Inverter heat dissipation system, inverter and AC socket

Abstract

The invention relates to the technical field of electronic manufacturing, and discloses an inverter heat dissipation system, an inverter and an AC socket, the inverter comprises an electric device arranged on an integrated board and the inverter heat dissipation system, a heat dissipation bottom substrate is fixed to the bottom of the integrated board of the inverter at intervals, and the heat dissipation bottom substrate and the integrated board are attached through the two faces of a heat conduction patch respectively; the heat conduction paster is used for covering the first electric device and the second electric device on the integrated board and conducting heat to the heat dissipation bottom substrate. Meanwhile, a heat dissipation top plate is added, the heat dissipation top plate and the heat dissipation bottom substrate are oppositely arranged for clamping the integrated board, the heat dissipation top plate is provided with abutting supporting feet, and the abutting supporting feet abut against the positions, corresponding to the first electric device and / or the second electric device, of the top face of the integrated board, so that the heat dissipation area can be increased, and heat dissipation is mainly conducted on the upper side and the lower side of a high-power heating part; the inverter can be effectively cooled, potential safety hazards caused by over-high temperature of the inverter are prevented, and the functional effect and the use safety of the AC socket are ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic manufacturing, and in particular to an inverter heat dissipation system, an inverter and an AC socket. Background Art

[0002] An AC (Alternating Current) socket is an electronic component used to connect an AC power source. It can transfer the voltage and current of the AC power source to electrical equipment, thereby realizing power supply and control of the electrical equipment. There are many types and specifications of AC sockets. According to their appearance, contact form, rating, installation method and other parameters, they can be divided into appliance sockets, wall-mounted sockets, desktop sockets, etc. Due to the rapid development of science and technology, the application scenarios of AC sockets have gradually become richer. It is necessary to add some additional functions or features according to different application scenarios and needs. In addition to the above common types, there are also some special AC sockets, such as explosion-proof sockets, waterproof sockets and lightning protection sockets, etc., and according to the installation location and space, choose the appropriate appearance and installation method to ensure the fixity and aesthetics of the socket.

[0003] In the prior art, an AC socket has an inverter. The inverter generates heat when it is working, and factors such as the temperature and humidity of the operating environment may cause the inverter temperature to be too high, thereby affecting the functional effect and safety of the AC socket.

[0004] Therefore, a reasonable heat dissipation structure needs to be set up to ensure the durability and safety of the inverter and AC socket. Summary of the invention

[0005] The object of the present invention is to provide an inverter heat dissipation system, an inverter and an AC socket, which can effectively dissipate heat from the inverter, prevent the inverter from overheating and causing safety hazards, and ensure the functional effect and safety of the AC socket.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] Inverter cooling system, including:

[0008] A heat dissipation base plate, wherein the heat dissipation base plate is fixed at intervals on the bottom of the integrated board of the inverter;

[0009] A thermally conductive patch, wherein two sides of the thermally conductive patch are respectively attached to the heat dissipation base substrate and the integrated board, and the thermally conductive patch is used to cover the first electrical device and the second electrical device on the integrated board;

[0010] A heat dissipation top plate, the heat dissipation top plate and the heat dissipation bottom plate are arranged opposite to each other for clamping the integrated board, the heat dissipation top plate is provided with abutment feet, the abutment feet abut against the position of the first electrical component and / or the second electrical component on the top surface of the integrated board.

[0011] As an optional technical solution for the inverter heat dissipation system, the inverter heat dissipation system further includes a first heat conductive member, which is clamped between the abutting leg and the integrated board, and the first heat conductive member abuts the abutting leg with an interference fit.

[0012] As an optional technical solution for the inverter heat dissipation system, the inverter heat dissipation system also includes an adjusting member, both ends of which are movably connected to the heat dissipation bottom substrate and the heat dissipation top plate, respectively, and the adjusting member is used to adjust the relative distance between the heat dissipation bottom substrate and the heat dissipation top plate.

[0013] As an optional technical solution for the inverter cooling system, the inverter cooling system also includes a cooling fan, a cooling channel is formed between the cooling bottom substrate and the cooling top plate, the side of the cooling bottom substrate is bent upward to form an installation flange, an air inlet is provided on the installation flange, the air inlet is connected to the cooling channel, and the cooling fan is arranged on the installation flange facing the air inlet.

[0014] As an optional technical solution for the inverter cooling system, a temperature measuring device is provided on the heat dissipation base substrate, and the temperature measuring device is used to measure the temperature of the heat dissipation base substrate. The temperature measuring device is communicatively connected to the cooling fan, and the rotation speed of the cooling fan is positively correlated with the temperature of the heat dissipation base substrate.

[0015] As an optional technical solution for the inverter heat dissipation system, the inverter heat dissipation system also includes a second heat conductor, one side of the second heat conductor is attached to the position corresponding to the third electrical component on the bottom surface of the integrated board, and the other side of the second heat conductor is attached to the thermal conductive patch.

[0016] As an optional technical solution for the inverter heat dissipation system, the rear edge of the heat dissipation bottom substrate is bent upward to form a hanging flange, and the hanging flange is used to fix the fourth electrical component on the inverter vertically connected to the integrated board.

[0017] As an optional technical solution for the inverter heat dissipation system, the inverter heat dissipation system further includes a heat dissipation side plate, and the heat dissipation side plate is arranged opposite to the hanging flange and is used to clamp the fourth electrical device.

[0018] An inverter comprises an integrated board, a first electrical component, a second electrical component, a third electrical component, a fourth electrical component and an inverter cooling system as described in any one of the above items, wherein the first electrical component, the second electrical component, the third electrical component and the fourth electrical component are all arranged on the integrated board, and the integrated board is arranged in a cooling channel of the inverter cooling system.

[0019] An AC socket comprises a socket shell and the inverter described above, wherein the socket shell is provided with honeycomb heat dissipation holes, and the honeycomb heat dissipation holes are communicated with the heat dissipation channel.

[0020] Beneficial effects of the present invention:

[0021] The inverter heat dissipation system provided by the present invention includes a heat dissipation bottom substrate, a thermal conductive patch and a heat dissipation top plate. The heat dissipation bottom substrate is fixed at intervals on the bottom of the integrated board of the inverter, and is respectively attached to the heat dissipation bottom substrate and the integrated board through the two sides of the thermal conductive patch. The thermal conductive patch is used to cover the first electrical component and the second electrical component on the integrated board and conduct heat to the heat dissipation bottom substrate. At the same time, a heat dissipation top plate is added. The heat dissipation top plate and the heat dissipation bottom substrate are arranged relative to each other for clamping the integrated board. The heat dissipation top plate is provided with abutting legs, and the abutting legs abut against the positions of the first electrical component and / or the second electrical component on the top surface of the integrated board, so as to increase the heat dissipation area, and focus on heat dissipation of high-power heat-generating parts on the upper and lower sides.

[0022] The inverter provided by the present invention includes an integrated board, a first electrical component, a second electrical component, a third electrical component, a fourth electrical component and the above-mentioned inverter heat dissipation system. The first electrical component, the second electrical component, the third electrical component and the fourth electrical component are all arranged on the integrated board, and the integrated board is arranged in the heat dissipation channel of the inverter heat dissipation system, which can effectively dissipate the heat of the inverter and prevent the inverter temperature from being too high to cause safety hazards.

[0023] The AC socket provided by the present invention includes a socket shell and the above-mentioned inverter. The socket shell is provided with honeycomb heat dissipation holes, which are connected to the heat dissipation channel, so as to better exchange and circulate the heat dissipated by conduction with the external normal temperature air, thereby avoiding affecting the functional effect and safety of the AC socket. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is an exploded diagram of an inverter heat dissipation system provided in a specific embodiment of the present invention;

[0025] Figure 2 It is a structural schematic diagram of an inverter heat dissipation system provided in a specific embodiment of the present invention;

[0026] Figure 3 It is a partial structural schematic diagram of an inverter heat dissipation system provided in a specific embodiment of the present invention;

[0027] Figure 4 It is a schematic diagram of the structure of an AC socket provided in a specific embodiment of the present invention.

[0028] In the figure:

[0029] 11. heat dissipation bottom substrate; 111. installation flange; 112. air inlet; 113. hanging flange; 12. thermal conductive patch; 13. heat dissipation top plate; 131. abutting legs; 14. first heat conducting member; 15. adjusting member; 16. heat dissipation fan; 17. second heat conducting member; 18. heat dissipation side plate;

[0030] 20. Inverter; 21. Integrated board; 22. First electrical component; 23. Second electrical component; 24. Third electrical component; 25. Fourth electrical component;

[0031] 30. Socket housing; 31. Honeycomb heat dissipation holes. DETAILED DESCRIPTION

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] In the description of this embodiment, the terms "upper", "lower", "right", "left" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0036] like Figures 1 to 3 As shown in , the present invention discloses an inverter heat dissipation system and an inverter 20. The inverter 20 provided by the present invention includes an integrated board 21, a first electrical device 22, a second electrical device 23, a third electrical device 24, a fourth electrical device 25 and an inverter heat dissipation system. The first electrical device 22, the second electrical device 23, the third electrical device 24 and the fourth electrical device 25 are all arranged on the integrated board 21, and the integrated board 21 is arranged in the heat dissipation channel of the inverter heat dissipation system, which can effectively dissipate the heat of the inverter 20 and prevent the inverter 20 from being overheated to cause safety hazards. In this embodiment, the first electrical device 22 is specifically a silicon carbide diode in the inverter circuit, the second electrical device 23 is specifically a field effect MOS tube, the third electrical device 24 is specifically an isolation transformer, and the fourth electrical device 25 is specifically an IGBT. The first electrical device 22, the second electrical device 23, the third electrical device 24, and the fourth electrical device 25 are all important components of the inverter 20. Continuous operation will generate a certain amount of heat. If the heat is not evacuated and cooled in time, it is very likely to affect the service life and safety of the inverter 20. Therefore, a highly matched inverter heat dissipation system is set accordingly to be suitable for the heat dissipation maintenance of the inverter 20.

[0037] Specifically, the inverter heat dissipation system includes a heat dissipation bottom substrate 11, a thermally conductive patch 12 and a heat dissipation top plate 13. The heat dissipation bottom substrate 11 is fixed at intervals on the bottom of the integrated board 21 of the inverter 20, and is respectively attached to the heat dissipation bottom substrate 11 and the integrated board 21 through the two sides of the thermally conductive patch 12. The thermally conductive patch 12 is used to cover the first electrical component 22 and the second electrical component 23 on the integrated board 21 and conduct heat to the heat dissipation bottom substrate 11; at the same time, a heat dissipation top plate 13 is added, and the heat dissipation top plate 13 is arranged relative to the heat dissipation bottom substrate 11 for clamping the integrated board 21. The heat dissipation top plate 13 is provided with abutting legs 131, and the abutting legs 131 are abutted against the positions of the first electrical component 22 and the second electrical component 23 and other electrical components on the top surface of the integrated board 21, which can increase the heat dissipation area, and focus on heat dissipation of high-power heat-generating parts on the upper and lower sides. The abutting legs 131 are attached to the backs of the first electrical component 22 and the second electrical component 23, which can avoid failure of the heat dissipation structure and ensure the heat dissipation effect.

[0038] Furthermore, the inverter cooling system also includes a first heat conductor 14, which is clamped between the abutment leg 131 and the integrated board 21. The first heat conductor 14 and the abutment leg 131 are abutted by interference fit, which can more tightly press the inverter cooling system against the high-power heating part to avoid looseness during use and cause heat dissipation abnormalities.

[0039] It is understandable that the inverter heat dissipation system also includes an adjustment member 15, which passes through and is fixed to the integrated board 21, and the two ends of the adjustment member 15 are respectively movably connected to the heat dissipation bottom substrate 11 and the heat dissipation top plate 13, and is used to adjust the relative distance between the heat dissipation bottom substrate 11 and the heat dissipation top plate 13, and the relative installation position of the heat dissipation bottom substrate 11 and the heat dissipation top plate 13 can be flexibly adjusted according to actual conditions, thereby expanding the scope of application and assembly convenience of the inverter heat dissipation system. For example, the adjustment member 15 adopts a single-pass copper stud, which has a stable structure, is easy to adjust, and has a long service life.

[0040] Furthermore, in order to adapt to the attachment position of the thermally conductive patch 12 and to effectively conduct heat to other electrical components that require heat dissipation, the inverter heat dissipation system also includes a second thermally conductive member 17. One side of the second thermally conductive member 17 is attached to the position of the third electrical component 24 on the bottom surface of the integrated board 21, and the other side of the second thermally conductive member 17 is attached to the thermally conductive patch 12 to facilitate heat dissipation of the third electrical component 24, thereby solving the defect that a single thermally conductive patch 12 cannot fully take care of all electrical components that require heat dissipation due to issues such as position, distance and thickness.

[0041] In this embodiment, the inverter heat dissipation system also includes a heat dissipation fan 16, and a heat dissipation channel is formed between the heat dissipation bottom substrate 11 and the heat dissipation top plate 13. The side of the heat dissipation bottom substrate 11 is bent upward to form an installation flange 111. An air inlet 112 is provided on the installation flange 111, and the air inlet 112 is connected to the heat dissipation channel. The heat dissipation fan 16 is arranged on the installation flange 111 opposite the air inlet 112. By adding a side-blowing heat dissipation fan 16, the wind blown out passes through the integrated board 21 and the electrical components thereon, which can effectively take away the heat in the inverter 20, and timely cool the heat dissipation bottom substrate 11 and the heat dissipation top plate 13, thereby improving the heat dissipation effect of the inverter heat dissipation system.

[0042] Exemplarily, a temperature measuring device is provided on the heat dissipation base substrate 11, and the temperature measuring device is used to measure the temperature of the heat dissipation base substrate 11. The heat dissipation fan 16 is a PWM (Pulse Width Modulation) speed-regulating fan. The temperature measuring device is communicated with the PWM speed-regulating fan, and the speed of the PWM speed-regulating fan is adjusted according to the temperature measured by the temperature measuring device. The speed of the PWM speed-regulating fan is positively correlated with the temperature of the heat dissipation base substrate 11, which can accelerate the heat exchange rate between the inverter heat dissipation system and the outside world, reduce the time to reach a thermal steady state, and improve the heat dissipation efficiency of the inverter heat dissipation system.

[0043] In this embodiment, the rear edge of the heat dissipation bottom substrate 11 is bent upward to form a hanging flange 113, which is used to fix the fourth electrical component 25 vertically connected to the integrated board 21 on the inverter 20, and helps to dissipate heat from the fourth electrical component 25. In order to achieve a better heat dissipation effect, the inverter heat dissipation system also includes a heat dissipation side plate 18, which is arranged opposite to the hanging flange 113 to clamp the fourth electrical component 25, and can dissipate heat more evenly and quickly in two directions. A third heat conductive member can also be inserted into the gap between the two, and the third heat conductive member is sleeved on the fourth electrical component 25 to dissipate heat for the fourth electrical component 25, further ensuring a stable heat conduction effect.

[0044] The thermally conductive patch 12 , the first thermally conductive member 14 , the second thermally conductive member 17 and the third thermally conductive member in the above embodiment are all high-voltage insulating silicone pads, which have thermal stability and good insulation effect, can quickly absorb heat, and do not affect the operation of the inverter 20 .

[0045] like Figures 1 to 4 As shown, the present invention further discloses an AC socket including a socket shell 30 and the inverter 20 described above, wherein the socket shell 30 is provided with honeycomb heat dissipation holes 31, and the honeycomb heat dissipation holes 31 are connected to the heat dissipation channel, so as to better exchange and circulate the heat dissipated by conduction with the external normal temperature air, thereby avoiding affecting the functional effect and use safety of the AC socket.

[0046] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. The inverter cooling system is characterized by: include: A heat dissipation base plate (11), wherein the heat dissipation base plate (11) is fixed at intervals on the bottom of the integrated board (21) of the inverter; A thermally conductive patch (12), wherein two surfaces of the thermally conductive patch (12) are respectively attached to the heat dissipation base substrate (11) and the integrated board (21), and the thermally conductive patch (12) is used to cover a first electrical device (22) and a second electrical device (23) on the integrated board (21); A heat dissipation top plate (13), the heat dissipation top plate (13) and the heat dissipation bottom plate (11) being arranged opposite to each other and used for clamping the integrated board (21), the heat dissipation top plate (13) being provided with abutment legs (131), the abutment legs (131) abutting against the top surface of the integrated board (21) at positions corresponding to the first electrical component (22) and / or the second electrical component (23).

2. The inverter heat dissipation system according to claim 1, characterized in that: The inverter heat dissipation system further comprises a first heat conducting member (14), wherein the first heat conducting member (14) is sandwiched between the abutting leg (131) and the integrated board (21), and the first heat conducting member (14) abuts against the abutting leg (131) in an interference fit.

3. The inverter heat dissipation system according to claim 2, characterized in that: The inverter heat dissipation system further comprises an adjusting member (15), the two ends of which are respectively movably connected to the heat dissipation bottom substrate (11) and the heat dissipation top plate (13), and the adjusting member (15) is used to adjust the relative distance between the heat dissipation bottom substrate (11) and the heat dissipation top plate (13).

4. The inverter heat dissipation system according to claim 1, characterized in that: The inverter heat dissipation system also includes a heat dissipation fan (16); a heat dissipation channel is formed between the heat dissipation bottom substrate (11) and the heat dissipation top plate (13); the side edge of the heat dissipation bottom substrate (11) is bent upward to form a mounting flange (111); an air inlet (112) is provided on the mounting flange (111); the air inlet (112) is connected to the heat dissipation channel; and the heat dissipation fan (16) is arranged on the mounting flange (111) facing the air inlet (112).

5. The inverter heat dissipation system according to claim 4, characterized in that: A temperature measuring component is provided on the heat dissipation base substrate (11), and the temperature measuring component is used to measure the temperature of the heat dissipation base substrate (11). The temperature measuring component is communicatively connected with the heat dissipation fan (16), and the rotation speed of the heat dissipation fan (16) is positively correlated with the temperature of the heat dissipation base substrate (11).

6. The inverter heat dissipation system according to claim 1, characterized in that: The inverter heat dissipation system also includes a second heat-conducting member (17), one side of the second heat-conducting member (17) is in contact with a position corresponding to a third electrical device (24) on the bottom surface of the integrated board (21), and the other side of the second heat-conducting member (17) is in contact with the heat-conducting patch (12).

7. The inverter heat dissipation system according to claim 1, characterized in that: The rear edge of the heat dissipation bottom substrate (11) is bent upward to form a hanging flange (113), and the hanging flange (113) is used to fix the fourth electrical component (25) on the inverter that is vertically connected to the integrated board (21).

8. The inverter heat dissipation system according to claim 7, characterized in that: The inverter heat dissipation system also includes a heat dissipation side plate (18), and the heat dissipation side plate (18) is arranged opposite to the hanging flange (113) and is used to clamp the fourth electrical device (25).

9. An inverter, characterized in that The invention comprises an integrated board (21), a first electrical device (22), a second electrical device (23), a third electrical device (24), a fourth electrical device (25), and an inverter heat dissipation system as claimed in any one of claims 1 to 8, wherein the first electrical device (22), the second electrical device (23), the third electrical device (24), and the fourth electrical device (25) are all arranged on the integrated board (21), and the integrated board (21) is arranged in a heat dissipation channel of the inverter heat dissipation system. 10.AC socket, characterized in that, It comprises a socket housing (30) and the inverter according to claim 9, wherein the socket housing (30) is provided with honeycomb heat dissipation holes (31), and the honeycomb heat dissipation holes (31) are connected to the heat dissipation channel.

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