Multi-layer bent heat dissipation structure, manufacturing method thereof and radiator

Abstract

The invention provides a multi-layer bent heat dissipation structure, a manufacturing method thereof and a radiator. The multi-layer bent heat dissipation structure comprises a heat exchange base and a phase change backflow pipe set. An evaporation cavity is formed in the heat exchange base; the phase change backflow pipe set is arranged outside the heat exchange base in a multi-layer bending mode. A liquid refrigerant outlet end of the phase change return pipe group is communicated with the evaporation cavity so as to guide a liquid refrigerant to flow towards the electronic element, the liquid refrigerant absorbs heat of the electronic element through the heat exchange base and is evaporated to form a gaseous refrigerant, and the gaseous refrigerant is low in density and can move to a position higher than the electronic element; the position of a gaseous refrigerant inlet end of the phase change return pipe group is higher than that of a liquid refrigerant outlet end of the phase change return pipe group, and the phase change return pipe group is communicated with the evaporation cavity so as to guide a gaseous refrigerant to enter the phase change return pipe group to be condensed, and the gaseous refrigerant is slower in flowing speed in the bending flowing process and can fill the whole phase change return pipe group; the unit heat exchange efficiency of the gaseous refrigerant and the phase change backflow pipe set is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation of electronic components, and in particular to a multi-layer curved heat dissipation structure and a manufacturing method thereof, and a heat sink. Background Art

[0002] When electronic components such as MOS tubes, chips and IGBTs are in operation, a large amount of heat will accumulate on the surface of the electronic components. The heat accumulation will easily cause the electronic components to overheat and deteriorate in performance. In order to ensure the stable performance of electronic components during operation, some manufacturers will use a heat sink structure such as the one disclosed in Chinese patent document CN216161725U to cool down the electronic components. However, due to the structural design of the above-mentioned heat sink structure, the contact area between the heat exchange fins and the serpentine tube is limited, and the unit heat exchange efficiency of the serpentine tube and the heat exchange fins is low. When the electronic components are operating at high power, heat will still accumulate locally in the electronic components. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a multi-layer curved heat dissipation structure with high unit heat exchange efficiency and a manufacturing method thereof, as well as a heat sink.

[0004] The purpose of this disclosure is achieved through the following technical solutions:

[0005] A multi-layer curved heat dissipation structure, comprising:

[0006] A heat exchange base, wherein an evaporation chamber is formed inside the heat exchange base, and the evaporation chamber is used to accommodate a refrigerant; the outside of the heat exchange base is used to install electronic components; the heat exchange base is used to conduct heat energy of the electronic components to the refrigerant, so that the liquid refrigerant evaporates to form a gaseous refrigerant;

[0007] The multi-layer curved heat dissipation structure also includes a phase change return pipe group;

[0008] The phase change return pipe group is arranged in a multi-layer bent state on the outside of the heat exchange base, and the phase change return pipe group is used to condense the gaseous refrigerant to form liquid refrigerant; the liquid refrigerant outlet of the phase change return pipe group is connected to the evaporation chamber to guide the liquid refrigerant to flow toward the electronic component; the position of the gaseous refrigerant inlet of the phase change return pipe group is higher than the position of the liquid refrigerant outlet of the phase change return pipe group, and is connected to the evaporation chamber to guide the gaseous refrigerant to enter the phase change return pipe group for condensation.

[0009] In some of the embodiments, the phase change reflux pipe group extends in a serpentine shape in the direction of gravity, and the gas refrigerant inlet end is arranged away from the electronic component.

[0010] In some embodiments, the phase change reflux tube group is arranged in a serpentine shape in the same vertical plane.

[0011] In some embodiments, the phase change reflux pipe group includes a refrigerant liquid outlet pipe, a serpentine condensation elbow and a refrigerant gas inlet pipe which are connected in sequence; the refrigerant liquid outlet pipe and the refrigerant gas inlet pipe are both installed on the outside of the heat exchange base, the refrigerant liquid outlet pipe is connected to a position in the evaporation chamber close to the electronic component, and the refrigerant gas inlet pipe is connected to a position in the evaporation chamber higher than the electronic component.

[0012] In some embodiments, the first end of the serpentine condensation bend is fixedly connected to the refrigerant liquid outlet pipe, and the second end of the serpentine condensation bend is fixedly connected to the refrigerant gas inlet pipe; a ventilation gap is formed between the serpentine condensation bend and the heat exchange base.

[0013] In some embodiments, the multi-layer curved heat dissipation structure also includes a fan unit, which is located on the side of the serpentine condensation bend tube away from the heat exchange base; adjacent tube walls in the serpentine condensation bend tube form a heat dissipation air duct, and each of the heat dissipation air ducts is respectively connected to the ventilation gap; the air outlet of the fan unit is arranged toward the heat dissipation air duct.

[0014] In some of the embodiments, the serpentine condensation elbow is a flat elbow, and the width direction of the serpentine condensation elbow is consistent with the air outlet direction of the fan unit.

[0015] In some embodiments, the phase change reflux pipe group further includes a supporting bottom pipe, which is fixedly arranged on the outside of the heat exchange base; the supporting bottom pipe is located at the same horizontal height as the refrigerant liquid outlet pipe, and is fixedly connected to the position of the serpentine condensation elbow away from the refrigerant liquid outlet pipe; the serpentine condensation elbow is connected to the evaporation chamber through the supporting bottom pipe; and / or,

[0016] The phase change reflux pipe group also includes a supporting top pipe, which is fixedly arranged on the outside of the heat exchange base; the supporting top pipe is located at the same horizontal height as the refrigerant gas inlet pipe, and is fixedly connected to the position of the serpentine condensation elbow away from the refrigerant gas inlet pipe; the evaporation chamber is connected to the serpentine condensation elbow through the supporting top pipe.

[0017] A method for manufacturing a multi-layer curved heat dissipation structure, which is applied to manufacturing the multi-layer curved heat dissipation structure of any of the above embodiments, comprises:

[0018] Obtain a heat-conducting plate group and a heat-conducting pipe group;

[0019] The heat-conducting plate group is subjected to evaporation chamber milling and then assembled to obtain a heat exchange base;

[0020] The heat-conducting pipe group is subjected to milling, pinning, bending and then assembly operations to obtain a phase change reflux pipe group;

[0021] Assembling and brazing the heat exchange base and the phase change reflux tube group, so that the evaporation chamber of the heat exchange base is connected to the phase change reflux tube group to form an evaporation condensation loop;

[0022] The evaporation-condensation circuit is sealed after vacuum injection of refrigerant to obtain the multi-layer curved heat dissipation structure.

[0023] A heat sink comprises the multi-layer curved heat dissipation structure of any one of the above embodiments.

[0024] Compared with the prior art, the present invention has at least the following advantages:

[0025] The above-mentioned multi-layer curved heat dissipation structure, since the liquid refrigerant outlet of the phase change return pipe group is connected to the evaporation chamber, the phase change return pipe group can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation chamber, and the liquid refrigerant absorbs the heat of the electronic components through the heat exchange base to evaporate to form a gaseous refrigerant. The gaseous refrigerant has a small density and will move to a higher position. In addition, since the phase change return pipe group is arranged outside the heat exchange base in a multi-layer curved manner, the position of the gaseous refrigerant inlet end of the phase change return pipe group is higher than the position of the liquid refrigerant outlet end of the phase change return pipe group, so that the gaseous refrigerant can enter the phase change return pipe group and flow along the curved path under the action of gravity. The gaseous refrigerant has a slower flow rate during the curved flow and can be filled in the entire phase change return pipe group, so as to increase the contact area between the gaseous refrigerant and the phase change return pipe group and improve the unit heat exchange efficiency of the above-mentioned multi-layer curved heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 A cross-sectional structural diagram of a multi-layer curved heat dissipation structure according to an embodiment of the present disclosure;

[0028] Figure 2 for Figure 1 A front cross-sectional view of the multi-layer curved heat dissipation structure in working state;

[0029] Figure 3 It is a structural schematic diagram of a multi-layer curved heat dissipation structure according to another embodiment of the present disclosure;

[0030] Figure 4 A vertical cross-sectional view of a multi-layer curved heat dissipation structure according to another embodiment of the present disclosure;

[0031] Figure 5 for Figure 4 A transverse cross-sectional view of the multi-layer curved heat dissipation structure shown;

[0032] Figure 6 The figure is a flow chart of a method for manufacturing a multi-layer curved heat dissipation structure according to another embodiment of the present disclosure.

[0033] Reference numerals:

[0034] 10. Electronic components;

[0035] 100, heat exchange base; 110, aluminum bottom plate; 120, aluminum cover plate; 101, evaporation chamber;

[0036] 200, phase change reflux pipe group; 210, refrigerant liquid outlet pipe; 220, serpentine condensation elbow pipe; 221, refrigerant gas cavity; 222, refrigerant liquid cavity; 223, layer barrier structure; 2231, capillary flow channel; 224, spherical heat exchange bubble cavity; 2201, ventilation gap; 2202, heat dissipation air duct; 230, refrigerant gas inlet pipe;

[0037] 300, fan unit; 400, supporting bottom pipe; 500, supporting top pipe. DETAILED DESCRIPTION

[0038] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0039] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0041] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0042] See also Figure 1 The multi-layer curved heat dissipation structure of an embodiment includes a heat exchange base 100 and a phase change return pipe group 200; the interior of the heat exchange base 100 forms an evaporation chamber 101, and the evaporation chamber 101 is used to accommodate the refrigerant; the exterior of the heat exchange base 100 is used to install the electronic component 10; the heat exchange base 100 is used to conduct the heat energy of the electronic component 10 to the refrigerant, so that the liquid refrigerant evaporates to form a gaseous refrigerant; the phase change return pipe group 200 is arranged on the heat exchange base 100 in a multi-layer curved manner 00, the phase change return pipe group 200 is used to condense the gaseous refrigerant to form a liquid refrigerant; the liquid refrigerant outlet of the phase change return pipe group 200 is connected to the evaporation chamber 101 to guide the liquid refrigerant to flow toward the electronic component 10; the gaseous refrigerant inlet of the phase change return pipe group 200 is higher than the liquid refrigerant outlet of the phase change return pipe group 200, and is connected to the evaporation chamber 101 to guide the gaseous refrigerant into the phase change return pipe group 200 for condensation. In this embodiment, the refrigerant can be a common refrigerant such as tetrafluoroethane, which is not limited here.

[0043] It can be understood that since the liquid refrigerant outlet of the phase change reflux pipe group 200 is connected to the evaporation chamber 101, the phase change reflux pipe group 200 can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation chamber 101. The liquid refrigerant absorbs the heat of the electronic component 10 through the heat exchange base 100 and evaporates to form a gaseous refrigerant. The gaseous refrigerant has a small density and will move to a higher position. Furthermore, since the phase change return pipe group 200 is arranged in a multi-layer curved manner on the outside of the heat exchange base 100, the position of the gas refrigerant inlet end of the phase change return pipe group 200 is higher than the position of the liquid refrigerant outlet end of the phase change return pipe group 200, so that the gaseous refrigerant can enter the phase change return pipe group 200 and flow along the curved path under the action of gravity. The flow velocity of the gaseous refrigerant is slower during the curved flow process and can be filled in the entire phase change return pipe group 200, so as to increase the contact area between the gaseous refrigerant and the phase change return pipe group 200 and improve the unit heat exchange efficiency of the above-mentioned multi-layer curved heat dissipation structure.

[0044] See also Figure 2In some embodiments, the phase change return pipe group 200 is bent and extended in a serpentine shape in the direction of gravity, and the gaseous refrigerant inlet end is arranged far away from the electronic component 10. It can be understood that since the gaseous refrigerant has a small density, it is easier to move to a position far away from and higher than the electronic component 10, so that the gaseous refrigerant inlet end arranged far away from the electronic component 10 can be connected to a gaseous refrigerant with a higher concentration, and the phase change return pipe group 200 is bent and extended in a serpentine shape in the direction of gravity. After the gaseous refrigerant enters the phase change return pipe group 200, the gaseous refrigerant exchanges heat with the phase change return pipe group 200 and gradually condenses to form liquid refrigerant. The liquid refrigerant can flow along the serpentine path under the action of gravity, which can provide power to the liquid refrigerant far away from the electronic component 10 and return to the evaporation chamber 101 more smoothly, thereby reducing the retention of liquid refrigerant at the bending position in the phase change return pipe group 200.

[0045] See also Figure 2 In some embodiments, the phase change return pipe group 200 is arranged in a serpentine bending in the same vertical plane. It can be understood that since the phase change return pipe group 200 is arranged in a serpentine bending in the same vertical plane, the gaseous refrigerant and the liquid refrigerant can flow smoothly along the gravity direction in the vertical plane where the phase change return pipe group 200 is located, thereby simplifying the extension path of the phase change return pipe group 200 so that more refrigerant can flow back to the evaporation chamber 101 for reuse, and finally improving the circulation efficiency of the refrigerant in the entire multi-layer curved heat dissipation structure.

[0046] Please also read Figure 1 and Figure 2 In some embodiments, the phase change reflux pipe group 200 includes a refrigerant liquid outlet pipe 210, a serpentine condensation elbow 220 and a refrigerant gas inlet pipe 230 which are connected in sequence; the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 are both installed on the outside of the heat exchange base 100, the refrigerant liquid outlet pipe 210 is connected to a position in the evaporation chamber 101 close to the electronic component 10, and the refrigerant gas inlet pipe 230 is connected to a position in the evaporation chamber 101 higher than the electronic component 10. It can be understood that, since the refrigerant liquid outlet pipe 210, the serpentine condensation elbow pipe 220 and the refrigerant gas inlet pipe 230 are connected in sequence, and the refrigerant liquid outlet pipe 210 is connected to the position close to the electronic component 10 in the evaporation chamber 101, the liquid refrigerant can be guided to the electronic component 10 through the refrigerant liquid outlet pipe 210 so that the liquid refrigerant and the electronic component 10 can fully exchange heat, and since the refrigerant gas inlet pipe 230 is connected to a position higher than the electronic component 10 in the evaporation chamber 101, the gaseous refrigerant gathered at a high position in the evaporation chamber 101 can be introduced into the serpentine condensation elbow pipe 220 for condensation through the refrigerant gas inlet pipe 230. The serpentine condensation elbow pipe 220 can condense the gaseous refrigerant into liquid refrigerant, and redirect the liquid refrigerant to the evaporation chamber 101 for reuse.

[0047] See also Figure 3In some embodiments, the first end of the serpentine condensation bend 220 is fixedly connected to the refrigerant liquid outlet pipe 210, and the second end of the serpentine condensation bend 220 is fixedly connected to the refrigerant gas inlet pipe 230; a ventilation gap 2201 is formed between the serpentine condensation bend 220 and the heat exchange base 100. It can be understood that since the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 are both installed on the outside of the heat exchange base 100, the first end of the serpentine condensation bend 220 is fixedly connected to the refrigerant liquid outlet pipe 210, and the second end of the serpentine condensation bend 220 is fixedly connected to the refrigerant gas inlet pipe 230, so that the serpentine condensation bend 220 can be supported by the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230, so that the serpentine condensation bend 220 and the heat exchange base 100 are tightly connected together and form a ventilation gap 2201, and the ventilation gap 2201 can not only reduce the heat conduction between the serpentine condensation bend 220 and the heat exchange base 100, but also accelerate the heat dissipation of the serpentine condensation bend 220 itself.

[0048] Please also read Figure 3 and Figure 4 In some embodiments, the multi-layer curved heat dissipation structure further includes a fan unit 300, which is located on the side of the serpentine condensation elbow 220 away from the heat exchange base 100; the adjacent tube walls in the serpentine condensation elbow 220 form a heat dissipation duct 2202, and each heat dissipation duct 2202 is respectively connected to the ventilation gap 2201; the air outlet of the fan unit 300 is arranged toward the heat dissipation duct 2202. It can be understood that since each heat dissipation duct 2202 formed between the adjacent tube walls in the serpentine condensation elbow 220 is respectively connected to the ventilation gap 2201, by setting the air outlet of the fan unit 300 toward the heat dissipation duct 2202, the wind blown out by the air outlet of the fan unit 300 can blow the heat dissipated from the serpentine condensation elbow 220 to the ventilation gap 2201 for discharge, thereby further improving the condensation effect of the serpentine condensation elbow 220. In this embodiment, the fan unit 300 is a plurality of cooling fans arranged side by side, and thus will not be described in detail herein.

[0049] Please also read Figure 3 and Figure 4 In some embodiments, the serpentine condensation elbow 220 is a flat elbow, and the width direction of the serpentine condensation elbow 220 is consistent with the air outlet direction of the fan unit 300. It can be understood that since the serpentine condensation elbow 220 is a flat elbow, after the gaseous refrigerant enters the serpentine condensation elbow 220, the gaseous refrigerant can have more contact area with the serpentine condensation elbow 220 to improve the heat exchange efficiency. At the same time, since the width direction of the serpentine condensation elbow 220 is consistent with the air outlet direction of the fan unit 300, the wind blown out by the fan unit 300 can take away the heat emitted from the pipe wall of the serpentine condensation elbow 220 along the width direction of the serpentine condensation elbow 220, so as to improve the heat dissipation efficiency.

[0050] Usually, due to the differences in the distribution positions of the gaseous refrigerant entering the serpentine condenser bend 220, the heat dissipation efficiency of the gaseous refrigerant at different positions is different, which leads to the coexistence of gaseous refrigerant and liquid refrigerant in the same section of the serpentine condenser bend 220. The gaseous refrigerant and the liquid refrigerant are easily mixed together and heat exchange occurs, which affects the overall heat exchange efficiency of the serpentine condenser bend 220 for the gaseous refrigerant.

[0051] In order to reduce the heat exchange between gaseous refrigerant and liquid refrigerant, please refer to Figure 4 In some embodiments, the serpentine condensation elbow 220 is tilted downward from the side close to the fan unit 300 to the side close to the heat exchange base 100 along the width direction, and the air supply direction of the heat dissipation duct 2202 is set toward the direction of the electronic component 10. It can be understood that since the serpentine condenser bend 220 is tilted downward from the side close to the fan unit 300 to the side close to the heat exchange base 100 along the width direction, the side of the serpentine condenser bend 220 close to the fan unit 300 in the horizontal direction is higher than the side of the serpentine condenser bend 220 close to the heat exchange base 100. After the gaseous refrigerant in the same section of the serpentine condenser bend 220 condenses to form liquid refrigerant, the liquid refrigerant will flow toward the heat exchange base 100 along the width direction of the serpentine condenser bend 220 under the action of gravity. The gaseous refrigerant will be enriched in the same section of the serpentine condenser bend 220 on the side close to the fan unit 300 due to its lighter density so as to be better cooled by the wind blown by the fan unit 300, thereby separating the gaseous refrigerant and the liquid refrigerant in the same section of the serpentine condenser bend 220, thereby reducing the mixed heat exchange of the gaseous refrigerant and the liquid refrigerant. At the same time, since the air supply direction of the heat dissipation duct 2202 is set toward the direction of the electronic component 10, the air supply direction of the heat dissipation duct 2202 forms an inclined angle with the plane where the heat exchange base 100 is located. In this way, the wind flowing along the heat dissipation duct 2202 will be hindered by the heat exchange base 100 and discharged more toward the direction close to the electronic component 10, thereby further improving the heat dissipation effect on the electronic component 10.

[0052] Further, in order to improve the cooling effect of the fan unit 300 on the gaseous refrigerant, please refer to Figure 4 In some embodiments, a spherical heat exchange bubble cavity 224 is formed inside the serpentine condensation elbow 220 at one end close to the fan unit 300. It can be understood that since the spherical heat exchange bubble cavity 224 is located inside the serpentine condensation elbow 220 at one end close to the fan unit 300, the gaseous refrigerant will be more enriched in the spherical heat exchange bubble cavity 224, that is, the wind blown by the fan unit 300 can act more on the gaseous refrigerant, thereby improving the condensation effect of the serpentine condensation elbow 220 on the gaseous refrigerant.

[0053] Usually, since the flow rate of the gaseous refrigerant in the serpentine condensation elbow 220 is often greater than the flow rate of the liquid refrigerant, the uncondensed gaseous refrigerant is likely to enter the evaporation chamber 101 close to the electronic component 10 before the condensed liquid refrigerant, causing bubbles to be generated in the evaporation chamber 101 close to the electronic component 10. The bubbles occupy the contact area between the liquid refrigerant and the electronic component 10, thereby reducing the heat exchange efficiency of the electronic component 10.

[0054] In order to reduce the influence of bubbles on the heat transfer efficiency of the electronic component 10, please refer to Figure 4 and Figure 5 In some embodiments, a refrigerant gas cavity 221 and a refrigerant liquid cavity 222 are sequentially arranged in the width direction of the serpentine condensation bend 220; the refrigerant gas cavity 221 is arranged close to the fan unit 300, and the refrigerant liquid cavity 222 is arranged close to the heat exchange base 100; a plurality of capillary channels 2231 are formed on the inner bottom side wall of the serpentine condensation bend 220; the plurality of capillary channels 2231 are arranged along the length direction of the serpentine condensation bend 220, and together form a layer blocking structure 223; the layer blocking structure 223 gradually inclines from the refrigerant liquid cavity 222 to the refrigerant gas cavity 221, and the first end of each capillary channel 2231 is connected to the refrigerant liquid cavity 222; the second end of each capillary channel 2231 extends along the width direction of the serpentine condensation bend 220, and is connected to the refrigerant gas cavity 221, so as to block and guide the gaseous refrigerant in the refrigerant gas cavity 221. It can be understood that because the layer blocking structure 223 composed of a plurality of capillary channels 2231 gradually inclines from the refrigerant liquid cavity 222 to the refrigerant gas cavity 221, that is, the width of the refrigerant liquid cavity 222 gradually increases and the width of the refrigerant gas cavity 221 gradually decreases along the refrigerant reflux direction, the layer blocking structure 223 can form an obstruction in the process of the gaseous refrigerant flowing toward the refrigerant liquid outlet pipe 210 to reduce the flow rate of the gaseous refrigerant, and the gaseous refrigerant is obstructed and intercepted and condensed into liquid refrigerant. Since the second end of each capillary channel 2231 extends along the width direction of the serpentine condensation elbow 220 and is connected to the refrigerant gas cavity 221, the second end of each capillary channel 2231 can drain the formed liquid refrigerant to the refrigerant liquid cavity 222 through capillary action to accelerate the convergence and flow rate of the liquid refrigerant, and finally reduce the difference in flow rate between the gaseous refrigerant and the liquid refrigerant, and reduce the uncondensed gaseous refrigerant entering the evaporation cavity 101 close to the electronic component 10. Specifically, the capillary channel 2231 is a capillary microchannel, and the channel equivalent diameter thereof is between 10 μm and 1000 μm.

[0055] Furthermore, in order to further reduce the flow rate of the gaseous refrigerant and increase the flow rate of the liquid refrigerant, please refer to Figure 4 and Figure 5In some embodiments, the second end of the capillary flow channel 2231 extends a plurality of condensing hairs (not shown) into the refrigerant gas cavity 221, and a capillary guide groove (not shown) is provided in the refrigerant liquid cavity 222 away from the first end of the capillary flow channel 2231, and the capillary guide groove extends from the refrigerant gas inlet pipe 230 to the refrigerant liquid outlet pipe 210. It can be understood that since the second end of the capillary flow channel 2231 extends a plurality of condensing hairs into the refrigerant gas cavity 221, the condensing hairs can hinder and capture the gaseous refrigerant in the refrigerant gas cavity 221, so as to further reduce the flow rate of the gaseous refrigerant and accelerate the condensation of the gaseous refrigerant. At the same time, since the capillary guide groove is provided in the refrigerant liquid cavity 222 away from the first end of the capillary flow channel 2231, the capillary action of the capillary guide groove can further accelerate the movement of the liquid refrigerant from the refrigerant gas inlet pipe 230 to the refrigerant liquid outlet pipe 210. In this embodiment, the capillary guide grooves are grooves with a diameter of 10 μm to 1000 μm, and the gas condensing hairs are metal micro hairs.

[0056] See also Figure 2 In some embodiments, the phase change return pipe group 200 further includes a supporting bottom pipe 400, which is fixedly arranged outside the heat exchange base 100; the supporting bottom pipe 400 is located at the same level as the refrigerant liquid outlet pipe 210, and is fixedly connected to the position of the serpentine condensation elbow 220 away from the refrigerant liquid outlet pipe 210; the serpentine condensation elbow 220 is connected to the evaporation chamber 101 through the supporting bottom pipe 400. It can be understood that since the refrigerant liquid outlet pipe 210 is fixedly connected to the first end of the serpentine condensation elbow 220, the supporting bottom pipe 400 is fixedly connected to the position of the serpentine condensation elbow 220 away from the refrigerant liquid outlet pipe 210, and the supporting bottom pipe 400 is located at the same level as the refrigerant liquid outlet pipe 210, the phase change return pipe group 200 can be carried by the refrigerant liquid outlet pipe 210 and the supporting bottom pipe 400. At the same time, since the serpentine condensation elbow 220 is connected to the evaporation chamber 101 through the supporting bottom tube 400, the liquid refrigerant can be guided to the vicinity of the electronic component 10 through the supporting bottom tube 400 for heat exchange.

[0057] Please also read Figure 2 and Figure 3In some embodiments, the phase change return pipe group 200 further includes a supporting top pipe 500, which is fixedly arranged outside the heat exchange base 100; the supporting top pipe 500 is located at the same level as the refrigerant gas inlet pipe 230, and is fixedly connected to the position of the serpentine condensation elbow 220 away from the refrigerant gas inlet pipe 230; the evaporation chamber 101 is connected to the serpentine condensation elbow 220 through the supporting top pipe 500. It can be understood that since the refrigerant gas inlet pipe 230 is fixedly connected to the second end of the serpentine condensation elbow 220, the supporting top pipe 500 is fixedly connected to the position of the serpentine condensation elbow 220 away from the refrigerant gas inlet pipe 230, and the supporting top pipe 500 is located at the same level as the refrigerant gas inlet pipe 230, the phase change return pipe group 200 can be supported by the refrigerant gas inlet pipe 230 and the supporting top pipe 500. At the same time, since the evaporation chamber 101 is connected to the serpentine condensation elbow 220 through the supporting top pipe 500, the gaseous refrigerant can be introduced into the phase change reflux pipe group 200 through the supporting top pipe 500 for condensation.

[0058] See also Figure 6 The present disclosure also provides a method for manufacturing a multi-layer curved heat dissipation structure, which is applied to manufacturing the multi-layer curved heat dissipation structure of any of the above embodiments, and includes part or all of the following steps:

[0059] Obtain a heat-conducting plate group and a heat-conducting pipe group;

[0060] See also Figure 1 In this embodiment, the heat conductive plate group includes an aluminum bottom plate 110 and an aluminum cover plate 120 , and the heat conductive pipe group is copper pipes, and the heat conductive pipe group includes a refrigerant liquid outlet pipe 210 , a condensation main pipe and a refrigerant gas inlet pipe 230 .

[0061] The heat-conducting plate group is subjected to evaporation chamber milling and then assembled to obtain a heat exchange base 100;

[0062] See also Figure 1 In this embodiment, the assembly operation after milling the evaporation chamber includes: using a CNC machine tool to perform a milling operation on the aluminum base plate 110 to form an evaporation groove on the aluminum base plate 110; using a CNC machine tool to perform a milling operation on the aluminum cover plate 120 to match the aluminum base plate 110 with the aluminum cover plate 120; degreasing the aluminum base plate 110 and the aluminum cover plate 120 after milling to remove the residues of cutting fluid and lubricating oil applied to the aluminum base plate 110 and the aluminum cover plate 120 before milling, so as to reduce subsequent welding defects caused by the residues, such as uneven coating, bubbling or falling off; assembling the aluminum cover plate 120 on the aluminum base plate 110, so that the evaporation groove is closed to form the evaporation chamber 101, and the heat exchange base 100 is obtained.

[0063] The heat-conducting pipe group is milled, bent and assembled to obtain a phase change reflux pipe group 200;

[0064] See also Figure 2 In this embodiment, the assembly operation after milling and bending includes: using a CNC machine tool to perform milling operations on the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230, so that the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 are matched with the heat exchange base 100; degreasing operations are performed on the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 after milling, so as to remove the cutting fluid and lubricating oil residues coated on the refrigerant liquid outlet pipe 210 and the refrigerant gas inlet pipe 230 before milling. To reduce subsequent welding defects caused by residues, such as uneven coating, bubbling or falling off; after bending the main condenser pipe in a serpentine shape, the main condenser pipe is rolled to obtain a flat bent pipe. The flat bent pipe has a larger contact area with the refrigerant and can improve the unit heat exchange efficiency; wherein, the flat bent pipe is the serpentine condenser bent pipe 220; assemble the refrigerant liquid outlet pipe 210, the serpentine condenser bent pipe 220 and the refrigerant gas inlet pipe 230 to obtain a phase change reflux pipe group 200.

[0065] The heat exchange base 100 and the phase change return pipe group 200 are assembled and brazed to connect the evaporation chamber 101 of the heat exchange base 100 to the phase change return pipe group 200 to form an evaporation condensation loop;

[0066] In this embodiment, the post-assembly brazing operation includes: assembling the heat exchange base 100 and the phase change return tube group 200 so that the evaporation chamber 101 is connected to the phase change return tube group 200 to form an evaporation-condensation loop; brazing the heat exchange base 100 and the phase change return tube group 200 as a whole so that the heat exchange base 100 and the phase change return tube group 200 are connected as a whole.

[0067] The evaporation condensation circuit is sealed after vacuum injection of refrigerant to obtain a multi-layer curved heat dissipation structure.

[0068] In this embodiment, the sealing operation after vacuum injection of refrigerant includes: evacuating the evaporative condensing circuit to form a negative pressure environment in the evaporative condensing circuit. The boiling point of the refrigerant is lower in the negative pressure environment and it is easier to evaporate and circulate at low temperature. For example, the refrigerant evaporates at 35°C to 40°C for internal circulation; slowly injecting the refrigerant through the low-pressure side of the evaporative condensing circuit. When the evaporative condensing circuit is in a negative pressure state, the air and moisture in the evaporative condensing circuit will be emptied to maintain the vacuum degree, which is not only convenient for the injection of the refrigerant, but also can effectively ensure the normal operation of the refrigerant phase change cycle; sealing the evaporative condensing circuit to obtain a multi-layer curved heat dissipation structure. By sealing the connecting position of the heat exchange base 100 and the phase change reflux pipe group 200, the air tightness of the evaporative condensing circuit can be improved, and the vacuum degree of the evaporative condensing circuit is stabilized, thereby ultimately extending the service life of the multi-layer curved heat dissipation structure.

[0069] It can be understood that the evaporation chamber 101 can be formed in the heat exchange base 100 by milling and bending the heat conductive tube group and then assembling it, and the components in the heat conductive tube group can be adapted and interconnected to form a phase change return tube group 200 with a serpentine bend. Then, by assembling and brazing the heat exchange base 100 and the phase change return tube group 200, the heat exchange base 100 and the phase change return tube group 200 can be tightly connected, so that the evaporation chamber 101 is connected to the phase change return tube group 200 to form an evaporation condensation circuit. Finally, the evaporation condensation circuit is sealed by vacuum injection of refrigerant, which can not only maintain the vacuum degree of the evaporation condensation circuit stable, but also reduce the boiling point of the refrigerant to improve the evaporation cycle heat exchange efficiency. In this way, the multi-layer curved heat dissipation structure made by the multi-layer curved heat dissipation structure manufacturing method can have a higher unit heat exchange efficiency, so as to reduce the local heat accumulation of the electronic component 10.

[0070] Please combine Figure 1 As shown, the present disclosure further provides a heat sink, including the multi-layer curved heat dissipation structure of any of the above-mentioned embodiments. It can be understood that by applying the multi-layer curved heat dissipation structure of the present disclosure to the heat sink, since the liquid refrigerant outlet of the phase change return pipe group 200 is connected to the evaporation chamber 101, the phase change return pipe group 200 can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation chamber 101, and the liquid refrigerant absorbs the heat of the electronic component 10 through the heat exchange base 100 and evaporates to form a gaseous refrigerant, and the gaseous refrigerant has a small density and moves to a higher position. Furthermore, since the phase change return pipe group 200 is arranged in a multi-layer curved manner on the outside of the heat exchange base 100, the position of the gas refrigerant inlet end of the phase change return pipe group 200 is higher than the position of the liquid refrigerant outlet end of the phase change return pipe group 200, so that the gaseous refrigerant can enter the phase change return pipe group 200 and flow along the curved path under the action of gravity. The flow velocity of the gaseous refrigerant is slower during the curved flow process and can be filled in the entire phase change return pipe group 200, so as to increase the contact area between the gaseous refrigerant and the phase change return pipe group 200 and improve the unit heat exchange efficiency of the above-mentioned multi-layer curved heat dissipation structure.

[0071] Compared with the prior art, the present invention has at least the following advantages:

[0072] The above-mentioned multi-layer curved heat dissipation structure, since the liquid refrigerant outlet end of the phase change return pipe group 200 is connected to the evaporation chamber 101, the phase change return pipe group 200 can guide the liquid refrigerant obtained by condensing the gaseous refrigerant into the evaporation chamber 101. The liquid refrigerant absorbs the heat of the electronic component 10 through the heat exchange base 100 and evaporates to form a gaseous refrigerant. The gaseous refrigerant has a small density and will move to a higher position. Furthermore, since the phase change return pipe group 200 is arranged in a multi-layer curved manner on the outside of the heat exchange base 100, the position of the gas refrigerant inlet end of the phase change return pipe group 200 is higher than the position of the liquid refrigerant outlet end of the phase change return pipe group 200, so that the gaseous refrigerant can enter the phase change return pipe group 200 and flow along the curved path under the action of gravity. The flow velocity of the gaseous refrigerant is slower during the curved flow process and can be filled in the entire phase change return pipe group 200, so as to increase the contact area between the gaseous refrigerant and the phase change return pipe group 200 and improve the unit heat exchange efficiency of the above-mentioned multi-layer curved heat dissipation structure.

[0073] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be subject to the attached claims.

Claims

1. A multi-layer curved heat dissipation structure, comprising: A heat exchange base, wherein an evaporation chamber is formed inside the heat exchange base, and the evaporation chamber is used to accommodate a refrigerant; The exterior of the heat exchange base is used to install electronic components; the heat exchange base is used to conduct the heat energy of the electronic components to the refrigerant, so that the liquid refrigerant evaporates to form a gaseous refrigerant; Characterized in that the multi-layer curved heat dissipation structure further comprises a phase change return pipe group; The phase change return pipe group is arranged in a multi-layer bent state on the outside of the heat exchange base, and the phase change return pipe group is used to condense the gaseous refrigerant to form liquid refrigerant; the liquid refrigerant outlet of the phase change return pipe group is connected to the evaporation chamber to guide the liquid refrigerant to flow toward the electronic component; the position of the gaseous refrigerant inlet of the phase change return pipe group is higher than the position of the liquid refrigerant outlet of the phase change return pipe group, and is connected to the evaporation chamber to guide the gaseous refrigerant to enter the phase change return pipe group for condensation.

2. The multi-layer curved heat dissipation structure according to claim 1, characterized in that: The phase change reflux pipe group extends in a serpentine shape in the direction of gravity, and the gaseous refrigerant inlet end is arranged away from the electronic component.

3. The multi-layer curved heat dissipation structure according to claim 1, characterized in that: The phase change reflux pipe group is arranged in a serpentine shape in the same vertical plane.

4. The multi-layer curved heat dissipation structure according to claim 1, characterized in that: The phase change reflux pipe group includes a refrigerant liquid outlet pipe, a serpentine condensation elbow and a refrigerant gas inlet pipe which are connected in sequence; the refrigerant liquid outlet pipe and the refrigerant gas inlet pipe are both installed on the outside of the heat exchange base, the refrigerant liquid outlet pipe is connected to a position in the evaporation chamber close to the electronic component, and the refrigerant gas inlet pipe is connected to a position in the evaporation chamber higher than the electronic component.

5. The multi-layer curved heat dissipation structure according to claim 4, characterized in that: The first end of the serpentine condensation elbow is fixedly connected to the refrigerant liquid outlet pipe, and the second end of the serpentine condensation elbow is fixedly connected to the refrigerant gas inlet pipe; a ventilation gap is formed between the serpentine condensation elbow and the heat exchange base.

6. The multi-layer curved heat dissipation structure according to claim 5, characterized in that: The multi-layer curved heat dissipation structure also includes a fan unit, which is located on the side of the serpentine condensation bend away from the heat exchange base; adjacent tube walls in the serpentine condensation bend form a heat dissipation duct, and each of the heat dissipation ducts is connected to the ventilation gap respectively; the air outlet of the fan unit is arranged toward the heat dissipation duct.

7. The multi-layer curved heat dissipation structure according to claim 6, characterized in that: The serpentine condensation elbow is a flat elbow, and the width direction of the serpentine condensation elbow is consistent with the air outlet direction of the fan unit.

8. The multi-layer curved heat dissipation structure according to claim 5, characterized in that: The phase change reflux pipe group further includes a supporting bottom pipe, which is fixedly arranged on the outside of the heat exchange base; the supporting bottom pipe is located at the same horizontal height as the refrigerant liquid outlet pipe, and is fixedly connected to the position of the serpentine condensation elbow away from the refrigerant liquid outlet pipe; the serpentine condensation elbow is connected to the evaporation chamber through the supporting bottom pipe; and / or, The phase change reflux pipe group also includes a supporting top pipe, which is fixedly arranged on the outside of the heat exchange base; the supporting top pipe is located at the same horizontal height as the refrigerant gas inlet pipe, and is fixedly connected to the position of the serpentine condensation elbow away from the refrigerant gas inlet pipe; the evaporation chamber is connected to the serpentine condensation elbow through the supporting top pipe.

9. A method for manufacturing a multi-layer curved heat dissipation structure, applied to manufacturing the multi-layer curved heat dissipation structure according to any one of claims 1 to 8, characterized in that: include: Obtain a heat-conducting plate group and a heat-conducting pipe group; The heat-conducting plate group is subjected to evaporation chamber milling and then assembled to obtain a heat exchange base; The heat-conducting pipe group is subjected to milling, pinning, bending and then assembly operations to obtain a phase change reflux pipe group; Assembling and brazing the heat exchange base and the phase change reflux tube group, so that the evaporation chamber of the heat exchange base is connected to the phase change reflux tube group to form an evaporation condensation loop; The evaporation-condensation circuit is sealed after vacuum injection of refrigerant to obtain the multi-layer curved heat dissipation structure.

10. A radiator, characterized in that: The invention comprises the multi-layer curved heat dissipation structure according to any one of claims 1 to 8.

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