Visual pre-alignment mechanism for square substrate

Abstract

The invention relates to the field of semiconductors, and particularly discloses a square substrate visual pre-alignment mechanism. By arranging the position adjusting part and the camera shooting part, the square substrate with marks is placed on the wafer bearing column, the clamping assembly is controlled to clamp the square substrate, then the square substrate is pushed through the pushing assembly so that the substrate can be fixed between the clamping assembly and the pushing assembly, the image picture of the square substrate is obtained through the camera shooting part, and the image picture of the square substrate is obtained through the camera shooting part. The direction of the square substrate is judged according to the mark position on the square substrate in the picture, the stability of mechanical positioning and the high precision of optical positioning are combined, the accuracy and reliability of direction positioning of the substrate can be effectively improved, and the method can adapt to the complex semiconductor manufacturing environment and the high-precision process requirement.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductors, and in particular relates to a visual pre-alignment mechanism for a square substrate. Background Art

[0002] In the semiconductor industry, there are semiconductor substrates of different shapes, among which circular substrates and square substrates are the main ones.

[0003] Square substrates are widely used in the semiconductor industry. The advantage of square substrates is that they can utilize chip packaging space more effectively. During the chip packaging process, square substrates can better perform chip layout and wiring to achieve higher packaging density. At the same time, square substrates are also in demand in the manufacturing of some special devices. For example, in the manufacturing of some power devices or sensor chips with regular shapes, square substrates can better meet the geometric shape requirements of chip design. In addition, rectangular substrates are a deformation of square substrates, and their length-to-width ratio may not be 1:1. Rectangular substrates have unique advantages in some specific semiconductor application scenarios.

[0004] The coarse positioning of semiconductor square substrates is an important link in the semiconductor manufacturing process. In semiconductor manufacturing, square substrates need to be accurately placed in processing equipment for subsequent lithography, etching, deposition and other processes. The commonly used methods for coarse positioning of semiconductor square substrates are mainly optical positioning method and fixture positioning method. The optical positioning method uses an optical imaging system to obtain the image of the substrate, and identifies the outline of the square substrate by processing the image. The approximate position of the substrate is estimated based on the position of the edge. The fixture positioning method uses a special fixture to fix the square substrate. The shape and size of the fixture are designed according to the size and shape of the substrate. Mechanical devices with precise position control and positioning accuracy, such as precision fixtures, positioning pins, etc., are used to fix and determine the direction of the semiconductor square substrate. Through close cooperation with the edge or specific position of the substrate, the substrate is ensured to maintain an accurate direction during processing.

[0005] However, although the above-mentioned conventional semiconductor square substrate positioning method can determine the position and direction of the substrate, the processing of the positioning edge or positioning groove will cause mechanical damage to the substrate, affecting its performance and reliability; the accuracy of the positioning edge or positioning groove is limited by the processing technology, and it is difficult to meet extremely high precision requirements, which affects the accuracy of substrate positioning. Summary of the invention

[0006] In order to overcome the deficiencies of the prior art, an object of the present invention is to provide a visual pre-alignment mechanism for a square substrate to solve the problem that the existing alignment and positioning method may cause mechanical damage to the substrate, thereby affecting the performance and reliability of the substrate.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A square substrate visual pre-alignment mechanism, comprising:

[0009] The position adjustment part is used to adjust the placement position of the square substrate, including a first operating platform and a plate-carrying column connected to the first operating platform in a lifting manner, wherein the first operating platform is provided with a clamping component for clamping the square substrate and a pushing component for pushing the square substrate;

[0010] The camera unit is used to photograph the square substrate and identify the position of the square substrate according to the photographed image.

[0011] Preferably, the pushing assembly includes a first cylinder connected to the first operating table, a first mounting block connected to the telescopic end of the first cylinder, and a push plate fixedly mounted on the first mounting block, and the push plate is rotatably connected to a first roller that contacts the square base plate.

[0012] Preferably, the clamping assembly includes a second cylinder connected to the first operating table, a second mounting block connected to the telescopic end of the second cylinder, and a clamp fixedly mounted on the second mounting block, and the clamp is rotatably connected to a second roller and a third roller that contact the square substrate.

[0013] Preferably, the clamping assembly and the pushing assembly are arranged relative to each other.

[0014] Preferably, the camera unit includes a second operating table, a mounting bracket connected to the second operating table, and an industrial camera connected to the mounting bracket for photographing the square substrate.

[0015] Preferably, the mounting bracket is a bracket with three degrees of freedom adjustment in the horizontal, vertical and longitudinal directions.

[0016] A square substrate alignment recognition method is applied to a square substrate visual pre-alignment mechanism, comprising:

[0017] A specific mark is pre-set on the edge or corner of the square substrate, and then the square substrate with the specific mark is placed on the substrate holding column, and the substrate holding column is lowered to move the square substrate to the position to be clamped;

[0018] The extension of the telescopic end of the second cylinder drives the second mounting block and the clamping plate to move, and the moving clamping plate clamps the square substrate through the second roller. The extension of the telescopic end of the first cylinder drives the first mounting block and the push plate to move, and the push plate pushes the square substrate to move through the first roller, so that the square substrate is stably clamped between the first roller, the second roller and the third roller, and the clamping assembly and the pushing assembly are retracted in turn, and the sheet-bearing column drives the square substrate to rise to the original position;

[0019] The position of the industrial camera is adjusted by means of the mounting bracket, an image of the square substrate is acquired by the industrial camera, and the position of the square substrate is then identified according to specific marks on the square substrate in the image.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention arranges a positioning part and a camera part, places a square substrate with a mark on a substrate support column, controls a clamping assembly to clamp the square substrate, and then pushes the square substrate through a pushing assembly, so that the substrate is fixed between the clamping assembly and the pushing assembly, obtains an image of the square substrate through the camera part, and determines the direction of the square substrate according to the position of the mark on the square substrate in the image. The stability of mechanical positioning and the high precision of optical positioning are combined, and the accuracy and reliability of substrate direction positioning can be effectively improved, and the accuracy and reliability of substrate direction positioning can be adapted to complex semiconductor manufacturing environments and high-precision process requirements.

[0022] This method has better accuracy and adaptability in identifying basic directions, and can more accurately identify the direction of the substrate. In the semiconductor manufacturing process, it can effectively reduce product defects caused by incorrect substrate directions. Through accurate direction identification, these problems can be avoided, thereby improving product yield and reducing production costs. In addition, if errors occur in traditional direction identification methods, manual intervention or complex repositioning processes may be required, which will take a lot of time. This method can quickly and accurately determine the direction of the substrate through a combination of real-time optical detection and mechanical positioning, and can make timely adjustments when small deviations occur. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The overall structure of the present invention is shown in FIG. Figure 1 ;

[0024] Figure 2 The overall structure of the present invention is shown in FIG. Figure 2 ;

[0025] Figure 3 For the present invention Figure 2 A magnified image of the middle part;

[0026] Figure 4 The overall structure of the present invention is shown in FIG. Figure 3 ;

[0027] In the figure: 1. first operating table; 2. film-carrying column; 3. first cylinder; 4. first mounting block; 5. push plate; 6. first roller; 7. second cylinder; 8. second mounting block; 9. clamping plate; 10. second roller; 11. third roller; 12. second operating table; 13. mounting bracket; 14. industrial camera. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Embodiment 1:

[0030] See also Figure 1 - Figure 4 As shown, a square substrate visual pre-alignment mechanism comprises:

[0031] The positioning part is used to adjust the placement position of the square substrate, including a first operating platform 1 and a plate-carrying column 2 connected to the first operating platform 1 in a lifting manner, wherein the first operating platform 1 is provided with a clamping component for clamping the square substrate and a pushing component for pushing the square substrate, and the clamping component and the pushing component are arranged relative to each other;

[0032] The camera unit is used to photograph the square substrate and identify the position of the square substrate according to the photographed image.

[0033] As can be seen from the above, by setting the adjustment part and the camera part, the square substrate with the mark is placed on the substrate support column 2, the clamping component is controlled to clamp the square substrate, and then the square substrate is pushed by the pushing component so that the substrate is fixed between the clamping component and the pushing component, and the image of the square substrate is obtained by the camera part, and the direction of the square substrate is judged according to the position of the mark on the square substrate in the picture. The stability of mechanical positioning and the high precision of optical positioning are combined, and the accuracy and reliability of substrate direction positioning can be effectively improved, and it can adapt to the complex semiconductor manufacturing environment and high-precision process requirements. It has better accuracy and adaptability in identifying the basic direction, and can more accurately identify the direction of the substrate. In the semiconductor manufacturing process, it can effectively reduce product defects caused by incorrect substrate direction. Through accurate direction recognition, these problems can be avoided, thereby improving the product yield and reducing production costs. In addition, if the traditional direction recognition method is wrong, it may require manual intervention or a complex repositioning process, which will take a lot of time. The method can quickly and accurately judge the direction of the substrate through the combination of real-time optical detection and mechanical positioning, and can make timely adjustments when small deviations occur.

[0034] Embodiment 2:

[0035] See also Figure 1 - Figure 4 As shown, a square substrate visual pre-alignment mechanism comprises:

[0036] The positioning part is used to adjust the placement position of the square substrate, including a first operating platform 1 and a plate-carrying column 2 connected to the first operating platform 1 in a lifting manner, wherein the first operating platform 1 is provided with a clamping component for clamping the square substrate and a pushing component for pushing the square substrate, and the clamping component and the pushing component are arranged relative to each other;

[0037] The camera unit is used to photograph the square substrate and identify the position of the square substrate according to the photographed image.

[0038] As can be seen from the above, by setting the adjustment part and the camera part, the square substrate with the mark is placed on the substrate support column 2, the clamping component is controlled to clamp the square substrate, and then the square substrate is pushed by the pushing component so that the substrate is fixed between the clamping component and the pushing component, and the image of the square substrate is obtained by the camera part, and the direction of the square substrate is judged according to the position of the mark on the square substrate in the picture. The stability of mechanical positioning and the high precision of optical positioning are combined, and the accuracy and reliability of substrate direction positioning can be effectively improved, and it can adapt to the complex semiconductor manufacturing environment and high-precision process requirements. It has better accuracy and adaptability in identifying the basic direction, and can more accurately identify the direction of the substrate. In the semiconductor manufacturing process, it can effectively reduce product defects caused by incorrect substrate direction. Through accurate direction recognition, these problems can be avoided, thereby improving the product yield and reducing production costs. In addition, if the traditional direction recognition method is wrong, it may require manual intervention or a complex repositioning process, which will take a lot of time. The method can quickly and accurately judge the direction of the substrate through the combination of real-time optical detection and mechanical positioning, and can make timely adjustments when small deviations occur.

[0039] See also Figure 3 - Figure 4 As shown, the pushing assembly includes a first cylinder 3 connected to the first operating table 1, a first mounting block 4 connected to the telescopic end of the first cylinder 3, and a push plate 5 fixedly mounted on the first mounting block 4, and the push plate 5 is rotatably connected to a first roller 6 that contacts the square base plate.

[0040] The telescopic end of the first cylinder 3 can drive the first mounting block 4 and the push plate 5 to move. The moving push plate 5 will press against the square base plate on the sheet-bearing column 2 through the first roller 6 and push the square base plate to move.

[0041] See also Figure 3 - Figure 4 As shown, the clamping assembly includes a second cylinder 7 connected to the first operating table 1, a second mounting block 8 connected to the telescopic end of the second cylinder 7, and a clamping plate 9 fixedly mounted on the second mounting block 8, and the clamping plate 9 is rotatably connected with a second roller 10 and a third roller 11 that contact the square base plate.

[0042] The telescopic end of the second cylinder 7 can drive the second mounting block 8 and the clamping plate 9 to move. After the two relatively movable clamping plates 9 move to both sides of the square substrate, the second roller 10 will clamp the square substrate. When used in conjunction with the pushing assembly, the first roller 6 pushes the square substrate clamped by the second roller 10, so that the square substrate contacts the first roller 6, the second roller 10 and the third roller 11, and the square substrate is firmly clamped by the three rollers.

[0043] See also Figure 1 - Figure 2 As shown, the camera unit includes a second operating table 12, a mounting bracket 13 connected to the second operating table 12, and an industrial camera 14 connected to the mounting bracket 13 for photographing the square substrate. The industrial camera 14 takes pictures of the square substrate at a high altitude and determines the direction and position of the square substrate based on the pictures.

[0044] The mounting bracket 13 is a bracket with three degrees of freedom adjustment in the horizontal, vertical and longitudinal directions, so that users can adjust the position of the industrial camera 14 through the mounting bracket 13 .

[0045] A square substrate alignment recognition method is applied to a square substrate visual pre-alignment mechanism, comprising:

[0046] A specific mark is pre-set on the edge or corner of the square substrate, and then the square substrate with the specific mark is placed on the substrate support column 2, and the substrate support column 2 is lowered to move the square substrate to the position to be clamped;

[0047] The telescopic end of the second cylinder 7 extends to drive the second mounting block 8 and the clamping plate 9 to move. The moving clamping plate 9 clamps the square substrate through the second roller 10. The telescopic end of the first cylinder 3 extends to drive the first mounting block 4 and the push plate 5 to move. The push plate 5 pushes the square substrate to move through the first roller 6, so that the square substrate is stably clamped between the first roller 6, the second roller 10 and the third roller 11. The clamping assembly and the pushing assembly are retracted in turn, and the sheet-bearing column 2 drives the square substrate to rise to the original position;

[0048] The position of the industrial camera 14 is adjusted by the mounting bracket 13 , and an image of the square substrate is obtained by the industrial camera 14 , and then the position of the square substrate is identified according to a specific mark on the square substrate in the image.

[0049] This method can pre-make a variety of specific marks on the edges or corners of the substrate. This diversity enables the method to adapt to different types of substrates and manufacturing process requirements. For example, for some substrates with special coatings or complex structures on the surface, by selecting the appropriate type of mark (such as optical mark), direction identification can be more effectively performed without being interfered by other factors on the substrate surface.

[0050] The standard parts used in the present invention can all be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0051] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0052] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0055] In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

Claims

1. A visual pre-alignment mechanism for a square substrate, characterized in that: include: The positioning part is used to adjust the placement position of the square substrate, comprising a first operating platform (1) and a plate-carrying column (2) connected to the first operating platform (1) in a lifting manner, wherein the first operating platform (1) is provided with a clamping component for clamping the square substrate and a pushing component for pushing the square substrate; The camera unit is used to photograph the square substrate and identify the position of the square substrate according to the photographed image.

2. A square substrate visual pre-alignment mechanism according to claim 1, characterized in that: The pushing assembly comprises a first cylinder (3) connected to the first operating table (1), a first mounting block (4) connected to the telescopic end of the first cylinder (3), and a push plate (5) fixedly mounted on the first mounting block (4), wherein the push plate (5) is rotatably connected to a first roller (6) in contact with a square base plate.

3. A square substrate visual pre-alignment mechanism according to claim 1, characterized in that: The clamping assembly comprises a second cylinder (7) connected to the first operating table (1), a second mounting block (8) connected to the telescopic end of the second cylinder (7), and a clamping plate (9) fixedly mounted on the second mounting block (8), wherein the clamping plate (9) is rotatably connected with a second roller (10) and a third roller (11) in contact with the square base plate.

4. A square substrate visual pre-alignment mechanism according to claim 1, characterized in that: The clamping assembly and the pushing assembly are arranged opposite to each other.

5. The square substrate visual pre-alignment mechanism according to claim 1, characterized in that: The camera unit comprises a second operating table (12), a mounting bracket (13) connected to the second operating table (12), and an industrial camera (14) connected to the mounting bracket (13) for photographing a square substrate.

6. A square substrate visual pre-alignment mechanism according to claim 5, characterized in that: The mounting bracket (13) is a bracket with three degrees of freedom adjustment in the horizontal, vertical and longitudinal directions.

7. A square substrate alignment and recognition method, characterized in that: A square substrate visual pre-alignment mechanism applied to any one of claims 1 to 6, comprising: A specific mark is pre-set on the edge or corner of the square substrate, and then the square substrate with the specific mark is placed on the substrate support column (2), and the substrate support column (2) is lowered to move the square substrate to a position to be clamped; The telescopic end of the second cylinder (7) extends to drive the second mounting block (8) and the clamping plate (9) to move, and the moving clamping plate (9) clamps the square substrate through the second roller (10). The telescopic end of the first cylinder (3) extends to drive the first mounting block (4) and the push plate (5) to move, and the push plate (5) pushes the square substrate to move through the first roller (6), so that the square substrate is stably clamped between the first roller (6), the second roller (10) and the third roller (11), and the clamping assembly and the pushing assembly are retracted in turn, and the sheet-bearing column (2) drives the square substrate to rise to its original position; The position of the industrial camera (14) is adjusted by means of the mounting bracket (13), an image of the square substrate is acquired by means of the industrial camera (14), and the position of the square substrate is then identified based on specific marks on the square substrate in the image.

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