Ultrathin efficient heat dissipation vapor chamber and preparation method thereof

Abstract

The invention discloses an ultrathin efficient heat dissipation vapor chamber and a preparation method thereof, and belongs to the technical field of heat dissipation plates. The vapor chamber comprises an upper shell plate and a lower shell plate; the bolt or the bolt hole lower shell plate is bent downwards to be arc-shaped; the bolt or bolt hole upper shell plate is fixedly connected with the lower shell plate, and a vacuum cavity is formed between the bolt or bolt hole upper shell plate and the lower shell plate; the upper surface of the bolt or bolt hole upper shell plate is provided with a plurality of bolts or bolt holes used for being connected with target equipment. At least one supporting column is arranged on the lower surface of the bolt or bolt hole lower shell plate; and a heat transfer system is arranged in the bolt or bolt hole vacuum cavity. According to the ultrathin vapor chamber, rapid heat conduction is achieved through the bending radian of the lower shell plate, the connection mode of combination of the lower shell plate and the one-dimensional heat pipes and the phase change principle, the ultrathin vapor chamber can be applied to an electronic heat dissipation structure high in power consumption and small in size, especially mobile electronic equipment, local heat is rapidly dissipated, and the service life of the vapor chamber is prolonged. And the service life and the safety performance of related products are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation plates, and in particular to an ultra-thin high-efficiency heat dissipation vapor chamber and a preparation method thereof. Background Art

[0002] In the field of electronic products, as the heat flux density of electronic chips continues to rise and the available heat dissipation space gradually shrinks, ultra-thin heat dissipation technology has gradually become an ideal choice for solving heat dissipation problems. For example, the functions of modern mobile phones, PCs, tablets and other electronic devices are becoming more and more powerful, and the thermal power consumption of chips is also increasing. However, the internal structure of these devices is becoming more and more compact, and the heat dissipation space is becoming more and more limited. At the same time, the rapid development of electric vehicles has also brought new heat dissipation challenges. The internal lithium battery structure is very compact, and the gap between batteries is usually less than 1mm. Achieving effective heat dissipation in such a small space is a key issue in the development of electric vehicles. This solution is used to try to solve the problems of reduced life of electronic equipment and aging of hardware equipment.

[0003] Traditional flat-plate heat spreaders have some limitations in design, mainly in the structure and heat diffusion of the evaporation end. Since the evaporation end is usually a horizontal structure, the working fluid is mainly distributed on the liquid wick, while the outer part cannot effectively contact the heat source, resulting in low heat absorption efficiency. In addition, during the evaporation and heat dissipation process of the working fluid, the heat is mainly concentrated in the local area of ​​the evaporation end and will not diffuse to the surrounding area, which is easy to form hot spots and is not conducive to the heat dissipation of the entire system. This heat accumulation phenomenon will cause local temperatures to be too high, increase the thermal risk of electronic equipment, reduce the reliability and stability of the equipment, and limit the heat dissipation efficiency. When dealing with the heat dissipation needs of high heat flux density, traditional flat-plate heat spreaders may not dissipate heat in time, causing the temperature of the heat source to rise, affecting the performance and life of the electronic equipment.

[0004] Therefore, how to improve the heat transfer performance and temperature uniformity of the heat spreader is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0005] The present invention aims to solve one of the above-mentioned technical problems in the prior art at least to a certain extent.

[0006] To this end, one object of the present invention is to provide an ultra-thin and efficient heat dissipation vapor chamber.

[0007] From top to bottom, it includes an upper shell plate and a lower shell plate; the thickness of the heat spreader is in the range of 0.3 to 2 mm.

[0008] The lower shell plate is bent downward in an arc shape, and the curvature radius of the lower shell plate is designed to be 1 / 5 to 1 / 3 of the chip size; the upper shell plate and the lower shell plate are fixedly connected, and a vacuum chamber is provided between the upper shell plate and the lower shell plate;

[0009] The upper surface of the upper shell plate is provided with a plurality of bolts or bolt holes for connecting with the target equipment; at least one supporting column is provided in the lower vacuum chamber;

[0010] A heat transfer system is provided on the lower surface of the lower shell plate.

[0011] Further, the heat transfer system is composed of a plurality of one-dimensional heat pipes;

[0012] A plurality of the one-dimensional heat pipes are regularly arranged on the lower surface of the lower shell plate;

[0013] The vacuum chamber is in a vacuum state, and a plurality of the one-dimensional heat pipes are filled with liquid working medium.

[0014] Furthermore, a plurality of the one-dimensional heat pipes are fixed on the lower surface of the lower shell plate.

[0015] Furthermore, a fixing groove matching the one-dimensional heat pipe is provided on the lower surface of the lower shell plate, and each one-dimensional heat pipe works independently and is responsible for conducting heat from the heat source to the heat dissipation area.

[0016] Furthermore, the heat spreader is an "L"-shaped or "T"-shaped heat spreader.

[0017] Furthermore, the support column is composed of a support end and a liquid wick.

[0018] The present invention also provides a method for preparing the ultra-thin high-efficiency heat dissipation vapor chamber, comprising the following steps:

[0019] (1) Selecting an upper shell plate and a lower shell plate that meet the requirements, opening a groove corresponding to the one-dimensional heat pipe on the lower shell plate and laying the one-dimensional heat pipe to form a heat transfer system;

[0020] (2) using a sintering mold and copper powder to support a support column including a support end and a liquid wick by a one-time sintering method, processing a corresponding mounting groove on the lower shell plate, then installing the support column on the mounting groove, and then fixing the support column to the lower shell plate by welding;

[0021] (3) The upper shell plate and the lower shell plate are then packaged by laser welding, and then a liquid working medium is injected into the heat transfer system. At the same time, the vacuum chamber is evacuated and the port of the liquid injection pipe is sealed by argon arc welding to obtain the ultra-thin high-efficiency heat dissipation vapor chamber.

[0022] Furthermore, the liquid working medium is any one of deionized water, ethanol and refrigerant.

[0023] The beneficial effects of the present invention are as follows: the condensation reflux of the liquid working fluid in the heat spreader in the present invention will gather at the bend, where it fits closely with the chip of the electronic product. Since the chip is the main heat release source, more heat is gathered here, which is conducive to the evaporation of the working fluid, thereby improving the evaporation efficiency. After the working fluid absorbs heat at the evaporation end, most of it will directly condense and dissipate heat at the condensation end corresponding to the chip, rather than diffusing to the surroundings. At this time, the evenly distributed one-dimensional heat pipe can effectively conduct the heat gathered at the bend to the surroundings, thereby expanding the heat dissipation area and further improving the heat transfer efficiency of the heat spreader. This helps to ensure the stable operation of the chip in a high temperature environment.

[0024] The ultra-thin heat spreader of the present invention utilizes the curvature of the lower shell plate and the connection method combined with multiple one-dimensional heat pipes and the principle of phase change to achieve rapid heat conduction. It can be applied to electronic heat dissipation structures with high power consumption and small size, especially in mobile electronic devices (such as notebooks and mobile phones), to quickly dissipate local heat and improve the service life and safety performance of related products. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0026] Figure 1 The accompanying drawing is a schematic diagram of the structure of an ultra-thin high-efficiency heat dissipation vapor chamber provided by the present invention.

[0027] In the accompanying drawings, the structures represented by each reference numeral are listed as follows: 1-upper shell plate, 2-lower shell plate, 3-, 4-bolts, 5-bolt holes, 6-vacuum chamber, 7-heat transfer system, 8-liquid absorption core. DETAILED DESCRIPTION

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0029] In the description of the present invention, it is necessary to understand that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] Example 1

[0034] An ultra-thin and efficient heat dissipation vapor chamber.

[0035] From top to bottom, it includes an upper shell plate 1 and a lower shell plate 2; the thickness of the heat spreader is in the range of 0.3 to 2 mm.

[0036] The lower shell plate 2 is bent downward in an arc shape, and the curvature radius of the lower shell plate 2 is designed to be 1 / 5 to 1 / 3 of the chip size; the upper shell plate 1 and the lower shell plate 2 are fixedly connected, and a vacuum chamber 3 is provided between the upper shell plate 1 and the lower shell plate 2;

[0037] The upper surface of the upper shell plate 1 is provided with a plurality of bolts 4 or bolt holes 5 for connecting with the target equipment; at least one support column 6 is provided in the vacuum chamber 3;

[0038] A heat transfer system 7 is provided on the lower surface of the lower shell plate 2 .

[0039] In some embodiments, the heat transfer system is composed of a plurality of one-dimensional heat pipes;

[0040] A plurality of one-dimensional heat pipes are regularly arranged on the lower surface of the lower shell plate 2;

[0041] The vacuum chamber is in a vacuum state, and a plurality of one-dimensional heat pipes are filled with liquid working fluid.

[0042] In other embodiments, a plurality of one-dimensional heat pipes are fixed on the lower surface of the lower shell plate 2 .

[0043] In some embodiments, the lower surface of the lower shell plate 2 is provided with a fixed groove matching the one-dimensional heat pipe, and each one-dimensional heat pipe works independently and is responsible for conducting heat from the heat source to the heat dissipation area.

[0044] In some embodiments, the vapor chamber is an "L"-shaped or "T"-shaped vapor chamber.

[0045] In some embodiments, the support column is composed of a support end and a wick 8 .

[0046] Example 2 Preparation method of ultra-thin high-efficiency heat dissipation vapor chamber:

[0047] (1) Selecting an upper shell plate and a lower shell plate that meet the requirements, opening a groove corresponding to the one-dimensional heat pipe on the lower shell plate and laying the one-dimensional heat pipe to form a heat transfer system;

[0048] (2) using a sintering mold and copper powder to support a support column including a support end and a liquid wick by a one-time sintering method, processing a corresponding mounting groove on the lower shell plate, then installing the support column on the mounting groove, and then fixing the support column to the lower shell plate by welding;

[0049] (3) The upper shell plate and the lower shell plate are then packaged by laser welding, and then a liquid working medium is injected into the heat transfer system. At the same time, the vacuum chamber is evacuated and the port of the liquid injection pipe is sealed by argon arc welding to obtain the ultra-thin high-efficiency heat dissipation vapor chamber.

[0050] In the present invention, heat is first transferred to the liquid wick at the evaporation end through the lower shell of the vapor chamber. Since a certain vacuum is maintained inside the vapor chamber, the liquid in the liquid wick at the evaporation end can absorb heat and evaporate into steam at a relatively low temperature. Subsequently, the steam diffuses and fills the entire cavity of the vapor chamber under the pressure difference between the evaporation end and the condensation end.

[0051] The liquid working fluid is selected according to the usage scenario. It can be conventional deionized water or other liquid substances such as ethanol, refrigerant, etc., as long as the liquid working fluid can undergo phase change in the main channel and multiple one-dimensional heat pipes under its usage scenario.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0053] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An ultra-thin high-efficiency heat dissipation vapor chamber, characterized in that: From top to bottom, it includes the upper shell plate and the lower shell plate; Wherein, the lower shell plate is bent downward in an arc shape; the upper shell plate and the lower shell plate are fixedly connected, and a vacuum chamber is provided between the upper shell plate and the lower shell plate; The upper surface of the upper shell plate is provided with a plurality of bolts or bolt holes for connecting with the target equipment; at least one supporting column is provided in the vacuum chamber; A heat transfer system is provided on the lower surface of the lower shell plate.

2. The ultra-thin high-efficiency heat dissipation vapor chamber according to claim 1, characterized in that: The heat transfer system is composed of a number of one-dimensional heat pipes; A plurality of the one-dimensional heat pipes are regularly arranged on the lower surface of the lower shell plate; The vacuum chamber is in a vacuum state, and a plurality of the one-dimensional heat pipes are filled with liquid working medium.

3. The ultra-thin high-efficiency heat dissipation vapor chamber according to claim 2, characterized in that: A plurality of the one-dimensional heat pipes are fixed on the lower surface of the lower shell plate.

4. The ultra-thin high-efficiency heat dissipation vapor chamber according to claim 3, characterized in that: The lower surface of the lower shell plate is provided with a fixing groove matching the one-dimensional heat pipe, and each one-dimensional heat pipe works independently.

5. The ultra-thin high-efficiency heat dissipation vapor chamber according to claim 1, characterized in that: The heat spreader is an "L"-shaped or "T"-shaped heat spreader.

6. The ultra-thin high-efficiency heat dissipation vapor chamber according to claim 1, characterized in that: The support column consists of a support end and a liquid wick.

7. A method for preparing the ultra-thin high-efficiency heat dissipation vapor chamber according to any one of claims 1 to 6, characterized in that: The following steps are involved: (1) Selecting an upper shell plate and a lower shell plate that meet the requirements, opening a groove corresponding to the one-dimensional heat pipe on the lower shell plate and laying the one-dimensional heat pipe to form a heat transfer system; (2) using a sintering mold and copper powder to support a support column including a support end and a liquid wick by a one-time sintering method, processing a corresponding mounting groove on the lower shell plate, then installing the support column on the mounting groove, and then fixing the support column to the lower shell plate by welding; (3) The upper shell plate and the lower shell plate are then packaged by laser welding, and then a liquid working medium is injected into the heat transfer system. At the same time, the vacuum chamber is evacuated and the port of the liquid injection pipe is sealed by argon arc welding to obtain the ultra-thin high-efficiency heat dissipation vapor chamber.

8. A method for preparing an ultra-thin high-efficiency heat dissipation vapor chamber according to claim 7, characterized in that: The liquid working medium is any one of deionized water, ethanol and refrigerant.

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