Display module manufacturing method and device, display equipment and electronic equipment

Abstract

The embodiment of the invention relates to a display module manufacturing method and device, display equipment and electronic equipment. The display module manufacturing method comprises the steps that a display circuit is manufactured on a front body of a substrate; obtaining a metal wire driving circuit film, and connecting the metal wire driving circuit film to the back surface of the substrate in an attaching manner; manufacturing a slope for connecting the edge of the top end of the offset surface and the back surface of the substrate on the back surface of the substrate and at the offset surface position close to the metal wire driving circuit film relative to the back surface of the substrate in a printing manner; and manufacturing a plurality of interconnection circuits which are wound from the front surface of the substrate to the back surface of the substrate through the side surface of the substrate in a printing manner and are connected between the display circuit and the metal wire driving circuit film in a manner of obliquely climbing on a slope, so as to manufacture the display module. According to the display module manufacturing method, the production cost of the display module can be reduced, and the production yield of the display module can be increased.

Description

Technical Field

[0001] Multiple embodiments of this specification relate to the field of printing technology, and specifically to a display module manufacturing method and device, a display device, and an electronic device. Background Art

[0002] In the field of display module manufacturing, the current technology generally adopts the side line connection method, because to a certain extent, this connection method can achieve efficient signal transmission and better module integration. Specifically, the side line connection can reduce space occupation, improve the compactness of the display module, and also help to improve the uniformity and stability of the display effect.

[0003] However, the existing display module manufacturing process has certain limitations. At present, the circuit production on the front and back of the substrate is usually completed through exposure, development and laser etching technology. For the side connection part, vapor deposition and laser etching methods are used. Although this process flow can achieve circuit connection, its cost is high and the entire process flow is complicated. More importantly, the adverse effects of the post-process are often transmitted to the front-end process, resulting in a decrease in the overall yield, thereby increasing costs and reducing efficiency.

[0004] In view of the above problems, a new display module manufacturing method is urgently needed. Summary of the invention

[0005] The embodiments of the present specification provide a display module manufacturing method and apparatus, a display device, and an electronic device, which can reduce the production cost of the display module and increase the production yield of the display module, especially when preparing a display module with a small interconnect line spacing, which can reduce the production cost of the display module and increase the production yield of the display module.

[0006] The technical solution is as follows: In a first aspect, an embodiment of the present specification provides a method for manufacturing a display module, comprising: Manufacturing a display circuit on the front body of the substrate; Obtaining a metal wire driving circuit film, and connecting the metal wire driving circuit film to the back surface of the substrate by attaching; A slope connecting the top edge of the step difference surface and the back surface of the substrate is formed by printing on the back surface of the substrate and close to the metal wire driving circuit film at a position of the step difference surface compared to the back surface of the substrate; A display module is manufactured by printing a plurality of interconnection lines that pass through the side of the substrate and go around from the front side of the substrate to the back side of the substrate and climb obliquely on the slope to achieve connection between the display circuit and the metal wire driving circuit film.

[0007] As a preferred solution, the manufacturing of the display circuit on the front body of the substrate includes: The display circuit is manufactured on the front body of the substrate by exposure, development and laser etching.

[0008] As a preferred solution, the inclined climbing angles of the multiple interconnected lines when they are climbing obliquely on the slope are all equal; Before the metal wire driving circuit film is connected to the back surface of the substrate by attaching, the method further includes: Obtaining a display circuit position of the display circuit on the front side of the substrate; Obtaining the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection line; The method of connecting the metal wire driving circuit film to the back surface of the substrate by attaching includes: Get the height of the section plane; Obtaining the attachment offset based on the slope inclination angle design value, the inclined climbing angle design value of the interconnection line, and the step height; Based on the display circuit position and the attachment offset of the display circuit on the front side of the substrate, obtaining the metal wire driving circuit film attachment position of the metal wire driving circuit film on the back side of the substrate; Based on the metal wire driving circuit film attaching position of the metal wire driving circuit film on the reverse side of the substrate, the metal wire driving circuit film is connected to the reverse side of the substrate by attaching.

[0009] As a preferred solution, the method of obtaining the attachment offset based on the slope inclination angle design value, the inclined climbing angle design value of the interconnection line, and the step height includes: Based on the design value of the slope inclination angle and the height of the step surface, the climbing distance required to climb from the bottom of the slope to the top of the slope along the slope inclination direction is obtained; The attachment offset is obtained based on the design value of the oblique climbing angle of the interconnection line and the climbing distance required to climb from the bottom of the slope along the inclination direction of the slope to the top of the slope.

[0010] As a preferred solution, the step of obtaining the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection line includes: Obtaining viscosity of printing materials and line spacing design parameters between interconnected lines; Based on the viscosity of the printing material and the line spacing design parameters between the interconnection lines, the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection lines are obtained.

[0011] As a preferred solution, the step of printing a slope connecting the top edge of the step difference surface and the back surface of the substrate at a position of the step difference surface of the metal wire driving circuit film compared to the back surface of the substrate, comprises: Based on the display circuit position of the display circuit on the front side of the substrate, obtaining the slope manufacturing position parameter of the slope on the back side of the substrate; Based on the slope production position parameters and slope inclination angle design value on the back of the substrate, a slope connecting the top edge of the fault surface and the back of the substrate is produced by printing on the back of the substrate and close to the fault surface position of the metal wire driving circuit film compared to the back of the substrate.

[0012] As a preferred solution, when the multiple interconnection lines are produced by printing, passing through the side of the substrate from the front side of the substrate to the back side of the substrate and climbing obliquely on the slope to achieve connection between the display circuit and the metal wire driving circuit film, the production is based on the design value of the oblique climbing angle of the interconnection line.

[0013] In a second aspect, an embodiment of the present specification provides a display module manufacturing device, based on a display module manufacturing method described in the first aspect of the above embodiment, comprising: A first manufacturing module is used to manufacture a display circuit on the front body of the substrate; An attachment module, used for attaching the obtained metal wire driving circuit film to the back surface of the substrate by means of attachment; The second manufacturing module is used to print a slope connecting the top edge of the step difference surface and the back surface of the substrate at a position of the step difference surface of the metal wire driving circuit film compared to the back surface of the substrate on the back surface of the substrate; The second manufacturing module is also used to manufacture a display module by printing a plurality of interconnection lines that pass through the side of the substrate, go around from the front side of the substrate to the back side of the substrate, and climb obliquely on the slope to achieve connection between the display circuit and the metal wire driving circuit film.

[0014] In a third aspect, an embodiment of the present specification provides a display device, wherein the display device includes a display module manufactured by a display module manufacturing method as described in the first aspect of the above embodiment.

[0015] In a fourth aspect, an embodiment of this specification provides an electronic device, comprising a processor and a memory; the processor is connected to the memory; the memory is used to store executable program code; the processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, so as to execute the steps described in the first aspect of the above embodiment.

[0016] In a fifth aspect, an embodiment of this specification provides a computer storage medium, wherein the computer storage medium stores a plurality of instructions, wherein the instructions are suitable for being loaded by a processor and executing the steps described in the first aspect of the above embodiment.

[0017] The beneficial effects brought by the technical solutions provided by some embodiments of this specification include at least: The required circuit is manufactured on the reverse side of the substrate by attaching a metal wire driving circuit film, and a plurality of interconnection lines are manufactured by printing through the side of the substrate from the front side of the substrate to the reverse side of the substrate to realize the connection between the display circuit and the metal wire driving circuit film, so as to manufacture a display module, thereby reducing the manufacturing cost of the display module; further, since the required circuit is manufactured on the reverse side of the substrate by attaching a metal wire driving circuit film, the metal wire driving circuit film will have a step difference surface compared to the reverse side of the substrate. If the interconnection line is directly printed and climbed through the step difference surface, it is easy for the printed line to accumulate and expand and collapse due to the excessive slope of the step difference surface, thereby reducing the manufacturing cost of the display module. The production yield of the display module is reduced, and the negative impact of this situation is particularly obvious in the manufacturing process of the display module with a smaller interconnection line spacing; therefore, in the display module manufacturing method provided in the embodiment of the present specification, a slope connecting the top edge of the step difference surface and the back of the substrate is made on the back of the substrate and close to the metal wire driving circuit film at the position of the step difference surface compared to the back of the substrate by printing, and the interconnection line is connected to the display circuit and the metal wire driving circuit film by climbing obliquely on the slope, thereby avoiding the accumulation and expansion of the printed circuits and the collapse of the accumulation due to the excessive slope of the step difference surface, thereby providing the possibility of manufacturing display modules with smaller interconnection line spacing.

[0018] Since the circuits on the front of the display module are often more complex, including tiny feature sizes and precise patterns. Exposure, development and laser etching are precise graphical processes that can be used to make very fine lines and spacings to meet the requirements of high-density integrated circuits. Therefore, the display circuit is still made on the front body of the substrate by exposure, development and laser etching. For the circuits for driving the display circuits that are set on the back of the display module and do not require such high precision, the display module manufacturing method provided in the embodiment of this specification adopts the method of attaching a metal wire driving circuit film to complete the manufacturing. For the circuits used to connect the display circuit and the metal wire driving circuit film, the display module manufacturing method provided in the embodiment of this specification adopts the method of printing the circuit to achieve the manufacturing. Thus, on the basis of ensuring the precision of the display module product, the production cost is reduced.

[0019] It can be understood that if the printed length of the interconnection line is to be shorter, the setting position of the metal wire driving circuit film on the back side of the substrate needs to be set based on the position of the display circuit on the front side of the substrate. In the display module manufacturing method provided in the embodiment of this specification, since the interconnection line adopts an oblique climbing method, the interconnection line has a certain degree of deviation compared with the original connection path. Therefore, in the display module manufacturing method provided in the embodiment of this specification, the attachment position of the metal wire driving circuit film on the back side of the substrate needs to be based not only on the position of the display circuit on the front side of the substrate, but also on the offset of the interconnection line due to the oblique climbing. In order to ensure the consistency of the offset of all interconnection lines, it is also limited that the oblique climbing angles of multiple interconnection lines when climbing obliquely on the slope are equal.

[0020] It can be understood that the viscosity of the printing material will affect the ability of the circuit to maintain its shape on the slope. The line spacing design parameters between the interconnected circuits are different, and the requirements for the printed circuit's ability to maintain its shape are different. Therefore, in the display module manufacturing method provided in the embodiment of this specification, based on the viscosity of the printing material and the line spacing design parameters between the interconnected circuits, the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnected circuit are obtained to avoid the printed circuit from piling up or collapsing on the slope. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a flow chart of a display module manufacturing method provided in an embodiment of this specification.

[0023] Figure 2 This is a schematic diagram of the printing route of interconnection lines on the back side of a substrate in a display module manufacturing method provided in an embodiment of this specification.

[0024] Figure 3 It is a structural schematic diagram of slopes of different shapes in a display module manufacturing method provided in an embodiment of this specification.

[0025] Figure 4 It is a schematic diagram of the process of connecting the metal wire driving circuit film to the back side of the substrate by attaching in the embodiment of this specification.

[0026] Figure 5 It is a schematic diagram of the process of obtaining the attachment offset described in the embodiment of this specification.

[0027] Figure 6 It is a structural schematic diagram of an electronic device provided in an embodiment of this specification.

[0028] In the figure: 1, ramp; 2, metal wire driving circuit film; 3, substrate; 4, step difference surface; 600, electronic device; 601, processor; 602, communication bus; 603, user interface; 604, network interface; 605, memory. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of this specification will be described clearly and completely below in conjunction with the drawings in the embodiments of this specification.

[0030] The terms "first", "second", "third", etc. in the description and claims of this specification and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0031] The following description provides examples and does not limit the scope, applicability or examples set forth in the claims. Changes may be made to the functions and arrangements of the elements described without departing from the scope of the present specification. Various processes or components may be appropriately omitted, substituted or added to each example. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted or combined. In addition, features described with respect to some examples may be combined in other examples.

[0032] Reference Figure 1 As shown, Figure 1 A flow chart of a display module manufacturing method provided in an embodiment of this specification, the display module manufacturing method may at least include: Step 102: Make a display circuit on the front body of the substrate 3 (Note: Figure 1 The substrate 3 is not shown in the figure, and it can be understood that Figure 1 All structures in are arranged on the reverse side of the substrate 3); Step 104, obtaining a metal wire driving circuit film 2 (such as FPC, PI, etc.), and connecting the metal wire driving circuit film 2 to the back surface of the substrate 3 by attaching; Step 106, a slope 1 connecting the top edge of the step surface 4 and the back surface of the substrate 3 is made on the back surface of the substrate 3 and close to the metal wire driving circuit film 2 at a position of the step surface 4 compared to the back surface of the substrate 3 by printing; Step 108, a plurality of interconnection lines are made by printing through the side of substrate 3, from the front side of substrate 3 to the back side of substrate 3, and by climbing obliquely on slope 1 to connect the display circuit with the metal wire driving circuit film 2, so as to manufacture a display module.

[0033] The display module manufacturing method provided in the embodiment of the present specification manufactures the required circuit on the back side of the substrate 3 by attaching a metal wire driving circuit film 2, and manufactures a plurality of interconnection lines by printing through the side of the substrate 3 from the front side of the substrate 3 to the back side of the substrate 3 to realize the connection between the display circuit and the metal wire driving circuit film 2, so as to manufacture the display module, thereby reducing the manufacturing cost of the display module; further, because the required circuit is manufactured on the back side of the substrate 3 by attaching the metal wire driving circuit film 2, the metal wire driving circuit film 2 will have a step difference surface 4 compared with the back side of the substrate 3. If the interconnection line is directly printed and climbed through the step difference surface 4, it is easy for the printed line to accumulate and expand due to the excessive slope of the step difference surface 4, and The pile-up and collapse situation reduces the production yield of the display module, and the negative impact of this situation is particularly obvious in the manufacturing process of the display module with a smaller interconnection line spacing; therefore, in the display module manufacturing method provided in the embodiment of the present specification, a slope 1 connecting the top edge of the step surface 4 and the back of the substrate 3 is made on the back of the substrate 3 and close to the metal wire driving circuit film 2 at a position relative to the step surface 4 on the back of the substrate 3 by printing, and the interconnection line is connected to the metal wire driving circuit film 2 by climbing obliquely on the slope 1, thereby avoiding the pile-up expansion and pile-up collapse of the printed circuit due to the excessive slope of the step surface 4, thereby providing the possibility of manufacturing display modules with smaller interconnection line spacing.

[0034] Please refer to Figure 2 As shown, Figure 2 It shows that the interconnection line climbs from the back side of the substrate 3 through the slope 1 to the metal wire driving circuit film 2 and is connected to the metal wire driving circuit film 2 (Note: Figure 2 The arrow in the middle indicates the direction of connection of the interconnection line).

[0035] Reference Figure 3 As shown, the slope 1 can take different shapes, including an inclined slope 1 and an arcuate slope 1, which can achieve the above technical effects. However, it should be noted that in the following multiple embodiments of this specification, if the slope inclination angle and the oblique climbing angle of the interconnection line are involved, it means that the slope 1 is an inclined slope, that is, Figure 2The slope shape shown in .

[0036] In one embodiment of the present specification, the manufacturing of the display circuit on the front body of the substrate 3 includes: The display circuit is manufactured on the front body of the substrate 3 by means of exposure, development and laser etching.

[0037] Since the circuit on the front of the display module is often more complex, including tiny feature sizes and precise patterns. Exposure development and laser etching are precise graphical processes that can be used to make very fine lines and spacings to meet the requirements of high-density integrated circuits. Therefore, the display circuit is still made on the front body of the substrate 3 by exposure development and laser etching. For the circuit that is set on the back of the display module and is used to drive the display circuit, which does not require so much precision, the display module manufacturing method provided in the embodiment of this specification adopts the method of attaching the metal wire driving circuit film 2 to complete the production. For the circuit used to connect the display circuit and the metal wire driving circuit film 2, the display module manufacturing method provided in the embodiment of this specification adopts the method of printing the circuit to achieve production. Thus, on the basis of ensuring the precision of the display module product, the production cost is reduced.

[0038] In one embodiment of the present specification, the slope climbing angles of the plurality of interconnection lines when performing slope climbing on slope 1 are all equal; Before the metal wire driving circuit film 2 is connected to the back surface of the substrate 3 by attaching, the method further includes: Obtaining a display circuit position of the display circuit on the front side of the substrate 3; Obtain the design value of the slope 1 inclination angle (the slope 1 inclination angle is the angle between the slope 1 and the horizontal plane) and the design value of the oblique climbing angle of the interconnection line (the oblique climbing angle is the angle between the interconnection line direction and the slope 1 inclination direction); Reference Figure 4 As shown, the metal wire driving circuit film 2 is connected to the back surface of the substrate 3 by attaching, including: Step 402, obtaining the height of the section plane 4; Step 404, obtaining an attachment offset based on a designed value of a slope inclination angle, a designed value of an oblique climbing angle of an interconnection line, and a height of a step difference surface; Step 406, based on the display circuit position and the attachment offset of the display circuit on the front side of the substrate 3, obtaining the metal wire driving circuit film attachment position of the metal wire driving circuit film 2 on the back side of the substrate 3; Step 408 , based on the metal wire driving circuit film attachment position of the metal wire driving circuit film 2 on the back surface of the substrate 3 , connect the metal wire driving circuit film 2 to the back surface of the substrate by attaching.

[0039] It can be understood that if the printed length of the interconnection line is to be shorter, the setting position of the metal wire driving circuit film 2 on the back side of the substrate 3 needs to be set based on the position of the display circuit on the front side of the substrate 3. In the display module manufacturing method provided in the embodiment of this specification, since the interconnection line adopts an oblique climbing method, the interconnection line has a certain degree of deviation compared with the original connection path. Therefore, in the display module manufacturing method provided in the embodiment of this specification, the attachment position of the metal wire driving circuit film 2 on the back side of the substrate 3 needs to be based not only on the position of the display circuit on the front side of the substrate 3, but also on the offset of the interconnection line due to the oblique climbing. In order to ensure the consistency of the offset of all interconnection lines, it is also limited that the oblique climbing angles of multiple interconnection lines when performing oblique climbing on the slope 1 are equal.

[0040] Reference Figure 5 As shown, in one embodiment of the present specification, the step of obtaining the attachment offset based on the slope inclination angle design value, the inclined climbing angle design value of the interconnection line, and the step height includes: Step 502: Based on the designed slope inclination angle and the height of the step surface, obtain the climbing distance required to climb from the bottom of the slope to the top of the slope along the slope inclination direction; Step 504 : Obtain an attachment offset based on the design value of the inclined climbing angle of the interconnection line and the climbing distance required to climb from the bottom of the slope to the top of the slope along the inclination direction of the slope.

[0041] It can be understood that the climbing distance X=△h / sinα, where α represents the slope inclination angle and △h represents the step height.

[0042] The attachment offset ΔL=X*tanβ, where β represents the slope climbing angle of the interconnection line on slope 1.

[0043] In one embodiment of the present specification, the step of obtaining a design value of a slope inclination angle and a design value of an oblique climbing angle of an interconnection line includes: Obtaining viscosity of printing materials and line spacing design parameters between interconnected lines; Based on the viscosity of the printing material and the line spacing design parameters between the interconnection lines, the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection lines are obtained.

[0044] It can be understood that the viscosity of the printing material will affect the ability of the circuit to maintain its shape on the slope. The line spacing design parameters between the interconnected circuits are different, and the requirements for the printed circuit's ability to maintain its shape are different. Therefore, in the display module manufacturing method provided in the embodiment of this specification, based on the viscosity of the printing material and the line spacing design parameters between the interconnected circuits, the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnected circuit are obtained to avoid the printed circuit from piling up or collapsing on slope 1.

[0045] Specifically, a parameter design table may be obtained in advance, wherein the parameter design table has multiple design parameter groups, each of which has corresponding printing material viscosity parameters, line spacing design parameters, slope inclination angle parameters, and interconnection line oblique climbing angle parameters, and the parameter design in any design parameter group may avoid the phenomenon of stacking expansion or stacking collapse of the printed lines on the slope 1, or may avoid the situation where the line spacing design parameters cannot be achieved due to the stacking expansion or stacking collapse of the printed lines on the slope 1. Multiple design parameter groups may be obtained through multiple experiments in advance.

[0046] Therefore, in the embodiment of the present specification, the process of printing the slope 1 connecting the top edge of the step surface 4 and the back surface of the substrate 3 on the back surface of the substrate 3 and close to the metal wire driving circuit film 2 at a position of the step surface 4 compared to the back surface of the substrate 3 includes: Based on the display circuit position of the display circuit on the front surface of the substrate 3, the slope manufacturing position parameters of the slope 1 on the back surface of the substrate 3 are obtained; Based on the slope manufacturing position parameters and the slope inclination angle design value of the slope 1 on the back side of the substrate 3, a slope 1 connecting the top edge of the fault surface 4 and the back side of the substrate 3 is manufactured on the back side of the substrate 3 and close to the metal wire driving circuit film 2 at a position relative to the fault surface 4 on the back side of the substrate 3 by printing.

[0047] When the multiple interconnection lines are made by printing through the side of the substrate 3, from the front side of the substrate 3 to the back side of the substrate 3 and by climbing obliquely on the slope 2 to achieve connection between the display circuit and the metal wire driving circuit film 2, the production is based on the design value of the oblique climbing angle of the interconnection line.

[0048] In one embodiment of the present specification, tanβ≤2, where β represents the slope climbing angle of the interconnection line on slope 1.

[0049] Understandably, the inclined climbing angle cannot be too large, as it will cause the printed circuit materials to pile up and collapse.

[0050] In one embodiment of the present specification, 5≥tanα≥1 / 5, where α represents the slope inclination angle.

[0051] It is understandable that the slope inclination angle cannot be too small or too large. If it is too large, it will cause the printed circuit material to accumulate and expand or collapse. If it is too small, it will cause the slope 1 to be too large.

[0052] In one embodiment of the present specification, the slope inclination angle is greater than the slope climbing angle of the interconnection line on slope 1.

[0053] It can be understood that the slope inclination angle is greater than the inclined climbing angle of the interconnection line, which can further prevent the printed line material from piling up and expanding or piling up and collapsing.

[0054] That is, the setting of the oblique climbing angle and the slope inclination angle is limited accordingly to avoid the phenomenon of accumulation expansion or accumulation collapse of the printed circuit on the slope 1 and to avoid the slope 1 being too large.

[0055] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0056] This specification also provides a display module manufacturing device, based on a display module manufacturing method described in the above embodiment, characterized by comprising: The first manufacturing module is used to manufacture a display circuit on the front body of the substrate 3; An attaching module, used to connect the obtained metal wire driving circuit film 2 to the back surface of the substrate 3 by attaching; The second manufacturing module is used to print a slope 1 connecting the top edge of the step surface 4 and the back surface of the substrate 3 at a position of the step surface 4 on the back surface of the substrate 3 and close to the metal wire driving circuit film 2; The second manufacturing module is also used to manufacture a plurality of interconnection lines by printing, passing through the side surface of the substrate 3, winding from the front surface of the substrate 3 to the back surface of the substrate 3 and climbing obliquely on the slope 1 to realize the connection between the display circuit and the metal wire driving circuit film 2, so as to manufacture a display module.

[0057] The embodiment of this specification also provides a display device, which includes a display module manufactured by the display module manufacturing method described in the above embodiment. The display device can be, but is not limited to, a display screen or a mobile phone and iPad with a display screen.

[0058] See also Figure 6A schematic diagram of the structure of an electronic device provided in an embodiment of this specification is shown.

[0059] like Figure 6 As shown, the electronic device 600 may include: at least one processor 601 , at least one network interface 604 , a user interface 603 , a memory 605 , and at least one communication bus 602 .

[0060] The communication bus 602 may be used to realize the connection and communication among the above-mentioned components.

[0061] The user interface 603 may include buttons, and the optional user interface may also include a standard wired interface or a wireless interface.

[0062] The network interface 604 may include, but is not limited to, a Bluetooth module, an NFC module, a Wi-Fi module, etc.

[0063] Among them, the processor 601 may include one or more processing cores. The processor 601 uses various interfaces and lines to connect the various parts of the entire electronic device 600, and executes various functions and processes data of the electronic device 600 by running or executing instructions, programs, code sets or instruction sets stored in the memory 605, and calling data stored in the memory 605. Optionally, the processor 601 can be implemented in at least one hardware form of DSP, FPGA, and PLC. The processor 601 can integrate one or a combination of CPU, GPU, modem, etc. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 601, and it can be implemented separately through a chip.

[0064] Among them, the memory 605 may include RAM or ROM. Optionally, the memory 605 includes a non-transitory computer-readable medium. The memory 605 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 605 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 605 may also be at least one storage device located away from the aforementioned processor 601. The memory 605 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a display module manufacturing application. The processor 601 may be used to call the display module manufacturing application stored in the memory 605 and execute the steps of the display module manufacturing method mentioned in the above-mentioned embodiment.

[0065] The embodiments of this specification also provide a computer-readable storage medium, which stores instructions, and when the instructions are executed on a computer or a processor, the computer or the processor executes one or more steps in the above-mentioned display module manufacturing method embodiment. If the components of the above-mentioned electronic device are implemented in the form of software functional units and sold or used as independent products, they can be stored in the computer-readable storage medium.

[0066] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented by software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of this specification is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a digital versatile disc (DVD)), or a semiconductor medium (eg, a solid state drive (SSD)).

[0067] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. The aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other media that can store program codes. In the absence of conflict, the technical features in this embodiment and the implementation scheme can be combined arbitrarily.

[0068] The embodiments described above are merely preferred embodiments of this specification and are not intended to limit the scope of this specification. Without departing from the design spirit of this specification, various modifications and improvements made to the technical solutions of this specification by ordinary technicians in this field should fall within the scope of protection determined by the claims of this specification.

Claims

1. A method for manufacturing a display module, characterized in that: include: Manufacturing a display circuit on the front body of the substrate; Obtaining a metal wire driving circuit film, and connecting the metal wire driving circuit film to the back surface of the substrate by attaching; A slope connecting the top edge of the step difference surface and the back surface of the substrate is formed by printing on the back surface of the substrate and close to the metal wire driving circuit film at a position of the step difference surface compared to the back surface of the substrate; A display module is manufactured by printing a plurality of interconnection lines that pass through the side of the substrate and go around from the front side of the substrate to the back side of the substrate and climb obliquely on the slope to achieve connection between the display circuit and the metal wire driving circuit film.

2. A display module manufacturing method according to claim 1, characterized in that: The method of manufacturing a display circuit on the front body of the substrate comprises: The display circuit is manufactured on the front body of the substrate by exposure, development and laser etching.

3. The method for manufacturing a display module according to claim 1, characterized in that: The inclined climbing angles of the multiple interconnected lines when they are climbing diagonally on the slope are all equal; Before the metal wire driving circuit film is connected to the back surface of the substrate by attaching, the method further includes: Obtaining a display circuit position of the display circuit on the front side of the substrate; Obtaining the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection line; The method of connecting the metal wire driving circuit film to the back surface of the substrate by attaching includes: Get the height of the section plane; Obtaining the attachment offset based on the slope inclination angle design value, the inclined climbing angle design value of the interconnection line, and the step height; Based on the display circuit position and the attachment offset of the display circuit on the front side of the substrate, obtaining the metal wire driving circuit film attachment position of the metal wire driving circuit film on the back side of the substrate; Based on the metal wire driving circuit film attaching position of the metal wire driving circuit film on the reverse side of the substrate, the metal wire driving circuit film is connected to the reverse side of the substrate by attaching.

4. A method for manufacturing a display module according to claim 3, characterized in that: The step of obtaining the attachment offset based on the slope inclination angle design value, the inclined climbing angle design value of the interconnection line, and the step height includes: Based on the design value of the slope inclination angle and the height of the step surface, the climbing distance required to climb from the bottom of the slope to the top of the slope along the slope inclination direction is obtained; The attachment offset is obtained based on the design value of the oblique climbing angle of the interconnection line and the climbing distance required to climb from the bottom of the slope along the inclination direction of the slope to the top of the slope.

5. The method for manufacturing a display module according to claim 3, characterized in that: The step of obtaining the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection line comprises: Obtaining viscosity of printing materials and line spacing design parameters between interconnected lines; Based on the viscosity of the printing material and the line spacing design parameters between the interconnection lines, the design value of the slope inclination angle and the design value of the oblique climbing angle of the interconnection lines are obtained.

6. A method for manufacturing a display module according to claim 5, characterized in that: The method of printing a slope connecting the top edge of the step difference surface and the back surface of the substrate at a position of the step difference surface of the metal wire driving circuit film compared to the back surface of the substrate comprises: Based on the display circuit position of the display circuit on the front side of the substrate, obtaining the slope manufacturing position parameter of the slope on the back side of the substrate; Based on the slope production position parameters and slope inclination angle design value on the back of the substrate, a slope connecting the top edge of the fault surface and the back of the substrate is produced by printing on the back of the substrate and close to the fault surface position of the metal wire driving circuit film compared to the back of the substrate.

7. The method for manufacturing a display module according to claim 5, characterized in that: When the multiple interconnection lines are produced by printing, passing through the side of the substrate from the front side of the substrate to the back side of the substrate and climbing obliquely on the slope to connect the display circuit and the metal wire driving circuit film, the production is based on the design value of the oblique climbing angle of the interconnection line.

8. A display module manufacturing device, based on a display module manufacturing method according to any one of claims 1 to 7, characterized in that: include: A first manufacturing module is used to manufacture a display circuit on the front body of the substrate; An attachment module, used for attaching the obtained metal wire driving circuit film to the back surface of the substrate by means of attachment; The second manufacturing module is used to print a slope connecting the top edge of the step difference surface and the back surface of the substrate at a position of the step difference surface of the metal wire driving circuit film compared to the back surface of the substrate on the back surface of the substrate; The second manufacturing module is also used to manufacture a display module by printing a plurality of interconnection lines that pass through the side of the substrate, go around from the front side of the substrate to the back side of the substrate, and climb obliquely on the slope to achieve connection between the display circuit and the metal wire driving circuit film.

9. A display device, characterized in that: The display device comprises a display module manufactured by a display module manufacturing method as described in any one of claims 1 to 7.

10. An electronic device, characterized in that: including a processor and a memory; The processor is connected to the memory; The memory is used to store executable program code; The processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, so as to execute the method according to any one of claims 1 to 7.

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