarray is not exactly the same.
[0039] The delay of the excitation pulse of an array element is related to the position of the virtual wave source currently simulated by the subarray where the array element is located. When determining the delay, it is first necessary to determine the time when the ultrasonic wave emitted by the virtual wave source reaches each array element, which can be calculated as follows:
[0040] Wherein, i represents the number of the array element, t represents the time required for the virtual wave source to be transmitted to the array element, c represents the sound speed in the imaging area, r represents the position of the array element, and s represents the position of the virtual wave source.
[0041] Then, the excitation pulse delay of each array element can be determined according to the following formula:
[0042] Where, d represents the delay, t min Indicates that all t i The minimum value in .
[0043] It should be noted that in this method, each subarray needs to determine the excitation pulse of each array element contained in the subarray when simulating each virtual wave source; at the same time, each subarray works independently, and the array elements contained in different subarrays do not affect each other.
[0044] S106: for each sub-array, combine the excitation pulses of each array element included in the sub-array in turn, and simulate each virtual wave source in a preset order.
[0045] After determining the excitation pulse of each array element when each sub-array simulates each virtual wave source in step S104, the excitation pulse can be emitted in this step to simulate the virtual wave source.
[0046] Since in this method, different array elements in the array are operated at different times in a time-division multiplexing manner, in this step, only one subarray occupies the channel to work at the same time, that is, after one subarray completes signal transmission and reception, the next subarray starts working, and each subarray operates in turn.
[0047] Compared with the original array, the subarray has a smaller area and the energy of a single excitation emission is lower, resulting in a low signal-to-noise ratio of the echo signal, which may affect the quality of the final image. Therefore, in this method, this problem can be effectively solved by introducing a coded excitation method. The coded excitation method is to extend the duration of the transmission pulse in one transmission, such as combining the pulse excitations of multiple virtual wave sources in sequence to increase the average transmission power and improve the signal-to-noise ratio of the echo signal.
[0048] For any subarray, when it is working, it is necessary to simulate each virtual wave source in a preset order. The preset order is the order of the virtual wave sources set in advance. All virtual wave sources are included in the preset order, and each virtual wave source appears only once. The specific order of each virtual wave source in the preset order can be determined according to specific needs, and this specification does not make specific restrictions on this.
[0049] For example, assuming that there are 15 virtual wave sources in total, and the preset order is virtual wave sources 1, 2, 3, ..., 15, then each subarray, when working, must combine and transmit the corresponding excitation pulses through the array elements contained in the subarray in the order of virtual wave sources 1 to 15, thus completing a coded transmission. Among them, after the simulation of the previous virtual wave source is completed, the simulation of the next virtual wave source will start immediately; the duration of the simulation of each virtual wave source can be set according to specific needs, and this manual does not impose specific restrictions on this.
[0050] More preferably, in the present method, the coding excitation mode can be set to round-robin inversion coding. That is, assuming that the number of virtual wave sources is P, then in the round-robin inversion coding, a total of P coding transmissions are performed, and for the i-th coding transmission, the polarity of the array element excitation pulse corresponding to the i-th virtual wave source is reversed, and the excitation pulses of other virtual wave sources remain unchanged. Specifically, the excitation pulses of each array element included in the subarray can be combined according to the round-robin inversion coding mode, and each virtual wave source can be repeatedly simulated for a specified number of times in a preset order, wherein the signal polarity of the excitation pulses of each array element corresponding to a virtual wave source is reversed each time the simulation is performed.
[0051] Figure 4 This is a schematic diagram of transmitting excitation pulses in a round-robin inversion coding manner provided in this specification. Figure 4 As shown, specifically Figure 4As shown in the figure, it is assumed that three virtual wave sources are set for coded transmission, with their position coordinates s i It means that each subarray is controlled in turn to perform three coded transmissions. For each subarray, the diffusion wave corresponding to s1 is first transmitted with an inverted pulse, and then the diffusion waves corresponding to s2 and s3 are transmitted with a normal pulse. After these transmissions are completed, the collection is performed; in the second transmission, the diffusion waves corresponding to s1, s2, and s3 are transmitted in the same order, but the pulse excitation corresponding to s2 is inverted; in the third transmission, the corresponding diffusion waves are transmitted in the same order as s1, s2, and s3, but the pulse excitation corresponding to s3 is inverted. In the above manner, the transmission and collection of all subarrays are completed.
[0052] S108: Perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each sub-array corresponding to each virtual wave source.
[0053] After completing the transmission of the excitation pulses of the array elements when simulating each virtual wave source in each subarray in step S106, the received echo signals can be processed in this step. Among them, after each subarray completes one coded transmission, that is, after simulating all virtual wave sources once in a preset order, all array elements included in the subarray will receive an echo signal once. For example, assuming that a subarray contains 9 array elements, and the subarray simulates each virtual wave source 5 times in a preset order, then each subarray will receive 9×5=45 echo signals accordingly.
[0054] Since in this method, each coded transmission will simulate all virtual wave sources, each received echo signal will also contain information of all virtual wave sources at the same time. Therefore, it is necessary to consider that the echo signal of coded transmission cannot be directly used for beam synthesis, so decoding operation is required to obtain the echo data corresponding to a single virtual wave source. Decoding is equivalent to the inverse process of coded transmission. Through decoding, echo data with a high signal-to-noise ratio can be obtained.
[0055] Specifically, for each subarray, the echo signal received by the subarray can be Fourier transformed to obtain transformed echo data; based on the transformed echo data, the signal frequency band and angular frequency of the original array, the frequency domain echo data of the subarray corresponding to each virtual wave source can be obtained.
[0056] By performing frequency domain analysis on the echo signal that encodes multiple virtual wave source information, the frequency domain echo data of a single virtual wave source can be obtained. The specific process can be divided into the following three steps: Step 1: Perform time domain Fourier transform on all echo signals to obtain frequency domain signals; Step 2: For each subarray, the frequency domain echo data when the subarray simulates a virtual wave source alone is used as the variable to be solved, and a frequency domain linear equation group is constructed according to the transmission code, where the equation corresponding to the i-th code transmission is as follows:
[0057] Among them, y i represents the frequency domain signal obtained by Fourier transforming the echo signal corresponding to the i-th coded transmission, u i represents the frequency domain echo data corresponding to the ith virtual wave source, and g represents the phase rotation multiplier corresponding to the excitation interval, which is given by the following formula:
[0058] Among them, j is the imaginary unit, ω is the angular frequency, and ΔT is the time interval between consecutive simulations of each virtual wave source (i.e. Figure 4 The time interval between the three stimuli s1, s2, and s3 on the clock sequence, ΔT is generally very small, close to 0).
[0059] Step 3: Solve the linear equations for each frequency within the operating frequency band of the original array to obtain the frequency domain echo data emitted by each virtual wave source in the array. L , f H ], the frequency components of echo data outside this interval are assumed to be 0 and will not be taken into account.
[0060] S110: constructing a target three-dimensional image according to the frequency domain echo data.
[0061] Finally, in this step, frequency domain beam synthesis is performed on each pixel point in the imaging area according to the frequency domain echo data of each subarray corresponding to each virtual wave source obtained in step S108 to construct a target three-dimensional image.
[0062] For any pixel point r in the imaging area, its frequency domain beamforming is given by the following formula:
[0063] Among them, u klp represents the frequency domain echo data received by the lth array element after the pth virtual wave source is transmitted for the kth subarray, τ klp represents the echo delay corresponding to the transmitted pixel r at the lth array element, ω q Represents the qth angular frequency point.
[0064] When using the three-dimensional imaging method for ultrasonic two-dimensional phased array provided in this specification to construct a target three-dimensional image, based on the idea of time-division multiplexing, the original array is divided into multiple sub-arrays, each sub-array successively simulates different virtual wave sources in a coded transmission manner, and performs frequency domain analysis on the collected echo signals, and constructs the target three-dimensional image based on the obtained frequency domain echo data. This method uses time-division multiplexing to control a high-element array with a low number of channels for imaging, effectively controlling the overall cost of the system; the high frame rate of imaging is ensured by the diffusion wave emission and beam synthesis of the virtual wave source; the average energy of the sub-array emission is increased by coded excitation, ensuring the signal-to-noise ratio of the sub-array acquisition; at the same time, frequency domain decoding and beam synthesis are performed within the working frequency band of the original array, greatly simplifying the calculation process.
[0065] The above is the three-dimensional imaging method provided in this specification. Based on the same idea, this specification also provides a corresponding three-dimensional imaging device, such as Figure 5 shown.
[0066] Figure 5 A schematic diagram of a three-dimensional imaging device provided in this specification specifically includes: A division module 200 is used to divide an original array including a plurality of array elements into a plurality of sub-arrays, wherein both the original array and the sub-arrays are two-dimensional arrays; A first determination module 202 is used to determine the number of virtual wave sources and the position of each virtual wave source according to the information of the imaging target and the imaging requirements; The second determination module 204 is used to determine, for each virtual wave source, an excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source; The simulation module 206 is used to combine the excitation pulses of each array element included in each sub-array in turn, and simulate each virtual wave source in a preset order; The analysis module 208 is used to perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each sub-array corresponding to each virtual wave source; The construction module 210 is used to construct a target three-dimensional image according to the frequency domain echo data.
[0067] Optionally, each array element included in the original array exists in only one sub-array after division, and the sub-arrays do not include overlapping parts.
[0068] Optionally, the sizes of the sub-arrays obtained by dividing the original array are the same.
[0069] Optionally, the first determination module 202 is specifically configured to determine the number of virtual wave sources according to an imaging depth, an imaging frame rate, and an average sound velocity in an imaging area of a target three-dimensional image to be constructed.
[0070] Optionally, the second determination module 204 is specifically configured to determine, for each sub-array, a size and a delay of an excitation pulse of each array element included in the sub-array when simulating the virtual wave source.
[0071] Optionally, the simulation module 206 is specifically used to combine the excitation pulses of each array element included in the subarray according to the round-robin inversion coding method, and repeatedly simulate each virtual wave source for a specified number of times according to a preset order, wherein the signal polarity of the excitation pulses of each array element corresponding to a virtual wave source is reversed each time the simulation is performed.
[0072] Optionally, the analysis module 208 is specifically configured to perform Fourier transform on the echo signal received by each subarray to obtain transformed echo data; and obtain frequency domain echo data of the subarray corresponding to each virtual wave source according to the transformed echo data and the signal frequency band and angular frequency of the original array.
[0073] This specification also provides a computer-readable storage medium, which stores a computer program, which can be used to execute the above Figure 1 A three-dimensional imaging method is provided.
[0074] This manual also provides Figure 6 The schematic structure diagram of the electronic device shown in FIG. Figure 6 As mentioned above, at the hardware level, the electronic device includes a processor, an internal bus, a network interface, a memory, and a non-volatile memory, and may also include other hardware required for the business. The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it to achieve the above Figure 1 Of course, in addition to the software implementation, this specification does not exclude other implementations, such as logic devices or a combination of software and hardware, etc., that is, the execution subject of the following processing flow is not limited to each logic unit, but can also be hardware or logic devices.
[0075] For the improvement of a technology, it can be clearly distinguished whether it is a hardware improvement (for example, improvement of the circuit structure of diodes, transistors, switches, etc.) or a software improvement (improvement of the method flow). However, with the development of technology, many improvements of the method flow today can be regarded as direct improvements of the hardware circuit structure. Designers almost always obtain the corresponding hardware circuit structure by programming the improved method flow into the hardware circuit. Therefore, it cannot be said that the improvement of a method flow cannot be implemented with a hardware entity module. For example, a programmable logic device (PLD) (such as a field programmable gate array (FPGA)) is such an integrated circuit whose logical function is determined by the user's programming of the device. Designers can "integrate" a digital system on a PLD by programming themselves, without having to ask chip manufacturers to design and make dedicated integrated circuit chips. Moreover, nowadays, instead of manually making integrated circuit chips, this kind of programming is mostly implemented by "logic compiler" software, which is similar to the software compiler used when developing and writing programs, and the original code before compilation must also be written in a specific programming language, which is called hardware description language (HDL). There is not only one kind of HDL, but many kinds, such as ABEL (Advanced Boolean Expression Language), AHDL (Altera Hardware Description Language), Confluence, CUPL (Cornell University Programming Language), HDCal, JHDL (Java Hardware Description Language), Lava, Lola, MyHDL, PALASM, RHDL (Ruby Hardware Description Language), etc. The most commonly used ones are VHDL (Very-High-Speed Integrated Circuit Hardware Description Language) and Verilog. Those skilled in the art should also know that it is only necessary to program the method flow slightly in the above-mentioned hardware description languages and program it into the integrated circuit, and then it is easy to obtain the hardware circuit that implements the logic method flow.
[0076] The controller may be implemented in any suitable manner, for example, the controller may take the form of a microprocessor or processor and a computer-readable medium storing a computer-readable program code (e.g., software or firmware) executable by the (micro)processor, a logic gate, a switch, an application-specific integrated circuit (ASIC), a programmable logic controller, and an embedded microcontroller, examples of which include but are not limited to the following microcontrollers: ARC 625D, Atmel AT91SAM, Microchip PIC18F26K20, and Silicone Labs C8051F320, and the memory controller may also be implemented as part of the control logic of the memory. It is also known to those skilled in the art that, in addition to implementing the controller in a purely computer-readable program code manner, the controller may be implemented in the form of a logic gate, a switch, an application-specific integrated circuit, a programmable logic controller, and an embedded microcontroller by logically programming the method steps. Therefore, such a controller may be considered as a hardware component, and the devices for implementing various functions included therein may also be considered as structures within the hardware component. Or even, the devices for implementing various functions may be considered as both software modules for implementing the method and structures within the hardware component.
[0077] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.
[0078] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing this specification, the functions of each unit can be implemented in the same or multiple software and / or hardware.
[0079] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.
[0080] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.
[0081] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.
[0082] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.
[0083] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.
[0084] The memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. The memory is an example of a computer-readable medium.
[0085] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.
[0086] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.
[0087] It should be understood by those skilled in the art that the embodiments of this specification may be provided as methods, systems or computer program products. Therefore, this specification may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware. Moreover, this specification may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0088] This specification may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. This specification may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.
[0089] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.
[0090] The above description is only an embodiment of this specification and is not intended to limit this specification. For those skilled in the art, this specification may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification should be included in the scope of the claims of this application.
Claims
1. A three-dimensional imaging method, characterized in that: include: Dividing an original array including a plurality of array elements to obtain a plurality of sub-arrays, wherein both the original array and the sub-arrays are two-dimensional arrays; Determine the number of virtual wave sources and the position of each virtual wave source according to the information of the imaging target and the imaging requirements; For each virtual wave source, determining an excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source; For each sub-array in turn, the excitation pulses of each array element included in the sub-array are combined to simulate each virtual wave source in a preset order; Perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each subarray corresponding to each virtual wave source; A target three-dimensional image is constructed according to the frequency domain echo data.
2. The method according to claim 1, characterized in that Each array element included in the original array exists in only one sub-array after division, and the sub-arrays do not contain overlapping parts.
3. The method according to claim 1, characterized in that The sizes of the sub-arrays obtained by dividing the original array are the same.
4. The method according to claim 1, characterized in that The number of virtual wave sources is determined according to the information of the imaging target and the imaging requirements, including: The number of virtual wave sources is determined according to the imaging depth, imaging frame rate and average sound velocity of the imaging area of the target three-dimensional image to be constructed.
5. The method according to claim 1, characterized in that Determining the excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source specifically includes: For each sub-array, the size and delay of the excitation pulse of each array element included in the sub-array when simulating the virtual wave source are determined.
6. The method according to claim 1, characterized in that Combining the excitation pulses of each array element included in the subarray, simulating each virtual wave source in a preset order, specifically including: The excitation pulses of each array element included in the subarray are combined in a round-robin inversion coding manner, and each virtual wave source is simulated repeatedly for a specified number of times in a preset order, wherein the signal polarity of the excitation pulses of each array element corresponding to a virtual wave source is reversed each time the simulation is performed.
7. The method according to claim 1, characterized in that Perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each subarray corresponding to each virtual wave source, specifically including: For each subarray, performing Fourier transform on the echo signal received by the subarray to obtain transformed echo data; The frequency domain echo data of the sub-array corresponding to each virtual wave source is obtained according to the transformed echo data, the signal frequency band and the angular frequency of the original array.
8. A three-dimensional imaging device, characterized in that: include: A division module, used for dividing an original array including a plurality of array elements into a plurality of sub-arrays, wherein both the original array and the sub-arrays are two-dimensional arrays; A first determination module is used to determine the number of virtual wave sources and the position of each virtual wave source according to the information of the imaging target and the imaging requirements; A second determination module is used to determine, for each virtual wave source, an excitation pulse of each array element included in each subarray when the subarray simulates the virtual wave source; A simulation module, used for combining the excitation pulses of each array element included in each sub-array in turn, and simulating each virtual wave source in a preset order; An analysis module is used to perform frequency domain analysis on the received echo signal to obtain frequency domain echo data of each subarray corresponding to each virtual wave source; A construction module is used to construct a target three-dimensional image according to the frequency domain echo data.
9. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of claims 1 to 7 is implemented.
10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method described in any one of claims 1 to 7 is implemented.
Citation Information
Patent Citations
Millimeter wave near-field holographic fast imaging method and system based on spatial multiplexing
CN114089338A
Area array ultrasonic transducer, ultrasonic imaging method and electronic equipment
CN116671976A
Rotary withdrawing system for three-dimensional imaging and data analysis method thereof
CN117796852A
Subarray forming system and method for ultrasound
US20050192499A1
System and method employing two dimensional ultrasound array for wide field of view imaging
US6238346B1
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