Conductive device

Abstract

The invention relates to the technical field of electric conduction, in particular to an electric conduction device which is provided with a first packaging layer, a second packaging layer and an electric conduction function layer. The conductive function layer is located between the first packaging layer and the second packaging layer, and the conductive function layer comprises a conductive circuit and a pressure-sensitive device; the pressure-sensitive device is connected to the conductive circuit, and the resistance value of the pressure-sensitive device is configured to be gradually reduced along with the increase of stress; the conductive circuit is configured to be switched on when the resistance value of the pressure-sensitive device reaches a threshold resistance value. The conductive device achieves the effect of preventing mistaken touch, and can improve the sensitivity.

Description

Technical Field

[0001] The present disclosure relates to the field of conductive technology, and in particular to a conductive device. Background Art

[0002] In-mold electronics (IME) is a combination of traditional in-mold decoration technology and flexible printed circuits, which can produce 3D shapes with embedded circuits of varying complexity. The stretchability of printed wires during high-temperature 3D molding is the key to the successful preparation of in-mold electronics (IME) devices.

[0003] Smart surfaces with touch functions are increasingly being used in car interiors. Currently, the main touch button solution is capacitive buttons. However, a single capacitive touch button can only realize a single switch function, cannot achieve multi-level control, and has the risk of accidental touch. It is prone to failure in complex environments such as when there is water on the surface, which affects the user experience and the convenience and safety of use. In related technologies, a micro-strain sensor is attached to the back of the decorative part, and the touch pressure is detected by detecting the deformation of the decorative part. However, the thickness of the decorative part (usually greater than 3mm) will seriously affect the sensitivity of the touch.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0005] The purpose of the present disclosure is to overcome the above-mentioned deficiencies of the prior art and provide a conductive device that can achieve the effect of preventing accidental touches and improve sensitivity.

[0006] According to one aspect of the present disclosure, there is provided a conductive device having:

[0007] A first encapsulation layer;

[0008] A second encapsulation layer;

[0009] A conductive functional layer; the conductive functional layer is located between the first packaging layer and the second packaging layer, and the conductive functional layer includes a conductive circuit and a pressure-sensitive device; the pressure-sensitive device is connected to the conductive circuit, and the pressure-sensitive device is configured to gradually reduce resistance as the force increases; the conductive circuit is configured to be turned on when the resistance of the pressure-sensitive device reaches a threshold resistance.

[0010] In one embodiment of the present disclosure, the conductive device has a flat area and a non-flat area; the pressure sensitive device is located in the flat area.

[0011] In one embodiment of the present disclosure, the pressure-sensitive device includes a first conductive part and a second conductive part, and a pressure-sensitive layer connecting the first conductive part and the second conductive part;

[0012] The first conductive part and the second conductive part are both connected to the conductive circuit; the pressure-sensitive layer is configured so that its resistance gradually decreases as the force increases; and the conductive circuit is configured to be turned on when the resistance of the pressure-sensitive layer reaches a threshold resistance.

[0013] In one embodiment of the present disclosure, the first conductive part is a plate-like structure, the second conductive part is a plate-like structure, and the pressure-sensitive layer is located between the first conductive part and the second conductive part.

[0014] In one embodiment of the present disclosure, the orthographic projection of at least one of the first conductive portion and the second conductive portion on the first packaging layer is located within the orthographic projection of the pressure-sensitive layer on the first packaging layer and is smaller than the orthographic projection of the pressure-sensitive layer on the first packaging layer.

[0015] In one embodiment of the present disclosure, the first conductive part and the second conductive part form a planar interdigitated structure, the first conductive part and the second conductive part are arranged on the same layer, and the extension direction of the first conductive part is the same as the extension direction of the conductive circuit, and the pressure-sensitive layer is located on one side of the planar interdigitated structure.

[0016] In one embodiment of the present disclosure, the pressure-sensitive layer contains a conductive filler and an elastomer, and the mass ratio of the conductive filler to the elastomer is (1-40): (60-99);

[0017] The conductive filler includes at least one of graphene, carbon black, and carbon nanotubes, and the elastomer includes at least one of polyurethane, polypropylene, and polystyrene-polyisoprene-polystyrene.

[0018] In one embodiment of the present disclosure, the conductive filler is carbon black, and the elastomer is polyurethane.

[0019] In one embodiment of the present disclosure, the conductive filler is carbon nanotubes, and the elastomer is polyurethane.

[0020] In one embodiment of the present disclosure, the conductive filler is carbon black, and the elastomer is polystyrene-polyisoprene-polystyrene.

[0021] In one embodiment of the present disclosure, the distance between the upper surface of the pressure sensitive device and the upper surface of the first packaging layer is 10 μm to 2 mm.

[0022] In one embodiment of the present disclosure, the conductive device further comprises an electronic component group, and the electronic component group is located in the flattened area;

[0023] The electronic component group includes a first electronic component and a second electronic component, the first electronic component is located between the first packaging layer and the second packaging layer, and the first electronic component is connected to the conductive circuit, one end of the second electronic component is connected to the conductive circuit, and the other end is configured to be connected to an external control circuit after passing through the second packaging layer.

[0024] In one embodiment of the present disclosure, the conductive device further comprises an ink layer, and the ink layer is located between the conductive functional layer and the first encapsulation layer;

[0025] The ink layer has a marking area, and the orthographic projection of the marking area on the first packaging layer is located within the orthographic projection of the pressure sensitive device on the first packaging layer.

[0026] In one embodiment of the present disclosure, the conductive functional layer includes multiple groups of pressure-sensitive control units, each group of pressure-sensitive control units includes the conductive circuit and the pressure-sensitive device; the input end and the output end of the conductive circuit of each group of the pressure-sensitive control units are connected to different external control circuits.

[0027] In one embodiment of the present disclosure, the conductive device further includes a feedback element, and the feedback element corresponds one-to-one to the pressure-sensitive device; the feedback element is connected to the conductive circuit and is connected in series with the pressure-sensitive device, and the feedback element is configured to respond when the resistance value of the pressure-sensitive device reaches a threshold value.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification are used to explain the principles of the present disclosure. Obviously, the accompanying drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.

[0030] Figure 1 It is a schematic structural diagram of a conductive device in one embodiment of the present disclosure.

[0031] Figure 2 This is a schematic diagram of the structure of an ink layer in one embodiment of the present disclosure.

[0032] Figure 3 It is a schematic structural diagram of a conductive device in one embodiment of the present disclosure.

[0033] Figure 4 It is a schematic structural diagram of a conductive device in one embodiment of the present disclosure.

[0034] Figure 5 This is a schematic diagram of how the electrons of a pressure-sensitive device change with pressure in one embodiment of the present disclosure.

[0035] Figure 6 It is a schematic structural diagram of a conductive device in one embodiment of the present disclosure.

[0036] Figure 7 This is a schematic diagram of the structure of a pressure-sensitive device in one embodiment of the present disclosure.

[0037] Figure 8 It is a schematic structural diagram of a conductive device in one embodiment of the present disclosure.

[0039] 1. First packaging layer; 2. Second packaging layer; 3. Ink layer; 31. Marking area; 32. Light-transmitting area; 4. Conductive circuit; 5. Pressure-sensitive device; 51. First conductive part; 52. Second conductive part; 53. Pressure-sensitive layer; 531. Conductive filler; 532. Elastomer; 6. Second electronic component; 7. Feedback element; PZ, flat area; PB, non-flat area. DETAILED DESCRIPTION

[0040] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present disclosure will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted. In addition, the drawings are only schematic illustrations of the present disclosure and are not necessarily drawn to scale.

[0041] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the illustration to another component, these terms are used in this specification only for convenience, such as according to the orientation of the examples described in the drawings. It is understood that if the device of the illustration is turned upside down, the component described as "upper" will become the component "lower". When a structure is "on" other structures, it may mean that the structure is formed integrally on the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.

[0042] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may exist in addition to the listed elements / components / etc.; the terms "first", "second", etc. are used merely as labels and are not intended to limit the quantity of their objects.

[0043] Structure A is located on the side of structure B that is away from structure C. It can be understood that structure A is formed on the side of structure B that is away from structure C.

[0044] In the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0045] In-mold electronics (IME) is a combination of traditional in-mold decoration technology and flexible printed circuits, which can produce 3D shapes with embedded circuits of varying complexity. The stretchability of printed wires during high-temperature 3D molding is the key to the successful preparation of in-mold electronics (IME) devices.

[0046] Smart surfaces with touch functions are increasingly used in car interiors. Currently, the main touch button solution is capacitive buttons. However, a single capacitive touch button can only realize a single switch function, cannot achieve multi-level control, and has the risk of accidental touch. It is prone to failure in complex environments such as when there is water on the surface, which affects the user experience and the convenience and safety of use. In the related art, a micro-strain sensor is attached to the back of the decorative part (the conductive device in the present disclosure) to detect the deformation of the decorative part to detect the touch pressure. However, the thickness of the decorative part (usually greater than 3mm) will seriously affect the sensitivity of the touch.

[0047] In order to solve at least one of the above problems, the present disclosure provides a conductive device. Figure 1 and Figure 6 , including a first encapsulation layer 1 and a second encapsulation layer 2, and a conductive functional layer located between the first encapsulation layer 1 and the second encapsulation layer 2. The conductive functional layer includes a conductive circuit 4 and a piezoresistive device 5; the piezoresistive device 5 is connected to the conductive circuit 4, and the piezoresistive device 5 is configured to gradually decrease in thickness as the force increases, and the resistance of the piezoresistive device 5 gradually decreases as the thickness gradually decreases. It can be understood that the piezoresistive device 5 has a piezoresistive effect; the conductive circuit 4 is configured to be turned on when the resistance of the piezoresistive device 5 reaches a threshold resistance.

[0048] In the present disclosure, a pressure-sensitive device 5 having a characteristic of gradually decreasing resistance as the force increases is provided in the conductive device, and the change in its resistance is utilized so that the conductive circuit 4 is turned on only when the threshold resistance is reached, thereby reducing the possibility of false touch; in addition, the resistance of the pressure-sensitive device 5 changes with the pressure, and the current in the conductive circuit 4 also changes with the pressure. By utilizing this characteristic, the present disclosure can realize multi-level control according to the pressure acting on the conductive device, such as interconnecting with a speaker to control the volume, interconnecting with a window drive to control the raising and lowering of a window, etc.

[0049] In one embodiment of the present disclosure, the conductive device has multiple groups of pressure-sensitive control units, each group of pressure-sensitive control units has a pressure-sensitive device 5 and a corresponding conductive line 4, and the multiple groups of pressure-sensitive control units are arranged in parallel, and the input end and the output end of the conductive line 4 of each group of pressure-sensitive control units can be connected to the corresponding external control circuit as needed. In this way, different external components can be independently controlled by multiple pressure-sensitive devices 5 arranged in parallel.

[0050] In one embodiment of the present disclosure, the first encapsulation layer 1 and the second encapsulation layer 2 are both made of transparent materials.

[0051] The first encapsulation layer 1 is an insulating material, and the material of the first encapsulation layer 1 can be PC (Polycarbonate, PC for short), PMMA (Poly (methyl methacrylate, PMMA for short)), PET (polyethylene glycol terephthalate, PET for short), TPU (Thermoplastic Urethane, TPC for short) and other materials. The second encapsulation layer 2 is an insulating material, and the second encapsulation layer 2 can be made of plastic, resin and other materials.

[0052] In one embodiment of the present disclosure, the conductive circuit 4 is stretchable. In one example, the conductive circuit 4 is a silver paste cured wire. In this way, during the preparation of the conductive device (in-mold electronics (IME)), the continuity of the conductive circuit 4 can be ensured during 3D molding, and the stability of the circuit connection of the conductive device can be ensured.

[0053] In one embodiment of the present disclosure, the pressure sensitive device 5 is a capacitive structure, see Figure 1 , Figure 3 , Figure 7 and Figure 8The specific pressure-sensitive device 5 includes a first conductive part 51 and a second conductive part 52, and a pressure-sensitive layer 53 connecting the first conductive part 51 and the second conductive part 52, and the pressure-sensitive layer 53 is a composite material with a piezoresistive effect; the conductive line 4 is disconnected and has a first end and a second end, the first conductive part 51 is connected to the first end, and the second conductive part 52 is connected to the second end; the first conductive part 51 and the second conductive part 52 are independently arranged, and the pressure-sensitive layer 53 is configured to gradually decrease in thickness and resistance as the force gradually increases (see Figure 5 , the horizontal axis is the magnitude of the force, and the vertical axis is the resistance of the pressure-sensitive layer 53. The greater the force, the smaller the resistance); the conductive circuit 4 is configured to be turned on when the resistance of the pressure-sensitive layer 53 reaches the threshold resistance. In the present disclosure, only when the thickness of the pressure-sensitive layer 53 decreases under the action of external pressure, so that the resistance of the pressure-sensitive layer 53 reaches the threshold resistance, the first conductive part 51 and the second conductive part 52 are connected, which can ensure the stability of the pressure-sensitive device 5 and the stability of the conductive device. In an example of the present disclosure, see Figure 3 , the first conductive part 51 is a plate-like structure, and the second conductive part 52 is a plate-like structure. In this example, the first conductive part 51 can be a plate-like electrode, the second conductive part 52 can be a plate-like electrode, and the pressure-sensitive layer 53 is located between the first conductive part 51 and the second conductive part 52. In this example, the orthographic projection of at least one of the first conductive part 51 and the second conductive part 52 on the first packaging layer 1 is located within the orthographic projection of the pressure-sensitive layer 53 on the first packaging layer 1, and is smaller than the orthographic projection of the pressure-sensitive layer 53 on the first packaging layer 1. In this way, the short circuit between the first conductive part 51 and the second conductive part 52 can be avoided, and the reliability of the conductive device can be improved. For example, the orthographic projection of the first conductive part 51 on the first packaging layer 1 is located within the orthographic projection of the pressure-sensitive layer 53 on the first packaging layer 1, and is smaller than the orthographic projection of the pressure-sensitive layer 53 on the first packaging layer 1. For another example, the orthographic projections of the first conductive part 51 and the second conductive part 52 on the first packaging layer 1 are both located within the orthographic projection of the pressure-sensitive layer 53 on the first packaging layer 1, and are both smaller than the orthographic projection of the pressure-sensitive layer 53 on the first packaging layer 1. This is more conducive to improving the reliability of the conductive device.

[0054] In another example of the present disclosure, see Figure 6 , Figure 7 and Figure 8 , the first conductive part 51 and the second conductive part 52 form a planar interdigitated structure, the first conductive part 51 and the second conductive part 52 are arranged in the same layer, and the pressure-sensitive layer 53 is located on one side of the planar interdigitated structure. In this example, the pressure-sensitive layer 53 is located on the side of the planar interdigitated structure away from the first packaging layer 1. By adopting this planar interdigitated structure, the thickness of the pressure-sensitive device 5 can be reduced (the thickness refers to the size along the arrangement direction of the first packaging layer 1 and the second packaging layer 2), and the effective area of ​​conduction can be increased. By shortening the ion (e -) path to improve the capacitance performance. Among them, the planar interdigital structure is a symmetrical structure (the symmetrical structure here means that the finger-shaped parts of the symmetrical interdigital electrodes are completely identical in structure and size). In this example, the orthographic projection area of ​​the piezoresistance layer 53 on the first packaging layer 1 is larger than the orthographic projection area of ​​the planar interdigital structure on the first packaging layer 1, so that the planar interdigital structure is in full contact with the piezoresistance layer 53, and the effective area of ​​conduction is increased.

[0055] In one embodiment of the present disclosure, the pressure-sensitive layer 53 has a conductive filler 531 and an elastomer 532, and the mass ratio of the conductive filler 531 to the elastomer 532 is (1-40): (60-99), wherein the conductive filler 531 includes at least one of graphene, carbon black, and carbon nanotubes, and the elastomer 532 includes at least one of polyurethane, polypropylene, and polystyrene-polyisoprene-polystyrene. In one example, the pressure-sensitive layer 53 is composed of a conductive filler 531 and an elastomer 532, and the conductive filler 531 is evenly mixed in the elastomer 532 to ensure the uniformity of the resistance of the pressure-sensitive layer 53. For example, the mass ratio of the conductive filler 531 to the elastomer 532 is 1:99. For another example, the mass ratio of the conductive filler 531 to the elastomer 532 is 10:90. For another example, the mass ratio of the conductive filler 531 to the elastomer 532 is 23:77. For another example, the mass ratio of the conductive filler 531 to the elastic body 532 is 28:72. For another example, the mass ratio of the conductive filler 531 to the elastic body 532 is 36:64. For another example, the mass ratio of the conductive filler 531 to the elastic body 532 is 40:60.

[0056] In one example, the conductive filler 531 is carbon black, and the elastomer 532 is polyurethane. In another example, the conductive filler 531 is carbon nanotubes, and the elastomer 532 is polyurethane. The interpenetrating network structure formed by the carbon nanotubes enables the pressure-sensitive layer 53 to have a higher pressure response sensitivity. In another example, the conductive filler 531 is carbon black, and the elastomer 532 is polystyrene-polyisoprene-polystyrene. Polystyrene-polyisoprene-polystyrene has a lower elastic modulus than polyurethane, so that the pressure-sensitive layer 53 has a higher pressure response sensitivity.

[0057] Of course, in other examples, the conductive filler 531 and the elastomer 532 may also be material ratios not given in the above examples. For example, the conductive filler 531 may include two materials, and the elastomer 532 may also include two materials.

[0058] In one embodiment of the present disclosure, see Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6The conductive device also has an ink layer 3, which is an opaque ink layer. The ink layer 3 is located between the first packaging layer 1 and the pressure-sensitive device 5. First, the conductive circuit 4 can be shielded from the user's perspective to improve the aesthetics. Second, the ink layer 3 can be used to set an identification area 31 for the user to accurately obtain the position of the pressure-sensitive device 5 (accurately obtain the pressing position). In this example, the ink layer 3 has an identification area 31, and the orthographic projection of the identification area 31 on the first packaging layer 1 is located within the orthographic projection of the pressure-sensitive device 5 on the first packaging layer 1 (of course, the size of the pressure-sensitive device 5 can be set according to the size of the identification area 31, and it is also sufficient that the orthographic projection of the identification area 31 on the first packaging layer 1 is located within the orthographic projection of the pressure-sensitive device 5 on the first packaging layer 1). It can be understood that the orthographic projection of the identification area 31 on the first packaging layer 1 is located within the orthographic projection of the pressure-sensitive device 5 on the first packaging layer 1, and the orthographic projection of the identification area 31 on the first packaging layer 1 is equal to the orthographic projection of the pressure-sensitive device 5 on the first packaging layer 1, or the orthographic projection of the identification area 31 on the first packaging layer 1 is located within the orthographic projection of the pressure-sensitive device 5 on the first packaging layer 1, and the orthographic projection of the identification area 31 on the first packaging layer 1 is smaller than the orthographic projection of the pressure-sensitive device 5 on the first packaging layer 1. In this way, when the user presses the identification area 31, it can be ensured that the pressure-sensitive device 5 is pressed. The identification area 31 can have characters or button icons, etc., to indicate the area to the user. In this example, the identification area 31 does not run through the entire ink layer 3, which can improve the aesthetics.

[0059] In one embodiment of the present disclosure, the conductive device further has a feedback element 7, and the feedback element 7 corresponds one-to-one to the pressure-sensitive control unit. The feedback element 7 is connected to the corresponding conductive circuit 4, and is connected in series with the corresponding pressure-sensitive device 5. The feedback element 7 is configured to respond when the resistance of the pressure-sensitive device 5 reaches a threshold value. In the present disclosure, a feedback element 7 is provided to respond when the resistance of the pressure-sensitive device 5 reaches a threshold value. In this way, even if there is a false touch, it can be discovered in time through the response of the feedback element 7, thereby achieving an interactive effect of preventing false touches, further reducing the probability of false touches, and during normal use, the feedback element 7 can indicate a normal state to achieve touch interaction. In an example of the present disclosure, see Figure 1 and Figure 6, the feedback element 7 can be a light-emitting element, which is connected to the conductive circuit 4. When the pressure-sensitive device 5 reaches the threshold resistance under the action of pressure, the conductive circuit 4 is turned on, triggering the light-emitting element to emit light (in this example, the light-emitting element can be a lamp bead, which is arranged between the second packaging layer 2 and the first packaging layer 1. In other examples, the light-emitting element can be other components with light-emitting function), and the light emission of the light-emitting element is used to respond to achieve the interactive effect of light-emitting feedback. In another example of the present disclosure, the feedback element 7 can be a linear motor, which is connected to the conductive circuit 4. When the pressure-sensitive device 5 reaches the threshold resistance under the action of pressure, the conductive circuit 4 is turned on, triggering the linear motor to vibrate, and using the vibration of the linear motor to respond to achieve the interactive effect of vibration feedback. In this example, the vibration motor is arranged on the side of the second packaging layer 2 away from the first packaging layer 1, and is arranged in contact with the second packaging layer 2. Of course, in other examples, the feedback element 7 can also be other components not shown.

[0060] In one example of the present disclosure, when the feedback element 7 is a light-emitting element, the ink layer 3 further has a light-transmitting area 32, which exposes at least part of the area of ​​the light-emitting element, so as to allow the light emitted by the light-emitting element to be transmitted. Of course, in order to ensure aesthetics, the orthographic projection of the light-transmitting area 32 on the first encapsulation layer 1 is located within the orthographic projection of the light-emitting element on the first encapsulation layer 1. In this example, in order to ensure the feedback effect, the light-transmitting area 32 just exposes the light-emitting element. In other words, the orthographic projection of the light-transmitting area 32 on the first encapsulation layer 1 is the same as the orthographic projection of the light-emitting element on the first encapsulation layer 1.

[0061] In one embodiment of the present disclosure, the conductive device may also have an electronic component group, wherein the electronic component group includes a first electronic component and a second electronic component, the first electronic component includes at least one first sub-electronic component, the first sub-electronic component is connected to the conductive circuit 4, and the first sub-electronic component is located between the first packaging layer 1 and the second packaging layer 2. The second electronic component 6 includes at least one second sub-electronic component, the first end of the second sub-electronic component is located between the first packaging layer 1 and the second packaging layer 2, and the first end is connected to the conductive circuit 4, the second end of the second sub-electronic component passes through the second packaging layer 2 and is as far as the outside of the conductive device, and the second end of the second electronic component 6 is configured to connect to an external control circuit. In this example, the second sub-electronic component can be a terminal. In this example, the number of the first sub-electronic component and the second sub-electronic component is set according to demand. Multiple first sub-electronic components can be of the same structure or different structures, and multiple second sub-electronic components can be of the same structure or different structures.

[0062] In one embodiment of the present disclosure, see Figure 1If the conductive device has a flat area PZ and a non-flat area PB, the pressure sensitive device 5, the feedback element 7 and the electronic component group are all located in the flat area PZ. If the conductive device is a non-flat area PB, the pressure sensitive device 5, the feedback element 7 and the electronic component group are all arranged along the curve of the conductive device (it can be understood that the pressure sensitive device 5, the feedback element 7 and the electronic component group have the same curve as the conductive device, so that the performance of the conductive device can be guaranteed). In the present disclosure, the flat area PZ refers to the plane area that can be seen from the user's perspective, and the non-flat area PB refers to the inclined surface area and the curved surface area that can be seen from the user's perspective.

[0063] In one embodiment of the present disclosure, the first encapsulation layer 1 is the side close to the user, and the distance between the upper surface of the pressure-sensitive device 5 and the upper surface of the first encapsulation layer 1 is 10μm to 2mm. It can be understood that when the conductive device does not have an ink layer 3, 10μm to 2mm is the thickness of the first encapsulation layer 1. When the conductive device has an ink layer 3, 10μm to 2mm is the total thickness of the first encapsulation layer 1 and the ink layer 3. The present disclosure limits the distance between the upper surface of the pressure-sensitive device 5 and the upper surface of the first encapsulation layer 1, which can not only ensure the sensitivity of the conductive device, but also make the conductive device have a longer service life (if the distance is too small, the thickness of the first encapsulation layer 1 is small, and it is easy to be damaged under the action of a large external force). In the present disclosure, the pressure-sensitive device 5 is arranged between the first encapsulation layer 1 and the second encapsulation layer 2, and the distance between the upper surface of the pressure-sensitive device 5 and the upper surface of the first encapsulation layer 1 is limited to 10μm to 2mm, which can solve the problem of low external bonding sensitivity and limited use range. For example, the distance between the upper surface of the pressure-sensitive device 5 and the upper surface of the first encapsulation layer 1 is 10μm. For another example, the distance between the upper surface of the pressure sensitive device 5 and the upper surface of the first packaging layer 1 is 200μm. For another example, the distance between the upper surface of the pressure sensitive device 5 and the upper surface of the first packaging layer 1 is 830μm. For another example, the distance between the upper surface of the pressure sensitive device 5 and the upper surface of the first packaging layer 1 is 1mm. For another example, the distance between the upper surface of the pressure sensitive device 5 and the upper surface of the first packaging layer 1 is 1.8mm. For another example, the distance between the upper surface of the pressure sensitive device 5 and the upper surface of the first packaging layer 1 is 2mm. Of course, in other examples, the distance between the upper surface of the pressure sensitive device 5 and the upper surface of the first packaging layer 1 can also be other distances not shown.

[0064] In the present disclosure, when the marking area 31 is subjected to pressure, the spacing between the pressure-sensitive layers 53 decreases, thereby causing the resistance between the first conductive portion 51 and the second conductive portion 52 to decrease sharply, so that the size of the external pressure can be determined by the size of the resistance of the pressure-sensitive layer 53.

[0065] In the initial state, the resistance of the pressure-sensitive layer 53 is close to infinity, and the external control circuit connected to the conductive circuit 4 is in an open circuit state. When the identification area 31 is pressed, when the external pressure reaches the threshold, the pressure-sensitive layer 53 reaches the threshold resistance, triggering the external control circuit connected to the conductive circuit 4, and the feedback element 7 performs feedback (light or vibration). From the user's perspective, the light-transmitting area 32 lights up, or feels vibration, thereby realizing the pressure touch interaction function.

[0066] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the appended claims.

Claims

1. A conductive device, characterized in that: have: A first encapsulation layer; A second encapsulation layer; A conductive functional layer; the conductive functional layer is located between the first packaging layer and the second packaging layer, and the conductive functional layer includes a conductive circuit and a pressure-sensitive device; the pressure-sensitive device is connected to the conductive circuit, and the pressure-sensitive device is configured to gradually reduce resistance as the force increases; the conductive circuit is configured to be turned on when the resistance of the pressure-sensitive device reaches a threshold resistance.

2. The conductive device according to claim 1, characterized in that: The conductive device has a flat area and a non-flat area; the pressure sensitive device is located in the flat area.

3. The conductive device according to claim 1 or 2, characterized in that: The pressure-sensitive device comprises a first conductive part and a second conductive part, and a pressure-sensitive layer connecting the first conductive part and the second conductive part; The first conductive part and the second conductive part are both connected to the conductive circuit; the pressure-sensitive layer is configured so that its resistance gradually decreases as the force increases; and the conductive circuit is configured to be turned on when the resistance of the pressure-sensitive layer reaches a threshold resistance.

4. The conductive device according to claim 3, characterized in that: The first conductive part is a plate-shaped structure, the second conductive part is a plate-shaped structure, and the pressure-sensitive layer is located between the first conductive part and the second conductive part.

5. The conductive device according to claim 4, characterized in that: An orthographic projection of at least one of the first conductive portion and the second conductive portion on the first packaging layer is located within an orthographic projection of the pressure-sensitive layer on the first packaging layer and is smaller than an orthographic projection of the pressure-sensitive layer on the first packaging layer.

6. The conductive device according to claim 3, characterized in that: The first conductive part and the second conductive part form a planar interdigitated structure. The first conductive part and the second conductive part are arranged in the same layer, and the extension direction of the first conductive part is the same as the extension direction of the conductive circuit. The pressure-sensitive layer is located on one side of the planar interdigitated structure.

7. The conductive device according to claim 4, characterized in that: The pressure-sensitive layer contains a conductive filler and an elastomer, and the mass ratio of the conductive filler to the elastomer is (1-40): (60-99); The conductive filler includes at least one of graphene, carbon black, and carbon nanotubes, and the elastomer includes at least one of polyurethane, polypropylene, and polystyrene-polyisoprene-polystyrene.

8. The conductive device according to claim 7, characterized in that: The conductive filler is carbon black, and the elastomer is polyurethane.

9. The conductive device according to claim 7, characterized in that: The conductive filler is carbon nanotube, and the elastomer is polyurethane.

10. The conductive device according to claim 7, characterized in that: The conductive filler is carbon black, and the elastomer is polystyrene-polyisoprene-polystyrene.

11. The conductive device according to claim 1, characterized in that: The distance between the upper surface of the pressure sensitive device and the upper surface of the first packaging layer is 10 μm to 2 mm.

12. The conductive device according to claim 2, characterized in that: The conductive device also has an electronic component group, and the electronic component group is located in the flattened area; The electronic component group includes a first electronic component and a second electronic component, the first electronic component is located between the first packaging layer and the second packaging layer, and the first electronic component is connected to the conductive circuit, one end of the second electronic component is connected to the conductive circuit, and the other end is configured to be connected to an external control circuit after passing through the second packaging layer.

13. The conductive device according to claim 1, characterized in that The conductive device further comprises an ink layer, wherein the ink layer is located between the conductive functional layer and the first encapsulation layer; The ink layer has a marking area, and the orthographic projection of the marking area on the first packaging layer is located within the orthographic projection of the pressure sensitive device on the first packaging layer.

14. The conductive device according to claim 1, characterized in that The conductive functional layer includes a plurality of groups of pressure-sensitive control units, each group of pressure-sensitive control units includes the conductive circuit and the pressure-sensitive device; the input end and the output end of the conductive circuit of each group of the pressure-sensitive control units are connected to different external control circuits.

15. The conductive device according to claim 1 or 14, characterized in that: The conductive device also includes a feedback element, which corresponds to the pressure-sensitive device one by one; the feedback element is connected to the conductive circuit and is connected in series with the pressure-sensitive device, and the feedback element is configured to respond when the resistance of the pressure-sensitive device reaches a threshold value.

Images