Power packaging module

Abstract

A power packaging module comprises an electronic assembly, N pins and a packaging body, and N is larger than or equal to 10. The electronic component comprises a substrate, a circuit pattern layer, a conductive heat dissipation layer and a power element. The packaging body wraps the electronic component and one end of each of the N pins, one end of each of the N pins is electrically connected with the circuit pattern layer, and the other end of each of the N pins is exposed out of the packaging body in a protruding mode. Wherein in the N pins, the first pin, the second pin, the (N-1) th pin and the Nth pin are in line symmetry with the center line of the packaging body as the symmetry axis, and the center line is parallel to the direction, exposed out of the packaging body, of the N pins.

Description

Technical Field

[0001] The invention relates to a power packaging module, in particular to a power packaging module with high voltage resistance and high structural strength. Background Art

[0002] Power components or power packaging modules including them are the core of power conversion and circuit control of electronic devices. Power components have the functions of frequency conversion, rectification, voltage conversion, power amplification, power control, etc., and can also have energy-saving effects. Therefore, power components are widely used in many technical fields such as mobile communications, consumer electronics and automotive (such as electric vehicles).

[0003] In some circuits, such as voltage conversion circuits, power modules need to operate under high voltage or high current conditions. Therefore, how to reduce the size of the power module so that it can withstand high voltage and strengthen its structure is a topic that relevant personnel in the field of technology are eager to study.

[0004] In addition, the power module will generate more heat during operation. Therefore, the power module also needs to have good heat dissipation capabilities. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a power packaging module in view of the deficiencies in the prior art.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a power packaging module, which includes: an electronic component, N pins and a package body, N≥10. The electronic component includes a substrate, a circuit pattern layer, a conductive heat dissipation layer and a power element, the substrate is located between the circuit pattern layer and the conductive heat dissipation layer, the power element is located on the circuit pattern layer, and is electrically connected to the circuit pattern layer. The N pins are electrically connected to the circuit pattern layer, respectively. The package body covers the electronic component and one end of the N pins, one end of the N pins is electrically connected to the circuit pattern layer, and the other end of the N pins protrudes from the package body. Among the N pins, the first pin and the second pin are linearly symmetrical with the N-1th pin and the Nth pin with a center line of the package body as the symmetry axis, and the center line is parallel to the direction in which the N pins protrude from the package body.

[0007] According to a feasible solution, there is an insulation distance between the bottom edge of the conductive heat dissipation layer and the N pins protruding from the package body.

[0008] According to a feasible solution, the power packaging module further includes at least one locking hole penetrating through the packaging body.

[0009] According to a feasible solution, the package body has a first surface and an opposite second surface, and the surface of the conductive heat dissipation layer is exposed on the second surface.

[0010] According to a feasible solution, the conductive heat dissipation layer has a plurality of holes located at the outer edge of the surface of the conductive heat dissipation layer.

[0011] According to a feasible solution, the conductive heat dissipation layer includes a first heat dissipation part and a second heat dissipation part separated from each other. The first heat dissipation part has a plurality of first holes located at the outer edge of the surface of the first heat dissipation part; the second heat dissipation part has a plurality of second holes located at the outer edge of the surface of the second heat dissipation part.

[0012] According to a feasible solution, the first pin and the second pin are connected via a connecting portion, and the first pin and the second pin are defined as a power input pin group.

[0013] According to a feasible solution, the electronic component further includes a temperature sensor located on the circuit pattern layer and electrically connected to the circuit pattern layer. The temperature sensor is also electrically connected to the Nth pin and the N-1th pin. The Nth pin and the N-1th pin are defined as a temperature sensing pin group.

[0014] According to a feasible solution, among the N pins, the pins located between the power input pin group and the temperature sensing pin group are not linearly symmetrical with the center line as the symmetry axis.

[0015] According to a feasible solution, among the N pins, the pins located between the power input pin group and the temperature sensing pin group define a first signal transmission pin group and a second signal transmission pin group; the package body forms at least one middle groove located between the first signal transmission pin group and the second signal transmission pin group.

[0016] According to a feasible solution, the package body forms a first groove and a second groove, the first groove is located between the first signal transmission pin group and the power input pin group, and the second groove is located between the second signal transmission pin group and the temperature sensing pin group.

[0017] One of the beneficial effects of the present invention is that the power packaging module provided by the present invention can disperse the stress of the power packaging module insertion and improve the structural strength of the power packaging module through the technical solution of "among the N pins, the first pin and the second pin, and the N-1th pin and the Nth pin are linearly symmetrical with a center line of the packaging body as the symmetry axis".

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 4 is a schematic diagram of a power packaging module according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 Exploded schematic diagram of the illustrated embodiment.

[0021] Figure 3 for Figure 1 Front view of the illustrated embodiment.

[0022] Figure 4 for Figure 1 Rear view of the illustrated embodiment.

[0023] Figure 5-Figure 10 , are schematic diagrams of the appearance of a power packaging module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following is an explanation of the implementation methods of the "power packaging module" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0025] See also Figures 1 to 4 , Figure 1 FIG. 1 is a schematic diagram of the appearance of a power packaging module 1A according to an embodiment of the present invention. Figure 2 for Figure 1 Exploded schematic diagram of the illustrated embodiment. Figure 3 for Figure 1 Front view of the illustrated embodiment. Figure 4 for Figure 1 Rear view of the illustrated embodiment.

[0026] According to this embodiment, the power package module 1A includes: an electronic component 11, 10 pins 12 and a package body 13. The electronic component 11 includes a substrate 111, a circuit pattern layer 112, a conductive heat dissipation layer 113 and two power components 114. The substrate 111 is located between the circuit pattern layer 112 and the conductive heat dissipation layer 113, and the power component 114 is located on the circuit pattern layer 112 and electrically connected to the circuit pattern layer 112. The 10 pins 12 are electrically connected to the circuit pattern layer 112 respectively. The package body 13 covers the electronic component 11 and one end of the 10 pins 12 electrically connected to the circuit pattern layer 112, and the other end of the 10 pins 12 protrudes from the package body 13. Among the 10 pins 12, the first pin 121 and the second pin 122 are symmetrical with the ninth pin 129 and the tenth pin 120, with the center line L1 of the package body 13 as the axis of symmetry. The center line L1 is parallel to the direction in which the 10 pins 12 are exposed from the package body 13. The first pin 121 and the second pin 122 are symmetrical with the ninth pin 129 and the tenth pin 120 to strengthen the structural strength of the power package module, especially when it is plugged (dip) into a circuit board for use, to disperse stress. Figure 1 In the illustrated embodiment, the pins 12 (including the pins 120 - 129 ) are upright, but the present invention is not limited thereto. According to some embodiments, the pins 12 have a bent structure (described later in detail).

[0027] It should be noted that the number of pins 12 is ≥ 10. In these embodiments, 10 pins are used as an example, which is not the only embodiment. Figure 1 In the illustrated embodiment, there are two power devices 114 , which form a half-bridge circuit structure with the circuit pattern layer 112 . However, the present invention is not limited thereto, and the user or manufacturer may also design the circuit structure as a full-bridge structure.

[0028] According to some embodiments, the substrate 111 is made of ceramic. The conductive heat dissipation layer 113 is a metal layer (plate), such as copper foil. According to some embodiments, the circuit pattern layer 112 is also made of copper foil.

[0029] exist Figure 1 In the embodiment shown, the package body 13 has a first surface 131 and an opposite second surface 132. Figure 3 As shown, the surface of the conductive heat dissipation layer 113 is exposed on the second surface 132 of the package body 13. Since the power package module 1A generates more heat energy during operation, the conductive heat dissipation layer 113 enables the power package module 1A to have good heat dissipation capability. According to some embodiments, the user may also set a thermal conductive adhesive layer (not shown) on the surface of the conductive heat dissipation layer 113 to improve the heat dissipation capability of the power package module 1A.

[0030] exist Figure 1In the embodiment shown, the first pin 121 and the second pin 122 are connected via the connecting portion 1210, and the first pin 121 and the second pin 122 are defined as a power input pin group 12A. The electronic component 11 further includes a temperature sensor 115, which is located on the circuit pattern layer 112 and electrically connected to the circuit pattern layer 112. The temperature sensor 115 is also electrically connected to the 9th pin 129 and the 10th pin 120. The 9th pin 129 and the 10th pin 120 are, for example, thermistors, and are collectively defined as a temperature sensing pin group 12B. The power input pin group 12A and the temperature sensing pin group 12B are linearly symmetrical with the center line L1 as the symmetry axis. Since the temperature sensor 115 and the power element 114 are both covered by the package body 13, the temperature sensed by the temperature sensor 115 of the present invention is substantially close to the operating temperature of the power element 114, compared with the external sensing of the power packaging module.

[0031] In addition, if Figure 3 and Figure 4 As shown, the pins between the power input pin group 12A and the temperature sensing pin group 12B are defined as signal transmission pins 123-128, which are not linearly symmetrical with the center line L1 as the axis of symmetry. In this embodiment, the signal transmission pins 123-128 correspond to the two power elements 114 and are divided into the first signal transmission pin group 12C and the second signal transmission pin group 12D (the signal transmission pins 123-125 are the first signal transmission pin group 12C, and the signal transmission pins 126-128 are the second signal transmission pin group 12D). The spacing relationship of the signal transmission pins 123-125 is different from the spacing relationship of the signal transmission pins 126-128, that is, the first signal transmission pin group 12C and the second signal transmission pin group 12D are not linearly symmetrical with the center line L1. In this way, the power packaging module 1A can achieve the purpose of plug-in fool-proofing in use.

[0032] exist Figure 1 In the embodiment shown, the package body 13 forms a groove 133, and the groove 133 extends in a direction away from the outside of the package body 13. For example, the package body 13 forms a middle groove 1333, and the middle groove 1333 is located between the first signal transmission pin group 12C and the second signal transmission pin group 12D. Figure 1In the embodiment of the present invention, the package body 13 further forms a first groove 1331 and a second groove 1332, wherein the first groove 1331 is located between the power input pin group 12A and the first signal transmission pin group 12C. The second groove 1332 is located between the temperature sensing pin group 12B and the signal transmission pin group 12D. The width h1, extension length h2 and thickness h3 of the plurality of grooves 133 are designed to increase the creepage distance between the first signal transmission pin group 12C and the second signal transmission pin group 12D, increase the creepage distance between the power input pin group 12A and the first signal transmission pin group 12C, and increase the creepage distance between the temperature sensing pin group 12B and the second signal transmission pin group 12D, thereby increasing two more extension length h2 creepage distances compared to the original case where there is no groove 133.

[0033] exist Figure 1 In the embodiment shown, the power packaging module further includes two locking holes 15 that penetrate the packaging body 13. When the power packaging module 1A is plugged (or welded) on the circuit board, the user can lock and fix the power packaging module 1A through the locking holes 15. In other words, the power packaging module 1A of the present invention can be plugged on the side or corner of the circuit board without occupying other usable space on the circuit board.

[0034] like Figure 1 As shown, there is an insulation distance H between the bottom edge 1132 of the conductive heat dissipation layer 113 and the ten pins 12 protruding from the package body. With this insulation distance H, the insulation capability of the power package module 1A reaches ultra-high voltage or above, for example, above 1KV.

[0035] like Figure 3 As shown, in this embodiment, the conductive heat dissipation layer 113 has a plurality of holes 1131, which are spaced apart and arranged on the outer edge of the surface of the conductive heat dissipation layer 113. This structural design can disperse the stress (such as thermal stress) received by the conductive heat dissipation layer 113 to prevent it from warping.

[0036] like Figure 4 As shown, in this embodiment, the power package module 1A further includes a positioning recess 14, which is located on the first surface 131 of the package body 13. The location of the positioning recess 14 avoids the power element 114 (for example, the pad 1141 of the power element 114). In the process, the electronic component 11 is fixed by the positioning recess 14, and the package body 13 is injected so that the surface of the conductive heat dissipation layer 113 can be completely exposed on the second surface 132 (for example, Figure 3 shown).

[0037] See also Figures 5 to 9 , respectively, are schematic diagrams of the appearance of power packaging modules 1B-1F according to an embodiment of the present invention. In these embodiments, each pin 12 has at least one bending structure, and the pins 12 of different embodiments have different extension directions, such as Figure 5 , Figure 6 and Figure 8 In the embodiment shown, the pin 12 is bent and extended in a direction away from the second surface 132. Fig. 9 In the embodiment shown, the pin 12 is bent and extended in a direction away from the first surface 131. Figure 6 and Figure 7 In the embodiment shown, the power packaging module 1C and the power packaging module 1D have shorter pins 12. In other words, the user can design the structure of the pins 12 according to the technical field and requirements, and the present invention is not limited thereto.

[0038] See also Fig.10 , is a schematic diagram of the appearance of a power packaging module 1G according to an embodiment of the present invention. According to this embodiment, the conductive heat dissipation layer 113 includes a first heat dissipation portion 113a and a second heat dissipation portion 113b separated from each other. The first heat dissipation portion 113a has a plurality of first holes 1131, which are spaced apart at the outer edge of the first heat dissipation portion 113a. The second heat dissipation portion 113b has a plurality of second holes 1131, which are spaced apart at the outer edge of the second heat dissipation portion 113b. As mentioned above, the purpose of providing the first holes 1131 and the second holes 1131 is to disperse the stress of the conductive heat dissipation layer 113, so as to avoid warping due to the stress and peeling off from the substrate 111 under long-term use.

[0039] [Beneficial Effects of Embodiments]

[0040] One of the beneficial effects of the present invention is that the power packaging module provided by the present invention can disperse the stress of the power packaging module insertion and improve the structural strength of the power packaging module through the technical solution of "among the N pins, the first pin and the second pin, and the N-1th pin and the Nth pin are linearly symmetrical with the center line of the packaging body as the symmetry axis".

[0041] Furthermore, the power packaging module achieves the purpose of preventing incorrect insertion and fool-proofing by adopting the technical feature that "the pins between the power input pin group and the temperature sensing pin group (such as the first signal transmission pin group and the second signal transmission pin group) are not linearly symmetrical with the center line as the axis of symmetry."

[0042] One of the beneficial effects of the present invention is that the conductive heat dissipation layer has a plurality of holes that are spaced apart on the outer edge of the surface of the conductive heat dissipation layer. This structural design can disperse the stress (such as thermal stress) received by the conductive heat dissipation layer, thereby preventing warping (peeling off from the substrate).

[0043] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A power packaging module, characterized in that: The power packaging module comprises: An electronic component, comprising: a substrate, a circuit pattern layer, a conductive heat dissipation layer and at least one power element, wherein the substrate is located between the circuit pattern layer and the conductive heat dissipation layer, and the at least one power element is located on the circuit pattern layer and electrically connected to the circuit pattern layer; and N pins, respectively electrically connected to the circuit pattern layer, wherein N ≥ 10; and A package body, covering the electronic component and one end of the N pins, one end of the N pins is electrically connected to the circuit pattern layer, and the other end of the N pins is protruding from the package body; Among the N pins, a first pin and a second pin, and an N-1th pin and an Nth pin are linearly symmetrical with a center line of the package body as a symmetry axis, and the center line is parallel to the direction in which the N pins protrude from the package body.

2. The power packaging module according to claim 1, characterized in that: An insulation distance exists between a bottom edge of the conductive heat dissipation layer and the N pins protruding from the package body.

3. The power packaging module according to claim 1, characterized in that: The power packaging module further includes at least one locking hole penetrating through the packaging body.

4. The power packaging module according to claim 1, characterized in that: The package body has a first surface and an opposite second surface, and a surface of the conductive heat dissipation layer is exposed on the second surface.

5. The power packaging module according to claim 4, characterized in that: The conductive heat dissipation layer has a plurality of holes located at the outer edge of the surface of the conductive heat dissipation layer.

6. The power packaging module according to claim 4, characterized in that: The conductive heat dissipation layer includes a first heat dissipation portion and a second heat dissipation portion separated from each other. The first heat dissipation portion has a plurality of first holes located at the outer edge of the surface of the first heat dissipation portion; the second heat dissipation portion has a plurality of second holes located at the outer edge of the surface of the second heat dissipation portion.

7. The power packaging module according to claim 1, characterized in that: The first branch pin and the second branch pin are connected via a connecting portion, and the first branch pin and the second branch pin are defined as a power input pin group.

8. The power packaging module according to claim 7, characterized in that: The electronic component further includes: a temperature sensor located on the circuit pattern layer and electrically connected to the circuit pattern layer, the temperature sensor is also electrically connected to the Nth pin and the N-1th pin, and the Nth pin and the N-1th pin are defined as a temperature sensing pin group.

9. The power packaging module according to claim 8, characterized in that: Among the N pins, the pins located between the power input pin group and the temperature sensing pin group are not linearly symmetrical with the center line as the axis of symmetry.

10. The power packaging module according to claim 8, characterized in that: Among the N pins, the pins located between the power input pin group and the temperature sensing pin group define a first signal transmission pin group and a second signal transmission pin group; the package body forms at least one middle groove located between the first signal transmission pin group and the second signal transmission pin group.

11. The power packaging module according to claim 10, characterized in that: The package body forms a first groove and a second groove, the first groove is located between the first signal transmission pin group and the power input pin group, and the second groove is located between the second signal transmission pin group and the temperature sensing pin group.

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