Heat dissipation device

Abstract

The invention provides a heat dissipation device which is suitable for heat dissipation of a heat source and comprises a uniform temperature plate, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted to be thermally coupled to a heat source. The heat pipe set is suitable for being thermally coupled to a heat source, and heat of the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set. Through the arrangement, the heat dissipation device has high heat dissipation efficiency.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, and in particular to a heat dissipation device with high heat dissipation efficiency. Background Art

[0002] In recent years, the rapid development of high-power chips (such as AI chips) has led to a significant increase in the demand for heat dissipation in high-power servers (>400W). How to provide a heat dissipation device with high heat dissipation efficiency is the goal of research in this field. Summary of the invention

[0003] The invention provides a heat dissipation device with high heat dissipation efficiency.

[0004] A heat dissipation device of the present invention is suitable for dissipating heat from a heat source, comprising a temperature averaging plate, a heat pipe group and a heat dissipation fin group. The temperature averaging plate is suitable for thermally coupling to the heat source. The heat pipe group is suitable for thermally coupling to the heat source, wherein the heat of the heat source is synchronously conducted to the temperature averaging plate and the heat pipe group. The temperature averaging plate is thermally coupled to the heat dissipation fin group, and the heat pipe group is arranged through the heat dissipation fin group.

[0005] In one embodiment of the present invention, the heat dissipation device further includes a heat conduction structure suitable for contacting the heat source, the temperature vaporizer and the heat pipe group directly contact the heat conduction structure, and the heat from the heat source is synchronously conducted to the temperature vaporizer and the heat pipe group via the heat conduction structure.

[0006] In one embodiment of the present invention, the above-mentioned heat conduction structure includes a main body and an extension portion extending from the side of the main body, the temperature averaging plate directly contacts the top surface of the main body, the extension portion extends to the heat pipe group, the heat pipe group includes a flat portion, the flat portion is located between the extension portion and the temperature averaging plate, and directly contacts the extension portion and the temperature averaging plate.

[0007] In one embodiment of the present invention, the body includes a concave cavity facing away from the top surface, suitable for accommodating at least a portion of the heat source.

[0008] In one embodiment of the present invention, the above-mentioned heat conduction structure includes a body, the temperature equalizing plate directly contacts the top surface of the body, the heat pipe group includes a flat portion, the flat portion contacts the side surface of the body, and the bottom surface of the body and the flat portion contact the heat source.

[0009] In one embodiment of the present invention, the temperature homogenizing plate directly contacts the top surface of the heat source, and the heat pipe assembly includes a flat portion, which directly contacts the side surface of the heat source.

[0010] In one embodiment of the present invention, the above-mentioned heat dissipation fin group includes an upper half and a lower half, the lower half is located between the upper half and the temperature equalizing plate, and the heat pipe group includes a circular tube portion, which is penetrated through the upper half of the heat dissipation fin group.

[0011] In one embodiment of the present invention, the above-mentioned temperature equalizing plate includes a first shell, including a first plate portion and a first side wall protruding from the inner surface of the first plate portion, wherein the heat source is suitable for contacting the outer surface of the first plate portion; a second shell, superimposed on the first shell, the second shell includes a second plate portion, a plurality of support columns protruding from the second plate portion, and a second side wall protruding from the second plate portion and surrounding these support columns, wherein the first side wall is connected to the second side wall, and a plurality of steam channels are formed between these support columns; and a capillary structure, arranged between these support columns of the first plate portion and the second shell.

[0012] In one embodiment of the present invention, the first shell includes a first capillary structure located on the inner surface of the first plate portion and surrounded by the first side wall. The capillary structure is a second capillary structure disposed between the first capillary structure and the support columns of the second shell.

[0013] In one embodiment of the present invention, the above-mentioned temperature equalizing plate further includes a third capillary structure disposed on the inner surface of the first plate portion in a region corresponding to the heat source.

[0014] In one embodiment of the present invention, the first capillary structure comprises a plurality of grooves, and at least a portion of the grooves are arranged radially.

[0015] In one embodiment of the present invention, the above-mentioned temperature equalization plate includes a first shell, a first capillary structure and a second shell. The first shell includes a first plate portion, a plurality of first protrusions protruding from the inner surface of the first plate portion, and a first side wall protruding from the inner surface and surrounding these first protrusions, wherein the heat source is suitable for contacting the outer surface of the first plate portion. The first capillary structure is arranged above the inner surface of the first plate portion and surrounds these first protrusions. The second shell is superimposed on the first shell, and the second shell includes a second plate portion, a plurality of second protrusions protruding from the second plate portion, and a second side wall protruding from the second plate portion and surrounding these second protrusions, wherein the first side wall is joined to the second side wall, and a plurality of steam channels are formed between these second protrusions. The second plate portion includes a plurality of joint areas made room by these second protrusions, these first protrusions are joined to these joint areas, and these second protrusions are against the first capillary structure.

[0016] In one embodiment of the present invention, the above-mentioned first shell includes a second capillary structure that protrudes integrally from the inner surface of the first plate portion, and the second capillary structure includes a plurality of grooves formed between a plurality of convex strips to serve as a liquid channel. The first capillary structure is disposed between the second capillary structure and these second protrusions of the second shell.

[0017] In one embodiment of the present invention, the temperature vapor chamber further comprises a third capillary structure filled in the grooves in the area corresponding to the heat source, and the third capillary structure comprises metal powder or non-woven metal wool.

[0018] In one embodiment of the present invention, the above-mentioned second protrusions include a plurality of first support columns and a plurality of second support columns, the shapes of the first support columns are different from the shapes of the second support columns, the first support columns are arranged at positions corresponding to the heat sources, and the second support columns are located beside the first support columns and extend axially.

[0019] Based on the above, the temperature averaging plate and the heat pipe group of the heat dissipation device of the present invention are suitable for thermal coupling to the heat source, and the heat of the heat source is synchronously conducted to the temperature averaging plate and the heat pipe group. The temperature averaging plate is thermally coupled to the heat dissipation fin group, and the heat pipe group is arranged through the heat dissipation fin group. Therefore, the heat of the heat source can be synchronously conducted to the temperature averaging plate and the heat pipe group, and the heat dissipation path can be increased to effectively improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1A is a schematic diagram of a heat dissipation device according to an embodiment of the present invention;

[0021] Figure 1B is along Figure 1A A cross-sectional schematic diagram of the AA line segment of the heat dissipation device;

[0022] Figure 1C is a cross-sectional schematic diagram of a heat dissipation device according to another embodiment of the present invention;

[0023] FIG. 2A to FIG. 2B is a cross-sectional schematic diagram of various heat dissipation devices according to other embodiments of the present invention;

[0024] Figure 3 is a schematic diagram of a heat dissipation device according to another embodiment of the present invention;

[0025] Figure 4A yes Figure 2A A schematic diagram of the appearance of a temperature vapor chamber of a heat dissipation device;

[0026] Figure 4B is along Figure 4A A schematic cross-sectional view of the BB line segment of the temperature homogenizing plate;

[0027] Figure 4C is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention;

[0028] Figure 4D is a schematic diagram of the interior of a first shell of a temperature homogenizing plate according to another embodiment of the present invention;

[0029] Figure 4E is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention;

[0030] Figure 5A is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention;

[0031] Figure 5B yes Figure 5A A schematic diagram of the interior of a first shell of a temperature homogenizing plate;

[0032] Figure 5C yes Figure 5A A schematic diagram of the interior of a second housing of a temperature homogenizing plate;

[0033] Figure 5D is a schematic diagram of the interior of a first shell of a temperature homogenizing plate according to another embodiment of the present invention;

[0034] Figure 5E is a schematic diagram of the interior of a second shell of a temperature homogenizing plate according to another embodiment of the present invention;

[0035] Fig. 6A is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention;

[0036] Figure 6B yes Fig. 6A A schematic diagram of the interior of a first shell of a temperature homogenizing plate;

[0037] Figure 7 FIG. 4 is a cross-sectional schematic diagram of a temperature vapor chamber according to another embodiment of the present invention.

[0038] Description of Reference Numerals

[0039] A1: axial;

[0040] g: working fluid;

[0041] 10, 10a: heat source;

[0042] 12: top surface;

[0043] 14: Side;

[0044] 20, 20a, 20b: heat dissipation device;

[0045] 30: heat pipe group;

[0046] 32: flat part;

[0047] 34: round tube;

[0048] 40: heat sink fin group;

[0049] 42: upper part;

[0050] 44: lower part;

[0051] 50, 50b: heat conduction structure;

[0052] 52: top surface;

[0053] 53: Bottom;

[0054] 54: side;

[0055] 55: concave cavity;

[0056] 56: Ontology;

[0057] 58: extension;

[0058] 60: fan;

[0059] 100, 100', 100a, 100b, 100c: temperature equalizing plate;

[0060] 110, 110", 110a, 110b: first shell;

[0061] 111: first plate portion;

[0062] 1112: inner surface;

[0063] 1114: outer surface;

[0064] 112: convex strip;

[0065] 113, 130a: first capillary structure;

[0066] 112”, 114, 115, 118, 119: grooves;

[0067] 117: First side wall;

[0068] 117a, 117b: first protrusion 120, 120a: second housing;

[0069] 121: second plate portion;

[0070] 122: support column;

[0071] 122b: first supporting column;

[0072] 123: second support column;

[0073] 124: Steam channel;

[0074] 126: wall;

[0075] 128: Second side wall;

[0076] 129: junction area;

[0077] 130, 113a: second capillary structure;

[0078] 132: Wire;

[0079] 140: The third capillary structure. DETAILED DESCRIPTION

[0080] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0081] Figure 1A is a schematic diagram of a heat dissipation device according to an embodiment of the present invention. Figure 1B is along Figure 1A Schematic diagram of the cross section of the heat sink along line AA. Figure 1A and Figure 1B The heat dissipation device 20 of this embodiment is suitable for dissipating heat from the heat source 10. The heat source 10 is, for example, a central processing unit of a motherboard, but the heat source 10 may also be other chips, and the type and quantity of the heat source 10 are not limited thereto.

[0082] The heat dissipation device 20 includes a temperature averaging plate 100, a heat pipe group 30, and a heat dissipation fin group 40. The temperature averaging plate 100 is, for example, an ultra-thin temperature averaging plate (UTVC), but the type of the temperature averaging plate 100 is not limited thereto. The heat pipe group 30 includes a plurality of heat pipes. The temperature averaging plate 100 and the heat pipe group 30 are thermally coupled to the heat source 10. The heat of the heat source 10 is synchronously conducted to the temperature averaging plate 100 and the heat pipe group 30. The temperature averaging plate 100 is thermally coupled to the heat dissipation fin group 40, and the heat pipe group 30 is disposed through the heat dissipation fin group 40.

[0083] In this embodiment, the heat dissipation device 20 may further include a heat conduction structure 50. The material of the heat conduction structure 50 is, for example, copper, but is not limited thereto. In this embodiment, the heat conduction structure 50 directly contacts the heat source 10, and the temperature plate 100 and the heat pipe group 30 directly contact the heat conduction structure 50. The heat of the heat source 10 is synchronously conducted to the temperature plate 100 and the heat pipe group 30 via the heat conduction structure 50.

[0084] Specifically, the heat conduction structure 50 includes a body 56 and an extension portion 58 extending from a side surface 54 of the body 56 . The temperature vapor chamber 100 directly contacts the top surface 52 of the body 56 , and the extension portion 58 extends to below the heat pipe assembly 30 . Figure 1B The extending portion 58 is shown to extend to below the heat pipe assembly 30 , but the extending portion 58 may also be extended to above the heat pipe assembly 30 .

[0085] The heat pipe group 30 includes a circular tube portion 34 and a flat portion 32. The circular tube portion 34 is disposed through the heat dissipation fin group 40, and the flat portion 32 is located between the extension portion 58 and the temperature evaporating plate 100, and directly contacts the extension portion 58 and the temperature evaporating plate 100. The design of the flat portion 32 can reduce the height and increase the contact area with the heat conduction structure 50 to enhance the effect of heat conduction.

[0086] In addition, in this embodiment, the flat portion 32 does not contact the side surface 54 of the body 56. In other embodiments, the flat portion 32 may also contact the side surface 54 of the body 56. In one embodiment, the heat conducting structure 50 may also be a cuboid without the extension portion 58, and the flat portion 32 directly contacts the side surface 54 of the body 56.

[0087] In addition, the heat sink fin group 40 includes an upper part 42 and a lower part 44, the lower part 44 is located between the upper part 42 and the temperature plate 100, and the circular tube portion 34 of the heat pipe group 30 is inserted into the upper part 42 of the heat sink fin group 40. Since the upper part 42 of the heat sink fin group 40 is lower in temperature than the lower part 44, such a design allows the heat generated by the heat source 10 to be quickly brought to the upper part 42 of the heat sink fin group 40 by the heat pipe group 30, which can effectively improve the heat dissipation efficiency of the heat sink fin group 40 and reduce the heat load of the temperature plate 100. According to simulation, the heat sink 20 of this case can effectively meet the heat dissipation requirements when the heat source 10 exceeds 1000W.

[0088] Figure 1C is a cross-sectional schematic diagram of a heat dissipation device according to another embodiment of the present invention. Figure 1C In this embodiment, the heat conduction structure has only a body 56 and no extension. The heat source 10 directly contacts the bottom surface 53 of the body 56 and the flat portion 32 of the heat pipe group 30. The temperature plate 100 directly contacts the top surface 52 of the body 56, and the flat portion 32 of the heat pipe group 30 contacts the side surface 54 of the body 56. The heat of the heat source 10 is simultaneously transferred to the flat portion 32 of the heat pipe group 30 and the body 56, and is synchronously transferred to the temperature plate 100 and the flat portion 32 of the heat pipe group 30 through the body 56.

[0089] FIG. 2A to FIG. 2B is a cross-sectional schematic diagram of various heat dissipation devices 20 according to other embodiments of the present invention. Figure 2A , Figure 2A and Figure 1B The main difference is that Figure 1B The heat source 10 is small and flat, and the heat source 10 transfers heat to the heat pipe assembly 30 and the temperature homogenizing plate 100 through the heat conduction structure 50 . Figure 2A The heat source 10a is relatively large in size. In addition to the chip, the heat source 10a also includes an integrated heat sink (IHS). For this type of heat source 10a, due to space limitations, the heat dissipation device 20a of this embodiment omits the heat conduction structure 50, the temperature plate 100 directly contacts the top surface 12 of the heat source 10, and the flat portion 32 of the heat pipe group 30 directly contacts the side surface 14 of the heat source 10.

[0090] Similarly, the heat of the heat source 10a is simultaneously conducted to the temperature plate 100 and the heat pipe assembly 30. Part of the heat is transferred upward to the lower half 44 of the heat dissipation fin assembly 40 through the temperature plate 100, and part of the heat is transferred upward to the upper half 42 of the heat dissipation fin assembly 40 through the heat pipe assembly 30 to improve the heat dissipation efficiency.

[0091] Please refer to Figure 2B , Figure 2B and Figure 1B The main difference is that Figure 1B The heat source 10 is small and flat, and the bottom surface 53 of the heat conducting structure 50 is in contact with the heat source 10 . Figure 2B The heat source 10a is larger in size and also includes a built-in temperature balancing structure (IHS). The body 56 of the heat conducting structure 50b may have a cavity 55 for accommodating at least a portion of the heat source 10a to reduce the overall height.

[0092] Similarly, the temperature averaging plate 100 directly contacts the top surface 52 of the body 56, and the flat portion 32 of the heat pipe group 30 is located between the extension portion 58 and the temperature averaging plate 100, and directly contacts the extension portion 58 and the temperature averaging plate 100. This design allows the heat of the heat source 10a to be simultaneously transferred to the temperature averaging plate 100 and the heat pipe group 30 through the heat conduction structure 50b. A portion of the heat is transferred upward to the lower half 44 of the heat dissipation fin group 40 through the heat conduction structure 50b and the temperature averaging plate 100, and a portion of the heat is transferred upward to the upper half 42 of the heat dissipation fin group 40 through the heat conduction structure 50b and the heat pipe group 30, so as to improve the heat dissipation efficiency.

[0093] Figure 3 is a schematic diagram of a heat dissipation device according to another embodiment of the present invention. Figure 3 , Figure 3 The heat dissipation device 20 further includes a fan 60. The fan 60 is, for example, disposed above the heat dissipation fin set 40. The wind from the fan 60 blows toward the heat dissipation fin set 40 below. However, the position and wind direction of the fan 60 are not limited thereto. In addition, in this embodiment, the width of the fan 60 is approximately the same as the width of the heat dissipation fin set 40, so that the heat of the heat dissipation fin set 40 can be fully taken away by the wind from the fan 60, thereby improving the heat dissipation efficiency.

[0094] In addition, based on the above-mentioned heat source 10, 10a being synchronously conducted to the temperature plate 100 and the heat pipe group 30, the temperature plate 100 also has a variety of designs to enhance the heat dissipation effect, which will be described below. It is worth noting that although the temperature plate described below is directly in contact with the heat source 10, it can also be directly in contact with the heat conduction structure 50, 50b. In other words, Figures 1A to 2B The temperature averaging plates in these embodiments may adopt the temperature averaging plates described below.

[0095] Figure 4A yes Figure 2A Schematic diagram of the appearance of a temperature vapor chamber of a heat dissipation device. Figure 4B is along Figure 4A The cross-sectional diagram of the BB line segment of the temperature equalization plate. It should be noted that Figure 4A The appearance shape of the temperature homogenizing plate is taken as a rectangular plate body as an example, but it is not limited to this.

[0096] See also Figure 4A and Figure 4B The temperature vapor chamber 100 of this embodiment includes a first shell 110 and a second shell 120. Figure 4B It can be seen that the first housing 110 includes a first plate portion 111, a first capillary structure 113 located on an inner surface 1112 of the first plate portion 111, and a first side wall 117 protruding from the inner surface 1112 and surrounding the first capillary structure 113. The heat source 10 is suitable for contacting the first housing outer surface 1114 of the first plate portion 111, and transferring the heat energy generated by the heat source 10 to the temperature vapor chamber 100.

[0097] In the present embodiment, the first capillary structure 113 includes a plurality of grooves 114 formed between the plurality of convex strips 112. More specifically, the convex strips 112 protrude from the inner surface 1112 of the first plate body, so that the grooves 114 are defined between two adjacent convex strips 112. The first capillary structure 113 adopts the design of the grooves 114 to provide a smaller flow resistance. In the present embodiment, the width of the grooves 114 is, for example, between 50 microns and 200 microns, and the depth of the grooves 114 is, for example, between 50 microns and 200 microns, but the width and depth of the grooves 114 are not limited thereto.

[0098] Therefore, if Figure 4B As shown, the temperature vapor chamber 100 further includes a second capillary structure 130 . The second capillary structure 130 is disposed between the first capillary structure 113 and the support pillars 122 to cover the first capillary structure 113 .

[0099] In addition, in this embodiment, the first plate portion 111 and the ridges 112 are integrally formed, and such a design can have a simpler structure. Since there is no contact thermal resistance between the first plate portion 111 and the ridges 112 (that is, between the first plate portion 111 and the grooves 114), the heat transfer effect is better.

[0100] The second housing 120 is superimposed on the first housing 110 and includes a second plate portion 121, a plurality of support columns 122 protruding from the second plate portion 121, and a second side wall 128 protruding from the second plate portion 121 and surrounding the support columns 122. In this embodiment, the support columns 122 and the second side wall 128 are at the same height and flush, but the relationship between the support columns 122 and the second side wall 128 is not limited thereto.

[0101] The support columns 122 are of the same shape and are evenly distributed on the inner surface of the second plate portion 121, and a plurality of steam channels 124 are formed between the support columns 122. The support columns 122 are, for example, square columns, but in other embodiments, the support columns 122 may also be rectangular columns, cylinders, elliptical columns, polygonal columns, conical columns, irregular columns, or / and a combination thereof. The shape and distribution of the support columns 122 are not limited thereto. The support columns 122 and the second plate portion 121 are integrally formed, but may also be joined by welding, bonding, or other methods.

[0102] In this embodiment, the support columns 122 face the first capillary structure 113. In addition, in this embodiment, the first housing 110 and the second housing 120 are, for example, two metal housings, and the first side wall 117 is joined to the second side wall 128 to provide good structural strength. The first side wall 117 and the second side wall 128 are joined by, for example, diffusion bonding or welding, but are not limited thereto.

[0103] In this embodiment, the first capillary structure 113 is slightly lower than the first side wall 117, and the second capillary structure 130 is disposed on the first capillary structure 113 and is approximately flush with the first side wall 117, so that when the first side wall 117 is joined to the second side wall 128, the support column 122 can press against the second capillary structure 130. Of course, in other embodiments, the above height relationship is not limited to this.

[0104] It should be mentioned that in the present embodiment, an appropriate amount of working fluid, such as water, is filled into the internal space surrounded by the first shell 110 and the second shell 120, but the type of the working fluid is not limited thereto. The working fluid, for example, flows in the groove 114 of the first capillary structure 113 of the first shell 110 in the form of a liquid. The working fluid absorbs heat in the area close to the heat source 10 and evaporates into steam. The steam channel 124 of the second shell 120 can be evacuated to make the pressure here less than 1 atmosphere (for example, close to vacuum) to avoid the subsequent phase change of the working fluid, and the air pressure here is too high, so as to separate the first shell 110 from the second shell 120.

[0105] Therefore, in this embodiment, the support column 122 abuts against the second capillary structure 130, and can support the second plate portion 121, effectively preventing the first shell 110, the second shell 120 and the steam channel 124 from collapsing when vacuuming. In addition, when the working fluid condenses from gas to liquid, the working fluid can also flow down along the side wall of the support column 122. In other words, the support column 122 can also serve as a structure to guide the working fluid (liquid) to flow down.

[0106] In this embodiment, the second capillary structure 130 is a mesh structure woven by a plurality of wires 132, such as a copper mesh. Of course, in other embodiments, the second capillary structure 130 may also be a non-woven mesh or a porous foamed metal capillary structure, and the form of the second capillary structure 130 is not limited thereto.

[0107] It is worth mentioning that in Figure 4B As can be seen in the figure, since the second capillary structure 130 is disposed on the groove 114 of the first capillary structure 113, the upper part of the groove 114 of the first capillary structure 113 is covered by the second capillary structure 130, and a capillary structure is formed in the extension direction of the groove 114 (the direction of injection or injection into the figure), and this structure can enable the working fluid in the groove 114 to resist gravity, so that the temperature vapor chamber 100 can complete the thermal cycle well in a non-horizontal condition. In other words, the setting of the second capillary structure 130 not only maintains the low flow resistance advantage of the groove 114, but also significantly improves the capillary and channel functions of the first capillary structure 113, so that the temperature vapor chamber 100 is suitable for non-horizontal placement.

[0108] Figure 4C is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention. Figure 4C In this embodiment, the temperature vapor chamber 100 further includes a third capillary structure 140 disposed near the corresponding heat source 10 . In this embodiment, the third capillary structure 140 is disposed on the inner surface 1112 of the first plate portion 111 in a region corresponding to the heat source 10 .

[0109] In detail, in this embodiment, since the grooves 114 of the first capillary structure 113 are evenly distributed on the first plate portion 111, a portion (particularly the central portion) of the grooves 114 corresponds to the region of the first plate portion 111 corresponding to the heat source 10. Therefore, in this embodiment, the third capillary structure 140 is filled in the region of the grooves 114 corresponding to the heat source 10.

[0110] The second capillary structure 130 includes a plurality of holes. The third capillary structure 140 is filled in these holes corresponding to the heat source 10. In the present embodiment, the third capillary structure 140 is a sintered capillary structure, for example, metal powder or metal velvet is sintered in the groove 114 and the local area of ​​the hole, so as to further increase the capillary force therein and enhance the anti-drying ability. Of course, in other embodiments, the form of the third capillary structure 140 is not limited thereto. In addition, in an embodiment not shown, the second capillary structure 130 may also be a metal foam layer having a large number of holes inside, and the third capillary structure 140 (metal powder) is filled in these holes of the metal foam layer and the groove 114 of the first capillary structure 113.

[0111] Depend on Figure 4C It can be seen that the first shell outer surface 1114 of the first shell 110 of the vapor chamber 100 contacts the heat source 10, and the heat emitted by the heat source 10 will be transferred to the first shell 110. The area of ​​the vapor chamber 100 corresponding to the heat source 10 is called the evaporation zone. In the evaporation zone, the liquid in the groove 114 absorbs heat and vaporizes into steam. This working fluid (gas) will flow upward to the steam channel 124 of the second shell 120 and diffuse in the internal steam cavity of the second shell 120, and then condense into liquid in the condensation area of ​​the vapor chamber (for example, the outer surface of the second shell of the vapor chamber, or the selected area of ​​the outer surface 1114 of the first shell that is not in contact with the heat source 10), and discharge the heat from the vapor chamber 100. Condensed into liquid. The condensed working fluid (liquid) flows downward to the groove 114 of the first shell 110, and flows to the third capillary structure 140 under the capillary force in the groove 114, completing the cycle.

[0112] It is worth mentioning that in the present embodiment, the third capillary structure 140 is filled in the groove 114 of the first capillary structure 113 and the hole of the second capillary structure 130 in the evaporation area. Since the sintered material can provide a good capillary environment for the liquid, the working fluid can be easily absorbed into the evaporation area to avoid the situation where the liquid in the evaporation area is not replenished in time after being vaporized, thereby providing good anti-drying ability.

[0113] In addition, the grooves 114 of the first capillary structure 113 and the holes of the second capillary structure 130 are not provided with the third capillary structure 140 in the area other than the heat source 10, so that low flow resistance can be maintained. In other words, since the third capillary structure 140 is only provided in the first capillary structure 113 near the position corresponding to the heat source 10, it does not block the path through which the liquid flows back.

[0114] Thus, the heat spreader 100 can greatly increase the maximum heat dissipation through the above design, and can be applied to thin devices without increasing the thickness (the thickness of the first capillary structure 113 and the second capillary structure 130 can be maintained). According to the test, compared with the heat spreader without the third capillary structure 140, the maximum heat dissipation of the heat spreader 100 of this embodiment can be increased by at least 50%, and has a very good performance.

[0115] Figure 4D FIG. 1 is a schematic diagram of the interior of a first housing of a temperature vaporizer according to another embodiment of the present invention. Figure 4DIn this embodiment, the first shell 110" has a plurality of grooves 114, 112", 115, 118, 119 in different directions, and these grooves are radial to reduce flow resistance and allow the condensed working fluid g (liquid) to flow back quickly. The arrangement of the grooves on the inner surface of the first shell 110" is not limited to the radial shape, and any arrangement pattern sufficient to guide the working fluid g (liquid) can be used. Of course, in other embodiments, the grooves of the first shell can also be arranged in only a single direction, or the grooves of the first shell can also be arranged in multiple non-radial directions.

[0116] Figure 4E is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention. Figure 4E In this embodiment, the temperature plate 100' has only a single capillary structure (for example, the second capillary structure 130). The second capillary structure 130 is a mesh structure woven by a plurality of wires, for example, a copper mesh. Of course, in other embodiments, the second capillary structure 130 may also be a non-woven mesh or a porous foamed metal capillary structure, and the form of the second capillary structure 130 is not limited thereto. In addition, the type of the capillary structure of the temperature plate 100' is not limited thereto.

[0117] Figure 5A FIG. 4 is a cross-sectional schematic diagram of a temperature vapor chamber according to another embodiment of the present invention. Figure 5B yes Figure 5A Schematic diagram of the interior of the first shell of the temperature homogenizer. Figure 5C yes Figure 5A Schematic diagram of the interior of the second shell of the temperature homogenizer.

[0118] It should be noted that Figure 5A The cross section is the cross section along the width direction of the temperature plate, which is different from Figure 4B The cross-section along the length of the temperature plate is different. Figure 5B In the figure, the convex strip 112 is represented by a thin line, and the first protrusion 117a is represented by a thick line.

[0119] The temperature vapor chamber 100a of this embodiment includes a first shell 110a, a first capillary structure 130a and a second shell 120a. The first shell 110a and the second shell 120a are made of metal, such as aluminum or aluminum alloy, but are not limited thereto. In other embodiments, the first shell 110a and the second shell 120a may also be made of other metals such as copper or copper alloy.

[0120] The first housing 110a includes a first plate portion 111, a plurality of first protrusions 117a protruding from an inner surface 1112 of the first plate portion 111, and a first side wall 117 protruding from the inner surface 1112 and surrounding the first protrusions 117a. The heat source 10 is adapted to contact an outer surface 1114 of the first plate portion 111 to transfer heat energy generated by the heat source 10 to the vapor chamber 100a.

[0121] In this embodiment, the first protrusions 117a are columnar, and the first protrusions 117a are evenly distributed on the inner surface 1112. Of course, in other embodiments, the first protrusions 117a may also be long strips, and the first protrusions 117a may also be unevenly distributed. The shape and distribution of the first protrusions 117a are not limited to this. Figure 5B Although the first protrusion 117a is not placed in the evaporation area corresponding to the heat source 10 in the illustrated embodiment, the first protrusion 117a can actually be partially placed in the evaporation area corresponding to the heat source 10, and the second protrusion 122 can be partially removed from the position on the second plate portion 121 corresponding to the first protrusion 117a to form a bonding area 129.

[0122] In this embodiment, the first plate portion 111 and the first protrusions 117a are integrally formed, and such a design can have a simpler structure. In addition, since there is no contact thermal resistance between the first plate portion 111 and the first protrusions 117a, the heat transfer effect is better. The first plate portion 111 and the first protrusions 117a are made, for example, by stamping, chemical etching, forging or die-casting, but are not limited thereto.

[0123] like Figure 5A As shown, the first capillary structure 130a is disposed on the inner surface 1112 of the first plate portion 111 and surrounds the first protrusions 117a. In the present embodiment, the first capillary structure 130a is a mesh structure woven by a plurality of wires, such as a metal mesh such as a copper mesh or an aluminum mesh. Of course, in other embodiments, the first capillary structure 130a may also be a non-woven mesh or a porous foamed metal capillary structure. The first capillary structure 130a may also be a sintered metal powder capillary, and the form of the first capillary structure 130a is not limited thereto. Since the first capillary structure 130a includes a plurality of holes, a capillary force can be provided in the holes.

[0124] The second housing 120a is superimposed on the first housing 110a. The second housing 120a includes a second plate portion 121, a plurality of second protrusions 122 protruding from the second plate portion 121, and a second side wall 128 protruding from the second plate portion 121 and surrounding the second protrusions 122. In this embodiment, the second protrusions 122 and the second side wall 128 are at the same height and flush, but the relationship between the second protrusions 122 and the second side wall 128 is not limited thereto.

[0125] The first side wall 117 is joined to the second side wall 128. In this embodiment, the first side wall 117 and the second side wall 128 can be joined by stamping shearing, diffusion bonding, brazing, soldering, laser welding, or arc welding to achieve a sealing effect.

[0126] In order to increase the structural strength of the temperature evaporating plate 100a, the temperature evaporating plate 100a of this embodiment is specially provided with the first protrusions 117a in the area within the first side wall 117 of the first housing 110a. Figure 5C As shown, the second plate portion 121 includes a plurality of bonding areas 129 formed by the second protrusions 122. When the first side wall 117 is bonded with the second side wall 128, the first protrusions 117a are bonded to the bonding areas 129 of the second plate portion 121. The bonding areas 129 of the first protrusion 117a and the second plate portion 121 can be bonded by resistance welding during cold working; during hot working, the bonding can be achieved by diffusion bonding or other methods to enhance the connectivity between the first shell 110a and the second shell 120a and achieve sufficient anti-expansion properties.

[0127] In this embodiment, since these first protrusions 117a and these second protrusions 122 are staggered with each other, there is no need for precise alignment between the first shell 110a and the second shell 120a. Even if there is any offset between the first shell 110a and the second shell 120a during the manufacturing process, it will not have any impact on the joining between the first protrusion 117a and the joining area 129 of the second plate portion 121. The process is convenient, and the first protrusion 117a can be directly joined to the second plate portion 121, which makes it easy to maintain the joining strength between the first shell 110a and the second shell 120a.

[0128] In addition, if Figure 5A As shown, these second protrusions 122 abut against the first capillary structure 130a, which helps to keep the distance between the first plate portion 111 and the second plate portion 121 fixed, not only ensuring the flatness of the first capillary structure 130a, but also preventing the temperature averaging plate 100a from collapsing and deforming due to changes in internal pressure, and effectively increasing the service life of the temperature averaging plate 100a. In this embodiment, the difference between the height of the first protrusion 117a protruding from the first plate portion 111 and the height of the second protrusion 122 protruding from the second plate portion 121 is the height of the capillary layer.

[0129] In addition, in this embodiment, the number of the second protrusions 122 is greater than the number of the first protrusions 117a. A plurality of steam channels 124 are formed between the second protrusions 122. The second protrusions 122 are used as a structure defining the steam channel, a guide structure for the liquid condensed from the steam to flow down along the second protrusions 122, and a support structure to prevent the first shell 110a and the second shell 120a from collapsing. Therefore, a larger number of the second protrusions 122 can provide more steam channels 124, guide structures, and support structures.

[0130] In addition, in this embodiment, the size of the first protrusion 117a is larger than the size of the second protrusion 122. The first protrusion 117a is mainly used as a connecting structure for joining the second plate portion 121. Therefore, the larger size of the first protrusion 117a can provide a larger joining area. Of course, the size and quantity relationship between the first protrusion 117a and the second protrusion 122 is not limited to this.

[0131] In addition, since the first protrusion 117a of this embodiment is directly connected to the second plate portion 121, the first protrusion 117a can also be used as a structure to define a portion of the steam channel, and can have the effect of allowing the liquid condensed from the steam to flow down along the first protrusion 117a. The first protrusion 117a and the second protrusion 122 can greatly shorten the path length of the liquid reflux, effectively reducing the flow resistance.

[0132] In the present embodiment, the second protrusions 122 are, for example, cylinders, and the shapes of the second protrusions 122 are consistent, but the shape of the second protrusions 122 is not limited thereto. In other embodiments, the second protrusions 122 may also be rectangular columns, square columns, elliptical columns, polygonal columns, conical columns, irregular columns, or / and a combination thereof. The shape and distribution of the second protrusions 122 are not limited thereto. In addition, in the present embodiment, the second protrusions 122 and the second plate portion 121 are integrally formed, and the second plate portion 121 and the second protrusions 122 are, for example, made by a process of stamping, chemical etching, forging, or die-casting, but are not limited thereto.

[0133] In addition, in this embodiment, Figure 5A From the cross-section of the second protrusion 122, the cross-section of the second protrusion 122 is a rectangle, but in other embodiments, the cross-section of the second protrusion 122 can also be an inverted trapezoid, so the cross-section of the constructed steam channel 124 is a trapezoid. In other embodiments, these second protrusions 122 may include a plurality of conical columns, a plurality of trapezoidal columns, a plurality of cylinders, or a plurality of irregular columns, so the cross-section of the second protrusion 122 can be a triangle, an arc, or other shapes. Similarly, the cross-section of the steam channel 124 can be a triangle, an arc, or other shapes.

[0134] It should be mentioned that in this embodiment, an appropriate amount of working fluid g (indicated by Figure 5C , Figure 5C The working fluid g is a gas. The working fluid g is, for example, acetone compatible with the aluminum container, but the type of the working fluid g is not limited thereto. In other embodiments, the working fluid g may also be water or other types of working fluids as long as they can be compatible with the material of the vapor chamber container. The working fluid g flows in the first housing 110a in the form of a liquid, for example.

[0135] The outer surface 1114 (marked at Figure 5A ) contacts the heat source 10, and the heat emitted by the heat source 10 will be transferred to the first shell 110a. The area of ​​the temperature evaporating plate 100a corresponding to the heat source 10 is called the evaporation zone. In the evaporation zone, the working fluid g (liquid) absorbs heat and vaporizes into a gas (steam). This working fluid g (steam) will flow upward to the steam channel 124 of the second shell 120a and diffuse inside the second shell 120a, and then condense into a liquid in the condensation area of ​​the temperature evaporating plate (for example, the second shell 120a of the temperature evaporating plate 100a or the area of ​​the first shell 110a outside the projection of the heat source 10), and discharge the heat from the temperature evaporating plate 100a. When the working fluid g condenses from a gas to a liquid, the working fluid g can flow down along the side walls of the second protrusion 122 and the first protrusion 117a. The condensed working fluid g (liquid) flows back downward to the area near the heat source 10 to evaporate, completing the heat cycle.

[0136] In this embodiment, the steam channel 124 of the second shell 120a can be evacuated to make the pressure there less than 1 atmosphere (for example, close to vacuum) to avoid the subsequent phase change of the working fluid g, where the air pressure is too high, thereby separating the first shell 110a from the second shell 120a.

[0137] It is worth mentioning that in this embodiment, the second protrusion 122 abuts against the first capillary structure 130a, and can support the second plate portion 121, effectively preventing the first shell 110a, the second shell 120a and the steam channel 124 from collapsing when vacuuming. In addition, the first protrusion 117a can be connected to the corresponding joint area 129, so that when the pressure between the first plate portion 111 and the second plate portion 121 is greater than 1 atmosphere (that is, the saturation pressure corresponding to the operating temperature of the temperature equalizer is higher than the ambient pressure), the distance between the first plate portion 111 and the second plate portion 121 can be maintained fixed, thereby preventing the temperature equalizer 100a from expanding and deforming.

[0138] In addition, if Figure 5AAs shown, in this embodiment, the first housing 110a includes a second capillary structure 113a integrally protruding from the inner surface 1112 of the first plate portion 111. The second capillary structure 113a includes a plurality of grooves 114 formed between the plurality of protrusions 112 to serve as liquid channels.

[0139] More specifically, these convex strips 112 protrude from the inner surface 1112 of the first plate body, so that a groove 114 is defined between two adjacent convex strips 112. In this embodiment, the first plate portion 111 and these convex strips 112 are integrally formed, and such a design can have a simpler structure. Since there is no contact thermal resistance between the first plate portion 111 and these convex strips 112 (that is, between the first plate portion 111 and the groove 114), the heat transfer effect is better.

[0140] Working fluid g( Figure 5C ) For example, the first shell 110a flows in the groove 114 of the second capillary structure 113a in the form of a liquid. The second capillary structure 113a adopts the design of the groove 114 to provide a smaller flow resistance. In this embodiment, the width of the groove 114 is, for example, between 50 microns and 200 microns, and the depth of the groove 114 is, for example, between 50 microns and 200 microns, but the width and depth of the groove 114 are not limited thereto.

[0141] like Figure 5A As shown, the height of the first protrusion 117a is greater than the height of the ridge 112. The first protrusion 117a passes through the first capillary structure 130a, and is disposed between the second capillary structure 113a and the second protrusions 122 of the second shell 120a through the first capillary structure 130a. Since the first capillary structure 130a is disposed on the groove 114 of the second capillary structure 113a, the upper part of the groove 114 of the second capillary structure 113a is covered by the first capillary structure 130a, and a capillary structure is formed in the extending direction of the groove 114 (the direction of injection or injection into the figure), and this structure can enable the working fluid in the groove 114 to resist gravity, so that the vapor chamber 100a can complete the thermal cycle well in a non-horizontal state.

[0142] Therefore, in this embodiment, the open grooves 114 of the second capillary structure 113a are covered with the meshed first capillary structure 130a, which not only maintains the low flow resistance advantage of the grooves 114 but also significantly enhances the capillary force, making the temperature vapor chamber 100a suitable for non-horizontal placement.

[0143] In addition, if Figure 5BAs shown, in this embodiment, the length of the convex strip 112 in the left and right regions of the first plate portion 111 in the length direction is large, and the length in the central region of the first plate portion 111 in the length direction is small. In addition to reducing the probability of the second shell 120 being dented, the design of the convex strip 112 having different lengths in different regions can make it easier for the condensed liquid in the first shell 110 to flow back to the evaporation area.

[0144] Figure 5D FIG. 1 is a schematic diagram of the interior of a first housing of a temperature vaporizer according to another embodiment of the present invention. Figure 5D In this embodiment, the first protrusions 117b and at least a portion of the ridges 112 are arranged radially, so that at least a portion of the grooves 114, 115, and 118 are arranged radially. In addition, the grooves 119 of the first shell 110b corresponding to the heat source 10 are arranged in a checkerboard pattern. Of course, in an embodiment, only the ridges 112 may be arranged radially, which is not limited to the figure.

[0145] Specifically, in this embodiment, the first shell 110b has a plurality of grooves 114, 115, 118, 119 in different directions. These grooves 114, 115, 118 are radially arranged to reduce flow resistance and allow the condensed working fluid g (liquid) to flow back quickly. The arrangement of the grooves 114, 115, 118 on the inner surface 1112 of the first shell 110b is not limited to the radial arrangement, and any arrangement pattern sufficient to guide the working fluid g (liquid) can be used.

[0146] It is worth mentioning that, in one embodiment, these first protrusions may be evenly distributed in the area outside the evaporation area. In another embodiment, these first protrusions may be unevenly distributed in the area outside the evaporation area. The shape and size of these first protrusions are not limited. In other embodiments, these first protrusions may also be partially located in the evaporation area, and are not limited by the figure.

[0147] Figure 5E FIG. 1 is a schematic diagram of the interior of a second housing of a temperature vaporizer according to another embodiment of the present invention. Figure 5E In this embodiment, these second protrusions include multiple first support columns 122b and multiple second support columns 123. The shapes of these first support columns 122b are different from the shapes of these second support columns 123. These first support columns 122b are arranged at the positions corresponding to the heat source 10, and these second support columns 123 are located next to these first support columns 122b and extend along the axial direction A1.

[0148] In this embodiment, the second housing 120 is provided with high-density first support columns 122b at the position corresponding to the heat source 10, thereby providing good structural strength. The second support columns 123 are arranged on both sides of the first support columns 122b and extend along the axial direction A1, thereby guiding the flow direction of the working fluid g (gas). In addition, in this embodiment, the second support columns 123 partially give way to the joint area 129, so that the first protrusion 117a (such as Figure 5A ) join.

[0149] Fig. 6A FIG. 4 is a cross-sectional schematic diagram of a temperature vapor chamber according to another embodiment of the present invention. Figure 6B yes Fig. 6A Schematic diagram of the interior of the first housing of the temperature plate. Fig. 6A The cross section is like Figure 5A , is the cross section along the width direction of the temperature homogenizing plate.

[0150] See also Fig. 6A and Figure 6B In this embodiment, the temperature vapor chamber 100b further includes a third capillary structure 140, which is filled in the area of ​​the second capillary structure 113a corresponding to the heat source 10. That is, the third capillary structure 140 is added to the area with the largest heat flux in the evaporation zone, and this area has fewer support columns.

[0151] The third capillary structure 140 includes metal powder or non-woven metal velvet. In the present embodiment, the third capillary structure 140 is a sintered capillary structure, for example, the metal powder is sintered in a local area of ​​the groove 114. Of course, in other embodiments, the form of the third capillary structure 140 is not limited to this. The first capillary structure 130 may also be a metal foam layer with a large number of holes inside, and the third capillary structure 140 (metal powder) may also be filled in these holes of the metal foam layer.

[0152] In this embodiment, adding metal powder or metal wool with stronger capillary force to the second capillary structure 113a near the heat source 10 can further increase the capillary force there and improve the anti-drying ability. In addition, since the third capillary structure 140 is only arranged at the position corresponding to the heat source 10 in the second capillary structure 113a, it does not block the path through which the liquid flows back.

[0153] It is worth mentioning that in the present embodiment, since the third capillary structure 140 corresponding to the heat source 10 area has a stronger capillary force, and the groove 114 in the second capillary structure 113a covered by the first capillary structure 130a has both lower flow resistance and stronger capillary force, these three capillary structures are properly matched, so that the working liquid can flow back to the evaporation area close to the heat source 10 more quickly, making the evaporation area of ​​the temperature vapor chamber structure less likely to dry out, and having better heat dissipation performance.

[0154] Figure 7 FIG. 1 is a cross-sectional schematic diagram of a temperature homogenizing plate according to another embodiment of the present invention. It should be noted that: Figure 7 is the cross section of the long side of the temperature plate. Figure 7 , Figure 7 The temperature plate is 100c and Figure 5A The main difference of the temperature plate 100a is that Figure 7 In the embodiment, the temperature plate 100c has only a single capillary structure (e.g., the first capillary structure 130a). The first capillary structure 130a is a mesh structure woven by a plurality of wires, such as a copper mesh. Of course, in other embodiments, the first capillary structure 130a may also be a non-woven mesh or a porous foamed metal capillary structure, and the form of the first capillary structure 130a is not limited thereto. In addition, the type of the capillary structure of the temperature plate 100c is not limited thereto.

[0155] In summary, the temperature averaging plate and the heat pipe group of the heat dissipation device of the present invention are suitable for thermal coupling to the heat source, and the heat of the heat source is synchronously conducted to the temperature averaging plate and the heat pipe group. The temperature averaging plate is thermally coupled to the heat dissipation fin group, and the heat pipe group is arranged through the heat dissipation fin group. Therefore, the heat of the heat source can be synchronously conducted to the temperature averaging plate and the heat pipe group, and the heat dissipation path can be increased to effectively improve the heat dissipation efficiency.

[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, suitable for dissipating heat from a heat source, characterized in that: include: A temperature homogenizing plate, adapted to be thermally coupled to the heat source; A heat pipe group, adapted to be thermally coupled to the heat source, wherein the heat of the heat source is synchronously conducted to the temperature homogenizing plate and the heat pipe group; as well as The heat dissipation fin group is thermally coupled to the heat dissipation fin group, and the heat pipe group is disposed through the heat dissipation fin group.

2. The heat dissipation device according to claim 1, characterized in that: It further comprises a heat conduction structure suitable for contacting the heat source, the temperature averaging plate and the heat pipe group directly contact the heat conduction structure, and the heat of the heat source is synchronously conducted to the temperature averaging plate and the heat pipe group via the heat conduction structure.

3. The heat dissipation device according to claim 2, characterized in that: The heat conduction structure includes a main body and an extension portion extending from a side surface of the main body, the temperature averaging plate directly contacts a top surface of the main body, the extension portion extends to the heat pipe group, the heat pipe group includes a flat portion, the flat portion is located between the extension portion and the temperature averaging plate, and directly contacts the extension portion and the temperature averaging plate.

4. The heat dissipation device according to claim 3, characterized in that: The body includes a recessed cavity facing away from the top surface, adapted to accommodate at least a portion of the heat source.

5. The heat dissipation device according to claim 2, characterized in that: The heat conduction structure includes a body, the temperature equalizing plate directly contacts the top surface of the body, the heat pipe group includes a flat portion, the flat portion contacts the side surface of the body, and the bottom surface of the body and the flat portion contact the heat source.

6. The heat dissipation device according to claim 1, characterized in that: The temperature homogenizing plate directly contacts the top surface of the heat source, and the heat pipe group includes a flat portion, and the flat portion directly contacts the side surface of the heat source.

7. The heat dissipation device according to claim 1, characterized in that: The heat dissipation fin group includes an upper half and a lower half, the lower half is located between the upper half and the temperature equalizing plate, and the heat pipe group includes a circular tube portion, and the circular tube portion is penetrated through the upper half of the heat dissipation fin group.

8. The heat dissipation device according to claim 1, characterized in that: The temperature homogenizing plate comprises: A first shell, comprising a first plate portion and a first side wall protruding from an inner surface of the first plate portion, wherein the heat source is adapted to contact an outer surface of the first plate portion; a second shell, superimposed on the first shell, the second shell comprising a second plate portion, a plurality of support columns protruding from the second plate portion, and a second side wall protruding from the second plate portion and surrounding the plurality of support columns, wherein the first side wall is joined to the second side wall, and a plurality of steam channels are formed between the plurality of support columns; and The capillary structure is disposed between the first plate portion and the plurality of support columns of the second shell.

9. The heat dissipation device according to claim 8, characterized in that: The first shell includes a first capillary structure located on the inner surface of the first plate portion and surrounded by the first side wall. The capillary structure is a second capillary structure. The second capillary structure is disposed between the first capillary structure and the plurality of support columns of the second shell.

10. The heat dissipation device according to claim 9, characterized in that: The temperature homogenizing plate further comprises: The third capillary structure is disposed on the inner surface of the first plate portion in a region corresponding to the heat source.

11. The heat dissipation device according to claim 9, characterized in that: The first capillary structure includes a plurality of grooves, and at least a portion of the plurality of grooves are arranged radially.

12. The heat dissipation device according to claim 1, characterized in that: The temperature homogenizing plate comprises: A first housing comprises a first plate portion, a plurality of first protrusions protruding from an inner surface of the first plate portion, and a first side wall protruding from the inner surface and surrounding the plurality of first protrusions, wherein the heat source is adapted to contact an outer surface of the first plate portion; a first capillary structure disposed above the inner surface of the first plate portion and surrounding the plurality of first protrusions; and A second shell is superimposed on the first shell, the second shell includes a second plate portion, a plurality of second protrusions protruding from the second plate portion, and a second side wall protruding from the second plate portion and surrounding the plurality of second protrusions, wherein the first side wall is joined to the second side wall, a plurality of steam channels are formed between the plurality of second protrusions, the second plate portion includes a plurality of joining areas given way by the plurality of second protrusions, the plurality of first protrusions are joined to the plurality of joining areas, and the plurality of second protrusions are against the first capillary structure.

13. The heat dissipation device according to claim 12, characterized in that: The first shell includes a second capillary structure integrally protruding from the inner surface of the first plate portion, the second capillary structure includes a plurality of grooves formed between a plurality of convex strips to serve as a liquid channel, and the first capillary structure is disposed between the second capillary structure and the plurality of second protrusions of the second shell.

14. The heat dissipation device according to claim 12, characterized in that: The temperature vapor chamber further includes a third capillary structure filled in the plurality of grooves in areas corresponding to the heat sources, and the third capillary structure includes metal powder or non-woven metal velvet.

15. The heat dissipation device according to claim 12, characterized in that: The multiple second protrusions include multiple first support columns and multiple second support columns. The shapes of the multiple first support columns are different from the shapes of the multiple second support columns. The multiple first support columns are arranged at positions corresponding to the heat source, and the multiple second support columns are located beside the multiple first support columns and extend along the axial direction.

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