Core bonding auxiliary device and method for multi-chip packaging

Abstract

The invention discloses a core bonding auxiliary device and method for multi-chip packaging, and particularly relates to the technical field of chip packaging, the core bonding auxiliary device for multi-chip packaging comprises a processing table, an electric turntable is rotatably mounted on the processing table, and a glue injection frame is mounted on one side of the upper surface of the processing table. By arranging the core sticking mechanism, the material cavity unit is divided into the core sticking station and the cleaning station, rapid core sticking operation can be completed through the material distributing units of the core sticking station, meanwhile, cleaning work can be completed for the other material distributing units, the material distributing units can complete release of glue liquid in an extrusion mode, and the glue liquid is not prone to falling off. The glue solution residual quantity of the material distributing unit is reduced, meanwhile, under the arrangement of the auxiliary unit, the positions of the chips can be actively limited, active switching can be completed along with the material distributing unit, therefore, free and rapid switching response can be completed according to the machining requirement, adaptive adjustment can be completed for the chips of various sizes, and the flexibility is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a core bonding auxiliary device and method for multi-chip packaging. Background Art

[0002] Core bonding is an important step in the semiconductor packaging process. It refers to sticking the cut chip to the base island of the packaging substrate. This process usually occurs after the wafer is cut into individual chips. It is part of the chip packaging process. During the core bonding process, specific bonding materials such as epoxy conductive glue or eutectic solder are used to ensure a firm connection between the chip and the substrate.

[0003] The accuracy and stability of core bonding are crucial to the subsequent packaging steps and the performance of the final product. Therefore, during the core bonding process, it is necessary to strictly control parameters such as the amount of bonding material, the bonding position, and the temperature and pressure during the bonding process to ensure that the chip can be accurately and firmly bonded to the base island. In general, core bonding is a key link in the semiconductor packaging process. It involves the connection between the chip and the substrate and has an important impact on the performance and reliability of the product.

[0004] Reference is made to a core bonding auxiliary device for multi-chip packaging disclosed in the patent with publication number CN118629919B. The core bonding auxiliary device performs core bonding positioning through a positioning unit, and performs glue dispensing positioning through the positioning unit and the glue dispensing unit. This allows auxiliary positioning of the core bonding process to be performed in two different situations, and has strong versatility.

[0005] The core bonding auxiliary device can complete the core bonding operation through the cooperation of the positioning unit and the glue dispensing unit, but the flexibility of this type of core bonding auxiliary device is poor, and it cannot complete fast and flexible adaptation assistance for chips of different sizes, so there are great limitations in the core bonding process. In addition, the design of the glue guide tube of the core bonding auxiliary device only relies on gravity to release the glue liquid, which has a long cycle. At the same time, a large amount of glue liquid is easily left in the glue guide tube, which affects the accuracy of the glue liquid amount.

[0006] At the same time, the above-mentioned core-adhesive auxiliary device cannot assist in cleaning the rubber guide tube, so the glue is very easy to use after solidification, which affects the circulation of the glue, increases the difficulty of subsequent cleaning, and affects the use effect. Summary of the invention

[0007] The object of the present invention is to provide a core bonding auxiliary device and method for multi-chip packaging to solve the above technical problems.

[0008] To solve the above technical problems, the present invention is implemented through the following technical solutions.

[0009] The present invention is a core bonding auxiliary device for multi-chip packaging, comprising a processing table, an electric turntable is rotatably mounted on the processing table, a glue injection frame is mounted on one side of the upper surface of the processing table, and further comprising:

[0010] Multiple packaging stations are arranged in a circular array on an electric turntable;

[0011] The three-axis moving module is set on the injection frame to complete the moving control;

[0012] The core sticking mechanism is arranged on the three-axis moving module to complete the core sticking operation. The core sticking mechanism is divided into a material cavity unit, multiple material dividing units and multiple auxiliary units. The material cavity unit is used to complete the switching and feeding work of the multiple material dividing units. The multiple material dividing units are used to complete the transportation of the glue in the material cavity unit. The multiple auxiliary units are used to complete the active auxiliary restriction of different chips. The core sticking operation of different chips is completed by multiple auxiliary units and material dividing units.

[0013] Furthermore, the cavity unit comprises:

[0014] The annular cavity is arranged at the output end of the three-axis moving module through a bracket, a cut-off block is arranged on one side of the annular cavity, and the remaining space in the annular cavity is divided into a cleaning area by the cut-off block, a rubber hose is arranged on one side of the top of the annular cavity, and a cleaning pipe is arranged on the other side of the top of the annular cavity;

[0015] A rotating ring and a rotating seal are arranged at the bottom of the annular cavity to complete the sealing, and a plurality of through holes are arranged in a circular array on the rotating ring.

[0016] Furthermore, the material cavity unit also includes:

[0017] An inner gear ring is arranged on the inner wall of the rotating ring;

[0018] The switching motor is arranged on one side of the annular cavity through a bracket, and a driving gear meshing with the inner gear ring is installed at the output end of the switching motor;

[0019] The control electric push rod is arranged on the annular cavity and close to the truncation block through a bracket.

[0020] Furthermore, each material distribution unit comprises:

[0021] A material distribution pipe is connected and arranged at the bottom of the through hole, a piston plate is installed at the bottom of the material distribution pipe, and a plurality of release holes are opened at the bottom of the material distribution pipe near the piston plate to release the glue in the material distribution pipe through the plurality of release holes;

[0022] A material distribution barrel is sleeved on the outside of the material distribution pipe and is in sliding sealing contact with the piston plate. A sealing cover is detachably installed on the top of the material distribution barrel, and the sealing cover is slidably sleeved on the outside of the material distribution pipe. A material discharge port is connected to the bottom of the material distribution barrel;

[0023] The material dividing electric push rod is arranged on one side of the rotating ring through a bracket, and the output end of the material dividing electric push rod is transmission connected with one side of the material dividing barrel.

[0024] Furthermore, each material distribution unit also includes:

[0025] A plurality of discharge ports are arranged on the piston plate in a circular array;

[0026] A plurality of plugs are arranged in a circular array at the bottom of the inner wall of the material distribution barrel, and the plurality of plugs are used to complete the bottom sealing of the plurality of discharge ports.

[0027] Furthermore, each auxiliary unit comprises:

[0028] A sliding arm is arranged on the rotating ring, and a lifting arm is slidably provided on the sliding arm;

[0029] The pressing plate is slidably engaged with the sliding arm and fixedly connected to the top of the lifting arm. A return spring is sleeved on the outside of the lifting arm, and the return spring is arranged between the pressing plate and the sliding arm.

[0030] An auxiliary frame is arranged at one side of the bottom of the lifting arm, and the auxiliary restriction of the chip is completed through the auxiliary frame;

[0031] The curing unit is hidden and arranged around the bottom of the auxiliary frame.

[0032] Furthermore, each auxiliary unit also includes:

[0033] A clamping frame is arranged below the rotating ring, and the clamping frame cooperates with the auxiliary frame, and the auxiliary frame can be actively cleaned by the clamping frame;

[0034] Two guiding telescopic rods are arranged between the rotating ring and the pressing frame, and the lifting and lowering guidance of the pressing frame is completed through the two guiding telescopic rods.

[0035] Furthermore, each auxiliary unit also includes:

[0036] Rack No. 1, set on one side of the material distribution barrel;

[0037] A second rack is arranged on one side of the first rack, and a telescopic member is installed at the bottom of the second rack, and the telescopic member is connected to the pressing frame;

[0038] The switching gear is rotatably arranged at the bottom of the rotating ring through a bracket, and the switching gear is respectively engaged and connected with the first rack and the second rack.

[0039] Furthermore, it also includes:

[0040] Multiple electric rods are correspondingly arranged on the annular cavity, and the auxiliary unit close to the side of the control electric push rod is not provided with an electric rod;

[0041] Multiple suction nozzles are arranged at the output ends of multiple electric rods. Each suction nozzle is respectively arranged in cooperation with the material distribution unit located in the cleaning area. The active blocking of the material discharge port is completed through the suction nozzle. A flow channel is arranged in each suction nozzle. A recovery pipe is connected and installed on one side of each suction nozzle. The cleaning liquid is received and recovered through the recovery pipe.

[0042] An arc-shaped boss is arranged on the side of the annular cavity close to the truncation block. An air chamber is arranged on each material distribution unit. A piston is installed in the air chamber in a sliding seal. A roller is installed at the front end of the piston. The roller is in rotational contact with the arc-shaped boss. An expansion air bag is hidden at the bottom of the clamping frame, and the expansion air bag is connected to the air chamber through a pipeline.

[0043] The present invention also provides a core bonding auxiliary method for multi-chip packaging, and the core bonding auxiliary method specifically comprises the following steps:

[0044] Step 1: First, assemble the substrate on each packaging station to complete the restriction;

[0045] Step 2: The material cavity unit is divided into a core sticking station and a cleaning station, and the material cavity unit can be used to complete the cleaning work for the remaining material distribution units;

[0046] Step 3: The glue liquid can be released by extrusion through the distributing unit, thereby reducing the residual amount of glue liquid in the distributing unit;

[0047] Step 4: By setting the auxiliary unit, the position of the chip can be actively restricted, and the active switching can be completed following the material distribution unit, so as to complete free and fast switching response according to processing requirements.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] 1. The present invention is provided with a core sticking mechanism, and the material distribution unit of the core sticking station can complete the fast core sticking operation, and at the same time, the cleaning work can be completed for the other material distribution units, and the material distribution unit can release the glue by extrusion, which reduces the glue residue of the material distribution unit, and avoids the problem that the glue cannot be fully released to affect the bonding effect. At the same time, under the setting of the auxiliary unit, it can complete the free and fast switching response according to the processing requirements, and can complete the adaptation adjustment for chips of various sizes, thereby improving the flexibility;

[0050] 2. The present invention is provided with a material distribution unit, and the glue liquid is sent into the material distribution barrel at the core sticking station through the rubber hose, and the glue liquid is sent into the material distribution barrel through the release hole at the bottom of the material distribution pipe. The material distribution barrel is pushed downward by the material distribution electric push rod, and the piston plate and the material distribution pipe are relatively moved upward in the material distribution barrel. The discharge port is separated from the plug, so that the stored glue liquid is released through multiple discharge ports. When the material distribution barrel moves downward, the piston plate will squeeze the glue liquid during the upward movement, so that the glue liquid can be quickly released, avoiding the problem of a large amount of residue accumulation, and at the same time improving the release efficiency of the glue liquid;

[0051] 3. The present invention is provided with an auxiliary unit, the auxiliary frame can restrict the chip, the clamping frame can be linked with the material distribution barrel, and the clamping frame is driven to move down to a predetermined position through the guidance of the No. 1 rack, the No. 2 rack and the switching gear, so that the bottom of the clamping frame moves to the top of the chip to complete the restriction, and can provide top pressure on the chip to complete the multi-directional restriction of the chip. At the same time, the auxiliary frame contacts the clamping frame when it moves up and resets, and the inner wall of the auxiliary frame is scraped and cleaned by the clamping frame to ensure the cleanliness of the auxiliary frame.

[0052] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is the overall front view of the present invention;

[0054] Figure 2 It is a schematic diagram of installing the packaging station of the present invention on the electric turntable;

[0055] Figure 3 It is a schematic diagram of a packaging station of the present invention;

[0056] Figure 4 It is a schematic diagram of installing the core sticking mechanism of the present invention on the glue injection frame;

[0057] Figure 5 It is a schematic diagram of the core sticking mechanism and the three-axis moving module distribution of the present invention;

[0058] Figure 6 It is a schematic diagram of the core sticking mechanism of the present invention;

[0059] Figure 7 It is a schematic diagram of the distribution of multiple material distribution units on the material cavity unit of the present invention;

[0060] Figure 8 It is a schematic diagram of the distribution of the annular cavity and the rotating ring of the present invention;

[0061] Fig. 9 It is a schematic diagram of the installation of the truncation block of the present invention in the annular cavity;

[0062] Fig.10It is a schematic diagram of the distribution of the material distribution unit and the auxiliary unit of the present invention;

[0063] Fig.11 It is a schematic diagram of the distribution of the auxiliary frame and the pressing frame of the present invention;

[0064] Fig.12 It is a schematic diagram of installing the arc-shaped boss of the present invention on the rotating ring;

[0065] Fig.13 This is a schematic diagram of the distribution of the first rack and the second rack of the present invention;

[0066] Fig.14 This is a schematic diagram of the internal structure of the material distribution barrel of the present invention;

[0067] Fig.15 It is a schematic diagram of installing the expansion airbag of the present invention on the compression frame.

[0068] In the figure: 1. Processing table; 2. Electric turntable; 3. Glue injection rack; 4. Packaging station; 401. Fixed seat; 402. Clamp; 403. Electric push rod; 5. Three-axis moving module; 6. Annular cavity; 7. Cut-off block; 8. Cleaning area; 9. Hose; 10. Cleaning tube; 11. Rotating ring; 12. Through hole; 13. Inner gear ring; 14. Switching motor; 15. Driving gear; 16. Control electric push rod; 17. Distributing tube; 18. Piston plate; 19. Release hole; 20. Distributing barrel; 21. Discharging port; 22 , material distribution electric push rod; 23, discharge port; 24, plug; 25, sliding arm; 26, lifting arm; 27, pressure plate; 28, reset spring; 29, auxiliary frame; 30, curing unit; 31, clamping frame; 32, guide telescopic rod; 33, rack No. 1; 34, rack No. 2; 35, telescopic part; 36, switching gear; 37, electric rod; 38, suction nozzle; 39, recovery tube; 40, arc boss; 41, air chamber; 42, piston; 43, roller; 44, control spring; 45, inflation airbag. DETAILED DESCRIPTION

[0069] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0070] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0071] Embodiment 1: The present invention provides a technical solution: Figure 1 , Figure 2 and Figure 3 As shown, a die bonding auxiliary device for multi-chip packaging includes a processing table 1, on which an electric turntable 2 is rotatably installed. Specifically, a rotating motor for driving the electric turntable 2 is installed in the processing table 1, and a glue injection frame 3 is installed on one side of the upper surface of the processing table 1. It also includes:

[0072] like Figure 4 and Figure 5 As shown, a plurality of packaging stations 4 are arranged in a circular array on the electric turntable 2, each packaging station 4 comprises a fixed seat 401, two clamping plates 402 and two electric push rods 403, the fixed seat 401 is arranged on the electric turntable 2, a base plate is mounted on the fixed seat 401, the two clamping plates 402 are symmetrically slidably arranged on both sides of the fixed seat 401, the two electric push rods 403 are symmetrically arranged on both sides of the fixed seat 401, and the output ends of the two electric push rods 403 are respectively connected to the two clamping plates 402 through the two clamping plates 402;

[0073] The three-axis moving module 5 is arranged on the injection frame 3 to complete the moving control. The three-axis moving module 5 is specifically an X, Y, and Z electric module, which can complete the moving control in the X, Y, and Z directions. A manipulator is arranged on the processing table 1 near the injection frame 3. The chip is transferred to the substrate by the manipulator to complete the loading. At the same time, other structures can be used to complete the chip loading action;

[0074] like Figure 6 As shown, the core sticking mechanism is arranged on the three-axis moving module 5 to complete the core sticking operation. The core sticking mechanism is divided into a material cavity unit, a plurality of material dividing units and a plurality of auxiliary units. The material cavity unit is used to complete the switching and feeding work of the plurality of material dividing units. The plurality of material dividing units are used to complete the conveying of the glue in the material cavity unit. The plurality of auxiliary units are used to complete the active auxiliary restriction of different chips. The core sticking operation of different chips is completed by the plurality of auxiliary units and the material dividing units.

[0075] Among them, the three-axis moving module 5, the switching motor 14, the control electric push rod 16, the material dividing electric push rod 22 and other electrical components are all connected to the switch through the wire, and the switch is electrically connected to the controller, and the specific structure of the controller is not limited.

[0076] Embodiment 2: Based on the material cavity unit provided in Embodiment 1, this embodiment provides a further technical solution of the material cavity unit.

[0077] like Figure 7 , Figure 8 and Fig. 9 As shown, the material chamber unit includes:

[0078] The annular cavity 6 is arranged at the output end of the three-axis moving module 5 through a bracket. The bottom of the annular cavity 6 is open. A cut-off block 7 is arranged on one side of the annular cavity 6. The cut-off block 7 divides the remaining space in the annular cavity 6 into a cleaning area 8. A rubber hose 9 is arranged on one side of the top of the annular cavity 6. The rubber hose 9 passes through the cut-off block 7. The rubber hose 9 is connected to the external glue through a pipeline. A cleaning pipe 10 is arranged on the other side of the top of the annular cavity 6. The cleaning pipe 10 is connected to the cleaning area 8 of the annular cavity 6. The material distribution unit located at the position of the rubber hose 9 is a core sticking station, and the material distribution unit located in the cleaning area 8 is a cleaning station;

[0079] The rotating ring 11 and the rotating seal are arranged at the bottom of the annular cavity 6 to complete the sealing. A plurality of through holes 12 are arranged in a circular array on the rotating ring 11, and each through hole 12 is connected to the rubber hose 9 correspondingly;

[0080] It is worth noting that: when switching for cleaning: by providing a material chamber unit, the distribution pipes 17 of the multiple distribution units located on the cleaning station are interconnected with the cleaning area 8. At this time, the distribution electric push rod 22 is controlled to move, so that the discharge port 23 on the piston plate 18 is separated from the plug 24, and the electric rod 37 is controlled to move, so that the suction nozzle 38 moves up and contacts the bottom of the distribution barrel 20 to form a loop, and then the cleaning liquid is introduced into the cleaning area 8 through the cleaning pipe 10, and then the cleaning liquid continuously enters the distribution barrel 20 of each distribution unit to complete the flushing, avoiding the problem of residual glue in the distribution barrel 20, reducing the difficulty of cleaning, and ensuring the continuous and stable progress of the core sticking work. At the same time, drying gas can be introduced through the cleaning pipe 10, thereby completing the drying treatment in the distribution barrel 20, which is beneficial to subsequent processing, and the circulating cleaning liquid is centrally recovered through the recovery pipe 39, so that the used distribution unit can complete the active cleaning operation, which is convenient for operation and use;

[0081] In the embodiment of the present invention, the material chamber unit further includes:

[0082] The inner gear ring 13 is arranged on the inner wall of the rotating ring 11;

[0083] The switching motor 14 is arranged on one side of the annular cavity 6 through a bracket, and a driving gear 15 meshingly connected with the inner gear ring 13 is installed at the output end of the switching motor 14;

[0084] The control electric push rod 16 is arranged on the annular cavity 6 near the truncation block 7 through a bracket;

[0085] It should be noted that: when completing the switching selection of the auxiliary unit for different chips, it is only necessary to start the switching motor 14, and through the driving gear 15 and the meshing transmission with the inner ring 13, the dividing unit and the auxiliary unit on the rotating ring 11 can follow and complete the switching, which is convenient for free switching according to different chips. At the same time, the dividing unit can synchronously complete automatic cleaning during the switching process, which reduces the subsequent maintenance workload and improves the core bonding efficiency.

[0086] Embodiment 3: Based on the material distribution unit provided in Embodiment 1, this embodiment provides a further technical solution of the material distribution unit.

[0087] like Fig.10 and Fig.11 As shown, each dispensing unit includes:

[0088] A distribution pipe 17 is connected and arranged at the bottom of the through hole 12. A piston plate 18 is installed at the bottom of the distribution pipe 17. A plurality of release holes 19 are opened at the bottom of the distribution pipe 17 near the piston plate 18. The glue in the distribution pipe 17 is released through the plurality of release holes 19. The distribution pipe 17 is hollow in design, and a one-way structure is arranged on one side of the bottom of the distribution pipe 17 near the release hole 19 to limit the glue from flowing back into the distribution pipe 17, so that the glue can be discharged and released stably.

[0089] The material distribution barrel 20 is sleeved on the outside of the material distribution pipe 17 and is in sliding and sealing contact with the piston plate 18. A sealing cover is detachably installed on the top of the material distribution barrel 20, and the sealing cover is slidably sleeved on the outside of the material distribution pipe 17. The bottom of the material distribution barrel 20 is connected to a discharge port 21, and the shape and size of the discharge port 21 can be freely changed according to needs;

[0090] The material distribution electric push rod 22 is arranged on one side of the rotating ring 11 through a bracket, and the output end of the material distribution electric push rod 22 is transmission-connected to one side of the material distribution barrel 20;

[0091] It is worth noting that: when the core gluing operation is performed: a material distribution unit is provided, and the glue liquid is sent into the material distribution barrel 20 at the core gluing station through the rubber hose 9, and the glue liquid is sent into the material distribution barrel 20 through the release hole 19 at the bottom of the material distribution pipe 17, and the glue liquid accumulates between the piston plate 18 and the material distribution barrel 20. Since multiple material distribution units correspond to multiple auxiliary units, and the sizes of the auxiliary frames 29 on the auxiliary units are different, it is necessary to control the amount of glue liquid in each material distribution unit. Since the material distribution barrel 20 is in the initial position, the piston plate 18 The multiple discharge ports 23 on the upper side are correspondingly blocked with the plug 24 to prevent the glue liquid in the material distribution barrel 20 from leaking. Then, the material distribution electric push rod 22 is started to push the material distribution barrel 20 downward, and the piston plate 18 and the material distribution pipe 17 move upward relatively in the material distribution barrel 20. The discharge port 23 is separated from the plug 24, so that the stored glue liquid is released through the multiple discharge ports 23. When the material distribution barrel 20 moves downward, the piston plate 18 squeezes the glue liquid during the upward movement, so that the glue liquid can be released quickly, avoiding the problem of a large amount of residue accumulation, and at the same time improving the release efficiency of the glue liquid.

[0092] Each dosing unit also includes:

[0093] A plurality of discharge ports 23 are provided on the piston plate 18 in a circular array;

[0094] A plurality of plugs 24 are arranged in a circular array at the bottom of the inner wall of the material distribution barrel 20, and the plurality of plugs 24 are used to complete the bottom plugging of the plurality of discharge ports 23;

[0095] In the embodiment of the present invention, each auxiliary unit includes:

[0096] A sliding arm 25 is provided on the rotating ring 11 at a side close to the cutting block 7, and a lifting arm 26 is slidably provided on the sliding arm 25;

[0097] The pressing plate 27 is slidably engaged with the sliding arm 25 and fixedly connected to the top of the lifting arm 26. A return spring 28 is sleeved on the outside of the lifting arm 26, and the return spring 28 is arranged between the pressing plate 27 and the sliding arm 25.

[0098] The auxiliary frame 29 is arranged at one side of the bottom of the lifting arm 26. The auxiliary frame 29 is used to complete the auxiliary restriction of the chip. The size of the auxiliary frame 29 of each auxiliary unit is adapted and replaced according to the size of the chip.

[0099] The curing unit 30 is hidden and arranged around the bottom of the auxiliary frame 29. The curing unit 30 specifically adopts a heating structure, a curing lamp and other structures to complete the curing of the glue;

[0100] It is worth mentioning that: when assisting the core bonding: an auxiliary unit is provided, and the pressure plate 27 on the auxiliary unit at the core bonding station corresponds to the control electric push rod 16, and then the control electric push rod 16 is started to push the pressure plate 27 downward, and the linkage lifting arm 26 and the auxiliary frame 29 are synchronously moved downward to the predetermined position, and the auxiliary frame 29 can limit the released glue to avoid the loss of the glue. At the same time, the auxiliary frame 29 can limit the chip, so that the chip can maintain stable contact with the glue, and can limit the chip to a predetermined substrate installation position. At the same time, a curing unit 30 is provided on the auxiliary frame 29, which can accelerate the curing of the glue, so that the chip can be stably bonded to the predetermined position. By providing a clamping frame 31, the clamping frame 31 can be linked with the distribution barrel 20. When the distribution barrel 20 moves the glue downward to release the glue, it is guided by the first rack 33, the second rack 34 and the switching gear 36. , can control the clamping frame 31 to move up to complete the avoidance, which is beneficial to the assembly of the chip. When the glue liquid is released, the material distribution electric push rod 22 controls the material distribution barrel 20 to move up and reset. Under this action, the clamping frame 31 is driven to move down to the predetermined position through the guidance of the No. 1 rack 33, the No. 2 rack 34 and the switching gear 36, so that the bottom of the clamping frame 31 moves to the top of the chip to complete the restriction. It can provide top pressure on the chip and complete the multi-directional restriction of the chip. After the core bonding work is completed, the electric push rod 16 is controlled to reset, and the reset spring 28 controls the reset. The auxiliary frame 29 moves up and resets to separate from the chip. At this time, the clamping frame 31 can complete the limit of the chip, avoid the interference of the reset of the auxiliary frame 29 on the chip, and improve the accuracy of the core bonding. At the same time, the auxiliary frame 29 contacts with the clamping frame 31 when it moves up and resets, and the inner wall of the auxiliary frame 29 is scraped and cleaned by the clamping frame 31 to ensure the cleanliness of the auxiliary frame 29.

[0101] Each auxiliary unit also includes:

[0102] A clamping frame 31 is disposed below the rotating ring 11. The clamping frame 31 is arranged in cooperation with the auxiliary frame 29. The auxiliary frame 29 can be actively cleaned by the clamping frame 31.

[0103] Two guiding telescopic rods 32 are arranged between the rotating ring 11 and the pressing frame 31. The lifting and lowering guidance of the pressing frame 31 is completed by the two guiding telescopic rods 32. The guiding telescopic rods 32 are specifically composed of a guiding sleeve and a guiding rod. The guiding rod is slidably arranged in the guiding sleeve.

[0104] like Fig.13 and Fig.14 Each auxiliary unit shown also includes:

[0105] A first rack 33 is provided on one side of the material distribution barrel 20;

[0106] The second rack 34 is arranged on one side of the first rack 33. A telescopic member 35 is installed at the bottom of the second rack 34. The telescopic member 35 is connected to the clamping frame 31. The telescopic member 35 is specifically composed of a threaded sleeve and a telescopic screw. The threaded sleeve is arranged at the bottom of the second rack 34. The telescopic screw is screwed into the threaded sleeve through a thread, and the bottom of the telescopic screw is rotatably connected to the clamping frame 31. The initial position of the telescopic member 35 of each auxiliary unit can be freely set according to demand. At the same time, the telescopic member 35 can use an electric telescopic rod to complete telescopic control;

[0107] The switching gear 36 is rotatably arranged at the bottom of the rotating ring 11 through a bracket, and the switching gear 36 is engaged and connected with the first rack 33 and the second rack 34 respectively;

[0108] In the embodiment of the present invention, it also includes:

[0109] A plurality of electric rods 37 are correspondingly arranged on the annular cavity 6, and the auxiliary unit close to the side of the control electric push rod 16 is not provided with an electric rod 37;

[0110] A plurality of suction nozzles 38 are arranged at the output ends of the plurality of electric rods 37. Each suction nozzle 38 is respectively arranged in cooperation with a material distribution unit located in the cleaning area 8. The active blocking of the material discharge port 21 is completed by the suction nozzle 38. A flow channel is arranged in each suction nozzle 38. A recovery pipe 39 is connected and installed on one side of each suction nozzle 38. The cleaning liquid is received and recovered through the recovery pipe 39.

[0111] like Fig.12 and Fig.15 As shown, an arc-shaped boss 40 is arranged on the side of the annular cavity 6 near the truncation block 7, and an air chamber 41 is arranged on each material distribution unit. The top of the air chamber 41 is open, and the air chamber 41 is connected to the rotating ring 11. A piston member 42 is installed in the air chamber 41 in a sliding seal, and a roller 43 is installed at the front end of the piston member 42. The roller 43 is in rotational contact with the arc-shaped boss 40, and the movement control of the piston member 42 is completed by the extrusion of the arc-shaped boss 40. The two sides of the arc-shaped boss 40 are designed with an inclined transition. A control spring 44 is arranged between the piston member 42 and the air chamber 41, and an expansion airbag 45 is hidden and installed at the bottom of the clamping frame 31. The expansion airbag 45 is connected to the air chamber 41 through a pipeline, a certain amount of gas is injected into the air chamber 41, and a friction layer is arranged on the outer surface of the expansion airbag 45.

[0112] It is worth mentioning that: at the same time, since an arc-shaped boss 40 is provided at the core bonding station, the roller 43 and the piston member 42 are squeezed by the trajectory of the arc-shaped boss 40 to complete the movement, and the gas in the air chamber 41 is squeezed into the expansion airbag 45 through the piston member 42, so that the expansion airbag 45 can expand to a certain extent. In the reset path of the auxiliary frame 29, the auxiliary frame 29 can be assisted in cleaning by the expansion airbag 45, which further improves the cleaning accuracy and can compensate for the missing cleaning position. When the roller 43 is separated from the arc-shaped boss 40, the expansion airbag 45 is reset, so that the expansion airbag 45 of the material distribution unit at the core bonding station is automatically started, which is conducive to the stable progress of the cleaning work and ensures the cleanliness of the auxiliary frame 29.

[0113] Embodiment 4: A core bonding auxiliary method for multi-chip packaging, the core bonding auxiliary method specifically comprising the following steps:

[0114] Step 1: First, assemble the substrate on each packaging station 4 to complete the restriction;

[0115] Step 2: The material cavity unit is divided into a core sticking station and a cleaning station, and the material cavity unit can be used to complete the cleaning work for the remaining material distribution units;

[0116] Step 3: The glue liquid can be released by extrusion through the distributing unit, thereby reducing the residual amount of glue liquid in the distributing unit;

[0117] Step 4: By setting the auxiliary unit, the position of the chip can be actively restricted, and the active switching can be completed following the material distribution unit, so as to complete free and fast switching response according to processing requirements.

[0118] The present invention provides a core bonding auxiliary device and method for multi-chip packaging, and the specific working principle is as follows: first, the substrate is assembled on each packaging station 4 to complete the restriction, and then the three-axis moving module 5 is operated according to the program setting, so as to complete the position movement of the core bonding mechanism. By providing the core bonding mechanism, the material cavity unit is divided into a core bonding station and a cleaning station. The material dividing unit of the core bonding station can complete the rapid core bonding operation, and at the same time, the cleaning work can be completed for the remaining material dividing units, thereby ensuring the stable operation of multiple material dividing units, avoiding the problem that a large amount of residual glue in the material dividing unit solidifies and causes blockage, and the material dividing unit can complete the release of the glue in an extrusion manner, reducing the residual glue in the material dividing unit, avoiding the problem that the glue cannot be fully released to affect the bonding effect, and at the same time, under the setting of the auxiliary unit, the position of the chip can be actively restricted, and the auxiliary units are of different sizes, and can follow the material dividing unit to complete active switching, thereby completing free and rapid switching response according to processing requirements, and can complete adaptation and adjustment for chips of various sizes, thereby improving flexibility.

[0119] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0120] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A core bonding auxiliary device for multi-chip packaging, comprising a processing table, an electric turntable is rotatably mounted on the processing table, and a glue injection frame is mounted on one side of the upper surface of the processing table, characterized in that: Also includes: Multiple packaging stations are arranged in a circular array on an electric turntable; The three-axis moving module is set on the injection frame to complete the moving control; The core sticking mechanism is arranged on the three-axis moving module to complete the core sticking operation. The core sticking mechanism is divided into a material cavity unit, multiple material dividing units and multiple auxiliary units. The material cavity unit is used to complete the switching and feeding work of the multiple material dividing units. The multiple material dividing units are used to complete the transportation of the glue in the material cavity unit. The multiple auxiliary units are used to complete the active auxiliary restriction of different chips. The core sticking operation of different chips is completed by multiple auxiliary units and material dividing units.

2. The die bonding auxiliary device for multi-chip packaging according to claim 1, characterized in that: The cavity unit comprises: The annular cavity is arranged at the output end of the three-axis moving module through a bracket, a cut-off block is arranged on one side of the annular cavity, and the remaining space in the annular cavity is divided into a cleaning area by the cut-off block, a rubber hose is arranged on one side of the top of the annular cavity, and a cleaning pipe is arranged on the other side of the top of the annular cavity, the material distribution unit located at the rubber hose position is a core sticking station, and the material distribution unit located in the cleaning area is a cleaning station; A rotating ring and a rotating seal are arranged at the bottom of the annular cavity to complete the sealing, and a plurality of through holes are arranged in a circular array on the rotating ring.

3. The die bonding auxiliary device for multi-chip packaging according to claim 2, characterized in that: The cavity unit also includes: An inner gear ring is arranged on the inner wall of the rotating ring; The switching motor is arranged on one side of the annular cavity through a bracket, and a driving gear meshing with the inner gear ring is installed at the output end of the switching motor; The control electric push rod is arranged on the annular cavity and close to the truncation block through a bracket.

4. The die bonding auxiliary device for multi-chip packaging according to claim 3, characterized in that: Each dosing unit includes: A material distribution pipe is connected and arranged at the bottom of the through hole, a piston plate is installed at the bottom of the material distribution pipe, and a plurality of release holes are opened at the bottom of the material distribution pipe near the piston plate to release the glue in the material distribution pipe through the plurality of release holes; A material distribution barrel is sleeved on the outside of the material distribution pipe and is in sliding sealing contact with the piston plate. A sealing cover is detachably installed on the top of the material distribution barrel, and the sealing cover is slidably sleeved on the outside of the material distribution pipe. A material discharge port is connected to the bottom of the material distribution barrel; The material dividing electric push rod is arranged on one side of the rotating ring through a bracket, and the output end of the material dividing electric push rod is transmission connected with one side of the material dividing barrel.

5. The die bonding auxiliary device for multi-chip packaging according to claim 4, characterized in that: Each dosing unit also includes: A plurality of discharge ports are arranged on the piston plate in a circular array; A plurality of plugs are arranged in a circular array at the bottom of the inner wall of the material distribution barrel, and the plurality of plugs are used to complete the bottom sealing of the plurality of discharge ports.

6. The die bonding auxiliary device for multi-chip packaging according to claim 5, characterized in that: Each auxiliary unit includes: A sliding arm is arranged on the rotating ring, and a lifting arm is slidably provided on the sliding arm; The pressing plate is slidably engaged with the sliding arm and fixedly connected to the top of the lifting arm. A return spring is sleeved on the outside of the lifting arm, and the return spring is arranged between the pressing plate and the sliding arm. An auxiliary frame is arranged at one side of the bottom of the lifting arm, and the auxiliary restriction of the chip is completed through the auxiliary frame; The curing unit is hidden and arranged around the bottom of the auxiliary frame.

7. The die bonding auxiliary device for multi-chip packaging according to claim 6, characterized in that: Each auxiliary unit also includes: A clamping frame is arranged below the rotating ring, and the clamping frame cooperates with the auxiliary frame, and the auxiliary frame can be actively cleaned by the clamping frame; Two guiding telescopic rods are arranged between the rotating ring and the pressing frame, and the lifting and lowering guidance of the pressing frame is completed through the two guiding telescopic rods.

8. The die bonding auxiliary device for multi-chip packaging according to claim 7, characterized in that: Each auxiliary unit also includes: Rack No. 1, set on one side of the material distribution barrel; A second rack is arranged on one side of the first rack, and a telescopic member is installed at the bottom of the second rack, and the telescopic member is connected to the pressing frame; The switching gear is rotatably arranged at the bottom of the rotating ring through a bracket, and the switching gear is respectively engaged and connected with the first rack and the second rack.

9. The die bonding auxiliary device for multi-chip packaging according to claim 8, characterized in that: Also includes: Multiple electric rods are correspondingly arranged on the annular cavity, and the auxiliary unit close to the side of the control electric push rod is not provided with an electric rod; Multiple suction nozzles are arranged at the output ends of multiple electric rods. Each suction nozzle is respectively arranged in cooperation with the material distribution unit located in the cleaning area. The active blocking of the material discharge port is completed through the suction nozzle. A flow channel is arranged in each suction nozzle. A recovery pipe is connected and installed on one side of each suction nozzle. The cleaning liquid is received and recovered through the recovery pipe. An arc-shaped boss is arranged on the side of the annular cavity close to the truncation block. An air chamber is arranged on each material distribution unit. A piston is installed in the air chamber in a sliding seal. A roller is installed at the front end of the piston. The roller is in rotational contact with the arc-shaped boss. An expansion air bag is hidden at the bottom of the clamping frame, and the expansion air bag is connected to the air chamber through a pipeline.

10. A core bonding auxiliary method for multi-chip packaging, using a core bonding auxiliary device for multi-chip packaging as claimed in any one of claims 1 to 9, characterized in that: The core bonding auxiliary method specifically comprises the following steps: Step 1: First, assemble the substrate on each packaging station to complete the restriction; Step 2: The material cavity unit is divided into a core sticking station and a cleaning station, and the material cavity unit can be used to complete the cleaning work for the remaining material distribution units; Step 3: The glue liquid can be released by extrusion through the distributing unit, thereby reducing the residual amount of glue liquid in the distributing unit; Step 4: By setting the auxiliary unit, the position of the chip can be actively restricted, and the active switching can be completed following the material distribution unit, so as to complete free and fast switching response according to processing requirements.

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