Heat dissipation unit and power device

Abstract

The embodiment of the invention provides a heat dissipation unit and a power device, the heat dissipation unit comprises a heat conduction body and N installation parts, the installation parts are arranged on the outer surface of the heat conduction body, and the installation parts are used for installing a power unit; one or more heat dissipation channels are arranged in the heat conduction body and penetrate from one end of the heat conduction body to the other end of the heat conduction body, and opening ends are formed at the two ends of the heat conduction body respectively. The power device comprises a heat dissipation unit and a power unit, the power unit comprises N power subunits, and each mounting part of the heat dissipation unit is provided with one power subunit; the power subunit comprises a power circuit, and the power circuit is arranged on the mounting part; or the power subunit comprises a substrate and a power circuit arranged on the substrate, and the substrate is arranged on the mounting part. The embodiment of the invention solves the technical problem of how to dissipate heat of the power unit.

Description

Technical Field

[0001] The present invention relates to the field of electronics, and in particular to a heat dissipation unit and a power device. Background Art

[0002] The application scope of power units is very wide, such as the automotive field, home appliance field, aerospace field, etc.

[0003] Existing power units are usually not equipped with heat dissipation units. When the temperature of the power unit is too high, a temperature protection circuit is generally used to reduce the current flowing through the power unit to achieve the purpose of cooling. This method will affect the normal operation of the power unit. Summary of the invention

[0004] A heat dissipation unit and a power device provided in the embodiments of the present invention solve the technical problem of how to dissipate heat from a power unit.

[0005] To solve the above technical problems, an embodiment of the present invention provides a heat dissipation unit, comprising a heat-conducting body and N mounting portions, N being greater than or equal to 1, wherein the mounting portion is arranged on the outer surface of the heat-conducting body, and the mounting portion is used to install a power unit; the heat-conducting body has one or more heat dissipation channels inside, and the heat dissipation channels extend from one end of the heat-conducting body to the other end of the heat-conducting body, and open ends are formed at the two ends respectively.

[0006] To solve the above technical problems, an embodiment of the present invention further provides a power device, comprising the above-mentioned heat dissipation unit, and also comprising a power unit, wherein the power unit comprises N power sub-units, and one of the power sub-units is arranged on each mounting part of the heat dissipation unit; the power sub-unit comprises a power circuit, and the power circuit is arranged on the mounting part; or the power sub-unit comprises a substrate and a power circuit arranged on the substrate, and the substrate is arranged on the mounting part.

[0007] Beneficial Effects

[0008] The heat dissipation unit and power device provided in the embodiments of the present invention set the power unit on the heat dissipation unit, directly dissipate the heat from the power unit, and vertically conduct the heat to the heat dissipation unit. Through the ingenious structural design of the heat dissipation unit, the overall structure is simple, the cost is low, the heat dissipation efficiency is high, and the normal operation of the power unit is not affected.

[0009] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects become obvious from the description in the specification of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A schematic diagram of a heat dissipation unit provided in Embodiment 1 of the present invention;

[0011] Figure 2 for Figure 1 A schematic diagram of a heat dissipation channel of the heat dissipation unit shown;

[0012] Figure 3 A schematic diagram of another heat dissipation unit provided in Embodiment 1 of the present invention;

[0013] Figure 4 A schematic diagram of a power device provided in Embodiment 2 of the present invention;

[0014] Figure 5 A schematic diagram of another power device provided in Embodiment 2 of the present invention;

[0015] Figure 6 A schematic diagram of a power module provided in Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the following is a further detailed description of the embodiments of the present invention through specific implementation methods combined with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0017] Embodiment 1:

[0018] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. An embodiment of the present invention provides a heat dissipation unit, which includes a heat-conducting body and N mounting portions, N being greater than or equal to 1, wherein the mounting portion is arranged on the outer surface of the heat-conducting body, and the mounting portion is used to mount the power unit; the heat-conducting body has one or more heat dissipation channels inside, and the heat dissipation channels run through one end of the heat-conducting body to the other end of the heat-conducting body, and open ends are formed at the two ends respectively.

[0019] In some embodiments, the heat dissipation unit further includes a connector, which is disposed at the open end and is used to connect to an external heat dissipation system. The connector can be made of a thermally conductive material.

[0020] In some embodiments, the connector includes a hollow column connector with two ends open, one end of the column connector butting against the open end, and the other end having a connecting portion for connecting to an external channel, and connecting to an external heat dissipation system through the external channel. The connecting portion includes at least one of an internal thread, an external thread, a buckle, a slot, and a clamp.

[0021] In some embodiments, the connecting piece is one of an internal thread, an external thread, a buckle, a slot, and a clamp, and is arranged at the open end for connecting to an external cooling system. It has a simple structure, reduces the number of parts and assembly steps, and reduces costs.

[0022] In some embodiments, the heat-conducting body may have one heat dissipation channel or multiple heat dissipation channels inside. In order to expand the heat dissipation area and make the heat dissipation more uniform, a honeycomb or spiral heat dissipation channel may be provided. The heat dissipation channel may be provided in the central area inside the heat-conducting body, or may be provided inside the heat-conducting body and at a position corresponding to the mounting portion, so that the heat dissipation effect is better.

[0023] In some embodiments, the heat dissipation channel includes heat dissipation holes, heat sinks, heat dissipation plates, devices made of phase change materials, etc., which are arranged inside the heat-conducting body to achieve the effect of heat dissipation. Among them, phase change materials, thermal paste, coolant, etc. can be poured into the heat dissipation holes for heat dissipation. The coolant includes but is not limited to 50% ethylene glycol aqueous solution, which has a freezing point of -40°C and a boiling point of 110°C, taking into account both antifreeze and heat conduction effects, and the thermal conductivity coefficient is about 0.4W / m·K. It can also be connected to an external heat dissipation system through a connector, such as a water cooling system or an air cooling system. The water cooling system can pour water into the heat dissipation holes, and the air cooling system can pour air into the heat dissipation holes to further accelerate heat dissipation. The heat dissipation channel can be processed using metal 3D printing (such as SLM technology). A spiral water-cooled heat dissipation channel or a honeycomb air-cooled heat dissipation channel can be set to dissipate heat through natural convection or forced air cooling. The water-cooled heat dissipation channel can be used in high-power scenarios, such as electric vehicle inverters, and the air-cooled heat dissipation channel can be used in medium and low-power scenarios, such as industrial and automotive motor drives.

[0024] In some embodiments, the cross-sectional shape of the heat dissipation through hole can be circular, semicircular, square, polygonal, etc. In some embodiments, in order to accelerate heat dissipation and dissipate heat more evenly, the interior of the heat conductive body has a plurality of heat dissipation through holes, the hole diameter is 0.5 mm to 1 mm, and the external water cooling system is connected through a connector, and the water flow rate is 0.8 m / s to 1.2 m / s.

[0025] In some embodiments, the mounting portion is an insulating portion, or the heat dissipation unit further includes an insulating portion, the insulating portion is disposed on the mounting portion, and the power unit is mounted on the insulating portion. If the heat-conducting body is made of a conductive material, the insulating portion can serve as an insulator between the power unit and the heat-conducting body, for example, the heat-conducting body is made of a copper material. The insulating portion can be an insulating heat-conducting portion.

[0026] In some embodiments, N mounting portions are symmetrically arranged on the outer surface of the heat-conducting body. Since the mounting portions are used to install power units, symmetrically arranging the power units on the outer surface of the heat-conducting body is conducive to uniform heat dissipation.

[0027] In some embodiments, the heat-conducting body has two ends and a side wall portion located between the two ends. Each mounting portion is arranged on the outer surface of the side wall portion of the heat-conducting body. The heat dissipation channel runs through one end of the heat-conducting body to the other end of the heat-conducting body, and open ends are formed at the two end portions respectively.

[0028] In some embodiments, the heat-conducting body is a column or a polyhedron, which abandons the redundant structure of the traditional heat sink and directly utilizes the geometric symmetry and inner cavity space of the column or polyhedron to achieve efficient heat dissipation and reduce costs.

[0029] In some embodiments, the heat-conducting body is one of a cylinder, a triangular prism, a quadrangular prism, a pentagonal prism, and a hexagonal prism.

[0030] In some embodiments, the mounting portion is a plane, which is conducive to the installation of the power unit.

[0031] In some embodiments, at least two of the mounting portion, the connecting member, and the heat-conducting body are integrally formed structures.

[0032] In some embodiments, the outer surface of the heat-conducting body has N planes, and the planes serve as mounting portions; or the outer surface of the heat-conducting body is surrounded by M planes, M is greater than or equal to N, and N of the M planes serve as mounting portions respectively.

[0033] In some embodiments, the heat-conducting body has an internal thread or an external thread, and the internal thread or the external thread is disposed at the open end to serve as a connecting piece.

[0034] In some embodiments, the heat-conducting body, the mounting portion and / or the connecting member are made of a high thermal conductivity material.

[0035] In some embodiments, a thermal conductive coating may be disposed on an outer surface of the thermally conductive body and / or an outer surface of the mounting portion.

[0036] In some embodiments, a fin structure may be further provided on the outer surface of the heat-conducting body to increase the surface area and improve the heat dissipation effect.

[0037] Reference below Figure 1 , is a schematic diagram of a heat dissipation unit provided in Embodiment 1 of the present invention, the heat dissipation unit comprises a heat-conducting body 41, three mounting portions 412 (only two are shown in the figure) and two connecting members 43, and the heat-conducting body 41 and the three mounting portions 412 are an integrally formed structure;

[0038] The heat-conducting body 41 is made of metal material, and is a triangular prism. The mounting portion 412 is a plane. The heat-conducting body 41 has two ends 411 (only one is shown in the figure), and a side wall portion located between the two ends 411. The side wall portion includes three side walls. The outer surface of the heat-conducting body 41 is surrounded by five planes, wherein the outer surfaces of the two ends 411 are respectively a plane, and the outer surfaces of the three side walls are respectively a plane, and the outer surfaces of the three side walls are respectively a mounting portion 412.

[0039] refer to Figure 2 The heat conducting body 41 has a plurality of heat dissipation holes 413 arranged in a straight line and in parallel inside, forming a honeycomb shape. Each heat dissipation hole 413 runs from one end 411 of the heat conducting body 41 to the other end 411 (not shown in the figure) of the heat conducting body 41, and an opening end 413a is formed at the two ends 411. The cross-sectional shape of the heat dissipation hole 413 is circular, and the hole diameter is 0.8 mm.

[0040] The materials, structures, and settings of the two connectors 43 are the same. Taking one of the connectors 43 as an example, the connector 43 is made of metal material. The connector 13 includes a hollow column connector with two ends open. One end of the column connector is set at one end 411 of the heat-conducting body 41 by welding, and is adapted to the position of the open end 413a formed by the heat dissipation through hole 413 at the end 411, and docked with the open end 413a. The other end has a connecting portion 43a for connecting to an external channel, and is connected to an external heat dissipation system through the external channel. In this embodiment, the connecting portion 43a is an external thread, which is used to connect to an external water pipe with an internal thread, and is connected to an external water cooling system through the water pipe; of course, in other embodiments, the materials, structures, and settings of the two connectors 43 may also be different. In other embodiments, the two connectors 43 may also be an integrally formed structure with the heat-conducting body 41.

[0041] The three mounting parts 412 are used to install the power unit, and the power unit may include three power sub-units. One power sub-unit is arranged on each of the three mounting parts 412. Since the three mounting parts 412 are symmetrically arranged on the outer surface of the heat-conducting body 41, the three power sub-units are also symmetrically arranged on the outer surface of the heat-conducting body 41. The symmetrical arrangement is conducive to uniform heat dissipation.

[0042] In this embodiment, a water pipe is connected via a connector 43 and then connected to an external water cooling system. The water cooling system can inject water into the heat dissipation through hole 413 to further accelerate heat dissipation through water circulation.

[0043] Reference below Figure 3 , is a schematic diagram of another heat dissipation unit provided in Embodiment 1 of the present invention, the heat dissipation unit comprises a heat conducting body 51, three mounting portions 512a and two connecting members 53, and Figure 1The heat dissipation unit shown is different in that the three mounting portions 512a, the two connecting pieces 53 and the heat-conducting body 51 are an integrally formed structure; the heat-conducting body 51 is a cylinder, and the heat-conducting body 51 has two ends 511 (only one is shown in the figure), and a side wall portion 512 located between the two ends 511, and the outer surface of the side wall portion 512 has 6 planes, which are symmetrically arranged on the outer surface of the side wall portion 512, and three of the symmetrically arranged planes are selected as the mounting portions 512a respectively; the heat-conducting body 51 has a linear heat dissipation through hole 513 inside, and the heat dissipation through hole 513 runs from one end 511 of the heat-conducting body 51 to the other end 511 of the heat-conducting body 51, and open ends 513a are formed at the two ends 511 respectively. The cross-sectional shape of the heat dissipation through hole 513 is circular, the two connecting pieces 53 and the heat-conducting body 51 are an integrally formed structure, and the connecting portions 43a of the two connecting pieces 53 are internal threads, which are used to connect to the water pipes with external threads on the outside, and are connected to the external water cooling system through the water pipes.

[0044] The heat dissipation unit provided in the embodiment of the present invention is provided with an installation portion and a heat dissipation channel. The installation portion is used to install the power unit, and the power unit can dissipate heat through the heat dissipation channel inside the heat dissipation unit. The overall structure is simple, the cost is low, the heat dissipation efficiency is high, and it does not affect the normal operation of the power unit.

[0045] Embodiment 2:

[0046] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. An embodiment of the present invention provides a power device, which includes the heat dissipation unit provided in embodiment 1, and also includes a power unit, wherein the power unit includes N power sub-units, and a power sub-unit is arranged on each mounting portion of the heat dissipation unit. The power sub-unit includes a power circuit, which is arranged on the mounting portion; or the power sub-unit includes a substrate and a power circuit arranged on the substrate, and the substrate is arranged on the mounting portion.

[0047] In some embodiments, the power unit may include a power sub-unit. For example, the power unit is a half-bridge power unit, including a power sub-unit. The power circuit in the power sub-unit is a half-bridge circuit.

[0048] In some embodiments, the power unit may also include two power sub-units. For example, the power unit is an H-bridge power unit, including two power sub-units. The power circuits in the two power sub-units constitute an H-bridge circuit (H-Bridge Circuit), wherein the power circuit in each power sub-unit can be a half-bridge circuit, and the two half-bridge circuits constitute an H-bridge circuit.

[0049] In some embodiments, the power unit may also include three power sub-units. For example, the power sub-unit is a three-phase full-bridge power unit, including three power sub-units. The power circuits in the three power sub-units constitute a three-phase full-bridge circuit (Three-Phase Full-Bridge Circuit), wherein the power circuit in each power sub-unit can be a single-phase circuit, such as a half-bridge circuit, and three single-phase circuits constitute a three-phase full-bridge circuit.

[0050] Each power subunit is arranged on a mounting portion, which fully utilizes the mounting space and is conducive to dispersed heat dissipation.

[0051] The power circuit can be directly arranged on the mounting part, and the mounting part can be an insulating mounting part. The power circuit can also be arranged on the mounting part with the help of a substrate, and the thickness of the substrate can be 0.1 mm to 10 mm, and the substrate can be arranged on the mounting part by welding. The substrate can be an insulating substrate, such as a ceramic substrate, preferably an insulating thermally conductive substrate, which can be arranged according to actual needs.

[0052] The power circuit has a current output terminal, a current input terminal and a control terminal, and may also have a detection terminal. The substrate may be provided with a current output pin, a current input pin, a control pin, and may also be provided with a detection pin, the current output pin pair is internally connected to the current output terminal of the power circuit and externally connected to the current output circuit, the current input pin pair is internally connected to the current input terminal of the power circuit and externally connected to the current input circuit, the control pin pair is internally connected to the control terminal of the power circuit and externally connected to the drive circuit, and the detection pin pair is internally connected to the detection terminal of the power circuit, such as a temperature monitoring circuit, and externally connected to the detection circuit.

[0053] In some embodiments, the power circuit includes at least a power module, a power electronic device and / or a power chip, and the power module is provided with a power electronic device and / or a power chip. The power circuit is used to realize the preset function, and the power circuit may also include other auxiliary electronic devices and auxiliary circuits, other auxiliary electronic devices such as resistors, etc., and auxiliary circuits such as control circuits, etc. Power electronic devices include but are not limited to power semiconductor devices, such as MOS tubes, thyristor transistors, insulated gate bipolar transistors (Insulate-Gate Bipolar Transistor, IGBT), etc., and MOS tubes include but are not limited to silicon carbide MOS tubes. The power module, power electronic devices, and other auxiliary electronic devices in the power circuit can be set on the mounting part or substrate by welding, and welding includes but is not limited to surface mounting technology (SMT). The power chip can be set on the mounting part or substrate by solid crystal, and the routing in the power circuit can be made on the mounting part or substrate by photolithography, etching, electroplating, printing, etc.

[0054] In some embodiments, the power circuit may further include a temperature monitoring circuit, which is connected to an external heat dissipation system. The temperature monitoring circuit sends a monitoring signal to the external heat dissipation system, and the external heat dissipation system controls the heat dissipation effect, for example, a water cooling system controls the flow rate of water flowing to the heat dissipation through hole, and an air cooling system controls the wind speed.

[0055] In some embodiments, the power unit includes three power sub-units, and the power circuits in the three power sub-units form a three-phase full-bridge circuit.

[0056] In some embodiments, the power device further includes a housing, which is sleeved outside the heat dissipation unit and the power unit. The housing plays a role in protecting the power unit and the heat dissipation unit. The housing may be a heat-conducting housing. A circular housing may be used to improve vibration resistance.

[0057] In some embodiments, the power device further includes a filling unit, which is filled between the housing and the power unit and the heat dissipation unit. The filling module is in the gap between the housing and the power unit and the heat dissipation unit to improve shock resistance and waterproofness. The filling unit can be obtained by filling with a thermal conductive material.

[0058] refer to Figure 4 The power device shown in FIG. 1 includes a heat sink unit. Figure 1 Taking the heat dissipation unit shown as an example, the power unit includes three power subunits 61 (only two power subunits 61 are shown in the figure), and the power circuits in the three power subunits 61 constitute a three-phase full-bridge circuit. The power subunit 61 includes a substrate 611 and a power circuit (not shown in the figure) arranged on the substrate. The substrate 611 is arranged on the mounting portion 412, and each power subunit 61 is arranged on a mounting portion 412 respectively, and is symmetrically arranged on the outer surface of the heat-conducting body 41. The substrate 611 faces the two ends of the connecting member 43, one end of which is provided with a current output pin 611a, which is connected to the current output end of the power circuit internally and connected to the current output circuit externally, and the other end is provided with a current input pin 611b, a control pin 611c, and a detection pin 611d. The current input pin 611b is connected to the current input end of the power circuit internally and connected to the current input circuit externally, the control pin 611c is connected to the control end of the power circuit internally and connected to the drive circuit externally, and the detection pin 611d is connected to the detection end of the power circuit internally, such as the temperature monitoring circuit, and connected to the detection circuit externally. The manufacturing process of the power device may be to first install the substrate 611 on the mounting portion 412 through a welding process, and then set the power circuit on the substrate 611. Figure 5 As shown, the power device further includes a housing 71, and the housing 71 is sleeved outside the heat dissipation unit and the power unit.

[0059] The heat-conducting body matches the three-phase topology of the three-phase full-bridge circuit. Water flows in the heat dissipation channel inside the heat-conducting body, directly taking away the heat of the three-phase full-bridge circuit. The direct water cooling design reduces the need for external radiators and reduces system complexity. It can also reduce parasitic inductance and wiring complexity. The three-phase magnetic fields cancel each other out, reducing common-mode noise and electromagnetic radiation. The symmetrical design of the mounting part makes the temperatures of the three power sub-units basically consistent, avoiding local overheating and reliability problems caused by single-phase overheating. The symmetrical layout can also reduce unbalanced current. The heat-conducting body with a cylindrical or polyhedral structure is also convenient for multi-module combination and modular expansion to form a higher power system.

[0060] Power modules include but are not limited to the following two types:

[0061] One is to arrange the power subcircuit on the circuit board, and encapsulate the circuit board and the power subcircuit together into a module, which has a current input terminal, a current output terminal and a control terminal. The power subcircuit includes at least power electronic devices and / or power chips. The current input terminal, the current output terminal and the control terminal are usually arranged on a single side of the circuit board, and the power module is powered on a single side.

[0062] Another type is that the power module includes a power module bracket and a power sub-circuit, wherein the power module bracket includes an upper bracket and a lower bracket for upper and lower assembly; the upper bracket is provided with a first electrical connection part; the lower bracket is provided with a second electrical connection part and a third electrical connection part, and the second electrical connection part and the third electrical connection part are separately provided; the power sub-circuit is installed on the upper surface of the lower bracket, and the power sub-circuit includes at least power electronic devices and / or power chips; the power sub-circuit has a current input terminal, a current output terminal and a control terminal; the upper end of the second electrical connection part is electrically connected to the current input terminal, and the lower end is used to be electrically connected to an external current input circuit; the upper end of the third electrical connection part is electrically connected to the current output terminal, and the lower end is used to be electrically connected to an external current output circuit; the lower end of the first electrical connection part is electrically connected to the control terminal, and the upper end is used to be electrically connected to an external drive circuit.

[0063] refer to Figure 6 The power module bracket includes an upper bracket 11 and a lower bracket 12 for upper and lower assembly, wherein the upper bracket 11 is provided with a first electrical connection portion 111; the lower bracket 12 is provided with a second electrical connection portion 121 and a third electrical connection portion 122, and the second electrical connection portion 121 and the third electrical connection portion 122 are separately provided.

[0064] The upper bracket 11 may also be provided with a fourth electrical connection portion 112, and the fourth electrical connection portion 112 is provided separately from the first electrical connection portion 111; the lower end of the fourth electrical connection portion 112 is used to be electrically connected to the upper end of the second electrical connection portion 121 or the current input end of the power circuit, and the upper end is used to be electrically connected to an external circuit. The external circuit connected to the upper end of the fourth electrical connection portion 112 includes but is not limited to a detection circuit.

[0065] The upper bracket 11 may further be separately provided with at least one fifth electrical connection portion 113, the upper end of which is used to be electrically connected to an external circuit, the first electrical connection portion 111 and / or the fourth electrical connection portion 112. The fifth electrical connection portions 113, the fifth electrical connection portion 113 and the fourth electrical connection portion 112, and the fifth electrical connection portion 113 and the first electrical connection portion 111 are separately provided.

[0066] The upper end of the first electrical connection part 111, the upper end of the fourth electrical connection part 112 and / or the upper end of the fifth electrical connection part 113 are exposed on the upper surface of the upper bracket 11; the lower end of the second electrical connection part 121 and / or the lower end of the third electrical connection part 122 are exposed on the lower surface of the lower bracket 12. The exposed design is convenient for connection with an external circuit and also convenient for heat dissipation. In particular, the second electrical connection part 121 and the third electrical connection part 122 are often used for passing large currents, and exposing them on the lower surface of the lower bracket 12 dissipates heat faster.

[0067] The lower end of the first electrical connection portion 111, the lower end of the fourth electrical connection portion 112 and / or the lower end of the fifth electrical connection portion 113 are exposed on the lower surface of the upper bracket 11; the upper end of the second electrical connection portion 121 and / or the upper end of the third electrical connection portion 122 are exposed on the upper surface of the lower bracket 12. These exposed designs facilitate electrical connection with the power circuit installed on the upper surface of the lower bracket.

[0068] In some embodiments, the lower end of the second electrical connection portion 121 is exposed on the lower surface of the lower bracket 12, and the lower end of the second electrical connection portion 121 is a plane. The lower end of the third electrical connection portion 122 is exposed on the lower surface of the lower bracket 12, and the lower end of the third electrical connection portion 122 is a plane. Since the second electrical connection portion 121 and the third electrical connection portion 122 are often used to pass large currents, the lower ends are exposed on the lower surface of the lower bracket 12, and the lower ends are planes with a slightly larger area, which is conducive to connection with external circuits and heat dissipation. The lower ends of the second electrical connection portion 121 and the lower ends of the third electrical connection portion 122 can be installed on the heat dissipation unit by being close to the mounting portion of the heat dissipation unit or close to the substrate on the mounting portion, and the close approach also makes it easier to dissipate heat.

[0069] In some embodiments, the upper end of the second electrical connection portion 121 is exposed on the upper surface of the lower bracket 12, and the upper end of the second electrical connection portion 121 is a plane. The upper end of the third electrical connection portion 122 is exposed on the upper surface of the lower bracket 12, and the upper end of the third electrical connection portion 122 is a plane. The plane design facilitates connection with the current input terminal and the current output terminal of the power sub-circuit.

[0070] In some embodiments, at least one of the first electrical connection part 111, the second electrical connection part 121, the third electrical connection part 122, the fourth electrical connection part 112, and the fifth electrical connection part 113 is an integrated molded structure, such as a metal column, a metal block, etc. The integrated molding method can simplify the structure and facilitate circuit connections on the upper and lower surfaces of the upper bracket 11 and the upper and lower surfaces of the lower bracket 12.

[0071] In some embodiments, since the fifth electrical connection portion 113 is only used to make circuit connections on the upper surface of the upper bracket 11 and does not need to extend into the interior or lower surface of the upper bracket 11, the fifth electrical connection portion 113 can also be only arranged on the upper surface of the upper bracket 11, such as a copper layer plated on the upper surface of the upper bracket 11 made of insulating material.

[0072] As an embodiment, taking the first electrical connection part 111 as an example, the first electrical connection part 111 includes an upper end and a lower end, and a middle end connected therebetween; the upper end is exposed on the upper surface of the upper bracket 11, and the lower end is exposed on the lower surface of the upper bracket 11; the first electrical connection part 111 is an integrally formed structure, the first electrical connection part 111 passes through the upper surface and the lower surface of the upper bracket 11, and the first electrical connection part 111 can be a metal column, a metal block, etc. that passes through the upper and lower surfaces of the upper bracket 11. The structures of the second electrical connection part 121, the third electrical connection part 122, the fourth electrical connection part 112, and the fifth electrical connection part 113 refer to the structure of the first electrical connection part 111. The upper bracket 11 and the lower bracket 12 are used for upper and lower assembly, and the shapes of the upper bracket 11 and the lower bracket 12 are not limited.

[0073] The power sub-circuit is installed on the upper surface of the lower bracket 12, the upper end of the second electrical connection part 121 is electrically connected to the current input end of the power sub-circuit, and the lower end is used to be electrically connected to the external current input circuit; the upper end of the third electrical connection part 122 is electrically connected to the current output end of the power sub-circuit, and the lower end is used to be electrically connected to the external current output circuit; the lower end of the first electrical connection part 111 is electrically connected to the control end of the power sub-circuit, and the upper end is used to be electrically connected to the external drive circuit.

[0074] In some embodiments, the power module also includes a first electrical connector 31, a second electrical connector 32 and / or a third connector 33, the upper end of the first electrical connector 31 is electrically connected to the lower end of the first electrical connection part 111, and the lower end of the first electrical connector 31 is electrically connected to the control end of the power sub-circuit; the upper end of the second electrical connector 32 is electrically connected to the lower end of the fourth electrical connection part 112, and the lower end of the second electrical connector 32 is electrically connected to the upper end or the current input end of the second electrical connection part 121; one end of the third connector 33 is electrically connected to the current input end, and the other end is electrically connected to the upper end of the second electrical connection part 32. The first electrical connector 31 and the second electrical connector 32 may be copper sheets or copper columns. The first electrical connector 31 may be disposed on the lower surface of the upper bracket 11, with the upper end fixedly connected to the lower end of the first electrical connection portion 111, and the lower end extending downward to above the control end of the power sub-circuit; the second electrical connector 32 may be disposed on the lower surface of the lower bracket 12, with the lower end fixedly connected to the upper end of the second electrical connection portion 121, and the upper end extending upward to the lower end of the fourth electrical connection portion 112, or the third connector 33 may also be disposed on the lower surface of the upper bracket 11, with the upper end fixedly connected to the lower end of the fourth electrical connection portion 112, and the lower end extending downward to the upper end of the second electrical connection portion 121; the third connector 33 may be a metal wire.

[0075] As an embodiment, the power sub-circuit includes a power chip, which is a MOS tube chip, integrating a MOS tube, the source S of the MOS tube is the current input end of the power circuit, the drain D of the MOS tube (not shown in the figure) is the current output end of the power circuit, the gate G of the MOS tube is the control end of the power circuit, the drain D of the MOS tube is arranged on the lower surface of the MOS tube, the source S and the gate G of the MOS tube are arranged on the upper surface of the MOS tube, the MOS tube is installed at the upper end of the third electrical connection part 122, the drain D of the MOS tube is closely connected to the upper end of the third electrical connection part 122, the gate G of the MOS tube is electrically connected to the lower end of the first electrical connection part 111 through the first electrical connection part 31, the source S of the MOS tube is electrically connected to the upper end of the second electrical connection part 121 through the third electrical connection part 33, and the source S of the MOS tube is also electrically connected to the lower end of the fourth electrical connection part 112 through the second electrical connection part 32.

[0076] As an embodiment, the upper bracket 11 is separately provided with three fifth electrical connection parts 113, wherein the upper ends of the two fifth electrical connection parts 113 located in the middle area of ​​the upper bracket 11 can be used to connect the thermistor NTC and the external heat dissipation system; the upper end of another fifth electrical connection part 13 can be used to connect between the external drive circuit and one end of the gate resistor R, and the other end of the gate resistor R is electrically connected to the upper end of the first electrical connection part 111. That is to say, in the power module bracket and the power module provided in this embodiment, the external drive circuit can be directly electrically connected to the upper end of the first electrical connection part 111; or the gate resistor R is connected between the upper end of a fifth electrical connection part 13 and the upper end of the first electrical connection part 111, the external drive circuit is electrically connected to the upper end of the fifth electrical connection part 13, and the upper end of the fifth electrical connection part 13 is electrically connected to the upper end of the first electrical connection part 111 through the gate resistor R.

[0077] In the above power module, the control end of the power sub-circuit installed in the power module bracket is connected to the external circuit through the upper bracket, and the current input end and the current output end are connected to the external circuit through the lower bracket respectively, so as to realize the circuit layering of the power module, and the power module is powered on both sides for external connection; and the control end of the power sub-circuit often flows with a small current, and the current input end and the current output end often flow with a large current, and the small current is powered from the top of the power module, and the large current is powered from the bottom of the power module, so as to realize the layered arrangement of small current and large current, and such a power module is installed as a whole, such as being installed on a heat dissipation unit, and the lower end of the second electrical connection part and the lower end of the third electrical connection part on the lower surface of the lower bracket can be close to the installation part of the heat dissipation unit or the substrate on the installation part, which is conducive to the heat dissipation of large current. In addition, the overall circuit layout is more orderly, and the volume of the power module is reduced at the same time, and the power sub-circuit is encapsulated into a power module with a double-layer structure. As an independent electronic device, the power module is convenient to install and replace, and the manufacturing method is also simpler, which can be realized by general engineering personnel without the need for professional personnel to manufacture and install.

[0078] The heat dissipation unit and power device provided in the embodiments of the present invention arrange the power unit on the heat dissipation unit, and through the ingenious structural design of the heat dissipation unit, the overall structure is simple, the cost is low, the heat dissipation efficiency is high, and the normal operation of the power unit is not affected.

[0079] The above contents are further detailed descriptions of the embodiments of the present invention in combination with specific implementation methods, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A heat dissipation unit, characterized in that: It includes a heat-conducting body and N mounting parts, N is greater than or equal to 1, wherein, The mounting portion is disposed on the outer surface of the heat-conducting body, and the mounting portion is used to mount a power unit; The heat-conducting body has one or more heat-dissipating channels inside. The heat-dissipating channels run through one end of the heat-conducting body to the other end of the heat-conducting body, and open ends are formed at the two ends respectively.

2. The heat dissipation unit according to claim 1, characterized in that: It also includes a connecting piece, which is arranged at the open end and is used to connect to an external heat dissipation system.

3. The heat dissipation unit according to claim 1, characterized in that: The N mounting portions are symmetrically arranged on the outer surface of the heat-conducting body.

4. The heat dissipation unit according to claim 1, characterized in that: The heat-conducting body has two ends and a side wall portion located between the two ends. Each of the mounting portions is arranged on the outer surface of the side wall portion of the heat-conducting body. The heat dissipation channel runs from one end of the heat-conducting body to the other end of the heat-conducting body, and open ends are formed at the two end portions respectively.

5. The heat dissipation unit according to claim 4, characterized in that: The heat-conducting body is a column or a polyhedron.

6. The heat dissipation unit according to any one of claims 2 to 5, characterized in that: At least two of the mounting portion, the connecting member and the heat-conducting body are integrally formed structures.

7. The heat dissipation unit according to claim 6, characterized in that: The outer surface of the heat-conducting body has M planes; or the outer surface of the heat-conducting body is surrounded by M planes; M is greater than or equal to N, and N planes among the M planes serve as the mounting parts respectively.

8. A power device, characterized in that: The heat dissipation unit comprises the heat dissipation unit according to any one of claims 1 to 7, and further comprises a power unit, wherein: The power unit includes N power sub-units, and each mounting portion of the heat dissipation unit is provided with one power sub-unit; The power subunit includes a power circuit, and the power circuit is arranged on the mounting portion; or the power subunit includes a substrate and a power circuit arranged on the substrate, and the substrate is arranged on the mounting portion.

9. The power device according to claim 8, characterized in that The power circuit at least includes a power module, a power electronic device and / or a power chip, and the power module is provided with a power electronic device and / or a power chip.

10. The power device according to claim 8, characterized in that The power circuit includes a temperature monitoring circuit, and the temperature monitoring circuit is connected to an external heat dissipation system.

11. The power device according to claim 9, characterized in that: The power module comprises a power module bracket and a power sub-circuit, wherein: The power module bracket includes an upper bracket and a lower bracket for upper and lower assembly; the upper bracket is provided with a first electrical connection part; the lower bracket is provided with a second electrical connection part and a third electrical connection part, and the second electrical connection part and the third electrical connection part are provided separately; The power subcircuit is mounted on the upper surface of the lower bracket, and the power subcircuit at least includes a power electronic device and / or a power chip; the power subcircuit has a current input terminal, a current output terminal and a control terminal; The upper end of the second electrical connection portion is electrically connected to the current input end, and the lower end is used to be electrically connected to an external current input circuit; The upper end of the third electrical connection portion is electrically connected to the current output end, and the lower end is used to be electrically connected to an external current output circuit; The lower end of the first electrical connection portion is electrically connected to the control end, and the upper end is used to be electrically connected to an external driving circuit.

12. The power device according to claim 8, characterized in that The power unit includes three power sub-units, and the power circuits in the three power sub-units form a three-phase full-bridge circuit.

13. The power device according to any one of claims 8 to 12, characterized in that: It also includes a shell, which is sleeved outside the heat dissipation unit and the power unit.

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