Temperature alarm method and device, semiconductor process equipment and electronic equipment

Abstract

The embodiment of the invention provides a temperature alarm method and device, semiconductor process equipment and electronic equipment, the temperature alarm method is applied to the semiconductor process equipment, a plurality of heating bands are arranged in the semiconductor process equipment, and the temperature alarm method comprises the following steps: obtaining process information of a target heating band; determining a target safe temperature range of the target heating band based on the process information of the target heating band; the target safe temperature range corresponds to the process information of the target heating band; and when the current temperature of the target heating band is out of the target safety temperature range of the target heating band, outputting a temperature alarm for the target heating band. Different heating bands are distinguished through the heating band marks, and meanwhile, gas introduced into the pipeline is taken into consideration. Therefore, a more reasonable safe temperature range can be determined for the target heating tape, and the temperature false alarm condition in the process production process is reduced.

Description

Technical Field

[0001] The implementation methods in this specification relate to the field of production process technology, specifically, to alarm technology in the field of production process technology, and more specifically, to a temperature alarm method, device, semiconductor process equipment and electronic equipment. Background Art

[0002] On semiconductor process equipment, heating belts are distributed in the air intake and exhaust pipes of the equipment. The heating belts are controlled by the temperature control system to achieve preheating of process gases before entering the reaction chamber and heating of process exhaust gases. In order to meet process requirements and ensure the safety of personnel and equipment, a temperature alarm mechanism is required to avoid adverse consequences caused by excessively high heating belt temperatures. Figure 1 As shown, the temperature alarm threshold of the heating belt is usually set based on experience, and then the temperature of the heating belt is collected in real time during the process production. It is judged whether the real-time collected heating belt temperature exceeds the alarm threshold. If not, the temperature is collected and judged. If not, an abnormal temperature alarm is issued for the heating belt output.

[0003] However, with the continuous advancement of process production, the production environment is becoming more and more complex, and the use of the current temperature alarm mechanism will produce more false alarms. Summary of the invention

[0004] Multiple embodiments in this specification provide a temperature alarm method, device, semiconductor process equipment and electronic equipment to achieve the purpose of reducing the occurrence of false temperature alarms during the process production process.

[0005] In a first aspect, an embodiment of the present specification provides a temperature alarm method, which is applied to a semiconductor process equipment, wherein a plurality of heating belts are provided in the semiconductor process equipment, and the temperature alarm method comprises:

[0006] Acquire process information of a target heating belt, wherein the process information includes a first gas identifier and a first heating belt identifier, the first gas identifier being a gas identifier of a gas currently flowing through a pipeline covered by the target heating belt; the first heating belt identifier being a heating belt identifier of the target heating belt; the target heating belt being any heating belt among the multiple heating belts;

[0007] Based on the process information of the target heating zone, determining a target safety temperature range of the target heating zone; the target safety temperature range corresponds to the process information of the target heating zone;

[0008] When the current temperature of the target heating zone is outside the target safety temperature range of the target heating zone, a temperature alarm for the target heating zone is output.

[0009] In some embodiments, determining a target safe temperature range of the target heating zone based on process information of the target heating zone includes:

[0010] Based on the process information of the target heating belt, determine the target safety temperature range corresponding to the process information of the target heating belt in the temperature alarm library; wherein the temperature alarm library is used to store the correspondence between the target safety temperature range and the process information of the target heating belt.

[0011] In some embodiments, the temperature alarm library includes: a plurality of groups with heating belt identification and gas identification as group identification; wherein each group includes a safe temperature range when the gas of the current group passes through the pipeline covered by the heating belt of the current group; the heating belt of the current group is the heating belt indicated by the heating belt identification of the current group, and the gas of the current group is the gas indicated by the gas identification of the current group;

[0012] Based on the process information of the target heating belt, determining a target safe temperature range corresponding to the process information of the target heating belt in a temperature alarm library includes:

[0013] Based on the first gas identifier and the first heating zone identifier, determining a corresponding target group in the temperature alarm library;

[0014] The safe temperature range in the target group is determined as the target safe temperature range corresponding to the process information of the target heating zone.

[0015] In some embodiments, before obtaining the process information of the target heating zone, the method further includes:

[0016] Obtaining heating belt distribution information of the semiconductor process equipment and historical data during the target operation time of the semiconductor process equipment; wherein the heating belt distribution information includes: the corresponding relationship between the plurality of heating belts and the gas flowing through the pipelines covered by the heating belts; the historical data includes the temperature of each heating belt at each operation time and the gas identification of the gas flowing through the pipelines covered by the heating belts;

[0017] Determine the temperature range of the heating zone in each of the groups based on the heating zone distribution information and the historical data;

[0018] The temperature alarm library is generated based on the temperature range of the heating belts in each of the groups.

[0019] In some embodiments, determining the temperature range of the heating belt in each group based on the heating belt distribution information and the historical data includes:

[0020] Inputting the heating zone distribution information and the historical data into a preset data model;

[0021] Determine a plurality of the groups based on the heating belt distribution information by using the preset data model, and count the maximum temperature and the minimum temperature of the heating belt at each operating time for each group;

[0022] The temperature range between the lowest temperature and the highest temperature in each of the groups is determined by the preset data model as the temperature range of the heating zone temperature in each of the groups.

[0023] In some embodiments, before determining the target safe temperature range corresponding to the process information of the target heating belt in the temperature alarm library based on the process information of the target heating belt, the method further includes:

[0024] Acquire initial temperature alarm data of the semiconductor process equipment; wherein the initial temperature alarm data is determined based on test data of the semiconductor process equipment before it leaves the factory;

[0025] The initial temperature alarm data is corrected based on the test data of the semiconductor process equipment after leaving the factory to obtain the temperature alarm library.

[0026] In some embodiments, the step of obtaining the first gas identifier in the process information of the target heating zone includes:

[0027] Obtaining the switch status of the gas switch in the pipeline covered by the target heating belt and the current process step;

[0028] Based on the process steps and the switch state of the gas switch, determining the gas currently flowing through the pipeline covered by the target heating belt;

[0029] The gas identifier of the gas currently flowing through the pipeline covered by the target heating belt is determined as the first gas identifier.

[0030] In a second aspect, an embodiment of the present specification provides a temperature alarm device, which is applied to a semiconductor process equipment, wherein a plurality of heating belts are provided in the semiconductor process equipment, and the temperature alarm device comprises:

[0031] An acquisition module, used for acquiring process information of a target heating belt, wherein the process information includes a first gas identifier and a first heating belt identifier, the first gas identifier being a gas identifier of a gas currently passing through a pipeline covered by the target heating belt; the first heating belt identifier being a heating belt identifier of the target heating belt; the target heating belt being any heating belt among the multiple heating belts;

[0032] A safety range determination module, configured to determine a target safety temperature range of the target heating zone based on the process information of the target heating zone; the target safety temperature range corresponds to the process information of the target heating zone;

[0033] The alarm module is used to output a temperature alarm for the target heating belt when the current temperature of the target heating belt is outside the target safety temperature range of the target heating belt.

[0034] In some embodiments, the safety range determination module is specifically used to determine the target safety temperature range corresponding to the process information of the target heating belt in the temperature alarm library based on the process information of the target heating belt; wherein the temperature alarm library is used to store the correspondence between the target safety temperature range and the process information of the target heating belt.

[0035] In some embodiments, the temperature alarm library includes: a plurality of groups with heating belt identification and gas identification as group identification; wherein each group includes a safe temperature range when the gas of the current group passes through the pipeline covered by the heating belt of the current group; the heating belt of the current group is the heating belt indicated by the heating belt identification of the current group, and the gas of the current group is the gas indicated by the gas identification of the current group;

[0036] Security scope determination module, including:

[0037] a group determination unit, configured to determine a corresponding target group in the temperature alarm library based on the first gas identifier and the first heating zone identifier;

[0038] The safety range determination unit is used to determine the safety temperature range in the target group as the target safety temperature range corresponding to the process information of the target heating zone.

[0039] In some embodiments, the device further comprises:

[0040] The first generation module of the alarm library is used to obtain the heating belt distribution information of the semiconductor process equipment and the historical data of the semiconductor process equipment during the target operation time; wherein the heating belt distribution information includes: the corresponding relationship between the plurality of heating belts and the gas flowing through the pipelines covered by the heating belts; the historical data includes the temperature of each heating belt at each operation time and the gas identification of the gas flowing through the pipelines covered by the heating belts;

[0041] A second generation module of the alarm library is used to determine the temperature range of the heating belt in each of the groups based on the heating belt distribution information and the historical data;

[0042] The third alarm library generation module is used to generate the temperature alarm library based on the temperature range of the heating belt in each group.

[0043] In some implementations, the second generation module of the alarm library is specifically used to:

[0044] Inputting the heating zone distribution information and the historical data into a preset data model;

[0045] Determine a plurality of the groups based on the heating belt distribution information by using the preset data model, and count the maximum temperature and the minimum temperature of the heating belt at each operating time for each group;

[0046] The temperature range between the lowest temperature and the highest temperature in each of the groups is determined by the preset data model as the temperature range of the heating zone temperature in each of the groups.

[0047] In some embodiments, the device further comprises:

[0048] An initial alarm module, used to obtain initial temperature alarm data of the semiconductor process equipment; wherein the initial temperature alarm data is determined based on test data of the semiconductor process equipment before leaving the factory;

[0049] The alarm data correction module is used to correct the initial temperature alarm data based on the test data of the semiconductor process equipment after leaving the factory to obtain the temperature alarm library.

[0050] In some embodiments, the step of obtaining the first gas identifier in the process information of the target heating zone by the acquisition module includes:

[0051] Obtaining the switch status of the gas switch in the pipeline covered by the target heating belt and the current process step;

[0052] Based on the process steps and the switch state of the gas switch, determining the gas currently flowing through the pipeline covered by the target heating belt;

[0053] The gas identifier of the gas currently flowing through the pipeline covered by the target heating belt is determined as the first gas identifier.

[0054] In a third aspect, an embodiment of the present specification provides a semiconductor process equipment, including: a host computer, a slave computer connected to the host computer, a hardware control system connected to the slave computer, and a heating belt for performing heat treatment;

[0055] The hardware control system is used to detect the process information of the heating belt and send the detected process information to the lower computer; the lower computer is used to execute the temperature alarm method as described in the first aspect to output a temperature alarm to the upper computer, and the upper computer is used to respond to the temperature alarm when receiving the temperature alarm from the lower computer.

[0056] In some implementations, the host computer is also used to:

[0057] Obtaining heating belt distribution information and historical data during the target operation time of the semiconductor process equipment; wherein the heating belt distribution information includes: the corresponding relationship between the heating belt and the gas flowing through the pipeline covered by the heating belt; the historical data includes the temperature of each heating belt and the gas identification of the gas flowing through the pipeline covered by the heating belt at each operation time;

[0058] The heating zone distribution information and the historical data are sent to the lower computer, so that the lower computer generates a temperature alarm library based on the heating zone distribution information and the historical data.

[0059] In some embodiments, the host computer is specifically used to: obtain a gas circuit schematic diagram and a heating zone distribution diagram of the semiconductor process equipment, and determine the heating zone distribution information based on the gas circuit schematic diagram and the heating zone distribution diagram.

[0060] In a fourth aspect, an embodiment of this specification provides an electronic device, including a processor and a memory;

[0061] Wherein, the memory is connected to the processor, and the memory is used to store a computer program;

[0062] The processor is used to implement the temperature alarm method as described in the first aspect by running the computer program stored in the memory.

[0063] In a fifth aspect, an embodiment of the present specification provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the temperature alarm method as described in the first aspect is implemented.

[0064] In a sixth aspect, an embodiment of the present specification provides a computer program product or a computer program, wherein the computer program product includes a computer program, and the computer program is stored in a computer-readable storage medium; the processor of the computer device reads the computer program from the computer-readable storage medium, and when the processor executes the computer program, the steps of the temperature alarm method described in the first aspect are implemented.

[0065] The multiple implementation methods provided in this specification, for any heating belt in the semiconductor process equipment, that is, the target heating belt, first obtain its process information, so as to determine the heating belt identification of the target heating belt and the gas identification of the gas currently passing through the pipeline covered by the target heating belt. Then, based on the corresponding gas identification and heating belt identification, the target safety temperature range of the target heating belt is determined in a targeted manner. The present application not only realizes the distinction between different heating belts through the heating belt identification, but also takes into account the gas passing through the pipeline. Thereby, a more reasonable safety temperature range can be determined for the target heating belt. Compared with using the same safety temperature range for each heating belt, the present application is undoubtedly more targeted. When realizing the temperature alarm based on the current temperature of the target heating belt and the target safety temperature range, it can avoid the false alarm caused by the inappropriate safety temperature range, and reduce the occurrence of false temperature alarms in the process production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 A schematic diagram of a traditional implementation method of a temperature alarm provided in one embodiment of this specification;

[0067] Figure 2 A semiconductor process equipment structure provided as one embodiment of the present specification;

[0068] Figure 3 A schematic flow chart of a temperature alarm method provided for one embodiment of this specification;

[0069] Figure 4 An architectural diagram of a preset data model provided for one embodiment of this specification;

[0070] Figure 5 A practical application flow chart of a temperature alarm method provided in one embodiment of this specification;

[0071] Figure 6 A schematic diagram of the structure of a temperature alarm device provided in one embodiment of this specification;

[0072] Figure 7 A schematic diagram of the structure of an electronic device provided for one embodiment of the present specification. DETAILED DESCRIPTION

[0073] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this specification shall have the common meanings understood by persons with ordinary skills in the field to which this specification belongs. The words "first", "second" and similar words used in the embodiments of this specification do not indicate any order, quantity or importance, but are only used to avoid confusion of constituent elements.

[0074] Unless the context requires otherwise, throughout the specification, "plurality" means "at least two", and "including" is interpreted as an open, inclusive meaning, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" are intended to indicate that a particular feature, structure, material or characteristic associated with the embodiment or example is included in at least one embodiment or example of the specification. The schematic representation of the above terms does not necessarily refer to the same embodiment or example.

[0075] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0076] Overview

[0077] As described in the background technology, with the continuous advancement of process production, the production environment is becoming more and more complex. Figure 2 As shown, a plurality of distributed heating belts are usually provided in semiconductor process equipment. Among them, the distribution of the intake heating belt can determine that the process gas flows from the pipeline into the process chamber via the pressure sensor, the pneumatic valve and the mass flow meter. The pipeline is covered with a heating belt for heating. The distribution of the exhaust heating belt can determine that the process gas coming out of the process chamber flows from the pipeline into the factory end via the vacuum gauge, and the pipeline is also covered with a heating belt for heating. A heating belt is also provided in the process chamber. During the process production process, each heating belt is required to perform heat treatment according to the requirements of normal pressure and temperature, normal pressure and high heat, low pressure and high heat, and vacuum and high heat.

[0078] At this time, if you use Figure 1 The temperature alarm mechanism shown in the figure will undoubtedly cause a large number of false alarms because it does not take into account the complex production environment of semiconductor process equipment. In order to reduce the occurrence of false alarms, the inventor has found through research that the production environment of each heating belt can be considered, so as to set a reasonable temperature alarm threshold for each heating belt. This can greatly reduce the occurrence of false alarms.

[0079] Based on the above concept, an embodiment of the present specification provides a temperature alarm method, which will be described exemplarily in conjunction with the accompanying drawings.

[0080] Exemplary Methods

[0081] Taking semiconductor process equipment as an example, the embodiment of this specification provides a temperature alarm method, in which a plurality of heating belts are arranged in the semiconductor process equipment, and the heating belts cover the ventilation pipes in the semiconductor process equipment. During the process production, the semiconductor process equipment heat treats the gas in the pipes covered by the heating belts. For example Figure 2 As shown, the semiconductor process equipment is provided with multiple heating belts in a distributed manner. Figure 3 As shown, it may include:

[0082] S301: Acquire process information of the target heating zone.

[0083] In this step, the process information includes a first gas identifier and a first heating belt identifier. The first gas identifier is the gas identifier of the gas currently passing through the pipeline covered by the target heating belt; the first heating belt identifier is the heating belt identifier of the target heating belt; and the target heating belt is any heating belt among multiple heating belts. It can be understood that the gas identifier is an identifier for distinguishing different gases. In this embodiment, it is only necessary to ensure that different gases have different gas identifiers. The specific content of the gas identifier is not limited. For example, the gas identifier can be a unique identifier composed of any one or more of words, numbers, and letters. In some embodiments, the gas currently passing through the pipeline covered by the target heating belt is determined by the current switch state of the pneumatic valve in the pipeline. Therefore, the gas identifier of the gas currently passing through the pipeline covered by the target heating belt can also be represented by the current switch state of the pneumatic valve in the pipeline covered by the target heating belt. That is, the first gas identifier can be the current switch state of the pneumatic valve in the pipeline covered by the target heating belt. In other embodiments, the first gas identifier includes: the gas identifier of the gas currently passing through the pipeline covered by the target heating belt and the current switch state of the pneumatic valve in the pipeline covered by the target heating belt.

[0084] Similarly, the heating belt mark is a mark to distinguish different heating belts. In this embodiment, it is only necessary to ensure that different heating belts have different heating belt marks. The specific content of the heating belt mark is not limited. For example, the heating belt mark can be a unique mark composed of any one or more of words, numbers, and letters.

[0085] S302: Determine a target safe temperature range of the target heating zone based on process information of the target heating zone.

[0086] In this step, the target safety temperature range of the target heating belt is the temperature range in which the target heating belt will not trigger a temperature alarm. And, the target safety temperature range corresponds to the process information of the target heating belt. Specifically, in some embodiments, the temperature range in which the temperature alarm will not be triggered under a specified state can be determined in advance for the target heating belt, and then the temperature range can be used as the target safety temperature range of the target heating belt. Finally, a correspondence between the process information of the target heating belt and the target safety temperature range of the target heating belt is established. In this way, after determining the process information of the target heating belt, the target safety temperature range of the target heating belt can be determined using the correspondence, wherein the specified state is the state when the gas indicated by the first gas identifier passes through the pipeline covered by the target heating belt.

[0087] S303: When the current temperature of the target heating zone is outside the target safety temperature range of the target heating zone, output a temperature alarm for the target heating zone.

[0088] It should be noted that when the current temperature of the target heating belt is within the target safety temperature range of the target heating belt, there is no need to alarm, and the process production can continue. Outputting a temperature alarm for the target heating belt includes: outputting information related to the temperature abnormality of the target heating belt in any manner. For example, a pop-up box can be popped up in the display interface to remind the target heating belt of the temperature abnormality. The reminder voice of the target heating belt temperature abnormality can be played directly, or emails and text messages about the target heating belt temperature abnormality can be pushed to a designated contact address. In some embodiments, when the semiconductor process equipment includes a host computer and a slave computer, if the method provided in this embodiment is executed by the slave computer, the temperature alarm can be a temperature alarm signal sent to the host computer, and the host computer responds to the temperature alarm after receiving the temperature alarm signal. The specific form of the temperature alarm response is not limited here.

[0089] In some embodiments, the semiconductor process equipment includes a special heating belt, that is, during the process production process, there will be a situation where gas is blocked in the pipeline covered by it. In this case, a special identifier can be used to replace the first gas identifier. That is, the process information of the special heating belt obtained includes the special identifier and the heating belt identifier of the special heating belt. Accordingly, the target safe temperature range of the special heating belt is the temperature range in which the temperature alarm will not be triggered when the gas is blocked.

[0090] In some embodiments, during the process of semiconductor process equipment, each heating belt independently performs the above steps S301 to S303. In this way, all heating belts in the semiconductor process equipment can be monitored simultaneously to avoid missing any heating belt.

[0091] In this embodiment, for any heating belt in the semiconductor process equipment, that is, the target heating belt, its process information is first obtained to determine the heating belt identification of the target heating belt and the gas identification of the gas currently passing through the pipeline covered by the target heating belt. Then, based on the corresponding gas identification and heating belt identification, the target safety temperature range of the target heating belt is determined in a targeted manner. The present application not only distinguishes different heating belts through heating belt identification, but also takes into account the gas passing through the pipeline. Thereby, a more reasonable safety temperature range can be determined for the target heating belt. Compared with using the same safety temperature range for each heating belt, the present application is undoubtedly more targeted. When realizing the temperature alarm based on the current temperature of the target heating belt and the target safety temperature range, it can avoid false alarms caused by inappropriate safety temperature ranges, and reduce the occurrence of false temperature alarms during the process production process.

[0092] In some embodiments, determining a target safe temperature range of the target heating zone based on process information of the target heating zone includes:

[0093] Based on the process information of the target heating zone, a target safe temperature range corresponding to the process information of the target heating zone in the temperature alarm library is determined; wherein the temperature alarm library is used to store the correspondence between the target safe temperature range and the process information of the target heating zone.

[0094] It should be noted that the temperature alarm library is a pre-created database that records the correspondence between the target safety temperature range and the process information of the target heating zone. Therefore, after determining the process information of the target heating zone, the target safety temperature range corresponding to the process information of the target heating zone can be quickly determined based on the temperature alarm library, that is, the target safety temperature range of the target heating zone.

[0095] In this embodiment, the temperature alarm library is used to store the correspondence between the target safety temperature range and the process information of the target heating zone, so that the target safety temperature range of the target heating zone can be quickly determined after the process information of the target heating zone is acquired.

[0096] In some embodiments, the temperature alarm library includes: multiple groups with heating belt identifiers and gas identifiers as group identifiers; wherein each group includes a safe temperature range when the gas of the current group passes through the pipeline covered by the heating belt of the current group; the heating belt of the current group is the heating belt indicated by the heating belt identifier of the current group, and the gas of the current group is the gas indicated by the gas identifier of the current group.

[0097] Based on the process information of the target heating zone, determine the target safe temperature range of the process information corresponding to the target heating zone in the temperature alarm library, including:

[0098] Based on the first gas identifier and the first heating zone identifier, determining a corresponding target group in the temperature alarm library;

[0099] The safe temperature range in the target group is determined as the target safe temperature range of the process information corresponding to the target heating zone.

[0100] It should be noted that the identification of each group in the temperature alarm library is composed of a heating zone identification and a gas identification, and different groups have different identifications. If at least one of the heating zone identification and the gas identification is different, it can be regarded that the identification of the group is different.

[0101] The number of groups in the temperature alarm library is related to the number of target combinations, where the target combination is the combination of the heating belt identification and the gas identification involved in the semiconductor process equipment. For example, the number of heating belt identifications involved in the semiconductor process equipment is m and the number of gas identifications is n. Correspondingly, the number of target combinations a=m×n, and the number of groups can be a. Of course, considering that in the actual process production process, not every pipeline covered by the heating belt will pass through n types of gases. Therefore, the number of groups can be less than a, which is equal to the number of actual combinations of heating belt identification and gas identification. For example, a semiconductor process equipment includes three heating belts, and the heating belt identifications are HD1, HD2 and HD3, respectively. In the process production process, two different gases will be passed in turn in the pipeline covered by the heating belt indicated by HD1, and the gas identifications are GD1 and GD2 respectively; only one gas will be passed in the pipeline covered by the heating belt indicated by HD2, and the gas identification is GD2; three different gases will be passed in turn in the pipeline covered by the heating belt indicated by HD3, and the gas identifications are GD1, GD2 and GD3 respectively. Then, in the actual process production process, the actual combinations of heating belt identification and gas identification include six combinations: HD1-GD1, HD1-GD2, HD2-GD2, HD3-GD1, HD3-GD2, and HD3-GD3. The number of groups in the temperature alarm library is six.

[0102] The safety temperature range in each group is described with the above examples. First, for the first group with the group identifier: HD1-GD1, its current group heating belt is the heating belt indicated by HD1, and its current group gas is the gas indicated by GD1. Its safety temperature range is the safety temperature range when the gas indicated by GD1 passes through the pipeline covered by the heating belt indicated by HD1. It can be understood that the safety temperature range here is targeted. The safety temperature range of the first group is targeted at the heating belt indicated by HD1. It is the safety temperature range in which the heating belt indicated by HD1 does not trigger a temperature alarm under the above state. For other groups, they are similar to the first group and will not be explained one by one here.

[0103] The target group is a group identified by the first gas identifier and the first heating zone identifier.

[0104] In this embodiment, the heating belt identifier and the gas identifier are used as group identifiers, and the safe temperature range of each heating belt is recorded in the temperature alarm library through different groups, which can facilitate temperature alarm for each heating belt.

[0105] In order to improve the accuracy of the target safe temperature range and further reduce the occurrence of false alarms, in some embodiments, before obtaining the process information of the target heating belt, the method further includes:

[0106] Obtaining heating belt distribution information of semiconductor process equipment and historical data during the target operation time of the semiconductor process equipment; wherein the heating belt distribution information includes: the corresponding relationship between multiple heating belts and the gas flowing through the pipelines covered by them; the historical data includes the temperature of each heating belt at each operation time and the gas identification of the gas flowing through the pipelines covered by the heating belts;

[0107] Based on the heating zone distribution information and historical data, determine the temperature range of the heating zone in each group;

[0108] A temperature alarm library is generated based on the temperature range of the heating belts in each group.

[0109] It should be noted that the heating zone distribution information of the semiconductor process equipment includes: heating zone identification of each heating zone set on the semiconductor process equipment, gas identification of the corresponding gas and position information, etc. For example, the heating zone distribution information may be the heating zone distribution relationship table shown in Table 1.

[0110] Gas identification Heating belt marking HF AD1, AD4 DCS AD2, AD3, AD5

[0111] Table 1

[0112] As shown in Table 1, the semiconductor process equipment is equipped with 5 heating belts, and the heating belts are marked as AD1, AD2, AD3, AD4, and AD5. During the process production, the pipelines covered by the heating belts indicated by AD1 and AD4 will pass through the gas indicated by HF; the pipelines covered by the heating belts indicated by AD2, AD3, and AD5 will pass through the gas indicated by DCS. Among them, the gas indicated by HF is hydrofluoric acid gas. The gas indicated by DCS is dichlorosilane gas, i.e., SiH2Cl2 gas.

[0113] In some embodiments, the semiconductor process equipment can directly receive the heating belt distribution information input by the user. In other embodiments, the semiconductor process equipment can also obtain the pre-stored gas circuit schematic diagram and the heating belt distribution diagram, and then obtain the heating belt distribution information based on the obtained gas circuit schematic diagram and the heating belt distribution diagram. The target duration can be a longer duration. For example, the target duration can be one day, one week, etc., but is not limited to this. Specifically, after determining the specific grouping involved in the semiconductor process equipment, the heating belt temperature under each grouping can be counted to determine a temperature range. For each grouping, all heating belt temperatures under the grouping are within its temperature range. Then, based on the determined temperature ranges and the corresponding gas identification and heating belt identification, a temperature alarm library is generated. In other embodiments, when counting the heating belt temperature under each grouping, the abnormal data can be removed. Abnormal data is data that is significantly greater than or less than other heating belt temperatures.

[0114] In this embodiment, the temperature alarm library is generated by using the historical data of semiconductor process equipment, which can improve the accuracy of the target safe temperature range and further reduce the occurrence of false alarms.

[0115] In some embodiments, based on the heating zone distribution information and historical data, determining the temperature range of the heating zone in each group includes:

[0116] Inputting heating zone distribution information and historical data into a preset data model;

[0117] Determine multiple groups based on the heating zone distribution information through a preset data model, and count the highest temperature and the lowest temperature of the heating zone at each operating time for each group;

[0118] The temperature range between the lowest temperature and the highest temperature in each group is determined as the temperature range of the heating zone temperature in each group through a preset data model.

[0119] This embodiment uses a preset data model to determine the temperature range of each group. Specifically, the preset data model is as follows: Figure 4 As shown in FIG. 1 , it includes: a data range part, a data processing part, and an alarm data part. Among them, the data range part is used to determine the various groups involved in the temperature alarm library. Each group is as follows: Figure 4The data range part is also used to classify the temperatures of each heating zone in the historical data into corresponding groups. The data processing part is used to extract the maximum temperature of each group, that is, the maximum temperature MAX(G1-1) in Group1-1, the maximum temperature MAX(G1-2) in Group1-2, the maximum temperature MAX(G1-3) in Group1-3, ..., the maximum temperature MAX(G1-n) in Group1-n. At the same time, it is also used to extract the minimum temperature of each group, that is, the minimum temperature MIN(G1-1) in Group1-1, the minimum temperature MIN(G1-2) in Group1-2, the minimum temperature MIN(G1-3) in Group1-3, ..., the minimum temperature MIN(G1-n) in Group1-n. The alarm data part is used to assign the maximum temperature and the minimum temperature of each group to the corresponding group through the maximum value assignment processing to obtain the safe temperature range of the group. For example, for Group 1-1, its temperature range is [AD1-1.min, AD1-1.max], where AD1-1.min is equal to MIN(G1-1), and AD1-1.max is equal to MAX(G1-1). Similarly, the temperature ranges can be determined as [AD1-2.min, AD1-2.max], [AD1-3.min, AD1-3.max], ..., [AD1-n.min, AD1-n.max].

[0120] It is understandable that after the preset data model is created, the preset data model will automatically complete the processing of the above-mentioned parts based on the heating zone distribution information and historical data, so as to obtain the temperature range of each group. In some embodiments, when the preset data model determines the grouping, it can also be divided into two levels of grouping. The number of primary groupings is two, one group is a [heating zone identifier-gas identifier] group created with the heating zone as a variable condition and the gas as a fixed condition. The other group is a [gas identifier-heating zone identifier] group created with the gas as a variable condition and the heating zone as a fixed condition. The situation of the secondary grouping is the same as the above-mentioned situation where the grouping is not divided into levels, and will not be repeated here.

[0121] In this embodiment, with the help of a preset data model, the temperature range of the heating zone temperature in each group can be determined quickly and accurately.

[0122] To facilitate the use of semiconductor process equipment, in some embodiments, before determining the target safe temperature range of the process information corresponding to the target heating belt in the temperature alarm library based on the process information of the target heating belt, the method further includes:

[0123] Acquire initial temperature alarm data of semiconductor process equipment; wherein the initial temperature alarm data is determined based on test data of the semiconductor process equipment before it leaves the factory;

[0124] Initial temperature alarm data is corrected based on test data of semiconductor process equipment after leaving the factory to obtain a temperature alarm library.

[0125] Among them, the process of determining the initial temperature alarm data based on the test data of the semiconductor process equipment before it leaves the factory is similar to the process of determining the temperature alarm library based on the heating belt distribution information and the historical data in the above embodiment, and will not be repeated here. It is worth noting that the difference between the two lies in the different data used. The data used by the former is the test data of the semiconductor process equipment before it leaves the factory. The data used by the latter belongs to the test data of the semiconductor process equipment after it leaves the factory.

[0126] The process of correcting the initial temperature alarm data based on the test data of the semiconductor process equipment after leaving the factory to obtain the temperature alarm library is the same as the process of determining the temperature alarm library based on the heating belt distribution information and the historical data in the above embodiment, and will not be repeated here.

[0127] In this embodiment, the initial temperature alarm data can be set first, so that the device can be used directly after leaving the factory. At the same time, by correcting it, the accuracy of the temperature alarm data can be improved and the number of false alarms can be reduced.

[0128] In some embodiments, the step of obtaining the first gas identifier in the process information of the target heating zone includes:

[0129] Obtain the switch status of the gas switch in the pipeline covered by the target heating belt and the current process step;

[0130] Based on the process steps and the on / off status of the gas switch, determine the gas currently flowing through the pipeline covered by the target heating belt;

[0131] The gas identifier of the gas currently flowing through the pipeline covered by the target heating belt is determined as the first gas identifier.

[0132] It should be noted that the gas switch includes but is not limited to a pneumatic valve. It is understandable that the gas passed through the gas source of the semiconductor process equipment may be different in different process steps. Even when the gas passed through the gas source remains unchanged, the gas passed through the pipeline may also change due to the change in the state of the gas switch. Therefore, the current gas passed can be determined during the process production process by the current process step and the state of the gas switch corresponding to the heating belt.

[0133] In this embodiment, during the process production process, the gas currently flowing through the pipeline covered by the heating belt can be accurately determined based on the current process step and the state of the gas switch corresponding to the heating belt.

[0134] In one possible implementation, the Figure 2 Taking the semiconductor process equipment shown in the figure as an example, the temperature alarm method is explained in detail. Figure 5 , the temperature alarm method may include:

[0135] S501: Create heater belt temperature data groups, process gas data groups and alarm data groups. For example, heater belt temperature data groups (HD1, HD2, HD3…HDn); process gas data groups (GD1, GD2, GD3…GDn); alarm data groups (AD1, AD2, AD3…ADn); used to store and process process data. Assume that the semiconductor process equipment has 5 heater belts, the heater belt temperature data groups are HD1, HD2,…, HD5; 2 kinds of process gases need to be heated, and the process gas data groups are GD1 and GD2.

[0136] S502: Establish an alarm mechanism data model. First, classify based on heating belts and process gases (this step is completed in the lower computer of the semiconductor process equipment). Assume that the semiconductor process equipment involves 5 heating belts and 2 process gases. The following groups can be obtained: G1-1: [heating belt 1-process gas 1], G1-2: [heating belt 2-process gas 1], ..., G1-5: [heating belt 5-process gas 1]; G2-1: [heating belt 1-process gas 2], G2-2: [heating belt 2-process gas 2], ..., G2-5: [heating belt 5-process gas 2]. Then obtain the historical data of the test process of the semiconductor process equipment before leaving the factory, classify the historical data based on the above grouping results, apply the MAX function and the MIN function respectively, and obtain the maximum and minimum values ​​of each group; for example, obtain the maximum value G1-1.max and the minimum value G1-1.min in the G1-1 grouping relationship, and obtain the maximum and minimum values ​​of each group in turn. The alarm data group is assigned the maximum value, and finally the alarm mechanism data model is obtained.

[0137] S503: Machine data and parameter setting. Specifically, according to the equipment gas path and heating belt details, the configuration parameters of the semiconductor process equipment are set: the relationship information between the process gas and the heating belt. By setting different configuration parameters, the alarm database can be adapted to different semiconductor process equipment, thereby improving the adaptability and scalability of the alarm database.

[0138] S504: Alarm mechanism data model training.

[0139] S505: Generate an alarm database.

[0140] It can be understood that the information such as the pneumatic valve status, process gas and heating belt is obtained through the feedback data of the IO control module, pressure sensor and temperature acquisition module in the hardware control system. Real-time data in the post-factory test process is obtained. The real alarm database of this semiconductor process equipment is obtained through data classification-maximum value processing-maximum value assignment processing of the alarm mechanism data model. This alarm database is the basis for determining whether the real-time data of the heating belt in the process is abnormal. If the semiconductor process equipment involves 5 heating belts and 2 process gases, the alarm data model is trained through the real-time data of 5 heating belts and 2 process gases collected during the test process to obtain the alarm database of this machine. During the normal process production of this equipment, the real-time feedback data of each heating belt will be fed back to the hardware control system in real time through the temperature acquisition module, uploaded to the lower computer, and the real-time data of the heating belt will be transmitted to the alarm database through the heating belt and process gas conditions at this moment. If this feedback data is greater than the maximum alarm threshold, or less than the minimum alarm threshold, the lower computer will send an alarm signal to the upper computer, the upper computer will throw a corresponding alarm, and at the same time send a signal to the hardware control system, and the hardware control system will take response measures.

[0141] In this embodiment, by establishing an alarm mechanism data model, the real-time feedback temperature data is processed according to the alarm mechanism data model to improve the alarm accuracy of the distributed heating belt. By setting the configuration parameters of different semiconductor process equipment and matching the alarm database, the scalability and applicability of the alarm database are improved.

[0142] Exemplary Devices

[0143] Some embodiments of the present specification also provide a temperature alarm device, which is applied to semiconductor process equipment, wherein the semiconductor process equipment is provided with a plurality of heating belts, such as Figure 6 As shown, the temperature alarm device comprises:

[0144] The acquisition module 61 is used to acquire the process information of the target heating belt, wherein the process information includes a first gas identifier and a first heating belt identifier, the first gas identifier is the gas identifier of the gas currently passing through the pipeline covered by the target heating belt; the first heating belt identifier is the heating belt identifier of the target heating belt; the target heating belt is any heating belt among the multiple heating belts;

[0145] A safety range determination module 62 is used to determine a target safety temperature range of the target heating zone based on the process information of the target heating zone; the target safety temperature range corresponds to the process information of the target heating zone;

[0146] The alarm module 63 is used to output a temperature alarm for the target heating zone when the current temperature of the target heating zone is outside the target safety temperature range of the target heating zone.

[0147] In some embodiments, the safety range determination module 62 is specifically used to determine the target safety temperature range corresponding to the process information of the target heating belt in the temperature alarm library based on the process information of the target heating belt; wherein the temperature alarm library is used to store the correspondence between the target safety temperature range and the process information of the target heating belt.

[0148] In some embodiments, the temperature alarm library includes: a plurality of groups with heating belt identification and gas identification as group identification; wherein each group includes a safe temperature range when the gas of the current group passes through the pipeline covered by the heating belt of the current group; the heating belt of the current group is the heating belt indicated by the heating belt identification of the current group, and the gas of the current group is the gas indicated by the gas identification of the current group;

[0149] The safety range determination module 62 includes:

[0150] A group determination unit, used to determine a corresponding target group in a temperature alarm library based on the first gas identifier and the first heating zone identifier;

[0151] The safety range determination unit is used to determine the safety temperature range in the target group as the target safety temperature range of the process information corresponding to the target heating zone.

[0152] In some embodiments, the device further comprises:

[0153] The first generation module of the alarm library is used to obtain the distribution information of the heating belts of the semiconductor process equipment and the historical data during the target operation time of the semiconductor process equipment; wherein the distribution information of the heating belts includes: the corresponding relationship between the multiple heating belts and the gas flowing through the pipelines covered by them; the historical data includes the temperature of each heating belt at each operation time and the gas identification of the gas flowing through the pipelines covered by the heating belts;

[0154] The second generation module of the alarm library is used to determine the temperature range of the heating belt under each group based on the heating belt distribution information and historical data;

[0155] The third alarm library generation module is used to generate a temperature alarm library based on the temperature range of the heating belt in each group.

[0156] In some implementations, the second generation module of the alarm library is specifically used to:

[0157] Inputting heating zone distribution information and historical data into a preset data model;

[0158] Determine multiple groups based on the heating zone distribution information through a preset data model, and count the highest temperature and the lowest temperature of the heating zone at each operating time for each group;

[0159] The temperature range between the lowest temperature and the highest temperature in each group is determined as the temperature range of the heating zone temperature in each group through a preset data model.

[0160] In some embodiments, the device further comprises:

[0161] An initial alarm module is used to obtain initial temperature alarm data of semiconductor process equipment; wherein the initial temperature alarm data is determined based on test data of the semiconductor process equipment before it leaves the factory;

[0162] The alarm data correction module is used to correct the initial temperature alarm data based on the test data of the semiconductor process equipment after leaving the factory to obtain a temperature alarm library.

[0163] In some embodiments, the step of obtaining the first gas identifier in the process information of the target heating zone by the acquisition module includes:

[0164] Obtain the switch status of the gas switch in the pipeline covered by the target heating belt and the current process step;

[0165] Based on the process steps and the on / off status of the gas switch, determine the gas currently flowing through the pipeline covered by the target heating belt;

[0166] The gas identifier of the gas currently flowing through the pipeline covered by the target heating belt is determined as the first gas identifier.

[0167] The temperature alarm device provided in the embodiment of this specification belongs to the same inventive concept as the temperature alarm method provided in the above embodiment of this specification. For technical details not fully described in this embodiment, please refer to the specific processing content of the temperature alarm method provided in the above embodiment of this specification, which will not be repeated here.

[0168] Exemplary semiconductor process equipment and electronic equipment

[0169] Another embodiment of the present application also proposes a semiconductor process equipment, including: a host computer, a lower computer connected to the upper computer, a hardware control system connected to the lower computer, and a heating belt for heat treatment; the hardware control system is used to detect process information of the heating belt and send the detected process information to the lower computer; the lower computer is used to execute the temperature alarm method described in the above embodiments according to various embodiments of this specification to output a temperature alarm to the host computer, and the host computer is used to respond to the temperature alarm when receiving the temperature alarm from the lower computer.

[0170] In some implementations, the host computer is also used to:

[0171] Obtaining heating belt distribution information and historical data during the target operation time of semiconductor process equipment; wherein the heating belt distribution information includes: the corresponding relationship between the heating belt and the gas flowing through the pipeline covered by the heating belt; the historical data includes the temperature of each heating belt at each operation time and the gas identification of the gas flowing through the pipeline covered by the heating belt;

[0172] The heating zone distribution information and historical data are sent to the lower computer, so that the lower computer generates a temperature alarm library based on the heating zone distribution information and historical data.

[0173] It should be noted that the heating belt distribution information of the semiconductor process equipment may also include: the heating belt identification of each heating belt set on the semiconductor process equipment, the gas identification of the corresponding gas and the location information, etc. It can be obtained by user input, but is not limited to this. The target duration can be a longer duration. For example, the target duration can be one day, one week, etc., but is not limited to this. It can be understood that the heating belt distribution information and historical data are used to generate a temperature alarm library, and the process of generating a temperature alarm library is the same as the process of generating a temperature alarm library in the above-mentioned embodiment. For the specific circumstances of the heating belt distribution information and historical data, please refer to the specific description of the heating belt distribution information and historical data in the above-mentioned embodiment of generating the temperature alarm library, which will not be repeated here. In this embodiment, the host computer is only used to collect and forward the heating belt distribution information and historical data.

[0174] In this embodiment, the temperature alarm library is generated by using the historical data of semiconductor process equipment, which can improve the accuracy of the target safe temperature range and further reduce the occurrence of false alarms.

[0175] In some embodiments, the host computer is specifically used to: obtain a gas circuit schematic diagram and a heating zone distribution diagram of a semiconductor process equipment, and determine the heating zone distribution information based on the gas circuit schematic diagram and the heating zone distribution diagram.

[0176] It should be noted that the gas circuit schematic diagram is a ventilation pipeline diagram of the semiconductor process equipment, which records the location, connection status, valve information, etc. of each ventilation pipeline. The heating belt distribution diagram records the various heating belts on the semiconductor process equipment and their location information. In some embodiments, the gas circuit schematic diagram and the heating belt distribution diagram are pre-stored in the semiconductor process equipment and can be directly called when obtained.

[0177] In this embodiment, the gas circuit schematic diagram and the heating zone distribution diagram can be directly called to generate the heating zone distribution information, so as to realize automatic processing and reduce the steps of manually configuring the heating zone distribution information.

[0178] Another embodiment of the present application also provides an electronic device, see Figure 7As shown, an exemplary embodiment of the present specification also provides an electronic device, including: a memory and a processor, the memory stores a computer program, and the processor executes the steps of the temperature alarm method according to various embodiments of the present specification described in the above embodiments of the present specification when executing the computer program.

[0179] The internal structure of the electronic device can be as follows Figure 7 As shown, the electronic device includes a processor, a memory, a network interface and an input device connected through a system bus. Among them, the processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the electronic device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps in the temperature alarm method according to various embodiments of the present specification are described in the above embodiments of the present specification.

[0180] The processor may include a main processor and may also include a baseband chip, a modem, etc.

[0181] The memory stores a computer program for executing the technical solution of the present invention, and may also store an operating system and other key services. Specifically, the computer program may include a program code, and the program code includes computer operation instructions. More specifically, the memory may include a read-only memory (ROM), other types of static storage devices that can store static information and instructions, a random access memory (RAM), other types of dynamic storage devices that can store information and instructions, a disk storage, a flash, and the like.

[0182] The processor may be a general-purpose processor, such as a general-purpose central processing unit (CPU), a microprocessor, etc., or an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the program of the scheme of the present invention. It may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0183] The input device may include a device for receiving data and information input by a user, such as a keyboard, a mouse, a camera, a scanner, a light pen, a voice input device, a touch screen, a pedometer, or a gravity sensor.

[0184] Output devices may include means that allow information to be output to a user, such as display screens, printers, speakers, etc.

[0185] The communication interface may include using any transceiver or the like to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Network (WLAN), etc.

[0186] The processor executes the computer program stored in the memory and calls other devices, which can be used to implement the various steps of any temperature alarm method provided in the above embodiments of the present application.

[0187] The electronic device may also include a display component and a voice component. The display component may be a liquid crystal display or an electronic ink display. The input device of the electronic device may be a touch layer covered on the display component, or a button, trackball or touchpad provided on the housing of the electronic device, or an external keyboard, touchpad or mouse.

[0188] Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the scheme of this specification, and does not constitute a limitation on the electronic device to which the scheme of this specification is applied. The specific electronic device may include more or fewer components than shown in the figure, or combine certain components, or have a different arrangement of components.

[0189] Exemplary computer program products and computer-readable storage media

[0190] In addition to the above-mentioned methods and devices, the temperature alarm method provided in the embodiments of this specification may also be a computer program product, which includes a computer program, which, when executed by a processor, enables the processor to execute the steps of the temperature alarm method according to various embodiments of this specification described in the above "Exemplary Method" section of this specification.

[0191] The computer program product may be written in any combination of one or more programming languages ​​to write program code for performing the operations of the embodiments of the present specification, including object-oriented programming languages ​​such as Java, C++, etc., and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a separate software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0192] In addition, an embodiment of the present specification also provides a computer-readable storage medium on which a computer program is stored, and the computer program is executed by a processor to execute the steps of the temperature alarm method according to various embodiments of the present specification described in the above "Exemplary Method" section of the present specification.

[0193] It should be understood that the specific examples in this article are only intended to help those skilled in the art better understand the implementation methods of this specification, rather than to limit the scope of this specification.

[0194] It can be understood that in the various implementations of this specification, the size of the sequence number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation methods of this specification.

[0195] It can be understood that the various embodiments described in this specification can be implemented individually or in combination, and the embodiments of this specification are not limited to this.

[0196] Unless otherwise specified, all technical and scientific terms used in the embodiments of this specification have the same meaning as those generally understood by those skilled in the art of the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms of "a", "above", and "the" used in the embodiments of this specification and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0197] It can be understood that the processor of the embodiment of this specification can be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method implementation can be completed by the hardware integrated logic circuit or software instructions in the processor. The above processor can be a general processor, a digital signal processor (Digital Signal Processor, DSP), an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field programmable gate array (Field Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The disclosed methods, steps and logic block diagrams in the embodiment of this specification can be implemented or executed. The general processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in the embodiment of this specification can be directly embodied as a hardware decoding processor to perform, or the hardware and software modules in the decoding processor are combined and executed. The software module can be located in a mature storage medium in the field such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory, and the processor reads the information in the memory and completes the steps of the above method in combination with its hardware.

[0198] It is understood that the memory in the embodiments of this specification may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memory. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (Programmable ROM, PROM), an erasable programmable read-only memory (ErasablePROM, EPROM), an electrically erasable programmable read-only memory (EEPROM) or a flash memory. The volatile memory may be a random access memory (RAM). It should be noted that the memory of the systems and methods described herein is intended to include, but is not limited to, these and any other suitable types of memory.

[0199] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this specification.

[0200] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method implementation methods and will not be repeated here.

[0201] In the several embodiments provided in this specification, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device implementation described above is only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0202] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0203] In addition, each functional unit in each embodiment of the present specification may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0204] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this specification, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the method described in each embodiment of this specification. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc., various media that can store program codes.

[0205] The above is only a specific implementation of this specification, but the protection scope of this specification is not limited to this. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this specification, which should be included in the protection scope of this specification. Therefore, the protection scope of this specification should be based on the protection scope of the claims.

Claims

1. A temperature alarm method, characterized in that: Applied to semiconductor process equipment, the semiconductor process equipment is provided with a plurality of heating belts, and the temperature alarm method comprises: Acquire process information of a target heating belt, wherein the process information includes a first gas identifier and a first heating belt identifier, the first gas identifier being a gas identifier of a gas currently flowing through a pipeline covered by the target heating belt; the first heating belt identifier being a heating belt identifier of the target heating belt; the target heating belt being any heating belt among the multiple heating belts; Based on the process information of the target heating zone, determining a target safety temperature range of the target heating zone; the target safety temperature range corresponds to the process information of the target heating zone; When the current temperature of the target heating zone is outside the target safety temperature range of the target heating zone, a temperature alarm for the target heating zone is output.

2. The method according to claim 1, characterized in that Determining a target safe temperature range of the target heating zone based on the process information of the target heating zone includes: Based on the process information of the target heating belt, determine the target safety temperature range corresponding to the process information of the target heating belt in the temperature alarm library; wherein the temperature alarm library is used to store the correspondence between the target safety temperature range and the process information of the target heating belt.

3. The method according to claim 2, characterized in that The temperature alarm library includes: a plurality of groups with heating belt identification and gas identification as group identification; wherein each group includes a safe temperature range when the gas of the current group passes through the pipeline covered by the heating belt of the current group; the heating belt of the current group is the heating belt indicated by the heating belt identification of the current group, and the gas of the current group is the gas indicated by the gas identification of the current group; Based on the process information of the target heating belt, determining a target safe temperature range corresponding to the process information of the target heating belt in a temperature alarm library includes: Based on the first gas identifier and the first heating zone identifier, determining a corresponding target group in the temperature alarm library; The safe temperature range in the target group is determined as the target safe temperature range corresponding to the process information of the target heating zone.

4. The method according to claim 3, characterized in that Before obtaining the process information of the target heating zone, the method further includes: Obtaining heating belt distribution information of the semiconductor process equipment and historical data during the target operation time of the semiconductor process equipment; wherein the heating belt distribution information includes: the corresponding relationship between the plurality of heating belts and the gas flowing through the pipelines covered by the heating belts; the historical data includes the temperature of each heating belt at each operation time and the gas identification of the gas flowing through the pipelines covered by the heating belts; Determine the temperature range of the heating zone in each of the groups based on the heating zone distribution information and the historical data; The temperature alarm library is generated based on the temperature range of the heating belts in each of the groups.

5. The method according to claim 4, characterized in that Determining the temperature range of the heating belt in each group based on the heating belt distribution information and the historical data includes: Inputting the heating zone distribution information and the historical data into a preset data model; Determine a plurality of the groups based on the heating belt distribution information by using the preset data model, and count the maximum temperature and the minimum temperature of the heating belt at each operating time for each group; The temperature range between the lowest temperature and the highest temperature in each of the groups is determined by the preset data model as the temperature range of the heating zone temperature in each of the groups.

6. The method according to claim 2, characterized in that Before determining a target safe temperature range corresponding to the process information of the target heating belt in a temperature alarm library based on the process information of the target heating belt, the method further includes: Acquire initial temperature alarm data of the semiconductor process equipment; wherein the initial temperature alarm data is determined based on test data of the semiconductor process equipment before it leaves the factory; The initial temperature alarm data is corrected based on the test data of the semiconductor process equipment after leaving the factory to obtain the temperature alarm library.

7. The method according to any one of claims 1 to 6, characterized in that: The step of obtaining the first gas identifier in the process information of the target heating zone includes: Obtaining the switch status of the gas switch in the pipeline covered by the target heating belt and the current process step; Based on the process steps and the switch state of the gas switch, determining the gas currently flowing through the pipeline covered by the target heating belt; The gas identifier of the gas currently flowing through the pipeline covered by the target heating belt is determined as the first gas identifier.

8. A temperature alarm device, characterized in that: Applied to semiconductor process equipment, the semiconductor process equipment is provided with a plurality of heating belts, and the temperature alarm device comprises: An acquisition module, used for acquiring process information of a target heating belt, wherein the process information includes a first gas identifier and a first heating belt identifier, the first gas identifier being a gas identifier of a gas currently passing through a pipeline covered by the target heating belt; the first heating belt identifier being a heating belt identifier of the target heating belt; the target heating belt being any heating belt among the multiple heating belts; A safety range determination module, configured to determine a target safety temperature range of the target heating zone based on the process information of the target heating zone; the target safety temperature range corresponds to the process information of the target heating zone; The alarm module is used to output a temperature alarm for the target heating belt when the current temperature of the target heating belt is outside the target safety temperature range of the target heating belt.

9. A semiconductor process equipment, characterized in that: include: A host computer, a slave computer connected to the host computer, a hardware control system connected to the slave computer, and a heating belt for heat treatment; The hardware control system is used to detect the process information of the heating belt and send the detected process information to the lower computer; the lower computer is used to execute the temperature alarm method as described in any one of claims 1 to 7 to output a temperature alarm to the upper computer, and the upper computer is used to respond to the temperature alarm when receiving the temperature alarm from the lower computer.

10. The semiconductor process equipment according to claim 9, characterized in that: The host computer is also used for: Obtaining heating belt distribution information and historical data during the target operation time of the semiconductor process equipment; wherein the heating belt distribution information includes: the corresponding relationship between the heating belt and the gas flowing through the pipeline covered by the heating belt; the historical data includes the temperature of each heating belt and the gas identification of the gas flowing through the pipeline covered by the heating belt at each operation time; The heating zone distribution information and the historical data are sent to the lower computer, so that the lower computer generates a temperature alarm library based on the heating zone distribution information and the historical data.

11. The semiconductor process equipment according to claim 9, characterized in that: The host computer is specifically used to: obtain the gas path schematic diagram and the heating zone distribution diagram of the semiconductor process equipment, and determine the heating zone distribution information based on the gas path schematic diagram and the heating zone distribution diagram.

12. An electronic device, characterized in that: include: Processor and memory; Wherein, the memory is connected to the processor, and the memory is used to store a computer program; The processor is used to implement the temperature alarm method according to any one of claims 1 to 7 by running the computer program stored in the memory.

13. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the temperature alarm method according to any one of claims 1 to 7 is implemented.

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