Thermal management method and device, computer equipment and storage medium

Abstract

The invention relates to a thermal management method and device, computer equipment and a storage medium. The method comprises the steps that temperature data corresponding to multiple devices in a target module and the environment temperature of the target module are acquired; operation processing is carried out on the temperature data corresponding to the multiple devices, and adjusting parameters corresponding to the devices are determined; determining a target adjustment parameter according to the adjustment parameter corresponding to each device; determining a plurality of regulation and control nodes according to the temperature data corresponding to the plurality of devices and the target regulation parameters; and according to the target adjustment parameter, the plurality of regulation and control nodes and the environment temperature, a heat dissipation piece of the target module is regulated and controlled. By means of the method, the fan can be dynamically regulated and controlled, it is ensured that operation of the fan adapts to the current environment temperature requirement of the module, ESR fluctuation is reduced, the excessive cooling problem is effectively prevented, and then the electrolytic capacitor bulging problem is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a thermal management method, device, computer equipment, storage medium and computer program product. Background Art

[0002] In the design of modern electronic devices and charging modules, large-capacity electrolytic capacitors are one of the indispensable core components and are widely used in filtering and energy storage links in circuits to ensure the stability and reliability of equipment operation. Electrolytic capacitors are usually connected in parallel with the circuit to alleviate the impact of ripple voltage. However, with the diversification of application scenarios, charging modules are increasingly deployed in extreme environments, especially under ultra-low temperature conditions, which poses severe challenges to the performance of electrolytic capacitors. The current operating temperature range of large-capacity electrolytic capacitors is generally -25℃ to 105℃, while charging modules on the market are generally designed to operate in an environment of -30℃ to 75℃. In ultra-low temperature environments, the significant differences in the equivalent series resistance (ESR) inside the electrolytic capacitors due to extreme changes in ambient temperature seriously affect the performance and service life of the electrolytic capacitors. Specifically, the ESR of electrolytic capacitors is extremely sensitive to temperature changes, especially in ultra-low temperature environments, where the difference in ESR is more significant than in normal temperature environments. When the ESR of parallel electrolytic capacitors is inconsistent, the ripple current distribution is unbalanced, causing the ripple current to be excessively concentrated on the electrolytic capacitors with lower ESR, which in turn causes a significant increase in the internal heating of the low-ESR electrolytic capacitors, accelerates the vaporization and expansion of the electrolyte, and ultimately leads to bulging and failure of the electrolytic capacitors.

[0003] In order to alleviate the ripple current concentration phenomenon caused by ESR differences, traditional technologies use a fixed logic to control the fan. The fan speed is usually set according to the maximum heat dissipation requirement of the charging module to ensure the temperature control effect of the entire charging module.

[0004] However, in an ultra-low temperature environment, the fan still dissipates heat according to the maximum heat dissipation demand, which may cause over-cooling, thereby significantly increasing the ESR of the electrolytic capacitor, aggravating the ripple current imbalance inside the module, and ultimately causing the electrolytic capacitor to bulge and fail, and even affecting the overall stability of the charging module. Summary of the invention

[0005] Based on this, it is necessary to provide a thermal management method, device, computer equipment, computer-readable storage medium and computer program product that can dynamically adjust the fan to ensure that the fan operation adapts to the current ambient temperature requirements of the module, reduces ESR fluctuations, effectively prevents over-cooling problems, and thereby avoids electrolytic capacitor bulging.

[0006] In a first aspect, the present application provides a thermal management method, comprising:

[0007] Obtain the temperature data corresponding to multiple devices inside the target module and the ambient temperature of the target module;

[0008] Performing calculations on the temperature data corresponding to the plurality of devices to determine the adjustment parameters corresponding to the devices; and determining the target adjustment parameters according to the adjustment parameters corresponding to the devices;

[0009] Determine multiple control nodes according to temperature data corresponding to multiple devices and target adjustment parameters;

[0010] The heat sink of the target module is regulated according to the target regulation parameters, the multiple regulation nodes and the ambient temperature.

[0011] In one embodiment, regulating a heat sink of a target module according to a target regulation parameter, a plurality of regulation nodes, and an ambient temperature includes:

[0012] When the ambient temperature is less than a first threshold, a first control strategy is used to regulate the heat sink of the target module;

[0013] When the ambient temperature is greater than or equal to the first threshold, the second control strategy is adopted to regulate the heat dissipation element of the target module.

[0014] In one embodiment, the plurality of control nodes include a first control node, and a first control strategy is used to control a heat sink of a target module, including:

[0015] Determining whether the target adjustment parameter is less than the first adjustment node;

[0016] When the target adjustment parameter is less than the first control node, the rotation speed of the heat sink is controlled to be the first target rotation speed;

[0017] When the target adjustment parameter is greater than or equal to the first control node, the rotation speed of the heat sink is controlled to be a second target rotation speed.

[0018] In one embodiment, the plurality of control nodes further include a second control node, and the heat sink of the target module is controlled by using a second control strategy, including:

[0019] Determining whether the target adjustment parameter is less than the first adjustment node;

[0020] When the target adjustment parameter is less than the first control node, the rotation speed of the heat sink is controlled to be a second target rotation speed;

[0021] When the target adjustment parameter is greater than or equal to the first adjustment node, it is determined whether the target adjustment parameter is less than the second adjustment node.

[0022] In one embodiment, the plurality of control nodes further include a third control node, and the heat sink of the target module is controlled by using the second control strategy, further comprising:

[0023] When the target adjustment parameter is less than the second control node, controlling the rotation speed of the heat sink to be a third target rotation speed;

[0024] When the target adjustment parameter is greater than or equal to the second adjustment node, it is determined whether the target adjustment parameter is less than a third adjustment node; when the target adjustment parameter is greater than or equal to the third adjustment node, over-temperature protection is performed on the target module.

[0025] In one embodiment, the second control strategy is used to regulate the heat dissipation element of the target module, and further includes:

[0026] When the target adjustment parameter is less than the third control node, the power of the charging module is reduced; and after the power of the charging module is reduced, it is determined whether the ambient temperature is greater than the second threshold;

[0027] When the ambient temperature is greater than a second threshold, controlling the rotation speed of the heat sink to be a second target rotation speed;

[0028] When the ambient temperature is less than or equal to the second threshold, the first control strategy is adopted to regulate the heat dissipation element of the target module.

[0029] In one embodiment, the temperature data includes a first temperature parameter and a second temperature parameter, and the method further includes:

[0030] Determine the adjustment parameters corresponding to each device according to the first temperature parameter and the second temperature parameter corresponding to each device; compare the adjustment parameters corresponding to each device to determine the target adjustment parameters;

[0031] Determine a target device corresponding to a target adjustment parameter;

[0032] A plurality of control nodes are determined according to a first temperature parameter corresponding to the target device.

[0033] In a second aspect, the present application also provides a thermal management device, comprising:

[0034] An acquisition module is used to acquire temperature data corresponding to multiple devices inside the target module and the ambient temperature of the target module;

[0035] The first determination module is used to perform calculation processing on the temperature data corresponding to the multiple devices respectively, determine the adjustment parameters corresponding to each device; and determine the target adjustment parameters according to the adjustment parameters corresponding to each device;

[0036] A second determination module is used to determine a plurality of control nodes according to temperature data and target adjustment parameters respectively corresponding to a plurality of devices;

[0037] The control module is used to control the heat sink of the target module according to the target adjustment parameters, multiple control nodes and ambient temperature.

[0038] In a third aspect, the present application further provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are implemented:

[0039] Obtain the temperature data corresponding to multiple devices inside the target module and the ambient temperature of the target module;

[0040] Performing calculations on the temperature data corresponding to the plurality of devices to determine the adjustment parameters corresponding to the devices; and determining the target adjustment parameters according to the adjustment parameters corresponding to the devices;

[0041] Determine multiple control nodes according to temperature data corresponding to multiple devices and target adjustment parameters;

[0042] The heat sink of the target module is regulated according to the target regulation parameters, the multiple regulation nodes and the ambient temperature.

[0043] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the following steps are implemented:

[0044] Obtain the temperature data corresponding to multiple devices inside the target module and the ambient temperature of the target module;

[0045] Performing calculations on the temperature data corresponding to the plurality of devices to determine the adjustment parameters corresponding to the devices; and determining the target adjustment parameters according to the adjustment parameters corresponding to the devices;

[0046] Determine multiple control nodes according to temperature data corresponding to multiple devices and target adjustment parameters;

[0047] The heat sink of the target module is regulated according to the target regulation parameters, the multiple regulation nodes and the ambient temperature.

[0048] In a fifth aspect, the present application further provides a computer program product, including a computer program, which implements the following steps when executed by a processor:

[0049] Obtain the temperature data corresponding to multiple devices inside the target module and the ambient temperature of the target module;

[0050] Performing calculations on the temperature data corresponding to the plurality of devices to determine the adjustment parameters corresponding to the devices; and determining the target adjustment parameters according to the adjustment parameters corresponding to the devices;

[0051] Determine multiple control nodes according to temperature data corresponding to multiple devices and target adjustment parameters;

[0052] The heat sink of the target module is regulated according to the target regulation parameters, the multiple regulation nodes and the ambient temperature.

[0053] The above-mentioned thermal management method, device, computer equipment, storage medium and computer program product obtain the temperature data corresponding to the multiple devices inside the target module and the ambient temperature of the target module; perform calculations on the temperature data corresponding to the multiple devices to determine the adjustment parameters corresponding to each device; and determine the target adjustment parameters according to the adjustment parameters corresponding to each device; determine multiple control nodes according to the temperature data corresponding to the multiple devices and the target adjustment parameters; and control the heat sink of the target module according to the target adjustment parameters, multiple control nodes and the ambient temperature. This method can be used to dynamically control the fan, ensure that the fan operation adapts to the current ambient temperature requirements of the module, reduce ESR fluctuations, effectively prevent over-cooling problems, and thus avoid the problem of electrolytic capacitor bulging. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0055] Figure 1 A diagram of an application environment of a thermal management method in an embodiment;

[0056] Figure 2 is a schematic diagram of the distribution of electrolytic capacitors in one embodiment;

[0057] Figure 3 is a schematic flow chart of a thermal management method in one embodiment;

[0058] Figure 4 A schematic diagram of a process for regulating a heat sink of a target module in one embodiment;

[0059] Figure 5 A schematic diagram of an overall process of regulating a heat sink of a charging module in one embodiment;

[0060] Figure 6 is a structural block diagram of a thermal management device in one embodiment;

[0061] Figure 7 FIG. 4 is a diagram showing the internal structure of a computer device in one embodiment. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0063] The thermal management method provided in the embodiment of the present application can be applied to Figure 1 In the application environment shown. Among them, the terminal 102 communicates with the server 104 through the network. The data storage system can store the data that the server 104 needs to process. The data storage system can be integrated on the server 104, or it can be placed on the cloud or other network servers. The terminal 102 sends a thermal management request to the server 104, and the server 104 receives the thermal management request, obtains the temperature data corresponding to the multiple devices inside the target module and the ambient temperature of the target module; performs calculations on the temperature data corresponding to the multiple devices, and determines the adjustment parameters corresponding to each device; and determines the target adjustment parameters according to the adjustment parameters corresponding to each device; determines multiple control nodes according to the temperature data corresponding to the multiple devices and the target adjustment parameters; and regulates the heat sink of the target module according to the target adjustment parameters, multiple control nodes and ambient temperature. Among them, the terminal 102 can be, but is not limited to, various personal computers, laptops, smart phones, tablet computers, Internet of Things devices and portable wearable devices. The Internet of Things devices can be smart speakers, smart TVs, smart air conditioners, smart car-mounted devices, etc. Portable wearable devices can be smart watches, smart bracelets, head-mounted devices, etc. The server 104 can be implemented with an independent server or a server cluster consisting of multiple servers.

[0064] In the field of electronic equipment technology, the charging module needs to actively dissipate heat through a fan, such as Figure 2 The figure shows the distribution diagram of electrolytic capacitors. Figure 2The dotted box contains multiple electrolytic capacitors. The direction indicated by the arrow is the direction of the air duct flow. The air outlet of the heat sink (fan) is located on one side of the electrolytic capacitor. Due to the different distribution of electrolytic capacitors, the temperature of the electrolytic capacitors close to the air inlet and the temperature of the electrolytic capacitors far from the air inlet in the ultra-low temperature environment are quite different, which leads to a large difference in ESR between the electrolytic capacitors. In the operation of electronic circuits, the use of parallel electrolytic capacitors is extremely common. Based on Ohm's law, when multiple parallel electrolytic capacitors are connected to a ripple voltage environment, due to the different ESRs of the electrolytic capacitors, the ripple current distribution is seriously unbalanced, which will cause serious bulging of the electrolytic capacitors. This is because capacitors with large ESR only receive a small amount of ripple current, while electrolytic capacitors with low ESR will attract more ripple current to pass through, forming a "current concentration" phenomenon, causing the current amplitude borne by the low ESR electrolytic capacitor to far exceed the expected average current value; low ESR capacitors that withstand large ripple current will generate a large amount of heat accumulated inside due to the thermal effect of the current, and excessively high temperatures will accelerate the vaporization and expansion of the electrolyte, causing the internal pressure to rise sharply, which in turn leads to the failure of the electrolytic capacitor.

[0065] Therefore, the present application proposes a thermal management method, which uses the control of the fan to effectively intervene in the temperature of the electrolytic capacitor, thereby controlling the equivalent series resistance (ESR) value of the electrolytic capacitor, and realizing the improvement of circuit stability and long-term operation of the equipment; specifically, the rotation speed and start-stop state of the fan are precisely controlled; when the fan is running at a higher speed, a large amount of cold air is driven by wind pressure and quickly passes through the air inlet to blow toward the electrolytic capacitor array, increasing the flow rate and flow rate of the heat dissipation airflow, efficiently absorbing the heat emitted by the electrolytic capacitor and entraining it to the outside of the equipment, and causing the temperature of the electrolytic capacitor to steadily decrease. On the contrary, when the fan rotates at a low speed or stops rotating, the airflow introduced by the fan slows down, the heat dissipation efficiency decreases, the heat of the electrolytic capacitor accumulates, and the temperature of the electrolytic capacitor rises accordingly. Therefore, in an ultra-low temperature environment, the speed of the start-up fan is stopped, so that the heat of the electrolytic capacitor accumulates, and the temperature of the electrolytic capacitor rises to a normal temperature state. At this time, the ESR of the electrolytic capacitor is not sensitive to temperature changes, and the parallel electrolytic capacitor has a good current sharing effect, and it is not easy for the capacitor to fail.

[0066] In an exemplary embodiment, Figure 3 As shown, a thermal management method is provided, which is applied to Figure 1 The server in the example is used to illustrate, including the following steps 302 to 308. Among them:

[0067] Step 302: Acquire temperature data corresponding to a plurality of components in the target module and the ambient temperature of the target module.

[0068] Optionally, the target module may be a charging module, which includes a DC-DC converter, a power factor correction module (PFC) module, and other components. The multiple devices inside the charging module may include a DC-DC side metal-oxide-semiconductor field-effect transistor (MOS), a DC-DC side rectifier diode, a DC-DC side anti-reverse diode, a DC-DC side transformer, a PFC side insulated gate bipolar transistor (IGBT), and a PFC rectifier diode. The ambient temperature of the target module refers to the temperature of the external environment where the target module is located. The ambient temperature reflects the temperature state of the surrounding air, equipment room, etc. of the target module. The change of the ambient temperature can directly affect the heat sink (fan) control logic and temperature management strategy. Therefore, the influence of the ambient temperature on the internal temperature of the device needs to be considered in the thermal management method.

[0069] Exemplarily, the ambient temperature of the charging module and the temperature data corresponding to the multiple components in the charging module are monitored in real time, and the temperature data corresponding to each component and the ambient temperature of the charging module are obtained.

[0070] Step 304 , performing calculation processing on the temperature data corresponding to the plurality of devices respectively, determining the adjustment parameters corresponding to the respective devices; and determining the target adjustment parameters according to the adjustment parameters corresponding to the respective devices.

[0071] Exemplarily, after obtaining the real-time temperature data corresponding to multiple devices, for each device, the temperature data corresponding to the device is processed by a preset operation to obtain the adjustment parameters corresponding to the device. The adjustment parameters corresponding to the multiple devices are analyzed and compared, and then the target adjustment parameters are determined from the adjustment parameters corresponding to the multiple devices. The target adjustment parameters combine the temperature conditions of multiple devices inside the charging module and can serve as a basis for thermal management of the charging module.

[0072] Step 306 : determining a plurality of control nodes according to the temperature data and target adjustment parameters respectively corresponding to the plurality of components.

[0073] The control node refers to the critical point or threshold that needs to be adjusted in the thermal management process. Optionally, the control node can be a percentage of a pre-set data (such as 40%, 75%, 80% or 85%). The control node can include the starting control point, load reduction point, over-temperature protection point, etc.

[0074] Exemplarily, multiple control nodes are determined through target adjustment parameters and temperature data corresponding to each device. These control nodes are used to provide operating thresholds for the thermal management process and guide the execution timing of strategies such as heat sink speed and load adjustment. This can ensure that each electrolytic capacitor in the charging module can operate stably within an appropriate temperature range to avoid failures caused by overheating.

[0075] Step 308 , regulating the heat sink of the target module according to the target regulation parameter, the plurality of regulation nodes, and the ambient temperature.

[0076] Exemplarily, the server regulates the heat dissipation parts (such as fans and other heat dissipation components) of the target module in combination with the target adjustment parameters, multiple control nodes and ambient temperature. For example, when the ambient temperature of the target module reaches a certain threshold or when the target adjustment parameter reaches a certain control node, the server will trigger the corresponding control strategy (such as adjusting the fan speed, reducing the load, etc.) to ensure that each component in the target module (especially the electrolytic capacitor) remains within the appropriate temperature range to avoid overheating or overcooling, thereby ensuring the stability and long-term operation of the target module.

[0077] In the above thermal management method, the target adjustment parameters and multiple control nodes are determined according to the temperature data corresponding to the multiple devices, and the heat sink of the target module is adjusted according to the target adjustment parameters, multiple control nodes and ambient temperature, so as to realize intelligent and dynamic regulation of the heat sink according to the internal temperature and ambient temperature of the charging module, thereby realizing refined management of the temperature of the electrolytic capacitor inside the charging module, keeping the electrolytic capacitor working within a suitable temperature range, and thus ensuring the stability of the ESR value of each electrolytic capacitor. Stabilizing the ESR value of each electrolytic capacitor can ensure that each parallel or series electrolytic capacitor in the circuit evenly shares the current as expected by the design, avoid problems such as uneven ripple current, local overheating and even bulging failure caused by ESR fluctuations, and extend the service life of the electrolytic capacitor; at the same time, stabilizing the ESR value of each electrolytic capacitor can also accurately control the temperature and ESR of the electrolytic capacitor from the perspective of the overall performance of the charging module, thereby enhancing the stability of the power output of the charging module.

[0078] In the previous exemplary embodiment, the temperature data includes a first temperature parameter and a second temperature parameter, and the method also includes: determining an adjustment parameter corresponding to each device according to the first temperature parameter and the second temperature parameter corresponding to each device; comparing the adjustment parameters corresponding to each device to determine a target adjustment parameter; determining a target device corresponding to the target adjustment parameter; and determining multiple control nodes according to the first temperature parameter corresponding to the target device.

[0079] The first temperature parameter and the second temperature parameter of the device refer to the maximum operating junction temperature of the device. and the actual temperature of the device (i.e. the current operating temperature of the device). The maximum operating junction temperature of the device It refers to the highest temperature that the device can withstand within the design specifications, representing the device's operating limit temperature. Exceeding this temperature will cause the device to be damaged or in an unreliable working state.

[0080] Optionally, the multiple devices inside the target module are multiple devices inside the charging module, including DC-DC side MOS tube, DC-DC side rectifier diode, DC-DC side anti-reverse diode, DC-DC side transformer, PFC side IGBT and PFC rectifier diode. For each of the above devices, obtain the actual temperature of the device and the maximum operating junction temperature , and the actual temperature of the device and the maximum operating junction temperature Perform ratio processing to obtain the corresponding adjustment parameters of the device , The specific calculation formula is as follows:

[0081]

[0082] According to the above calculation formula and the actual temperature corresponding to each of the above devices and the maximum operating junction temperature Determine the adjustment parameters corresponding to each device , and the corresponding adjustment parameters of each device Compare and adjust the parameters corresponding to each device The target adjustment parameters are determined in . Among them, the adjustment parameters corresponding to each device can be The maximum value in is taken as the target adjustment parameter , and the target adjustment parameter The corresponding device is used as the target device.

[0083] Get the maximum operating junction temperature of the target device , according to the maximum operating junction temperature of the target device Determine multiple control nodes, such as multiple control nodes set to the maximum operable junction temperature corresponding to the preset target device Optional, based on the maximum operating junction temperature of the target device. Determine the starting control point, maximum fan speed point, load reduction point, and over-temperature protection point of the target device; the starting control point of the device can be set to the corresponding maximum operating junction temperature of the device The maximum fan speed point of the device can be set to the corresponding maximum operating junction temperature of the device. The fan load reduction point of the device can be set to the corresponding maximum operating junction temperature of the device. The over-temperature protection point of the device can be set to the corresponding maximum operating junction temperature of the device. 85% of the total.

[0084] In this embodiment, by obtaining the first temperature parameter and the second temperature parameter of the device, the current temperature (actual temperature) of the device and the maximum operable junction temperature can be comprehensively considered, thereby more accurately evaluating the thermal state of the device, and determining the target adjustment parameters and control nodes according to the thermal state of the device, which can make the thermal management process more flexible and ensure that each device and electrolytic capacitor can operate within an appropriate temperature range.

[0085] In an exemplary embodiment, Figure 4 As shown, according to the target adjustment parameter, multiple adjustment nodes and the ambient temperature, adjusting the heat sink of the target module includes steps 402 to 406. Among them:

[0086] Step 402 , determining whether the ambient temperature is less than a first threshold value, if the ambient temperature is less than the first threshold value, jumping to step 404 ; if the ambient temperature is greater than or equal to the first threshold value, jumping to step 406 .

[0087] Step 404: Use a first control strategy to regulate the heat sink of the target module.

[0088] Step 406: Use the second control strategy to regulate the heat sink of the target module.

[0089] Optionally, when the target module is a charging module, the first threshold is set to -25°C. Since the ambient temperature is a key factor affecting the internal temperature management and heat dissipation strategy of the charging module, especially in a low-temperature environment, the working state of the charging module is closely related to the temperature. Therefore, by judging whether the ambient temperature of the charging module is less than the first threshold, it is possible to adopt appropriate thermal management strategies according to different environmental conditions to ensure that the charging module can operate stably in various environments. The operating temperature range of large-capacity electrolytic capacitors is generally -25°C to 105°C, while charging modules are generally designed to operate in an environment of -30°C to 75°C, that is, when the operating temperature of the electrolytic capacitor is lower than -25°C, problems such as changes in the ESR of the electrolytic capacitor, uneven distribution of the ripple current, and even solidification of the electrolyte may occur. Therefore, using -25°C as the first threshold can ensure that the server dynamically adjusts the thermal management strategy according to environmental changes in a low-temperature environment.

[0090] If the ambient temperature is lower than the first threshold, that is, when the charging module is in an environment below -25°C, the operating temperature of the electrolytic capacitor, MOS tube, diode and other devices may drop, affecting their normal operation. At this time, in order to avoid excessive heat dissipation, it may be necessary to adopt a strategy to reduce the heat dissipation efficiency so that the electrolytic capacitor can be maintained in a suitable operating temperature range to avoid further temperature drop due to excessive heat dissipation, causing the electrolytic capacitor to fail or become unstable. Therefore, the first control strategy is used to regulate the heat dissipation components of the target module and to restrict the heat dissipation to a certain extent, such as reducing the fan speed or suspending the fan to reduce the inflow of cold air to avoid the electrolytic capacitor from having a low temperature.

[0091] If the ambient temperature is greater than the first threshold, that is, when the charging module is in an environment above -25°C, the ambient temperature is more suitable for the electrolytic capacitor, and the heat dissipation demand gradually increases. The operating temperature inside the charging module gradually increases. At this time, a more efficient heat dissipation strategy is needed to prevent the temperature from being too high and ensure that the device remains in a suitable operating temperature range. Therefore, the second control strategy is used to regulate the heat dissipation of the target module and enhance the heat dissipation to a certain extent, such as increasing the speed of the fan to remove excess heat through effective air flow to avoid failure of the electrolytic capacitor due to overheating.

[0092] In this embodiment, the heat sink control strategy is dynamically adjusted based on the real-time ambient temperature of the target module, which can ensure that the electrolytic capacitor can maintain a stable operating state under different environmental conditions (whether extremely cold or normal temperature), avoid the electrolytic capacitor temperature being too low or too high, which may lead to electrolytic capacitor failure, and enhance the adaptability of the target module (charging module).

[0093] In an exemplary embodiment, multiple control nodes include a first control node, and a first control strategy is used to control the heat sink of the target module, including: determining whether a target adjustment parameter is less than the first control node; when the target adjustment parameter is less than the first control node, controlling the speed of the heat sink to be a first target speed; when the target adjustment parameter is greater than or equal to the first control node, controlling the speed of the heat sink to be a second target speed.

[0094] Optionally, the first control node is set as the starting control point of the target device, that is, the maximum operable junction temperature corresponding to the target device The first target speed and the second target speed are set according to actual conditions. In this embodiment, the first target speed and the second target speed can be set to 0% and 35% of the maximum speed of the heat sink, respectively.

[0095] For example, the overall flow chart of regulating the heat sink of the charging module according to the target regulation parameters, multiple regulation nodes and ambient temperature is as follows: Figure 5 When the ambient temperature of the charging module is less than the first threshold (-25°C), the first control strategy is used to regulate the heat sink (fan) of the charging module. Specifically, the first control strategy includes determining the target adjustment parameter Is it lower than the maximum operating junction temperature of the target device? 40%; when the target adjustment parameter Lower than the maximum operating junction temperature of the target device When the target adjustment parameter is 40%, the speed of the heat sink of the charging module is set to 0% of the maximum speed of the heat sink; when the target adjustment parameter is Greater than or equal to the maximum operating junction temperature of the target device When the speed of the heat sink of the charging module is 40%, the speed of the heat sink of the charging module is set to 35% of the maximum speed of the heat sink.

[0096] In this embodiment, when the ambient temperature is lower than the first threshold value, the rotation speed of the heat sink is determined by judging whether the target adjustment parameter is lower than the first control node. The heat dissipation strategy can be flexibly adjusted according to different working conditions, making the thermal management method more accurate. At the same time, the internal temperature of the charging module and the ambient temperature are combined to adjust the heat sink in real time, which enables the thermal management method to flexibly adapt to different working environments and improve the working stability of the charging module and the electrolytic capacitor.

[0097] In an exemplary embodiment, the multiple control nodes also include a second control node, and the heat sink of the target module is controlled using a second control strategy, including: determining whether the target adjustment parameter is less than the first control node; when the target adjustment parameter is less than the first control node, controlling the speed of the heat sink to a second target speed; when the target adjustment parameter is greater than or equal to the first control node, determining whether the target adjustment parameter is less than the second control node.

[0098] Optionally, the second control node is set to the maximum fan speed point of the target device, that is, the maximum operable junction temperature corresponding to the target device 75% of the total.

[0099] For example, please refer again Figure 5 When the ambient temperature of the charging module is lower than the first threshold (-25°C), the second control strategy is used to adjust the heat sink (fan) of the charging module. Specifically, the second control strategy includes determining the target adjustment parameter Is it lower than the maximum operating junction temperature of the target device? 40%; when the target adjustment parameter Lower than the maximum operating junction temperature of the target device When the target adjustment parameter is 40%, the speed of the heat sink of the charging module is set to 35% of the maximum speed of the heat sink; when the target adjustment parameter is Greater than or equal to the maximum operating junction temperature of the target device When it is 40% of the target adjustment parameter, Is it lower than the maximum operating junction temperature of the target device? 75% of the total.

[0100] In the previous exemplary embodiment, the multiple control nodes also include a third control node, and the second control strategy is used to control the heat sink of the target module, and also includes: when the target adjustment parameter is less than the second control node, controlling the speed of the heat sink to a third target speed; when the target adjustment parameter is greater than or equal to the second control node, determining whether the target adjustment parameter is less than the third control node; when the target adjustment parameter is greater than or equal to the third control node, performing over-temperature protection on the charging module.

[0101] Optionally, the third control node is set as the over-temperature protection point of the target device, that is, the maximum operating junction temperature corresponding to the target device The third target speed is set to 85% of the maximum speed of the heat sink. .

[0102] For example, when the target adjustment parameter Lower than the maximum operating junction temperature of the target device When the speed of the heat sink of the charging module reaches 75%, set the speed of the heat sink to the maximum speed of the heat sink. ; When the target adjustment parameter Greater than or equal to the maximum operating junction temperature of the target device When it reaches 75%, the target adjustment parameters are further determined. Is it lower than the maximum operating junction temperature of the target device? 85% of the total.

[0103] If the target adjustment parameter Greater than or equal to the maximum operating junction temperature of the target device If the temperature reaches 85%, the charging module will be protected from over-temperature, which can prevent the charging module and the electrolytic capacitors and components in the charging module from being damaged due to high temperature, extend the service life of the components, and thus ensure the long-term reliability and stability of the charging module.

[0104] In this embodiment, by setting multiple control nodes (such as the first control node, the second control node and the third control node), the heat dissipation strategy can be dynamically adjusted according to the target adjustment parameters and different control nodes, so that the fan regulation is more precise and flexible, and the thermal management efficiency is improved. Moreover, when the target adjustment parameter exceeds the set maximum threshold (such as the third control node), the over-temperature protection mechanism will be activated, which can effectively prevent the charging module from overheating and ensure the safety of the charging module under extreme conditions.

[0105] In the previous exemplary embodiment, the second control strategy is used to regulate the heat sink of the target module, and also includes: when the target adjustment parameter is less than the third control node, the power of the charging module is reduced; and after the power of the charging module is reduced, it is determined whether the ambient temperature is greater than the second threshold; when the ambient temperature is greater than the second threshold, the second control strategy is used to regulate the heat sink of the target module, and the speed of the heat sink is controlled to be the second target speed; when the ambient temperature is less than or equal to the second threshold, the first control strategy is used to regulate the heat sink of the target module.

[0106] The second threshold is -20°C. For example, if the target adjustment parameter Lower than the maximum operating junction temperature of the target device If the ambient temperature of the charging module is greater than 85%, the power of the charging module is derated; and it is determined whether the ambient temperature of the charging module is greater than -20°C. When the ambient temperature of the charging module is greater than -20°C, the second control strategy is adopted to regulate the heat sink of the target module, and the speed of the heat sink is first set to 35% of the maximum speed of the heat sink; when the ambient temperature of the charging module is less than or equal to -20°C, the first control strategy is adopted to regulate the heat sink of the target module.

[0107] In this embodiment, the target adjustment parameter Lower than the maximum operating junction temperature of the target device 85% of the target adjustment parameter Greater than the maximum operating junction temperature of the target device 75% and less than the maximum operating junction temperature of the target device 85% of the power of the charging module, reducing the power of the charging module may not necessarily completely solve the problem of excessively high internal temperature of the charging module, especially when the ambient temperature is high, the heat dissipation effect may be limited. Therefore, judging whether the ambient temperature is greater than the second threshold value can determine the impact of the current ambient temperature on the internal temperature of the charging module. Specifically, if the ambient temperature is lower than -20°C, the air is colder and the heat dissipation effect is better. At this time, even if the power is reduced, the internal temperature of the charging module may be maintained within a suitable range, and a milder heat dissipation strategy (first control strategy) can be adopted; when the ambient temperature is higher than -20°C, the heat dissipation effect is poor, so more active heat dissipation measures (second control strategy) are required. This embodiment can further adjust the heat dissipation strategy according to the ambient temperature, flexibly respond to changes in the internal temperature and ambient temperature of the charging module, and maintain the stability and performance of the charging module and the electrolytic capacitor and various components inside the charging module.

[0108] In another embodiment, please refer again to Figure 5 , provides a thermal management method, the method comprising:

[0109] The temperature data corresponding to the multiple components in the target module and the ambient temperature of the target module are obtained; the temperature data includes a first temperature parameter and a second temperature parameter.

[0110] Determine the adjustment parameters corresponding to each device according to the first temperature parameter and the second temperature parameter corresponding to each device; compare the adjustment parameters corresponding to each device to determine the target adjustment parameters; determine the target device corresponding to the target adjustment parameters; determine multiple control nodes according to the first temperature parameter corresponding to the target device.

[0111] According to the target adjustment parameter, multiple adjustment nodes and the ambient temperature, the heat sink of the target module is adjusted, including steps 1 to 11. Wherein:

[0112] Step 1, determine whether the ambient temperature is less than a first threshold value. If the ambient temperature is less than the first threshold value, jump to step 2; if the ambient temperature is greater than or equal to the first threshold value, jump to step 5.

[0113] Step 2, determine whether the target adjustment parameter is less than the first adjustment node. If the target adjustment parameter is less than the first adjustment node, jump to step 3; if the target adjustment parameter is greater than or equal to the first adjustment node, jump to step 4.

[0114] Step 3, controlling the rotation speed of the heat sink to be a first target rotation speed.

[0115] Step 4, controlling the rotation speed of the heat sink to be a second target rotation speed.

[0116] Step 5, determine whether the target adjustment parameter is less than the first adjustment node. If the target adjustment parameter is less than the first adjustment node, jump to step 4; if the target adjustment parameter is greater than or equal to the first adjustment node, jump to step 6.

[0117] Step 6, determine whether the target adjustment parameter is less than the second adjustment node. If the target adjustment parameter is less than the second adjustment node, jump to step 7; if the target adjustment parameter is greater than or equal to the second adjustment node, jump to step 8.

[0118] Step 7, controlling the rotation speed of the heat sink to be a third target rotation speed.

[0119] Step 8, determine whether the target adjustment parameter is less than the third adjustment node. If the target adjustment parameter is less than the third adjustment node, jump to step 10; if the target adjustment parameter is greater than or equal to the third adjustment node, jump to step 9.

[0120] Step 9: Perform over-temperature protection on the target module.

[0121] Step 10: derate the power of the charging module, and after derate the power of the charging module, jump to step 11.

[0122] Step 11, determine whether the ambient temperature is greater than the second threshold; if the ambient temperature is greater than the second threshold, adopt the second control strategy to regulate the heat sink of the target module, that is, jump to step 4; if the ambient temperature is less than or equal to the second threshold, adopt the first control strategy to regulate the heat sink of the target module, that is, jump to step 2.

[0123] It should be understood that, although the steps in the flowcharts involved in the above embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps is not strictly limited in order, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above embodiments may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0124] Based on the same inventive concept, the embodiment of the present application also provides a thermal management device for implementing the thermal management method involved above. The implementation solution provided by the device to solve the problem is similar to the implementation solution recorded in the above method, so the specific limitations in one or more thermal management device embodiments provided below can refer to the limitations on the thermal management method above, and will not be repeated here.

[0125] In an exemplary embodiment, Figure 6 As shown, a thermal management device is provided, including: an acquisition module 602, a first determination module 604, a second determination module 606 and a control module 608, wherein:

[0126] An acquisition module 602 is used to acquire temperature data corresponding to a plurality of components inside a target module and an ambient temperature of the target module;

[0127] The first determination module 604 is used to perform calculation processing on the temperature data corresponding to the multiple devices, determine the adjustment parameters corresponding to each device; and determine the target adjustment parameters according to the adjustment parameters corresponding to each device;

[0128] A second determination module 606 is used to determine a plurality of control nodes according to the temperature data and target adjustment parameters respectively corresponding to the plurality of components;

[0129] The control module 608 is used to control the heat sink of the target module according to the target adjustment parameter, multiple control nodes and the ambient temperature.

[0130] In an exemplary embodiment, the temperature data includes a first temperature parameter and a second temperature parameter, and the first determination module 604 is further used to determine the adjustment parameters corresponding to each component based on the first temperature parameter and the second temperature parameter corresponding to each component; and compare the adjustment parameters corresponding to each component to determine the target adjustment parameters.

[0131] In an exemplary embodiment, the second determination module 606 is further configured to determine a target device corresponding to the target adjustment parameter; and determine a plurality of control nodes according to the first temperature parameter corresponding to the target device.

[0132] In an exemplary embodiment, the regulation module 608 is also used to use a first control strategy to regulate the heat sink of the target module when the ambient temperature is less than a first threshold; and use a second control strategy to regulate the heat sink of the target module when the ambient temperature is greater than or equal to the first threshold.

[0133] In an exemplary embodiment, multiple control nodes include a first control node, and the control module 608 is also used to determine whether the target adjustment parameter is less than the first control node; when the target adjustment parameter is less than the first control node, the speed of the heat sink is controlled to be the first target speed; when the target adjustment parameter is greater than or equal to the first control node, the speed of the heat sink is controlled to be the second target speed.

[0134] In an exemplary embodiment, the multiple control nodes also include a second control node, and the control module 608 is also used to determine whether the target adjustment parameter is less than the first control node; when the target adjustment parameter is less than the first control node, the speed of the heat sink is controlled to be the second target speed; when the target adjustment parameter is greater than or equal to the first control node, it is determined whether the target adjustment parameter is less than the second control node.

[0135] In an exemplary embodiment, the multiple control nodes also include a third control node, and the control module 608 is also used to control the speed of the heat sink to a third target speed when the target control parameter is less than the second control node; when the target control parameter is greater than or equal to the second control node, determine whether the target control parameter is less than the third control node; when the target control parameter is greater than the third control node, perform over-temperature protection on the target module.

[0136] In an exemplary embodiment, the control module 608 is also used to derate the power of the charging module when the target adjustment parameter is less than the third control node; and after derate the power of the charging module, determine whether the ambient temperature is greater than a second threshold; when the ambient temperature is greater than the second threshold, adopt the second control strategy to regulate the heat sink of the target module, and control the speed of the heat sink to the second target speed; when the ambient temperature is less than or equal to the second threshold, adopt the first control strategy to regulate the heat sink of the target module.

[0137] Each module in the above thermal management device can be implemented in whole or in part by software, hardware, or a combination thereof. Each module can be embedded in or independent of a processor in a computer device in the form of hardware, or can be stored in a memory in a computer device in the form of software, so that the processor can call and execute operations corresponding to each module.

[0138] In an exemplary embodiment, a computer device is provided. The computer device may be a server, and its internal structure diagram may be as shown in FIG. Figure 7 As shown. The computer device includes a processor, a memory, an input / output interface (Input / Output, referred to as I / O) and a communication interface. Among them, the processor, the memory and the input / output interface are connected through a system bus, and the communication interface is connected to the system bus through the input / output interface. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store temperature data. The input / output interface of the computer device is used to exchange information between the processor and an external device. The communication interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, a thermal management method is implemented.

[0139] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0140] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above-mentioned method embodiments when executing the computer program.

[0141] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0142] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0143] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with relevant regulations.

[0144] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetoresistive random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, etc., but are not limited to this.

[0145] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0146] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A thermal management method, characterized in that: The method comprises: Acquire temperature data corresponding to a plurality of components in a target module and an ambient temperature of the target module; Performing calculations on the temperature data corresponding to the plurality of devices to determine the adjustment parameters corresponding to the devices; and determining the target adjustment parameters according to the adjustment parameters corresponding to the devices; Determine a plurality of control nodes according to the temperature data respectively corresponding to the plurality of devices and the target adjustment parameters; The heat sink of the target module is regulated according to the target regulation parameter, the plurality of regulation nodes and the ambient temperature.

2. The method according to claim 1, characterized in that The step of regulating the heat sink of the target module according to the target regulation parameter, the plurality of regulation nodes and the ambient temperature includes: When the ambient temperature is less than a first threshold, a first control strategy is adopted to regulate the heat dissipation element of the target module; When the ambient temperature is greater than or equal to a first threshold, a second control strategy is adopted to regulate the heat dissipation element of the target module.

3. The method according to claim 2, characterized in that The plurality of control nodes include a first control node, and the first control strategy is used to control the heat sink of the target module, including: Determining whether the target adjustment parameter is less than a first control node; When the target adjustment parameter is less than the first control node, controlling the rotation speed of the heat sink to be the first target rotation speed; When the target adjustment parameter is greater than or equal to the first control node, the rotation speed of the heat sink is controlled to be a second target rotation speed.

4. The method according to claim 2, characterized in that: The plurality of control nodes further include a second control node, and the use of a second control strategy to control the heat sink of the target module includes: Determining whether the target adjustment parameter is less than a first control node; When the target adjustment parameter is less than the first control node, controlling the rotation speed of the heat sink to be a second target rotation speed; When the target adjustment parameter is greater than or equal to the first adjustment node, it is determined whether the target adjustment parameter is less than a second adjustment node.

5. The method according to claim 4, characterized in that: The plurality of control nodes further include a third control node, and the use of the second control strategy to control the heat sink of the target module further includes: When the target adjustment parameter is less than the second control node, controlling the rotation speed of the heat sink to be a third target rotation speed; When the target adjustment parameter is greater than or equal to the second adjustment node, it is determined whether the target adjustment parameter is less than a third adjustment node; when the target adjustment parameter is greater than or equal to the third adjustment node, the target module is over-temperature protected.

6. The method according to claim 5, characterized in that: The adopting the second control strategy to regulate the heat sink of the target module also includes: When the target adjustment parameter is less than the third control node, the power of the charging module is reduced; and after the power of the charging module is reduced, it is determined whether the ambient temperature is greater than a second threshold; When the ambient temperature is greater than the second threshold, a second control strategy is adopted to regulate the heat sink of the target module, and the rotation speed of the heat sink is controlled to be a second target rotation speed; When the ambient temperature is less than or equal to the second threshold, a first control strategy is adopted to regulate the heat dissipation element of the target module.

7. The method according to claim 1, characterized in that The temperature data includes a first temperature parameter and a second temperature parameter, and the method further includes: Determining adjustment parameters corresponding to each of the devices according to the first temperature parameter and the second temperature parameter corresponding to each of the devices; comparing the adjustment parameters corresponding to each of the devices to determine target adjustment parameters; Determining a target device corresponding to the target adjustment parameter; A plurality of control nodes are determined according to a first temperature parameter corresponding to the target device.

8. A thermal management device, characterized in that: The device comprises: An acquisition module, used to acquire temperature data corresponding to a plurality of components in a target module and an ambient temperature of the target module; A first determination module is used to perform calculation processing on the temperature data corresponding to the plurality of devices, determine the adjustment parameters corresponding to the devices, and determine the target adjustment parameters according to the adjustment parameters corresponding to the devices; A second determination module is used to determine a plurality of control nodes according to the temperature data respectively corresponding to the plurality of devices and the target adjustment parameter; The control module is used to control the heat sink of the target module according to the target adjustment parameter, the plurality of control nodes and the ambient temperature.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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