Manufacturing method of antenna assembly, antenna module and communication equipment

Abstract

The invention provides a manufacturing method of an antenna assembly, an antenna module and communication equipment. The antenna module comprises a circuit board; an isolation antenna; the at least two antenna assemblies are arranged on the circuit board, the adjacent antenna assemblies are oppositely arranged, and the isolation antennas are arranged between the adjacent antenna assemblies; the antenna assembly comprises a first ceramic dielectric layer, a first radiation sheet, a second ceramic dielectric layer, a second radiation sheet and a third ceramic dielectric layer which are stacked in sequence, the first ceramic dielectric layer is arranged on the circuit board, the second ceramic dielectric layer is provided with a through hole, and the first radiation sheet and the second radiation sheet are coupled through a conductive column arranged in the through hole; the first radiation sheet and the second radiation sheet are at least partially overlapped; the microstrip line is coupled with the first radiation sheet of each antenna assembly for feeding. Therefore, the size of the UWB antenna can be reduced, the resonant frequency, the bandwidth and the efficiency are improved, the isolation between adjacent antennas is improved, and the directivity of the antenna is more stable.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to a method for manufacturing an antenna assembly, an antenna module and a communication device. Background Art

[0002] With the rapid development of smart devices and the Internet of Things (IoT), integration, miniaturization, low latency, and high transmission rates have become the development trend of future smart communication devices. As the space for smart communication devices becomes smaller and smaller, the surrounding metal environment becomes more and more complex, which leads to limited antenna design space. It is difficult to ensure that the performance of the antenna meets the design requirements in a limited space. Taking UWB (Ultra Wide Band) antennas as an example, traditional steel sheet UWB antennas and PCB UWB antennas have a large footprint and poor stability. They are easily affected by the surrounding metal, resulting in poor performance. At the same time, they are not isolated enough from other antennas, and electromagnetic interference will occur between antennas, resulting in low efficiency. Summary of the invention

[0003] In view of this, the present application provides a method for manufacturing an antenna assembly, an antenna module and a communication device, which can improve the problems of insufficient miniaturization, low bandwidth, low efficiency and poor isolation between antennas of traditional UWB antennas.

[0004] The present application provides a method for manufacturing an antenna assembly, comprising:

[0005] providing a first ceramic dielectric layer;

[0006] forming a first radiation plate on the first ceramic dielectric layer;

[0007] Arranging a plurality of welding feet on the first ceramic dielectric layer, wherein the plurality of welding feet and the first radiation sheet are arranged on opposite sides of the first ceramic dielectric layer, and each of the welding feet is exposed to the first ceramic dielectric layer;

[0008] forming a second ceramic dielectric layer on the first ceramic dielectric layer, wherein the second ceramic dielectric layer covers the first radiation plate;

[0009] forming a through hole on the second ceramic dielectric layer, and forming a conductive column in the through hole;

[0010] forming a second radiation plate on the second ceramic dielectric layer, wherein the second radiation plate is coupled to the first radiation plate through the conductive column, and the first radiation plate and the second radiation plate at least partially overlap;

[0011] A third ceramic dielectric layer is formed on the second ceramic dielectric layer, and the third ceramic dielectric layer covers the second radiation plate.

[0012] Optionally, the first radiation sheet and the second radiation sheet are both in the shape of long strips, and the length directions of the first radiation sheet and the second radiation sheet are arranged perpendicularly.

[0013] The present application provides an antenna module, comprising:

[0014] A circuit board is provided with a microstrip line;

[0015] An isolation antenna is disposed on the circuit board;

[0016] At least two antenna components, the antenna components are made by any of the above methods, each of the antenna components is arranged on the circuit board, and the first ceramic dielectric layer of each antenna component is in contact with the circuit board, adjacent antenna components are arranged relative to each other, and the isolation antenna is arranged between the adjacent antenna components; the microstrip line is coupled and fed with the first radiation plate of each antenna component.

[0017] Optionally, the circuit board is provided with a hollow area, and the orthographic projection of the first radiation sheet falls into the hollow area, so that an edge of the first radiation sheet is arranged opposite to an edge of the hollow area.

[0018] Optionally, the microstrip line and the first radiation plate are arranged relative to each other along the stacking direction through the first ceramic dielectric layer to achieve coupled feeding.

[0019] Optionally, the relative distance between the microstrip line and the first radiation plate along the stacking direction is in millimeter order.

[0020] Optionally, the microstrip line is flush with the surface of the circuit board.

[0021] Optionally, the welding foot is arranged adjacent to the short side of the first radiation piece, and the distance between the welding foot and the short side of the first radiation piece is greater than the distance between the long side of the first radiation piece and the adjacent edge of the hollow area.

[0022] Optionally, each of the antenna components is provided with four welding feet, which are respectively arranged adjacent to the four top corners of the hollow area.

[0023] The present application provides a communication device, comprising an antenna module as described in any one of the above items.

[0024] As described above, in the antenna assembly, antenna module and communication equipment of the present application, each antenna assembly includes a first radiating plate and a second radiating plate that are stacked, so that the footprint of the entire antenna is smaller, meeting the requirements of miniaturized design, and being applicable to a wider range of communication equipment. It is highly versatile, and by reasonably changing the size of any radiating plate to adjust the overlapping area of ​​the two radiating plates, the resonant frequency of the antenna can be better adjusted, so that the bandwidth and efficiency can be effectively improved. In addition, by arranging an isolation antenna between two adjacent antenna assemblies, the isolation between adjacent antennas can be greatly improved, reducing the impact on the radiation direction of the antenna, making the directivity of the antenna more stable, and facilitating the consistency of antenna design.

[0025] Furthermore, the present application realizes coupled feeding of each antenna component through microstrip lines, improves the bandwidth of the antenna through coupled feeding, and reduces the influence of the circuit board on the radiation direction of the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a structural schematic diagram of an antenna module provided in an embodiment of the present application;

[0027] Figure 2 yes Figure 1 The antenna module shown is a schematic diagram of exposing one of the antenna components;

[0028] Figure 3 yes Figure 2 An enlarged schematic diagram of the structure of the antenna module in the area indicated by the middle circle;

[0029] Figure 4 It is a schematic diagram of the structure of each layer of an antenna module of the present application;

[0030] Figure 5 is a curve diagram of the S11 parameters of the two antenna components of the present application;

[0031] Figure 6 is a schematic diagram of efficiency curves of two antenna components of the present application;

[0032] Figure 7 is a schematic diagram of an isolation curve between two antenna components of the present application;

[0033] Figure 8 is a PDoA response diagram generated by the antenna module of the present application according to the source polarization;

[0034] Fig. 9 It is a schematic diagram of the radiation direction of the two antenna components of the present application in the horizontal and vertical directions;

[0035] Fig.10 It is a schematic flow chart of a method for manufacturing an antenna assembly provided in an embodiment of the present application.

[0036] The first direction is x, the second direction is y, and the third direction is z;

[0037] Antenna module 100, circuit board 1, solder pad 10, hollow area 11, recessed area 12, isolation antenna 2, antenna component 3, microstrip line 4, first antenna component 3a, second antenna component 3b, solder foot 30, first ceramic dielectric layer 31, first radiation plate 32, second ceramic dielectric layer 33, second radiation plate 34, third ceramic dielectric layer 35, through hole 331, conductive column 332. DETAILED DESCRIPTION

[0038] In order to solve the above-mentioned technical problems existing in the prior art, in the antenna assembly, antenna module and communication equipment of the present application, the radiation plates of each antenna assembly are stacked so that the footprint of the entire antenna meets the requirements of miniaturized design, and the overlapping area between these radiation plates is adjusted by reasonably changing the size of any radiation plate, so as to adjust the resonant frequency of the antenna and improve the bandwidth and efficiency; in addition, by arranging an isolation antenna between two adjacent antenna assemblies, the isolation between adjacent antennas is improved.

[0039] The specific form of the parameters such as shape, quantity, size, etc. of any of the radiation plates, isolation antennas and circuit boards can be determined according to the adaptability required by the actual scenario, and this application is not limited thereto.

[0040] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly described below in conjunction with specific embodiments and corresponding drawings. Obviously, the embodiments described below are only part of the embodiments of the present application, not all of the embodiments. In the absence of conflict, the following embodiments and their technical features can be combined with each other and also belong to the technical solutions of the present application.

[0041] In the description of the embodiments of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", and "counterclockwise" indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the corresponding embodiments, rather than indicating or implying that a device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0042] Please also read Figures 1 to 4As shown, the antenna module 100 of an embodiment of the present application includes a circuit board 1, an isolated antenna 2 and at least two antenna components 3. The number and position of the antenna components 3 and the isolated antenna 2 can be determined according to the adaptability of actual needs, and the present application does not limit them. The two antenna components 3 and the isolated antenna 2 are provided in the figure for exemplary display only. For the convenience of description, the two antenna components 3 are respectively referred to as "first antenna component 3a" and "second antenna component 3b" herein.

[0043] The circuit board 1 includes but is not limited to a PCB (Printed Circuit Board). The circuit board 1 can be designed with a single-layer structure or a plurality of layers. Figure 1 and Figure 2 The double-layer design shown includes a first circuit board body and a second circuit board body, or a multi-layer design.

[0044] For ease of description and understanding, in combination with the placement orientation shown in the figure, the length direction of the antenna module 100 is called the first direction x, the height direction or the thickness direction is called the second direction y, and the width direction is called the third direction z. The first direction x, the second direction y and the third direction z are perpendicular to each other and can be regarded as the three coordinate axes of the three-dimensional rectangular coordinate system. It should be understood that the so-called verticality in the whole application does not require that the angle between the two must be 90°, but allows a deviation of, for example, ±10°, that is, the so-called verticality can be understood as the angle between any two directions is 80° to 100°. Similarly, the so-called parallelism in the whole application does not require that the angle between the two must be 0° or 180°, but allows a deviation of, for example, ±10°, that is, the so-called parallelism can be understood as the angle between any two directions is 0° to 10° or 170° to 190°.

[0045] The antenna component 3 is arranged on the circuit board 1, for example, it can be arranged on the upper surface of the circuit board 1 by using SMT (Surface Mounted Technology). Two adjacent antenna components 3 are arranged relative to each other, and the so-called relative arrangement can be understood as: on the mounting surface of the circuit board 1 or on the plane parallel to the circuit board 1, along the line of sight of the first direction x, there is a distance between the two adjacent antenna components 3 that is not equal to zero.

[0046] The isolation antenna 2 is arranged on the circuit board 1 and is located between two adjacent antenna components 3. The isolation antenna 2 is arranged relative to any antenna component 3, and the distance between the isolation antenna 2 and each antenna component 3 can be equal or unequal. The main function of the isolation antenna 2 is to reduce or eliminate the mutual interference between two adjacent antenna components 3, ensuring that each antenna component 3 can work independently and efficiently. The structure and specific manifestation of the isolation antenna 2 can refer to the relevant technology in this field. Figure 1 and Figure 2 The illustrations are for exemplary purposes only.

[0047] Any antenna component 3 can be implemented as a separate antenna, including but not limited to a UWB antenna. The structures of the antenna components 3 can be completely the same, or they can include components with the same name, but the sizes and shapes of the components are different. Figure 3 and Figure 4 As shown, a single antenna assembly 3 includes a first ceramic dielectric layer 31, a first radiation plate 32, a second ceramic dielectric layer 33, a second radiation plate 34 and a third ceramic dielectric layer 35 stacked in sequence, wherein the first ceramic dielectric layer 31 is disposed on the circuit board 1. Figure 3 and Figure 4 In the example shown, each antenna component 3 may include a plurality of welding feet 30, for example, four welding feet 30 are provided in the figure, each welding foot 30 is at least provided on the first ceramic dielectric layer 31, and a plurality of corresponding pads 10 may be provided on the circuit board 1, and each pad 10 is welded with each welding foot 30 one by one, so as to weld and fix the antenna component 3 on the circuit board 1. It should be noted that there is no electrical connection between each welding foot 30 and the first radiation plate 32 and the second radiation plate 34, and each welding foot 30 is only used for welding and fixing the antenna component 3, and is not used for feeding and coupling the circuit board 1 with the antenna component 3. Each antenna component 3 is a complete device and can be independently produced, manufactured and sold. For any antenna component 3, the first ceramic dielectric layer 31, the second ceramic dielectric layer 33 and the third ceramic dielectric layer 35 form the ceramic dielectric body of the antenna component 3, which completely wraps the first radiation plate 32 and the second radiation plate 34, and only exposes the plurality of welding feet 30 from the first ceramic dielectric layer 31.

[0048] After each soldering pad 10 is soldered to each soldering foot 30 in a one-to-one correspondence, the first ceramic dielectric layer 31 of each antenna assembly 3 contacts the upper surface of the circuit board 1 .

[0049] The second ceramic dielectric layer 33 is provided with a through hole 331, and the first radiation plate 32 and the second radiation plate 34 are coupled through the conductive column 332 provided in the through hole 331, so that the first radiation plate 32 and the second radiation plate 34 are jointly implemented as the radiation plate of the antenna component 3. The first ceramic dielectric layer 31, the second ceramic dielectric layer 33 and the third ceramic dielectric layer 35 can be made of the same material, so as to form a ceramic protection layer and a dielectric layer of each antenna component 3, which plays a role in protecting the antenna radiation plate and adjusting the dielectric constant. For example, by adjusting the thickness of the second ceramic dielectric layer 33, the dielectric constant between the first radiation plate 32 and the second radiation plate 34 can be adjusted.

[0050] The first radiation plate 32 and the second radiation plate 34 can be made of radiation plate materials of conventional related antennas, and the material of the conductive column 332 can be completely the same as or different from that of the first radiation plate 32 and the second radiation plate 34. The through hole 331 can be formed by etching or other processes.

[0051] The first radiation plate 32 and the second radiation plate 34 at least partially overlap, that is, along the second direction y, the orthographic projections of the first radiation plate 32 and the second radiation plate 34 at least partially overlap.

[0052] Based on the above, in the antenna module 100 of the present application, each antenna component 3 includes two stacked radiation plates 32 and 34, which can make the entire antenna occupy a small area, meet the requirements of miniaturization design, and be applicable to more types of communication equipment, with strong versatility. For example, the size of a single antenna component 3 can be realized as (length L is) 4.5mm*(width D is) 3.2mm*(height H is) 1.6mm, and the size of a single antenna is extremely small, which is convenient for integration into various types of equipment.

[0053] Furthermore, by reasonably changing the size of any one of the radiation sheets to adjust the overlapping area between the two radiation sheets 32 and 34, the resonant frequency of the antenna can be adjusted to effectively improve the bandwidth and efficiency. Figures 1 to 4 As shown, the first radiation plate 32 and the second radiation plate 34 can both be long strips, and the length direction of the first radiation plate 32 is perpendicular to the length direction of the second radiation plate 34. Here, the overlapping area between the first radiation plate 32 and the second radiation plate 34 is smaller. The smaller overlapping area means that each radiation plate can be more focused on the area covered by its corresponding design. For example, signal interference between different radiation plates can be reduced, thereby improving the overall signal quality. At the same time, each radiation plate can provide optimal signal coverage in a specific direction of the corresponding design, and use energy more efficiently, thereby improving transmission efficiency, thereby meeting the needs of various wireless communication applications.

[0054] In addition, multiple antenna components 3 can realize a multi-antenna design, which is beneficial to the high-precision positioning of the antenna module 100. By setting an isolation antenna 2 between two adjacent antenna components 3, the isolation between adjacent antennas (i.e., two adjacent antenna components 3) can be greatly improved, reducing the impact on the radiation direction of the antenna, making the directivity of each antenna more stable, which is beneficial to the consistency of the antenna design.

[0055] Please continue to read Figures 1 to 3As shown, the circuit board 1 may be provided with a hollow area 11. When observed along the line of sight of the second direction y, the orthographic projection of the first radiation sheet 32 ​​falls into the hollow area 11, so that the edge of the first radiation sheet 32 ​​is arranged opposite to the edge of the hollow area 11. The hollow area 11 and the first radiation sheet 32 ​​may both be rectangular, and the two long sides of the hollow area 11 may be arranged opposite to the two long sides of the first radiation sheet 32, and the two short sides of the hollow area 11 may be arranged opposite to the two short sides of the first radiation sheet 32. It should be noted that since the distance between adjacent edges is small, Figure 3 It shows that the adjacent long edges are relatively close to each other, and even touch each other, but they are not touching.

[0056] Since the circuit board 1 has multiple layers of wiring (i.e., copper cladding) inside, two adjacent layers of wiring are insulated by the circuit board 1 material, and different layers of wiring are coupled through vias and conductive columns arranged in the vias, i.e., so-called interlayer coupling is achieved. Therefore, in the hollow area 11, the circuit board 1 will expose the copper cladding at each edge of the hollow area 11, and the first radiation plate 32 is arranged relative to the edge of the hollow area 11 to form a slot antenna, thereby further improving the transmission efficiency of the entire antenna module 100 and helping to further reduce its size.

[0057] By adjusting the distance between the first radiation plate 32 and the edge of the hollow area 11 , the operating frequency of the slot antenna can be adjusted, and the return loss of the slot antenna can be controlled at the same time.

[0058] exist Figure 3 In the example shown, the four welding feet 30 of any antenna component 3 are respectively arranged adjacent to the four vertices of the hollow area 11; each welding foot 30 can be arranged adjacent to the short side of the first radiation piece 32, and the distance between the short side of the first radiation piece 32 and the adjacent short side of the hollow area 11 is greater than the distance between the long side of the first radiation piece 32 and the adjacent edge of the hollow area 11, and the distance between the welding foot 30 and the short side of the first radiation piece 32 is greater than the distance between the long side of the first radiation piece 32 and the adjacent edge of the hollow area 11. Here, the distance between each welding foot 30 and the first radiation piece 32 is large, which can avoid interference between each welding foot 30 and the first radiation piece 32.

[0059] Please continue to read Figures 1 to 3 As shown, a microstrip line 4 may be provided on the circuit board 1, and the microstrip line 4 is coupled and fed with the first radiation plate 32. The present application realizes coupled feeding of each antenna component 3 through the microstrip line 4, and the bandwidth of each antenna can be improved through coupled feeding, while reducing the influence of the circuit board 1 on the radiation direction of the antenna.

[0060] In one example, the microstrip line 4 can be flush with the surface of the circuit board 1. For example, a recessed area 12 can be provided on the surface of the circuit board 1, and the depth of the recessed area 12 (i.e., the length along the second direction y) can be equal to the thickness of the microstrip line 4. When the microstrip line 4 is provided in the recessed area 12, the microstrip line 4 can be flush with the surface of the circuit board 1, and the first ceramic dielectric layer 31 of each antenna component 3 can be directly formed on the surface of the microstrip line 4, that is, the thickness of the first ceramic dielectric layer 31 can be equal to the distance between the microstrip line 4 and the first radiation plate 32.

[0061] Optionally, the microstrip line 4 and the first radiation plate 32 are arranged relative to each other along the stacking direction (i.e., the second direction y) through the first ceramic dielectric layer 31 to achieve coupled feeding. In actual scenarios, the relative distance between the microstrip line 4 and the first radiation plate 32 along the stacking direction is in the millimeter level, that is, the thickness of the first ceramic dielectric layer 31 is in the millimeter level, for example, about 0.5 mm. This millimeter-level relative distance can ensure good coupled feeding between the microstrip line 4 and the first radiation plate 32, and at the same time ensure that the first radiation plate 32 will not be exposed, that is, the first ceramic dielectric layer 31 can achieve better protection for the first radiation plate 32.

[0062] for Figures 1 to 4 The antenna module 100 of the structure shown in FIG. 1 is a UWB antenna in which each antenna component 3 is a UWB antenna. Figure 5 The curve diagram of the S11 parameters of the two antenna components 3 shown in FIG. 1 is a schematic diagram of the curve diagram of the S11 parameters of the two antenna components 3. The S11 parameter refers to the reflection coefficient of the input end of the antenna component 3, which is used to measure the matching degree between the antenna component 3 and the transmission line (ie, the microstrip line 4). Figure 5 As shown, when the resonant frequency is between 7.8 and 8.2 GHz, the bandwidths of the two antenna components 3 are both greater than 400 MHz, and the S11 parameters are both less than -10 dB, making the performance of the two antennas relatively superior.

[0063] Combination Figure 6 From the schematic diagram of the efficiency curves of the two antenna components 3 shown, it can be seen that when the resonant frequency is between 7.8 and 8.2 GHz, the efficiencies of the two antenna components 3 are both greater than 40%, which is conducive to meeting the transmission performance requirements.

[0064] Combination Figure 7 From the schematic diagram of the isolation curve between the two antenna components 3 shown, it can be seen that the maximum isolation between the two antenna components 3 is below -20dB, and the interference between two adjacent antenna components 3 is very low, which is conducive to meeting the stable performance requirements of the communication equipment.

[0065] Combination Figure 8The PDoA (Phase Difference of Arrival) response diagram (simulated CH9) generated according to the source polarization is shown, wherein the horizontal axis represents the incident angle (AOA, Angle of Arrival, also known as the arrival angle) of the signal reaching the antenna module 100, and the vertical axis represents the signal amplitude. It can be seen that as the signal amplitude increases, the incident angle increases. Here, the position of the signal source can be determined more accurately by measuring the incident angle of the signal, and centimeter-level positioning accuracy can be achieved. At the same time, the AOA technology can adapt to different environmental conditions, such as maintaining high-precision positioning in multipath effects and occlusion environments.

[0066] Combination Fig. 9 The schematic diagram of the radiation direction of the two antenna components 3 in the horizontal and vertical directions shows that the 3dB lobe width of the two antenna components 3 in these two directions is greater than 120deg., with good directivity and sufficient radiation width, which can adapt to different environmental conditions to maintain high-precision positioning.

[0067] The present application also provides a method for manufacturing an antenna assembly. Fig.10 As shown, including:

[0068] S101: providing a first ceramic dielectric layer;

[0069] S102: forming a first radiation plate on the first ceramic dielectric layer;

[0070] S103: Arranging a plurality of welding feet on the first ceramic dielectric layer, wherein the plurality of welding feet and the first radiation plate are arranged on two opposite sides of the first ceramic dielectric layer, and each welding foot is exposed to the first ceramic dielectric layer;

[0071] S104: forming a second ceramic dielectric layer on the first ceramic dielectric layer, wherein the second ceramic dielectric layer covers the first radiation plate;

[0072] S105: forming a through hole on the second ceramic dielectric layer, and forming a conductive column in the through hole;

[0073] S106: forming a second radiation plate on the second ceramic dielectric layer, wherein the second radiation plate is coupled to the first radiation plate via a conductive column, and the first radiation plate and the second radiation plate at least partially overlap;

[0074] S107: forming a third ceramic dielectric layer on the second ceramic dielectric layer, and the third ceramic dielectric layer covers the second radiation plate.

[0075] The method can be used to manufacture Figures 1 to 4The antenna assembly 3 shown can therefore produce the beneficial effects that can be produced by the antenna assembly 3 of any of the aforementioned embodiments and the antenna module 100 to which the antenna assembly 3 is applicable, which will not be described in detail here. For example, the first radiating plate and the second radiating plate can both be long strips, so the length direction of the first radiating plate and the second radiating plate are perpendicularly arranged, and the overlapping area between the first radiating plate and the second radiating plate is small. The smaller overlapping area means that each radiating plate can be more focused on the area covered by its corresponding design, for example, it can reduce signal interference between different radiating plates, thereby improving the overall signal quality. At the same time, each radiating plate can provide the best signal coverage in a specific direction of the corresponding design, and use energy more efficiently, thereby improving the transmission efficiency, thereby meeting the needs of various wireless communication applications.

[0076] This document uses step codes such as S101, S102, etc., for the purpose of expressing the corresponding content more clearly and concisely, and does not constitute a substantial limitation on the sequence. When implementing the step codes, those skilled in the art may execute S103 first and then S102, etc., but these should all be within the scope of protection of this application.

[0077] The present application also provides a communication device, including the antenna module 100 of any of the above embodiments, so that the beneficial effects of the antenna module 100 of the corresponding embodiment can be produced. The specific form of the communication device is not limited by the present application, for example, it can be a remote control pen, a smart phone, etc.

[0078] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. For ordinary technicians in this field, all equivalent structural changes made using the contents of this specification and drawings are also included in the patent protection scope of the present application.

[0079] Although the terms "first, second", etc. are used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. In addition, the singular forms "one", "an", and "the" are intended to include plural forms as well. The terms "or" and "and / or" are interpreted as inclusive, or mean any one or any combination. Only when the combination of elements, functions, steps, or operations is inherently mutually exclusive in some way, an exception to this definition will occur.

Claims

1. A method for manufacturing an antenna assembly, characterized in that: include: providing a first ceramic dielectric layer; forming a first radiation plate on the first ceramic dielectric layer; Arranging a plurality of welding feet on the first ceramic dielectric layer, wherein the plurality of welding feet and the first radiation sheet are arranged on opposite sides of the first ceramic dielectric layer, and each of the welding feet is exposed to the first ceramic dielectric layer; forming a second ceramic dielectric layer on the first ceramic dielectric layer, wherein the second ceramic dielectric layer covers the first radiation plate; forming a through hole on the second ceramic dielectric layer, and forming a conductive column in the through hole; forming a second radiation plate on the second ceramic dielectric layer, wherein the second radiation plate is coupled to the first radiation plate through the conductive column, and the first radiation plate and the second radiation plate at least partially overlap; A third ceramic dielectric layer is formed on the second ceramic dielectric layer, and the third ceramic dielectric layer covers the second radiation plate.

2. The method according to claim 1, characterized in that The first radiation sheet and the second radiation sheet are both in the shape of long strips, and the length directions of the first radiation sheet and the second radiation sheet are arranged perpendicularly.

3. An antenna module, characterized in that: include: A circuit board is provided with a microstrip line; An isolation antenna is disposed on the circuit board; At least two antenna components, the antenna components are made by the method described in claim 1 or 2, each of the antenna components is arranged on the circuit board, and the first ceramic dielectric layer of each antenna component is in contact with the circuit board, adjacent antenna components are arranged relative to each other, and the isolation antenna is arranged between the adjacent antenna components; the microstrip line is coupled and fed with the first radiation plate of each antenna component.

4. The antenna module according to claim 1, characterized in that: The circuit board is provided with a hollow area, and the orthographic projection of the first radiation sheet falls into the hollow area, so that the edge of the first radiation sheet is arranged opposite to the edge of the hollow area.

5. The antenna module according to claim 3, characterized in that: The microstrip line and the first radiation plate are arranged opposite to each other along the stacking direction through the first ceramic dielectric layer to achieve coupled feeding.

6. The antenna module according to claim 5, characterized in that: The relative distance between the microstrip line and the first radiation plate along the stacking direction is in millimeter order.

7. The antenna module according to claim 4, characterized in that: The microstrip line is flush with the surface of the circuit board.

8. The antenna module according to claim 7, characterized in that: The soldering foot is disposed adjacent to the short side of the first radiation sheet, and the distance between the soldering foot and the short side of the first radiation sheet is greater than the distance between the long side of the first radiation sheet and the adjacent edge of the hollow area.

9. The antenna module according to claim 8, characterized in that: Each of the antenna components is provided with four welding feet, which are respectively arranged adjacent to the four vertex corners of the hollow area.

10. A communication device, characterized in that: An antenna module comprising any one of claims 3 to 9.

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