High-pass filter and radar receiver

Abstract

The embodiment of the invention discloses a high-pass filter and a radar receiver. The high-pass filter comprises a substrate and a metal heat dissipation layer, the heat conductivity coefficient of the substrate is greater than a first preset value; the metal heat dissipation layer is arranged on the surface of one side of the substrate, and a groove with a set shape is formed in the metal heat dissipation layer. According to the invention, the substrate made of a high-thermal-conductivity material is selected, the metal heat dissipation layer is additionally arranged on one side of the substrate, and meanwhile, the grooves in the metal heat dissipation layer are used for improving heat dissipation, so that the technical problem that the signal receiving precision of the radar receiver is affected due to poor heat dissipation of a filter in the radar receiver in the prior art is solved; the technical effects of increasing the heat dissipating capacity of the filter and ensuring the filtering performance of the filter are achieved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of filters, and in particular to a high-pass filter and a radar receiver. Background Art

[0002] When receiving echo signals, radar receivers will inevitably encounter noise and various interferences, such as clutter interference generated by various distributed objects, noise modulation interference released by the enemy, etc. In order to select useful targets and suppress various noises and interferences, filters are required to make frequency selections.

[0003] If the filter has poor heat dissipation, the internal components will degrade due to overheating, thus affecting the filter's filtering effect, which is directly related to important indicators such as the sensitivity and waveform distortion of the radar receiver. Therefore, it is particularly important to increase the heat dissipation of the filter. Summary of the invention

[0004] The embodiments of the present invention provide a high-pass filter and a radar receiver, which solve the technical problem in the prior art that the filter in the radar receiver has poor heat dissipation and affects the accuracy of receiving signals of the radar receiver.

[0005] An embodiment of the present invention provides a high-pass filter, the high-pass filter comprising a substrate and a metal heat dissipation layer;

[0006] The thermal conductivity of the substrate is greater than a first preset value;

[0007] The metal heat dissipation layer is arranged on one side surface of the substrate, and a groove of a set shape is arranged on the metal heat dissipation layer.

[0008] Furthermore, a preset number of slots are provided on the substrate, dividing the substrate into a set number of rectangular structures with a set area.

[0009] Furthermore, the high-pass filter further includes at least four capacitors having a quality factor higher than a second preset value;

[0010] At least four capacitors are connected in series and are arranged above the trench of the metal heat dissipation layer, and are integrated on a side of the substrate away from the metal heat dissipation layer.

[0011] Furthermore, the high-pass filter further comprises at least four inductors having a quality factor higher than a third preset value;

[0012] At least four of the inductors are integrated on a side of the substrate away from the metal heat dissipation layer, and one of the inductors is connected in parallel across one of the capacitors.

[0013] Furthermore, the surface of the metal heat dissipation layer is plated with a gold layer.

[0014] Furthermore, the thermal conductivity of the substrate is between 50 and 300 W / (m·K).

[0015] Furthermore, the metal heat dissipation layer is a copper layer.

[0016] Furthermore, the substrate is an aluminum nitride substrate.

[0017] An embodiment of the present invention further provides a radar receiver, wherein the radar receiver includes the high-pass filter described in any of the above embodiments.

[0018] The embodiment of the present invention discloses a high-pass filter and a radar receiver, including a substrate and a metal heat dissipation layer; the thermal conductivity of the substrate is greater than a first preset value; the metal heat dissipation layer is arranged on one side surface of the substrate, and a groove of a set shape is arranged on the metal heat dissipation layer. The present application selects a substrate of a high thermal conductivity material, adds a metal heat dissipation layer on one side of the substrate, and also uses the grooves on the metal heat dissipation layer to increase heat dissipation, thereby solving the technical problem of the filter in the radar receiver in the prior art affecting the accuracy of the radar receiver receiving the signal due to poor heat dissipation, and realizes the technical effect of increasing the heat dissipation of the filter and ensuring the filtering performance of the filter. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a structural diagram of a high-pass filter provided by an embodiment of the present invention;

[0020] Figure 2 is a heat map of a filter of a common structure provided by an embodiment of the present invention;

[0021] Figure 3 is a heat map of a high-pass filter provided by an embodiment of the present invention;

[0022] Figure 4 is a schematic diagram of a grooved filter substrate provided by an embodiment of the present invention;

[0023] Figure 5 is a front view of a high-pass filter provided by an embodiment of the present invention;

[0024] Figure 6 4 is a top view of a high-pass filter provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0026] It should be noted that the terms "first", "second", etc. in the specification, claims and drawings of the present invention are used to distinguish different objects, rather than to limit a specific order. The following embodiments of the present invention can be implemented separately, or in combination with each other, and the embodiments of the present invention do not impose specific limitations on this.

[0027] Figure 1 It is a structural diagram of a high-pass filter provided by an embodiment of the present invention.

[0028] like Figure 1 As shown, the high pass filter includes a substrate 10 and a metal heat dissipation layer 20 .

[0029] The thermal conductivity of the substrate 10 is greater than a first preset value; the metal heat dissipation layer 20 is disposed on a side surface of the substrate 10 , and a groove 21 of a set shape is disposed on the metal heat dissipation layer 20 .

[0030] The first preset value can be set to 50 W / (m·K) as required, that is, the substrate 10 needs to be made of a material with a thermal conductivity higher than 50 W / (m·K).

[0031] For high-power electronic devices, since they generate a lot of heat during operation, if they cannot be dissipated in time, the device performance may be degraded or even damaged. Figure 1 In the embodiment of the present invention, a material with high thermal conductivity is selected to make the substrate 10. The substrate 10 with high thermal conductivity can conduct heat more effectively, thereby providing a better heat dissipation effect.

[0032] On the basis of selecting a substrate 10 with a high thermal conductivity, a metal heat dissipation layer 20 is added on one side of the substrate 10. When the electronic devices on the substrate 10 are working, heat is generated. The heat is quickly conducted to a larger area through the metal heat dissipation layer 20, and then dissipated through air convection or other heat dissipation methods. By setting the metal heat dissipation layer 20, the heat dissipation area is effectively increased and the heat dissipation rate is improved.

[0033] In the embodiment of the present invention, a groove 21 of a predetermined shape is added to the metal heat dissipation layer 20. Figure 1 2 shows a schematic diagram of a metal heat dissipation layer 20 provided with an oblong groove. The groove 21 can increase the heat dissipation area, so that the heat can be dissipated more quickly through the metal heat dissipation layer 20.

[0034] Optionally, grounding is added to the metal heat dissipation layer 20. On the one hand, grounding helps to maintain the potential of the metal heat dissipation layer 20 stable and prevent heat accumulation or local overheating caused by potential floating, thereby further improving the heat dissipation effect; on the other hand, grounding can provide a stable potential reference point, which helps to suppress electromagnetic interference. When the electronic devices on the substrate 10 are working, electromagnetic radiation or electromagnetic induction may be generated. These electromagnetic phenomena may interfere with surrounding electronic devices. By adding grounding to the metal heat dissipation layer 20, these electromagnetic interferences can be guided to the earth or other grounding bodies, thereby reducing the impact on surrounding electronic devices and improving the stability and reliability of the entire system.

[0035] Figure 2 is a heat map of a filter of a common structure provided by an embodiment of the present invention, Figure 3 This is a heat map of the high-pass filter provided by an embodiment of the present invention, wherein the redder the color, the higher the heat. Figure 2 The white box in the figure marks the main heat dissipation area of ​​the entire filter circuit board. Figure 3 The white box in the figure marks the heat dissipation area of ​​an inductor integrated on the high-pass filter. Figure 2 and Figure 3 By comparison, it can be seen that the heat generated by the filter with ordinary structure during operation is more obvious, and the heating area is larger, almost occupying half of the circuit board. The high-pass filter with high thermal conductivity substrate 10 and metal heat dissipation layer 20 with grooves 21 in the present application has significantly reduced heat generation during operation, and the heating area is also significantly reduced, which is only concentrated near a single electronic device. Therefore, the high-pass filter provided by the embodiment of the present invention has higher heat dissipation performance than the filter with ordinary structure, and the heating area is smaller.

[0036] The present application selects a substrate made of a high thermal conductivity material, adds a metal heat dissipation layer on one side of the substrate, and also uses the grooves on the metal heat dissipation layer to increase heat dissipation, thereby solving the technical problem in the prior art that the filter in the radar receiver affects the accuracy of the radar receiver receiving signals due to poor heat dissipation, and achieves the technical effect of increasing the heat dissipation of the filter and ensuring the filtering performance of the filter.

[0037] Figure 4 It is a schematic diagram of the grooves on the filter substrate provided by an embodiment of the present invention.

[0038] Alternatively, if Figure 4 As shown, a preset number of slots 11 are provided on the substrate 10 to divide the substrate 10 into a set number of rectangular structures 12 with a set area.

[0039] Specifically, by setting the grooves 11 on the substrate 10, the substrate 10 is divided into a plurality of rectangular structures 12, and a substrate capacitor is formed between the rectangular structure 12 and the metal heat dissipation layer 20, and the set area of ​​the rectangular structure 12 can reflect the capacitance of the substrate capacitor. By setting the grooves 11 to divide the substrate 10 into rectangular structures 12 of set areas, the effective area of ​​the substrate 10 is reduced, thereby reducing its ability to store charge, that is, reducing the junction capacitance, and further improving the overall anti-interference ability of the circuit board.

[0040] Alternatively, if Figure 1 and Figure 4 As shown, the high pass filter further includes at least four capacitors 30 with quality factors higher than a second preset value.

[0041] At least four capacitors 30 are connected in series and are disposed above the trench 21 of the metal heat dissipation layer 20 , and are integrated on a side of the substrate 10 away from the metal heat dissipation layer 20 .

[0042] Specifically, the quality factor Q is a dimensionless unit that measures the performance of a component or resonant circuit. In a filter, it reflects the resolution of the filter. For a high-pass filter, the larger the quality factor Q of the capacitor, the higher the resolution of the filter, the better the filtering effect, and the smaller the active power consumption. Therefore, in order to ensure the performance of the high-pass filter, this application uses a capacitor with a high quality factor. Among them, the second preset value can be set according to the need for the capacitor quality factor, for example, set to 1.

[0043] like Figure 1 and Figure 4 As shown, for the convenience of observation, the substrate 10 is processed in perspective, and the oblong groove 21 provided in the metal heat dissipation layer 20 can be clearly seen, as well as the four capacitors 30 connected in series provided on the other side of the substrate 10 relative to the groove 21. By arranging the capacitor 30 above the groove 21, the heat dissipation of the capacitor 30 can be effectively improved through the groove 21, thereby improving the heat dissipation performance of the entire high-pass filter.

[0044] Alternatively, if Figure 1 As shown, the high-pass filter further includes at least four inductors 40 with quality factors higher than a third preset value; at least four inductors 40 are integrated on a side of the substrate 10 away from the metal heat dissipation layer 20 , and one inductor 40 is connected in parallel to both ends of one capacitor 30 .

[0045] Specifically, the quality factor Q, as an important parameter of the inductor, measures the ratio of the inductor energy storage to the loss. A high quality factor means that the inductor has a lower loss, can transmit signals more efficiently, and reduce the energy loss in the inductor. The embodiment of the present invention helps to improve the performance stability of the high-pass filter by using an inductor with a high quality factor. Among them, the third preset value can be set according to the need for the inductor quality factor, for example, set to 1.

[0046] Optionally, the inductor 40 is a spiral inductor. The spiral inductor is usually formed by winding a wire (such as a copper wire) into a spiral shape. This structure enables the inductor to provide a larger inductance value in a smaller volume.

[0047] Optionally, the surface of the metal heat dissipation layer 20 is plated with a gold layer.

[0048] Specifically, gold plating on the surface of the metal heat dissipation layer 20 can not only prevent the product from being oxidized, but also make it more convenient to mount the product. It should be noted that the surface of the metal heat dissipation layer 20 can also be plated with other metals according to needs or costs, as long as the performance of the plated metal is relatively stable and not easy to oxidize, and no specific restrictions are made here.

[0049] Optionally, the thermal conductivity of the substrate 10 is between 50 and 300 W / (m·K). Optionally, the substrate 10 is an aluminum nitride substrate.

[0050] Specifically, the substrate 10 with high thermal conductivity can be made of a material with a thermal conductivity of 50 to 300 W / (m·K), such as aluminum nitride (AlN).

[0051] Optionally, the metal heat dissipation layer 20 is a copper layer.

[0052] Specifically, the material of the metal heat dissipation layer 20 can be copper, which has good thermal conductivity, low price, and is easy to process. Other metal materials that meet the above conditions can also be selected.

[0053] In the embodiment of the present invention, heat dissipation is increased by using a substrate 10 with a high thermal conductivity, and a metal heat dissipation layer 20 with a groove 21 is provided on one side of the substrate 10 to further increase heat dissipation. At the same time, a groove 11 is provided on the substrate 10 to reduce the junction capacitance, and a high-Q capacitor and a high-Q inductor are provided on the side of the substrate 10 away from the metal heat dissipation layer 20 to ensure the performance of the high-pass filter, so that the size of the high-pass filter is greatly reduced compared with the filter of ordinary structure. Figure 5 is a front view of a high-pass filter provided by an embodiment of the present invention, Figure 6 is a top view of a high pass filter provided by an embodiment of the present invention, such as Figure 5 and Figure 6As shown, the size of the high-pass filter provided in the embodiment of the present invention is 11*5.5*3.7mm, while the size of the filter of the ordinary structure is usually 20*10*10mm. It can be concluded that the size of the high-pass filter provided in the present application is greatly reduced, and the space occupied when integrated in the radar receiver is smaller, which is conducive to the miniaturization development of the radar receiver.

[0054] An embodiment of the present invention further provides a radar receiver, which includes the high-pass filter in any of the above embodiments.

[0055] The radar receiver provided in the embodiment of the present invention includes the high-pass filter in the above embodiment. Therefore, the radar receiver provided in the embodiment of the present invention also has the beneficial effects described in the above embodiment, which will not be described in detail here.

[0056] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] Finally, it should be noted that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A high-pass filter, characterized in that: The high-pass filter comprises a substrate and a metal heat dissipation layer; The thermal conductivity of the substrate is greater than a first preset value; The metal heat dissipation layer is arranged on one side surface of the substrate, and a groove of a set shape is arranged on the metal heat dissipation layer.

2. The high-pass filter according to claim 1, characterized in that A preset number of slots are arranged on the substrate, dividing the substrate into a set number of rectangular structures with a set area.

3. The high-pass filter according to claim 1, characterized in that The high-pass filter further includes at least four capacitors having a quality factor higher than a second preset value; At least four capacitors are connected in series and are arranged above the trench of the metal heat dissipation layer, and are integrated on a side of the substrate away from the metal heat dissipation layer.

4. The high-pass filter according to claim 3, characterized in that The high-pass filter further includes at least four inductors having a quality factor higher than a third preset value; At least four of the inductors are integrated on a side of the substrate away from the metal heat dissipation layer, and one of the inductors is connected in parallel across one of the capacitors.

5. The high-pass filter according to claim 1, characterized in that: The surface of the metal heat dissipation layer is plated with a gold layer.

6. The high-pass filter according to claim 1, characterized in that The thermal conductivity of the substrate is between 50 and 300 W / (m·K).

7. The high-pass filter according to claim 1, characterized in that The metal heat dissipation layer is a copper layer.

8. The high-pass filter according to claim 1, characterized in that The substrate is an aluminum nitride substrate.

9. A radar receiver, characterized in that: The radar receiver comprises the high pass filter according to any one of claims 1 to 8 above.

Images