Copper block embedded HDI circuit board cutting and grinding integrated device and processing method

Abstract

The invention provides a copper block embedded HDI circuit board cutting and grinding integrated device and a machining method, and belongs to the technical field of circuit board machining equipment.The copper block embedded HDI circuit board cutting and grinding integrated device comprises a feeding assembly which comprises a set of supports, a rotating shaft, a suction cup, a laser cutting assembly which comprises a door-shaped frame, a door-shaped frame and a vacuum suction plate, and a laser cutting machine is arranged above the vacuum suction plate; and the grinding assembly is arranged on one side of the vertical part of the door-shaped frame and is used for grinding the copper embedding area of the circuit board. The processing method of the HDI circuit board embedded with the copper block comprises the following steps: S1, processing a copper base; s2, processing an inner-layer core plate; s3, performing press fit; s4, performing laser drilling and hole filling electroplating; s5, laser grooving is conducted, specifically, the PP and the copper foil in the copper-embedded block area on one face of the circuit board are removed through the laser cutting and grinding integrated device, and the copper-embedded block is exposed; and S6, grinding is conducted, specifically, the cutting position is ground. By using the scheme provided by the invention, the circuit board can be prevented from being transferred for many times, the processing efficiency of the circuit board is improved, the copper-based bonding effect is good, and the reliability of the circuit board is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board processing equipment, and in particular relates to a copper block embedded HDI circuit board cutting and grinding integrated device and a processing method. Background Art

[0002] As the assembly density and integration of PCB components increase and the signal transmission speed increases, the power consumption increases accordingly, and the requirements for heat dissipation and high-frequency transmission of PCB boards become increasingly higher.

[0003] The copper base has excellent heat dissipation performance, good electromagnetic shielding performance, high mechanical strength and toughness, so the embedded copper base has a good application in printed circuit boards.

[0004] The common copper-embedded base is a standard rectangular block, and the embedded position corresponds to the groove in the middle area of ​​the circuit board, which is the same size as the copper base. In the process of embedding the copper base, the hot-melted glue of the semi-cured sheet used for pressing flows into the gap between the copper base and the circuit board, and forms adhesion after solidification. This method requires grooves in the circuit board area, but the structure of the copper-embedded HDI board is PP and copper foil on the outside. Because PP cannot be fixed, the groove position and the embedded copper block cannot be aligned, resulting in the surface of the embedded copper block being covered with resin, affecting the connection between the embedded copper block and the chip; and when removing the resin on the surface of the embedded copper block, it is necessary to manually turn it over to remove the resin-covered areas on both sides of the circuit board separately, which is inefficient; in addition, the surface flatness of the area covered with resin is affected, and it needs to be moved to the next station for grinding before grinding can be performed, which is time-consuming and labor-intensive. Summary of the invention

[0005] In order to solve the above-mentioned deficiencies in the prior art, the present invention provides a copper-embedded HDI circuit board cutting and grinding integrated device and processing method, which avoids multiple transfers of circuit boards, improves the circuit board processing efficiency, and makes the copper base bonding effect good, thereby improving the reliability of the circuit board.

[0006] In order to achieve the purpose of the present invention, the following scheme is proposed: A copper-embedded HDI circuit board cutting and grinding integrated device, comprising: The feeding assembly comprises a group of brackets arranged at intervals, a conveyor belt is provided on the top of each group of brackets for conveying circuit boards, a rotating shaft is provided at one end of each group of brackets, a U-shaped suction cup frame is provided on the rotating shaft, a plurality of vertically retractable suction cups are evenly distributed on one side of the suction cup frame, and support plates are vertically provided on the vertical parts of both sides of the suction cup frame, and one end of the support plate is connected to the rotating shaft; The laser cutting assembly is arranged at one end of a group of brackets at intervals, including a door frame, a vacuum suction plate is rotatably arranged between the two vertical parts of the door frame, and the two ends of the vacuum suction plate are respectively rotatably connected with the vertical parts on both sides of the door frame, and a limiting piece is arranged on one side of the vacuum suction plate for limiting one side of the circuit board, and one end of the limiting plate passes through the vacuum suction plate. When the suction cup frame is located and rotated to the top surface of the vacuum suction plate, the suction cup absorbs the circuit board, and one side of the support plate abuts against one end of the limiting piece. When the suction cup frame flips the circuit board onto the conveyor belt, the support plate is separated from one end of the limiting piece; a laser cutting machine is arranged at intervals above the vacuum suction plate, and the upper end of the laser cutting machine is connected to the horizontal part of the door frame, and is used for laser cutting the copper embedded area of ​​the circuit board on the vacuum suction plate; The grinding assembly is arranged on one side of the vertical part of the portal frame, and includes an ejection member arranged to move along the horizontal direction of the portal frame. A group of grinding wheels arranged to move vertically are symmetrically arranged in the moving direction of the ejection member. When the vacuum suction plate drives the circuit board after laser cutting to rotate to a vertical state, the pushing member is used to push the circuit board between the group of grinding wheels for grinding, so as to grind the cutting position.

[0007] Furthermore, the middle parts of the lower parts of a group of brackets are connected to the same crossbar, a convex block is arranged on the crossbar, and a rubber pad is arranged on the convex block.

[0008] Furthermore, a group of brackets are respectively provided with a pushing member on one opposite side of one end, and the pushing member includes a first telescopic rod arranged to be telescopically arranged vertically, a connecting seat is provided on the top of the first telescopic rod, a second telescopic rod arranged to be telescopic horizontally is provided on one side of the connecting seat, and a push plate is provided on the output end of the second telescopic rod.

[0009] Furthermore, a horizontal baffle is provided at one end of a group of brackets. When the vacuum suction plate is in a horizontal state, the other side of the vacuum suction plate is attached to the horizontal baffle at the bottom. Buffer plates are provided on the other sides of the vertical part of the door-shaped frame. When the vacuum suction plate is in a vertical state, the bottom surface of the vacuum suction plate is attached to the buffer plate.

[0010] Furthermore, the limiting member includes an inverted L-shaped limiting plate vertically arranged on one side of the vacuum suction plate, one side of the vertical part of the limiting plate is parallel to and spaced apart from a group of guide rods, the horizontal part of the limiting plate is located on the top surface of the vacuum suction plate, a group of guide rods are passed through the vacuum suction plate, and a group of guide rods passing through one end of the vacuum suction plate is provided with a circular plate, when the suction cup frame rotates to above the vacuum suction plate, one side of the circular plate abuts against one side of the support plate, when the suction cup frame rotates to below the other end of a group of brackets, the circular plate extends to the other end of the group of brackets, a group of guide rods are passed through a spring, one end of the spring abuts against the other side of the vacuum suction plate, and the other end abuts against the other side of the circular plate.

[0011] Furthermore, a third telescopic rod is movably provided on the horizontal part of the portal frame, the third telescopic rod is arranged vertically, and a guide rod is arranged perpendicular to the horizontal part of the portal frame at the output end, and the laser cutting machine is movably provided along the length direction of the guide rod.

[0012] Furthermore, a strip seat is provided at the lower end of the portal frame, a strip groove is provided on the strip seat, the ejection piece is movably arranged along the strip groove, a guide rail is vertically provided at one end of the strip seat, a column is movably provided on the guide rail, and a group of grinding wheels are respectively arranged on the vertical part of one side of the portal frame and the side opposite to the column.

[0013] A method for processing a copper-embedded HDI circuit board comprises the following steps: S1. Copper base processing: cutting and milling are performed in sequence to obtain the copper base to be embedded; S2, inner core board processing: cutting, drilling, copper plating / board electricity, circuit, etching, gong board process in sequence; S3, Lamination: embed the copper block into the inner core board, laminate PP and copper foil on the outside of the core board, and press to form a multilayer board; S4, laser drilling and hole filling electroplating: laser drilling and hole filling electroplating are performed to realize HDI board; S5, laser slotting: the integrated cutting and grinding device for HDI circuit boards with embedded copper blocks puts the circuit board on the conveyor belt, moves the circuit board to the top surface of the vacuum suction plate, uses a laser cutting machine to remove the PP and copper foil in the copper block embedded area on one side of the circuit board to expose the embedded copper block, after the cutting is completed, rotates the suction cup frame, and the horizontal part of the suction cup frame pushes the limiter to move out of the top surface of the vacuum suction plate, and the suction cup absorbs one side of the circuit board, and rotates the suction cup frame to flip the circuit board onto the conveyor belt, and conveys the flipped circuit board to the top surface of the vacuum suction plate again, removes the PP and copper foil in the copper block embedded area on the other side of the circuit board to expose the embedded copper block; S6. Grinding: Flip the vacuum suction plate outward to a vertical state, and use a pusher to push the double-sided cut circuit board between a set of grinding wheels for grinding to grind the cutting position.

[0014] Furthermore, the height of the embedded copper block milled in step S1 is consistent with the thickness of the finished circuit board.

[0015] Furthermore, the PP and copper foil used in the lamination process in step S3 do not need to be grooved, and the copper embedding position of the laminated structure protrudes from the surface of the circuit board.

[0016] The beneficial effects of the present invention are: The side of the embedded copper block is embedded into the circuit board, so that the copper base and the circuit board are bonded in the horizontal direction, with good bonding force, which enhances the reliability of the copper-embedded printed circuit board. The circuit board is automatically turned over by using a flip suction cup frame. After the resin removal and cutting of both sides of the circuit board are completed, the double-sided circuit board is automatically ground at the same time, which shortens the circuit board processing time and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0018] Figure 1 A schematic diagram of an application scenario of the first embodiment of the present application is shown.

[0019] Figure 2 A schematic cross-sectional view along the width direction of the vacuum suction plate of the first embodiment of the present application is shown.

[0020] Figure 3 The first embodiment of the present application is shown Figure 2 A local enlarged schematic diagram of point A in the figure.

[0021] Figure 4 A schematic diagram showing the state of the circuit board when it is turned over and leaves the vacuum suction plate in the first embodiment of the present application.

[0022] Figure 5 A schematic diagram showing the state of the circuit board in the first embodiment of the present application when the lower side is in contact with the conveyor belt when the circuit board is flipped.

[0023] Figure 6 A schematic diagram showing the state of a circuit board on a flip conveyor belt in the first embodiment of the present application is shown.

[0024] Figure 7 A schematic diagram showing the state of the ejection member in the first embodiment of the present application pushing the circuit board for grinding is shown.

[0025] Figure 8 A schematic diagram of an orthographic projection of the side where the ejection member of the first embodiment of the present application is located is shown.

[0026] Fig. 9 A schematic diagram of the orthographic projection of the side where the grinding wheel of the first embodiment of the present application is located is shown.

[0027] Fig.10 A copper-based cross-sectional view of the second embodiment of the present application is shown.

[0028] Fig.11 A schematic diagram of the copper-based embedded inner core board of the second embodiment of the present application is shown.

[0029] Fig.12 A schematic diagram of a copper-embedded HDI board after lamination is shown in Example 2 of the present application.

[0030] Fig.13 A schematic diagram of a copper-embedded HDI board after laser hole drilling and hole filling electroplating in the second embodiment of the present application is shown.

[0031] Fig.14 A schematic diagram of a copper-embedded HDI board according to a second embodiment of the present application is shown.

[0032] Markings in the figure: circuit board -1, feeding assembly -10, bracket -11, conveyor belt -12, rotating shaft -13, suction cup frame -14, suction cup -141, support plate -142, cross bar -15, protrusion -151, pushing member -16, first telescopic rod -161, connecting seat -162, second telescopic rod -163, push plate -164, horizontal baffle -17, laser cutting assembly -20, door frame -21, buffer plate -211, vacuum suction plate -22, limit member -23, limit plate -231, guide rod -232, round plate -233, spring -234, laser cutting machine -24, third telescopic rod -241, guide rod -242, strip seat -25, strip groove -251, guide rail -26, grinding assembly -30, ejector -31, grinding wheel -32, column -33. DETAILED DESCRIPTION

[0033] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0034] Embodiment 1 like Figure 1-Figure 9 As shown, this embodiment provides a copper-embedded HDI circuit board cutting and grinding integrated device, including a feed assembly 10, a laser cutting assembly 20, and a grinding assembly 30 arranged at one end of the laser cutting assembly 20.

[0035] like Figure 1-Figure 4 As shown, the feeding assembly 10 includes a group of brackets 11, a conveyor belt 12, a rotating shaft 13, a suction cup frame 14, a cross bar 15, a pushing member 16, and a horizontal baffle 17.

[0036] A group of brackets 11 are arranged in parallel and at intervals, and a conveyor belt 12 is provided along the top surface of a group of brackets 11 in the length direction, which is used to convey the circuit board 1 to the direction of the laser cutting component 20. The outer sides of the top of a group of brackets 11 are respectively provided with strip plates, and the top surface height of the strip plates is higher than the top surface height of the conveyor belt 12, which is used to guide the circuit board 1. When in use, the two ends of the circuit board 1 are respectively conveyed to the laser cutting component 20 along the conveyor belt 12 on the top surface of a group of brackets 11, and the laser cutting component 20 is used to laser cut the central copper embedded area on the top surface of the circuit board 1 to expose the embedded copper block.

[0037] The rotating shaft 13 is arranged at one end of a group of brackets 11 facing the laser cutting assembly 20 and is located below the conveying direction of the conveyor belt 12. The rotation of the rotating shaft 13 can be driven by a motor in combination with a reducer, or a gear can be set at one end of the rotating shaft 13, and a cylinder can be used to push the rack, and the rack can drive the gear to rotate to rotate the rotating shaft 13 in the forward or reverse direction.

[0038] like Figure 5-Figure 6 As shown, the suction cup frame 14 is in a U-shaped structure, and a plurality of vertically retractable suction cups 141 are evenly distributed on one side of the suction cup frame 14 to meet the use of circuit boards 1 of different thicknesses. A support plate 142 is vertically provided at one end of the vertical portion of the suction cup frame 14, and the lower end of the support plate 142 is fixedly connected to the rotating shaft 13, so that the suction cup frame 14 can move synchronously with the forward or reverse rotation of the rotating shaft 13. When the suction cup frame 14 rotates to the laser cutting assembly 20, the suction end of its suction cup 141 is vertically downward to absorb the circuit board 1 after one side is cut by the laser.

[0039] The suction cup frame 14 is set to a U-shaped structure, which can reduce the weight of the suction cup frame 14, make the rotating shaft 13 more labor-saving, and make the suction cup frame 14 more stable during rotation, so that each suction cup 141 has a uniform adsorption force on the circuit board 1, avoiding the circuit board 1 from falling off due to uneven force during the flipping process, resulting in flipping failure.

[0040] The cross bar 15 is arranged below the middle of a group of brackets 11, and is used to connect a group of brackets 11. The top surface of the cross bar 15 is provided with protrusions 151 at intervals. The top surface of the protrusion 151 has an inclined surface and is inclined downward in the direction of the laser cutting assembly 20. A rubber pad is provided on the top surface of the protrusion 151. When the circuit board 1 after one side of the cutting is completed is turned over to the conveyor belt 12, and the downward side of the circuit board 1 contacts the conveyor belt 12, the suction cup 141 is closed, so that the circuit board 1 is separated from the suction cup 141, and the suction cup frame 14 continues to move downward. Move to the bottom of the conveyor belt 12. At this time, the inclined surface of the protrusion 151 limits the suction cup frame 14 to prevent the suction cup frame 14 from rotating downward too much, and ensure that the suction cup frame 14 does not affect the conveying of the turned over circuit board 1 by the conveyor belt 12. At the same time, when the suction cup 141 turns over the next circuit board 1 after one side is cut, the torque force when the rotating shaft 13 is started can be reduced, the service life of the rotating shaft 13 can be increased, and energy can be saved. The setting of the rubber pad can buffer and reduce the shock of the suction cup frame 14 and reduce noise.

[0041] The pusher 16 is disposed at one end of the lower side of the rotating shaft 13 facing the laser cutting assembly 20 , and the horizontal baffle 17 is disposed at one end of a group of brackets 11 facing the laser cutting assembly 20 .

[0042] Specifically, Figure 1-Figure 2 , Figure 4As shown, the laser cutting assembly 20 includes a gantry 21, a vacuum suction plate 22, a limiter 23, and a laser cutting machine 24. The gantry 21 is spaced apart at one end of a group of brackets 11, and the vacuum suction plate 22 is arranged in the gantry 21, and the two ends of the vacuum suction plate 22 are rotatably connected to the vertical parts on both sides of the gantry 21 respectively. When the vacuum suction plate 22 is in a horizontal state, it is used to receive the circuit board 1 transported to the laser cutting assembly 20 by the conveyor belt 12. At this time, the lower end of the vacuum suction plate 22 facing one side of a group of brackets 11 contacts the top surface of the horizontal baffle 17, which is used to ensure the horizontality of the vacuum suction plate 22, so that the suction cup 141 is more stable during adsorption.

[0043] like Figure 3 As shown, a group of through holes arranged at intervals are arranged in the width direction of the vacuum suction plate 22, and the limiting member 23 includes a limiting plate 231 of an inverted L-shaped structure, a group of guide rods 232, a circular plate 233, and a spring 234. The limiting plate 231 is arranged on the side of the vacuum suction plate 22 away from the group of brackets 11, and the horizontal part of the limiting plate 231 faces the top surface of the vacuum suction plate 22, so that the vertical part of the limiting plate 231 is used to limit one side of the moving direction of the circuit board 1 to prevent the circuit board 1 from moving out of the vacuum suction plate 22. A group of guide rods 232 are arranged parallel to and at intervals on the inner side of the vertical part of the limiting plate 231, and a group of guide rods 232 are slidably connected to the through holes, and the circular plates 233 are respectively arranged at one end of the group of guide rods 232 passing through the through holes, and the springs 234 are respectively penetrated on the group of guide rods 232, and one end of the spring 234 abuts against the side of the circular plate 233 facing the vacuum suction plate 22, and the other end abuts against the other side of the vacuum suction plate 22.

[0044] The laser cutting machine 24 is vertically arranged below the horizontal part of the gantry frame 21 and is used to perform laser cutting on the copper embedded area of ​​the circuit board 1 on the vacuum suction plate 22 . When laser cutting is performed, the vacuum suction plate 22 absorbs the circuit board 1 .

[0045] like Figure 5-Figure 6 As shown, after laser cutting is completed on one side of the circuit board 1, when the suction cup frame 14 rotates toward the top of the vacuum suction plate 22, the support plate 142 pushes the circular plate 233 to move toward the direction of the vacuum suction plate 22, so that the circular plate 233 pushes a group of guide rods 232 to move, so that the horizontal part of the limit plate 231 moves out of the top surface of the vacuum suction plate 22, so as to avoid the horizontal part of the limit plate 231 interfering with the rotation of the circuit board 1 with the suction cup frame 14, so that the circuit board 1 can be smoothly turned onto the conveyor belt 12. When the circuit board 1 completely falls into the top surface of the conveyor belt 12, the support plate 142 rotates to the bottom of the circular plate 233, so that the limit plate 231 is reset under the action of the restoring force of the spring 234. After that, the circuit board 1 moves again and moves to the top surface of the vacuum suction plate 22 with the conveyor belt 12 to cut the copper embedded area on the other side.

[0046] like Figure 1 , Figure 7-Figure 9As shown, the grinding assembly 30 includes a pusher 31, a set of grinding wheels 32, and a column 33. The lower ends of the vertical parts on both sides of the door frame 21 are connected to the two ends of the same strip seat 25, and the outer side of the strip seat 25 protrudes from the door frame 21. A strip groove 251 is provided on one side of the top surface of the strip seat 25. The strip groove 251 is located on the outer side of the projection of the horizontal part of the door frame 21 on the horizontal plane, as shown in FIG. Figure 8 As shown, the ejector 31 is in a "7"-shaped structure. When the circuit board 1 is cut on both sides, the vacuum suction plate 22 rotates to a vertical state to the side away from a group of brackets 11, and the outer end of the horizontal part of the ejector 31 is in contact with the side of the vacuum suction plate 22 carrying the circuit board 1. The lower end of the vertical part of the ejector 31 moves and is arranged in the strip groove 251. The movement of the ejector 31 can be driven by a motor in combination with a screw rod, so that the lower end of the vertical part of the ejector 31 is threadedly connected to the screw rod, or it can be directly pushed by a linear cylinder.

[0047] A guide rail 26 is vertically arranged at one end of the strip seat 25 facing the ejection direction of the ejection member 31, and a column 33 is movably arranged along the guide rail 26. The column 33 corresponds to a vertical portion of one side of the gate frame 21, and a set of grinding wheels 32 are respectively arranged at the vertical portion of the column 33 facing the gate frame 21 and at one side of the vertical portion of the gate frame 21 facing the column 33. The outer side of the grinding wheel 32 arranged at the vertical portion of one side of the gate frame 21 is parallel to the side of the vacuum suction plate 22 carrying the circuit board 1 when the vacuum suction plate 22 rotates to a vertical state.

[0048] When in use, when the ejection member 31 is pushed out along the inner side surface of the vertical part of the limiting plate 231 to push out the circuit board 1, the column 33 moves toward the vertical part of one side of the door frame 21, so that both sides of the circuit board 1 are ground by the grinding wheel 32 at the same time, so that the two sides of the circuit board 1 are subjected to the same force during the grinding process, and the grinding time can be saved, thereby improving work efficiency.

[0049] Preferably, in order to adapt to the grinding of laser cutting areas at different heights, slide grooves are vertically provided on one side of the vertical part of the gantry 21 facing the column 33, and on one side of the vertical part of the column 33 facing the gantry 21, and a slide seat is provided in the slide groove. The top surface of the slide seat is connected to a vertically telescopic electric telescopic rod, and the grinding wheel 32 is installed in the slide seat.

[0050] Specifically, in order to ensure the verticality of the vacuum suction plate 22 when it is rotated to a vertical state, a buffer plate 211 is respectively provided on one side of the vertical part of the door frame 21 facing a group of brackets 11. When the vacuum suction plate 22 is in a vertical state, the bottom surface of the vacuum suction plate 22 is in contact with the buffer plate 211.

[0051] Specifically, Figure 3As shown, the pushing member 16 is respectively arranged at one end of a group of brackets 11 facing the laser cutting assembly 20, and is located on the opposite side of the group of brackets 11. The pushing member 16 includes a first telescopic rod 161, a connecting seat 162, a second telescopic rod 163, and a push plate 164. A support is provided in front of the lower end of the connection between the two ends of the rotating shaft 13 and the group of brackets 11. The first telescopic rod 161 is vertically arranged above the end of the support facing the laser cutting assembly 20, the connecting seat 162 is arranged at the output end of the first telescopic rod 161, and the second telescopic rod 163 is horizontally arranged on the side of the connecting seat 162 facing the laser cutting assembly 20. The push plate 164 is arranged at the output end of the second telescopic rod 163. When the width of the circuit board 1 is small, if the cutting position of its top surface cannot be moved to the output end of the laser cutting assembly 20, the first telescopic rod 161 can be used to move vertically to make the bottom surface of the push plate 164 flush with the top surface of the vacuum suction plate 22, thereby pushing the circuit board 1 to the output end of the laser cutting assembly 20 for laser cutting.

[0052] Specifically, Figure 2 As shown, in order to increase the moving range of the laser cutting machine 24, a third telescopic rod 241 is movably provided on the horizontal part of the portal frame 21. The third telescopic rod 241 is arranged vertically. The output end of the third telescopic rod 241 is provided with a guide rod 242 which is arranged perpendicular to the horizontal part of the portal frame 21. The laser cutting machine 24 is movably arranged along the length direction of the guide rod 242.

[0053] Specific usage process: The circuit board 1 is intermittently conveyed onto the conveyor belt 12. When the circuit board 1 is conveyed to the vacuum suction plate 22 along the conveyor belt 12, the first telescopic rod 161 is started to push the first telescopic rod 161 vertically upward so that the bottom surface of the push plate 164 is flush with the top surface of the vacuum suction plate 22, and then the second telescopic rod 163 is started to move the push plate 164 along the top surface of the vacuum suction plate 22, thereby pushing the circuit board 1 so that one side of the circuit board 1 is flush with the vertical portion of the limit plate 231, and then the push plate 164 is reset.

[0054] The laser cutting machine 24 performs laser cutting on the copper-embedded area at the center of the top surface of the circuit board 1 to remove the PP and copper foil in the copper-embedded area to expose the copper-embedded area. After the cutting is completed, the rotating shaft 13 is started, so that the rotating shaft 13 drives the suction cup frame 14 to rotate upward in the direction of the vacuum suction plate 22 until it is parallel to the top surface of the vacuum suction plate 22. The suction cup 141 is started, so that the suction cup 141 vertically downwardly adsorbs the two ends of the upward side of the circuit board 1 and the side facing the limit plate 231. After the adsorption is completed, the rotating shaft 13 is rotated in the opposite direction, so that the suction cup frame 14 drives the circuit board 1 to rotate above a group of conveyor belts 12. When As the circuit board 1 continues to move toward the top of the conveyor belt 12 as the suction cup holder 14 rotates, when the other side of the adsorbed side of the circuit board 1 contacts the top surface of the conveyor belt 12, the angle between the circuit board 1 and the conveying direction of the conveyor belt 12 is greater than 120°. At this time, the suction cup 141 is closed, and the circuit board 1 slides along the suction cup 141 to the conveyor belt 12, and enters the top surface of the vacuum suction plate 22 again as the conveyor belt 12 is conveyed, and repeats the cutting action before turning over. At the same time, the rotating shaft 13 continues to rotate downward to make the suction cup 141 rotate to the bottom of the conveyor belt 12 to avoid affecting the next circuit board 1 from entering the conveyor belt 12.

[0055] After the laser cutting of the copper-embedded area of ​​the turned-over circuit board 1 is completed, the vacuum suction plate 22 is rotated to a vertical state toward the side away from a group of brackets 11, and the ejector 31 is started to push the circuit board 1 along one end of the circuit board 1 toward a group of grinding wheels 32. During the pushing process, the column 33 is moved inward along the guide rail 26, so that the grinding wheel 32 provided on the column 33 is close to the cut copper-embedded area for double-sided grinding.

[0056] Embodiment 2 A method for processing a copper-embedded HDI circuit board comprises the following steps: S1. Copper base processing: Cut and mill in sequence to obtain the required embedded Fig.10 Copper base shown; S2, inner core board processing: cutting, drilling, copper plating / board electricity, circuit, etching, gong board process in sequence; S3, pressing: Fig.11 As shown, the copper block is embedded in the inner core board, and the PP and copper foil are laminated on the outside of the core board to form a multilayer board as shown in FIG. Fig.12 As shown; S4, laser drilling and hole filling electroplating: laser drilling and hole filling electroplating are performed to realize HDI boards, such as Fig.13 As shown; S5, laser grooving: Use the copper embedded HDI circuit board cutting and grinding integrated device in Example 1 to place the circuit board 1 on the conveyor belt 12, move the circuit board 1 to the top surface of the vacuum suction plate 22, and use the laser cutting machine 24 to remove the PP and copper foil of the copper embedded block area on one side of the circuit board 1. Fig.14As shown, the embedded copper block is exposed. After the cutting is completed, the suction cup frame 14 is rotated in the direction of a group of brackets 11, and the support plate 142 pushes the limiter 23 to move out of the top surface of the vacuum suction plate 22. The suction cup 141 absorbs one side of the circuit board 1, and the suction cup frame 14 is rotated to turn the circuit board 1 onto the conveyor belt 12. The conveyor belt 12 transports the turned circuit board 1 to the top surface of the vacuum suction plate 22 again, and repeats the above laser cutting process; S6. Grinding: Flip the vacuum suction plate 22 to a vertical state in a direction away from a group of brackets 11, and use the ejector 31 to push the double-sided cut circuit board 1 between a group of grinding wheels 32 for grinding, so as to grind the cutting position.

[0057] Specifically, the height of the copper embedded block cut out by milling is consistent with the thickness of the finished circuit board 1 .

[0058] Specifically, the PP and copper foil used in the lamination process in step S3 do not need to be grooved, and the copper embedding position of the laminated structure protrudes from the surface of the circuit board 1.

[0059] The above description is only a preferred embodiment of the present invention, and is not intended to be the only one or to limit the present invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from the scope of the present invention are within the scope of protection of the present invention.

Claims

1. A copper-embedded HDI circuit board cutting and grinding integrated device, characterized in that: include: A feeding assembly (10) comprises a group of brackets (11) arranged at intervals and a U-shaped suction cup frame (14); a conveyor belt (12) is provided on the top of the bracket (11) for conveying the circuit board (1); a plurality of telescopic suction cups (141) are evenly distributed vertically on one side of the suction cup frame (14); support plates (142) are vertically provided on both sides of the vertical portion of the suction cup frame (14), one end of which is rotatably connected between the group of brackets (11) via a rotating shaft (13); A laser cutting assembly (20) is arranged at one end of a group of brackets (11) at intervals, and comprises a vacuum suction plate (22) rotatably arranged between a door frame (21) and its vertical portion; a limiting member (23) is arranged on one side of the vacuum suction plate (22) for limiting one side of the circuit board (1); one end of the limiting member (23) passes through the vacuum suction plate (22); when the suction cup frame (14) rotates to the top surface of the vacuum suction plate (22) and the suction cup (141) absorbs the circuit board (1), one side of the support plate (142) abuts against one end of the limiting member (23); when the suction cup frame (14) turns over the absorbed circuit board (1) and receives it on the conveyor belt (12), the support plate (142) is separated from one end of the limiting member (23); a laser cutting machine (24) connected to the door frame (21) is arranged at intervals above the vacuum suction plate (22) for laser cutting the copper embedded area of ​​the circuit board (1) on the vacuum suction plate (22); The grinding assembly (30) is arranged on one side of the vertical portion of the portal frame (21), and comprises an ejector (31) arranged to move along the length direction of the horizontal portion of the portal frame (21) and a group of grinding wheels (32) symmetrically arranged on both sides of the moving track of the ejector (31) and moving vertically. When the vacuum suction plate (22) drives the circuit board (1) after laser cutting to rotate to a vertical state, the ejector (31) is used to push the circuit board (1) between the group of grinding wheels (32) to grind the cutting position.

2. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: The middle parts below a group of brackets (11) are connected to the same crossbar (15), a convex block (151) is provided on the crossbar (15), and a rubber pad is provided on the convex block (151).

3. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A group of brackets (11) are provided with pushers (16) on opposite sides of one end, the pushers (16) comprising a first telescopic rod (161) which is telescopically arranged vertically, a connecting seat (162) being provided on the top of the first telescopic rod (161), a second telescopic rod (163) which is telescopically arranged horizontally being provided on one side of the connecting seat (162), and a push plate (164) being provided at the output end of the second telescopic rod (163).

4. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A horizontal baffle (17) is provided at one end of a group of brackets (11); when the vacuum suction plate (22) is in a horizontal state, the lower side of the other side of the vacuum suction plate (22) is in contact with the horizontal baffle (17); and a buffer plate (211) is provided at the other side of the vertical portion of the door-shaped frame (21); when the vacuum suction plate (22) is in a vertical state, the bottom surface of the vacuum suction plate (22) is in contact with the buffer plate (211).

5. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: The limiting member (23) comprises an inverted L-shaped limiting plate (231) vertically arranged on one side of the vacuum suction plate (22); a group of guide rods (232) are arranged on one side of the vertical portion of the limiting plate (231) in parallel and at intervals; a horizontal portion of the limiting plate (231) is located on the top surface of the vacuum suction plate (22); a group of guide rods (232) are penetrated through the vacuum suction plate (22); and a circular plate (233) is arranged on one end of the group of guide rods (232) passing through the vacuum suction plate (22); when the suction cup frame (1 4) When the circular plate (233) is rotated to the top of the vacuum suction plate (22), one side of the circular plate (233) abuts against one side of the support plate (142); when the suction cup frame (14) is rotated to the bottom of the other end of the one set of brackets (11), the circular plate (233) extends toward the other end of the one set of brackets (11); a spring (234) is provided on the one set of guide rods (232); one end of the spring (234) abuts against the other side of the vacuum suction plate (22), and the other end abuts against the other side of the circular plate (233).

6. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A third telescopic rod (241) is movably provided on the transverse portion of the portal frame (21); the third telescopic rod (241) is arranged vertically; an output end of the third telescopic rod (241) is provided with a guide rod (242) arranged perpendicularly to the transverse portion of the portal frame (21); and the laser cutting machine (24) is movably provided along the length direction of the guide rod (242).

7. The copper embedded HDI circuit board cutting and grinding integrated device according to claim 1, characterized in that: A strip seat (25) is provided at the lower end of the portal frame (21), a strip groove (251) is provided on the strip seat (25), a push-out member (31) is movably arranged along the strip groove (251), a guide rail (26) is vertically provided at one end of the strip seat (25), a column (33) is movably provided on the guide rail (26), and a group of grinding wheels (32) are respectively movably arranged on a side of a vertical portion of one side of the portal frame (21) and a side opposite to the column (33).

8. A method for processing a copper-embedded HDI circuit board, characterized in that: The steps include: S1. Copper base processing: cutting and milling are performed in sequence to obtain the copper base to be embedded; S2, inner core board processing: cutting, drilling, copper plating / board electricity, circuit, etching, gong board process in sequence; S3, Lamination: embed the copper block into the inner core board, laminate PP and copper foil on the outside of the core board, and press to form a multilayer board; S4, laser drilling and hole filling electroplating: laser drilling and hole filling electroplating are performed to realize HDI board; S5. Laser grooving: using the copper-embedded HDI circuit board cutting and grinding device as described in any one of claims 1 to 7, placing the circuit board (1) on the conveyor belt (12), moving the circuit board (1) to the top surface of the vacuum suction plate (22), using the laser cutting machine (24) to remove the PP and copper foil in the copper-embedded area on one side of the circuit board (1) to expose the copper-embedded area, after the cutting is completed, rotating the suction cup frame (14), the horizontal part of the suction cup frame (14) pushes the limiter (23) out of the top surface of the vacuum suction plate (22), the suction cup (141) adsorbs one side of the circuit board (1), rotating the suction cup frame (14) to flip the circuit board (1) onto the conveyor belt (12), conveying the flipped circuit board (1) to the top surface of the vacuum suction plate (22) again, removing the PP and copper foil in the copper-embedded area on the other side of the circuit board (1) to expose the copper-embedded area; S6, grinding: turning the vacuum suction plate (22) outward to a vertical state, and using a pusher (31) to push the double-sided cut circuit board (1) between a set of grinding wheels (32) for grinding, so as to grind the cutting position.

9. The method for processing a copper-embedded HDI circuit board according to claim 8, characterized in that: The height of the copper embedded block milled out in step S1 is consistent with the thickness of the finished printed circuit board.

10. The method for processing a copper-embedded HDI circuit board according to claim 8, characterized in that: The PP and copper foil used in the lamination process in step S3 do not need to be grooved, and the copper embedding position of the laminated structure is raised on the surface of the printed circuit board.

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