Pulse tube type Stirling refrigeration system and heat dissipation method thereof

Abstract

The invention discloses a pulse tube type Stirling refrigeration system and a heat dissipation method thereof, belongs to the field of full-ruggedized computers, and is applied to heat dissipation of the full-ruggedized computer, the full-ruggedized computer comprises a case, a chip module and a heat pipe module are arranged in the case, and the chip module comprises a CPU, a memory, a GPU and a bridge piece. The pulse tube type Stirling refrigeration system comprises a compressor, a heat regenerator, a cold end heat exchanger, a pulse tube and a hot end heat exchanger which are connected in sequence, and the heat tube module is arranged on the inner wall of the case; the cold end heat exchanger is provided with a heat conduction cold plate, the CPU, the memory and the GPU are all arranged on the heat conduction cold plate, the hot end heat exchanger is connected with the heat pipe module, and the bridge piece is arranged on the heat pipe module, so that the reliability of the fully ruggedized computer can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of fully reinforced computers, and in particular relates to a pulse tube Stirling refrigeration system and a heat dissipation method thereof. Background Art

[0002] Fully reinforced computers are also called computers that can withstand harsh environments. They have the advantages of strong environmental adaptability, high reliability, and high maintainability. In order to make fully reinforced computers withstand harsh environments such as electromagnetic interference, humidity, salt spray, and mold, they are usually designed to be completely enclosed. However, when the fully reinforced computer is an enclosed structure, the heat dissipation effect of the components inside the fully reinforced computer will be greatly affected.

[0003] In order to improve the heat dissipation effect of each component inside a fully reinforced computer, it is usually necessary to install a refrigeration system in the fully reinforced computer. The most common refrigeration system at present is an air cooling system. The fully reinforced computer includes a chassis and components arranged in the chassis, such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), etc. The air cooling system includes a fan and air holes arranged on the chassis shell. The fan guides the air flow through the air holes to flow in the chassis, which can achieve heat dissipation of the components. However, when adopting this structure, it is necessary to open air holes on the chassis shell, which reduces the airtightness of the fully reinforced computer, thereby affecting the reliability of the fully reinforced computer. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a pulse tube Stirling refrigeration system and a heat dissipation method thereof. The technical problem to be solved by the present invention is achieved by the following technical solutions:

[0005] In a first aspect, the present invention provides a pulse-tube Stirling refrigeration system, which is applied to heat dissipation of a fully reinforced computer. The fully reinforced computer includes a chassis, a chip module and a heat pipe module are arranged in the chassis, the chip module includes a CPU, a memory, a GPU and a bridge chip, the pulse-tube Stirling refrigeration system includes a compressor, a regenerator, a cold end heat exchanger, a pulse tube and a hot end heat exchanger connected in sequence, and the heat pipe module is arranged on the inner wall of the chassis;

[0006] A heat-conducting cold plate is provided on the cold-end heat exchanger, and the CPU, memory and GPU are all arranged on the heat-conducting cold plate. The hot-end heat exchanger is connected to the heat pipe module, and the bridge plate is arranged on the heat pipe module.

[0007] In one embodiment of the present invention, the cold end heat exchanger includes a cold end shell, the cold end shell has an inlet end and an outlet end, the inlet end is connected to the regenerator, the outlet end is connected to the pulse tube, and an expansion chamber and an airflow chamber are provided in the cold end shell, the expansion chamber is used to expand the gas input from the regenerator, and the airflow chamber is used to connect the inlet end and the outlet end;

[0008] There are multiple expansion chambers, which are arranged in sequence from the inlet end to the outlet end. Each expansion chamber is provided with a solenoid valve, which is used to control the expansion chamber to open or close.

[0009] In one embodiment of the present invention, the memory, the CPU and the GPU are arranged in sequence along the first direction, and the inlet and the outlet are arranged in sequence along the first direction;

[0010] There are eight expansion chambers, the memory corresponds to one expansion chamber, the CPU corresponds to three expansion chambers, and the GPU corresponds to four expansion chambers.

[0011] In one embodiment of the present invention, a temperature sensor and a temperature control module are further provided in the chassis, the temperature sensor and the temperature control module are electrically connected, the solenoid valves in the eight expansion chambers are electrically connected to the temperature control module, and the temperature sensor is provided on a heat-conducting cold plate;

[0012] The temperature control module is used to control the activation of the solenoid valves in the eight expansion chambers according to the temperatures of the memory, CPU and GPU.

[0013] In one embodiment of the present invention, it also includes a gas reservoir and a Laval nozzle for forming small holes, one end of the Laval nozzle is connected to the pulse tube, and the other end is connected to the hot end heat exchanger, and the gas reservoir and the Laval nozzle are arranged on both sides of the hot end heat exchanger.

[0014] In one embodiment of the present invention, the hot end heat exchanger includes a hot end housing, a heat conducting plate is provided between the hot end housing and the heat pipe module, the heat conducting plate is detachably connected to the hot end housing, the heat pipe module is mounted on the heat conducting plate, and a heat conducting gasket is further provided between the heat pipe module and the heat conducting plate;

[0015] The hot end shell is provided with an air inlet and an air outlet. The air inlet is connected with the Laval nozzle, the air outlet is connected with the air reservoir, and a sealing sleeve is provided at the air inlet.

[0016] In one embodiment of the present invention, the chassis includes a top plate and a cover plate, the heat pipe module is arranged on the inner surface of the top plate, the outer surface of the top plate is provided with a heat dissipation module, the heat dissipation module includes a turbo fan and a heat dissipation fin group, the heat dissipation fin group includes a plurality of fins parallel to each other, the heat dissipation fin group is arranged between the top plate and the cover plate, and a heat dissipation channel is formed between the top plate, the cover plate and two adjacent fins;

[0017] The fins are Z-shaped fins.

[0018] In one embodiment of the present invention, the heat pipe module includes a plurality of mutually parallel heat dissipation copper tubes, which are welded to the inner surface of the top plate, and one end of each heat dissipation copper tube is connected to the hot end heat exchanger. A heat pipe fixing frame is also provided in the chassis, and the heat pipe fixing frame and the inner surface of the top plate are detachably connected, and the plurality of heat dissipation copper tubes are clamped between the heat pipe fixing frame and the top plate.

[0019] In one embodiment of the present invention, the cold end heat exchanger is arranged along the width direction of the chassis, the hot end heat exchanger is arranged along the length direction of the chassis, the pulse tube is an L-shaped tube, the L-shaped tube includes a vertical section and a horizontal section, one end of the vertical section is connected to the cold end heat exchanger, the other end of the vertical section is connected to one end of the horizontal section, and the other end of the horizontal section is connected to the hot end heat exchanger;

[0020] A pulse tube mounting frame is also arranged in the chassis. The pulse tube mounting frame and the inner wall of the chassis are detachably connected. The pulse tube clamp is arranged between the pulse tube mounting frame and the inner wall of the chassis.

[0021] In a second aspect, the present invention further provides a heat dissipation method of a pulse-tube Stirling refrigeration system, which is applied to a pulse-tube Stirling refrigeration system as provided in the above scheme, wherein the pulse-tube Stirling refrigeration system is applied to a fully reinforced computer, wherein the fully reinforced computer comprises a chassis, wherein a chip module is arranged in the chassis, wherein the chip module comprises a CPU, a memory, a GPU and a bridge chip, wherein the pulse-tube Stirling refrigeration system comprises a cold-end heat exchanger, wherein the cold-end heat exchanger comprises a cold-end shell, wherein eight expansion chambers are arranged in the cold-end shell, wherein each expansion chamber is provided with a solenoid valve, wherein the solenoid valve is used to control the expansion chamber to be opened or closed, wherein the memory corresponds to one expansion chamber, the CPU corresponds to three expansion chambers, and the GPU corresponds to four expansion chambers, wherein a temperature control module is further arranged in the chassis, and wherein the solenoid valves in the eight expansion chambers are electrically connected to the temperature control module;

[0022] Methods include:

[0023] When the temperature of the storage device is higher than 70°C, the temperature control module controls the solenoid valve in the expansion chamber corresponding to the storage device to open;

[0024] When the temperature of the CPU is 70℃~80℃, the temperature control module controls the electromagnetic valve in the expansion chamber in the middle position among the three expansion chambers corresponding to the CPU to open;

[0025] When the temperature of the CPU is 80℃~90℃, the temperature control module controls the electromagnetic valves in the two expansion chambers on both sides of the three expansion chambers corresponding to the CPU to open;

[0026] When the temperature of the CPU is greater than or equal to 90°C, the temperature control module controls the solenoid valves in the three expansion chambers corresponding to the CPU to open;

[0027] When the temperature of the GPU is 70°C to 80°C, the temperature control module controls the solenoid valve in one of the two expansion cavities in the middle of the four expansion cavities corresponding to the GPU to open;

[0028] When the temperature of the GPU is 80°C to 90°C, the temperature control module controls the solenoid valves in the two expansion chambers in the middle of the four expansion chambers corresponding to the GPU to open;

[0029] When the temperature of the GPU is greater than or equal to 90° C., the temperature control module controls the solenoid valves in the four expansion chambers corresponding to the GPU to open.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] In the above scheme of the present application, the fully reinforced computer includes a chassis, a chip module and a heat pipe module are arranged in the chassis, the chip module includes a CPU, a memory, a GPU and a bridge chip, and the pulse tube type Stirling refrigeration system includes a compressor, a regenerator, a cold end heat exchanger, a pulse tube and a hot end heat exchanger connected in sequence; a heat conduction cold plate is arranged on the cold end heat exchanger, the CPU, the memory and the GPU are all arranged on the heat conduction cold plate, the hot end heat exchanger and the heat pipe module are connected, and the bridge chip is arranged on the heat pipe module. With this structure, high-pressure gas is transported to the regenerator through the compressor, and heat exchange and circulation are realized through the regenerator, wherein the gas can absorb the heat emitted by the chip module when passing through the cold end heat exchanger to cool the chip module, and when the gas flows to the hot end heat exchanger through the pulse tube, the heat can be conducted to the outside of the box through the heat pipe module, so that cooling can be realized through the pulse tube type Stirling refrigeration system, and the heat dissipation effect of the fully reinforced computer is improved. In the above scheme of the present application, heat is conducted to the inner wall of the chassis through a pulse tube Stirling cooling system and a heat pipe module, and heat is simultaneously conducted out of the chassis by heat conduction, so that there is no need to open air holes on the chassis, thereby improving the airtightness of the chassis and further improving the reliability of the fully reinforced computer.

[0032] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic diagram of the interior of a chassis in an embodiment of the present invention;

[0034] Figure 2 Schematic diagram of a turbo fan and a heat dissipation fin assembly outside a chassis in an embodiment of the present invention;

[0035] Figure 3 is a cross-sectional view of the cold end heat exchanger in an embodiment of the present invention Figure 1 ;

[0036] Figure 4is a cross-sectional view of the cold end heat exchanger in an embodiment of the present invention Figure 2 ;

[0037] Figure 5 2 is a cross-sectional view of a hot end heat exchanger in an embodiment of the present invention.

[0038] Figure markings: 1-chassis, 2-power module, 3-fan mounting slot, 4-compressor, 5-temperature control module, 6-heat regenerator, 7-memory, 8-CPU, 9-GPU, 10-inlet end, 11-cold end heat exchanger, 12-PCB board, 13-heat pipe fixing frame, 14-bridge, 15-heat pipe module, 16-pulse tube, 17-Laval nozzle, 18-hot end heat exchanger, 19-gas reservoir, 20-turbofan, 21-heat dissipation fin group, 22-cover plate, 23-pulse tube fixing frame, 111-expansion chamber, 112-chamber wall, 113-solenoid valve, 114-air flow chamber, 115-temperature sensor, 116-wire trough, 117-heat conduction cold plate, 181-heat conduction plate, 182-air inlet, 183-sealing sleeve. DETAILED DESCRIPTION

[0039] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0040] Embodiment 1:

[0041] See also Figure 1 and Figure 2 The embodiment of the present invention provides a pulse tube 16 Stirling refrigeration system, which is applied to the heat dissipation of a fully reinforced computer. The fully reinforced computer includes a chassis 1, in which a chip module and a heat pipe module 15 are arranged. The chip module includes a CPU 8, a memory 7, a GPU 9 and a bridge 14. The pulse tube 16 Stirling refrigeration system includes a compressor 4, a heat regenerator 6, a cold end heat exchanger 11, a pulse tube 16 and a hot end heat exchanger 18 connected in sequence. The heat pipe module 15 is arranged on the inner wall of the chassis 1; a heat conduction cold plate 117 is arranged on the cold end heat exchanger 11, and the CPU 8, the memory 7 and the GPU 9 are all arranged on the heat conduction cold plate 117. The hot end heat exchanger 18 is connected to the heat pipe module 15, and the bridge 14 is arranged on the heat pipe module 15.

[0042] In some embodiments of the present application, CPU8 (Central Processing Unit) is the core component of the computer system, responsible for interpreting and executing computer instructions, processing data, and controlling the operation of other hardware devices.

[0043] In some embodiments of the present application, the memory 7 is used to store various data during the operation of the fully reinforced computer. In this embodiment, the memory 7 is DDR4.

[0044] In some embodiments of the present application, GPU9 (Graphics Processing Unit) is a processor specially designed for efficiently processing images and graphics operations.

[0045] In some embodiments of the present application, Figure 1 As shown, there are 12 memories 7, among which 4 memories 7 are located on the upper side of CPU 8, 4 memories 7 are located on the left side of CPU 8, 4 memories 7 are located on the right side of CPU 8, and GPU 9 is located on the lower side of CPU 8.

[0046] In some embodiments of the present application, the bridge chip 14 refers to a chip that directly interacts with the CPU 8 on the mainboard to build a bridge for exchanging data and instructions.

[0047] In some embodiments of the present application, the chassis 1 includes a bottom plate, an annular side plate and a top plate, and the two axial side surfaces of the annular side plate are respectively connected to the bottom plate and the top plate, and the bottom plate, the annular side plate and the top plate together form a accommodating cavity, and the chip module, the heat pipe module 15, the compressor 4, the heat regenerator 6, the cold end heat exchanger 11, the pulse tube 16 and the hot end heat exchanger 18 are all arranged in the accommodating cavity.

[0048] In some embodiments of the present application, a PCB board 12 is provided in the chassis 1, and the CPU 8, the memory 7, the GPU 9 and the bridge 14 are all arranged on the PCB board 12. Since the heights of the various electronic components arranged on the PCB board 12 are different, the heat-conducting cold plate 117 needs to be customized with multiple protrusions according to the specific chip arrangement so that it can fit each component tightly. A heat-conducting pad with a high thermal conductivity is placed at the fitting position. The contact surface of the heat-conducting cold plate 117 and the cold-end heat exchanger 11 is a flat design, with the same area as the cold-end heat exchanger 11, and can completely overlap. A heat-conducting pad with a high thermal conductivity is also attached between the two. The pulse tube 16 between the cold-end heat exchanger 11 and the hot-end heat exchanger 18 is arranged in a reserved space and fixed by a pulse tube fixing frame 23. The hot-end heat exchanger 18 is arranged far away from the chip unit. With this structure, firstly, the pulse tube 16 is relatively long and can complete the heat conversion to the greatest extent. Secondly, the high temperature of the hot-end heat exchanger 18 will not have thermal radiation and other effects on the chip unit. The four corners of the hot end heat exchanger 18 are fixed to the inner wall of the chassis 1 by bolts.

[0049] In some embodiments of the present application, a power supply module 2 for supplying power is also provided inside the chassis 1 .

[0050] In the above scheme of the present application, the fully reinforced computer includes a chassis 1, in which a chip module and a heat pipe module 15 are arranged, the chip module includes a CPU 8, a memory 7, a GPU 9 and a bridge chip 14, and the pulse tube 16-type Stirling refrigeration system includes a compressor 4, a heat regenerator 6, a cold-end heat exchanger 11, a pulse tube 16 and a hot-end heat exchanger 18 connected in sequence; a heat-conducting cold plate 117 is provided on the cold-end heat exchanger 11, the CPU 8, the memory 7 and the GPU 9 are all arranged on the heat-conducting cold plate 117, the hot-end heat exchanger 18 is connected to the heat pipe module 15, and the bridge chip 14 is arranged on the heat pipe module 15. With this structure, high-pressure gas is delivered to the regenerator 6 through the compressor 4, and heat exchange and circulation are achieved through the regenerator 6, wherein the gas can absorb the heat emitted by the chip module to cool the chip module when passing through the cold-end heat exchanger 11, and when the gas flows to the hot-end heat exchanger 18 through the pulse tube 16, the heat can be conducted to the outside of the box through the heat pipe module 15, so that refrigeration can be achieved through the pulse tube 16 Stirling refrigeration system, thereby improving the heat dissipation effect of the fully reinforced computer. In the above scheme of the present application, heat is conducted to the inner wall of the chassis 1 through the pulse tube 16 Stirling refrigeration system and the heat pipe module 15, and heat is conducted to the outside of the chassis 1 by heat conduction, so that there is no need to open air holes on the chassis 1, thereby improving the airtightness of the chassis 1, and further improving the reliability of the fully reinforced computer.

[0051] In some embodiments of the present application, Figure 3 and Figure 4 As shown, the cold end heat exchanger 11 includes a cold end shell, which has an inlet end 10 and an outlet end. The inlet end 10 is connected to the regenerator 6, and the outlet end is connected to the pulse tube 16. An expansion chamber 111 and an airflow chamber 114 are provided in the cold end shell. The expansion chamber 111 is used to expand the gas input from the regenerator 6, and the airflow chamber 114 is used to connect the inlet end 10 and the outlet end. There are multiple expansion chambers 111, and the multiple expansion chambers 111 are arranged in sequence from the inlet end 10 to the outlet end. Each expansion chamber 111 is provided with a solenoid valve 113, and the solenoid valve 113 is used to control the opening or closing of the expansion chamber 111. With this structure, the gas can expand in the expansion chamber 111 and generate pulsation. When the gas expands in the expansion chamber 111, the distance between the gas molecules increases, the interaction force between the molecules is weakened, resulting in a decrease in the internal energy of the gas molecules, thereby absorbing the heat of the surrounding environment and achieving a cooling effect. The airflow chamber 114 is always connected to ensure the stable operation of the pulse tube 16 type Stirling refrigeration system. Furthermore, by controlling the expansion of the multiple expansion chambers 111 respectively through the multiple solenoid valves 113, the gas can be expanded in different regions, so that the heat absorption position of the cold end heat exchanger 11 can be accurately controlled to improve the heat dissipation efficiency.

[0052] In some embodiments of the present application, Figure 3 and Figure 4As shown, the expansion chamber 111 includes two chamber walls 112, and the upper and lower surfaces of the cold end shell are provided with wire grooves 116. The upper and lower sides of the chamber wall 112 are respectively installed in the two wire grooves 116 on the upper and lower surfaces of the cold end shell, and solenoid valves 113 are provided on the left and right sides of the chamber wall 112.

[0053] The pulsating airflow in the pulsating Stirling refrigeration system in the embodiment of the present application can transfer heat faster and more efficiently. Compared with traditional heat dissipation methods, under high load and high power conditions, local heat accumulation will not occur around the chip. The cold end heat exchanger 11 in the embodiment of the present application adopts a distributed expansion chamber 111 to perform dynamic heat dissipation adjustment under the control of the temperature control module 5. The pulsating Stirling refrigeration system in the embodiment of the present application has the advantages of high reliability, long life and high maintainability, and the heat transfer path of the structure is simple without introducing more heat transfer modules. In complex military application environments, the pulsating Stirling refrigeration system itself has no piston structure, runs more smoothly, has no vibration and noise, does not cause device wear, and has a longer service life.

[0054] In some embodiments of the present application, the memory 7, CPU 8 and GPU 9 are sequentially arranged along the first direction, and the inlet end 10 and the outlet end are sequentially arranged along the first direction; there are eight expansion chambers 111, the memory 7 corresponds to one expansion chamber 111, the CPU 8 corresponds to three expansion chambers 111, and the GPU 9 corresponds to four expansion chambers 111. With this structure, the expansion chambers 111 corresponding to the memory 7, CPU 8 and GPU 9 can be controlled to expand respectively, so that the memory 7, CPU 8 and GPU 9 can achieve independent heat dissipation, and at the same time, the heat dissipation efficiency of the memory 7, CPU 8 and GPU 9 can be improved.

[0055] In some embodiments of the present application, the first direction is the width direction of the chassis 1 .

[0056] In some embodiments of the present application, a temperature sensor 115 and a temperature control module 5 are also provided in the chassis 1. The temperature sensor 115 and the temperature control module 5 are electrically connected. The solenoid valves 113 in the eight expansion chambers 111 are all electrically connected to the temperature control module 5. The temperature sensor 115 is arranged on the heat-conducting cold plate 117. The temperature control module 5 is used to control the activation of the solenoid valves 113 in the eight expansion chambers 111 according to the temperatures of the memory 7, the CPU 8 and the GPU 9. With this structure, the temperature sensor 115 can detect the temperatures of the memory 7, the CPU 8 and the GPU 9, and the solenoid valves 113 in the eight expansion chambers 111 can be accurately controlled to be activated by the temperature control module 5, so that the expansion time of the eight expansion chambers 111 can be accurately controlled, further improving the efficiency of heat dissipation.

[0057] In some embodiments of the present application, three temperature sensors 115 may be provided, and the three temperature sensors 115 are respectively provided below the memory 7, CPU 8 and GPU 9, so as to accurately detect the temperatures of the memory 7, CPU 8 and GPU 9.

[0058] In some embodiments of the present application, the pulse tube 16 type Stirling refrigeration system further includes an air reservoir 19 and a Laval nozzle 17 for forming a small hole, one end of the Laval nozzle 17 is connected to the pulse tube 16, and the other end is connected to the hot end heat exchanger 18, and the air reservoir 19 and the Laval nozzle 17 are arranged on both sides of the hot end heat exchanger 18. With this structure, the air reservoir 19 and the Laval nozzle 17 can jointly form a phase adjustment structure to adjust the phase difference between the pressure wave and the mass flow at the cold end of the pulse tube 16, thereby generating a refrigeration effect.

[0059] In some embodiments of the present application, the Laval nozzle 17 is also called a gradually converging and widening nozzle, which is a tube that is converging in the middle and has an asymmetric hourglass shape.

[0060] In some embodiments of the present application, the pulse tube 16 Stirling refrigeration system is a small hole pulse tube 16 refrigeration structure. In addition to the small hole pulse tube 16 refrigeration structure, a basic pulse tube 16 Stirling refrigeration structure, a two-way air intake pulse tube 16 Stirling refrigeration structure, an inertial tube Stirling refrigeration structure, and other pulse tube 16 refrigeration structures of other phase adjustment mechanisms can also be used.

[0061] In some embodiments of the present application, the pulse tube 16 Stirling refrigeration system is a split refrigeration system. In addition to the small hole pulse tube 16 refrigeration structure, an integral heat dissipation structure can also be used, such as heat dissipation by a small coaxial Stirling refrigeration method.

[0062] In some embodiments of the present application, Figure 5 As shown, the hot end heat exchanger 18 includes a hot end shell, a heat conducting plate 181 is provided between the hot end shell and the heat pipe module 15, the heat conducting plate 181 is detachably connected to the hot end shell, the heat pipe module 15 is mounted on the heat conducting plate 181, and a heat conducting gasket is provided between the heat pipe module 15 and the heat conducting plate 181; the hot end shell has an air inlet 182 and an air outlet, the air inlet 182 is connected to the Laval nozzle 17, the air outlet is connected to the air reservoir 19, and a sealing sleeve 183 is provided at the air inlet 182. With this structure, the efficiency of heat exchange between the hot end heat exchanger 18 and the heat pipe module 15 can be improved, thereby improving the heat dissipation efficiency of the pulse tube 16 type Stirling refrigeration system.

[0063] In some embodiments of the present application, Figure 2As shown, the chassis 1 includes a top plate and a cover plate 22, a heat pipe module 15 is arranged on the inner surface of the top plate, and a heat dissipation module is arranged on the outer surface of the top plate. The heat dissipation module includes a turbo fan 20 and a heat dissipation fin group 21. The heat dissipation fin group 21 includes a plurality of fins parallel to each other. The heat dissipation fin group 21 is arranged between the top plate and the cover plate 22. A heat dissipation channel is formed between the top plate, the cover plate 22 and two adjacent fins; the fins are Z-shaped fins. With this structure, the hot end heat exchanger 18 can diffuse heat to the heat dissipation fin group 21 of the entire chassis 1 and the outer wall through the heat pipe module 15 on the inner wall of the chassis 1, and finally diffuse it to the external environment. Among them, the two turbo fans 20 outside the chassis 1 can force the airflow to pass through the fin surface, further enhance the heat dissipation, and bring the heat into the environment. In addition, during the heat dissipation process, the temperature control module 5 can dynamically adjust the working frequency and fan speed of the pulse tube 16 type Stirling refrigeration system according to the data collected by the temperature sensor 115.

[0064] In some embodiments of the present application, the temperature control module 5 can set four working modes according to the data collected by the temperature sensor 115. Mode 1: Energy-saving mode. In this mode, the operating frequency of the pulse tube 16 Stirling refrigeration system is set between 20Hz-40Hz, and the turbo fan 20 is turned off. In this mode, heat dissipation is mainly carried out through heat conduction. Mode 2: Working mode. In this mode, the operating frequency of the pulse tube 16 Stirling refrigeration system is set between 40Hz-60Hz, and the turbo fan 20 is turned on. The specific speed can be controlled by PID, fuzzy and other control algorithms. Mode 3: Enhanced heat dissipation mode. In this mode, the operating frequency of the pulse tube 16 Stirling refrigeration system is set between 60Hz-80Hz, and the turbo fan 20 is turned on. Mode 4: Overload protection mode. In this mode, the pulse tube 16 Stirling refrigeration system and the turbo fan 20 are both set to the maximum operating frequency.

[0065] It can be understood that compared with the heat conduction path inside a conventional fully enclosed reinforced computer, after the chip unit inside the fully reinforced computer of the present application generates heat, the heat can pass through the temperature equalizing plate, the heat pipe and the inner wall of the chassis 1 to the heat dissipation fin group 21 on the outer wall of the chassis 1 in sequence. Due to the characteristics of heat conduction itself, the heat at the heating unit position is always at the highest, and excessive heat accumulation will lead to the inability to conduct it out in time. Through the hot-end and cold-end split layout, the heat of the heating unit can be more effectively conducted and diffused, so that the chip unit will not generate heat accumulation and can always be in the allowable temperature operating range.

[0066] In some embodiments of the present application, the refrigeration principle of the pulse tube 16 Stirling refrigeration system is as follows: when the pulse tube 16 Stirling refrigeration system starts working, the compressor 4 compresses the gas and injects it into the regenerator 6. When the compressor 4 stops working, the gas begins to expand and pulsate. During the expansion process, the gas absorbs heat from the cold-end heat exchanger 11 to cool the chip. In the hot-end heat exchanger 18, the gas releases heat to the heat pipe network on the inner wall of the chassis 1 and then quickly exports it to the outside of the chassis 1. The heat is quickly diffused into the environment under the enhanced heat dissipation of the turbofan 20 and the Z-shaped fins. Specifically, when the chip unit is working, a large amount of heat generated is conducted through the thermally conductive gasket to the cold-end heat exchanger 11 of the pulse tube 16-type Stirling refrigeration system close to the thermally conductive cold plate 117. The cold-end heat exchanger 11 absorbs heat through gas expansion and transfers it to the hot-end heat exchanger 18 through the pressure wave in the pulse tube 16. The hot-end heat exchanger 18 diffuses the heat to the entire chassis 1 and the heat dissipation fin group 21 on the outer wall through the heat pipe module 15 on the inner wall of the chassis 1, and finally diffuses it to the external environment. The two external turbo fans 20 force the airflow to pass through the fin surface, further enhancing the heat dissipation and bringing the heat into the environment.

[0067] In some embodiments of the present application, a fan mounting groove 3 is provided on the outer surface of the top plate, and the turbofan 20 can be installed and fixed in the fan mounting groove 3.

[0068] In some embodiments of the present application, the heat pipe module 15 includes a plurality of mutually parallel heat dissipation copper pipes, which are welded to the inner surface of the top plate, and one end of each heat dissipation copper pipe is connected to the hot end heat exchanger 18. A heat pipe fixing frame 13 is also provided in the chassis 1, and the heat pipe fixing frame 13 and the inner surface of the top plate are detachably connected, and a plurality of heat dissipation copper pipes are clamped between the heat pipe fixing frame 13 and the top plate. With this structure, the heat dissipation efficiency of the heat pipe module 15 can be further improved, thereby further improving the heat pipe module 15.

[0069] In some embodiments of the present application, the cold end heat exchanger 11 is arranged along the width direction of the chassis 1, the hot end heat exchanger 18 is arranged along the length direction of the chassis 1, the pulse tube 16 is an L-shaped tube, and the L-shaped tube includes a vertical section and a horizontal section, one end of the vertical section is connected to the cold end heat exchanger 11, the other end of the vertical section is connected to one end of the horizontal section, and the other end of the horizontal section is connected to the hot end heat exchanger 18; the chassis 1 is also provided with a pulse tube 16 mounting frame, the pulse tube 16 mounting frame and the inner wall of the chassis 1 are detachably connected, and the pulse tube 16 is clamped between the pulse tube 16 mounting frame and the inner wall of the chassis 1. With this structure, the direction of the pulse tube 16 can be optimized, which can make the pulse tube 16 relatively long so as to complete the heat conversion to the greatest extent, and the high temperature of the hot end heat exchanger 18 will not have thermal radiation and other effects on the chip unit.

[0070] Embodiment 2:

[0071] The embodiment of the present invention further provides a heat dissipation method of a pulse-tube Stirling refrigeration system, which is applied to the pulse-tube Stirling refrigeration system provided in the above-mentioned embodiment 1. The pulse-tube Stirling refrigeration system is applied to a fully reinforced computer. The fully reinforced computer includes a chassis, a chip module is arranged in the chassis, and the chip module includes a CPU, a memory, a GPU and a bridge chip. The pulse-tube Stirling refrigeration system includes a cold-end heat exchanger, and the cold-end heat exchanger includes a cold-end shell. Eight expansion chambers are arranged in the cold-end shell. Each expansion chamber is provided with a solenoid valve, and the solenoid valve is used to control the expansion chamber to open or close. The memory corresponds to one expansion chamber, the CPU corresponds to three expansion chambers, and the GPU corresponds to four expansion chambers. A temperature control module is also arranged in the chassis, and the solenoid valves in the eight expansion chambers are electrically connected to the temperature control module.

[0072] Methods include:

[0073] When the temperature of the storage device is higher than 70°C, the temperature control module controls the solenoid valve in the expansion chamber corresponding to the storage device to open;

[0074] When the temperature of the CPU is 70℃~80℃, the temperature control module controls the electromagnetic valve in the expansion chamber in the middle position among the three expansion chambers corresponding to the CPU to open;

[0075] When the temperature of the CPU is 80℃~90℃, the temperature control module controls the electromagnetic valves in the two expansion chambers on both sides of the three expansion chambers corresponding to the CPU to open;

[0076] When the temperature of the CPU is greater than or equal to 90°C, the temperature control module controls the solenoid valves in the three expansion chambers corresponding to the CPU to open;

[0077] When the temperature of the GPU is 70°C to 80°C, the temperature control module controls the solenoid valve in one of the two expansion cavities in the middle of the four expansion cavities corresponding to the GPU to open;

[0078] When the temperature of the GPU is 80°C to 90°C, the temperature control module controls the solenoid valves in the two expansion chambers in the middle of the four expansion chambers corresponding to the GPU to open;

[0079] When the temperature of the GPU is greater than or equal to 90° C., the temperature control module controls the solenoid valves in the four expansion chambers corresponding to the GPU to open.

[0080] The beneficial effects of the second embodiment of the present invention and its various implementations can be analyzed by referring to the beneficial effects of the first embodiment and its various implementations, which will not be described in detail here.

[0081] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0082] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0084] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, devices (equipment), or computer program products. Therefore, the present application may adopt the form of complete hardware embodiments, complete software embodiments, or embodiments in combination with software and hardware, which are collectively referred to as "modules" or "systems" herein. Moreover, the present application may adopt the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program codes. The computer program is stored / distributed in a suitable medium, provided together with other hardware or as a part of hardware, or may adopt other distribution forms, such as by Internet or other wired or wireless telecommunication systems.

[0085] The above contents are further detailed descriptions of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A pulse tube Stirling refrigeration system, applied to heat dissipation of fully reinforced computers, characterized in that: The fully reinforced computer includes a chassis, a chip module and a heat pipe module are arranged in the chassis, the chip module includes a CPU, a memory, a GPU and a bridge chip, the pulse tube Stirling refrigeration system includes a compressor, a regenerator, a cold end heat exchanger, a pulse tube and a hot end heat exchanger connected in sequence, and the heat pipe module is arranged on the inner wall of the chassis; The cold-end heat exchanger is provided with a heat-conducting cold plate, the CPU, memory and GPU are all arranged on the heat-conducting cold plate, the hot-end heat exchanger is connected to the heat pipe module, and the bridge plate is arranged on the heat pipe module.

2. The pulse tube Stirling refrigeration system according to claim 1, characterized in that: The cold end heat exchanger comprises a cold end shell, the cold end shell has an inlet end and an outlet end, the inlet end is connected to the regenerator, the outlet end is connected to the pulse tube, an expansion chamber and an airflow chamber are arranged in the cold end shell, the expansion chamber is used to expand the gas input from the regenerator, and the airflow chamber is used to connect the inlet end and the outlet end; There are multiple expansion chambers, which are arranged in sequence from the inlet end to the outlet end. Each expansion chamber is provided with a solenoid valve, and the solenoid valve is used to control the expansion chamber to open or close.

3. The pulse tube Stirling refrigeration system according to claim 2, characterized in that: The memory, the CPU and the GPU are arranged in sequence along a first direction, and the inlet and the outlet are arranged in sequence along the first direction; There are eight expansion chambers, the memory corresponds to one expansion chamber, the CPU corresponds to three expansion chambers, and the GPU corresponds to four expansion chambers.

4. The pulse tube Stirling refrigeration system according to claim 3, characterized in that: A temperature sensor and a temperature control module are also provided in the chassis, the temperature sensor and the temperature control module are electrically connected, the solenoid valves in the eight expansion chambers are electrically connected to the temperature control module, and the temperature sensor is provided on the heat-conducting cold plate; The temperature control module is used to control the activation of the solenoid valves in the eight expansion chambers according to the temperatures of the memory, the CPU and the GPU.

5. The pulse tube Stirling refrigeration system according to claim 1, characterized in that: It also includes an air reservoir and a Laval nozzle for forming small holes, one end of the Laval nozzle is connected to the pulse tube, and the other end is connected to the hot end heat exchanger, and the air reservoir and the Laval nozzle are arranged on both sides of the hot end heat exchanger.

6. The pulse tube Stirling refrigeration system according to claim 5, characterized in that: The hot end heat exchanger comprises a hot end housing, a heat conducting plate is provided between the hot end housing and the heat pipe module, the heat conducting plate is detachably connected to the hot end housing, the heat pipe module is mounted on the heat conducting plate, and a heat conducting gasket is further provided between the heat pipe module and the heat conducting plate; The hot end shell has an air inlet and an air outlet, the air inlet is connected to the Laval nozzle, the air outlet is connected to the air reservoir, and a sealing sleeve is provided at the air inlet.

7. The pulse tube Stirling refrigeration system according to claim 1, characterized in that: The chassis comprises a top plate and a cover plate, the heat pipe module is arranged on the inner surface of the top plate, a heat dissipation module is arranged on the outer surface of the top plate, the heat dissipation module comprises a turbo fan and a heat dissipation fin group, the heat dissipation fin group comprises a plurality of fins parallel to each other, the heat dissipation fin group is arranged between the top plate and the cover plate, and a heat dissipation channel is formed between the top plate, the cover plate and two adjacent fins; The fins are Z-shaped fins.

8. The pulse tube Stirling refrigeration system according to claim 7, characterized in that: The heat pipe module includes a plurality of mutually parallel heat dissipation copper tubes, the heat dissipation copper tubes are welded to the inner surface of the top plate, one end of each of the heat dissipation copper tubes is connected to the hot end heat exchanger, a heat pipe fixing frame is also provided in the chassis, the heat pipe fixing frame and the inner surface of the top plate are detachably connected, and a plurality of the heat dissipation copper tubes are clamped between the heat pipe fixing frame and the top plate.

9. The pulse tube Stirling refrigeration system according to claim 7, characterized in that: The cold-end heat exchanger is arranged along the width direction of the chassis, and the hot-end heat exchanger is arranged along the length direction of the chassis. The pulse tube is an L-shaped tube, and the L-shaped tube includes a vertical section and a horizontal section. One end of the vertical section is connected to the cold-end heat exchanger, and the other end of the vertical section is connected to one end of the horizontal section, and the other end of the horizontal section is connected to the hot-end heat exchanger. A pulse tube mounting frame is also provided in the chassis. The pulse tube mounting frame and the inner wall of the chassis are detachably connected. The pulse tube is clamped between the pulse tube mounting frame and the inner wall of the chassis.

10. A heat dissipation method for a pulse tube Stirling refrigeration system, characterized in that: A pulse-tube Stirling refrigeration system applied to any one of claims 1 to 9, wherein the pulse-tube Stirling refrigeration system is applied to a fully reinforced computer, wherein the fully reinforced computer comprises a chassis, wherein a chip module is arranged in the chassis, wherein the chip module comprises a CPU, a memory, a GPU and a bridge chip, wherein the pulse-tube Stirling refrigeration system comprises a cold-end heat exchanger, wherein the cold-end heat exchanger comprises a cold-end shell, wherein eight expansion chambers are arranged in the cold-end shell, wherein each expansion chamber is provided with a solenoid valve, wherein the solenoid valve is used to control the expansion chamber to be opened or closed, wherein the memory corresponds to one expansion chamber, wherein the CPU corresponds to three expansion chambers, wherein the GPU corresponds to four expansion chambers, wherein a temperature control module is further arranged in the chassis, wherein the solenoid valves in the eight expansion chambers are electrically connected to the temperature control module; The method comprises: When the temperature of the storage device is higher than 70° C., the temperature control module controls the solenoid valve in the expansion chamber corresponding to the storage device to open; When the temperature of the CPU is 70°C to 80°C, the temperature control module controls the electromagnetic valve in the expansion chamber at the middle position among the three expansion chambers corresponding to the CPU to open; When the temperature of the CPU is 80°C to 90°C, the temperature control module controls the electromagnetic valves in the two expansion chambers on both sides of the three expansion chambers corresponding to the CPU to open; When the temperature of the CPU is greater than or equal to 90° C., the temperature control module controls the solenoid valves in the three expansion chambers corresponding to the CPU to open; When the temperature of the GPU is 70° C. to 80° C., the temperature control module controls the electromagnetic valve in one of the two expansion cavities in the middle among the four expansion cavities corresponding to the GPU to open; When the temperature of the GPU is 80° C. to 90° C., the temperature control module controls the electromagnetic valves in the two expansion chambers in the middle of the four expansion chambers corresponding to the GPU to open; When the temperature of the GPU is greater than or equal to 90° C., the temperature control module controls the solenoid valves in the four expansion chambers corresponding to the GPU to open.

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