PCB via hole copper paste pouring device and process thereof

Abstract

The invention discloses a PCB via hole copper paste pouring device and technology, and relates to the technical field of PCB processing, and the technical scheme is that the PCB via hole copper paste pouring device comprises a bottom plate, a first motor is fixedly arranged at the bottom of the bottom plate, the output end of the first motor is fixedly connected with a rotating rod, the rotating rod penetrates through the bottom plate and is connected with the bottom plate through a bearing, and one end of the rotating rod is fixedly connected with a circular truncated cone; multiple limiting mechanisms are arranged at the top of the circular truncated cone; the limiting mechanism comprises a vertical plate which is fixedly arranged at the top of the circular truncated cone, two baffles are fixedly arranged on one side of the vertical plate, a side groove is formed in one side of the vertical plate, a transmission rod is connected into the side groove through a bearing, and the transmission rod penetrates through the vertical plate and the circular truncated cone and is connected with the joint of the vertical plate and the circular truncated cone through a bearing. The beneficial effects are that through cooperative work of the motor, the electric push rod, the camera monitor, the pump machine and other devices, the steps of positioning, pressing, grouting, curing, pressure releasing and the like of the PCB can be automatically completed, dependence of manual operation is greatly reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB processing, and in particular to a PCB via hole copper slurry filling device and a process thereof. Background Art

[0002] PCB copper paste filling is an important process in the PCB (printed circuit board) manufacturing process. It uses a specific process to fill copper paste into the holes or idle spaces of the printed circuit board to enhance the circuit board's conductivity, heat dissipation efficiency and structural strength.

[0003] The existing PCB copper paste is poured manually, which is inefficient and costly. Summary of the invention

[0004] To this end, the present invention provides a PCB via hole copper slurry filling device and a process thereof to solve the problem of low efficiency and high cost of manual copper slurry filling of PCB.

[0005] In order to achieve the above-mentioned object, the present invention provides the following technical solution: a PCB via copper paste filling device, comprising a bottom plate, a first motor is fixedly provided at the bottom of the bottom plate, a rotating rod is fixedly connected to the output end of the first motor, the rotating rod passes through the bottom plate and is connected to the bottom plate connection through a bearing, one end of the rotating rod is fixedly connected to a round table, and a plurality of limit mechanisms are provided on the top of the round table;

[0006] The limiting mechanism includes a vertical plate, which is fixed on the top of the truncated table, two baffles are fixedly provided on one side of the vertical plate, a side groove is opened on one side of the vertical plate, a transmission rod is connected to the inside of the side groove through a bearing, the transmission rod passes through the vertical plate and the truncated table and is connected to the connection between the vertical plate and the truncated table through a bearing, one end of the transmission rod is fixedly connected to a gear, a block is provided on the outside of the transmission rod through a threaded sleeve, a U-shaped pressure plate is fixedly provided on one side of the block, and a U-shaped pad is fixedly provided at the bottom of the U-shaped pressure plate.

[0007] Preferably, a slide groove is provided at the bottom of the truncated table, a sliding block is provided inside the slide groove, a tooth plate is fixedly provided on one side of the sliding block, side plates are fixedly provided on both sides of the tooth plate, and the tooth plate is meshed with the gear.

[0008] Preferably, a fourth electric push rod is fixedly provided on the top of the base plate.

[0009] Preferably, a perfusion mechanism and a curing mechanism are respectively provided on one side of the base plate, and the perfusion mechanism comprises a first side frame, the first side frame is fixedly provided on one side of the base plate, a second electric push rod is fixedly provided on the top of the first side frame, an output end of the second electric push rod is fixedly connected to a connecting frame, a circular plate is fixedly provided on the bottom of the connecting frame, a third motor is fixedly provided on the top of the circular plate, a transmission shaft is fixedly connected to the output end of the third motor, one end of the transmission shaft is fixedly connected to a connecting plate, a bottom groove is provided at the bottom of the connecting plate, a second motor is fixedly provided on one side of the connecting plate, a screw rod is fixedly connected to the output end of the second motor, the screw rod is connected to the inner wall of the bottom groove through a bearing, a sliding block is provided on the outside of the screw rod through a threaded sleeve, a grouting head is fixedly provided on one side of the sliding block, a camera is fixedly installed on the bottom of the connecting plate, a storage box is fixedly provided on one side of the first side frame, a pump is fixedly provided on the top of the storage box, the pump input end extends into the interior of the storage box, and a connecting hose is fixedly connected to the output end of the pump, and the connecting hose is fixedly connected to the grouting head.

[0010] Preferably, a feeding pipe is fixedly provided on the top of the storage box.

[0011] Preferably, the curing mechanism includes a second side frame, the second side frame is fixedly provided on one side of the bottom plate, a third electric push rod is fixedly provided on the top of the second side frame, the output end of the third electric push rod is fixedly connected to a cover shell, and a plurality of heating rods are fixedly connected inside the cover shell.

[0012] Preferably, a fixing plate is fixedly provided on one side of the bottom plate, and a first electric push rod is fixedly provided on the top of the fixing plate.

[0013] Preferably, support columns are fixedly provided at the four corners of the bottom of the base plate.

[0014] The PCB via copper paste filling process includes the following steps:

[0015] S1. Place the PCB board between the two baffles of the limiting mechanism on the surface of the truncated table, and then start the fourth electric push rod. The output end of the fourth electric push rod contacts the side plate and pushes the toothed plate to move. The toothed plate drives the gear to rotate, the gear drives the transmission rod to rotate, the transmission rod drives the block to move downward, the block drives the U-shaped pressure plate to move downward, the U-shaped pressure plate drives the U-shaped pad to move downward, the U-shaped pad presses the PCB board to limit the position to prevent the PCB board from moving during grouting, and then start the first motor. The first motor controls the rotation rod to rotate, the rotation rod drives the truncated table to rotate, and the truncated table drives the PCB board pressed on the surface to move to the bottom of the connecting plate;

[0016] S2, detect the hole position on the PCB board through the camera at the bottom of the connecting plate, then start the second motor, the second motor controls the screw rod to rotate, the screw rod drives the sliding block to rotate, the sliding block drives the grouting head to move, then start the third motor, the third motor controls the transmission shaft to rotate, the transmission shaft drives the connecting plate to rotate, the connecting plate drives the grouting head to rotate, so that the grouting head is aligned with the hole position, then start the second electric push rod, the second electric push rod controls the connecting plate to move downward, the connecting plate drives the grouting head to move downward, so that the grouting head is close to the hole, start the pump, the pump injects the copper slurry inside the storage box into the hole, and then continue to control the rotation of the round table, the round table drives the PCB board on the limit mechanism to move to the bottom of the cover shell;

[0017] S3, start the third electric push rod, the third electric push rod controls the cover to move down, the cover covers the PCB board, and then the heating rod heats the PCB board, and the PCB board filled with copper paste is heated to make the copper paste solidify in the hole and tightly bonded to the hole wall, and then continue to control the PCB board to move to the side of the first electric push rod, and then start the first electric push rod, the output end of the first electric push rod contacts the side plate and pushes the side plate to move, the side plate pushes the tooth plate to move, the tooth plate drives the gear to rotate, the gear drives the transmission rod to rotate, the transmission rod drives the block to move up, the block drives the U-shaped pressure plate to move up, the U-shaped pressure plate drives the U-shaped pad to move up, the U-shaped pad moves up so that the PCB board is no longer pressed, the PCB board is removed, and then the cured PCB board is cleaned, polished and other subsequent treatments are performed to remove excess copper paste and impurities, so that the board surface is flat and smooth.

[0018] The embodiments of the present invention have the following advantages:

[0019] 1. Through the coordinated work of motors, electric push rods, camera monitoring, pumps and other equipment, the positioning, pressing, grouting, curing and loosening of PCB boards can be automatically completed, greatly reducing the reliance on manual operations and improving production efficiency;

[0020] 2. The camera module can monitor the hole positions on the PCB board in real time, ensuring that the grouting head can accurately align with the hole positions for grouting, avoiding errors that may be caused by manual operation, ensuring the accuracy and consistency of grouting, and thus improving the quality of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0022] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0023] Figure 1 A schematic diagram of the overall structure provided by the present invention;

[0024] Figure 2 A three-dimensional diagram of a truncated cone provided by the present invention;

[0025] Figure 3 A three-dimensional diagram of the limiting mechanism provided by the present invention;

[0026] Figure 4 The perfusion mechanism provided by the present invention is three-dimensional Figure 1 ;

[0027] Figure 5 A three-dimensional diagram of the curing mechanism provided by the present invention;

[0028] Figure 6 The perfusion mechanism provided by the present invention is three-dimensional Figure 2 .

[0029] In the figure: 1, bottom plate; 2, first motor; 3, support column; 4, fixing plate; 5, first electric push rod; 6, round table; 7, first side frame; 8, second electric push rod; 9, connecting plate; 10, second side frame; 11, third electric push rod; 12, cover; 13, storage box; 14, pump; 15, connecting hose; 16, feeding pipe; 17, grouting head; 18, vertical plate; 19, baffle; 20, rotating rod; 21 , slide groove; 22, slider; 23, tooth plate; 24, side plate; 25, gear; 26, fourth electric push rod; 27, transmission rod; 28, side groove; 29, block; 30, U-shaped pressure plate; 31, U-shaped pad; 32, second motor; 33, bottom groove; 34, camera module; 35, screw rod; 36, sliding block; 37, heating rod; 38, connecting frame; 39, round plate; 40, third motor; 41, transmission shaft. DETAILED DESCRIPTION

[0030] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Refer to the attached Figure 1 -Attached Figure 6 The PCB via copper paste filling device provided by the present invention comprises a bottom plate 1, a first motor 2 is fixedly provided at the bottom of the bottom plate 1, a rotating rod 20 is fixedly connected to the output end of the first motor 2, the rotating rod 20 passes through the bottom plate 1 and is connected to the bottom plate 1 at the connection point through a bearing, one end of the rotating rod 20 is fixedly connected to a round table 6, and a plurality of limiting mechanisms are provided on the top of the round table 6;

[0032] The limiting mechanism includes a vertical plate 18, which is fixed on the top of the truncated table 6. Two baffles 19 are fixedly provided on one side of the vertical plate 18. A side groove 28 is opened on one side of the vertical plate 18. A transmission rod 27 is connected to the inside of the side groove 28 through a bearing. The transmission rod 27 passes through the vertical plate 18 and the truncated table 6 and is connected to the connection between the vertical plate 18 and the truncated table 6 through a bearing. One end of the transmission rod 27 is fixedly connected to a gear 25. The outside of the transmission rod 27 is provided with a block 29 through a threaded sleeve. The block 29 is A U-shaped pressing plate 30 is fixedly provided on the side, a U-shaped pad 31 is fixedly provided at the bottom of the U-shaped pressing plate 30, a slide groove 21 is opened at the bottom of the round table 6, a slider 22 is provided inside the slide groove 21, a tooth plate 23 is fixedly provided on one side of the slider 22, side plates 24 are fixedly provided on both sides of the tooth plate 23, the tooth plate 23 is meshed with a gear 25, a fourth electric push rod 26 is fixedly provided on the top of the bottom plate 1, a fixed plate 4 is fixedly provided on one side of the bottom plate 1, and a first electric push rod 5 is fixedly provided on the top of the fixed plate 4;

[0033] In this embodiment, the PCB board is placed between the two baffles 19 of the limiting mechanism on the surface of the truncated table 6, and then the fourth electric push rod 26 is started, the output end of the fourth electric push rod 26 contacts the side plate 24 and pushes the toothed plate 23 to move, the toothed plate 23 drives the gear 25 to rotate, the gear 25 drives the transmission rod 27 to rotate, the transmission rod 27 drives the block 29 to move downward, the block 29 drives the U-shaped pressure plate 30 to move downward, the U-shaped pressure plate 30 drives the U-shaped pad 31 to move downward, and the U-shaped pad 31 presses the PCB board to limit the position;

[0034] Among them, in order to achieve the purpose of perfusion, the present device is implemented by the following technical solutions: a perfusion mechanism and a curing mechanism are respectively provided on one side of the bottom plate 1, and the perfusion mechanism includes a first side frame 7, the first side frame 7 is fixedly arranged on one side of the bottom plate 1, a second electric push rod 8 is fixedly arranged on the top of the first side frame 7, and the output end of the second electric push rod 8 is fixedly connected to a connecting frame 38, a circular plate 39 is fixedly arranged at the bottom of the connecting frame 38, a third motor 40 is fixedly arranged on the top of the circular plate 39, and a transmission shaft 41 is fixedly connected to the output end of the third motor 40, and one end of the transmission shaft 41 is fixedly connected to a connecting plate 9, a bottom groove 33 is opened at the bottom of the connecting plate 9, a second motor 32 is fixedly arranged on one side of the connecting plate 9, and a screw rod 35 is fixedly connected to the output end of the second motor 32, and the screw rod 35 is connected to the inner wall of the bottom groove 33 through a bearing, and a sliding block 36 is fixedly arranged on the outside of the screw rod 35 through a threaded sleeve, and a grouting head 17 is fixedly arranged on one side of the sliding block 36, and a camera 34 is fixedly installed on the bottom of the connecting plate 9, and a second motor 32 is fixedly arranged on one side of the first side frame 7. There is a storage box 13, a pump 14 is fixedly arranged on the top of the storage box 13, the input end of the pump 14 extends into the storage box 13, the output end of the pump 14 is fixedly connected to a connecting hose 15, the connecting hose 15 is fixedly connected to a grouting head 17, a feeding pipe 16 is fixedly arranged on the top of the storage box 13, a camera 34 at the bottom of the connecting plate 9 monitors the hole position on the PCB board, and then the second motor 32 is started, the second motor 32 controls the screw rod 35 to rotate, the screw rod 35 drives the sliding block 36 to rotate, and the sliding block 36 The grouting head 17 is driven to move, and then the third motor 40 is started. The third motor 40 controls the transmission shaft 41 to rotate. The transmission shaft 41 drives the connecting plate 9 to rotate. The connecting plate 9 drives the grouting head 17 to rotate, so that the grouting head 17 is aligned with the hole position. Then the second electric push rod 8 is started. The second electric push rod 8 controls the connecting plate 9 to move downward. The connecting plate 9 drives the grouting head 17 to move downward, so that the grouting head 17 is close to the hole. The pump 14 is started. The pump 14 injects the copper paste inside the storage box 13 into the hole. The camera module model is set to Monarch Pro multi-spectral PCB camera module;

[0035] Among them, in order to achieve the purpose of curing, the present device adopts the following technical solutions: the curing mechanism includes a second side frame 10, the second side frame 10 is fixedly arranged on one side of the bottom plate 1, a third electric push rod 11 is fixedly arranged on the top of the second side frame 10, the output end of the third electric push rod 11 is fixedly connected to a cover 12, a plurality of heating rods 37 are fixedly connected inside the cover 12, the third electric push rod 11 is started, the third electric push rod 11 controls the cover 12 to move downward, the cover 12 covers the PCB board, and then the heating rod 37 heats the PCB board, the PCB board filled with copper paste is heated, and the copper paste is cured in the hole and tightly combined with the hole wall;

[0036] In order to achieve the purpose of support, the device is implemented by adopting the following technical solution: support columns 3 are fixedly provided at the four corners of the bottom of the base plate 1, and the support columns 3 have the function of supporting the base plate 1.

[0037] The PCB via copper paste filling process includes the following steps:

[0038] S1. Place the PCB board between the two baffles 19 of the limiting mechanism on the surface of the truncated table 6, and then start the fourth electric push rod 26. The output end of the fourth electric push rod 26 contacts the side plate 24 and pushes the toothed plate 23 to move. The toothed plate 23 drives the gear 25 to rotate. The gear 25 drives the transmission rod 27 to rotate. The transmission rod 27 drives the block 29 to move downward. The block 29 drives the U-shaped pressing plate 30 to move downward. The U-shaped pressing plate 30 drives the U-shaped pad 31 to move downward. The U-shaped pad 31 presses the PCB board to limit the position to prevent the PCB board from moving during grouting. Then start the first motor 2. The first motor 2 controls the rotation rod 20 to rotate. The rotation rod 20 drives the truncated table 6 to rotate. The truncated table 6 drives the PCB board pressed on the surface to move to the bottom of the connecting plate 9.

[0039] S2, monitor the hole position on the PCB board through the camera 34 at the bottom of the connecting plate 9, then start the second motor 32, the second motor 32 controls the screw rod 35 to rotate, the screw rod 35 drives the sliding block 36 to rotate, the sliding block 36 drives the grouting head 17 to move, then start the third motor 40, the third motor 40 controls the transmission shaft 41 to rotate, the transmission shaft 41 drives the connecting plate 9 to rotate, the connecting plate 9 drives the grouting head 17 to rotate, so that the grouting head 17 is aligned with the hole position, then start the second electric push rod 8, the second electric push rod 8 controls the connecting plate 9 to move downward, the connecting plate 9 drives the grouting head 17 to move downward, so that the grouting head 17 is close to the hole, start the pump 14, the pump 14 injects the copper slurry inside the storage box 13 into the hole, then continue to control the rotation of the round table 6, the round table 6 drives the PCB board on the limit mechanism to move to the bottom of the cover 12;

[0040] S3, start the third electric push rod 11, the third electric push rod 11 controls the cover shell 12 to move downward, the cover shell 12 covers the PCB board, and then the heating rod 37 heats the PCB board, and the PCB board filled with copper paste is heated to make the copper paste solidify in the hole and tightly bonded to the hole wall, and then continue to control the PCB board to move to the side of the first electric push rod 5, and then start the first electric push rod 5, the output end of the first electric push rod 5 contacts the side plate 24 and pushes the side plate 24 to move, the side plate 24 pushes the tooth plate 23 to move, the tooth plate 23 drives the gear 25 to rotate, the gear 25 drives the transmission rod 27 to rotate, the transmission rod 27 drives the block 29 to move upward, the block 29 drives the U-shaped pressing plate 30 to move upward, the U-shaped pressing plate 30 drives the U-shaped pad 31 to move upward, the U-shaped pad 31 moves upward so that the PCB board is no longer pressed, the PCB board is removed, and then the cured PCB board is cleaned, polished and other subsequent treatments are performed to remove excess copper paste and impurities so that the board surface reaches a flat and smooth state.

[0041] The use process of the present invention is as follows: when using the present invention, the PCB board is placed between the two baffles 19 of the limiting mechanism on the surface of the round table 6, and then the fourth electric push rod 26 is started, the output end of the fourth electric push rod 26 contacts the side plate 24 and pushes the toothed plate 23 to move, the toothed plate 23 drives the gear 25 to rotate, the gear 25 drives the transmission rod 27 to rotate, the transmission rod 27 drives the block 29 to move downward, the block 29 drives the U-shaped pressing plate 30 to move downward, the U-shaped pressing plate 30 drives the U-shaped pad 31 to move downward, the U-shaped pad 31 presses the PCB board to limit the position to prevent the PCB board from moving during grouting, and then the first The first motor 2 controls the rotating rod 20 to rotate, the rotating rod 20 drives the round table 6 to rotate, the round table 6 drives the PCB board pressed on the surface to move to the bottom of the connecting plate 9, and the camera 34 at the bottom of the connecting plate 9 monitors the hole position on the PCB board, and then starts the second motor 32, the second motor 32 controls the screw rod 35 to rotate, the screw rod 35 drives the sliding block 36 to rotate, the sliding block 36 drives the grouting head 17 to move, and then starts the third motor 40, the third motor 40 controls the transmission shaft 41 to rotate, the transmission shaft 41 drives the connecting plate 9 to rotate, and the connecting plate 9 drives the grouting head 17 to rotate, so that the grouting The grouting head 17 is aligned with the hole position, and then the second electric push rod 8 is started. The second electric push rod 8 controls the connection plate 9 to move downward, and the connection plate 9 drives the grouting head 17 to move downward, so that the grouting head 17 is close to the hole, and the pump 14 is started. The pump 14 injects the copper slurry inside the storage box 13 into the hole, and then the round table 6 is continued to be controlled to rotate. The round table 6 drives the PCB board on the limit mechanism to move to the bottom of the cover shell 12, and the third electric push rod 11 is started. The third electric push rod 11 controls the cover shell 12 to move downward, and the cover shell 12 covers the PCB board. Then the heating rod 37 heats the PCB board, and the PCB board filled with copper slurry is heated. The copper paste is solidified in the hole and tightly combined with the hole wall, and then the PCB board is continued to be controlled to move to the side of the first electric push rod 5, and then the first electric push rod 5 is started, the output end of the first electric push rod 5 contacts the side plate 24 and pushes the side plate 24 to move, the side plate 24 pushes the tooth plate 23 to move, the tooth plate 23 drives the gear 25 to rotate, the gear 25 drives the transmission rod 27 to rotate, the transmission rod 27 drives the block 29 to move up, the block 29 drives the U-shaped pressure plate 30 to move up, the U-shaped pressure plate 30 drives the U-shaped pad 31 to move up, the U-shaped pad 31 moves up so that the PCB board is no longer pressed, and the PCB board is moved out.

[0042] The above is only a preferred embodiment of the present invention. Any person skilled in the art may modify the present invention by using the above technical solution or modify it into an equivalent technical solution. Therefore, any simple modification or equivalent replacement made according to the technical solution of the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A PCB via hole copper paste filling device, comprising a base plate (1), characterized in that: A first motor (2) is fixedly provided at the bottom of the base plate (1); a rotating rod (20) is fixedly connected to the output end of the first motor (2); the rotating rod (20) passes through the base plate (1) and is connected to the base plate (1) at a connection point via a bearing; one end of the rotating rod (20) is fixedly connected to a round table (6); a plurality of limiting mechanisms are provided on the top of the round table (6); The limiting mechanism comprises a vertical plate (18), wherein the vertical plate (18) is fixedly arranged on the top of the truncated table (6), two baffles (19) are fixedly arranged on one side of the vertical plate (18), a side groove (28) is opened on one side of the vertical plate (18), a transmission rod (27) is connected to the inside of the side groove (28) through a bearing, the transmission rod (27) passes through the vertical plate (18) and the truncated table (6) and is connected to the connection between the vertical plate (18) and the truncated table (6) through a bearing, one end of the transmission rod (27) is fixedly connected to a gear (25), the outside of the transmission rod (27) is provided with a block (29) through a threaded sleeve, a U-shaped pressing plate (30) is fixedly arranged on one side of the block (29), and a U-shaped pad (31) is fixedly arranged at the bottom of the U-shaped pressing plate (30).

2. The PCB via hole copper paste filling device according to claim 1, characterized in that: A slide groove (21) is provided at the bottom of the circular table (6), a slide block (22) is provided inside the slide groove (21), a tooth plate (23) is fixedly provided on one side of the slide block (22), side plates (24) are fixedly provided on both sides of the tooth plate (23), and the tooth plate (23) is meshed with a gear (25).

3. The PCB via hole copper paste filling device according to claim 1, characterized in that: A fourth electric push rod (26) is fixedly provided on the top of the base plate (1).

4. The PCB via hole copper paste filling device according to claim 1, characterized in that: A pouring mechanism and a curing mechanism are respectively provided on one side of the bottom plate (1), and the pouring mechanism comprises a first side frame (7), the first side frame (7) is fixedly arranged on one side of the bottom plate (1), a second electric push rod (8) is fixedly arranged on the top of the first side frame (7), an output end of the second electric push rod (8) is fixedly connected to a connecting frame (38), a circular plate (39) is fixedly arranged on the bottom of the connecting frame (38), a third motor (40) is fixedly arranged on the top of the circular plate (39), an output end of the third motor (40) is fixedly connected to a transmission shaft (41), one end of the transmission shaft (41) is fixedly connected to a connecting plate (9), a bottom groove (33) is provided on the bottom of the connecting plate (9), and a second The motor (32) is provided with a screw (35) at the output end of the second motor (32), the screw (35) is connected to the inner wall of the bottom groove (33) through a bearing, a sliding block (36) is provided on the outside of the screw (35) through a threaded sleeve, a grouting head (17) is fixedly provided on one side of the sliding block (36), a camera (34) is fixedly installed on the bottom of the connecting plate (9), a storage box (13) is fixedly provided on one side of the first side frame (7), a pump (14) is fixedly provided on the top of the storage box (13), an input end of the pump (14) extends into the interior of the storage box (13), an output end of the pump (14) is fixedly connected to a connecting hose (15), and the connecting hose (15) is fixedly connected to the grouting head (17).

5. The PCB via hole copper paste filling device according to claim 4, characterized in that: A feeding pipe (16) is fixedly provided on the top of the storage box (13).

6. The PCB via hole copper paste filling device according to claim 4, characterized in that: The curing mechanism comprises a second side frame (10), the second side frame (10) is fixedly arranged on one side of the bottom plate (1), a third electric push rod (11) is fixedly arranged on the top of the second side frame (10), an output end of the third electric push rod (11) is fixedly connected to a cover shell (12), and a plurality of heating rods (37) are fixedly connected inside the cover shell (12).

7. The PCB via hole copper paste filling device according to claim 1, characterized in that: A fixing plate (4) is fixedly provided on one side of the bottom plate (1), and a first electric push rod (5) is fixedly provided on the top of the fixing plate (4).

8. The PCB via hole copper paste filling device according to claim 1, characterized in that: Support columns (3) are fixedly provided at the four corners of the bottom of the base plate (1).

9. A PCB via hole copper slurry filling process, based on the PCB via hole copper slurry filling device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, placing the PCB board between the two baffles (19) of the limiting mechanism on the surface of the truncated table (6), then starting the fourth electric push rod (26), the output end of the fourth electric push rod (26) contacts the side plate (24) and pushes the tooth plate (23) to move, the tooth plate (23) drives the gear (25) to rotate, the gear (25) drives the transmission rod (27) to rotate, the transmission rod (27) drives the block (29) to move downward, the block (29) drives the U-shaped pressing plate (30) to move downward, the U-shaped pressing plate (30) drives the U-shaped pad (31) to move downward, the U-shaped pad (31) presses the PCB board to limit the position, and prevents the PCB board from moving during grouting, then starting the first motor (2), the first motor (2) controls the rotating rod (20) to rotate, the rotating rod (20) drives the truncated table (6) to rotate, and the truncated table (6) drives the PCB board pressed on the surface to move to the bottom of the connecting plate (9); S2, the hole position on the PCB is monitored by the camera (34) at the bottom of the connecting plate (9), and then the second motor (32) is started, the second motor (32) controls the screw rod (35) to rotate, the screw rod (35) drives the sliding block (36) to rotate, the sliding block (36) drives the grouting head (17) to move, and then the third motor (40) is started, the third motor (40) controls the transmission shaft (41) to rotate, the transmission shaft (41) drives the connecting plate (9) to rotate, and the connecting plate (9) drives the grouting head (17) is rotated so that the grouting head (17) is aligned with the hole position, and then the second electric push rod (8) is started, and the second electric push rod (8) controls the connection plate (9) to move downward, and the connection plate (9) drives the grouting head (17) to move downward, so that the grouting head (17) is close to the hole, and the pump (14) is started, and the pump (14) injects the copper paste inside the storage box (13) into the hole, and then the truncated table (6) is continuously controlled to rotate, and the truncated table (6) drives the PCB board on the limit mechanism to move to the bottom of the cover shell (12); S3, starting the third electric push rod (11), the third electric push rod (11) controls the cover shell (12) to move downward, the cover shell (12) covers the PCB board, and then the heating rod (37) heats the PCB board, the PCB board filled with copper paste is heated, the copper paste is solidified in the hole and tightly combined with the hole wall, and then the PCB board is continued to be controlled to move to the side of the first electric push rod (5), and then the first electric push rod (5) is started, the output end of the first electric push rod (5) contacts the side plate (24) and pushes the side plate (24) to move, and the side plate (24) pushes The movable tooth plate (23) moves, the tooth plate (23) drives the gear (25) to rotate, the gear (25) drives the transmission rod (27) to rotate, the transmission rod (27) drives the block (29) to move upward, the block (29) drives the U-shaped pressing plate (30) to move upward, the U-shaped pressing plate (30) drives the U-shaped pad (31) to move upward, the U-shaped pad (31) moves upward so that the PCB board is no longer pressed, the PCB board is removed, and then the cured PCB board is cleaned, polished and other subsequent treatments are performed to remove excess copper paste and impurities, so that the board surface reaches a flat and smooth state.

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