Electronic paper production method

Abstract

A kind of electronic paper production method, including the following steps: A: electronic ink film baking;Electronic ink film is cut to A baking treatment, and electronic ink film moisture content is uniform;During A baking process, humidity is within the set range, and temperature is within the set range;B: fit;Electronic ink film is fit with conductive layer, FPC, and shape A semi-finished product;C: the A semi-finished product after fitting is baked B;During B baking process, humidity is within the set range, and temperature is within the set range;D: module UV glue sealing.The present application, by optimizing process, control electronic paper inner moisture content and uniformity, solve the problem that obvious color difference can appear when the moisture content of variable color electronic paper is low or uneven.

Description

Technical Field

[0001] This application belongs to the field of display device manufacturing, and specifically relates to a method for producing electronic paper. Background Technology

[0002] Color-changing electronic paper is based on dual-color electronic ink technology, which contains two colors of charged particles: one white particle and one colored particle. The colored particle can be black, yellow, green, red, brown, dark blue, or light blue.

[0003] Take black and white dual-color electronic ink as an example. It consists of millions of microcapsules, each containing negatively charged white particles and positively charged black particles, suspended in a transparent liquid. Positive and negative electrodes are mounted on the top and bottom of the electronic ink, respectively.

[0004] The working principle of dual-color electronic ink relies on the electrophoresis of black and white particles under voltage. This electrophoresis controls the positional distribution of the two types of particles within a tiny space, thereby creating different grayscale levels on the screen surface. Using the principle of attraction between positive and negative particles, when an electric field is applied, the corresponding black or white particles move to the top of the microcapsule, allowing the user to see black or white in that area. Other colors of color-changing electronic paper operate on the same principle.

[0005] like Figure 4 and Figure 5 As shown, in a prior art method for preparing electronic paper, electronic ink composed of microcapsules is coated onto a plastic film, namely a PS film, to form an electronic ink film (FPL). During the production process of dual-color-changing electronic paper, an ITO conductive film (ITO FILM) and a PS protective film are attached to both the top and bottom of the electronic ink film. In design and use, it does not rely on a TFT substrate; the upper and lower electrodes alone can control the drive, and designers can cut it into any desired shape.

[0006] In the production process of electronic paper display modules, electronic paper is very sensitive to high temperature and is prone to water loss under high temperature conditions. The electronic ink movement is driven by segmented code driving or full-surface ITO driving. The driving capability is weaker than that of TFT thin film transistors. Therefore, the display effect is greatly affected by moisture. When the moisture content is low or uneven, obvious color difference will appear.

[0007] Definitions:

[0008] FPL is an abbreviation for "Front Plane Lamination". Electronic ink composed of microcapsules is coated onto a plastic film to form an electronic ink film (FPL).

[0009] CG lamination technology mainly includes two implementation methods: OCA lamination and LOCA lamination.

[0010] OCA bonding: using optical clear adhesive (OCA) as adhesive, with high light transmittance and good bonding strength, but higher cost.

[0011] LOCA bonding: using liquid optical clear adhesive (LOCA), with high light transmittance and good bonding performance, relatively low cost, but more process steps and time.

[0012] TFT is the abbreviation of English "Thin Film Transistor", which means thin film field effect transistor; each pixel point on the TFT display is driven by the integrated thin film transistor behind it.

[0013] PET is the abbreviation of English "Polyethylene terephthalate", which means polyester resin film layer.

[0014] IC is the abbreviation of English "Integrated Circuit", which means chip.

[0015] FPC is the abbreviation of English "Flexible Printed Circuit", which means flexible circuit board.

[0016] PS is the abbreviation of English "Polystyrene", which means polystyrene film.

[0017] ITO is the abbreviation of English "Indium Tin Oxide", which means indium tin oxide. In this application, the ITO of the electronic paper module refers to the conductive film layer material of the transparent conductive film shielding glass, mainly ITO (indium tin oxide semiconductor) film. SUMMARY

[0018] The present application optimizes the process, controls the water vapor content and uniformity in the electronic paper, and solves the problem of obvious color difference when the water vapor content of the color-variable electronic paper is low or uneven.

[0019] The technical solution of the present application to solve the above technical problems is an electronic paper production method, comprising the following steps: step A: electronic ink film baking; the cut electronic ink film is subjected to A baking treatment to make the water vapor content of the electronic ink film uniform; during the A baking process, the humidity is within the set range, and the temperature is within the set range; step B: bonding; the electronic ink film is bonded with the conductive layer 、 waterproof layer to form A semi-finished product; step C: B baking treatment is performed on the bonded A semi-finished product; during the B baking process, the humidity is within the set range, and the temperature is within the set range; step D: module UV glue sealing.

[0020] The temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

[0021] The baking time in the A baking process is 72 hours, the temperature is equal to 50 degrees Celsius; and the humidity is equal to 53%.

[0022] The temperature in the B baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

[0023] The baking time in the B baking process is 1 hour, the temperature is equal to 50 degrees Celsius; and the humidity is equal to 53%.

[0024] The step D further comprises a step E of cleaning test.

[0025] The step A comprises a step A10 of cutting the electronic ink film mother sheet to obtain the electronic ink film, and a step A20 of baking the electronic ink film.

[0026] The step B comprises a step B10 of cutting the electronic ink film mother sheet to obtain the electronic ink film, a step B20 of laminating the conductive layer ITO and the waterproof layer with the electronic ink film to form a B semi-finished product, a step B30 of laminating the B semi-finished product with the FPC module to form a C semi-finished product, and a step B40 of performing CG lamination on the C semi-finished product to form an A semi-finished product.

[0027] The step D comprises a step D10 of applying UV glue to the edge points of the A semi-finished product, a step D20 of performing high-pressure defoaming after the UV glue is applied to remove air bubbles in the UV glue, and a step D30 of ultraviolet curing.

[0028] In the step D20, the high-pressure defoaming is performed at a pressure of 0.5 Mpa, a temperature of 25 degrees Celsius, and for 10 minutes.

[0029] One of the beneficial effects of the technical solution in the present application is that the A baking process makes the water vapor content of the electronic ink film uniform, and the baking at the set temperature and humidity before lamination ensures that the moisture in the electronic ink film is not lost.

[0030] One of the beneficial effects of the technical solution in the present application is that the B baking process ensures that the moisture in the electronic ink film of the A semi-finished product is not lost.

[0031] One of the beneficial effects of the technical solution in the present application is that the combination of the two baking processes timely remedies the link that may cause moisture loss in the production process, and can keep the moisture in the electronic ink film from being lost as much as possible.

[0032] One of the beneficial effects of the technical solutions in the present application is that the A baking setting temperature and humidity range is suitable for keeping the moisture in the electronic ink film.

[0033] One of the beneficial effects of the technical solutions in the present application is that the A baking setting time is long enough to ensure that the moisture in the electronic ink film can be kept and supplemented.

[0034] One of the beneficial effects of the technical solutions in the present application is that the B baking setting temperature and humidity range is suitable for keeping the moisture in the electronic ink film.

[0035] One of the beneficial effects of the technical solutions in the present application is that the B baking setting time is appropriate, which ensures that the moisture in the electronic ink film can be kept and supplemented and also ensures the reliability of the bonding.

[0036] One of the beneficial effects of the technical solutions in the present application is that the cleaning test can ensure cleanliness and show normality.

[0037] One of the beneficial effects of the technical solutions in the present application is that the electronic ink film is baked after cutting to ensure that the moisture in the electronic ink film after cutting is not lost.

[0038] One of the beneficial effects of the technical solutions in the present application is that the A semi-finished product edge point UV glue further ensures that the moisture in the electronic ink film is not lost.

[0039] One of the beneficial effects of the technical solutions in the present application is that after the UV glue, high-pressure defoaming is performed to remove bubbles in the UV glue; ultraviolet light curing ensures complete curing and sealing, and keeps the moisture in the electronic ink film from being lost.

[0040] One of the beneficial effects of the technical solutions in the present application is that the pressure condition of high-pressure defoaming is suitable for defoaming and does not have a negative impact on other structures, and can balance the connection reliability of each component. BRIEF DESCRIPTION OF DRAWINGS

[0041] Figure 1 is a flowchart of an electronic paper production method;

[0042] Figure 2 is a flowchart of an electronic paper production method;

[0043] Figure 3 is a flowchart of an electronic paper production method;

[0044] Figure 4 is a flowchart of an existing electronic paper production method;

[0045] Figure 5 is a structural diagram of an electronic paper. DETAILED DESCRIPTION

[0046] The embodiments of the present application will be described below in further detail in conjunction with the accompanying drawings.

[0047] It should be noted that the following is a description of the preferred embodiments of the present application and does not constitute any limitation on the present application. The description of the preferred embodiments of the present application is only as a description of the general principles of the present application. The embodiments described in the present application are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0048] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, and the like, as well as numbers such as "A" and "B", are only for the purpose of description, for the convenience of explanation, and do not represent the chronological or spatial sequence; cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second", and technical features numbered with Arabic numerals 1, 2, 3, and the like can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "several" is two or more, unless otherwise specifically limited.

[0049] As Figure 4 shown, the electronic paper in the prior art usually adopts the electronic paper preparation method as Figure 5 shown. Figure 5 In the method shown, the cutting and lamination processes are completed under different environmental and tool conditions, and the environmental temperature may vary or fluctuate.

[0050] In the production process of the electronic paper display module, the electronic paper is very sensitive to high temperature and is prone to water loss under high temperature. The driving ability of the segmented code driving or the whole ITO driving for driving the electronic ink movement is weaker than the TFT thin film transistor, so the display effect is greatly affected by water vapor. When the water vapor content is low or uneven, obvious color difference will occur.

[0051] How to solve the problem of water loss and color difference caused by water loss in the production process of the electronic paper display module is a problem to be solved in the production method of the electronic paper.

[0052] In an embodiment of the electronic paper production method, the method comprises the following steps: A: baking the electronic ink film; B: laminating the electronic ink film with the conductive layer and the waterproof layer to form a semi-finished product A; C: baking the semi-finished product A; and D: sealing the module with UV glue. Figure 1 In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%.

[0053] Figure 3 In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%.

[0054] In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%. Figure 3 In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%.

[0055] Figure 3 In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%.

[0056] In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%. Figure 3 In an embodiment of the electronic paper production method, the temperature in the A baking process is greater than 45 degrees Celsius and less than 60 degrees Celsius, and the humidity is greater than 45% and less than 60%.

[0057] Figure 2 In an embodiment of the electronic paper production method, the method further comprises the following step E: cleaning test after step D.

[0058] In an embodiment of the electronic paper production method, step A comprises the following steps: A10: cutting the electronic ink film mother sheet to obtain the electronic ink film; and A20: baking the electronic ink film. Figure 3 In an embodiment of the electronic paper production method, step B comprises the following steps: B10: cutting the electronic ink film mother sheet to obtain the electronic ink film; B20: laminating the conductive layer ITO with the electronic ink film to form a semi-finished product B; B30: laminating the semi-finished product B with the FPC module to form a semi-finished product C; and B40: performing CG lamination on the semi-finished product C to form the semi-finished product A.

[0059] Figure 3 In an embodiment of the electronic paper production method, step B comprises the following steps: B10: cutting the electronic ink film mother sheet to obtain the electronic ink film; B20: laminating the conductive layer ITO with the electronic ink film to form a semi-finished product B; B30: laminating the semi-finished product B with the FPC module to form a semi-finished product C; and B40: performing CG lamination on the semi-finished product C to form the semi-finished product A.

[0060] In an embodiment of the electronic paper production method, step B comprises the following steps: B10: cutting the electronic ink film mother sheet to obtain the electronic ink film; B20: laminating the conductive layer ITO with the electronic ink film to form a semi-finished product B; B30: laminating the semi-finished product B with the FPC module to form a semi-finished product C; and B40: performing CG lamination on the semi-finished product C to form the semi-finished product A. Figure 3 ​​​​In an embodiment of the electronic paper production method, the step D comprises: step D10, UV glue is applied to the edge points of the A semi-finished product; step D20, after the UV glue is applied, high-pressure defoaming is performed to remove the bubbles in the UV glue; and step D30, UV curing.

[0061] As Figure 3 In an embodiment of the electronic paper production method, in the step D20, the pressure of the vacuum defoaming is 0.5 Mpa, the temperature is 25 degrees Celsius, and the time is 10 minutes.

[0062] In the production process of the electronic paper display module, the electronic paper is very sensitive to high temperature, and is prone to water loss under high temperature. The prism product uses segmented segment code driving or full-surface ITO driving to drive the movement of the electronic ink, and the driving capacity is weaker than the TFT thin film transistor. Therefore, the display effect is greatly affected by water vapor, and obvious color difference may occur when the water vapor content is low or uneven.

[0063] The present process optimizes the display effect of the prism product by optimizing the process parameters and flow, and controlling the water vapor content and uniformity in the electronic paper.

[0064] The original process flow and parameters are: electronic paper cutting → electronic paper attachment (room temperature) → back hot melt film attachment (room temperature) → FPC bonding → CG lamination (room temperature) → hot glue application → defoaming and curing (65°C, 0.5 Mpa, 80 min) → product cleaning / testing.

[0065] The optimized process flow and parameters are: electronic paper cutting → electronic paper baking (50°C, 53% RH, 72H) → electronic paper attachment (room temperature) → back hot melt film attachment (room temperature) → FPC bonding → CG lamination (room temperature) → baking (50°C, 53% RH, 1H) → UV glue application → defoaming (25°C, 0.5 Mpa, 10 min) → UV curing → product cleaning / testing. The optimized process is as follows: electronic paper baking (50°C, 53% RH, 72H): pretreat the electronic paper before operation to make the water vapor content of the electronic paper uniform; baking (50°C, 53% RH, 1H): the UV glue applied before is supplemented with water vapor lost during the operation; UV glue application: the waterproof glue is changed from hot glue to UV glue to solve the loss of water vapor in the electronic paper during the hot curing process.

[0066] As shown in the drawings, the above only describes the embodiments of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent flow transformation using the content of the application description and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An electronic paper production method characterized by, Comprising Step A: electronic ink film baking; the cut electronic ink film is subjected to A baking treatment, so that the electronic ink film moisture content is uniform; during the A baking process, the humidity is within the set range, and the temperature is within the set range; Step B: lamination; the electronic ink film is laminated with the conductive layer and the waterproof layer to form A semi-finished product; Step C: the A semi-finished product after lamination is subjected to B baking treatment; during the B baking process, the humidity is within the set range, and the temperature is within the set range; Step D: module UV glue sealing; During the A baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%. During the B baking process, the temperature is greater than 45 degrees Celsius and less than 60 degrees Celsius; the humidity is greater than 45% and less than 60%.

2. The electronic paper production method according to claim 1, wherein During the A baking process, the baking time is 72 hours, and the temperature is equal to 50 degrees Celsius; the humidity is equal to 53%.

3. The electronic paper production method according to claim 1, wherein During the B baking process, the baking time is 1 hour, the temperature is equal to 50 degrees, and the humidity is equal to 53%.

4. The electronic paper production method of claim 1, wherein After the step D, it further comprises a step E: cleaning test.

5. The electronic paper production method of claim 1, wherein The step A comprises: Step A10: cutting the electronic ink film mother sheet to obtain an electronic ink film; Step A20: baking the electronic ink film.

6. The electronic paper production method of claim 1, wherein The step B comprises: Step B10: cutting the electronic ink film mother sheet to obtain an electronic ink film; Step B20: laminating the conductive layer ITO with the electronic ink film to form a B semi-finished product; Step B30: laminating the B semi-finished product with the FPC module to form a C semi-finished product; Step B40: performing CG lamination on the C semi-finished product to form an A semi-finished product.

7. The electronic paper production method of claim 1, wherein The step D comprises: Step D10: UV glue for the edge points of the A semi-finished product; Step D20: after the point UV glue, high-pressure defoaming is performed to remove the air bubbles in the UV glue; Step D30: ultraviolet light curing.

8. The electronic paper production method of claim 7, wherein In the step D20, the pressure of the high-pressure defoaming is 0.5 Mpa, the temperature is 25 degrees Celsius, and the time is 10 minutes.

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