Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment, and the electronic equipment comprises a frame body, a cover body, a circuit board, a chip, a heat conduction part and a heat dissipation assembly. The circuit board is arranged on the frame body; the cover body is arranged on the frame body, and the cover body is provided with a mounting groove which is recessed in the direction away from the circuit board; the chip is arranged on the circuit board and located on the first side, away from the cover, of the circuit board. The heat conduction part is in contact with one side, close to the circuit board, of the chip, penetrates through the circuit board and extends to a second side, close to the cover body, of the circuit board; the heat dissipation assembly is in contact with the heat conduction part and comprises a vapor chamber, the vapor chamber is located in the mounting groove and comprises a plate body and at least one extension part, and the at least one extension part is connected with the plate body and extends towards the edge of the cover body.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art

[0002] In the related art, the electronic device includes a circuit board, a chip and a heat dissipation component. The chip is located on one side of the circuit board, and the heat dissipation component is located on the other side of the circuit board. The heat generated by the chip during operation will be transferred to the heat dissipation component through the circuit board, and the heat dissipation component will transfer the heat to the cover through the heat spreader, thereby achieving heat dissipation of the electronic device. In order to achieve the installation of the heat spreader, a mounting groove will be opened on the cover, and the heat spreader will be set in the mounting groove. If the area of ​​the heat spreader is too large, the mounting groove will be too large, affecting the strength of the cover; if the area of ​​the heat spreader is too small, efficient heat dissipation cannot be achieved, affecting the heat dissipation efficiency. Therefore, there is a problem in the related art that the heat dissipation efficiency and the cover strength cannot be taken into account at the same time. Summary of the invention

[0003] The present application aims to provide an electronic device, which at least solves the problem in the related art that heat dissipation efficiency and cover strength cannot be taken into account at the same time.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In the first aspect, an embodiment of the present application proposes an electronic device, including a frame, a cover, a circuit board, a chip, a heat-conducting component and a heat dissipation assembly; the circuit board is arranged on the frame; the cover is arranged on the frame, and the cover is provided with a mounting groove recessed in a direction away from the circuit board; the chip is arranged on the circuit board, and is located on a first side of the circuit board away from the cover; the heat-conducting component contacts a side of the chip close to the circuit board, is penetrated through the circuit board, and extends to a second side of the circuit board close to the cover; the heat dissipation assembly contacts the heat-conducting component, and the heat dissipation assembly includes a heat spreader, the heat spreader is located in the mounting groove, the heat spreader includes a plate body and at least one extension portion, and the at least one extension portion is connected to the plate body and extends toward the edge of the cover body.

[0006] In an embodiment of the present application, an electronic device includes a frame, a cover and a circuit board, the cover is arranged on the frame, and the circuit board is arranged on the frame, so that the circuit board and the cover are installed and fixed. The electronic device also includes a chip, which is arranged on the circuit board. When the electronic device is working, the chip processes data and the chip generates a certain amount of heat. The electronic device also includes a heat-conducting component and a heat dissipation component. The heat-conducting component contacts the side of the chip close to the circuit board, is arranged on the circuit board, and extends to the second side of the circuit board close to the cover. The heat dissipation component contacts the heat-conducting component, and the heat generated by the chip can be transferred to the heat dissipation component through the heat-conducting component; the heat dissipation component contacts the cover, and the heat transferred to the heat dissipation component is then transferred to the cover, so that the heat can be transferred to the environment around the electronic device, so as to achieve heat dissipation of the chip. The heat-spreading plate includes a plate body and an extension portion, the plate body is attached to the cover, the extension portion is connected to the plate body, and extends to the edge of the cover, so that the heat can be transferred to the edge of the cover through the extension portion of the heat-spreading plate, further improving the uniformity of the heat transfer of the heat-spreading plate, and thus improving the heat dissipation efficiency of the heat dissipation component to the chip. Furthermore, the heat spreader transfers heat to the edge of the cover body by setting an extension portion, and while ensuring the speed of heat transfer between the heat dissipation component and the cover body, the cover body can be provided with a mounting groove in the area corresponding to the extension portion, thereby reducing the area occupied by the mounting groove on the cover body, improving the strength of the cover body, and reducing the probability of deformation of the cover body, thereby enabling the cover body of the electronic device to better balance the heat dissipation efficiency and strength, and improving the reliability of the cover body during the use of the electronic device. Furthermore, the extension portion extending to the edge of the cover body is provided, so that the heat spreader is irregular in shape as a whole, thereby making it no longer necessary to set up a large area of ​​mounting grooves on the cover body, and the mounting grooves are no longer regular in shape. Compared with regular-shaped mounting grooves, the same area of ​​mounting grooves are more dispersed on the cover body, further improving the strength of the cover body.

[0007] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

[0010] Figure 2 is along Figure 1 Sectional view of AA in the middle;

[0011] Figure 3 is one of the structural schematic diagrams of a chip according to an embodiment of the present invention;

[0012] Figure 4This is a second schematic diagram of the structure of the chip according to an embodiment of the present invention;

[0013] Figure 5 is a cross-sectional view of a chip according to an embodiment of the present invention;

[0014] Figure 6 is one of the schematic diagrams of the relative position relationship between the heat sink and the cover according to an embodiment of the present invention;

[0015] Figure 7 is a second schematic diagram of the relative position relationship between the heat sink and the cover according to an embodiment of the present invention;

[0016] Figure 8 is one of the schematic diagrams of the distribution of the glue layer and the heat conducting layer on the heat spreader according to an embodiment of the present invention;

[0017] Fig. 9 is a second schematic diagram of the distribution of the adhesive layer and the heat conducting layer on the heat spreader according to an embodiment of the present invention;

[0018] Fig.10 is a schematic diagram of the relative positional relationship among a vapor chamber, a cover and a heat dissipation layer according to an embodiment of the present invention;

[0019] Fig.11 is one of the schematic diagrams of the arrangement of the heat conducting component inside the circuit board according to the embodiment of the present invention;

[0020] Fig.12 is a second schematic diagram of the arrangement of the heat conducting component inside the circuit board according to an embodiment of the present invention;

[0021] Fig.13 This is a third schematic diagram of the arrangement of the heat conducting component inside the circuit board according to an embodiment of the present invention.

[0022] Reference numerals:

[0023] 100 frame, 200 cover, 210 mounting groove, 220 first sub-groove, 230 second sub-groove, 240 third sub-groove, 300 circuit board, 310 first sub-layer, 320 second sub-layer, 330 third sub-layer, 340 fourth sub-layer, 350 fifth sub-layer, 400 chip, 410 core module, 412 first core module, 414 second core module, 416 third core module, 500 heat conduction component, 510 first heat conduction part , 520 second heat conduction part, 530 third heat conduction part, 540 fourth heat conduction part, 550 fifth heat conduction part, 600 heat dissipation component, 610 heat sink, 612 plate body, 614 extension part, 616 first extension part, 618 second extension part, 619 third extension part, 620 heat dissipation block, 630 thermal conductive layer, 640 glue layer, 650 heat dissipation layer, 710 screen, 720 shielding cover, 730 battery, 740 solder ball, 750 circuit. DETAILED DESCRIPTION

[0024] Embodiments of the present invention will be described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0025] The term "first" or "second" in the specification and claims of the present application may include one or more of the features explicitly or implicitly. In the description of the present invention, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0026] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0027] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Combine the following Figures 1 to 13 An electronic device according to an embodiment of the present invention is described.

[0029] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, an electronic device according to some embodiments of the present invention includes a frame 100, a cover 200, a circuit board 300, a chip 400, a heat-conducting component 500 and a heat dissipation assembly 600; the circuit board 300 is arranged on the frame 100; the cover 200 is arranged on the frame 100, and the cover 200 is provided with a mounting groove 210 recessed in a direction away from the circuit board 300; the chip 400 is arranged on the circuit board 300, and is located on a first side of the circuit board 300 away from the cover 200; the heat-conducting component 500 0 contacts with a side of the chip 400 close to the circuit board 300, penetrates the circuit board 300, and extends to the second side of the circuit board 300 close to the cover 200; the heat dissipation assembly 600 contacts with the heat-conducting component 500; wherein the heat dissipation assembly 600 includes a heat spreader 610, the heat spreader 610 is located in the mounting groove 210, the heat spreader 610 includes a plate body 612 and at least one extension portion 614, the at least one extension portion 614 is connected to the plate body 612, and extends toward the edge of the cover 200.

[0030] In this embodiment, the electronic device includes a frame 100, a cover 200 and a circuit board 300. The cover 200 is disposed on the frame 100, and the circuit board 300 is disposed on the frame 100, so that the circuit board 300 and the cover 200 are installed and fixed. The electronic device also includes a chip 400, which is disposed on the circuit board 300. When the electronic device is working, the chip 400 processes data, and the chip 400 generates a certain amount of heat. The electronic device further includes a heat-conducting component 500 and a heat-dissipating assembly 600. The heat-conducting component 500 contacts the side of the chip 400 close to the circuit board 300, penetrates the circuit board 300, and extends to the second side of the circuit board 300 close to the cover 200. The heat-dissipating assembly 600 contacts the heat-conducting component 500, and the heat generated by the chip 400 can be transferred to the heat-dissipating assembly 600 through the heat-conducting component 500; the heat-dissipating assembly 600 contacts the cover 200, and the heat transferred to the heat-dissipating assembly 600 is then transferred to the cover 200, so that the heat can be transferred to the environment around the electronic device, thereby achieving heat dissipation of the chip 400. Since the heat of the chip 400 is transferred to the heat-dissipating assembly 600 through the heat-conducting component 500, the thermal resistance between the chip 400 and the heat-dissipating assembly 600 is reduced, the heat transfer rate between the chip 400 and the heat-dissipating assembly 600 is accelerated, the heat dissipation speed of the chip 400 is accelerated, and the heat dissipation effect of the chip 400 is improved. Since the heat dissipation speed of the chip 400 can be accelerated by providing the heat conducting component 500 and the heat dissipation assembly 600 inside the electronic device, the temperature rise of the electronic device can be reduced, thereby improving the user's experience of the temperature of the electronic device itself.

[0031] The heat-conducting component 500 passes through the circuit board 300 and extends to the second side of the circuit board 300 close to the cover body 200, so that the heat-conducting component 500 can transfer the heat generated by the chip 400 to the heat dissipation component 600, while reducing the length of the heat-conducting component 500, shortening the heat transfer path, and further improving the heat transfer efficiency of the heat-conducting component 500.

[0032] The heat spreader 610 includes a plate body 612 and an extension 614. The plate body 612 is attached to the cover 200. The extension 614 is connected to the plate body 612 and extends to the edge of the cover 200, so that heat can be transferred to the edge of the cover 200 through the extension 614 of the heat spreader 610, further improving the uniformity of heat transfer by the heat spreader 610, thereby improving the heat dissipation efficiency of the heat dissipation component 600 to the chip. In addition, the heat spreader 610 transfers heat to the edge of the cover 200 by setting the extension 614, while ensuring the speed of heat transfer between the heat dissipation component 600 and the cover 200, so that the cover 200 can be provided with a mounting groove 210 in the area corresponding to the extension 614, thereby reducing the area occupied by the mounting groove 210 on the cover 200, improving the strength of the cover 200, and reducing the probability of deformation of the cover 200, thereby enabling the cover 200 of the electronic device to better balance the heat dissipation efficiency and strength, and improving the reliability of the cover 200 during the use of the electronic device. In addition, an extension portion 614 extending toward the edge of the cover body 200 is provided, so that the heat spreader 610 has an irregular shape as a whole, and the cover body 200 no longer needs to have a large-area installation groove 210 as a whole, and the installation groove 210 is no longer a regular shape. Compared with the installation groove 210 of a regular shape, the installation groove 210 of the same area is more dispersed on the cover body 200, thereby further improving the strength of the cover body 200.

[0033] like Figure 6 and Figure 7 As shown, the cover 200 is provided with a mounting groove 210 that is recessed in a direction away from the circuit board 300; the heat spreader 610 is located in the mounting groove 210, which reduces the occupation of the internal space of the electronic device by the heat spreader 610, thereby facilitating the thinness and lightness of the electronic device. The cover 200 is provided with a mounting groove 210 that is recessed in a direction away from the circuit board 300, which can also reduce the weight of the cover 200, thereby facilitating the lightweighting of the electronic device. The heat spreader 610 is located in the mounting groove 210. While ensuring the thinness and lightness of the electronic device, the heat spreader 610 can enhance the strength of the cover 200, reduce the probability of deformation of the cover 200 due to external forces, thereby improving the reliability of the electronic device during use.

[0034] Specifically, the chip 400 may be a system on chip (SoC).

[0035] The heat conducting component 500 may be a heat conducting column made of a high heat conducting metal such as a copper column.

[0036] The cover body 200 is a metal battery cover, which can accelerate the heat dissipation speed of the cover body 200 .

[0037] The circuit board 300 is a main board, a sub-board or other circuit boards 300 inside the electronic device.

[0038] Furthermore, if Figure 2 As shown, the electronic device further includes a screen 710 , which is disposed on a side of the frame 100 away from the cover 200 .

[0039] The electronic device further includes a shielding cover 720 , and the shielding cover 720 covers the chip 400 .

[0040] The electronic device further includes a battery 730 , which is disposed in the frame 100 and arranged in parallel with the circuit board 300 .

[0041] According to some embodiments of the present invention, Figure 2 and Figure 6 As shown, the heat dissipation assembly 600 further includes a heat dissipation block 620 , a first side of the heat dissipation block 620 contacts the heat conductive component 500 , and a second side of the heat dissipation block 620 contacts at least one extension portion 614 .

[0042] In this embodiment, the heat dissipation assembly 600 includes a heat spreader 610 and a heat sink 620. The first side of the heat sink 620 is in contact with the heat conductive component 500. The heat generated by the chip 400 during operation can be transferred to the heat sink 620 through the heat conductive component 500. The second side of the heat sink 620 is in contact with the heat spreader 610. The heat can be transferred to the heat spreader 610 through the heat spreader 620. The heat spreader 610 is arranged along the cover 200 and is located on the side of the cover 200 close to the circuit board 300. The heat transferred to the heat spreader 610 can be transferred to the cover 200 more evenly.

[0043] Specifically, the vapor chamber 610 may be a heterodyne vapor chamber 610 .

[0044] The heat spreader 610 is an ultra-high conductivity heat dissipation plate with a thermal conductivity of more than 10000 W / (m·k).

[0045] The heat dissipation block 620 is a high thermal conductivity block such as a copper block or a copper alloy block.

[0046] The heat sink 620 is located on the back of the circuit board 300 , in the heat source projection area of ​​the chip 400 ; the heat sink 620 can greatly reduce the thermal resistance between the internal heat-conducting component 500 of the circuit board 300 and the heat spreader 610 , and quickly conduct heat to the heat spreader 610 .

[0047] Furthermore, the heat conducting component 500 extends to the back side of the circuit board 300 and is fixedly connected to the heat dissipation block 620 .

[0048] According to some embodiments of the present invention, there are multiple extension portions 614 , and the multiple extension portions 614 extend toward multiple edges of the cover 200 respectively; the heat sink 620 contacts the extension portion 614 close to the chip 400 among the multiple extension portions 614 .

[0049] In this embodiment, the heat sink 620 contacts the extension portion 614 close to the chip 400 among the plurality of extension portions 614 , shortening the heat transfer path between the chip 400 and the heat spreader 610 , further improving the heat dissipation speed of the chip 400 .

[0050] According to some embodiments of the present invention, Figure 2 and Figure 5 As shown, in the cross section of the circuit board 300 , the heat conducting component 500 may penetrate the circuit board 300 along a straight line.

[0051] like Fig.11 , Fig.12 and Fig.13 As shown, on the cross section of the circuit board 300 , the heat conducting component 500 may also penetrate the circuit board 300 along the fold line.

[0052] In the cross section of the circuit board 300 , the heat conducting component 500 may also penetrate the circuit board 300 along a curve.

[0053] In this embodiment, the heat-conducting component 500 passes through the circuit board 300 along a straight line, a folded line or a curve, so that the layout of the heat-conducting component 500 inside the circuit board 300 is more flexible, which facilitates the heat-conducting component 500 to avoid the wiring of the circuit board 300, thereby reducing the impact of the setting of the heat-conducting component 500 on the layout of the circuit 750 on the circuit board 300.

[0054] According to some embodiments of the present invention, the heat conducting component 500 and the circuit 750 of the circuit board 300 are arranged in a staggered manner.

[0055] In this embodiment, the heat-conducting component 500 and the circuit of the circuit board 300 are arranged in a staggered manner, so as to avoid damaging the circuit 750 in the circuit board 300 while achieving the arrangement of the heat-conducting component 500 .

[0056] According to some embodiments of the present invention, Fig.11As shown, the circuit board 300 includes a first sublayer 310, a second sublayer 320 and a third sublayer 330; the second sublayer 320 is attached to the first sublayer 310; the third sublayer 330 is attached to the side of the second sublayer 320 away from the first sublayer 310; the heat-conducting component 500 includes a first heat-conducting part 510, a second heat-conducting part 520 and a third heat-conducting part 530; the first heat-conducting part 510 passes through the first sublayer 310; the second heat-conducting part 520 is arranged along the second sublayer 320 and is connected to the first heat-conducting part 510; the third heat-conducting part 530 passes through the third sublayer 330 and is connected to the second heat-conducting part 520.

[0057] In this embodiment, the first heat conducting part 510 passes through the first sub-layer 310, the second heat conducting part 520 is arranged along the second sub-layer 320 and connected to the first heat conducting part 510, and the third heat conducting part 530 passes through the third sub-layer 330 and is connected to the second heat conducting part 520. While realizing the arrangement of the heat conducting component 500, the heat conducting component 500 can be flexibly changed according to the layout of the circuits 750 in each circuit board 300, thereby improving the flexibility of the layout of the heat conducting component 500 in the circuit board 300.

[0058] Optionally, the first heat conducting portion 510 may penetrate the first sub-layer 310 , and the first heat conducting portion 510 may also penetrate the first sub-layer 310 and the second sub-layer 320 at the same time.

[0059] The third heat conducting part 530 penetrates the third sub-layer 330 , and the third heat conducting part 530 may also penetrate the second sub-layer 320 and the third sub-layer 330 at the same time.

[0060] Furthermore, if Fig.11 As shown, the circuit board 300 further includes a fourth sub-layer 340 and a fifth sub-layer 350 , and the first sub-layer 310 , the second sub-layer 320 , the third sub-layer 330 , the fourth sub-layer 340 and the fifth sub-layer 350 are stacked.

[0061] The first heat conducting part 510 penetrates the first sub-layer 310 and the second sub-layer 320 along the thickness direction of the circuit board 300. In the third sub-layer 330, the circuit 750 passes through the extension area of ​​the first heat conducting part 510. In order to avoid interrupting the circuit 750, a second heat conducting part 520 for changing the extension direction of the heat conducting part 500 is provided in the second sub-layer 320. The second heat conducting part 520 is arranged along the width or length direction of the circuit board 300 and extends a distance away from the first heat conducting part 510. The distance can be determined according to the situation of the circuit 750 in the second sub-layer 320 to avoid damaging the circuit 750 in the second sub-layer 320. A third heat conducting part 530 for changing the extension direction of the heat conducting part 500 is provided again. The third heat conducting part 530 penetrates the second sub-layer 320, the third sub-layer 330, the fourth sub-layer 340 and the fifth sub-layer 350. The first heat conducting part 510 is connected to the second heat conducting part 520, and the second heat conducting part 520 is connected to the third heat conducting part 530. The first heat conducting part 510, the second heat conducting part 520 and the third heat conducting part 530 extend in three sections of fold lines inside the circuit board 300, so that the heat conducting component 500 extends to the side of the circuit board 300 away from the chip 400, completing the arrangement of the heat conducting component 500 in the circuit board 300 while avoiding damaging the circuit 750 in the circuit board 300.

[0062] Furthermore, if Fig.12 and Fig.13 As shown, the heat conducting component 500 further includes a fourth heat conducting portion 540 and a fifth heat conducting portion 550 .

[0063] The first heat conducting part 510 penetrates the first sub-layer 310 and the second sub-layer 320 along the thickness direction of the circuit board 300. In the third sub-layer 330, the circuit 750 passes through the extension area of ​​the first heat conducting part 510. In order to avoid interrupting the circuit 750, a second heat conducting part 520 for changing the extension direction of the heat conducting part 500 is provided in the second sub-layer 320. The second heat conducting part 520 is arranged along the width or length direction of the circuit board 300, and extends a distance away from the first heat conducting part 510. The distance can be determined according to the situation of the circuit 750 in the second sub-layer 320, so as to avoid damaging the circuit 750 in the second sub-layer 320. A third heat conducting part 530 for changing the extension direction of the heat conducting part 500 is provided again. The third heat conducting part 530 penetrates the second sub-layer 320, the third sub-layer 330 and the fourth sub-layer 340 along the thickness direction of the circuit board 300. In the fifth sub-layer 350, the circuit 750 passes through the extension area of ​​the third heat conducting part 530. To avoid interrupting the circuit 750, a fourth heat conducting part 540 for changing the extension direction of the heat conducting part 500 is provided in the fourth sub-layer 340. The fourth heat conducting part 540 is arranged in the fourth sub-layer 340 along the width or length direction of the circuit board 300, and extends a distance away from the third heat conducting part 530. The distance can be determined according to the situation of the circuit 750 in the fourth sub-layer 340 to avoid damaging the circuit 750 in the fourth sub-layer 340. A fifth heat conducting part 550 for changing the extension direction of the heat conducting part 500 is provided again, and the fifth heat conducting part 550 passes through the fourth sub-layer 340 and the fifth sub-layer 350 along the thickness direction of the circuit board 300. The first heat conducting part 510 is connected to the second heat conducting part 520, the second heat conducting part 520 is connected to the third heat conducting part 530, the third heat conducting part 530 is connected to the fourth heat conducting part 540, the fourth heat conducting part 540 is connected to the fifth heat conducting part 550, the first heat conducting part 510, the second heat conducting part 520, the third heat conducting part 530, the fourth heat conducting part 540 and the fifth heat conducting part 550 are extended in five sections of broken lines inside the circuit board 300, so that the heat conducting component 500 extends to the side of the circuit board 300 away from the chip 400, completing the arrangement of the heat conducting component 500 in the circuit board 300, while avoiding damaging the circuit 750 in the circuit board 300.

[0064] According to some embodiments of the present invention, Figure 3 and Figure 4 As shown, there are multiple heat-conducting components 500; the chip 400 includes a core module 410, and the number of core modules 410 is multiple, and the multiple core modules 410 are respectively in contact with multiple heat-conducting components 500; wherein, the number of heat-conducting components 500 in contact with the core modules 410 is positively correlated with the heat generation of the core modules 410.

[0065] In this embodiment, the chip 400 includes a core module 410, and multiple core modules 410 are in contact with multiple heat-conducting components 500, so that the heat generated by each core module 410 can be more directly transferred to the heat-conducting component 500, and the heat is then transferred to the heat dissipation component through the heat-conducting component 500, further improving the heat dissipation effect of the heat-conducting component 500 and the heat dissipation component 600 on the chip 400. The number of the heat-conducting components 500 in contact with the core modules 410 is positively correlated with the heat generation of the core modules 410, so that the number of the heat-conducting components 500 is matched with the heat generation of the core modules 410, which can improve the heat dissipation efficiency of the core modules 410 and reduce the damage of the heat-conducting components 500 to the original structure of the chip 400.

[0066] Specifically, the number of heat-conducting components 500 in contact with the core module 410 is a first number, for example, three heat-conducting components 500 are in contact with the core module 410 at the same time, or four heat-conducting components 500 are in contact with the core module 410 at the same time. The first number is positively correlated with the heat generation of the core module 410, that is, the greater the heat generation of the core module 410, the greater the first number, and the smaller the heat generation of the core module 410, the smaller the first number.

[0067] There may be multiple core modules 410 , and core modules 410 with greater heat generation have more corresponding heat-conducting components 500 , while core modules 410 with less heat generation have fewer corresponding heat-conducting components 500 .

[0068] Furthermore, one core module 410 may correspond to one heat conducting component 500, or one core module 410 may correspond to multiple heat conducting components 500. When one core module 410 may correspond to multiple heat conducting components 500, the number of heat conducting components 500 contacting the core module 410 is positively correlated with the heat generated by the core module 410.

[0069] Furthermore, the chip 400 may be soldered to the circuit board 300 via a plurality of solder balls 740 , the plurality of solder balls 740 are arranged in a plurality of rows and / or columns, and the heat conducting component 500 is arranged between the plurality of solder balls 740 .

[0070] A plurality of core modules 410 are packaged inside the chip 400 , and the heat conducting component 500 is in direct contact with the core modules 410 .

[0071] Furthermore, the kernel module 410 is a central processing unit (CPU), a graphics processing unit (GPU) or a neural processing unit (NPU).

[0072] Furthermore, among the solder balls 740 soldered between the package of the chip 400 and the circuit board 300 , the solder balls 740 below the core modules 410 are reduced, so that the heat conducting component 500 is extended and connected to each core module 410 .

[0073] According to some embodiments of the present invention, Figure 3 , Figure 4 and Figure 5 As shown, the multiple core modules 410 include a first core module 412 and a second core module 414; the first core module 412 contacts a first number of heat-conducting components 500 among the multiple heat-conducting components 500; the second core module 414 contacts a second number of heat-conducting components 500 among the multiple heat-conducting components 500; wherein, when the electronic device is working, the heat generated by the first core module 412 is greater than the heat generated by the second core module 414; the first number is greater than the second number.

[0074] In this embodiment, the heat generated by the first core module 412 is greater than the heat generated by the second core module 414, and the number of thermally conductive components 500 in contact with the first core module 412 is also greater than the number of thermally conductive components 500 in contact with the second core module 414, so that the number of thermally conductive components 500 matches the heat generated by the core module 410, thereby ensuring the heat dissipation efficiency and reducing the impact on the layout of the solder balls 740 of each core module 410, increasing the number of solder balls 740 of each core module 410, and thereby increasing the welding area between the chip 400 and the circuit board 300, and improving the welding reliability between the chip 400 and the circuit board 300.

[0075] Furthermore, the first kernel module 412 is a central processing unit, and the second kernel module 414 is a graphics processor.

[0076] The number of heat-conducting components 500 corresponding to the CPU is greater than the number of heat-conducting components 500 corresponding to the GPU.

[0077] like Figure 3 and Figure 4 As shown, the chip 400 also includes a third core module 416, which is a neural network processor. The number of heat-conducting components 500 corresponding to the neural network processor is less than the number of heat-conducting components 500 corresponding to the graphics processor.

[0078] Based on the load characteristics of the chip 400, the density of the layout of the thermal conductive components 500 is relatively the largest on the first core module 412 where the load is the largest and the heat is the most serious; the density of the layout of the thermal conductive components 500 is relatively moderate on the second core module 414 where the heat is relatively central; and the density of the layout of the thermal conductive components 500 is relatively the smallest on the third core module 416 where the heat is relatively the smallest.

[0079] Based on the load characteristics of the core module 410 of the chip 400, the core module 410 that generates the most heat has the densest thermal conductive components 500, and the core module 410 that generates relatively less heat has the second-lowest density of thermal conductive components 500. This gradient density layout design of the thermal conductive components 500 ensures accurate and efficient heat transfer for each core module 410, and ensures that the number of solder balls 740 is reduced to a minimum. The overall soldering area of ​​the chip 400 and the circuit board 300 is sufficient, thereby ensuring the reliability of the soldering of the chip 400.

[0080] Specifically, Figure 3 As shown, the first core module 412 is arranged with five heat conducting components 500 , the second core module 414 is arranged with three heat conducting components 500 , and the third core module 416 is arranged with one core module 410 .

[0081] Specifically, Figure 4 As shown, the first core module 412 is arranged with six heat conducting components 500 , the second core module 414 is arranged with four heat conducting components 500 , and the third core module 416 is arranged with two core modules 410 .

[0082] According to some embodiments of the present invention, Figure 2 and Figure 7 As shown, the heat dissipation assembly 600 further includes a heat conductive layer 630 , and the heat conductive layer 630 is disposed between the heat spreader 610 and the cover 200 .

[0083] In this embodiment, the heat dissipation component 600 also includes a thermal conductive layer 630, which is disposed between the heat spreader 610 and the cover 200. The thermal conductive layer 630 can reduce the thermal resistance between the heat spreader 610 and the cover 200, accelerate the heat transfer rate between the heat spreader 610 and the cover 200, and further enhance the heat dissipation effect of the chip 400.

[0084] Specifically, the heat dissipation layer 650 is a heat dissipation layer 650 made of a thermal interface material (TIM).

[0085] The material of the heat-conducting layer 630 is one of the heat-conducting interface materials such as phase-change heat storage material, heat-conducting gel, and heat-conducting silica gel.

[0086] According to some embodiments of the present invention, Figure 2 and Figure 7 As shown, the heat dissipation assembly 600 further includes a glue layer 640 , which is disposed between the heat spreader 610 and the cover 200 and arranged in parallel with the heat conducting layer 630 .

[0087] In this embodiment, the heat dissipation assembly 600 further includes an adhesive layer 640, which is disposed between the vapor chamber 610 and the cover 200 to achieve installation and fixation of the vapor chamber 610, thereby improving the stability of the vapor chamber 610 during use of the electronic device. The adhesive layer 640 and the heat conducting layer 630 are arranged in parallel, so that while achieving installation and fixation of the vapor chamber 610, no additional space in the thickness direction of the electronic device is occupied, thereby further reducing the thickness of the electronic device.

[0088] According to some embodiments of the present invention, Figure 8 As shown, a plurality of adhesive layers 640 and a plurality of heat conducting layers 630 are arranged alternately.

[0089] In this embodiment, multiple adhesive layers 640 and multiple thermal conductive layers 630 are arranged alternately, so that the heat transfer between the heat spreader 610 and the cover 200 is more uniform, further improving the heat dissipation effect of the heat dissipation component 600 on the chip 400, and making the force points between the heat spreader 610 and the cover 200 more evenly distributed, reducing the probability of the heat spreader 610 falling off the cover 200, and further improving the stability of the heat spreader 610 during the use of the electronic device.

[0090] Furthermore, the heat conducting layer 630 is arranged in a strip shape, and the number of the heat conducting layer 630 is plural, and the adhesive layer 640 is arranged in a strip shape, and the number of the adhesive layer 640 is plural.

[0091] According to some embodiments of the present invention, Fig. 9 As shown, the heat conductive layer 630 is located between the plurality of adhesive layers 640 .

[0092] In this embodiment, the thermal conductive layer 630 is located between multiple adhesive layers 640, which increases the contact area between the thermal conductive layer 630 and the heat spreader 610, and increases the contact area between the thermal conductive layer 630 and the cover body 200, further accelerating the heat transfer efficiency between the heat spreader 610 and the cover body 200.

[0093] Furthermore, the heat conducting layer 630 is arranged in a block shape, the adhesive layer 640 is arranged in a strip shape, and the number of the adhesive layer 640 is a plurality.

[0094] According to some embodiments of the present invention, Figure 6 As shown, the vapor chamber 610 transfers heat to the edge of the cover 200 by providing the extension portion 614 , and can also reduce the material used in the vapor chamber 610 itself, thereby saving the material cost of the vapor chamber 610 .

[0095] Furthermore, if Figure 6As shown, the extension portion 614 includes a first extension portion 616, a second extension portion 618 and a third extension portion 619. The cover body 200 has a first sub-groove 220, a second sub-groove 230 and a third sub-groove 240 respectively formed at positions corresponding to the first extension portion 616, the second extension portion 618 and the third extension portion 619.

[0096] The heat spreader 610 extends a first extension portion 616 to the left, and the first extension portion 616 is connected to the heat sink 620 to ensure that the heat transferred from the chip 400 to the heat sink 620 can be quickly transferred to the heat spreader 610. At the same time, the cover 200 digs a first sub-groove 220 at this location to avoid a large area of ​​the cover 200 being hollowed out. The heat spreader 610 extends a second extension portion 618 upward to ensure that the heat spreader 610 can quickly transfer the heat to the cold end of the area above the cover 200. At the same time, the cover 200 digs a second sub-groove 230 at this location to avoid more areas of the cover 200 being hollowed out. In addition, the third extension portion 619 of the heat spreader 610 extends to the right, ensuring that the heat of the heat spreader 610 can be transferred to the cold end of the right area of ​​the cover body 200. At the same time, the cover body 200 digs a third sub-groove 240 at this location to avoid hollowing out a large area of ​​the cover body 200 at this location. Through this design, it can be ensured that the heat transferred to the heat spreader 610 is transmitted to the cold ends of the cover body 200 to achieve efficient heat dissipation, while reducing the grooving area of ​​the cover body 200 to ensure the strength and reliability of the cover body 200. In addition, the material used for the heat spreader 610 is reduced, saving material resources and costs.

[0097] According to some embodiments of the present invention, Figure 2 and Fig.10 As shown, the heat dissipation assembly 600 also includes a heat dissipation layer 650, which is arranged on a side of the heat spreader 610 close to the circuit board 300, a portion of the heat dissipation layer 650 is attached to the heat spreader 610, and another portion of the heat dissipation layer 650 is attached to the cover 200.

[0098] In this embodiment, a portion of the heat dissipation layer 650 is attached to the heat spreader 610, and another portion of the heat dissipation layer 650 is attached to the cover 200. The heat on the heat spreader 610 can be transferred to the cover 200 through the heat dissipation layer 650, further accelerating the heat transfer rate and heat transfer uniformity between the heat spreader 610 and the cover 200.

[0099] Furthermore, the heat dissipation layer 650 is composed of one or more high thermal conductivity materials, and the high thermal conductivity material may be a graphene film, an artificial graphite film, nano copper carbon, a carbon nanotube, etc.; the heat dissipation layer 650 is attached to the inner side of the cover 200, and its shape is rectangular, covering the heat spreader 610 and most of the cover 200 area; the function of the heat dissipation layer 650 is to quickly and evenly diffuse the heat conducted to the main body and branches of the heat spreader 610 to the entire cover 200 (including the area on the cover 200 that is not covered by the heat spreader 610).

[0100] According to some embodiments of the present invention, the wiring density of the third sub-layer 330 is greater than that of the first sub-layer 310 , and the cross-sectional area of ​​the third heat conducting portion 530 is smaller than that of the first heat conducting portion 510 .

[0101] In this embodiment, the wiring density of the third sublayer 330 is greater than the wiring density of the first sublayer 310, and the cross-sectional area of ​​the third heat conducting portion 530 is smaller than the cross-sectional area of ​​the first heat conducting portion 510, that is, the third heat conducting portion 530 with a smaller cross-sectional area is arranged on the third sublayer 330 with a larger wiring density, further reducing the influence of setting the heat conducting component 500 on the layout of the circuit 750 on the circuit board 300.

[0102] Furthermore, if Fig.13 As shown, the wiring density of the fourth sublayer 340 is greater than the wiring density of the second sublayer 320, the wiring density of the fifth sublayer 350 is greater than the wiring density of the first sublayer 310, the cross-sectional area of ​​the fourth heat conducting part 540 is smaller than the cross-sectional area of ​​the second heat conducting part 520, and the cross-sectional area of ​​the fifth heat conducting part 550 is smaller than the cross-sectional area of ​​the first heat conducting part 510.

[0103] In the sparsely wired areas of the first sublayer 310, the second sublayer 320 and the third sublayer 330, the first heat conducting part 510, the second heat conducting part 520 and the third heat conducting part 530 are designed as thick columns; and in the densely wired areas of the fourth sublayer 340 and the fifth sublayer 350, the fourth heat conducting part 540 and the fifth heat conducting part 550 are designed as thin columns. This design of a thermally conductive column with a combination of thick and thin columns can avoid damaging the circuit wiring, while ensuring a complete thermal conductive link and ensuring the design reliability of the circuit.

[0104] According to some embodiments of the present invention, the electronic device includes a mobile phone, a tablet computer, a smart wearable device or a laptop computer.

[0105] In the electronic device provided by the present application, one or more of the multiple core modules 410 of the chip 400 are working and will generate heat. The heat generated by the core module 410 of the chip 400 is firstly accurately and efficiently transferred to the heat spreader 610 through the heat-conducting component 500 arranged with gradient density, and then evenly diffused to the cover 200 through two layers of heat dissipation paths: the first layer of the two layers of heat dissipation paths is to conduct the heat transferred to the heat spreader 610 to the cover 200 through the heat-conducting layer 630; the second layer of the two layers of heat dissipation paths is to conduct the heat of the heat spreader 610 to the entire cover 200 through the heat dissipation layer 650 on the inner side of the battery 730 cover; this structure can effectively solve the heating problem of the chip 400, realize the accurate heat dissipation of the core module 410 of the chip 400, and improve the user's temperature rise and performance experience; at the same time, it also optimizes and solves the key product issues such as the thickness and weight of the electronic device, the strength reliability of the cover 200, and the adhesive reliability of the heat spreader 610, and improves the user's experience of lightness and reliability.

[0106] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0107] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: Frame; A circuit board, wherein the circuit board is arranged on the frame; A cover body, the cover body is arranged on the frame body, and the cover body is provided with a mounting groove recessed in a direction away from the circuit board; A chip, wherein the chip is disposed on the circuit board and is located on a first side of the circuit board away from the cover body; a heat-conducting component, the heat-conducting component contacts a side of the chip close to the circuit board, is disposed through the circuit board, and extends to a second side of the circuit board close to the cover; a heat dissipation component, the heat dissipation component being in contact with the heat conducting component; Wherein, the heat dissipation assembly includes a heat spreader, the heat spreader is located in the mounting groove, the heat spreader includes a plate body and at least one extension portion, at least one of the extension portions is connected to the plate body and extends toward the edge of the cover body.

2. The electronic device according to claim 1, characterized in that: The heat dissipation component also includes: A heat dissipation block, a first side of the heat dissipation block contacts the heat conducting component, and a second side of the heat dissipation block contacts at least one of the extensions.

3. The electronic device according to claim 2, characterized in that: There are multiple extension parts, and the multiple extension parts extend to multiple edges of the cover body respectively; The heat sink is in contact with an extension portion close to the chip among the plurality of extension portions.

4. The electronic device according to claim 1, characterized in that: On a cross section of the circuit board, the heat conducting component passes through the circuit board along a straight line; or On a cross section of the circuit board, the heat conducting component penetrates the circuit board along a fold line; or In a cross section of the circuit board, the heat conducting component penetrates the circuit board along a curve.

5. The electronic device according to claim 1, characterized in that: The heat conducting component and the circuit board are arranged in a staggered manner.

6. The electronic device according to claim 1, characterized in that: The number of the heat conducting components is multiple; The chip includes a core module, the number of the core modules is multiple, and the multiple core modules are respectively in contact with the multiple heat-conducting components; The number of contacts between the heat-conducting component and the core module is positively correlated with the heat generated by the core module.

7. The electronic device according to claim 1, characterized in that: The heat dissipation component also includes: A heat-conducting layer is disposed between the heat-spreading plate and the cover.

8. The electronic device according to claim 7, characterized in that: The heat dissipation component also includes: The adhesive layer is disposed between the heat spreader and the cover body and arranged in parallel with the heat conducting layer.

9. The electronic device according to claim 8, characterized in that: A plurality of the adhesive layers and a plurality of the heat-conducting layers are arranged alternately; or The heat-conducting layer is located between the plurality of adhesive layers.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The heat dissipation component also includes: The heat dissipation layer is arranged on a side of the heat spreader close to the circuit board, a portion of the heat dissipation layer is attached to the heat spreader, and another portion of the heat dissipation layer is attached to the cover.

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