Cluster-type high-vacuum wafer bonding equipment

Abstract

This invention relates to the field of wafer bonding technology, specifically to a cluster-type high-vacuum wafer bonding equipment, primarily addressing the technical problem of the lack of mature cluster-type high-vacuum wafer bonding equipment in the prior art. This equipment is equipped with multiple functional devices surrounding the operating unit, including a feeding device, a baking device, a plasma activation device, a vision alignment device, a bonding device, and a discharging device. The operating unit has a docking window corresponding to each functional device, and each functional device has an operating window. The operating windows connect to the corresponding docking windows via valves, thus enabling the switching of the operating unit with each functional device. This ensures the spatial independence of the operating unit and each functional device, thereby guaranteeing the vacuum level of each step in wafer processing, reducing the cleanroom cleanliness requirements. Furthermore, the operating unit includes a robotic arm that enables the transfer of wafers between the various functional devices, resulting in a high degree of automation.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding technology, and more particularly to a cluster-type high-vacuum wafer bonding device. Background Technology

[0002] Wafer bonding is the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers together through chemical and physical processes to achieve vertical stacking and electrical interconnection in 3D integration and advanced packaging.

[0003] Currently, wafer bonding equipment is shifting from single-machine systems to multi-chamber integration capable of performing multiple processes, leading to the emergence of bundled wafer bonding equipment. Furthermore, because particulate matter and contamination on the wafer surface directly affect key indicators such as wafer bonding strength and void ratio, the entire wafer bonding process must be carried out in a high-vacuum environment. Therefore, bundled high-vacuum wafer bonding equipment is gradually becoming the development trend of wafer bonding. However, existing technologies lack mature bundled high-vacuum wafer bonding equipment, thus there is an urgent need for a bundled high-vacuum wafer bonding system with a high degree of automation and lower cleanroom cleanliness requirements to meet the needs of this development trend. Summary of the Invention

[0004] To overcome the technical deficiency of the lack of mature cluster-type high-vacuum wafer bonding equipment in the existing technology, the present invention provides a cluster-type high-vacuum wafer bonding equipment.

[0005] The present invention provides a clustered high-vacuum wafer bonding equipment, including a frame, on which an operating device and a plurality of functional devices are arranged circumferentially along the operating device. The functional devices include a feeding device, a baking device, a plasma activation device, a vision alignment device, a bonding device, and a discharging device.

[0006] The operating device is provided with an operating cavity. The side wall of the operating cavity is provided with docking windows for each functional device. A robotic arm is installed in the operating cavity. The robotic arm is used to penetrate the docking window and extend into the corresponding functional device to realize the transfer of the wafer.

[0007] The feeding device is provided with a feeding chamber, and a first operating window is opened on the side wall of the feeding chamber. The first operating window is connected to a corresponding docking window through a first valve.

[0008] The baking device is provided with a baking cavity, and a second operation window is opened on the side wall of the baking cavity. The second operation window is connected to a corresponding docking window through a second valve.

[0009] The plasma activation device is provided with an activation chamber, and a third operation window is opened on the side wall of the activation chamber. The third operation window is connected to a corresponding docking window through a third valve.

[0010] The visual alignment device is provided with an alignment cavity, and the side wall of the alignment cavity is provided with a fourth operation window. The fourth operation window is connected to the corresponding docking window through a fourth valve.

[0011] The bonding device is provided with a bonding cavity, and the side wall of the bonding cavity is provided with a fifth operation window. The fifth operation window is connected to the corresponding docking window through a fifth valve.

[0012] The discharge device is provided with a discharge cavity, and the side wall of the discharge cavity is provided with a sixth operation window. The sixth operation window is connected to the corresponding docking window through a sixth valve.

[0013] Optionally, the feeding device, baking device, plasma activation device, bonding device, vision alignment device, and discharging device are distributed sequentially at intervals along the circumference of the operating device.

[0014] Optionally, the robotic arm is driven to rotate along a vertical axis and extend and retract radially along the operating cavity. Each functional device is equipped with a lifting structure for lifting the wafer, which works in conjunction with the robotic arm to pick up and place the wafer.

[0015] Optionally, both the feeding chamber and the discharging chamber are equipped with storage racks for storing wafers. The storage racks have multiple storage positions distributed in a vertical direction. The storage racks are driven to rise and fall so that the robotic arm can dock with different storage positions of the storage racks and the storage racks can also act as the lifting structure.

[0016] Optionally, the baking apparatus includes:

[0017] A baking oven, which is fixed on the frame, has a second operating window on its front side wall;

[0018] A vacuuming mechanism, which is fixed to the frame and communicates with the inner cavity of the baking oven;

[0019] A hot plate carrier is installed inside the baking oven and can slide vertically. The front of the hot plate carrier is open and abuts against the front side wall of the baking oven. Multiple horizontally arranged heating plates are fixed inside the hot plate carrier and the multiple heating plates are spaced apart vertically.

[0020] A first lifting rod is sealed through the bottom wall of the baking oven and connected to the bottom wall of the hot plate carrier. The first lifting rod is connected to a first driving component for driving its lifting and lowering. The first driving component drives the hot plate carrier to lift and lower through the first lifting rod so that each heating plate can be aligned with the operation window.

[0021] The top support mechanism serves as the lifting structure of the baking device and includes a mounting frame installed inside the baking oven and capable of sliding vertically. The mounting frame is provided with multiple top support components, each corresponding to a heating plate. The rear side wall of the hot plate carrier has multiple clearance windows corresponding to the multiple top support components. Each top support component includes a mounting plate, the rear end of which is fixedly connected to the mounting frame. The front end of the mounting plate extends into the hot plate carrier through the corresponding clearance window and is located below the corresponding heating plate. A pin is fixed above the front end of the mounting plate, and a through hole is provided on the heating plate corresponding to the position of the pin.

[0022] The second lifting rod is sealed through the bottom wall of the baking oven and located directly below the mounting bracket. The second lifting rod is connected to a second driving member for driving its lifting. The second driving member lifts the top support mechanism through the second lifting rod so that the ejector pin can pass through the corresponding through hole and lift the corresponding wafer.

[0023] Optionally, the inner sides of the top wall, bottom wall, left wall, right wall and rear wall of the hot plate carrier are provided with a first heat reflector, and the inner side of the front wall of the baking oven is provided with a second heat reflector.

[0024] Optionally, the visual alignment device includes:

[0025] The housing is fixed to the frame, and the fourth operating window is provided on the side wall of the housing.

[0026] The gantry frame is fixed inside the alignment cavity;

[0027] An electrostatic chuck is attached to the top beam of the gantry frame;

[0028] The alignment drive is located inside the gantry and mounted on the bottom wall of the housing. The output part of the alignment drive is located at its top and is used to output six degrees of freedom motion in space.

[0029] The lower electrostatic chuck is indirectly fixed above the output section of the alignment drive unit via a mounting base;

[0030] The ejector mechanism serves as a lifting structure for a vision alignment device and includes a lifting plate located below the lower electrostatic chuck. The lower electrostatic chuck has at least three lifting holes distributed circumferentially. The lifting plate has a needle body corresponding to the lifting holes. The lifting plate is mounted on the mounting base and is driven to move vertically up and down so that the needle body passes through the lifting holes to lift the upper or lower wafer.

[0031] The pre-bonding drive has its housing fixed on the frame and located below the housing. The output shaft of the pre-bonding drive seal penetrates the bottom wall of the housing. The alignment drive has a vertically arranged first clearance hole in the middle and a vertically arranged second clearance hole in the middle of the lower electrostatic chuck. The output shaft of the pre-bonding drive is used to lift the lower wafer after passing through the first clearance hole and the second clearance hole in sequence.

[0032] An optical mechanism is mounted on the gantry, and the lower electrostatic chuck and / or the upper electrostatic chuck are provided with imaging windows. The optical mechanism is used to acquire upper wafer images and lower wafer images through the imaging windows.

[0033] Optionally, the optical mechanism includes symmetrically distributed upper and lower vision components, which are fixedly connected by a connecting frame. Both the lower and upper electrostatic chucks have imaging windows. The upper vision component is mounted on the top beam of the gantry and is used to acquire an image of the upper wafer through the imaging window of the upper electrostatic chuck. The lower vision component is located below the lower electrostatic chuck and is used to acquire an image of the lower wafer through the imaging window of the lower electrostatic chuck.

[0034] Optionally, the bonding device includes:

[0035] The cavity shell is fixed to the frame and has an open top. The side wall of the cavity shell is provided with a fifth operating window.

[0036] A cover assembly includes a cover plate connected to an opening and closing drive member, which drives the cover plate to move so that the cover plate has a closed state that seals and covers the top of the cavity and an open state that is detached from the top of the cavity.

[0037] A bonding assembly includes an inverted, barrel-shaped lower bonding stage. The bottom opening of the lower bonding stage is sealed and fixed to the bottom of a cavity shell, so that the lower bonding stage, the cavity shell, and a cover plate form a sealed bonding cavity. The bonding assembly also includes an upper heating plate and a lower heating plate. The upper heating plate is suspended in the bonding cavity by a lifting shaft that seals and passes through the cover plate. The lifting shaft is connected to a first lifting drive component installed above the cover plate. The lower heating plate is supported on the inner side of the lower bonding stage by several support columns fixed to the bottom of the cavity shell. The lower heating plate and the top end plate of the lower bonding stage are connected by a first lifting drive component. A graphite pad is in contact. The side wall of the lower bonding stage is provided with a deformation part for axial buffering. The top edge of the lower bonding stage is evenly distributed with multiple notches and slots along the circumferential direction. The bonding assembly also includes a push pin structure. The push pin structure serves as the lifting structure of the bonding device and includes a lifting ring located outside the lower bonding stage and arranged coaxially. The lifting ring is connected to a second lifting drive. The housing of the second lifting drive is fixed below the cavity shell and the output shaft seal passes through the bottom of the cavity shell. The inner ring of the lifting ring is provided with a needle. The needle corresponds one-to-one with the notch and slot and is placed in the corresponding notch and slot.

[0038] A cooling assembly includes an upper cooling plate and a lower cooling plate. The upper cooling plate is suspended in the bonding cavity through a first water pipe that seals through the cover plate. The upper cooling plate is an annular plate and is slidably sleeved on the lifting shaft. The first water pipe is connected to a third lifting drive unit installed above the cover plate. The lower cooling plate is a perforated plate and is slidably sleeved on all the support columns. The lower cooling plate is connected to a second water pipe that penetrates through the bottom of the cavity shell. A fourth lifting drive unit for driving the lower cooling plate to rise and fall is installed at the bottom of the cavity shell.

[0039] Optionally, a second graphite pad is provided on the upper surface of the upper heating plate and the lower surface of the lower heating plate, and the second graphite pad located on the lower surface of the lower heating plate is adapted to the shape of the lower cooling plate.

[0040] The technical solution provided by this invention has the following advantages compared with the prior art:

[0041] The bundled high-vacuum wafer bonding equipment provided by this invention includes multiple functional devices surrounding the operating device, such as a feeding device, a baking device, a plasma activation device, a vision alignment device, a bonding device, and a discharging device. The operating device has a docking window corresponding to each functional device, and each functional device has an operating window. The operating windows connect to the corresponding docking windows via valves, thus enabling the switching of the operating device with each functional device. This ensures the spatial independence of the operating device and each functional device, thereby guaranteeing the vacuum level of each step in wafer processing. It also requires a lower cleanroom cleanliness level. Furthermore, the operating device includes a robotic arm that enables the transfer of wafers between the various functional devices, resulting in a high degree of automation. Therefore, this equipment meets the development trends required for wafer bonding. Attached Figure Description

[0042] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0043] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 This diagram shows the overall layout of the device in an embodiment of the present invention.

[0045] Figure 2 This is a schematic diagram of the structure of the robotic arm in an embodiment of the present invention;

[0046] Figure 3 This is a schematic diagram showing the overall structure of the baking apparatus in an embodiment of the present invention;

[0047] Figure 4 This is a cross-sectional perspective view of the baking oven and its internal structure along the front-back direction in an embodiment of the present invention.

[0048] Figure 5 This is a perspective view showing the assembly structure of the hot plate carrier and the top support mechanism in an embodiment of the present invention;

[0049] Figure 6 A perspective view of the top support mechanism in an embodiment of the present invention;

[0050] Figure 7 This is a cross-sectional perspective view of the assembly structure of the hot plate carrier and the top support mechanism in an embodiment of the present invention, taken along the left-right direction.

[0051] Figure 8This is a cross-sectional perspective view of the lifting drive-related structure in an embodiment of the present invention along the left-right direction.

[0052] Figure 9 This is a schematic diagram showing the overall structure of the visual alignment device in an embodiment of the present invention;

[0053] Figure 10 This is a schematic diagram of the internal structure of the visual alignment device in an embodiment of the present invention (excluding the housing).

[0054] Figure 11 This is a schematic diagram showing the assembly structure of the lower electrostatic chuck, the ejector pin mechanism, and the alignment drive component in an embodiment of the present invention.

[0055] Figure 12 This diagram illustrates the cooperation between the lower electrostatic chuck and the ejector pin mechanism in an embodiment of the present invention.

[0056] Figure 13 This is an exploded view showing the assembly structure of the gantry, lower electrostatic chuck, and ejection drive component in an embodiment of the present invention.

[0057] Figure 14 This is a schematic diagram of the optical mechanism in an embodiment of the present invention;

[0058] Figure 15 This is a schematic diagram showing the overall structure of the bonding device in an embodiment of the present invention;

[0059] Figure 16 This is a cross-sectional view of the bonding device in an embodiment of the present invention;

[0060] Figure 17 express Figure 16 A magnified view of a section at point A in the middle;

[0061] Figure 18 This is a schematic diagram showing the cover assembly and its associated structures in an embodiment of the present invention;

[0062] Figure 19 This is a schematic diagram of the bonding component in an embodiment of the present invention;

[0063] Figure 20 This is an exploded view of the upper heating plate and related structures in an embodiment of the present invention;

[0064] Figure 21 This is an exploded view showing the lower heating plate and related structures in an embodiment of the present invention.

[0065] In the picture:

[0066] 1. Rack;

[0067] 2. Operating device; 21. First valve; 22. Second valve; 23. Third valve; 24. Fourth valve; 25. Fifth valve; 26. Sixth valve; 27. Robotic arm; 28. Central shaft;

[0068] 3. Feeding device;

[0069] 4. Baking apparatus; 41. Baking oven; 411. Second operating window; 412. Fixing frame; 413. Guide rail; 414. Second reflector; 415. Vacuum gauge tube; 416. Adapter; 42. Vacuuming mechanism; 43. Hot plate carrier; 431. Heating plate; 432. Clearance window; 433. First reflector; 434. Vertical plate; 4341. Slot; 44. First lifting rod; 441. First driving component; 45. Top support mechanism; 451. Mounting bracket; 452. Top Support assembly; 4521, mounting plate; 4522, ejector pin; 46, second lifting rod; 461, second drive component; 47, sliding seal assembly; 471, bellows; 472, connecting plate; 473, flange; 4731, mounting groove; 474, oil-free bushing; 48, motor lead screw pair; 481, fixing plate; 482, guide rod; 483, screw; 484, servo motor; 485, nut; 4851, lifting component; 4852, nut; 49, cooling pipe;

[0070] 5. Plasma activation device;

[0071] 6. Vision alignment device; 61. Housing; 611. Alignment cavity; 612. Operation window; 613. Illumination glass; 62. Gantry frame; 63. Upper electrostatic chuck; 631. Through hole; 64. Alignment drive component; 641. First clearance hole; 642. Six-axis platform; 643. Piezoelectric platform; 644. Damping spring; 65. Lower electrostatic chuck; 651. Mounting base; 652. Lifting hole; 653. Second clearance hole; 66. Ejector pin mechanism; 661. Lifting plate; 662. Pin body; 67. Pre-bonding drive component; 68. Optical mechanism; 681. Imaging window; 682. Upper vision assembly; 683. Lower vision assembly; 684. Connecting frame; 685. Guide rail pair; 686. Vacuum slide; 69. Ejection drive component;

[0072] 7. Bonding device; 71. Cavity shell; 711. Fifth operating window; 712. Flange; 7121. First through hole; 713. Base plate; 72. Cover assembly; 721. Cover plate; 7211. Second through hole; 722. Opening and closing drive component; 7221. Fixed seat; 7222. Linear telescopic pair; 723. Mounting plate; 724. Installation space; 725. Connecting column; 726. Buffer; 73. Bonding assembly; 731. Upper heating plate; 7311. Plate body; 7312. Third graphite pad; 7313. Adhesive plate; 7314. Fourth graphite pad; 732. Lower heating plate; 733. Lifting shaft; 7331. Pressure block; 73311. Connecting shaft; 73312. Pressure plate; 7332. Support Ring; 7333, Bolt; 7334, Pad; 7335, Annular Block; 7336, Pressure Ring; 734, First Lifting Drive Component; 735, Support Column; 736, Lower Bonding Stage; 7361, Deformation Part; 7362, Notch; 737, First Graphite Pad; 738, Ejector Pin Structure; 7381, Lifting Ring; 7382, Second Lifting Drive Component; 7383, Needle Component; 739, Second Graphite Pad; 74, Cooling Assembly; 741, Upper Cooling Plate; 742, Lower Cooling Plate; 7421, Cooling Base Plate; 7422, Cooling Cover Plate; 74211, Water Storage Tank; 743, First Water Pipe; 744, Third Lifting Drive Component; 745, Fourth Lifting Drive Component; 746, Cooling Pipe Assembly; 75, Fixing Column;

[0073] 8. Discharge device. Detailed Implementation

[0074] To better understand the above-mentioned objectives, features, and advantages of the present invention, the solutions of the present invention will be further described below. It should be noted that, unless otherwise specified, the embodiments of the present invention and the features thereof can be combined with each other.

[0075] In this description, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. It should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joint" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0076] Many specific details are set forth in the following description in order to provide a full understanding of the invention, but the invention may also be practiced in other ways different from those described herein; obviously, the embodiments in the specification are only some embodiments of the invention, and not all embodiments.

[0077] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0078] Reference Figure 1 and Figure 2 This embodiment provides a cluster-type high-vacuum wafer bonding equipment, including a frame 1. The frame 1 is equipped with an operating device 2 and multiple functional devices spaced circumferentially along the operating device 2. The functional devices include a feeding device 3, a baking device 4, a plasma activation device 5, a vision alignment device 6, a bonding device 7, and a discharging device 8. The operating device 2 is equipped with an operating cavity. The side wall of the operating cavity has a docking window corresponding to each functional device. A robot arm 27 is installed in the operating cavity. The robot arm 27 is used to penetrate the docking window and extend into the corresponding functional device to realize wafer transfer. The feeding device 3 is equipped with a feeding cavity. The side wall of the feeding cavity has a first operating window 612. The first operating window 612 docks with the corresponding docking window through a first valve 21. The baking device 4 is equipped with a baking cavity. The side wall of the baking cavity has a second operating window 4. 11. The second operating window 411 is connected to the corresponding docking window through the second valve 22; the plasma activation device 5 is provided with an activation chamber, and the side wall of the activation chamber is provided with a third operating window 612, which is connected to the corresponding docking window through the third valve 23; the visual alignment device 6 is provided with an alignment chamber 611, and the side wall of the alignment chamber 611 is provided with a fourth operating window 612, which is connected to the corresponding docking window through the fourth valve 24; the bonding device 7 is provided with a bonding chamber, and the side wall of the bonding chamber is provided with a fifth operating window 711, which is connected to the corresponding docking window through the fifth valve 25; the discharge device 8 is provided with a discharge chamber, and the side wall of the discharge chamber is provided with a sixth operating window 612, which is connected to the corresponding docking window through the sixth valve 26.

[0079] Specifically, in this embodiment, the feeding device 3, baking device 4, plasma activation device 5, bonding device 7, visual alignment device 6, and discharging device 8 are arranged sequentially and at intervals along the circumference of the operating device 2. This arrangement is primarily for space avoidance, ensuring that the various devices do not interfere with each other. In other embodiments, the positions of each functional device can be adjusted according to specific circumstances.

[0080] Specifically, in this embodiment, the robotic arm 27 is driven to rotate along a vertical axis and extend and retract radially along the operating cavity. Each functional device is equipped with a lifting structure for lifting the wafer. The lifting structure cooperates with the robotic arm 27 to complete the picking and placing of the wafer. During operation, the robotic arm 27 rotates to dock with each functional device, and extends and retracts to allow the robotic arm 27 to enter or retrieve from the corresponding functional device.

[0081] More specifically, the rotation of the robotic arm 27 can be achieved by a rotary motor or rotary cylinder, while the extension and retraction of the robotic arm 27 can be achieved by a linear actuator or telescopic cylinder, or by a scissor mechanism. For example, in this embodiment, the arm of the robotic arm 27 uses a scissor linkage, with the end of the scissor linkage rotatably mounted on the central shaft 28. The rotation of the robotic arm 27 is achieved when the ends of the scissor linkage rotate synchronously, and the radial movement of the head end in the operating cavity is achieved by changing the angle of the scissor linkage when the ends of the scissor linkage rotate relative to each other.

[0082] It should be noted that the robotic arm 27 in this embodiment is limited to two degrees of freedom: rotation and radial extension. A lifting structure is provided in each functional device to assist the robotic arm 27 in picking up and placing wafers. This design simplifies the structure of the robotic arm 27. At the same time, since the robotic arm 27 does not need to be raised or lowered, the size of the operating window 612 and the docking window can be designed to be smaller, which is more conducive to ensuring the vacuum level.

[0083] Specifically, in this embodiment, the first valve 21, the second valve 22, the third valve 23, the fourth valve 24, the fifth valve 25, and the sixth valve 26 all adopt a slide gate valve structure, which is compact and reliable.

[0084] The specific structure of each device will be described in detail below.

[0085] Feed chamber and discharge chamber:

[0086] Both the infeed and discharge chambers are equipped with storage racks for storing wafers. The storage racks have multiple storage positions distributed vertically. The storage racks are driven to rise and fall so that the robot arm 27 can dock with different storage positions on the storage racks, and the storage racks also act as lifting structures. During operation, the storage racks rise and fall so that the storage position of the target layer docks with the robot arm 27 to pick up or place the wafers of the target layer.

[0087] Baking device 4:

[0088] Reference Figures 3 to 8 The baking apparatus 4 in this embodiment includes a baking oven 41, a vacuum mechanism 42, a hot plate carrier box 43, a first lifting rod 44, a top support mechanism 45, and a second lifting rod 46.

[0089] The baking oven 41 is fixed on the frame 1, and the front side wall of the baking oven 41 is provided with the second operation window 411.

[0090] As is easy to understand, the baking oven 41 has a closed structure, forming a sealed cavity inside.

[0091] The vacuum mechanism 42 is fixed on the frame 1 and communicates with the inner cavity of the baking oven 41.

[0092] Specifically, the vacuum mechanism 42 is connected to the rear side wall of the baking oven 41 to create a vacuum environment in the sealed cavity.

[0093] The hot plate carrier 43 is installed inside the baking oven 41 and can slide vertically. The front of the hot plate carrier 43 is open and abuts against the front wall of the baking oven 41. Multiple horizontally arranged heating plates 431 are fixed inside the hot plate carrier 43, and these heating plates 431 are spaced apart vertically. During operation, the hot plate carrier 43 slides vertically to align different heating plates 431 sequentially with the second operating window 411. Then, the robotic arm 27 places the wafers onto the corresponding heating plates 431 through the second operating window 411, thus achieving the purpose of baking multiple wafers simultaneously.

[0094] It should be noted that since the heat source during baking comes from the heating plate 431, the effective space for baking the wafer is the inner cavity of the hot plate carrier 43. Therefore, the front side of the hot plate carrier 43 is connected to the front side wall of the baking oven 41 to form a closed cavity in the inner cavity of the hot plate carrier 43, which helps to reduce heat loss.

[0095] Specifically, the heating plate 431 uses electric heating, which provides better temperature uniformity. The connecting cable of the heating plate 431 is led out through a ceramic tube, which helps to reduce heat loss.

[0096] Specifically, the baking oven 41 is equipped with a fixed frame 412 located behind the hot plate carrier 43. A vertically arranged guide rail 413 is fixed to the front of the fixed frame 412. The hot plate carrier 43 is slidably connected to the guide rail 413, so that the hot plate carrier 43 can slide in the vertical direction.

[0097] The first lifting rod 44 is sealed through the bottom wall of the baking oven 41 and connected to the bottom wall of the hot plate carrier 43. The first lifting rod 44 is connected to a first driving member 441 for driving its lifting and lowering. The first driving member 441 drives the hot plate carrier 43 to lift and lower through the first lifting rod 44 so that each heating plate 431 can be aligned with the second operating window 411.

[0098] Specifically, the first lifting rod 44 penetrates the bottom wall of the oven 41 through a sliding sealing assembly 47. The sliding sealing assembly 47 includes a bellows 471 sleeved on the outside of the first lifting rod 44. Both ends of the bellows 471 are provided with connecting plates 472. The connecting plate 472 at the upper end of the bellows 471 is sealed to the lower surface of the bottom wall of the oven 41, and the connecting plate 472 at the lower end of the bellows 471 is sealed to a flange 473. The upper surface of the flange 473 is provided with a mounting groove 4731, and the bottom end of the first lifting rod 44 is sleeved and fixed in the mounting groove 4731. The bellows 471 can be compressed or stretched as the first lifting rod 44 rises and falls, and together with the flange 473, it maintains the seal between the first lifting rod 44 and the bottom wall of the oven 41 during the movement of the first lifting rod 44. Compared to sliding seals such as rubber sleeves, this sliding seal method does not generate debris due to wear, thus preventing debris from contaminating the sealed cavity, ensuring the vacuum level of the sealed cavity, and consequently guaranteeing the quality of wafer bonding. Furthermore, this sliding seal method has a longer service life and does not require frequent maintenance or replacement. More specifically, the connecting plate 472 is sealed to the lower surface of the bottom wall of the baking oven 41 and the flange 473 via a sealing ring.

[0099] Furthermore, the sliding sealing assembly 47 also includes an oil-free bushing 474, which is disposed within the bottom wall of the baking oven 41. The first lifting rod 44 is slidably fitted within the oil-free bushing 474. It is easy to understand that a through hole 631 is provided in the bottom wall of the baking oven 41 corresponding to the position of the first lifting rod 44. The oil-free bushing 474 is fitted within the through hole 631, and the first lifting rod 44 is fitted within the oil-free bushing 474. The oil-free bushing 474 can guide the first lifting rod 44, thereby ensuring the movement accuracy of the first lifting rod 44. Furthermore, the oil-free bushing 474 does not require lubricating oil or other media, thus avoiding contamination of the sealed cavity and ensuring the vacuum level of the sealed cavity.

[0100] Specifically, the first driving component 441 is a motor lead screw assembly 48, which includes a fixed plate 481 located below the baking oven 41. The fixed plate 481 is fixedly connected to the baking oven 41 via a vertically arranged guide rod 482. The motor lead screw assembly 48 also includes a screw 483, the bottom end of which is rotatably connected to the fixed plate 481, and the top end of which is connected to a servo motor 484 for driving its rotation. The housing of the servo motor 484 is fixed to the lower surface of the bottom wall of the baking oven 41. A nut 485 is screwed onto the screw 483, and the nut 485 is fixedly connected to the flange 473 and slidably sleeved on the guide rod 482. The rotation of the output shaft of the servo motor 484 drives the screw 483 to rotate, thereby driving the nut 485 to move up and down, which in turn drives the first lifting rod 44 to rise and fall, ultimately realizing the lifting and lowering of the hot plate carrier box 43. In detail, the nut component 485 includes a lifting component 4851 and a nut 4852 fixed inside the lifting component 4851. The lifting component 4851 is slidably connected to the guide rod 482, and the nut 4852 is screwed to the screw rod 483.

[0101] The top support mechanism 45 serves as the lifting structure of the baking device 4 and includes a mounting frame 451 installed inside the baking oven 41 and capable of sliding vertically. The mounting frame 451 is provided with multiple top support components 452, which are arranged one-to-one with the heating plate 431. The rear side wall of the hot plate carrier 43 is provided with multiple clearance windows 432 corresponding to the multiple top support components 452. The top support component 452 includes a mounting plate 4521, the rear end of which is fixedly connected to the mounting frame 451. The front end of the mounting plate 4521 extends into the hot plate carrier 43 through the corresponding clearance window 432 and is located below the corresponding heating plate 431. A pin 4522 is fixed above the front end of the mounting plate 4521, and a through hole is provided on the heating plate 431 corresponding to the position of the pin 4522. During operation, when the robotic arm 27 carrying the wafer moves through the second operating window 411 to above the corresponding heating plate 431, the mounting bracket 451 rises, causing the ejector pin 4522 to move upward, so that the ejector pin 4522 passes through the through hole and lifts the wafer until it is detached from the robotic arm 27. At this time, the robotic arm 27 retracts, and then the mounting bracket 451 descends, causing the ejector pin 4522 to move downward, so that the ejector pin 4522 is lower than the upper surface of the heating plate 431, thereby placing the wafer directly on the heating plate 431.

[0102] It is easy to understand that since multiple support components 452 are all mounted on the mounting frame 451, all support components 452 rise and fall synchronously. That is, when a certain wafer needs to be lifted, other wafers located on the heating plate 431 will also be lifted and then fall back.

[0103] It should be noted that since the top support mechanism 45 needs to move vertically relative to the hot plate carrier 43, the vertical dimension of the clearance window 432 opened on the hot plate carrier 43 should be larger than the vertical dimension of the mounting plate 4521, so as to allow for the lifting and lowering of the mounting plate 4521.

[0104] Specifically, to ensure the stability of wafer support, each mounting plate 4521 needs to be equipped with at least three pins 4522, which is well known to those skilled in the art.

[0105] Specifically, the baking oven 41 is equipped with a fixed frame 412 located behind the mounting frame 451. A vertically arranged guide rail 413 is fixed to the front of the fixed frame 412, and the mounting frame 451 is slidably connected to the guide rail 413, thus allowing the mounting frame 451 to slide vertically. It should be noted that both the mounting frame 451 and the hot plate carrier 43 are slidably mounted through the fixed frame 412. Two sets of guide rails 413 need to be provided on the front of the fixed frame 412. The two sets of guide rails 413 are respectively connected to the mounting frame 451 and the hot plate carrier 43. The number of each set of guide rails 413 is not limited, but to ensure the stability of sliding, it is preferable to set two or more guide rails 413 in each set.

[0106] The second lifting rod 46 is sealed through the bottom wall of the baking oven 41 and located directly below the mounting bracket 451. The second lifting rod 46 is connected to a second driving member 461 for driving its lifting and lowering. The second driving member 461 lifts the top support mechanism 45 through the second lifting rod 46 so that the ejector pin 4522 can pass through the corresponding through hole and lift the corresponding wafer.

[0107] Specifically, the second lifting rod 46 adopts the same sliding sealing structure as the first lifting rod 44, that is, the second lifting rod 46 also penetrates the bottom wall of the baking oven 41 through the sliding sealing assembly 47.

[0108] More specifically, the second drive component 461 adopts the same structure as the first drive component 441, that is, the second drive component 461 is also a motor lead screw pair 48.

[0109] It should be noted that the second lifting rod 46 is used to lift the mounting frame 451, but the second lifting rod 46 and the mounting frame 451 can be fixedly connected or not connected at all. The latter is preferred for the following reasons: When the hot plate carrier 43 is raised and lowered, the top support assembly 452 corresponding to the heating plate 431 also rises and falls accordingly. If the second lifting rod 46 and the mounting frame 451 are fixedly connected, then the second lifting rod 46 needs to move synchronously when the first lifting rod 44 moves, which increases the control difficulty; while if the second lifting rod 46 and the mounting frame 451 are fixedly connected, then the second lifting rod 46 needs to move synchronously when the first lifting rod 44 moves, which increases the control difficulty; When there is no connection between the frames 451, the lifting and lowering of the hot plate carrier 43 will cause the top support assembly 452 to lift and lower synchronously. The second lifting rod 46 is disengaged from the mounting frame 451. When the hot plate carrier 43 is lifted and lowered to the position and the ejector pin 4522 needs to be activated, the second lifting rod 46 will be activated. The displacement of the second lifting rod 46 can be controlled to be equal to the displacement of the first lifting rod 44 plus the sum of the relative displacements of the ejector pin 4522 and the heating plate 431. It is not necessary to maintain the synchronization of the first lifting rod 44 and the second lifting rod 46 during the movement, which reduces the control difficulty.

[0110] In addition, to reduce heat loss within the hot plate carrier 43, this embodiment also provides first heat reflectors on the inner sides of the top, bottom, left, right, and rear walls of the hot plate carrier 43, and a second heat reflector on the inner side of the front wall of the baking oven 41. The five first heat reflectors and one second heat reflector can cover all surfaces of the hot plate carrier 43, reducing heat loss through heat reflection, thereby avoiding uneven temperature caused by excessive local heat dissipation and further improving the temperature uniformity during baking.

[0111] It should be noted that the first and second heat reflective screens can be set separately to serve as the box walls, or they can be fixed to the original box walls as additional structures. For example, in this embodiment, the first heat reflective screens set on the left and right sides of the hot plate carrier 43 are set separately to serve as the box walls, while the first heat reflective screens set on the rear, top, and bottom sides of the hot plate carrier 43 and the second heat reflective screens set on the front side of the baking oven 41 are fixed to the original box walls as additional structures.

[0112] It should be noted that since the front end of the mounting plate 4521 of the top support mechanism 45 needs to penetrate through the rear side wall of the hot plate carrier 43 and extend into the hot plate carrier 43, the first heat reflection screen located on the rear side wall of the hot plate carrier 43 needs to be provided with a hollow area corresponding to the avoidance window 432 in order to avoid the installation and lifting of the mounting plate 4521.

[0113] Specifically, the first and second heat-reflecting screens are formed by stacking multiple layers of heat-reflecting glass at intervals.

[0114] Furthermore, vertical plates 434 are fixed to the inner sides of the first heat reflective screens on both the left and right sides. The inner surface of each vertical plate 434 has multiple slots 4341 spaced vertically in relation to the heating plate 431. The left and right ends of the heating plate 431 are engaged in the slots 4341 of the corresponding vertical plates 434. When the first heat reflective screen is installed inside the wall of the heat plate carrier 43, the fixing of the heating plate 431 becomes a technical challenge due to the special structure of the first heat reflective screen. In this embodiment, vertical plates 434 are fixed to the inner sides of the first heat reflective screens on both the left and right sides, and the heating plate 431 is fixed by the slots 4341 on the vertical plates 434, resulting in a more robust structure.

[0115] In addition, in this embodiment, a cooling pipe 49 is provided on the outside of the baking oven 41, and the baking oven 41 is cooled by circulating coolant filled in the cooling pipe 49.

[0116] Specifically, cooling pipes 49 are provided on the outer side of the rear wall, the outer side of the left wall, and the outer side of the right wall of the baking oven 41, which provides a good cooling effect. The top wall of the baking oven 41 is provided with a vacuum gauge tube 415 and an adapter 416 for connecting to the testing equipment. The vacuum gauge tube 415 is used to detect the vacuum degree of the sealed cavity, and the adapter 416 is used to connect to the testing equipment to realize the automated control of baking.

[0117] The working process of the baking device 4 in this embodiment is as follows:

[0118] S1. Connect the baking oven 41 to the vacuum operating chamber through the second operating window 411 and open the slide valve;

[0119] S2. Control the first lifting rod 44 to move, drive the hot plate carrier 43 to rise and fall until the target heating plate 431 is aligned with the operation window 612;

[0120] S3. The robotic arm 27 picks up the wafer and extends into the interior of the hot plate carrier 43 through the operation window 612. At this time, the wafer is located directly above the heating plate 431 and supported on the robotic arm 27.

[0121] S4. Control the second lifting rod 46 to move, drive the mounting bracket 451 to rise and fall until the ejector pin 4522 lifts the wafer and detaches the wafer from the robot arm 27.

[0122] S5. The robotic arm 27 retracts and controls the second lifting rod 46 to move, driving the mounting frame 451 down so that the wafer falls onto the heating plate 431;

[0123] S6. Repeat steps S2 to S5 until all heating plates 431 of the hot plate carrier 43 are carrying wafers.

[0124] S7. Close the insert valve, turn on the heating plate 431 to heat up, and bake the wafer;

[0125] S8. After baking is complete, open the insert valve, the ejector pin 4522 lifts the wafer, the robot arm 27 extends into the hot plate carrier 43, the ejector pin 4522 descends to make the wafer fall onto the robot arm 27, and the robot arm 27 retracts to remove the wafer.

[0126] Plasma activation device 5:

[0127] The plasma activation device 5 used in this embodiment is a mature existing structure in the field, and will not be described in detail here.

[0128] Visual alignment device 6:

[0129] Reference Figures 9 to 14 The visual alignment device 6 in this embodiment includes a housing 61, a gantry frame 62, an upper electrostatic chuck 63, an alignment drive 64, a lower electrostatic chuck 65, a pin mechanism 66, a pre-bonding drive 67, and an optical mechanism 68.

[0130] The housing 61 is fixed on the frame 1, and the side wall of the housing 61 is provided with a fourth operation window 612.

[0131] It is easy to understand that since visual alignment needs to be performed in a vacuum environment, the enclosure 61 should be equipped with a vacuuming structure and a vacuum gauge tube 415 for detecting the vacuum level in the actual design. At the same time, an adapter 416 can be set as needed to connect the detection mechanism, a hanger can be set to connect the lifting device, or other structures can be set to assist the operation.

[0132] Furthermore, in this embodiment, an illumination glass 613 is sealed and installed on the side wall of the housing 61. The illumination glass 613 can adjust the brightness within the alignment cavity 611 to meet the brightness requirements of the optical mechanism 68 during operation.

[0133] Furthermore, in this embodiment, a silicone plate is provided on the outer wall of the housing 61. The silicone plate has a certain degree of flexibility, which can reduce the vibration caused by impacts to the internal structure of the device, thereby reducing the impact on the positional accuracy of the internal structure of the device.

[0134] The gantry frame 62 is fixed inside the alignment cavity 611.

[0135] As is easy to understand, the gantry 62 is mainly used to install other components, while dividing the alignment cavity 611 into multiple installation areas such as above the top beam of the gantry 62 and inside the gantry 62, so as to make fuller and more effective use of the space inside the alignment cavity 611.

[0136] As is easily understood, the gantry frame 62 consists of a top beam and two columns. The structure of the top beam and columns is not limited; for example, in this embodiment, both the top beam and columns are designed as H-shaped structures.

[0137] The upper electrostatic chuck 63 is fixed below the top beam of the gantry frame 62.

[0138] It is easy to understand that electrostatic chucks are a mature structure in this field. Their surface is provided with electrode holes for connecting electrodes. During operation, the electrodes provide a uniform electric field to the entire disk surface, and the charge polarization of the wafer surface is achieved according to Coulomb's law and Lorentz's law, thereby achieving the effect of wafer adsorption. The upper electrostatic chuck 63 and the lower electrostatic chuck 65 mentioned later are both made using this principle.

[0139] It should be noted that, in order to cooperate with the operation of other components, the upper electrostatic chuck 63 is also provided with an imaging window 681 and a through hole 631. For better understanding, the specific functions of the imaging window 681 and the through hole 631 will be explained in conjunction with the corresponding components later.

[0140] The alignment drive unit 64 is located inside the gantry 62 and installed on the bottom wall of the housing 61. The output part of the alignment drive unit 64 is located on its top and is used to output six degrees of freedom motion in space.

[0141] Specifically, the alignment drive 64 in this embodiment includes a six-axis platform 642 and a piezoelectric platform 643. The bottom of the six-axis platform 642 is fixed to the bottom wall of the housing 61, and the piezoelectric platform 643 is connected to the top of the six-axis platform 642. The mounting base 651 is fixed to the top of the piezoelectric platform 643. During operation, the six-axis platform 642 drives the piezoelectric platform 643, the mounting base 651, and the lower electrostatic chuck 65 to move along six degrees of freedom in space, thereby achieving arbitrary adjustment of the lower wafer's position in space, and thus achieving coarse alignment between the lower and upper wafers. Utilizing its high-precision characteristics, the piezoelectric platform 643 further adjusts the position of the lower wafer after the coarse alignment, thereby achieving fine alignment between the lower and upper wafers. By achieving coarse alignment through the six-axis platform 642 and then fine alignment through the piezoelectric platform 643, alignment accuracy can be effectively improved while ensuring alignment efficiency. More specifically, the six-axis platform 642 includes a ring plate at the top and a fixed plate 481 at the bottom. The ring plate is connected to the piezoelectric platform 643, and the fixed plate 481 is connected to the bottom of the housing 61. The ring plate and the fixed plate 481 are movably connected by six telescopic drive pairs. The six telescopic drive pairs work together to achieve six degrees of freedom of spatial motion of the ring plate. The piezoelectric platform 643 has a square ring structure and includes a base and an output section. The output section is installed on the top of the base and connected to the mounting base 651 through a piezoelectric drive structure. The piezoelectric drive structure utilizes the inverse piezoelectric effect of the piezoelectric ceramic material to generate spatial motion by controlling the mechanical deformation of the piezoelectric ceramic material, thereby realizing the spatial motion of the output section.

[0142] It should be noted that traditional motor operation will emit tiny particles and molecular deposits, which can easily contaminate the vacuum environment of the alignment cavity 611. In this embodiment, the alignment drive 64 adopts a combination structure of a six-axis platform 642 and a piezoelectric platform 643, which can avoid the precipitation of tiny particles and molecules, thereby avoiding contamination of the vacuum environment.

[0143] Furthermore, in this embodiment, a damping spring 644 is provided between the top of the mounting base 651 and the six-axis platform 642. The damping spring 644 can share part of the weight of the mounting base 651 and its auxiliary structures, thereby reducing the load on the piezoelectric platform 643 and preventing it from being crushed. Specifically, the damping spring 644 includes a pin and a spring body. The lower end of the pin is fixed to the top of the six-axis platform 642, and the upper end of the pin passes through the bottom of the mounting base 651. The spring body is fitted onto the pin and is in a compressed state. The two ends of the spring body abut against the six-axis platform 642 and the mounting base 651, respectively. In this way, the elastic force generated by the compression of the spring body shares part of the weight of the mounting base 651 and its auxiliary structures.

[0144] It should be noted that, in order to cooperate with the operation of other components, the alignment drive component 64 is also provided with a first clearance hole 641. For better understanding, the specific function of the first clearance hole 641 will be explained in conjunction with the corresponding components in the following text.

[0145] The lower electrostatic chuck 65 is indirectly fixed above the output section of the alignment drive unit 64 via the mounting base 651.

[0146] It should be noted that, in order to cooperate with the operation of other components, the lower electrostatic chuck 65 is also provided with an imaging window 681, a lifting hole 652 and a second clearance hole 653. For better understanding, the specific functions of the imaging window 681, the lifting hole 652 and the second clearance hole 653 will be explained in the following text in conjunction with the corresponding components.

[0147] The ejector mechanism 66 serves as the lifting structure of the visual alignment device 6 and includes a lifting plate 661. The lifting plate 661 is located below the lower electrostatic chuck 65. The lower electrostatic chuck 65 has at least three lifting holes 652 distributed circumferentially. The lifting plate 661 has a needle body 662 corresponding to the lifting hole 652. The lifting plate 661 is mounted on the mounting base 651 and is driven to rise and fall vertically so that the needle body 662 passes through the lifting hole 652 to lift the upper or lower wafer. During operation, the robotic arm 27 first delivers the upper wafer into the alignment cavity 611. The needle 662 rises and lifts the upper wafer to contact the lower surface of the upper electrostatic chuck 63, while the upper electrostatic chuck 63 attracts the upper wafer through electrostatic attraction. Then the needle 662 falls back to its original position, and the robotic arm 27 delivers the lower wafer into the alignment cavity 611. The needle 662 rises and lifts the lower wafer. After the robotic arm 27 exits the alignment cavity 611, the needle 662 falls back to its original position, causing the lower wafer to be attracted to the upper surface of the lower electrostatic chuck 65.

[0148] As is easy to understand, there are at least three lifting holes 652. The main purpose is to ensure the stability of the lifting of the wafer by the needle body 662. The main purpose of the lifting holes 652 is to avoid the movement of the needle body 662 so that the needle body 662 can penetrate the lower electrostatic chuck 65 to contact the wafer.

[0149] The housing of the pre-bonding drive 67 is fixed to the frame 1 and located below the housing 61. The output shaft of the pre-bonding drive 67 passes through the bottom wall of the housing 61. The alignment drive 64 has a vertically arranged first clearance hole 641 in the middle, and the lower electrostatic chuck 65 has a vertically arranged second clearance hole 653 in the middle. The output shaft of the pre-bonding drive 67 passes through the first clearance hole 641 and the second clearance hole 653 in sequence to lift the lower wafer. After the lower wafer completes visual alignment with the upper wafer, the pre-bonding drive 67 actuates to raise its output shaft and pass through the first clearance hole 641 and the second clearance hole 653 in sequence to lift the lower wafer until it contacts the upper wafer, thus completing the pre-bonding between the upper and lower wafers.

[0150] It should be noted that during coarse alignment, the six-axis platform 642 has already adjusted the gap between the upper and lower wafers to a small size. Therefore, when the pre-bonding drive 67 lifts the lower wafer, it has little impact on the positional accuracy of the lower wafer and can meet the process requirements.

[0151] As is easily understood, the inner hole of the ring plate of the six-axis platform 642 and the inner hole of the square annular structure of the piezoelectric platform 643 together form the first clearance hole 641. The first clearance hole 641 and the second clearance hole 653 are mainly used to avoid the movement of the output shaft of the pre-bonding drive 67, so that the output shaft of the pre-bonding drive 67 can pass through the alignment drive 64 and the lower electrostatic chuck 65 in sequence to contact the lower wafer.

[0152] Specifically, in this embodiment, the pre-bonding drive 67 is an electric cylinder with high precision.

[0153] The optical mechanism 68 is mounted on the gantry 62. An imaging window 681 is provided on the lower electrostatic chuck 65 and / or the upper electrostatic chuck 63. The optical mechanism 68 acquires images of the upper and lower wafers through the imaging window 681. During operation, the optical mechanism 68 acquires images of the upper and lower wafers and determines the direction and magnitude of the lower wafer compensation displacement based on the positional difference between the upper and lower wafer markers.

[0154] It should be understood that the imaging window 681 can be opened only on the lower electrostatic chuck 65. In this case, the optical mechanism 68 needs to be located below the lower electrostatic chuck 65 and must use a penetrating infrared optical element to simultaneously acquire images of the upper and lower wafers. Alternatively, the imaging window 681 can be opened only on the upper electrostatic chuck 63. In this case, the optical mechanism 68 needs to be located above the upper electrostatic chuck 63 and must use a penetrating infrared optical element to simultaneously acquire images of the upper and lower wafers. Furthermore, imaging windows 681 can be provided on both the upper electrostatic chuck 63 and the lower electrostatic chuck 65. The optical mechanism 68 needs to be equipped with two sets of vision components, located below the lower electrostatic chuck 65 and above the upper electrostatic chuck 63, respectively, to acquire images of the upper and lower wafers. This embodiment adopts this approach.

[0155] Specifically, the optical mechanism 68 in this embodiment includes symmetrically distributed upper vision component 682 and lower vision component 683. The upper vision component 682 and lower vision component 683 are fixedly connected by a connecting frame 684. Both the lower electrostatic chuck 65 and the upper electrostatic chuck 63 have imaging windows 681. The upper vision component 682 is mounted on the top beam of the gantry 62 and is used to acquire an image of the upper wafer through the imaging window 681 of the upper electrostatic chuck 63. The lower vision component 683 is located below the lower electrostatic chuck 65 and is used to acquire an image of the lower wafer through the imaging window 681 of the lower electrostatic chuck 65. It is easy to understand that since the upper vision component 682 and lower vision component 683 are fixedly connected by the connecting frame 684 and are symmetrically distributed, the relative positions of the upper vision component 682 and lower vision component 683 are determined, and the relative positions of the acquired upper and lower wafer images are also determined. During operation, the upper wafer image and the lower wafer image are acquired by the upper vision component 682 and the lower vision component 683 respectively, which can achieve high definition and low distortion, thus better ensuring the pre-bonding accuracy.

[0156] Furthermore, in this embodiment, the upper vision component 682 is slidably mounted on the top beam of the gantry 62 via a guide rail pair 685. The sliding direction of the upper vision component 682 is perpendicular to the in-and-out direction of the robot arm 27, and the upper vision component 682 is connected to a drive component for driving its sliding. The guide rail pair 685 allows the upper vision component 682 and the lower vision component 683 to move to opposite sides relative to the in-and-out direction of the robot arm 27, thereby enabling visual alignment of wafers of different sizes or with different markings.

[0157] Furthermore, in this embodiment, the upper vision component 682 is equipped with a guide rail pair 685 on one side of its sliding direction, and a vacuum slide 686 is equipped on the other side of its sliding direction as a driving component. The vacuum slide 686 serves as a power element and also provides support and guidance, which can further save space and facilitate the reduction of the overall size of the device.

[0158] It should be noted that in this embodiment, both the upper electrostatic chuck 63 and the lower electrostatic chuck 65 have two imaging windows 681. Both the upper and lower wafers have two marks. The optical mechanism 68 has two sets symmetrically distributed on the left and right. The two sets of optical mechanisms 68 capture the two marks on the upper or lower wafer through the two imaging windows 681 respectively, so as to more accurately determine the position of the upper or lower wafer.

[0159] In addition, the visual alignment device 6 of this embodiment also includes an ejection drive 69. The housing of the ejection drive 69 is fixed above the top beam of the gantry 62. The upper electrostatic chuck 63 is also provided with a through hole 631. The output shaft of the ejection drive 69 is arranged downward and is used to pass through the through hole 631 to eject the pre-bonded wafer. During operation, after the lower wafer and the upper wafer are pre-bonded, even if the upper electrostatic chuck 63 is de-energized, there may still be residual static electricity between the upper wafer and the upper electrostatic chuck 63, which may prevent the wafer from falling. Therefore, this embodiment adds an ejection drive 69 to eject the wafer after pre-bonding, so that the wafer detaches from the upper electrostatic chuck 63 and falls onto the robot arm 27 to ensure the smooth progress of subsequent processes.

[0160] As is easily understood, the through hole 631 is mainly used to prevent the output shaft of the ejector drive 69 from moving, so that the output shaft of the ejector drive 69 can pass through the electrostatic chuck 63 and contact the wafer.

[0161] Specifically, in this embodiment, the ejector drive 69 is an electric push rod.

[0162] The working process of the visual alignment device 6 in this embodiment is as follows:

[0163] S1. Evacuate the alignment cavity 611 enclosed by the housing 61 to ensure that the vacuum level of the alignment cavity 611 meets the process requirements.

[0164] S2. The robot arm 27 carries the upper wafer and sends it into the alignment cavity 611 through the fourth operation window 612. The ejector pin 4522 rises and lifts the upper wafer to contact the lower surface of the upper electrostatic chuck 63. The upper electrostatic chuck 63 is energized and attracts the upper wafer through electrostatic adsorption. The robot arm 27 exits the alignment cavity 611.

[0165] S3. The robot arm 27 carries the lower wafer and sends it into the alignment cavity 611 through the fourth operation window 612. The ejector pin 4522 rises and lifts the lower wafer until it is detached from the robot arm 27. The robot arm 27 exits the alignment cavity 611. The ejector pin 4522 falls back and causes the lower wafer to fall on the upper surface of the lower electrostatic chuck 65. The lower electrostatic chuck 65 is energized and attracts the lower wafer through electrostatic attraction.

[0166] S4. The upper vision component 682 acquires the upper wafer image through the imaging window 681 of the upper electrostatic chuck 63, and the lower vision component 683 acquires the lower wafer image through the imaging window 681 of the lower electrostatic chuck 65. The direction and magnitude of the lower wafer compensation displacement are determined by the positional difference between the markers in the upper wafer image and the markers in the lower wafer image.

[0167] S5. The lower wafer is coarsely aligned using the six-axis platform 642 and finely aligned using the piezoelectric platform 643, so that the markings on the lower wafer image and the upper wafer image overlap, and the alignment is completed.

[0168] S6. The pre-bonding driver 67 moves to lift the lower wafer to contact the upper wafer, and the lower wafer and the upper wafer are electrostatically attracted to complete the pre-bonding;

[0169] S7. The robotic arm 27 enters the alignment cavity 611 through the fourth operation window 612. The ejection drive 69 ejects the pre-bonded wafer to the upper electrostatic chuck 63 and onto the robotic arm 27. The robotic arm 27 carries the pre-processed wafer and exits the alignment cavity 611.

[0170] Bonding device 7:

[0171] Reference Figures 15 to 21 The bonding device 7 in this embodiment includes a cavity shell 71, a cover assembly 72, a bonding assembly 73, and a cooling assembly 74.

[0172] The cavity shell 71 is fixed on the frame 1 and has an open top. The side wall of the cavity shell 71 is provided with a fifth operation window 711.

[0173] Specifically, the opening and closing valve in this embodiment is a slide gate valve, which is easy to operate and has good sealing performance.

[0174] It should be noted that the bottom of the cavity shell 71 is closed. The bottom of the cavity shell 71 can be integrally formed with the main body of the cavity shell 71, or it can be a separate structure with a sealed connection. For example, in this embodiment, in order to facilitate the installation of internal parts of the cavity shell 71, an installation opening is opened in the middle of the bottom of the cavity shell 71, and a base plate 713 is detachably connected below the installation opening.

[0175] The cover assembly 72 includes a cover plate 721, which is connected to an opening and closing drive member 722. The opening and closing drive member 722 drives the cover plate 721 to move so that the cover plate 721 has a closed state that seals and covers the top of the cavity shell 71 and an open state that is detached from the top of the cavity shell 71.

[0176] It is easy to understand that a sealing ring can be provided between the cover plate 721 and the cavity shell 71 to ensure sealing.

[0177] Specifically, in this embodiment, a mounting plate 723 is provided above the cover plate 721. The mounting plate 723 is parallel to the cover plate 721 and has an installation space 724 between them. The cover plate 721 and the mounting plate 723 are fixedly connected by a connecting post 725. The installation space 724 and the area above the mounting plate 723 can be used to install other components, making it more suitable for scenarios where a large number of components need to be installed above the cover plate 721.

[0178] Specifically, the opening / closing drive component 722 in this embodiment includes a fixed base 7221 mounted on the frame 1, a mounting plate 723 movably connected to the fixed base 7221 and connected to a linear telescopic joint 7222 mounted on the frame 1. The linear telescopic joint 7222 drives the mounting plate 723 to rotate, thereby switching the state of the cover plate 721. More specifically, the linear telescopic joint 7222 in this embodiment uses a cylinder with a locking function, which can lock the cover plate 721 when it is in the closed state to ensure the safety of equipment operation.

[0179] Furthermore, the frame 1 is provided with a fixed column, and the cover plate 721 is provided with a buffer 726 extending below it. The buffer 726 cooperates with the fixed column to buffer before the cover plate 721 switches to the closed state, thereby avoiding the cover plate 721 from colliding with the cavity shell 71 and causing structural damage.

[0180] The bonding assembly 73 includes an inverted barrel-shaped lower bonding stage 736. The bottom opening of the lower bonding stage 736 is sealed and fixed to the bottom of the cavity shell 71 so that the lower bonding stage 736, the cavity shell 71, and the cover plate 721 form a sealed bonding cavity. The bonding assembly 73 also includes an upper heating plate 731 and a lower heating plate 732. The upper heating plate 731 is suspended in the bonding cavity by a lifting shaft 733 that seals and penetrates the cover plate 721. The lifting shaft 733 is connected to a first lifting drive component 734 installed above the cover plate 721. The lower heating plate 732 is supported on the inner side of the lower bonding stage 736 by several support columns 735 fixed to the bottom of the cavity shell 71. The lower heating plate 732 and the top end plate of the lower bonding stage 736 are connected. Contacting the first graphite pad 737, the side wall of the lower bonding stage 736 is provided with a deformation portion 7361 for axial buffering. The top edge of the lower bonding stage 736 is evenly distributed with multiple notches 7362 along the circumferential direction. The bonding assembly 73 also includes a push pin structure 738. The push pin structure 738 includes a lifting ring 7381 located outside the lower bonding stage 736 and arranged coaxially. The lifting ring 7381 is connected to a second lifting drive member 7382. The housing of the second lifting drive member 7382 is fixed below the cavity shell 71 and the output shaft seal passes through the bottom of the cavity shell 71. The inner ring of the lifting ring 7381 is provided with a needle member 7383. The needle member 7383 corresponds one-to-one with the notch 7362 and is placed in the corresponding notch 7362. During operation, the robotic arm 27 feeds the wafer into the bonding cavity through the fifth operating window 711. The second lifting drive 7382 drives the lifting ring 7381 to rise, causing the pin 7383 to support the wafer. Then, the robotic arm 27 exits the bonding cavity, the opening and closing valve closes, and then the second lifting drive 7382 drives the lifting ring 7381 to descend, causing the wafer to fall onto the upper surface of the lower bonding stage 736. Finally, the first lifting drive 734 drives the upper heating plate 731 to descend and press the wafer. The wafer completes bonding under the combined action of pressure and heat.

[0181] Specifically, in this embodiment, the first lifting drive component 734 is an electric cylinder. The housing of the electric cylinder is fixed above the mounting plate 723, and the output shaft of the electric cylinder passes through the mounting plate 723 and its lower end is fixedly connected to the lifting shaft 733.

[0182] It should be noted that the first graphite pad 737 has two functions: First, the first graphite pad 737 itself has toughness, which allows the distance between the lower heating plate 732 and the lower bonding stage 736 to have a certain adjustment range. Then, in conjunction with the deformable part 7361, it can compensate for the dimensional changes in the thickness direction of the upper heating plate 731 or the lower heating plate 732 due to heat, thereby avoiding excessive pressure on the wafer after the upper heating plate 731 descends a set distance. Second, the first graphite pad 737 has good thermal conductivity, which can evenly transfer the heat of the lower heating plate 732 to the entire surface of the first graphite pad 737, thereby making the heat distribution of the lower bonding stage 736 more uniform.

[0183] Specifically, in this embodiment, the deformable part 7361 is set as a rectangular corrugated tube 471 segment. The force required to deform the rectangular corrugated tube 471 segment should be less than the maximum pressure that the wafer can withstand. In this way, the rectangular corrugated tube 471 segment will be deformed before the wafer reaches the maximum pressure, thus avoiding damage to the wafer due to excessive pressure.

[0184] It is easy to understand that the bonding cavity needs to be connected to a vacuum pumping assembly and a vacuum gauge tube 415 for detecting the vacuum level in order to meet the vacuum level requirements of the bonding cavity, which is well known to those skilled in the art.

[0185] Specifically, in this embodiment, the support column 735 is a height-adjustable adjustment rod. During installation, the lower heating plate 732 can be leveled by adjusting the height of each support column 735.

[0186] Furthermore, in this embodiment, a flange 712 is formed by protruding outward from the top edge of the cavity shell 71. Multiple first through holes 7121 are evenly distributed along the axial direction on the flange 712. A second through hole 7211 is provided on the cover plate 721 corresponding to the first through holes 7121. When the cover plate 721 is in the closed state, it is leveled by bolts 7333 pairs inserted into the first and second through holes 7121 and 7211. Since the cavity shell 71 is fixed to the frame 1, the levelness of the top surface of the cavity shell 71 is ensured by structural precision. Therefore, when the cover plate 721 is in the closed state, the levelness of a local position of the cover plate 721 can be adjusted by tightening the nut 4852 of the bolts 7333 pairs, and the overall levelness of the cover plate 721 can be adjusted by using multiple bolts 7333 pairs. Since the upper heating plate 731 is mounted on the cover plate 721, the level of the upper heating plate 731 is also adjusted when the cover plate 721 is leveled. This, together with the aforementioned leveling of the lower heating plate 732, ensures that the upper heating plate 731 and the lower heating plate 732 are basically parallel, thereby ensuring uniform pressure during wafer bonding.

[0187] Furthermore, in this embodiment, a pressure block 7331 is provided below the lifting shaft 733. The pressure block 7331 is a structure formed by connecting shaft 73311 and pressure plate 73312. The connecting shaft 73311 is screwed to the middle of the bottom surface of the lifting shaft 733. A support ring 7332 is sleeved on the connecting shaft 73311, and the outer diameter of the support ring 7332 is larger than the diameter of the lifting shaft 733. The support ring 7332 is clamped between the lifting shaft 733 and the pressure plate 73312. The upper heating plate 731 is suspended on the support ring 7332 by vertically arranged bolts 7333. The upper heating plate 731 and the pressure plate 73312 are in contact through a pad 7334 to transmit pressure. The lower surface of the pressure plate 73312 is spherical. During operation, the wafer is placed on the lower bonding stage 736. When the upper heating plate 731 contacts the wafer, if there is a slight tilt, it can be finely adjusted by the cooperation of the spherical surface and the pad 7334 until the upper heating plate 731 is attached to the wafer in a parallel posture, further ensuring uniform pressure during wafer bonding.

[0188] Specifically, in this embodiment, an annular block 7335 is provided between the support ring 7332 and the upper heating plate 731, and a pressure ring 7336 is provided above the support ring 7332. Bolts 7333 pass through the pressure ring 7336, support ring 7332, annular block 7335, and upper heating plate 731 sequentially from top to bottom. The annular block 7335 indirectly contacts the upper heating plate 731 and support ring 7332, improving the stability of the lower heating plate 732 during bonding. The pressure ring 7336 ensures that the pressure transmitted from the bolt 7333 to the support ring 7332 is more even, preventing localized deformation. It should be understood that when the upper heating plate 731 is finely adjusted using the cooperation of the spherical surface and the pad 7334, the adjustment range is very small and can be ensured by the assembly gap between the structures.

[0189] Specifically, in this embodiment, the upper heating plate 731 includes a plate body 7311. A third graphite pad 7312 and a mounting plate 7313 are detachably fixed to the lower surface of the plate body 7311. A fourth graphite pad 7314 is provided on the lower surface of the mounting plate 7313. Because the upper heating plate 731 has a relatively complex structure and high cost, if it were to directly contact the wafer for bonding, it would be extremely susceptible to damage from impacts. Therefore, in this embodiment, a mounting plate 7313 is added below the upper heating plate 731, and a third graphite pad 7312 is added between the mounting plate 7313 and the upper heating plate 731. In this way, the mounting plate 7313 and the third graphite pad 7312 can protect the upper heating plate 731, ensuring its service life. The mounting plate 7313 can be replaced when damaged. Similarly, the lower bonding stage 736 can also protect the lower heating plate 732; the lower bonding stage 736 can be replaced when damaged. More specifically, the third graphite pad 7312, the mounting plate 7313, and the fourth graphite pad 7314 can be secured by clips located on the side wall or other common methods.

[0190] Specifically, in this embodiment, the second lifting drive component 7382 is a cylinder.

[0191] The cooling assembly 74 includes an upper cooling plate 741 and a lower cooling plate 742. The upper cooling plate 741 is suspended inside the cavity shell 71 by a first water pipe 743 that seals through the cover plate 721. The upper cooling plate 741 is an annular plate and is slidably sleeved on the lifting shaft 733. The first water pipe 743 is connected to a third lifting drive 744 installed above the cover plate 721. The lower cooling plate 742 is a perforated plate and is slidably sleeved on all the support columns 735. The lower cooling plate 742 is connected to a second water pipe that penetrates through the bottom of the cavity shell 71. A fourth lifting drive 745 for driving the lower cooling plate 742 to rise and fall is installed at the bottom of the cavity shell 71.

[0192] Specifically, the third lifting drive component 744 is a cylinder, the cylinder body of which is located in the installation space 724 and fixed on the cover plate 721, and the piston rod of which is fixedly connected to the first water pipe 743; the fourth lifting drive component 745 is also a cylinder, the cylinder body of which is fixed below the cavity shell 71, and the piston rod of which passes through the bottom of the cavity shell 71 and is used to lift the lower cooling plate 742.

[0193] Specifically, the lower cooling plate 742 includes a cooling base plate 7421 and a cooling cover plate 7422. The surface of the cooling base plate 7421 is provided with a water storage tank 74211, and the cooling cover plate 7422 is fixed to the surface of the cooling base plate 7421 to close the water storage tank 74211 and form a circulating water channel.

[0194] As is easy to understand, both the first water pipe 743 and the second water pipe need to be provided in two parts, one as an inlet pipe and the other as an outlet pipe. The circulating cooling water enters the upper cooling plate 741 or the lower cooling plate 742 from the inlet pipe and then exits from the outlet pipe. In this way, the heat of the upper heating plate 731 or the lower heating plate 732 is carried away by the circulating cooling water, thereby achieving cooling.

[0195] It should be noted that the second water pipe is not shown in the attached drawings. Its arrangement is the same as that of the first water pipe 743. However, since the lower cooling plate 742 is outside the bonding cavity, the second water pipe does not need to seal the bottom of the cavity shell 71.

[0196] Furthermore, in this embodiment, a second graphite pad 739 is provided on both the upper surface of the upper heating plate 731 and the lower surface of the lower heating plate 732, and the second graphite pad 739 located on the lower surface of the lower heating plate 732 is adapted to the shape of the lower cooling plate 742. The main function of the second graphite pad 739 is to utilize its good thermal conductivity to facilitate heat transfer from the upper heating plate 731 to the upper cooling plate 741 or from the lower heating plate 732 to the lower cooling plate 742, thereby achieving uniform and rapid heat dissipation. Specifically, the second graphite pad 739 can be fixed by a clip located on the side wall or other common methods.

[0197] Furthermore, the cooling assembly 74 in this embodiment also includes a cooling pipe assembly 746 on the outer wall of the cavity shell 71. The cooling pipe assembly 746 can cool the bonding cavity to improve cooling efficiency.

[0198] It should be noted that the lower bonding stage 736, the cavity shell 71, and the cover plate 721 form a closed bonding cavity. Therefore, components located inside the bonding cavity, such as the lifting shaft 733, the first water pipe 743, and the output shaft of the second lifting drive 7382, need to be subjected to sliding sealing treatment to ensure airtightness. However, components located outside the bonding cavity, such as the second water pipe and the output shaft of the fourth lifting drive 745, do not need to be sealed and can be replaced by a normal sliding structure.

[0199] The operation process of the bonding device 7 in the wafer bonding equipment of this embodiment is as follows:

[0200] S1. Evacuate the bonding cavity to ensure that the vacuum level meets the requirements;

[0201] S2. The robotic arm 27 picks up the wafer and sends it into the bonding cavity through the fifth operation window 711. The needle 7383483 rises to lift the wafer out of the robotic arm 27. The robotic arm 27 exits the bonding cavity, and the needle 7383483 falls to make the wafer fall onto the lower bonding stage 736.

[0202] S3. The upper heating plate 731 descends to perform bonding on the wafer;

[0203] S4. Bonding complete, upper heating plate 731 reset;

[0204] S5. The upper cooling plate 741 descends to contact the upper heating plate 731 to cool the upper heating plate 731, while the lower cooling plate 742 rises to contact the lower heating plate 732 to cool the lower heating plate 732.

[0205] The working layers of the clustered high-vacuum wafer bonding equipment in this embodiment are as follows:

[0206] S1. Vacuum the operating device 2 and each functional device to meet process requirements;

[0207] S2. The first valve 21 is opened, and the robotic arm 27 moves to transfer the wafer from the feeding chamber to the operating chamber, after which the first valve 21 is closed;

[0208] S3. The second valve 22 is opened, and the robot arm 27 moves to transfer the wafer from the operating cavity to the baking cavity. The second valve 22 is closed, and the wafer is baked. After baking is completed, the second valve 22 is opened again, and the robot arm 27 transfers the wafer from the baking cavity to the operating cavity. The second valve 22 is closed.

[0209] S4. The third valve 23 is opened, and the robot arm 27 moves to transfer the wafer from the operating cavity to the activation cavity. The third valve 23 is closed, and the wafer is subjected to plasma activation processing. After activation is completed, the third valve 23 is opened again, and the robot arm 27 transfers the wafer from the activation cavity to the operating cavity. The third valve 23 is closed.

[0210] S5. The fourth valve 24 is opened, and the robot arm 27 moves to transfer the wafer from the operating cavity to the alignment cavity 611. The fourth valve 24 is closed, and the wafer is visually aligned and pre-bonded. After the pre-bonding is completed, the fourth valve 24 is opened again, and the robot arm 27 transfers the wafer from the alignment cavity 611 to the operating cavity. The fourth valve 24 is closed.

[0211] S6. The fifth valve 25 is opened, and the robot arm 27 moves to transfer the wafer from the operating cavity to the bonding cavity. The fifth valve 25 is closed, and the wafer is bonded. After the bonding is completed, the fifth valve 25 is opened again, and the robot arm 27 transfers the wafer from the bonding cavity to the operating cavity. The fifth valve 25 is closed.

[0212] S7. The sixth valve 26 opens, the robotic arm 27 moves to transfer the wafer from the operating chamber to the discharge chamber, and the sixth valve 26 closes.

[0213] It should be noted that the various functional devices can operate simultaneously without interference, in order to ensure production efficiency.

[0214] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the present invention. Although detailed descriptions have been provided with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments, and they should all be covered within the protection scope of the claims.

Claims

1. A cluster-type high-vacuum wafer bonding device, characterized in that, It includes a frame (1), on which an operating device (2) and a plurality of functional devices are distributed circumferentially along the operating device (2). The functional devices include a feeding device (3), a baking device (4), a plasma activation device (5), a visual alignment device (6), a bonding device (7), and a discharging device (8). The operating device (2) is provided with an operating cavity. The side wall of the operating cavity is provided with docking windows for each functional device. A robotic arm (27) is installed in the operating cavity. The robotic arm (27) is used to penetrate the docking window and extend into the corresponding functional device to realize the transfer of the wafer. The feeding device (3) is provided with a feeding cavity, and a first operation window is provided on the side wall of the feeding cavity. The first operation window is connected to the corresponding docking window through a first valve (21). The baking device (4) is provided with a baking cavity, and a second operation window is provided on the side wall of the baking cavity. The second operation window is connected to the corresponding docking window through a second valve (22). The plasma activation device (5) is provided with an activation chamber, and a third operation window is provided on the side wall of the activation chamber. The third operation window is connected to the corresponding docking window through a third valve (23). The visual alignment device (6) is provided with an alignment cavity (611), and the side wall of the alignment cavity (611) is provided with a fourth operation window. The fourth operation window is connected to the corresponding docking window through a fourth valve (24). The bonding device (7) is provided with a bonding cavity, and the side wall of the bonding cavity is provided with a fifth operation window. The fifth operation window is connected to the corresponding docking window through a fifth valve (25). The discharge device (8) is provided with a discharge cavity, and the side wall of the discharge cavity is provided with a sixth operation window. The sixth operation window is connected to the corresponding docking window through a sixth valve (26).

2. The bundled high-vacuum wafer bonding equipment according to claim 1, characterized in that, The feeding device (3), baking device (4), plasma activation device (5), bonding device (7), visual alignment device (6) and discharging device (8) are distributed sequentially at intervals along the circumference of the operating device (2).

3. The bundled high-vacuum wafer bonding equipment according to claim 1 or 2, characterized in that, The robotic arm (27) is driven to rotate along the vertical axis and extend and retract radially along the operating cavity. Each functional device is provided with a lifting structure for lifting the wafer. The lifting structure works in conjunction with the robotic arm (27) to pick up and place the wafer.

4. The bundled high-vacuum wafer bonding equipment according to claim 3, characterized in that, Both the feeding chamber and the discharging chamber are equipped with storage racks for storing wafers. The storage racks have multiple storage positions distributed in a vertical direction. The storage racks are driven to rise and fall so that the robotic arm (27) can dock with different storage positions of the storage racks and the storage racks can also act as the lifting structure.

5. The bundled high-vacuum wafer bonding equipment according to claim 3, characterized in that, The baking apparatus (4) includes: A baking oven (41) is fixed on the frame (1), and the front side wall of the baking oven (41) is provided with the second operation window; A vacuuming mechanism (42) is fixed to the frame (1) and communicates with the inner cavity of the baking oven (41); A hot plate carrier (43) is installed inside the baking oven (41) and can slide in the vertical direction. The front side of the hot plate carrier (43) is open and is connected to the front side wall of the baking oven (41). A plurality of horizontally arranged heating plates (431) are fixed inside the hot plate carrier (43) and the plurality of heating plates (431) are spaced apart in the vertical direction. The first lifting rod (44) is sealed through the bottom wall of the baking oven (41) and connected to the bottom wall of the hot plate carrier (43). The first lifting rod (44) is connected to a first driving member (441) for driving its lifting and lowering. The first driving member (441) drives the hot plate carrier (43) to lift and lower through the first lifting rod (44) so ​​that each heating plate (431) can be aligned with the second operation window. The top support mechanism (45) serves as the lifting structure of the baking device (4) and includes a mounting frame (451) installed inside the baking oven (41) and capable of sliding vertically. The mounting frame (451) is provided with multiple top support components (452), each corresponding to a heating plate (431). The rear side wall of the hot plate carrier (43) is provided with multiple clearance windows (432) corresponding to the multiple top support components (452). 452) includes a mounting plate (4521), the rear end of which is fixedly connected to the mounting bracket (451), the front end of which extends into the hot plate carrier (43) through a corresponding clearance window (432) and is located below the corresponding heating plate (431), a pin (4522) is fixed above the front end of the mounting plate (4521), and the heating plate (431) has a through hole corresponding to the position of the pin (4522); The second lifting rod (46) is sealed through the bottom wall of the baking oven (41) and located directly below the mounting bracket (451). The second lifting rod (46) is connected to a second driving member (461) for driving its lifting. The second driving member (461) lifts the top support mechanism (45) through the second lifting rod (46) so that the ejector pin (4522) can pass through the corresponding through hole and lift the corresponding wafer.

6. The bundled high-vacuum wafer bonding equipment according to claim 5, characterized in that, The inner sides of the top wall, bottom wall, left wall, right wall and rear wall of the hot plate carrier (43) are provided with a first heat reflector, and the inner side of the front wall of the baking oven (41) is provided with a second heat reflector.

7. The bundled high-vacuum wafer bonding equipment according to claim 1, characterized in that, The visual alignment device (6) includes: The housing (61) is fixed on the frame (1), and the fourth operation window is provided on the side wall of the housing (61); The gantry frame (62) is fixed inside the alignment cavity (611); An upper electrostatic chuck (63) is fixed below the top beam of the gantry frame (62); The alignment drive (64) is located inside the gantry (62) and mounted on the bottom wall of the housing (61). The output of the alignment drive (64) is located on its top and is used to output six degrees of freedom motion in space. The lower electrostatic chuck (65) is indirectly fixed above the output part of the alignment drive (64) via a mounting base (651); The ejector mechanism (66) serves as the lifting structure of the visual alignment device (6) and includes a lifting plate (661). The lifting plate (661) is located below the lower electrostatic chuck (65). The lower electrostatic chuck (65) has at least three lifting holes (652) distributed circumferentially. The lifting plate (661) has a needle body (662) corresponding to the lifting hole (652). The lifting plate (661) is mounted on the mounting base (651) and is driven to rise and fall vertically so that the needle body (662) passes through the lifting hole (652) to lift the upper or lower wafer. The pre-bonding drive (67) has its housing fixed on the frame (1) and located below the housing (61). The output shaft of the pre-bonding drive (67) is sealed through the bottom wall of the housing (61). The alignment drive (64) has a vertically arranged first clearance hole (641) in the middle. The lower electrostatic chuck (65) has a vertically arranged second clearance hole (653) in the middle. The output shaft of the pre-bonding drive (67) is used to lift the lower wafer after passing through the first clearance hole (641) and the second clearance hole (653) in sequence. An optical mechanism (68) is mounted on the gantry (62), and the lower electrostatic chuck (65) and / or the upper electrostatic chuck (63) have imaging windows (681). The optical mechanism (68) is used to acquire upper wafer images and lower wafer images through the imaging windows (681).

8. The bundled high-vacuum wafer bonding equipment according to claim 7, characterized in that, The optical mechanism (68) includes a symmetrically distributed upper vision component (682) and a lower vision component (683). The upper vision component (682) and the lower vision component (683) are fixedly connected by a connecting frame (684). Both the lower electrostatic chuck (65) and the upper electrostatic chuck (63) have imaging windows (681). The upper vision component (682) is mounted on the top beam of the gantry (62) and is used to acquire an image of the upper wafer through the imaging window (681) of the upper electrostatic chuck (63). The lower vision component (683) is located below the lower electrostatic chuck (65) and is used to acquire an image of the lower wafer through the imaging window (681) of the lower electrostatic chuck (65).

9. The bundled high-vacuum wafer bonding equipment according to claim 1, characterized in that, The bonding device (7) includes: A cavity shell (71) is fixed to the frame (1) and has an open top. The side wall of the cavity shell (71) is provided with a fifth operating window. The cover assembly (72) includes a cover plate (721) connected to an opening and closing drive (722), which drives the cover plate (721) to move so that the cover plate (721) has a closed state that seals and covers the top of the cavity shell (71) and an open state that is detached from the top of the cavity shell (71); The bonding assembly (73) includes an inverted barrel-shaped lower bonding stage (736). The bottom opening of the lower bonding stage (736) is sealed and fixed to the bottom of the cavity shell (71) so that the lower bonding stage (736), the cavity shell (71), and the cover plate (721) form a closed bonding cavity. The bonding assembly (73) also includes an upper heating plate (731) and a lower heating plate (732). The upper heating plate (731) is suspended in the bonding cavity by a lifting shaft (733) that seals through the cover plate (721). The lifting shaft (733) is connected to a first lifting drive (734) installed above the cover plate (721). The lower heating plate (732) is supported on the inner side of the lower bonding stage (736) by a plurality of support columns (735) fixed to the bottom of the cavity shell (71). The lower heating plate (732) and the top end plate of the lower bonding stage (736) are connected by a first graphite The pad (737) contacts the lower bonding stage (736), and the side wall of the lower bonding stage (736) is provided with a deformable part (7361) for axial buffering. The top edge of the lower bonding stage (736) is evenly distributed with multiple notches (7362) along the circumferential direction. The bonding assembly (73) also includes a push pin structure (738). The push pin structure (738) serves as the lifting structure of the bonding device (7) and includes a lifting ring (7381) located outside the lower bonding stage (736) and arranged coaxially. The lifting ring (7381) is connected to a second lifting drive (7382). The housing of the second lifting drive (7382) is fixed below the cavity shell (71), and the output shaft seal passes through the bottom of the cavity shell (71). The inner ring of the lifting ring (7381) is provided with a needle (7383). The needle (7383) corresponds one-to-one with the notch (7362) and is placed in the corresponding notch (7362). The cooling assembly (74) includes an upper cooling plate (741) and a lower cooling plate (742). The upper cooling plate (741) is suspended in the bonding cavity by a first water pipe (743) that seals through the cover plate (721). The upper cooling plate (741) is an annular plate and is slidably sleeved on the lifting shaft (733). The first water pipe (743) is connected to a third lifting drive (744) installed above the cover plate (721). The lower cooling plate (742) is a perforated plate and is slidably sleeved on all the support columns (735). The lower cooling plate (742) is connected to a second water pipe that penetrates through the bottom of the cavity shell (71). A fourth lifting drive (745) for driving the lower cooling plate (742) to rise and fall is installed at the bottom of the cavity shell (71).

10. The bundled high-vacuum wafer bonding equipment according to claim 9, characterized in that, The upper surface of the upper heating plate (731) and the lower surface of the lower heating plate (732) are both provided with a second graphite pad (739), and the second graphite pad (739) located on the lower surface of the lower heating plate (732) is adapted to the shape of the lower cooling plate (742).

Images