Electric connector and connector of electric connector and circuit substrate

Abstract

The invention provides an electric connector which can ensure the functions of a signal contact part and a grounding contact part and stabilize the grounding electric connection between the electric connector and a circuit substrate. The electric connector is provided with a plurality of signal contact parts (13), a plurality of ground contact parts (15), a wafer (11) for supporting the plurality of signal contact parts (13) and the plurality of ground contact parts (15), a collator (30) which is mounted on the wafer (11) and is electrically connected with the plurality of ground contact parts (15), and at least one ground plate (40) which is mounted on the collator (30) and is electrically connected with the collator (30). A plurality of plate springs (42) are formed on the ground plate (40) as a plurality of spring bodies in contact with the circuit board (20).

Description

Technical Field

[0001] The present invention relates to an electrical connector connected to a substrate. Background Art

[0002] For servers and routers of connection systems used for data communication purposes in data centers, it is sometimes required to connect two circuit substrates that are 90 degrees to each other. In this case, a male connector and a female connector serving as electrical connectors are connected to each of the two circuit substrates, and the male connector and the female connector are connected to each other, thereby connecting the two circuit substrates to each other. Such electrical connectors are disclosed in, for example, Patent Document 1 and Patent Document 2, but signal contacts for transmitting signals and ground contacts for grounding (GND) are arranged at a high density. The electrical connectors of Patent Document 1 and Patent Document 2 are constructed by stacking the required number of wafers that support the signal contacts and the ground contacts. An example of a wafer is described in detail in, for example, Patent Document 3. Prior Art Literature Patent Literature

[0003] Patent Document 1: Japanese Patent Application No. 2005-527068; Patent Document 2: Japanese Patent Application No. 2008-535185; Patent document 3: Japanese Patent Application Publication No. 2021-2465. Summary of the invention Problems to be solved by the invention

[0004] Regarding a connection body of an electrical connector and a circuit substrate having a high density of signal contacts and ground contacts, which is required to have a higher data transmission speed, it is necessary to ensure the functions of the connection portion of the signal contact and the other signal contact and at the same time stabilize the electrical connection of the ground between the electrical connector and the circuit substrate. Therefore, an object of the present invention is to provide an electrical connector that can ensure the functions of a signal contact portion and a ground contact portion and stabilize the electrical connection of the ground between the electrical connector and a circuit board. Solutions to Solve Problems

[0005] The electrical connector of the present invention comprises a plurality of signal contacts, a plurality of ground contacts, and a chip supporting the plurality of signal contacts and the plurality of ground contacts. The electrical connector further comprises an organizer mounted on the chip and conducting with the plurality of ground contacts, and at least one grounding component mounted on the organizer and conducting with the organizer, wherein the grounding component is formed with a plurality of spring bodies connected with a circuit board.

[0006] In the electrical connector of the present invention, preferably, each of the spring bodies is formed into a cantilever support structure, and at least a portion of the cantilever support structure extends in a direction approaching the circuit board.

[0007] In the electrical connector of the present invention, preferably, each of the spring bodies is composed of a spring body extending in the lateral direction and a spring body extending in the longitudinal direction.

[0008] In the electrical connector of the present invention, preferably, at least one spring body is formed for the pair of signal contact portions.

[0009] In the electrical connector of the present invention, it is preferable that each of the plurality of ground contacts is a press-fit type contact.

[0010] In the electric connector of the present invention, preferably, the finisher includes: a conductive film formed on the conducting portion with the ground contact portion and the mounting portion with the ground member; and a molded body made of an electrically insulating material supporting the conductive film.

[0011] The present invention provides a connection body of any one of the above-described electric connectors and a circuit substrate, wherein the circuit substrate has a signal electrode and a ground electrode, the signal contact portion of the electric connector is electrically connected to the signal electrode of the circuit substrate, and the ground contact portion of the electric connector is electrically connected to the ground electrode of the circuit substrate. Effects of the Invention

[0012] The electrical connector of the present invention comprises an organizer mounted on a wafer and electrically connected to a plurality of grounding contacts, and at least one grounding member mounted on the organizer and electrically connected to the organizer, wherein the grounding member is formed with a plurality of spring bodies connected to a circuit substrate. According to the electrical connector of the present invention, the functions of the signal contact and the grounding contact can be ensured and the electrical connection of the ground between the organizer and the circuit substrate can be stabilized. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a diagram showing the electric connector according to the first embodiment. Figure 2 It is a diagram showing the relationship between the electric connector and the circuit board according to the first embodiment. Figure 3 It is a diagram showing the relationship between the ground member and the ground of the circuit board according to the first embodiment. Figure 4 1 is a diagram showing an electric connector according to a first embodiment, in which a grounding member is provided at a grounding location of a circuit board. Figure 5 It is a perspective view showing a part of the circuit board according to the first embodiment. Figure 6It is a perspective view showing a signal contact portion, a ground contact portion, and a part of a finisher of the electrical connector according to the first embodiment. Figure 7 It is a diagram showing a finisher and a grounding member according to the first embodiment. Figure 8 It is a diagram showing a finisher and a grounding member according to a second embodiment. Fig. 9 It is a diagram showing a finisher and a grounding member according to a third embodiment. Fig.10 It is a perspective view showing a part of a signal contact portion, a ground contact portion, an organizer, and a ground member of an electrical connector according to a fourth embodiment. DETAILED DESCRIPTION

[0014] Hereinafter, a connection body of an electric connector and a circuit board according to an embodiment of the present invention will be described with reference to the drawings. This connection means both electrical connection and mechanical connection. (First embodiment: refer to Figure 1 to Figure 7 ) The electrical connector 10 of the first embodiment is as follows Figure 1 As shown in FIG. 1 , a chip 11, a plurality of signal contacts 13, a plurality of ground contacts 15 and an arranger 30 are provided. Figure 2 As shown, the electrical connector 10 is connected to the circuit substrate 20 to form a connector. Although not shown in the figure, as an example, the electrical connector 10 and another electrical connector are mated with each other to form a DPO (Direct Plug Orthogonal) in which the circuit substrate 20 and the other circuit substrate are orthogonal to each other. In the DPO, the electrical signal sent and received between the circuit substrate 20 of the connector of this embodiment and the circuit substrate of another connector is transferred between the electrical connector 10 and the other electrical connector. The electrical connector 10 in this embodiment includes an organizer 30 that is conductive with a plurality of grounding contact portions 15, and at least one grounding plate 40 as a grounding component that is mounted on the organizer 30 and conductive with the organizer 30. The grounding plate 40 as a grounding component is formed with a plurality of leaf springs 42 as a plurality of spring bodies that are connected to the circuit substrate 20.

[0015] [Electrical connector 10: Figure 1 , Figure 2 , Figure 3 , Figure 6 ] The electrical connector 10 is formed by stacking a plurality of wafers 11. The wafer 11 is provided with two wiring boards and two shielding boards. The wiring boards and the shielding boards are formed into a substantially rectangular shape in a plan view. The two wiring boards are plate-shaped components in which metal wiring composed of a plurality of individual wirings arranged is insert-molded in a resin board. At one end of each individual wiring constituting the metal wiring, a contact portion is formed to contact with a contact portion of another electrical connector as a counterpart connector. In addition, at the other end of each individual wiring, a plurality of crimping type signal contact portions 13 ( Figure 2 ). In addition, the signal electrode pad 23 corresponds to the signal electrode of the present invention. The two shielding plates are arranged so as to sandwich the two wiring boards in an overlapping state from both sides. On one side of each of the two shielding plates, a plurality of grounding contacts connected to the grounding contacts of another electrical connector to be mated are arranged. Figure 3 ), a plurality of ground contact portions 15 inserted into a plurality of through-hole electrodes 25 serving as a plurality of ground electrodes are arranged on the other side of the circuit board 20. The through-hole electrodes 25 function as ground electrodes formed on the circuit board 20.

[0016] As an example, the signal contact portion 13 is a contact portion of a crimping type (Spring Contact). In the signal contact portion 13, the contact portion side is the front end. In the process of assembling the electrical connector 10 and the circuit substrate 20, if the contact portion is pressed against the signal electrode pad 23, the contact portion and the signal electrode pad 23 are crimped. The signal contact portion 13 is formed by, for example, punching and bending a plate material made of a copper alloy having excellent electrical conductivity and elasticity. The ground contact portion 15 is also formed in the same manner.

[0017] As an example, the ground contact portion 15 is a press fit type contact portion. The ground contact portion 15 is also called a needle-eye type, such as Figure 6 As shown, the fisheye terminal 15A is composed of a guide portion 15B connected to one side of the fisheye terminal 15A, and a base portion 15C connected to the other side of the fisheye terminal 15A. The fisheye terminal 15A has a pair of elastic crimping pieces 15A1, 15A1 and a gap 15A2 sandwiched between the elastic crimping pieces 15A1, 15A1. The elastic crimping pieces 15A1, 15A1 respectively form a supporting structure at both ends, sandwich the gap 15A2 and are bent outward in an arc shape. Therefore, the elastic crimping pieces 15A1, 15A1 sandwich the gap 15A2 and can bend inward or outward and deform elastically. When the ground contact portion 15 is inserted into the through-hole electrode 25 , the elastic pressure-bonding pieces 15A1 , 15A1 are elastically deformed inward with the gap 15A2 as a bending gap, and the outer peripheral surfaces of the elastic pressure-bonding pieces 15A1 , 15A1 are pressed against the through-hole electrode 25 by the reaction force.

[0018] [Circuit board 20: see Figure 2 , Figure 3 , Figure 5 ] The circuit board 20 includes a board body 21 having a main surface 21A and a back surface 21B, a plurality of signal electrode pads 23 formed on the main surface 21A of the board body 21 , and a plurality of through-hole electrodes 25 formed to penetrate the main surface 21A and the back surface 21B of the board body 21 .

[0019] A plurality of substrate materials are stacked to form the substrate main body 21. The substrate material has formed therein a signal path (not shown) connected to a plurality of signal electrode pads 23 formed on the main surface 21A. The substrate body 21 has a conductive film CP formed by, for example, plating on the main surface 21A except around a pair of adjacently arranged signal electrode pads 23, 23 and around the opening of a non-plated through hole (Non Plated Through Hole).

[0020] The signal contact portion 13 of the electrical connector 10 assembled on the circuit substrate 20 is pressed against the signal electrode pad 23, thereby transmitting and receiving electrical signals between the electrical connector 10 and the circuit substrate 20. Figure 2 , Figure 3 , Figure 5 In the embodiment, the signal electrode pads 23 are recorded on the main surface 21A of the substrate body 21, but a signal path related to the transmission and reception of electric signals, which is electrically connected to each of the plurality of signal electrode pads 23, is formed inside the substrate body 21 along the plane direction of the substrate body 21. The signal path is formed avoiding the through-hole electrode 25.

[0021] In addition, an example of using the signal electrode pad 23 to electrically connect to the pressure-contact type signal contact portion 13 is shown here, but the signal contact portion 13 may be a press-fit type like the ground contact portion 15, and the press-fit type signal contact portion 13 may be inserted into a through-hole electrode formed on the circuit board 20. However, if the signal electrode pad 23 is used, it is not necessary to form a through hole in the substrate body 21, so it is advantageous in ensuring the mechanical strength of the substrate body 21. In addition, even if the signal electrode pad 23 is formed on the main surface 21A, a signal path can be formed inside the substrate body 21.

[0022] like Figure 5 As shown, the through hole electrode 25 is formed by the through hole TH formed in the substrate body 21 and the conductive film CP formed by, for example, plating, on the wall surface surrounding the through hole TH in the thickness direction of the substrate body 21. The conductive film CP is usually also formed around the opening of the through hole electrode 25 on the main surface 21A and the back surface 21B. If the ground contact portion 15 is inserted into the through-hole electrode 25, Figure 6 The elastic pressure contact pieces 15A1, 15A1 of the fisheye terminal 15A are elastically deformed toward the inner gap. Due to the reaction force, the outer peripheral surfaces of the elastic pressure contact pieces 15A1, 15A1 are pressed against the conductive film CP of the through-hole electrode 25, thereby achieving grounding (GND) between the electrical connector 10 and the circuit board 20.

[0023] [Finisher 30: Refer to Figure 6 , Figure 7 ] The finisher 30 functions as a ground (GND) with the ground contact portion 15 via a ground plate 40 as a ground member, and both have the same potential. The finisher 30 is formed as a whole by injection molding a resin material as an electrical insulating material, for example. In addition, the finisher 30 has a conductive film CP formed by plating formed at a conductive portion with the ground contact portion 15 and a mounting portion with the ground plate 40 as a grounding member. In this embodiment, the conductive film CP formed by plating is formed on the entire surface of the finisher 30. The plating forming the conductive film CP is preferably a well-known plating such as gold plating or silver plating. In addition, the conductive film CP is not limited to the plated conductive film CP, and a conductive film CP formed by other methods (such as evaporation, sputtering, etc.) can be applied. The signal electrode pad 23 is also formed of the same conductive film. In addition, for the convenience of explanation, Figure 6 As shown in FIG. 1 , a lateral direction W, a longitudinal direction D and a height direction H are defined.

[0024] Finisher 30 Figure 7 As shown, the organizer body 31, the storage space 32, the insertion through hole 33 and the gap 34 are provided. The storage space 32, the insertion through hole 33 and the gap 34 are arranged in a grid or matrix along the lateral direction W and the longitudinal direction D, respectively.

[0025] The accommodation space 32 is a gap that penetrates in the height direction H, and the pair of signal contacts 13 , 13 are accommodated in the gap. The opening shape of the insertion through hole 33 is rectangular, and it penetrates the front and back surfaces of the organizer 30 and allows the ground contact portion 15 to be inserted through. The insertion through holes 33 are provided two by two, and two insertion through holes 33 are provided at intervals along the longitudinal direction D. Therefore, as a whole, a plurality of insertion through holes 33 are arranged side by side along the longitudinal direction D and the transverse direction W. In addition, although not shown in the figure, the organizer 30 has a press-in support portion for the base 15C of the ground contact portion 15 to be pressed in deeper than the insertion through hole 33. Regarding the press-in support portion, the base 15C is mechanically restricted as soon as it is pressed in, thereby positioning the ground contact portion 15. In addition, by pressing the base 15C of the ground contact portion 15 into the press-in support portion, the conductive film CP formed on the entire surface of the organizer 30 is electrically connected to the ground contact portion 15. The gap portion 34 is a gap that penetrates in the height direction H, and a ground plate 40 as a ground member is mounted in the gap.

[0026] [Ground plate 40: Figure 3 , Figure 4 , Figure 7 ] The ground plate 40 as a ground member functions as a ground (GND) with the ground contact portion 15 via the conductive film CP formed on the finisher 30 , and both have the same potential. The ground plate 40 is Figure 7 As shown, the ground plate main body 41 , a plurality of leaf springs 42 as a plurality of spring bodies in contact with the circuit board 20 , and a plurality of mounting portions 43 are provided. The ground plate 40 is formed by, for example, punching and bending a plate material made of a copper alloy having excellent electrical conductivity and elasticity.

[0027] In the present embodiment, when the grounding plate main body 41 is viewed from above, the grounding plate main body 41 is formed in a roughly ladder shape. The ladder-shaped grounding plate main body 41 is formed by a transverse member 45 corresponding to the steps of the ladder and a longitudinal member 46 corresponding to the pillars of the ladder. In the present embodiment, the ladder-shaped grounding plate main body 41 is formed by nine transverse members 45 and two longitudinal members 46. A plurality of transverse members 45 are arranged at equal intervals from each other along the longitudinal direction D. A pair of longitudinal members 46 are connected to both ends of the plurality of transverse members 45 in the transverse direction W. The opening surrounded by two adjacent transverse members 45 and two longitudinal members 46 of the grounding plate main body 41 is a configuration space 44 in which the storage spaces 32 and two insertion through holes 33 arranged side by side along the transverse direction W are configured. A plurality of configuration spaces 44 are configured along the longitudinal direction D of the grounding plate main body 41. The transverse member 45 is provided roughly parallel to the storage spaces 32 and two insertion through holes 33 arranged side by side along the transverse direction W.

[0028] The lateral member 45 is provided with a plurality of leaf springs 42 as a plurality of spring bodies in contact with the circuit substrate 20 and two mounting portions 43. When the ground plate 40 is mounted on the organizer 30, a leaf spring 42 is formed on the longitudinal direction D side of the storage space 32 for accommodating a pair of signal contacts 13, 13. A leaf spring 42 is formed for a pair of signal contacts 13, 13 arranged in a plurality of pairs along the longitudinal direction D, so that leaf springs 42 are arranged on both sides of the pair of signal contacts 13, 13 in the longitudinal direction D. In addition, grounding contacts 15 are arranged on both sides of the pair of signal contacts 13, 13 in the lateral direction W, so that when the electrical connector 10 and the circuit substrate 20 are connected, grounding between the electrical connector 10 and the circuit substrate 20 is performed in a manner surrounding the connection portion between the signal contacts 13 and the signal electrode pads 23. As a result, the connection body of the electrical connector 10 and the circuit substrate 20 has a shielding function around the signal contact area, and impedance adjustment can be performed.

[0029] In this embodiment, the leaf spring 42 is formed into a cantilever support structure, and the free end of the cantilever support structure extends in a manner close to the circuit substrate 20. Figure 4 As shown, when the electric connector 10 and the circuit substrate 20 are connected, the free end side of the leaf spring 42 of the cantilever support structure contacts the conductive film CP formed on the main surface 21A of the circuit substrate 20, thereby grounding between the electric connector 10 and the circuit substrate 20. If the leaf spring 42 contacts the circuit substrate 20 at any position in the lateral direction W of a portion of the cantilever support structure extending in a manner close to the circuit substrate 20, the grounding is effective, thereby improving the reliability of the electrical connection. In addition, in the present embodiment, the free end of the cantilever support structure extends in a manner close to the circuit substrate 20, but it is not limited to this. For example, a portion of the cantilever support structure may extend in a manner close to the circuit substrate 20, and the rear thereof may be a structure such that the front end side of the free end hangs down, and at least a portion of the cantilever support structure extends in a manner close to the circuit substrate 20. Furthermore, when the electric connector 10 and the circuit board 20 are connected, the free end side of the leaf spring 42 of the cantilever support structure is pressed against the circuit board 20 , so stress is generated in the leaf spring 42 of the cantilever support structure.

[0030] In this embodiment, the leaf spring 42 is shaped so that the front end tapers toward the free end of the cantilever support structure. For such a leaf spring 42, the rigidity of the leaf spring 42 in the thickness direction decreases from the support end toward the free end. Therefore, when the leaf spring 42 is pressed against the circuit substrate 20, the area closer to the free end with less rigidity bends in the shape of the circuit substrate 20, so that it is easy to make surface contact with the circuit substrate 20. In addition, there is a support end portion with greater rigidity, so that the pressure of contact with the circuit substrate 20 can be ensured, so that stable surface contact between the leaf spring 42 and the circuit substrate 20 can be achieved, and stable electrical connection between the connecting portion of the electrical connector 10 and the circuit substrate 20 can be maintained.

[0031] When the electric connector 10 and the circuit board 20 are connected by the leaf spring 42, even if the connection portion between the electric connector 10 and the circuit board 20 is deformed due to thermal expansion and thermal contraction caused by temperature changes or vibration, the leaf spring 42 will not be deformed. Figure 4 The plate spring 42 also elastically deforms to follow the displacement in the height direction H, thereby maintaining the grounding function between the electrical connector 10 and the circuit substrate 20, such as the connection portion around the signal contact portion 13 and the signal electrode pad 23. Therefore, the ground plate 40 as the grounding member can maintain a stable electrical connection between the finisher 30 formed with the conductive film CP and the conductive film CP formed on the main surface 21A of the circuit substrate 20.

[0032] In addition, when the electric connector 10 and the circuit substrate 20 are connected, a reaction force that attempts to separate the electric connector 10 and the circuit substrate 20 is generated by the leaf spring 42 of the ground plate 40. However, when the ground contact portion 15 is inserted into the through-hole electrode 25, the elastic pressure contact pieces 15A1, 15A1 of the fisheye terminal portion 15A are elastically deformed toward the inner gap, and due to the reaction force, the outer peripheral surfaces of the elastic pressure contact pieces 15A1, 15A1 are pressed against the conductive film CP of the through-hole electrode 25, thereby generating a holding force of the connection portion between the electric connector 10 and the circuit substrate 20 relative to the reaction force generated by the leaf spring 42 of the ground plate 40.

[0033] In this embodiment, the ground contact portion 15 of the press-fit type and the signal contact portion 13 of the crimp type are shown as examples of electrical connection, but as described above, by making the signal contact portion 13 of the press-fit type like the ground contact portion 15, the holding force of the connection portion between the electric connector 10 and the circuit board 20 can be further enhanced against the reaction force generated by the leaf spring 42 of the ground plate 40. As a result, the connection portion between the electric connector 10 and the circuit board 20 can maintain electrical connection more stably.

[0034] The ground plate 40 is mounted on the finisher 30 by inserting the mounting portion 43 into the gap portion 34 of the finisher 30. Figure 7As shown, the mounting portion 43 is formed in a manner extending perpendicularly to the plane of the lateral member 45. In the present embodiment, two mounting portions 43 are formed for one lateral member 45. In addition, in order to improve the mounting stability when the mounting portion 43 is inserted into the gap portion 34 of the organizer 30, the mounting portion 43 is formed with a protrusion 43A near the center of the mounting portion 43 in the height direction H and the lateral direction W. In the present embodiment, one protrusion 43A is formed on one mounting portion 43, but in order to further improve the mounting stability, two or more protrusions 43A may be formed on one mounting portion 43.

[0035] When the ground plate 40 is viewed from above, a leaf spring 42 is formed on one side of the transverse member 45 in the longitudinal direction D, and a mounting portion 43 is formed on the other side of the transverse member 45 in the longitudinal direction D. The leaf springs 42 and the mounting portions 43 are alternately formed in the transverse direction W of the transverse member 45. In addition, when the ground plate 40 is mounted on the finisher 30, the mounting portions 43 are formed on the longitudinal direction D sides of the two ground contact portions 15.

[0036] One ground plate 40 is attached to one finisher 30. Therefore, the process of attaching the ground plate 40 to the finisher 30 is simplified.

[0037] [Effects of the electrical connector 10] The electrical connector 10 according to the first embodiment described above achieves the following effects. The electrical connector 10 includes at least one ground plate 40 as a ground member that is mounted on the finisher 30 and is electrically connected to the finisher 30 . The ground plate 40 as the ground member is formed with a plurality of leaf springs 42 as a plurality of spring bodies.

[0038] Thus, when the electric connector 10 and the circuit board 20 are connected, even if there is a slight displacement of the connection portion between the electric connector 10 and the circuit board 20 due to thermal expansion and thermal contraction caused by temperature change or vibration, the leaf spring 42 elastically deforms to follow the displacement, thereby maintaining the grounding function between the electric connector 10 and the circuit board 20, such as the connection portion around the signal contact portion 13 and the signal electrode pad 23. Therefore, the ground plate 40 as a grounding member can maintain a stable electrical connection between the finisher 30 formed with the conductive film CP and the circuit board 20.

[0039] In the electrical connector 10 , each of the plurality of leaf springs 42 as the plurality of spring bodies is formed into a cantilever support structure, and at least a portion of the cantilever support structure extends so as to approach the circuit board 20 . Thus, when the spring 42 contacts the circuit board 20 at any position in the lateral direction W in a portion of the cantilever support structure extending close to the circuit board 20 , grounding is performed, thereby improving reliability of electrical connection.

[0040] In the electrical connector 10, the leaf spring 42 is shaped so that the front end tapers toward the free end of the cantilever support structure. For such a leaf spring 42, the rigidity of the leaf spring 42 in the thickness direction decreases from the support end toward the free end. Therefore, when the leaf spring 42 is pressed against the circuit substrate 20, the area closer to the free end with less rigidity bends in the shape of the circuit substrate 20, so that it is easy to make surface contact with the circuit substrate 20. In addition, there is a support end portion with greater rigidity, so that the pressure of contact with the circuit substrate 20 can be ensured, so that stable surface contact between the leaf spring 42 and the circuit substrate 20 can be achieved, and stable electrical connection of the connecting portion between the electrical connector 10 and the circuit substrate 20 can be maintained.

[0041] The leaf spring 42 is formed into a cantilever support structure, and at least a part of the cantilever support structure extends in a manner close to the circuit board 20, but is not limited thereto. The leaf spring 42 may also be formed into a two-end support structure, and at least a part of the leaf spring of the two-end support structure is formed in a manner close to the circuit board 20. Even in the structure of the leaf spring of the two-end support structure, the same effect as the leaf spring 42 of the cantilever support structure is achieved.

[0042] In the electrical connector 10 , each of the ground contacts 15 is a press-fit type contact. This can generate a holding force at the connection portion between the electric connector 10 and the circuit board 20 .

[0043] In the electric connector 10 , the finisher 30 includes a conductive film CP formed at a conductive portion with the ground contact portion 15 and a mounting portion of the ground plate 40 as a ground member, and a molded body made of an electrically insulating material that supports the conductive film CP. Thus, the finisher 30 can be integrally formed by injection molding a resin material that is an electrically insulating material, and the conductive film CP can be formed on a portion of the finisher 30. Such a finisher 30 is more cost-effective than a finisher 30 entirely made of a conductive material.

[0044] In addition to the above, the configurations listed in the above embodiments may be selected or eliminated, or may be appropriately changed to other configurations without departing from the spirit of the present invention. The present invention can only be applied to the connection between the electric connector 10 and the circuit board 20. That is, the electric connector 10 is not limited to being mated with another electric connector assembled with another circuit board, but can be mated with an electric connector not connected to a circuit board.

[0045] Although an example of the finisher 30 is shown as a composite body in which a conductive film CP is formed on a molded body made of a resin material, the present invention can also form the entire finisher 30 from a conductive material. In this case, the finisher 30 can be obtained by injection molding a conductive resin material, or by MIM (metal injection molding) of a conductive metal powder. The conductive resin material can be obtained by dispersing conductive powder, fibers, etc. in the resin material instead of the resin material itself having conductivity.

[0046] (Second embodiment: refer to Figure 8 ) The ground plate 50 mounted on the electrical connector 10 of the second embodiment is different from the ground plate 40 mounted on the electrical connector 10 of the first embodiment, which is formed integrally, and is formed in a divided manner along the longitudinal direction D, and a plurality of ground plates 50 are mounted on the electrical connector 10. Figure 8 As shown, the ground plate 50 includes a ground plate main body 51 , a plurality of leaf springs 52 as a plurality of spring bodies, and a mounting portion 53 . In such a ground plate 50, when the electric connector 10 and the circuit substrate 20 are connected, even if thermal expansion and thermal contraction or vibration caused by temperature changes occur along the connection portion between the electric connector 10 and the circuit substrate 20, Figure 8 The plate spring 52 also elastically deforms to follow the displacement in the height direction H, thereby maintaining the grounding function between the electrical connector 10 and the circuit substrate 20, such as the connection portion around the signal contact portion 13 and the signal electrode pad 23. Therefore, the ground plate 50 as the grounding member can maintain a stable electrical connection between the finisher 30 formed with the conductive film CP and the conductive film CP formed on the main surface 21A of the circuit substrate 20.

[0047] In addition, the ground plate 40 involved in the first embodiment is formed in one piece, but the ground plate 50 involved in the second embodiment is formed in a divided manner along the longitudinal direction D. In this embodiment, the ground plate 50 is divided into nine pieces along the longitudinal direction D. The ground plate 50 is formed in such a manner that one ground plate 50 corresponds to one row of accommodation spaces 32 for accommodating a pair of signal contact portions 13, 13 arranged along the lateral direction W of the organizer 30. In the ground plate 40 involved in the first embodiment, it is necessary to process a component with a larger area when the ground plate 40 is viewed from above as a whole, but the ground plate 50 involved in the second embodiment is a component with a smaller area, so a small processing device can be used. In addition, each ground plate 50 is smaller than the ground plate 40, so the processing accuracy can be stabilized, which is more advantageous than the ground plate 40 involved in the first embodiment in terms of the cost generated by the processing process.

[0048] (Third embodiment: refer to Fig. 9 ) The grounding plate 60 mounted on the electrical connector 10 of the third embodiment is different from the grounding plate 40 mounted on the electrical connector 10 of the first embodiment, which is formed integrally, and is divided along the longitudinal direction D and divided along the transverse direction W, and a plurality of grounding plates 60 are mounted on the electrical connector 10. Fig. 9 As shown, the ground plate 60 includes a ground plate main body 61 , a plurality of leaf springs 62 as a plurality of spring bodies, and a mounting portion 63 . In such a ground plate 60, when the electrical connector 10 and the circuit board 20 are connected, even if the ground plate 60 is connected along the Fig. 9 When a small displacement of the connection portion between the electric connector 10 and the circuit substrate 20 is caused by thermal expansion and thermal contraction or vibration due to temperature changes in the height direction H, the leaf spring 62 also elastically deforms to follow the displacement in the height direction H, thereby maintaining the grounding function between the electric connector 10 and the circuit substrate 20, such as the connection portion around the signal contact portion 13 and the signal electrode pad 23. Therefore, the grounding plate 60 as a grounding member can maintain a stable electrical connection between the finisher 30 formed with the conductive film CP and the conductive film CP formed on the main surface 21A of the circuit substrate 20.

[0049] In addition, the ground plate 40 involved in the first embodiment is formed in one piece, but the ground plate 60 involved in the third embodiment is formed by being divided into a plurality of pieces along the longitudinal direction D and divided into two pieces along the transverse direction W. In this embodiment, the ground plate 60 is divided into nine pieces along the longitudinal direction D and divided into two pieces along the transverse direction W. The ground plate 60 is formed so that one ground plate 60 corresponds to the adjacent accommodation spaces 32, 32 of the adjacent accommodation spaces 32 for accommodating a pair of signal contacts 13, 13 arranged along the transverse direction W of the organizer 30. The ground plate 50 involved in the second embodiment is formed so that one ground plate 50 corresponds to one row of accommodation spaces 32, and the ground plate 60 involved in the third embodiment is a member processed with about half the area of ​​the ground plate 50 involved in the second embodiment. As a result, a small processing device can be used, and each ground plate 60 is smaller than the ground plate 50, so the processing accuracy can be further stabilized, and the processing cost becomes more advantageous than the ground plate 50 involved in the second embodiment.

[0050] (Fourth embodiment: refer to Fig.10 ) The leaf spring 42 of the ground plate 40 according to the first embodiment extends in the lateral direction W. In contrast, the leaf spring 72 of the ground plate 70 mounted on the electrical connector 10 according to the fourth embodiment is composed of a leaf spring 72A extending in the longitudinal direction D and a leaf spring 72B extending in the lateral direction W. Fig.10 As shown, the ground plate 70 includes a ground plate body 71, a plurality of leaf springs 72 as a plurality of spring bodies, and a plurality of mounting portions 73. In the present embodiment, the plurality of leaf springs 72 are formed by leaf springs 72A extending in the longitudinal direction D and the height direction H and leaf springs 72B extending in the lateral direction W and the height direction H. The plurality of leaf springs 72A are arranged in parallel in the same direction as the ground contact portions 15 arranged in parallel in the longitudinal direction D. The electrical connection portions between the ground contact portions 15 and the through-hole electrodes 25 and between the leaf springs 72A and the conductive film CP of the main surface 21A of the circuit substrate 20 are arranged at a high density. When the ground plate 70 is viewed from above, one of the adjacent pair of signal contact portions 13B, 13B is closer to the pair of signal contact portions 13A, 13A than the adjacent pair of signal contact portions 13C, 13C. Therefore, in order to make the grounding function reliably, the ground contact portions 15 and the leaf springs 72A are arranged at a high density between the signal contact portions 13A and the signal contact portions 13B.

[0051] The ground plate 70 according to the present embodiment is processed integrally similarly to the ground plate 40 according to the first embodiment, so the process of attaching the ground plate 70 to the finisher 30 is simplified. Description of Reference Numerals

[0052] 10Electrical connector 11 chips 13Signal contact part 15 ground contact 15A fisheye terminal 15A1 elastic crimping piece 15A2 Gap 15B Guide 15C base 20 Circuit board 21Substrate body 21A Main surface 21B back 23Signal electrode pad 25 through-hole electrodes 30. Finisher 31 Organizer body 32Accommodation space 33 Insert through hole 34 gap 40 ground plate 41 Ground plate body 42 leaf spring 43 Installation Department 44 Configuration Space 45 Transverse member 50 ground plate 51 ground plate body 52 leaf spring 53 Installation Department 60 ground plate 61 ground plate body 62 leaf spring 63 Installation Department 70 ground plate 71 ground plate body 72 leaf spring 73 Installation Department CP conductive film TH through hole D Longitudinal direction HHeight direction W Horizontal direction

Claims

1. An electrical connector connected to a circuit substrate, comprising: a plurality of signal contacts; a plurality of ground contacts; A wafer supporting a plurality of the signal contacts and a plurality of the ground contacts; an arranger mounted on the wafer and in electrical communication with the plurality of ground contacts; and at least one grounding member mounted on the finisher and electrically connected to the finisher, The grounding member is formed with a plurality of spring bodies that are in contact with the circuit substrate.

2. The electrical connector according to claim 1, wherein: Each of the plurality of spring bodies is formed into a cantilever support structure, and at least a portion of the cantilever support structure extends in a direction approaching the circuit substrate.

3. The electrical connector according to claim 2, wherein: Each of the plurality of spring bodies, The spring body extends in the transverse direction (W), and The spring body is formed extending in a longitudinal direction (D).

4. The electrical connector according to claim 1, wherein: At least one of the spring bodies is formed for a pair of the signal contacts.

5. The electrical connector according to claim 1, wherein: Each of the plurality of ground contacts is a press-fit type contact.

6. The electrical connector according to claim 1, wherein: The organizer has: a conductive film formed on a conductive portion connected to the ground contact portion and a mounting portion connected to the ground member; and A formed body made of an electrically insulating material that supports the conductive film.

7. A connection body of an electric connector and a circuit substrate, which is a connection body of a circuit substrate and the electric connector according to any one of claims 1 to 6, The circuit substrate includes a signal electrode and a ground electrode. The signal contact portion of the electrical connector is electrically connected to the signal electrode of the circuit substrate. The ground contact portion of the electrical connector is electrically connected to the ground electrode of the circuit substrate.

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