Electronic equipment test fixture and method based on phase change energy storage

Abstract

The invention relates to the field of electronic equipment testing, in particular to an electronic equipment testing clamp and method based on phase change energy storage, and the electronic equipment testing clamp comprises a base which is provided with an installation part for the installation of electronic equipment; the heat storage bin is arranged in the base; the guide sliding plate is transversely arranged in the heat storage bin and divides an inner cavity of the heat storage bin into an upper sub-cavity and a lower sub-cavity, at least one side of the guide sliding plate is provided with a guide sliding inclined plane and extends towards the inner wall of the heat storage bin adjacent to the mounting part at an inclined angle, and a communication channel for communicating the upper sub-cavity with the lower sub-cavity is arranged between the tail end of the guide sliding inclined plane and the inner wall of the heat storage bin; and the phase change energy storage body is packaged in the upper sub-cavity in a solid prefabricated form. According to the invention, heat can be absorbed and released through the phase change energy storage body, transient heat dissipation buffering can be carried out, so that a test environment and the temperature stability of electronic components can be maintained, efficient heat dissipation can be realized, and meanwhile, a quiet working environment can be provided.

Description

Technical Field

[0001] The present invention relates to the field of electronic equipment testing, and in particular to an electronic equipment testing fixture and method based on phase change energy storage. Background Art

[0002] With the rapid development of avionics technology, integrated modular avionics have become a core component of modern aircraft. This type of equipment has greatly improved the combat performance and mission adaptability of aircraft with its high efficiency and flexibility. However, during its development process, the thermal power consumption and heat flux density of the module gradually became prominent, becoming one of the key factors restricting the performance improvement of the equipment. In the development stage of the module, in order to ensure the correct burning, debugging and comprehensive testing of its program, it is usually necessary to make a special test fixture. These fixtures are often simplified versions of the rack in design, mainly composed of liquid cooling plates, side panels, handles and other components. The test fixture also needs to be equipped with corresponding air cooling or liquid cooling systems, power supplies, cables and other facilities. However, there are many problems with the existing test fixtures during use. First, the assembly process is cumbersome and complicated, and it requires the collaboration of multiple people to complete various pipeline assembly tasks, which not only increases labor costs, but also reduces work efficiency. Secondly, the test desk is often messy, with various cables and tools mixed together, which not only affects the aesthetics of the working environment, but also increases safety hazards, and is not convenient for circulation between different workstations. During the test process, its working states include standby state and different power states. Under peak power, a supporting system with strong heat dissipation performance is required, and it is required to be able to quickly respond to the heat dissipation requirements of peak power. However, the test process also includes a long period of low-power working state, and even standby state. In terms of average working power, the heat dissipation design of the entire fixture needs to be designed according to the peak power. The excess performance results in a high fixture cost. Finally, the test preparation stage takes a long time, and the cold source startup, pipeline leak detection and temperature stabilization take a long time, which affects the test efficiency and seriously restricts the test progress of the equipment. Summary of the invention

[0003] The purpose of the present invention is to address the deficiencies in the prior art and to provide an electronic equipment testing fixture and method based on phase change energy storage, which can absorb and release heat through a phase change energy storage body, can perform transient heat dissipation buffering to maintain the temperature stability of the test environment and electronic components, can dissipate heat efficiently, and can provide a quiet working environment.

[0004] The object of the present invention is achieved by: an electronic equipment test fixture based on phase change energy storage, comprising: A base having a mounting portion for mounting electronic equipment; A heat storage bin is arranged in the base; A guide slide plate is horizontally placed in the heat storage bin and divides the inner cavity of the heat storage bin into an upper sub-cavity and a lower sub-cavity, a guide slide slope is provided on at least one side of the guide slide plate and extends at an inclination angle toward the inner wall of the heat storage bin adjacent to the mounting portion, and a connecting channel for connecting the upper sub-cavity and the lower sub-cavity is provided between the end of the guide slide slope and the inner wall of the heat storage bin; The phase-change energy storage body is packaged in the upper sub-cavity in a solid prefabricated form.

[0005] An open cavity is provided between the upper and lower side walls of the base, and mounting parts are provided on both side walls of the open cavity. Two isolated heat storage bins are provided on the upper and lower side walls of the base; guide sliding slopes are provided on both sides of the guide sliding plate, and the two guide sliding slopes converge and extend toward the far end.

[0006] The upper and lower side walls of the base are provided with a concave cavity, and the concave cavity is divided into two left and right heat storage bins by a middle partition. The mouth end of the concave cavity is detachably connected to a cover plate, and the cover plate and the mouth edge of the concave cavity are sealed by a sealing ring.

[0007] The mounting portion comprises a strip-shaped groove arranged on the side wall of the opening cavity, and the cross section of the guide slide plate is triangular or tapered; the two ends of the guide slide plate in the length direction are connected to the side wall of the heat storage bin.

[0008] The two side walls of the guide slide in the up-down direction are arrayed with a plurality of ribs in the length direction of the guide slide, and the ribs extend in the width direction, and the distal ends of the ribs in the up-down direction abut against the corresponding inner walls of the heat storage chamber.

[0009] The base is rotatably connected to the bracket via a rotating shaft to form a flipping mechanism. The axis of the rotating shaft is horizontally arranged so that the base can flip up and down around the rotating shaft. The guide slide plate and the rib plate are made of heat-conducting metal material.

[0010] The outer side wall of the base in the transverse direction is provided with heat dissipation fins.

[0011] The distal end of the guide slide plate abuts against the side wall of the corresponding heat storage bin, and the edge of the distal end of the guide slide plate is provided with grooves or meshes arranged along the length direction of the guide slide plate, and the grooves or meshes form a connecting channel; Alternatively, a gap is left between the distal end of the guide slide plate and the adjacent side wall of the heat storage bin, and the gap forms a connecting channel.

[0012] A temperature sensor is embedded in the heat storage bin and is electrically connected to an external display device.

[0013] A method for testing electronic equipment based on phase change energy storage comprises the following steps: Installing the electronic device on any of the test fixtures, and ensuring that the locking strip of the electronic device is in close contact with the fixture; After the electronic device is installed, a preset test condition is applied to the electronic device, a preset test program is started, the electronic device is tested, and during the test, the electronic device is continuously cooled by the phase change of the phase change energy storage body of the fixture, and the test data is recorded; After the test is completed, removing the electronic device from the fixture; After the electronic device is taken out, actively cooling the fixture until the fixture phase change material changes into a solid phase; After cooling is completed, the fixture is turned over and enters a state to be tested, ready to receive the next electronic device for testing.

[0014] By adopting the present invention, the electronic equipment in the simulation work can be cooled. The phase change energy storage system is relatively simple and does not require complex circulation equipment and piping systems. During use, there is no need for the docking and installation of facilities such as air cooling, liquid cooling systems, power supplies, and cables, as well as startup work, which simplifies the installation preparation work during testing and improves work efficiency. At the same time, due to the reduction in the number of various pipelines and cables, the aesthetics of the working environment is improved and safety hazards are reduced. The present invention provides an electronic equipment test fixture based on phase change energy storage. The phase change energy storage body absorbs and releases heat, and the temperature change of the phase change material during the phase change process is relatively small, which can provide a relatively stable temperature environment. When the temperature of the equipment rises, the phase change material absorbs heat and undergoes a phase change, but the temperature does not rise as quickly as traditional liquid cooling. At the same time, through the design of the guide plate and the heat storage bin, efficient heat dissipation is achieved, and a quiet working environment is provided, which reduces the hearing damage of personnel who conduct long-term testing. At the same time, it can also be suitable for the test scene of electronic equipment noise testing.

[0015] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the installation structure of the rear end cover plate of the present invention; Figure 3 It is a schematic diagram of the arrangement of the phase change energy storage body; Figure 4 This is a schematic diagram of the layout of the heat storage bin; Figure 5 It is a structural schematic diagram of the guide slide; Figure 6 A schematic diagram of the structure of an electronic device.

[0017] In the accompanying drawings, 1 is a base, 2 is a phase change energy storage body, 3 is an electronic device, 12 is a heat storage bin, 13 is a guide slide plate, 16 is a cover plate, 121 is an upper sub-cavity, 122 is a lower sub-cavity, 131 is a guide slide slope, 132 is a rib plate, 141 is a connecting channel, 161 is a sealing ring, and 11a is a mounting portion. DETAILED DESCRIPTION

[0018] Specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms center, up, down, front, back, left, right, vertical, horizontal, top, bottom, inside, outside, etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, the terms first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as first and second can be used to explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of multiple is two or more. It should be noted that in practical applications, due to the limitations of equipment accuracy or installation errors, absolute parallel or vertical effects are difficult to achieve. The description of vertical, parallel or same direction in this application is not an absolute limiting condition, but means that a vertical or parallel structural setting can be achieved within a preset error range and the corresponding preset effect can be achieved. In this way, the technical effect of the limited features can be maximized, and the corresponding technical solution can be easy to implement and has high feasibility.

[0021] In the description of this specification, the description of reference terms such as one embodiment, some embodiments, examples, specific examples, or some examples means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples without contradiction.

[0022] See also Figures 1 to 6 , an embodiment of an electronic device test fixture based on phase change energy storage, comprising a base 1, the base 1 is provided with a mounting portion 11a for mounting an electronic device, a heat storage bin 12, which is arranged in the base 1; it can be arranged at an upper side wall, a lower side wall, etc.; a guide slide 13 is horizontally placed in the heat storage bin 12 and divides the inner cavity of the heat storage bin 12 into an upper sub-cavity 121 and a lower sub-cavity 122, wherein the space of the phase change energy storage body 2 is in one of the sub-cavities, and the overall volume of the cavity is small, which can adapt to expansion, at least one side of the guide slide 13 is provided with a guide slope 131 and extends at an inclination toward the inner wall of the heat storage bin 12 adjacent to the mounting portion 11a, and a connecting channel 141 for connecting the upper sub-cavity 121 and the lower sub-cavity 122 is provided between the end of the guide slope 131 and the inner wall of the heat storage bin 12; the phase change energy storage body 2 is encapsulated in the upper sub-cavity 121 in a solid prefabricated form, and the phase change energy storage body 2 can be made of a paraffin phase change material.

[0023] It can be understood that the base 1 is the main structure of the test fixture or the installation of the heating module, and is provided with a mounting portion 11a for installing electronic equipment, which is used for installing electronic equipment to fix and conduct heat. The electronic equipment can be an avionics module or a PCB board, and can also be a power module, a communication module, a sensor module, etc. The base 1 provides mechanical support and electrical connection basis for the entire test fixture to ensure the stability and reliability of the test fixture. The avionics module is installed on the base 1 through the mounting portion 11a to simulate the installation environment of the avionics module.

[0024] The heat storage bin 12 provides packaging space for the phase change energy storage body 2, ensuring that it can effectively absorb and release heat during the test process, thereby achieving precise temperature control. The heat storage bin 12 is divided into an upper sub-cavity 121 and a lower sub-cavity 122 by a guide slide 13. The phase change energy storage body 2 is packaged in the upper sub-cavity 121, and heat is transferred to the heat storage bin 12. It can be understood that the side wall heat transfer path of the heat storage bin 12 close to the mounting portion 11a is the shortest.

[0025] The guide slide plate 13, through its inclined guide slope 131 and connecting channel 141, makes the phase change energy storage body 2 on the guide slide plate 13 have a sliding tendency, especially during the phase change process of the solid phase, it is easier to slide due to the presence of a small amount of liquid phase. When the electronic device 3 is working and heats the heat storage bin 12, the phase change energy storage body 2 undergoes a phase change in the upper sub-cavity 121, such as changing from solid to liquid, and absorbs a large amount of heat; the liquid phase flows into the lower sub-cavity 122 through the connecting channel 141, realizing the transfer of the liquid phase to the lower sub-cavity 122. Since the solid density and liquid density of phase change materials, especially paraffin, are less different, the transfer of the liquid phase reduces the buoyancy effect of the solid phase on the guide slide plate 13, making the solid phase have a more significant sliding tendency and closer to the mounting portion 11a, which can respond quickly. It can realize transient heat dissipation buffering, and continuously slide along the guide plate 13, always contacting the side wall of the adjacent heat storage bin 12, forming a phase change working area where the solid phase contacts the side wall, and the working area continuously dissipates heat through latent heat changes; it can avoid the conventional phenomenon that the phase change material is in different positions, and its phase change interface changes continuously in the phase change material during the phase change process. The solid phase close to the heat source undergoes phase change first, the heat transfer path gradually increases, and the heat transfer effect is not good. During the whole heat transfer process, the path gradually becomes farther, which leads to low heat transfer efficiency and other phenomena.

[0026] During the heating stage, the electronic device transfers heat through the mounting portion 11a, and the heat is transferred to the entire heat storage bin 12 and the upper sub-cavity 121. The phase change energy storage body 2 absorbs heat and undergoes a phase change, such as changing from a solid state to a liquid state. The phase change energy storage body 2 slides, approaches the side wall at the far end of the guide slide plate 13, and contacts the side wall there. The liquid phase after the phase change flows away, and the solid phase always tends to fit the wall of the heat storage bin 12 there. The phase change interface is continuously maintained there, with a shorter heat transfer path and a higher heat transfer rate, and can quickly dissipate heat and cool down. The temperature difference between the electronic device 3 and the mounting portion 11a is small, and it can respond to the temperature rise to avoid damage to the electronic device 3 caused by a sharp temperature increase.

[0027] In order to better adapt to the installation of the electronic device 3 and simulate its installation environment, in some embodiments, an open cavity is provided between the upper and lower side walls of the base 1, and a mounting portion 11a is provided on both side walls of the open cavity, and two isolated heat storage bins 12 are provided on the upper and lower side walls of the base 1. Guide sliding slopes 131 are provided on both sides of the guide slide 13, and the two guide sliding slopes 131 converge and extend toward the far end. Further, the mounting portion 11a includes a strip groove provided on the side wall of the open cavity, which can adapt to the rapid assembly of the locking strip through the strip groove, can adapt to the basic form of the current electronic device 3, and facilitate rapid testing. The cross-section of the guide slide 13 can be triangular or tapered, providing a tendency for the solid phase change material to slide; the two ends of the guide slide 13 in the length direction can be connected to the side wall of the heat storage bin 12 by abutting or clamping.

[0028] With this structure, the open cavity is used to accommodate the electronic device 3 to be tested, which is connected to the mounting portion 11a on both sides of the electronic device 3 through connectors such as locking strips, and the heat of the electronic device 3 is transferred to the mounting portion 11a through both sides, and then transferred to the heat storage bin 12. Since the heat has two transfer routes, a corresponding heat storage bin 12 is set on each side wall, so that it can absorb the transferred heat in both directions on any side wall in the up and down directions. Both sides of the guide slide 13 are provided with guide slopes 131, and the two guide slopes 131 converge and extend to the far end, so that after the entire device is turned over, the upper and lower sub-cavities can be switched in the height direction. The liquid phase in the last round of use process is in the lower sub-cavity 122, and after being left at room temperature, water-cooled, or air-cooled to achieve heat dissipation, the water cooling can be achieved by water spraying or immersion, forming a solid phase change material, which is used as the upper sub-cavity 121 for the next round of testing after the upper and lower positions are changed, wherein the solid phase change material is located on the guide slope 131 of the guide slide 13 and has a sliding tendency.

[0029] In some embodiments, a gap is reserved between the distal end of the guide slide 13 and the adjacent side wall of the heat storage bin 12, and a connecting channel 141 is formed through the gap. The channel can realize the transfer of the phase change material in the liquid phase. The transferred liquid phase can absorb heat according to the sensible heat change of the phase change material. The solid phase change material always sticks to the side wall to undergo phase change and absorbs heat through latent heat change. Alternatively, the distal end of the guide slide 13 abuts against the side wall of the corresponding heat storage bin 12, and the edge of the distal end of the guide slide 13 is provided with grooves or meshes arranged along the length direction of the guide slide 13, and the grooves or meshes form the connecting channel 141, and the gap forms the connecting channel 141. The solid phase change material at the distal end of the guide slide 13 and the adjacent side wall of the heat storage bin 12 always sticks to the connecting channel 141 and its nearby area, such as the side wall of the heat storage bin 12, continuously undergoes phase change, and the liquid phase after phase change enters the lower sub-chamber 122 from the connecting channel 141.

[0030] In some embodiments, specifically, the upper and lower side walls of the base 1 have a concave cavity, and the concave cavity is divided into two left and right heat storage bins 12 by a middle partition. The mouth end of the concave cavity can be detachably connected to a cover plate 16, and the detachable connection structure includes bolt connection, snap connection, etc. The cover plate 16 and the edge of the concave cavity are sealed by a sealing ring 161. By detachably connecting the cover plate 16, it is easy to process and assemble the heat storage bin 12, and install the guide plate 13, which can facilitate the initial assembly of the phase change material. The outer side wall of the base 1 in the transverse direction is provided with heat dissipation fins, and the heat dissipation fins can be provided to dissipate heat and save phase change energy. When the electronic device 3 is in a low power consumption state, such as standby mode, the heat dissipation through the fins can meet the demand, which can slow down the phase change state of the phase change material, and thus significantly extend the use time of the device.

[0031] In some embodiments, the two side walls of the guide slide plate 13 in the vertical direction are arrayed with a plurality of ribs 132 in the length direction of the guide slide plate 13. The guide slide plate 13 and the ribs 132 are made of heat-conducting metal materials, preferably aluminum, aluminum alloy, copper, and copper alloy, etc., with low cost and high thermal conductivity, easy to process, and can transfer part of the heat in the heat storage bin 12. The ribs 132 extend in the width direction, and the distal ends of the ribs 132 in the vertical direction abut against the corresponding inner wall of the heat storage chamber. With this structure, the ribs 132 can make the phase change material arranged more uniformly in the length direction, so that the areas separated in the length direction can all undergo phase change, and the liquid phase can flow into the lower sub-cavity in the corresponding area; at the same time, the ribs 132 can support and position the guide slide plate 13, and the ribs 132 and the guide slide plate 13 can be placed in the heat storage bin 12 as a whole, so that the installation of the guide slide plate 13 can be realized, and there is no need to set a complex installation structure in the heat storage bin 12.

[0032] In some embodiments, a temperature sensor is embedded in the heat storage bin 12, and the temperature sensor is electrically connected to an external display device. The temperature sensor and the external display device are electrically connected to a mobile battery. Preferably, the temperature sensor can be an integrated digital display temperature sensor, which is convenient and flexible in practice, reduces the workload of wiring, and is easy to transfer.

[0033] The entire device can be flipped upside down and switched manually or with lifting equipment to achieve the reversed and cyclic use of the lower sub-chamber 122 and the upper sub-chamber 121. Of course, in some embodiments, in order to reduce the operating burden, the base 1 is rotatably connected to the bracket through a rotating shaft to form a flipping mechanism; the axis of the rotating shaft is horizontally arranged, so that the base 1 can be flipped up and down around the rotating shaft. Through the flipping mechanism, convenient flipping can be achieved. For example, when working on an assembly line, the flipping mechanism is delivered with the fixture and arrives at the same position as the electronic device 3, where it is tested. After the test is completed, when the lower sub-chamber 122 is in a liquid phase, it can be flipped 180° to return to the original upper sub-chamber 121, in which heat is released to form a solid phase, and then flipped 180°, or the phase change material in the lower sub-chamber 122 releases heat to form a solid phase. After use, the entire device is flipped 180° and used directly.

[0034] The present invention also provides an embodiment of an electronic device testing method based on phase change energy storage, comprising the following steps: Install the electronic device 3 onto the test fixture, and ensure that the locking strip of the electronic device 3 is in close contact with the fixture; After the electronic device 3 is installed, a preset test condition is applied to the electronic device 3, a preset test program is started, the electronic device 3 is tested, and during the test, the electronic device 3 is continuously cooled by the phase change of the phase change energy storage body 2 of the fixture, and the test data is recorded; After the test is completed, the electronic device 3 is removed from the fixture; After the electronic device 3 is taken out, the fixture is actively cooled until the phase change material of the fixture is transformed into a solid phase; After cooling is completed, the fixture is turned over and enters a state to be tested, ready to receive the next electronic device 3 for testing.

[0035] The present invention has a simple structure, is easy to assemble and maintain, and is suitable for the testing needs of various avionics equipment 3. The present invention can achieve effective thermal management of electronic equipment through the use of phase change energy storage body 2. The phase change energy storage body 2 can absorb heat at high temperature and release heat at low temperature, thereby maintaining the temperature stability of the test environment. This design not only improves the test efficiency, but also reduces energy consumption and reduces safety hazards. During use, the present invention does not require the docking and installation of facilities such as air cooling, liquid cooling system, power supply and cable, as well as startup work, and does not require additional power devices and control systems. The installation preparation work during the test is simplified and the work efficiency is improved. At the same time, due to the reduction in the number of various pipelines and cables, the aesthetics of the working environment is improved and safety hazards are reduced. Since the present invention does not require the participation of heat dissipation fans in the process, the phase change energy storage process does not require external energy input, and relies on the phase change characteristics of the material itself to absorb and release heat, so no additional energy consumption is generated. Moreover, the phase change process is relatively quiet and does not generate obvious noise. It is suitable for noise-sensitive application scenarios, can provide a quiet working environment, and reduce the hearing damage phenomenon of personnel who conduct long-term testing. At the same time, it can also be suitable for the test scenario of noise testing of electronic equipment 3. The temperature change of phase change materials during the phase change process is relatively small, and they can provide a relatively stable temperature environment. When the temperature of the device rises, the phase change material absorbs heat and changes phase, but the temperature does not rise as quickly as traditional liquid cooling. This characteristic makes phase change energy storage have an advantage in maintaining the temperature stability of electronic equipment.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An electronic equipment test fixture based on phase change energy storage, characterized in that: include: A base (1) provided with a mounting portion (11a) for mounting an electronic device; A heat storage bin (12) is arranged inside the base (1); a guide slide plate (13) disposed transversely in the heat storage bin (12) and dividing the inner cavity of the heat storage bin (12) into an upper sub-cavity (121) and a lower sub-cavity (122); a guide slide slope (131) is provided on at least one side of the guide slide plate (13) and extends at an inclination angle toward the inner wall of the heat storage bin (12) adjacent to the mounting portion (11a); and a communication channel for connecting the upper sub-cavity (121) and the lower sub-cavity (122) is provided between the end of the guide slide slope (131) and the inner wall of the heat storage bin (12); The phase-change energy storage body (2) is packaged in the upper sub-cavity (121) in a solid prefabricated form.

2. The electronic device test fixture based on phase change energy storage according to claim 1, characterized in that: An open cavity is provided between the upper and lower side walls of the base (1), and mounting portions (11a) are provided on both side walls of the open cavity; two isolated heat storage bins (12) are provided on the upper and lower side walls of the base (1); guide sliding slopes (131) are provided on both sides of the guide sliding plate (13), and the two guide sliding slopes (131) converge and extend toward the far end.

3. The electronic device test fixture based on phase change energy storage according to claim 2, characterized in that: The upper and lower side walls of the base (1) are provided with a concave cavity, the concave cavity being divided into two left and right heat storage bins (12) by a middle partition, the mouth end of the concave cavity being detachably connected to a cover plate (16), and the cover plate (16) and the concave cavity mouth edge are sealed by a sealing ring (161).

4. The electronic device test fixture based on phase change energy storage according to claim 2, characterized in that: The mounting portion (11a) comprises a strip-shaped groove arranged on the side wall of the opening cavity; the cross section of the guide slide plate (13) is triangular or tapered; and the two ends of the guide slide plate (13) in the length direction are connected to the side wall of the heat storage bin (12).

5. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: A plurality of ribs (132) are arranged on both side walls of the guide slide plate (13) in the length direction of the guide slide plate (13), the ribs (132) extending in the width direction, and the distal ends of the ribs (132) in the vertical direction abut against the corresponding inner walls of the heat storage chamber.

6. The electronic device test fixture based on phase change energy storage according to claim 5, characterized in that: The base (1) is rotatably connected to the bracket via a rotating shaft to form a flip mechanism, and the axis of the rotating shaft is arranged horizontally, so that the base (1) can flip up and down around the rotating shaft; the guide plate (13) and the rib plate (132) are made of heat-conducting metal material.

7. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: The outer side wall of the base (1) in the transverse direction is provided with heat dissipation fins.

8. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: The distal end of the guide slide plate (13) abuts against the side wall of the corresponding heat storage bin (12), and the edge of the distal end of the guide slide plate (13) is provided with grooves or mesh holes arranged along the length direction of the guide slide plate (13), and the grooves or mesh holes form a communication channel; Alternatively, a gap is left between the distal end of the guide slide plate (13) and the adjacent side wall of the heat storage bin (12), and the gap forms a communication channel.

9. The electronic device test fixture based on phase change energy storage according to claim 1 or 2, characterized in that: A temperature sensor is embedded in the heat storage bin (12), and the temperature sensor is electrically connected to an external display device.

10. An electronic device testing method based on phase change energy storage, characterized in that: The following steps are involved: Installing the electronic device (3) onto the test fixture of any one of claims 1 to 9, and ensuring that the locking strip of the electronic device (3) is in close contact with the fixture; After the electronic device (3) is installed, a preset test condition is applied to the electronic device (3), a preset test program is started, the electronic device (3) is tested, and during the test, the electronic device (3) is continuously cooled by the phase change of the phase change energy storage body (2) of the fixture, and the test data is recorded; After the test is completed, the electronic device (3) is removed from the fixture; After the electronic device (3) is taken out, actively cooling the fixture until the phase change material of the fixture is transformed into a solid phase; After cooling is completed, the fixture is turned over and enters a state ready for testing, ready to receive the next electronic device (3) for testing.

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