Resistance-capacitance-inductance electronic component reliability evaluation method
By determining the target stress conditions and test rules in resistive capacitive-induced electronic components, combining the Weipole distribution and stress acceleration model, a reliability evaluation model is established, which solves the problem that the existing models cannot effectively evaluate inductance and resistance, and achieves rapid evaluation and efficient evaluation efficiency of resistive capacitive-induced electronic components.
Patent Information
- Application Number
- CN202510036355.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-05-13
AI Technical Summary
The existing rapid reliability evaluation model for resistive capacitance-inductance electronic components cannot be effectively applied to inductance and resistance reliability evaluation, and cannot be applied to capacitance reliability evaluation in non-short-circuit failure modes.
By determining the target stress conditions and test rules, high-acceleration reliability tests are implemented, performance parameters and reliability data are obtained, and combined with the Weipole distribution and stress acceleration model, a reliability evaluation model for resistive capacity sensing electronic components is established, and stress acceleration factors are determined to achieve rapid evaluation.
It realizes a rapid evaluation of the reliability of resistive capacitance-inductive electronic components, improves reliability evaluation efficiency, and extends the application scope of the model to capacitance reliability evaluation in non-short-circuit failure mode.
Smart Images
Figure CN119989652A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of electronic component performance evaluation, and in particular relates to a reliability evaluation method for resistor, capacitor and inductor electronic components. Background Art
[0002] Resistors, capacitors and inductors are the three main passive electronic components that are indispensable in the electronics industry. The development of smart phones, IoT, electric vehicles and driverless technology has driven electronic components to develop in the direction of miniaturization, high performance, high reliability and low prices. As one of the smallest units that constitute electronic systems or electronic devices, resistors, capacitors and inductors directly affect the technicality and reliability of the entire electronic device. Therefore, reliability is the key performance indicator of resistors, capacitors and inductors.
[0003] The reliability of RC and inductor electronic components refers to the ability or possibility to perform specified functions without failure within a certain period of time and under certain conditions. The reliability research of RC and inductor is mainly carried out by subjecting them to representative reliability test items, such as temperature shock test, high temperature and high humidity test, life test, impact test, etc. Standards such as AEC-Q200 and MIL-STD-202 require that the reliability test time of RC and inductor is long, such as high temperature and high humidity test and life test are required to be carried out for 1000 hours, so it is necessary to establish a reliability rapid evaluation model, and by applying highly accelerated reliability tests, shorten the test time and improve the efficiency of reliability evaluation.
[0004] Highly accelerated reliability testing is a test method that applies a limit stress far greater than the limit stress specified in the technical conditions without changing the failure mechanism of the product, thereby obtaining the failure data of the product. The limit stress includes a single stress or a combination of stresses. Then, combined with the stress acceleration factor formula, a reliability rapid assessment model for the corresponding stress is obtained, such as the Procopowicz-Vaskas model (PV model), and then various reliability parameters of the product under normal stress conditions are calculated, thereby achieving the purpose of rapid reliability assessment. However, the PV life model has a narrow scope of application and is only applicable to the rapid assessment of capacitor life in short-circuit failure mode. It cannot be applied to the rapid reliability assessment of inductors and resistors, nor can it be applied to other rapid reliability assessments of capacitors in non-short-circuit failure modes. Summary of the invention
[0005] The present invention aims to provide a reliability assessment method for RC and INS electronic components to solve the above technical problems. By establishing a reliability assessment model for RC and INS electronic components, a rapid assessment of the reliability of RC and INS electronic components can be achieved, thereby improving the efficiency of reliability assessment.
[0006] In order to solve the above technical problems, the present invention provides a method for evaluating the reliability of RC and INS electronic components, comprising the following steps:
[0007] Determining target stress conditions, and determining test rules based on the target stress conditions; the test rules comply with standard test conditions;
[0008] Taking the target stress condition as a variable, a highly accelerated reliability test is carried out on the RC / SI electronic components to be evaluated under the test rules to obtain the performance parameters of the RC / SI electronic components;
[0009] Based on performance parameters and target stress conditions, obtain the corresponding reliability data of RC and inductor electronic components under test rules;
[0010] According to Weibull distribution and reliability data, the characteristic life under highly accelerated reliability test conditions is obtained;
[0011] Determine the stress acceleration model based on the target stress conditions, and establish the reliability assessment model of the resistor, capacitor and inductor electronic components by fitting the stress acceleration model and characteristic life;
[0012] Under standard test conditions, the stress acceleration factor is determined based on the reliability assessment model, and the reliability of the resistor, capacitor and inductor electronic components is evaluated based on the stress acceleration factor.
[0013] The above scheme conducts reliability tests on the RC and INS electronic components to be evaluated while determining the target stress conditions and test rules, and then obtains the performance parameters and reliability data of the RC and INS electronic components as a reference, so that the characteristic life of the RC and INS electronic components under the target stress conditions can be calculated according to the Weibull distribution, and a reliability evaluation model of the RC and INS electronic components is established based on the corresponding stress acceleration model and characteristic life under the target stress conditions, and finally the stress acceleration factor can be determined to conduct reliability evaluation on the RC and INS electronic components.
[0014] The stress acceleration factor determined by the above scheme is highly correlated with the performance parameters of electronic components. Different from the stress acceleration factors published in existing literature and standards, the stress acceleration factor determined by this scheme not only has reference value, but its direct application will not lead to the problem of large evaluation errors in the reliability evaluation model, and can effectively improve the accuracy of the reliability evaluation model; furthermore, a reliability evaluation model for RC and INS electronic components can be established to realize rapid evaluation of the reliability of RC and INS electronic components and improve the efficiency of reliability evaluation.
[0015] Furthermore, the RC-SI electronic components include resistors, capacitors and inductors. The performance parameter of a resistor may be a resistance change rate; the performance parameter of a capacitor may be a capacity change rate and / or insulation resistance value; the performance parameter of an inductor may be one or more of an inductance change rate, an impedance change rate and a quality factor change rate.
[0016] Further, the determining of the target stress condition and determining the test rule based on the target stress condition includes:
[0017] Determining a target stress condition, wherein the target stress condition includes a temperature stress condition, a voltage stress condition, a current stress condition, a humidity stress condition, a temperature difference stress condition, or a vibration acceleration stress condition;
[0018] The test rule is determined based on the target stress condition, wherein the test rule is to select different test times or cycle numbers based on the target stress condition in a group of tests.
[0019] It should be noted that the highly accelerated reliability test can be conducted in groups. A group of highly accelerated reliability tests needs to determine different test times or numbers of cycles based on the target stress conditions, and then the performance parameters of each group of RC and INS electronic components can be obtained. Then, the reliability of electronic components under different target stress conditions and different test rules can be analyzed, that is, the proportion of the number of components that have not failed in the test, and finally the reliability data set of electronic components under each target stress condition can be obtained. The reliability data set can be converted into a data table for easy viewing.
[0020] Furthermore, obtaining the characteristic life under the highly accelerated reliability test conditions according to the Weibull distribution and the reliability data includes:
[0021]
[0022] Where T(R) represents the time of specific reliability of Weibull distribution; R represents reliability; α represents characteristic life; and β represents shape parameter.
[0023] Furthermore, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0024] When the target stress condition is a temperature stress condition, the stress acceleration model is determined to be a temperature stress acceleration model;
[0025] Based on the temperature stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0026]
[0027] Where AF Trepresents the temperature stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life at the first test temperature; α2 represents the characteristic life at the second test temperature; T1 represents the Kelvin temperature corresponding to the first test temperature; T2 represents the Kelvin temperature corresponding to the second test temperature; k represents the Boltzmann constant; Ea represents the activation energy.
[0028] Furthermore, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0029] When the target stress condition is a voltage stress condition, the stress acceleration model is determined to be a voltage stress acceleration model;
[0030] Based on the voltage stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0031]
[0032] Where AF V represents the voltage stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test voltage; α2 represents the characteristic life under the second test voltage; V1 represents the first test voltage; V2 represents the second test voltage; N represents the voltage acceleration coefficient.
[0033] Furthermore, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0034] When the target stress condition is a current stress condition, the stress acceleration model is determined to be a current stress acceleration model;
[0035] Based on the current stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0036]
[0037] Where AF I represents the current stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test current; α2 represents the characteristic life under the second test current; I1 represents the first test current; I2 represents the second test current; N2 represents the current acceleration coefficient.
[0038] Furthermore, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0039] When the target stress condition is a humidity stress condition, the stress acceleration model is determined to be a humidity stress acceleration model;
[0040] Based on the humidity stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0041]
[0042] Where AF RH represents the humidity stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test humidity; α2 represents the characteristic life under the second test humidity; RH1 represents the first test humidity; RH2 represents the second test humidity; N3 represents the humidity acceleration coefficient.
[0043] Furthermore, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0044] When the target stress condition is a temperature difference stress condition, the stress acceleration model is determined to be a temperature difference stress acceleration model;
[0045] Based on the temperature difference stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0046]
[0047] Where AF FC represents the temperature difference stress acceleration factor, that is, the reliability assessment model; α1 represents the characteristic life under the first test temperature difference; α2 represents the characteristic life under the second test temperature difference; ΔT1 represents the first test temperature difference, that is, the difference between the highest and lowest temperatures of the first test; ΔT2 represents the second test temperature difference, that is, the difference between the highest and lowest temperatures of the second test; q represents the temperature cycle index.
[0048] Furthermore, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0049] When the target stress condition is a vibration acceleration stress condition, the stress acceleration model is determined to be a vibration acceleration stress acceleration model;
[0050] Based on the vibration acceleration stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0051]
[0052] Where AF G It represents the vibration acceleration stress acceleration factor, that is, the reliability assessment model; α1 represents the characteristic life under the first test vibration acceleration; α2 represents the characteristic life under the second test vibration acceleration; G1 represents the first test vibration acceleration; G2 represents the second test vibration acceleration; N4 represents the acceleration coefficient of vibration acceleration.
[0053] Furthermore, the highly accelerated reliability test may be one or more of a high temperature resistance test, a damp heat test, a life test, a temperature cycle / shock test, and a vibration fatigue life test. Among them, the target stress condition of the high temperature resistance test is the temperature stress condition; the target stress condition of the damp heat test is the temperature stress condition, the humidity stress condition, and the voltage stress condition (or the current stress condition); the target stress condition of the life test is the temperature stress condition and the voltage stress condition (or the current stress condition); the target stress condition of the temperature cycle / shock test is the temperature difference stress condition; and the target stress condition of the vibration fatigue life test is the vibration acceleration stress condition.
[0054] Preferably, the number of test groups for implementing the highly accelerated reliability test on the RC and inductor electronic components to be evaluated under the test rules is 3-6 groups with only the target stress condition as the variable. When the highly accelerated reliability test is a high temperature resistance test, a damp heat test or a life test, the test rule of each group of highly accelerated reliability tests is determined as the test time, and 3-6 test times can be selected for the test; when the highly accelerated reliability test is a temperature cycle / shock test and a vibration fatigue life test, the test rule of each group of highly accelerated reliability tests is determined as the number of cycles, and 3-6 cycles can be selected for the test.
[0055] In the above scheme, selecting 3-6 test times to perform highly accelerated reliability tests can calculate the reliability of electronic components at different times, and selecting 3-6 cycles to perform highly accelerated reliability tests can calculate the reliability of electronic components at different numbers of cycles, thereby accurately obtaining the characteristic life under highly accelerated reliability test conditions.
[0056] Furthermore, the stress acceleration factor is determined based on the reliability evaluation model under standard test conditions, and the reliability evaluation of the RC and inductor electronic components is performed based on the stress acceleration factor, including:
[0057] Under standard test conditions, the stress acceleration factor is calculated based on the preset test target parameters and reliability assessment model;
[0058] The standard test conditions are accelerated based on the stress acceleration factor to achieve reliability evaluation of RC and inductor electronic components.
[0059] Preferably, when the target stress condition is a temperature stress condition, the temperature stress acceleration factor can be linearly fitted by the natural logarithm ln(α) of the characteristic life of several groups of highly accelerated reliability tests and the inverse of the temperature stress 1 / T, so as to obtain the activation energy Ea and further obtain the reliability assessment model expression.
[0060] Preferably, when the target stress condition is a humidity stress condition, a voltage stress condition, a current stress condition or a vibration acceleration stress condition, the corresponding stress acceleration factor can be exponentially fitted by a power exponential fitting of the characteristic life α of several groups of highly accelerated reliability tests and the corresponding stress condition, and the opposite of the exponent is the acceleration coefficient of the corresponding stress, thereby obtaining the corresponding reliability assessment model expression.
[0061] Preferably, when the target stress condition is a temperature difference stress condition, its corresponding stress acceleration factor can be fitted by a power exponential fitting of the characteristic life α and the temperature difference stress condition of several groups of highly accelerated reliability tests, where the exponent is the acceleration coefficient of the corresponding stress, thereby obtaining the corresponding reliability assessment model expression. BRIEF DESCRIPTION OF THE DRAWINGS
[0062] Figure 1 A schematic flow chart of a method for evaluating the reliability of RC and I electronic components provided by one embodiment of the present invention. DETAILED DESCRIPTION
[0063] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0064] See also Figure 1 This embodiment provides a method for evaluating the reliability of RC and IR electronic components, comprising the following steps:
[0065] S1: determining a target stress condition, and determining a test rule based on the target stress condition; the test rule complies with a standard test condition;
[0066] S2: Taking the target stress condition as a variable, a highly accelerated reliability test is performed on the RC / SI electronic components to be evaluated under the test rules to obtain the performance parameters of the RC / SI electronic components;
[0067] S3: Based on the performance parameters and target stress conditions, obtain the corresponding reliability data of the RC and I / O electronic components under the test rules;
[0068] S4: Based on the Weibull distribution and reliability data, obtain the characteristic life under the conditions of highly accelerated reliability test;
[0069] S5: Determine the stress acceleration model based on the target stress condition, and fit the stress acceleration model and characteristic life to establish the reliability assessment model of the RC and inductor electronic components;
[0070] S6: Under standard test conditions, determine the stress acceleration factor based on the reliability assessment model, and perform reliability assessment on the RC and I electronic components based on the stress acceleration factor.
[0071] In this embodiment, when the target stress conditions and test rules are determined, the reliability test of the RC and INS electronic components to be evaluated is carried out, and the performance parameters and reliability data of the RC and INS electronic components can be obtained as a reference, so that the characteristic life of the RC and INS electronic components under the target stress conditions can be calculated according to the Weibull distribution, and a reliability evaluation model of the RC and INS electronic components can be established based on the corresponding stress acceleration model and characteristic life under the target stress conditions, and finally the stress acceleration factor can be determined to conduct reliability evaluation of the RC and INS electronic components.
[0072] The stress acceleration factor determined in this embodiment is highly correlated with the performance parameters of the electronic components. Different from the stress acceleration factors published in existing literature and standards, the stress acceleration factor determined in this scheme not only has reference value, but its direct application will not lead to the problem of large evaluation errors in the reliability evaluation model, and can effectively improve the accuracy of the reliability evaluation model; furthermore, a reliability evaluation model for RC and INS electronic components can be established to realize rapid evaluation of the reliability of RC and INS electronic components and improve the efficiency of reliability evaluation.
[0073] In one embodiment, the RC-SI electronic components include resistors, capacitors and inductors. The performance parameter of the resistor may be the resistance change rate; the performance parameter of the capacitor may be the capacity change rate and / or the insulation resistance value; the performance parameter of the inductor may be one or more of the inductance change rate, impedance change rate and quality factor change rate.
[0074] In one embodiment, determining the target stress condition and determining the test rule based on the target stress condition includes:
[0075] Determining a target stress condition, wherein the target stress condition includes a temperature stress condition, a voltage stress condition, a current stress condition, a humidity stress condition, a temperature difference stress condition, or a vibration acceleration stress condition;
[0076] The test rule is determined based on the target stress condition, wherein the test rule is to select different test times or cycle numbers based on the target stress condition in a group of tests.
[0077] It should be noted that the highly accelerated reliability test can be conducted in groups. A group of highly accelerated reliability tests needs to determine different test times or numbers of cycles based on the target stress conditions, and then the performance parameters of each group of RC and INS electronic components can be obtained. Then, the reliability of electronic components under different target stress conditions and different test rules can be analyzed, that is, the proportion of the number of components that have not failed in the test, and finally the reliability data set of electronic components under each target stress condition can be obtained. The reliability data set can be converted into a data table for easy viewing.
[0078] In one embodiment, obtaining the characteristic life under the highly accelerated reliability test conditions according to the Weibull distribution and the reliability data includes:
[0079]
[0080] Where T(R) represents the time of specific reliability of Weibull distribution; R represents reliability; α represents characteristic life; and β represents shape parameter.
[0081] In one embodiment, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0082] When the target stress condition is a temperature stress condition, the stress acceleration model is determined to be a temperature stress acceleration model;
[0083] Based on the temperature stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0084]
[0085] Where AF T represents the temperature stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life at the first test temperature; α2 represents the characteristic life at the second test temperature; T1 represents the Kelvin temperature corresponding to the first test temperature; T2 represents the Kelvin temperature corresponding to the second test temperature; k represents the Boltzmann constant; Ea represents the activation energy.
[0086] In one embodiment, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0087] When the target stress condition is a voltage stress condition, the stress acceleration model is determined to be a voltage stress acceleration model;
[0088] Based on the voltage stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0089]
[0090] Where AF V represents the voltage stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test voltage; α2 represents the characteristic life under the second test voltage; V1 represents the first test voltage; V2 represents the second test voltage; N represents the voltage acceleration coefficient.
[0091] In one embodiment, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0092] When the target stress condition is a current stress condition, the stress acceleration model is determined to be a current stress acceleration model;
[0093] Based on the current stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0094]
[0095] Where AF I represents the current stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test current; α2 represents the characteristic life under the second test current; I1 represents the first test current; I2 represents the second test current; N2 represents the current acceleration coefficient.
[0096] In one embodiment, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0097] When the target stress condition is a humidity stress condition, the stress acceleration model is determined to be a humidity stress acceleration model;
[0098] Based on the humidity stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0099]
[0100] Where AF RHrepresents the humidity stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test humidity; α2 represents the characteristic life under the second test humidity; RH1 represents the first test humidity; RH2 represents the second test humidity; N3 represents the humidity acceleration coefficient.
[0101] In one embodiment, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0102] When the target stress condition is a temperature difference stress condition, the stress acceleration model is determined to be a temperature difference stress acceleration model;
[0103] Based on the temperature difference stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0104]
[0105] Where AF FC represents the temperature difference stress acceleration factor, that is, the reliability assessment model; α1 represents the characteristic life under the first test temperature difference; α2 represents the characteristic life under the second test temperature difference; ΔT1 represents the first test temperature difference, that is, the difference between the highest and lowest temperatures of the first test; ΔT2 represents the second test temperature difference, that is, the difference between the highest and lowest temperatures of the second test; q represents the temperature cycle index.
[0106] In one embodiment, the stress acceleration model is determined based on the target stress condition, and the reliability assessment model of the RC and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including:
[0107] When the target stress condition is a vibration acceleration stress condition, the stress acceleration model is determined to be a vibration acceleration stress acceleration model;
[0108] Based on the vibration acceleration stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows:
[0109]
[0110] Where AF G It represents the vibration acceleration stress acceleration factor, that is, the reliability assessment model; α1 represents the characteristic life under the first test vibration acceleration; α2 represents the characteristic life under the second test vibration acceleration; G1 represents the first test vibration acceleration; G2 represents the second test vibration acceleration; N4 represents the acceleration coefficient of vibration acceleration.
[0111] In one embodiment, the highly accelerated reliability test may be one or more of a high temperature test, a damp heat test, a life test, a temperature cycle / shock test, and a vibration fatigue life test. Among them, the target stress condition of the high temperature test is the temperature stress condition; the target stress condition of the damp heat test is the temperature stress condition, the humidity stress condition, and the voltage stress condition (or the current stress condition); the target stress condition of the life test is the temperature stress condition and the voltage stress condition (or the current stress condition); the target stress condition of the temperature cycle / shock test is the temperature difference stress condition; and the target stress condition of the vibration fatigue life test is the vibration acceleration stress condition.
[0112] Preferably, the number of test groups for implementing the highly accelerated reliability test on the RC and inductor electronic components to be evaluated under the test rules is 3-6 groups with only the target stress condition as the variable. When the highly accelerated reliability test is a high temperature resistance test, a damp heat test or a life test, the test rule of each group of highly accelerated reliability tests is determined as the test time, and 3-6 test times can be selected for the test; when the highly accelerated reliability test is a temperature cycle / shock test and a vibration fatigue life test, the test rule of each group of highly accelerated reliability tests is determined as the number of cycles, and 3-6 cycles can be selected for the test.
[0113] In this embodiment, selecting 3-6 test times to perform a highly accelerated reliability test can calculate the reliability of electronic components at different times, and selecting 3-6 cycles to perform a highly accelerated reliability test can calculate the reliability of electronic components at different numbers of cycles, thereby accurately obtaining the characteristic life under the conditions of a highly accelerated reliability test.
[0114] In one embodiment, the step of determining the stress acceleration factor based on the reliability assessment model under standard test conditions, and performing reliability assessment on the RC and INS electronic components based on the stress acceleration factor, includes:
[0115] Under standard test conditions, the stress acceleration factor is calculated based on the preset test target parameters and reliability assessment model;
[0116] The standard test conditions are accelerated based on the stress acceleration factor to achieve reliability evaluation of RC and inductor electronic components.
[0117] Preferably, when the target stress condition is a temperature stress condition, the temperature stress acceleration factor can be linearly fitted by the natural logarithm ln(α) of the characteristic life of several groups of highly accelerated reliability tests and the inverse of the temperature stress 1 / T, so as to obtain the activation energy Ea and further obtain the reliability assessment model expression.
[0118] Preferably, when the target stress condition is a humidity stress condition, a voltage stress condition, a current stress condition or a vibration acceleration stress condition, the corresponding stress acceleration factor can be obtained by performing power exponential fitting on the characteristic life α of several groups of highly accelerated reliability tests and the corresponding stress condition to obtain an exponent, and the opposite of the exponent is the acceleration coefficient of the corresponding stress, thereby obtaining the corresponding reliability assessment model expression.
[0119] Preferably, when the target stress condition is a temperature difference stress condition, its corresponding stress acceleration factor can be obtained by performing power exponential fitting of the characteristic life α of several groups of highly accelerated reliability tests and the temperature difference stress condition to obtain an exponent, where the exponent is the acceleration coefficient of the corresponding stress, and then the corresponding reliability assessment model expression is obtained.
[0120] It should be noted that the first test and the second test involved in the above embodiment need to be determined according to the actual test process. The data before the test can be used as the first test, and the data after the test can be used as the second test, or vice versa. That is, the embodiment only provides a calculation method. Since each test includes multiple groups, the calculation process of each group needs to substitute the first test and the second test into the calculation. Therefore, the first test and the second test do not specifically refer to any test process. In the actual implementation process, only the corresponding data needs to be substituted according to the actual calculation requirements to calculate the final result.
[0121] In order to further illustrate the technical points of the present invention and highlight its technical advantages, this embodiment provides a rapid evaluation process of the wet heat reliability of a chip resistor, specifically:
[0122] 1) Select temperature stress condition as variable, humidity and voltage fixed at 85%RH and 10% rated power, and implement three groups of damp heat tests. One group of damp heat tests selects three test times, and then the resistance parameters of the chip resistor can be obtained.
[0123] 2) According to the resistance parameters of the chip resistor, the reliability data of the chip resistor corresponding to the reliability components of different test times under different temperature stress conditions are analyzed, as shown in Table 1:
[0124] Table 1 Reliability of damp heat test conditions and different test times
[0125]
[0126]
[0127] 3) According to the Weibull distribution and reliability data, the characteristic life α under the highly accelerated damp heat test conditions is obtained, where: the calculated α at 115°C is 4200h, the α at 125°C is 1804h, and the α at 135°C is 1017h;
[0128] 4) According to the calculation formula of the temperature stress acceleration factor, the characteristic life and temperature stress conditions of the three groups of highly accelerated reliability tests are fitted, and the activation energy Ea is obtained as 0.97eV, and then the reliability rapid evaluation model is obtained. The calculation formula of the temperature stress acceleration factor is specifically expressed as:
[0129]
[0130] 5) AEC-Q200 requires that the damp heat test conditions for automotive grade resistors be 85°C, 85% RH, 10% rated power, and the test should be 1000h. If the temperature stress condition is increased to 125°C, according to the reliability rapid assessment model, the stress acceleration factor AF T =23.49, specifically expressed as:
[0131]
[0132] Therefore, at 125°C, 85% RH, and 10% rated power, the stress acceleration factor AF is T =23.49, the test time of 1000h can be shortened to 42.57h, thus realizing a rapid evaluation of the moisture and heat resistance reliability of the sheet.
[0133] In order to further illustrate the technical points of the present invention and highlight its technical advantages, this embodiment provides a rapid assessment process of vibration fatigue reliability of high-frequency inductors, specifically:
[0134] 1) Select vibration acceleration stress condition as variable, fix the frequency range to 10Hz~2kHz, one cycle is 20min, the number of cycles in X, Y and Z directions is the same, and implement three groups of vibration fatigue life tests. One group of vibration fatigue life tests selects three cycles, and then the inductance and quality factor parameters of high-frequency inductance can be obtained.
[0135] 2) According to the inductance and quality factor parameters of the high-frequency inductor, the reliability data of the reliability components corresponding to the high-frequency inductor with different numbers of cycles under different vibration acceleration stress conditions are analyzed, as shown in Table 2:
[0136] Table 2 Vibration fatigue life test conditions and reliability of different cycle numbers
[0137]
[0138] 3) According to the Weibull distribution and reliability data, the characteristic life α under the high acceleration vibration fatigue life test conditions is obtained, where: the calculated α of 15g acceleration is 5300, the α of 15g acceleration is 4298, and the α of 15g acceleration is 4003;
[0139] 4) According to the calculation formula of vibration acceleration stress acceleration factor, the characteristic life and vibration acceleration stress conditions of three groups of high acceleration reliability tests are fitted, and the vibration acceleration acceleration coefficient is obtained as 2.46, and then the reliability rapid assessment model is obtained. The calculation formula of vibration acceleration stress acceleration factor is specifically expressed as:
[0140]
[0141] 3) AEC-Q200 requires that the vibration fatigue life test conditions for automotive high-frequency inductors are 5g acceleration, 10Hz~2kHz, 20min per cycle, and 12 cycles in the X, Y, and Z directions. If the vibration acceleration stress is increased to 10g, according to the reliability rapid assessment model, the stress acceleration factor AF G =5.5, specifically expressed as:
[0142]
[0143] Therefore, at 10g, 10Hz~2kHz, and a cycle of 20min, the stress acceleration factor AF is G =5.5, the number of cycles in the X, Y, and Z directions can be shortened from 12 to 2.2, thus achieving a rapid assessment of the high-frequency inductive vibration fatigue reliability.
[0144] In this embodiment, the stress acceleration coefficient or activation energy Ea is highly correlated with the product material and process technology. Different from the stress acceleration factors published in existing literature, standards, etc., the stress acceleration factor determined in this embodiment not only has reference value, but its direct application will not lead to the problem of large evaluation errors in the reliability evaluation model, and can effectively improve the accuracy of the reliability evaluation model; furthermore, a reliability evaluation model for RC and INS electronic components can be established to realize rapid evaluation of the reliability of RC and INS electronic components, and can also be applied to rapid evaluation of capacitor reliability in non-short circuit failure modes, thereby improving the efficiency and applicability of reliability evaluation.
[0145] The specific embodiments described above further describe the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.
Claims
1. A method for evaluating the reliability of RC and inductive electronic components, characterized in that: The following steps are involved: Determining target stress conditions, and determining test rules based on the target stress conditions; the test rules comply with standard test conditions; Taking the target stress condition as a variable, a highly accelerated reliability test is carried out on the RC / SI electronic components to be evaluated under the test rules to obtain the performance parameters of the RC / SI electronic components; Based on performance parameters and target stress conditions, obtain the corresponding reliability data of RC and inductor electronic components under test rules; According to Weibull distribution and reliability data, the characteristic life under highly accelerated reliability test conditions is obtained; Determine the stress acceleration model based on the target stress conditions, and fit the stress acceleration model and characteristic life to establish a reliability assessment model for resistors, capacitors, and inductors; Under standard test conditions, the stress acceleration factor is determined based on the reliability assessment model, and the reliability of the resistor, capacitor and inductor electronic components is evaluated based on the stress acceleration factor.
2. A method for evaluating the reliability of RC and inductive electronic components according to claim 1, characterized in that: The step of determining the target stress condition and determining the test rule based on the target stress condition includes: Determining a target stress condition, wherein the target stress condition includes a temperature stress condition, a voltage stress condition, a current stress condition, a humidity stress condition, a temperature difference stress condition, or a vibration acceleration stress condition; The test rule is determined based on the target stress condition, wherein the test rule is to select different test times or cycle numbers based on the target stress condition in a group of tests.
3. The reliability evaluation method of a RC / SI electronic component according to claim 1, characterized in that: The method of obtaining the characteristic life under the highly accelerated reliability test conditions based on the Weibull distribution and reliability data includes: Where T(R) represents the time of specific reliability of Weibull distribution; R represents reliability; α represents characteristic life; and β represents shape parameter.
4. A method for evaluating the reliability of RC and inductive electronic components according to claim 2, characterized in that: The stress acceleration model is determined based on the target stress condition, and the reliability evaluation model of the resistor, capacitor and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including: When the target stress condition is a temperature stress condition, the stress acceleration model is determined to be a temperature stress acceleration model; Based on the temperature stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows: Where AF T represents the temperature stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life at the first test temperature; α2 represents the characteristic life at the second test temperature; T1 represents the Kelvin temperature corresponding to the first test temperature; T2 represents the Kelvin temperature corresponding to the second test temperature; k represents the Boltzmann constant; Ea represents the activation energy.
5. The reliability evaluation method of a RC / SI electronic component according to claim 2, characterized in that: The stress acceleration model is determined based on the target stress condition, and the reliability evaluation model of the resistor, capacitor and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including: When the target stress condition is a voltage stress condition, the stress acceleration model is determined to be a voltage stress acceleration model; Based on the voltage stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows: Where AF V represents the voltage stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test voltage; α2 represents the characteristic life under the second test voltage; V1 represents the first test voltage; V2 represents the second test voltage; N represents the voltage acceleration coefficient.
6. A method for evaluating the reliability of RC and inductive electronic components according to claim 2, characterized in that: The stress acceleration model is determined based on the target stress condition, and the reliability evaluation model of the resistor, capacitor and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including: When the target stress condition is a current stress condition, the stress acceleration model is determined to be a current stress acceleration model; Based on the current stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows: Where AF I represents the current stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test current; α2 represents the characteristic life under the second test current; I1 represents the first test current; I2 represents the second test current; N2 represents the current acceleration coefficient.
7. A method for evaluating the reliability of RC and inductive electronic components according to claim 2, characterized in that: The stress acceleration model is determined based on the target stress condition, and the reliability evaluation model of the resistor, capacitor and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including: When the target stress condition is a humidity stress condition, the stress acceleration model is determined to be a humidity stress acceleration model; Based on the humidity stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows: Where AF RH represents the humidity stress acceleration factor, i.e., the reliability assessment model; α1 represents the characteristic life under the first test humidity; α2 represents the characteristic life under the second test humidity; RH1 represents the first test humidity; RH2 represents the second test humidity; N3 represents the humidity acceleration coefficient.
8. The reliability evaluation method of RC inductor electronic components according to claim 2 is characterized in that: The stress acceleration model is determined based on the target stress condition, and the reliability evaluation model of the resistor, capacitor and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including: When the target stress condition is a temperature difference stress condition, the stress acceleration model is determined to be a temperature difference stress acceleration model; Based on the temperature difference stress acceleration model and characteristic life fitting, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows: Where AF FC represents the temperature difference stress acceleration factor, that is, the reliability assessment model; α1 represents the characteristic life under the first test temperature difference; α2 represents the characteristic life under the second test temperature difference; ΔT1 represents the first test temperature difference, that is, the difference between the highest and lowest temperatures of the first test; ΔT2 represents the second test temperature difference, that is, the difference between the highest and lowest temperatures of the second test; q represents the temperature cycle index.
9. A method for evaluating the reliability of RC and inductive electronic components according to claim 2, characterized in that: The stress acceleration model is determined based on the target stress condition, and the reliability evaluation model of the resistor, capacitor and inductor electronic components is established by fitting the stress acceleration model and the characteristic life, including: When the target stress condition is a vibration acceleration stress condition, the stress acceleration model is determined to be a vibration acceleration stress acceleration model; Based on the vibration acceleration stress acceleration model and characteristic life, a reliability evaluation model for resistor, capacitor and inductor electronic components is established, which is specifically expressed as follows: Where AF G It represents the vibration acceleration stress acceleration factor, that is, the reliability assessment model; α1 represents the characteristic life under the first test vibration acceleration; α2 represents the characteristic life under the second test vibration acceleration; G1 represents the first test vibration acceleration; G2 represents the second test vibration acceleration; N4 represents the acceleration coefficient of vibration acceleration.
10. A method for evaluating the reliability of RC inductor electronic components according to any one of claims 1 to 9, characterized in that: The method of determining the stress acceleration factor based on the reliability evaluation model under standard test conditions and performing reliability evaluation on the resistor, capacitor and inductor electronic components based on the stress acceleration factor includes: Under standard test conditions, the stress acceleration factor is calculated based on the preset test target parameters and reliability assessment model; The standard test conditions are accelerated based on the stress acceleration factor to achieve reliability evaluation of RC and inductor electronic components.