Shielding cover, circuit board assembly and electronic equipment

Abstract

The invention provides a shielding case, a circuit board assembly and an electronic device, the shielding case comprises a case body, the case body and a circuit board jointly enclose a shielding area, and at least part of components on the circuit board are covered in the shielding area. The components located in the cover body comprise the first device, the first device is provided with the step face facing the cover body, the reinforcing part is arranged in the area, corresponding to the step face of the first device, of the cover body, at least part of the structure of the reinforcing part is located in the area, right facing the step face, of the cover body, and the space formed above the step face of the first device is utilized; the reinforcing part is additionally arranged to increase the strength of the cover body, the surrounding area of the part corresponding to the step surface on the cover body is prevented from collapsing, and the stability and reliability of the shielding cover are improved. Moreover, the distance between the first device and the adjacent component is kept unchanged or the increase of the distance between the first device and the adjacent component is reduced, so that the circuit board can keep a densely arranged layout structure, the component layout area of the circuit board is saved, and the space utilization rate of the circuit board is improved.

Description

[0001] This application claims the priority of the Chinese patent application filed with the China Patent Office on August 12, 2021, with application number CN202110925358.5 and application name “Shielding cover, circuit board assembly and electronic device”, all contents of which are incorporated by reference in this application.

[0002] This application is a divisional application. The application number of the original application is 202280054334.X, and the original application date is April 26, 2022. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0003] The present application relates to the technical field of electromagnetic shielding, and in particular to a shielding cover, a circuit board assembly and an electronic device. Background Art

[0004] At present, terminal devices such as mobile phones, tablet computers, laptop computers, and personal digital assistants (PDAs) are usually provided with shielding covers for shielding electromagnetic wave signals.

[0005] Taking a circuit board as an example, the shielding cover mounted on the circuit board includes a supporting frame and a cover body. The supporting frame is fixed on the circuit board, the components on the circuit board are located in the area enclosed by the supporting frame, and the cover body is connected to the outside of the supporting frame. The cover body completely wraps the components inside to form a complete shielding structure.

[0006] However, in areas on the circuit board where components are densely packed and space is compact, the shield is prone to collapse, posing a threat to the reliability of the shield. Summary of the invention

[0007] The present application provides a shielding cover, a circuit board assembly and an electronic device. The shielding cover has good support, high strength, good reliability, and can save the arrangement space of components on the circuit board, thereby improving the space utilization rate of the circuit board.

[0008] In a first aspect, the present application provides a shielding cover, which is installed on a side surface of a circuit board provided with components, and includes a cover body, which is arranged on the circuit board, and a shielding area is enclosed between the cover body and the circuit board, and at least part of the components are located in the shielding area; the components located in the shielding area include at least one first component, and the first component has a step surface facing the cover body;

[0009] Wherein, a reinforcement portion is arranged on the cover body, and at least part of the reinforcement portion is located in the area of ​​the cover body facing the step surface.

[0010] The shielding cover provided by the present application includes a cover body, and the cover body and the circuit board jointly form a shielding area, and at least part of the components on the circuit board are covered therein. The components located inside the cover body include a first component, and the first component has a step surface facing the cover body. A usable space is formed between the step surface of the first component and the area on the cover body facing the step surface. By providing a reinforcement part in the area corresponding to the step surface of the first component on the cover body, at least part of the structure of the reinforcement part is located in the area on the cover body facing the step surface, the usable space formed above the step surface of the first component is utilized, and the reinforcement part is added to increase the strength of the cover body, so as to avoid the collapse of the surrounding area of ​​the corresponding step surface on the cover body, and improve the stability and reliability of the shielding cover. In addition, the spacing between the first component and the adjacent components can remain unchanged, or the increase in the spacing between the first component and the adjacent components is reduced, so that the circuit board maintains a densely arranged layout structure, saves the component layout area of ​​the circuit board, and improves the space utilization rate of the circuit board.

[0011] In a possible implementation manner, the cover body includes a support frame and a cover plate, the support frame is supported on the circuit board, and the cover plate is arranged outside the support frame.

[0012] As the supporting basis of the cover body, the support frame is installed on the circuit board to form a supporting skeleton. By setting the cover plate outside the support frame, the cover plate and the circuit board together form a shielding area, and the components are covered in the cover body.

[0013] In a possible implementation, the support frame includes a frame and at least one support plate. The frame is arranged around the edge of the shielding area, and the support plate is connected to the inner side of the frame, and the support plate forms a reinforcement portion.

[0014] By connecting the support plate in the frame, the support plate can support the corresponding part of the cover plate to prevent the local area of ​​the cover plate from collapsing, improve the stability of the cover plate, and ensure the reliability of the shielding cover.

[0015] Furthermore, by arranging a support plate in the space between the step surface of the first device and the step surface facing the cover plate, the support plate supports the corresponding part of the cover plate, thereby preventing the area around the support plate on the cover plate from collapsing, improving the stability of the cover plate, and enhancing the reliability of the shielding cover.

[0016] In a possible implementation manner, a recessed portion is provided on the cover plate, the recessed portion extends toward the step surface, and the recessed portion forms a reinforcement portion.

[0017] By setting a recessed portion on the cover plate as a reinforcing portion, the recessed portion on the cover plate generates a force on the surrounding area in the opposite direction to the gravity of the cover plate, thereby supporting the area around the recessed portion on the cover plate, preventing the area around the recessed portion from collapsing, enhancing the strength and stability of the cover plate, and improving the reliability of the cover body.

[0018] In a possible implementation, in the extension direction of the board surface of the circuit board, there is a distance between the surface of the first component close to the cover body and the reinforcement portion.

[0019] By providing a gap between the reinforcing portion located above the step surface of the first device and on the side of the upper portion of the first device in the horizontal direction, interference between the reinforcing portion and the first device can be avoided, thereby ensuring that the shielding cover is installed normally without affecting the performance of the first device.

[0020] In a possible implementation manner, the reinforcement portion extends along the length direction of the step surface and at least covers an edge of the first component.

[0021] By extending the reinforcing portion along the length direction of the step surface of the first device, the utilization rate of the space between the step surface of the first device and the cover plate is improved, the length of the reinforcing portion is extended, the supporting force of the reinforcing portion on the cover body is enhanced, and the strength and stability of the cover body are improved.

[0022] In a possible implementation, a partial region of a projection of the reinforcement portion on the circuit board is located within a region covered by the step surface.

[0023] By making part of the projection area of ​​the reinforcement part on the circuit board located within the area covered by the step surface, that is, part of the width area of ​​the reinforcement part is located above the step surface, and another part of the width area of ​​the reinforcement part extends to the side of the first device, the width of the reinforcement part is increased, the area of ​​the reinforcement part is expanded, and the force of the reinforcement part on the shielding cover is increased.

[0024] In a possible implementation, in the width direction of the step surface, the thickness of the component adjacent to the first component is less than the thickness of the first component; a partial area of ​​the projection of the reinforcement portion on the circuit board is located within the coverage area of ​​the component adjacent to the first component.

[0025] By making a partial area of ​​the projection of the reinforcing part on the circuit board be located within the coverage area of ​​the components on the side of the first device, that is, the reinforcing part extends from the space above the step surface of the first device to the space above the components on the side of the first device, the coverage range of the reinforcing part is increased, the supporting force of the reinforcing part on the cover body is improved, and the stability and reliability of the cover body are improved.

[0026] In a possible embodiment, the frame of the support frame includes a side wall, a fixed edge and an overlapping edge, the side wall is supported on the circuit board, the fixed edge and the overlapping edge are respectively located at two ends of the side wall, the fixed edge is attached to the circuit board, and the overlapping edge is attached to the cover plate.

[0027] The support frame is supported on the circuit board through the side wall of the frame. By setting a fixed edge that fits the circuit board at the end of the side wall facing the circuit board, the fixed edge can increase the contact area between the frame and the circuit board, thereby ensuring that the support frame is firmly installed; by setting a lap edge that fits the cover plate at the end of the side wall facing the cover plate, the lap edge can increase the contact area between the frame and the cover plate, thereby ensuring that the support frame is firmly connected to the cover plate.

[0028] In a possible implementation, the fixed edge is located outside the area surrounded by the side walls, the overlapping edge is located inside the area surrounded by the side walls, and the support plate is connected to the overlapping edge.

[0029] By setting the fixed edge attached to the circuit board on the outer side of the side wall to prevent the fixed edge from occupying the space inside the shielding cover, the distance between the side wall and the peripheral components in the shielding cover is reduced, the spatial volume of the support frame is reduced, and the space occupied by the shielding frame is reduced; by setting the overlapping edge attached to the cover plate on the inner side of the side wall to prevent the overlapping edge from occupying additional space outside the side wall, the space occupied by the support frame is reduced, the space occupied by the shielding frame is reduced, and the edge of the cover plate can extend along the overlapping edge to the side wall of the frame body, thereby increasing the connection area between the support frame and the cover plate and enhancing the connection strength between the support frame and the cover plate.

[0030] In a possible implementation, the cover plate includes a plate body, and at least a portion of an outer edge of the plate body extends out a side edge, and the side edge is attached to the side wall.

[0031] By providing side edges on at least part of the outer edge of the plate body, the edge of the plate body of the cover plate is attached to the overlapping edge of the frame body, and the side edge of the cover plate is attached to the side wall of the frame body. The edge of the plate body of the cover plate and the side edge of the cover plate can be connected to the overlapping edge of the frame and the side wall of the frame respectively, thereby increasing the connection area between the cover plate and the support frame and improving the connection strength between the cover plate and the support frame.

[0032] In a second aspect, the present application provides a circuit board assembly, including a circuit board and the shielding cover as described above, wherein a plurality of components are arranged on one surface of the circuit board, and the shielding cover is provided on the outside of at least some of the components.

[0033] The circuit board assembly provided by the present application includes a circuit board and a shielding cover, wherein a plurality of components are arranged on the component surface of the circuit board, and the shielding cover includes a cover body, wherein the cover body and the component surface of the circuit board together form a shielding area, and at least some of the components on the circuit board are shielded inside the cover body. The components located inside the cover body include a first component, wherein the first component has a step surface facing the cover body, and an available space is formed between the step surface of the first component and the area on the cover body facing the step surface. By providing a reinforcement part in the area corresponding to the step surface of the first component on the cover body, at least part of the structure of the reinforcement part is located in the area on the cover body facing the step surface, the available space formed above the step surface of the first component is utilized, and the reinforcement part is added to increase the strength of the cover body, so as to avoid the collapse of the surrounding area of ​​the corresponding step surface on the cover body, and improve the stability and reliability of the shielding cover. In addition, the spacing between the first component and the adjacent components can remain unchanged, or the increase in the spacing between the first component and the adjacent components is reduced, so that the circuit board maintains a densely arranged layout structure, saves the component layout area of ​​the circuit board, and improves the space utilization rate of the circuit board.

[0034] In a third aspect, the present application provides an electronic device comprising at least one circuit board assembly as described above.

[0035] The electronic device provided by the present application includes a circuit board assembly, the circuit board assembly includes a circuit board and a shielding cover, a plurality of components are arranged on the component surface of the circuit board, the shielding cover includes a cover body, the cover body and the component surface of the circuit board together form a shielding area, and at least part of the components on the circuit board are covered therein. The components located inside the cover body include a first component, the first component has a step surface facing the cover body, and a usable space is formed between the step surface of the first component and the area on the cover body facing the step surface. By providing a reinforcement part in the area corresponding to the step surface of the first component on the cover body, at least part of the structure of the reinforcement part is located in the area on the cover body facing the step surface, the usable space formed above the step surface of the first component is utilized, and the reinforcement part is added to increase the strength of the cover body, avoid the collapse of the surrounding area of ​​the corresponding step surface on the cover body, and improve the stability and reliability of the shielding cover. In addition, the spacing between the first component and the adjacent components can remain unchanged, or the increase in the spacing between the first component and the adjacent components is reduced, so that the circuit board maintains a densely arranged layout structure, saves the component layout area of ​​the circuit board, and improves the space utilization rate of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a structural schematic diagram of a shielding cover provided on a circuit board in the related art;

[0037] Figure 2 It is a schematic diagram of another structure of setting a shielding cover on a circuit board in the related art;

[0038] Figure 3 A schematic diagram of the structure of a circuit board assembly provided in an embodiment of the present application;

[0039] Figure 4 for Figure 3 Exploded diagram of

[0040] Figure 5 A schematic diagram of the structure of a circuit board provided in an embodiment of the present application;

[0041] Figure 6 A schematic diagram of the structure of the shielding cover provided in the embodiment of the present application;

[0042] Figure 7 An exploded view of a circuit board assembly provided in an embodiment of the present application;

[0043] Figure 8 A schematic diagram of the structure of the support frame provided in the embodiment of the present application;

[0044] Fig. 9 A schematic diagram of the structure of the support frame provided in the embodiment of the present application being assembled on a circuit board;

[0045] Fig.10 for Figure 3 Schematic diagram of the local cross section at AA in the middle;

[0046] Fig.11 A schematic diagram of the structure of another circuit board assembly provided in an embodiment of the present application.

[0047] Description of reference numerals:

[0048] 100-circuit board assembly;

[0049] 1-shielding cover; 2-circuit board; 3-components;

[0050] 101-support frame; 1011-support beam; 102-shielding cover; 301-first component; 302-second component;

[0051] 10- housing; 10a- reinforcement portion; 11- support frame; 12- cover plate; 21- component surface; 22- positioning hole; 31- first device;

[0052] 111-frame; 112-support plate; 121-plate body; 122-side edge; 311-step surface;

[0053] 1111-side wall; 1112-fixed edge; 1113-lap edge; 1121-support portion; 1211-recessed portion; 1221-protrusion;

[0054] 1111a - pit; 1112a - mounting hole. DETAILED DESCRIPTION

[0055] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0056] In order to improve the sensitivity and anti-interference performance of electronic devices, especially portable mobile electronic devices, it is usually necessary to use a shielding cover to shield sensitive signals or interference sources. The shielding cover can shield the influence of external electromagnetic waves on the circuit inside the shielding cover, and can also prevent the electromagnetic waves generated inside the shielding cover from radiating outward.

[0057] Taking a mobile phone as an example, a shielding cover is usually provided on the circuit board inside the mobile phone. The shielding cover covers the components on the circuit board, thereby preventing the components inside the shielding cover from interfering with other components in the mobile phone.

[0058] Figure 1 It is a structural schematic diagram of a shielding cover provided on a circuit board in the related art; Figure 2 The figure is a schematic diagram of another structure of setting a shielding cover on a circuit board in the related art.

[0059] Reference Figure 1 and Figure 2 As shown, the shielding cover 1 generally includes a support frame 101 and a shielding cover 102. The support frame 101 is fixed on the circuit board 2. The support frame 101 is generally an annular frame, surrounding the periphery of the components 3 on the circuit board 2. The support frame 101 forms a supporting base, and the shielding cover 102 is connected to the outside of the support frame 101. The shielding cover 102 and the support frame 101 form a complete surrounding structure, which completely covers the components 3 located in the surrounding area of ​​the support frame 101.

[0060] In actual applications, there are situations where there are more components 3 arranged on the circuit board 2. In this case, there are more components 3 contained in the shielding cover 1, and the span of the shielding cover 102 is larger. It is difficult to support the entire shielding cover 102 only by relying on the support frame 101 located at the outer edge of the enclosed area. This may cause deformation and collapse of local areas of the shielding cover 102. For example, the central area of ​​the shielding cover 102 collapses toward the circuit board 2, reducing the stability of the shielding cover 1. If the cover body contacts the components 3 inside, it may also affect the performance of the shielding cover 1 and the working performance of the components 3.

[0061] Therefore, in the shielding cover 1 with a larger span, the support frame 101 is usually connected to a support beam 1011, the support beam 1011 is located in the opening area of ​​the support frame 101, and the support beam 1011 is supported below the shielding cover 102. The support beam 1011 supports the shielding cover 102, thereby improving the stability of the shielding cover 102 to prevent the shielding cover 102 from partial collapse. Among them, multiple support beams 1011 can be connected to the support frame 101, and the multiple support beams 1011 can be distributed in different parts, so that different parts of the shielding cover 102 can be supported by the multiple support beams 1011 to ensure the stability of the shielding cover 102 with a large span.

[0062] However, for a circuit board 2 with a large number of components 3 arranged thereon, there will be a component 3 densely arranged area (hereinafter referred to as a densely arranged area) where the components 3 are densely piled and the layout space is compact. Since there are a large number of components 3 in the densely arranged area and the layout is compact, especially when the height space in the shielding cover 1 is limited, it is often difficult to set the support beam 1011 in the area, and the area corresponding to the shielding cover 102 cannot be effectively supported.

[0063] Reference Figure 1 As shown, Figure 1 FIG. 1 shows a schematic diagram of the structure of a shielding cover 1 in a densely arranged area in the related art. Figure 1 Taking the adjacent first component 301 and second component 302 shown in FIG as an example, the spacing between the first component 301 and the second component 302 is small, and the thickness of the first component 301 is large, and the first component 301 occupies more height space, resulting in a small gap between the first component 301 and the shielding cover 1. Therefore, in order to maintain a dense arrangement in this area and ensure the compactness of the layout of the components 3 on the circuit board 2, the support beam 1011 is usually not provided in the space between the first component 301 and the second component 302.

[0064] Reference Figure 2 As shown, Figure 2 A schematic diagram of the structure of another shielding cover 1 in a densely arranged area in the related art is shown. In order to erect a support beam 1011 between the first component 301 and the second component 302, the distance between the first component 301 and the second component 302 is increased, and a space for the support beam 1011 is reserved between the first component 301 and the second component 302. The support beam 1011 on the support frame 101 is arranged in the space between the first component 301 and the second component 302. The support beam 1011 supports the portion of the shielding cover 102 located between the first component 301 and the second component 302.

[0065] However, if Figure 1As shown, the spacing between the first component 301 and the second component 302 is maintained, and the layout of the circuit board 2 is kept compact. However, since no support beam 1011 is provided in the densely arranged area, the area of ​​the shielding cover 102 located in the densely arranged area is prone to deformation and collapse, and the stability of the shielding cover 102 is poor, which affects the reliability of the shielding cover 1 and will affect the performance of the shielding cover 1 and the working performance of the components 3 inside the shielding cover 1.

[0066] like Figure 2 As shown, sufficient space is reserved between the first component 301 and the second component 302, and a support beam 1011 is arranged in the space. The support beam 1011 supports the shielding cover 102, thereby enhancing the stability of the shielding cover 102, preventing the shielding cover 102 from partial collapse, and ensuring the reliability of the shielding cover 1. However, since the spacing between the first component 301 and the second component 302 is increased, the layout area of ​​the component 3 is increased, resulting in a waste of the layout area of ​​the circuit board 2, and reducing the layout utilization rate of the circuit board 2; in addition, since the layout area of ​​the component 3 is increased, the area covered by the shielding cover 1 is increased, which will increase the volume of the shielding cover 1, the shielding cover 1 occupies a large space, has a high cost, and correspondingly reduces the layout space of other components in the electronic device, affecting the reasonable layout in the electronic device.

[0067] To this end, an embodiment of the present application provides an electronic device, which may be a mobile terminal device such as a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), a smart wearable device, a point of sales (POS), etc., or the electronic device may be a fixed terminal device such as a smart TV, a server, a switch, etc., which is not limited in this embodiment.

[0068] Figure 3 A schematic diagram of the structure of a circuit board assembly provided in an embodiment of the present application; Figure 4 for Figure 3 Exploded diagram.

[0069] Reference Figure 3 As shown, a circuit board assembly 100 is provided in an electronic device such as a mobile phone. The circuit board assembly 100 includes a circuit board 2 and a shielding cover 1 .

[0070] Reference Figure 4As shown, a plurality of components 3 are arranged on the circuit board 2, and all the components 3 can be arranged on the same side surface of the circuit board 2. Among them, the side surface of the circuit board 2 on which the components 3 are arranged can be defined as the component surface 21 of the circuit board 2, and the circuit board 2 can be fixedly installed in the electronic device through its other side surface. Taking a printed circuit board 2 (PCB) as an example, one side surface of the PCB is the component surface 21 on which the components 3 are arranged, and the other side surface of the PCB is usually used to place printed conductors and perform welding, and this side surface can be called a printed surface.

[0071] Alternatively, components 3 may be arranged on both side surfaces of the circuit board 2, so that both side surfaces of the circuit board 2 serve as component surfaces 21. This embodiment does not limit this.

[0072] Exemplarily, the circuit board 2 can be a mainboard in a mobile phone, and chips such as a central processing unit (CPU), a double data rate memory (DDR), an electrically erasable programmable read-only memory (EEPROM), and a power manager are arranged on the circuit board 2. Capacitors, resistors, connectors and other components 3 can also be arranged on the circuit board 2.

[0073] Continue to refer to Figure 4 As shown, the shielding cover 1 is arranged on the component surface 21 of the circuit board 2, and the shielding cover 1 covers at least part of the components 3 on the component surface 21 of the circuit board 2, so as to prevent the components 3 in the shielding cover 1 from causing electromagnetic interference to other external components, and also to prevent other components outside the shielding cover 1 from affecting the performance of the components 3 in the shielding cover 1. In addition, the shielding cover 1 forms a protective barrier for the components 3 inside it, so as to prevent other external components from affecting the stability of the components 3 in the shielding cover 1.

[0074] Exemplarily, all components 3 on the component surface 21 of the circuit board 2 may be located inside the shielding cover 1. A shielding cover 1 may be provided on the component surface 21 of the circuit board 2, and the shielding cover 1 covers all components 3 therein; or, in case that the area where components 3 are arranged on the component surface 21 of the circuit board 2 is large and there are many components 3 arranged therein, a plurality of shielding covers 1 may be provided on the circuit board 2 in different regions, and each shielding cover 1 covers the components 3 in each region therein.

[0075] The circuit board 2 is introduced in detail below.

[0076] Figure 5 A schematic diagram of the structure of a circuit board provided in an embodiment of the present application. Figure 5 As shown, in actual applications, in order to effectively utilize the layout space on the circuit board 2 and improve the layout utilization rate of the circuit board 2, some chips will be stacked on the circuit board 2 using a stacking process. For example, these chips are stacked on the component surface 21 of the circuit board 2 along the thickness direction and are arranged on the circuit board 2 in the form of a stacked chipset. For some larger chips, at least two chips are usually stacked as a stacked chipset to save the space occupied by the chips. In addition, the impedance of the circuit can also be reduced.

[0077] For example, taking the CPU chip and the DDR chip as an example, since the sizes of the DDR chip and the CPU chip are relatively large, and the planar size of the DDR chip is usually smaller than the planar size of the CPU chip, in the layout design of the circuit board 2, the DDR chip is usually stacked on the CPU chip to form a stacked chipset.

[0078] By stacking the DDR chip and the CPU chip, on the one hand, the DDR chip is located in the coverage area of ​​the CPU chip on the circuit board 2, and the DDR chip does not occupy additional board area of ​​the circuit board 2, which can save board space of the circuit board 2 and improve the board utilization rate of the circuit board 2; on the other hand, the length of the wire connecting the DDR chip and the CPU chip is shortened, which not only saves the space occupied by the wire, but also reduces the impedance of the circuit formed between the DDR chip and the CPU chip.

[0079] It can be understood that if the DDR chip and the CPU chip are arranged side by side on the circuit board 2, when the DDR chip and the CPU chip are connected by wires, the DDR chip and the CPU chip can be connected by wires between the two sides that are opposite and close to each other, and the DDR chip and the CPU chip can be connected by wires between the two sides that are far away from each other; or, the DDR chip and the CPU chip are connected between the two sides located in the same orientation; or, the DDR chip and the CPU chip are connected in other ways.

[0080] Obviously, when the DDR chip and the CPU chip are placed side by side and connected by wires, a longer wire is needed to connect them, and thus the impedance generated in the circuit formed between the two is also larger. In this regard, by stacking the DDR chip on the CPU chip, the DDR chip and the CPU chip can be connected by wires on the same side in the thickness direction, which greatly shortens the length of the wire connecting the DDR chip and the CPU chip, and can effectively reduce the impedance of the circuit formed between the DDR chip and the CPU chip.

[0081] In the layout design of the components 3 on the circuit board 2, in addition to the stacking arrangement of the DDR chip and the CPU chip, other chips can also be stacked to form a stacked chipset, for example, the EEPROM chip and the CPU chip are stacked, the EEPROM chip and the DDR chip are stacked, or the EEPROM chip, the DDR chip and the CPU chip are stacked together, and this embodiment does not impose any specific restrictions on this. Among them, similar to the aforementioned stacking arrangement of the DDR chip and the CPU chip, by stacking different chips together, the layout space of the circuit board 2 can be saved, the layout utilization rate of the circuit board 2 can be improved, and the impedance of the circuit can also be reduced, which will not be repeated.

[0082] In specific applications, chips with smaller planar dimensions are usually stacked on chips with larger planar dimensions to ensure the stability of the stacked chips and facilitate fixing the upper chip on the lower chip. In this way, in the stacked chip set, a step surface 311 is formed between the chip located at the upper layer and the chip located at the lower layer. Since the planar dimensions of the chip at the upper layer are smaller, the step surface 311 is a partial surface of the lower chip that is exposed to the outside of the upper chip, and the step surface 311 faces away from the component surface 21 of the circuit board 2.

[0083] In addition, in some other scenarios, some components 3 with special shapes are arranged on the circuit board 2. For example, the outer contour of the component 3 with special shapes can be similar to the outer contour of the aforementioned stacked chipset, that is, the component 3 with special shapes has a width difference between the upper and lower parts in the thickness direction, and the upper part of the component 3 has a small width and the lower part has a large width. For example, in the side view direction of the component surface 21 of the circuit board 2, the outer contour of the component 3 with special shapes is in the shape of a "convex" character, that is, the longitudinal cross-section of the component 3 with special shapes is in the shape of a "convex" character. Similar to the stacked chipset, the component 3 with special shapes has a step surface 311, and the direction of the step surface 311 is away from the component surface 21 of the circuit board 2.

[0084] Exemplarily, the component 3 with a special shape may be a capacitor, a resistor, a connector or other circuit components 3 .

[0085] For the convenience of description, in this embodiment, the stacked chipset and the component 3 having a special shape are collectively referred to as a first component 31, that is, Figure 3 The longitudinal cross-section of the first device 31 is in a "convex" shape, or both sides of the outer contour of the first device 31 have multi-level stepped surfaces 311 that gradually expand outward toward the component surface 21 of the circuit board 2. For example, the first device 31 is a stacked chip set with at least three layers of chips stacked. In this way, the first device 31 has a stepped surface 311 that is away from the component surface 21 of the circuit board 2.

[0086] It can be understood that among the numerous components 3 arranged on the circuit board 2 , there is at least one group of the above-mentioned stacked chip group or components 3 with special shapes, that is, there is at least one first device 31 on the circuit board 2 .

[0087] Reference Figure 4 As shown, as a specific implementation, the first device 31 is, for example, a component 3 with a relatively large plane size. Exemplarily, the first device 31 is the aforementioned stacked chipset consisting of a CPU chip and a DDR chip; or, the first device 31 is the aforementioned component 3 with a relatively large plane size and a "convex" shape in longitudinal section. On the component surface 21 of the circuit board 2, a plurality of other components 3 are arranged on the side of the first device 31, such as Figure 3 As shown in FIG. 1 , a plurality of components 3 with smaller sizes are arranged in rows or columns at intervals on one side of the first device 31 .

[0088] In other scenarios, other components 3 with larger planar dimensions may also be arranged on the side of the first device 31 with larger planar dimensions. In this embodiment, there is no specific restriction on the shape, size and layout of the components 3 arranged adjacent to the first device 31. For example, a plurality of chips with smaller planar dimensions may be arranged at intervals on the adjacent side of the first device 31, which may include a stacked chipset; or a single-layer chip with larger planar dimensions may be arranged on the adjacent side of the first device 31, or a stacked chipset with larger planar dimensions may be arranged on the adjacent side of the first device 31.

[0089] In order to rationalize the arrangement structure of the components 3 on the component surface 21 of the circuit board 2 and efficiently utilize the layout area of ​​the circuit board 2, refer to Figure 3 As shown, multiple components 3 on the side of the first device 31 are closely arranged with the first device 31, and the interval between the first device 31 and the adjacent components 3 is small. For components 3 with larger plane dimensions on the side of the first device 31, the interval between the components 3 with larger plane dimensions and the first device 31 is small.

[0090] Combination Figure 4As shown, in view of the situation that there are many components 3 arranged on the circuit board 2, the arranged components 3 include the above-mentioned first component 31, and the first component 31 and the components 3 around it are arranged compactly, and the layout space on the circuit board 2 is tight, especially for the first component 31 with a large plane size, this embodiment designs the shielding cover 1, utilizes the space between the step surface 311 of the first component 31 and the shielding cover 1, and sets a reinforcing part 10a on the shielding cover 1 to increase the strength of the shielding cover 1, avoid the phenomenon of partial collapse of the shielding cover 1, and improve the reliability of the shielding cover 1. In addition, the spacing between the first component 31 and the components 3 on its side can remain unchanged, or the increase in the spacing between the first component 31 and the components 3 on its side is reduced, which can maintain the close arrangement layout of the components 3, save the layout space of the circuit board 2, reduce the area of ​​the layout components 3, and improve the space utilization rate of the circuit board 2.

[0091] The shielding cover 1 is described in detail below in conjunction with the circuit board 2 .

[0092] Figure 6 A schematic diagram of the structure of the shielding cover provided in the embodiment of the present application; Figure 7 An exploded view of a circuit board assembly provided in an embodiment of the present application; Figure 8 A schematic diagram of the structure of the support frame provided in the embodiment of the present application; Fig. 9 A schematic diagram of the structure of the support frame provided in an embodiment of the present application assembled on a circuit board.

[0093] Combination Figure 4 As shown, the shielding cover 1 includes a cover body 10, which is arranged on the component surface 21 of the circuit board 2. The cover body 10 is a semi-enclosed structure, and the side of the cover body 10 facing the component surface 21 of the circuit board 2 is open. The cover body 10 is arranged on the component surface 21 of the circuit board 2, and a shielding area is enclosed between the cover body 10 and the component surface 21 of the circuit board 2. The cover body 10 is a metal part, so that the shielding cover 1 has the function of shielding signals. For example, the material for making the cover body 10 can be nickel silver or iron.

[0094] As a specific implementation method, Figure 4 The cover 10 shown in the figure has an outer contour that matches the outer contour of the circuit board 2. For example, the edge of the cover 10 may be flush with the edge of the circuit board 2, and the cover 10 covers all components 3 on the component surface 21 of the circuit board 2. In other embodiments, the cover 10 may only cover some of the components 3 on the circuit board 2. For example, the cover 10 covers the first component 31 and some of the components 3 closely arranged around the first component 31.

[0095] In the case where the thickness of the first device 31 is relatively large, for example, the first device 31 is the above-mentioned stacked chip group, after multiple chips are stacked, the thickness of the first device 31 is increased, and the vertical distance between the surface of the first device 31 and the cover 10 is very small. There is usually not enough space to set up a support structure in the area between the surface of the first device 31 and the cover 10, resulting in low strength of this part of the cover 10. In addition, since other components 3 are closely arranged around the first device 31, the space in this area of ​​the cover 10 is relatively tight, and it is difficult to set up a support structure. The area of ​​the cover 10 suspended is relatively large, and the stability is poor.

[0096] For the first device 31 with a larger plane size, the area of ​​the cover body 10 directly opposite the first device 31 is larger. In addition, the other components 3 arranged around the first device 31 have a larger densely arranged area on the circuit board 2, and the area where the cover body 10 is suspended is correspondingly increased. The cover body 10 is prone to collapse in this area, and the reliability of the cover body 10 is reduced.

[0097] It should be understood that the surface of the first device 31 refers to the surface of the first device 31 exposed on the component surface 21 of the circuit board 2, and the vertical distance between the surface of the first device 31 and the cover body 10 refers to the distance between the surface of the first device 31 and the area of ​​the cover body 10 facing the first device 31 in the thickness direction of the circuit board 2.

[0098] In order to improve the reliability of the cover body 10 and prevent the cover body 10 from partially collapsing, in the embodiment of the present application, a reinforcing portion 10a (not shown in the figure) is provided on the cover body 10 by utilizing the space between the step surface 311 of the first device 31 and the area on the cover body 10 facing the step surface 311, and at least part of the structure of the reinforcing portion 10a on the cover body 10 is located in the area on the cover body 10 facing the step surface 311 of the first device 31. The reinforcing portion 10a on the cover body 10 increases the strength of the cover body 10 in the densely arranged area, improves the stability of the cover body 10, prevents the cover body 10 from partially collapsing, and ensures the reliability of the cover body 10.

[0099] For ease of description, the space between the step surface 311 of the first device 31 and the step surface 311 on the cover body 10 facing it is defined as the available space below. By setting the reinforcing portion 10a in the area corresponding to the available space on the cover body 10, the reinforcing portion 10a increases the strength of the cover body 10, and the reliability of the cover body 10 is guaranteed by the reinforcing portion 10a. In addition, since the reinforcing portion 10a utilizes the available space between the step surface 311 of the first device 31 and the cover body 10, there is no need to increase the spacing between the first device 31 and the adjacent components 3, or reduce the increase in the spacing between the first device 31 and the adjacent components 3, so that the components 3 on the circuit board 2 maintain a densely arranged layout structure, saving the layout area of ​​the components 3 of the circuit board 2 and improving the space utilization rate of the circuit board 2.

[0100] As an implementation, the reinforcing portion 10a may be completely located in the available space above the step surface 311 of the first device 31. As another implementation, a portion of the reinforcing portion 10a may be located in the available space above the step surface 311 of the first device 31, and another portion of the reinforcing portion 10a may be located in the gap between the first device 31 and the component 3 adjacent thereto.

[0101] Reference Figure 6 As shown, the cover body 10 may include a support frame 11 and a cover plate 12. The support frame 11 may be a frame structure. The cover plate 12 is covered on the outside of the support frame 11. The support frame 11 supports the cover plate 12. The cover plate 12 mainly serves as a covering structure. The cover plate 12 and the support frame together constitute the cover body 10. Figure 7 As shown, the support frame 11 is fixed on the component surface 21 of the circuit board 2, and the support frame 11 encloses the components 3 on the circuit board 2 inside thereof. The cover plate 12 is covered on the outside of the support frame 11, and the cover plate 12, the support frame 11 and the component surface 21 of the circuit board 2 together form a shielding area, shielding the components 3 inside the cover body 10.

[0102] In practical applications, the support frame 11 can be welded on the component surface 21 of the circuit board 2 to provide a connection basis for the cover plate 12, and the cover plate 12 can be bonded or welded to the support frame 11. Exemplarily, since the support frame 11 is a frame structure, the bonding area is limited, and the support frame 11 and the cover plate 12 are both metal parts, the cover plate 12 and the support frame 11 can be welded to ensure that the cover plate 12 and the support frame 11 are firmly connected.

[0103] Reference Figure 8As shown, the support frame 11 includes a frame 111, which is arranged around the periphery of the shielding area. The frame 111 serves as the main structure of the support frame 11 and defines the size of the support frame 11. The shape and size of the cover 12 can match the shape and size of the frame 111. The edge of the cover 12 is connected to the frame 111. For example, the edge of the cover 12 is welded to the frame 111.

[0104] Specifically, the frame 111 of the support frame 11 may include a side wall 1111, a fixed edge 1112 and a lap edge 1113. The support frame 11 may be an integrally formed part, that is, the side wall 1111, the fixed edge 1112 and the lap edge 1113 of the frame 111 are an integral structure. Exemplarily, the side wall 1111, the fixed edge 1112 and the lap edge 1113 of the frame 111 may be formed by a stamping process.

[0105] Reference Fig. 9 As shown, the side walls 1111 of the frame 111 are supported on the circuit board 2, and the side walls 1111 of the frame 111 constitute the structural basis of the support frame 11. The extension direction of the side walls 1111 of the frame 111 is inclined to the plane where the component surface 21 of the circuit board 2 is located. For example, the side walls 1111 of the frame 111 extend in a direction perpendicular to the component surface 21 of the circuit board 2, so that the support frame 11 has a certain height on the circuit board 2, so that a shielding space is formed between the cover plate 12 covered on the outside of the support frame 11 and the component surface 21 of the circuit board 2, so that the components 3 can be wrapped in the shielding cover 1.

[0106] Among them, taking the side wall 1111 of the frame 111 as an example, which is perpendicular to the component surface 21 of the circuit board 2, the height of the side wall 1111 of the support frame 11 should be greater than the thickest component 3 in the shielding cover 1, so that there is a certain gap between the cover plate 12 and the thickest component 3 to prevent the shielding cover 1 and the component 3 from contacting each other, so as not to affect the performance of the shielding cover 1 and the component 3.

[0107] The fixed edge 1112 of the frame 111 is located at one end of the side wall 1111 facing the component surface 21 of the circuit board 2, and the fixed edge 1112 extends along the component surface 21 of the circuit board 2. The fixed edge 1112 is attached to the component surface 21 of the circuit board 2. The fixed edge 1112 can increase the contact area between the support frame 11 and the circuit board 2, and improve the stability of the support frame 11. The support frame 11 is installed on the circuit board 2 through the fixed edge 1112. For example, the fixed edge 1112 of the frame 111 is welded on the component surface 21 of the circuit board 2. The welding area between the fixed edge 1112 and the circuit board 2 is large, which can ensure that the support frame 11 is welded firmly.

[0108] In addition, combined Figure 7As shown, on the basis of welding connection between the fixed edge 1112 of the frame 111 and the component surface 21 of the circuit board 2, a mounting hole 1112a can be further provided on the fixed edge 1112 of the frame 111, and a positioning hole 22 can be provided at a position on the circuit board 2 corresponding to the mounting hole 1112a of the frame 111, and screws, rivets and other connectors can be inserted into the mounting hole 1112a of the frame 111 and the positioning hole 22 of the circuit board 2, and the support frame 11 is locked on the circuit board 2 through the connector. Alternatively, the support frame 11 and the circuit board 2 are fixedly connected only through the connector.

[0109] The overlapping edge 1113 of the frame 111 is located at one end of the side wall 1111 facing the cover plate 12, and the surface of the cover plate 12 facing the component surface 21 of the circuit board 2 is defined as the inner surface of the cover plate 12. The overlapping edge 1113 extends along the inner surface of the cover plate 12, and the overlapping edge 1113 is attached to the inner surface of the cover plate 12. Similar to the fixed edge 1112 of the frame 111, by providing the overlapping edge 1113 attached to the inner surface of the cover plate 12 on the support frame 11, the contact area between the support frame 11 and the cover plate 12 can be increased, and the overlapping edge 1113 of the frame 111 and the inner surface of the cover plate 12 can be welded together to ensure that the support frame 11 and the cover plate 12 are firmly welded.

[0110] Exemplarily, taking the case where the side wall 1111 of the frame 111 is vertically supported on the component surface 21 of the circuit board 2 , the fixed edge 1112 and the overlapping edge 1113 located at both ends of the side wall 1111 of the frame 111 can be perpendicular to the side wall 1111 .

[0111] Continue to refer to Fig. 9 As shown, the fixed edge 1112 attached to the component surface 21 of the circuit board 2 can be located outside the area enclosed by the side wall 1111, and the fixed edge 1112 does not occupy the space in the area enclosed by the side wall 1111. The side wall 1111 can be arranged close to the peripheral components 3 inside it. On the premise that all the components 3 that need to be protected are enclosed, the spatial volume of the support frame 11 can be reduced, the size of the shielding frame can be reduced, and the space occupied by the circuit board assembly 100 can be reduced, thereby reserving a larger layout space for other components in the electronic device.

[0112] The overlap edge 1113 located at one end of the side wall 1111 facing the cover plate 12 can be located on the inner side of the area surrounded by the side wall 1111, so as to prevent the overlap edge 1113 from occupying the extra space outside the side wall 1111, reduce the space occupied by the support frame 11, reduce the space occupied by the shielding frame, and thus reduce the space occupied by the circuit board assembly 100, which is beneficial to the layout design of other components in the electronic device. In addition, the overlap edge 1113 extending to the inner side of the side wall 1111 matches the orientation of the cover plate 12 wrapping the support frame 11, and the area of ​​the side wall 1111 can be used to increase the connection area between the support frame 11 and the cover plate 12, thereby enhancing the connection strength between the support frame 11 and the cover plate 12.

[0113] In order to increase the connection area between the cover plate 12 and the frame 111, Figure 7 As shown, the edge of the cover plate 12 can extend along the overlapping edge 1113 of the frame 111 to fit the side wall 1111 of the frame 111 to increase the contact area between the cover plate 12 and the support frame 11. The overlapping edge 1113 and the side wall 1111 of the cover plate 12 and the frame 111 are all connected, which can increase the connection strength between the cover plate 12 and the support frame 11.

[0114] Among them, the cover plate 12 includes a plate body 121 and a side edge 122. The plate body 121 is parallel to the component surface 21 of the circuit board 2 as a whole. The side edge 122 is located at the outer edge of the plate body 121. The side edge 122 is in contact with the side wall 1111 of the frame body 111. The edge of the plate body 121 of the cover plate 12 is in contact with the overlapping edge 1113 of the frame body 111. The side edge 122 of the cover plate 12 and the edge of the plate body 121 are respectively connected to the side wall 1111 and the overlapping edge 1113 of the frame body 111 to ensure that the cover plate 12 is firmly connected to the support frame 11.

[0115] In addition, in order to improve the connection strength between the support frame 11 and the cover plate 12, a concave-convex structure that cooperates with each other can also be provided between the support frame 11 and the cover plate 12. Figure 7 As shown, a protrusion 1221 protruding toward the side wall 1111 of the support frame 11 is provided on the side edge 122 of the cover plate 12, and a recess 1111a is provided on the side wall 1111 of the support frame 11. After the cover plate 12 is assembled onto the support frame 11, the protrusion 1221 on the cover plate 12 sinks into the recess 1111a on the support frame 11. Through the mutual limiting action between the protrusion 1221 on the cover plate 12 and the recess 1111a on the support frame 11, the cover plate 12 can be firmly installed on the support frame 11.

[0116] The pit 1111a on the support frame 11 may be a recessed area, and the protrusion 1221 and the pit 1111a may increase the contact area between the cover plate 12 and the support frame 11, increase the welding area between the cover plate 12 and the support frame 11, and increase the welding strength between the two. Alternatively, the pit 1111a on the support frame 11 may be a through hole, and the protrusion 1221 on the cover plate 12 is inserted into the through hole on the support frame 11.

[0117] It can be understood that the support frame 11 has a protrusion facing the cover surface 12, and the cover plate 12 has a recessed area facing the support frame 11. The positions of the protrusion and the recessed area are relative to each other, and the cover plate can be limited when installed on the support frame to increase the installation strength.

[0118] Among them, refer to Figure 7 As shown, since the support frame 11 is a frame structure, the cover plate 12 matches the shape of the frame body 111 of the support frame 11, and the edge of the plate body 121 of the cover plate 12 has a corner with a sudden change in the extension direction. Taking the cover plate 12 made by a stamping process as an example, in order to facilitate the molding of the cover plate 12, the side edge 122 can be set only in the straight section area on the outer edge of the plate body 121, and the side edge 122 is not set at the corner of the plate body 121.

[0119] Since the plate body 121 of the cover plate 12 covers the entire area of ​​the frame body 111 of the support frame 11, the plate body 121 of the cover plate 12 has a large area, and the cover plate 12 is usually thin and has limited rigidity. Due to its own weight, the area away from the edge of the cover plate 12 is prone to collapse. Figure 8 As shown, the support frame 11 is usually further provided with a support plate 112, which is located on the inner side of the frame 111 of the support frame 11, and at least one of the two ends of the support plate 112 is connected to the overlapping edge 1113 of the frame 111, and the support plate 112 and the overlapping edge 1113 are in the same plane, and the support plate 112 is attached to the inner surface of the cover plate 12 to support the cover plate 12, prevent local areas of the cover plate 12 from collapsing, and improve the stability of the cover plate 12.

[0120] According to the actual size of the shielding cover 1, a support plate 112 may be provided on the support frame 11, for example, the support plate 112 is located in the central area of ​​the cover plate 12 to support both sides of the cover plate 12 stably, so that the two side areas of the cover plate 12 remain level; or, for a shielding cover 1 with a larger size, a plurality of support plates 112 may be provided at intervals inside the frame 111 of the support frame 11, and the plurality of support plates 112 may be provided in different areas of the cover plate 12 accordingly. This embodiment does not limit this.

[0121] Exemplarily, the support plate 112 may be located in an area where the arrangement density of the components 3 is relatively low, and the gaps between the components 3 in this area are relatively large, which facilitates the arrangement of the support plate 112, wherein the support plate 112 may be located in the gaps between adjacent components 3. Furthermore, the support plate 112 may be arranged in an area where the cover plate 12 is prone to collapse, so that the support plate 112 can play an effective supporting role.

[0122] The present embodiment does not limit the specific shape and size of the support plate 112 on the support frame 11. Taking the example that both ends of the support plate 112 are connected to the overlap edge 1113 of the frame 111, the support plate 112 can be a flat plate structure. Fig. 9 Taking the support plate 112 with one end connected to the overlapping edge 1113 of the frame 111 as an example, the other end of the support plate 112 can form a support portion 1121 bent toward the component surface 21 of the circuit board 2, and the support portion 1121 is arranged on the component surface 21 of the circuit board 2. The support portion 1121 can be located in the gap between two adjacent components 3, for example.

[0123] Reference Fig. 9 As shown, as an implementation method of setting a reinforcement portion 10a on the cover body 10, the reinforcement portion 10a on the cover body 10 can be a support plate 112 set on the support frame 11, that is, the support frame 11 has a support plate 112 located in the available space above the step surface 311 of the first device 31, and by setting the support plate 112 at a position on the support frame 11 corresponding to the step surface 311 of the first device 31, the available space between the step surface 311 of the first device 31 and the cover plate 12 is effectively utilized. The support plate 112 set at this position is supported under the cover plate 12. The support force of the support plate 112 on the cover plate 12 can prevent the cover plate 12 from collapsing, thereby improving the stability of the cover plate 12 and enhancing the reliability of the shielding cover 1.

[0124] As mentioned above, combined with Figure 7 As shown, for the first device 31 with a larger plane size, due to the small gap between the surface of the first device 31 and the cover plate 12, the support plate 112 cannot be set in the area where the surface of the first device 31 is located. By setting the support plate 112 in the available space between the step surface 311 at the edge of the first device 31 and the cover plate 12, the supporting force of the support plate 112 on the corresponding part of the cover plate 12 can be diffused to the surrounding area of ​​the cover plate 12, so that the surrounding area of ​​the cover plate 12 supported by the support plate 112 will not collapse, thereby improving the stability of the area of ​​the cover plate 12 corresponding to the surface of the first device 31, and avoiding the collapse of the local area on the cover plate 12 located above the first device 31 and affecting the performance of the first device 31.

[0125] The support plate 112 serves as a reinforcement portion 10a, and at least part of its structure is located in the available space formed between the step surface 311 of the first device 31 and the cover plate 12. Taking the first device 31 as a stacked chip group as an example, the support plate 112 is located above the step surface 311 formed between the lower chip and the upper chip in the stacked chip group, that is, the support plate 112 is located above the lower chip, and the support plate 112 is located to the side of the topmost chip; taking the first device 31 as a "convex"-shaped component 3 as an example, the support plate 112 is located above the step surface 311 of the component 3, and the support plate 112 is located to the side of the smaller upper part of the component 3.

[0126] Continue to refer to Fig. 9 As shown, in order to avoid interference between the support plate 112 and the first device 31, in the extension direction of the board surface of the circuit board 2, there is a gap between the support plate 112 and the surface of the first device 31 close to the cover body 10, that is, there is a gap between the support plate 112 located on the side of the topmost chip in the stacked chip group and the edge of the topmost chip, or there is a gap between the support plate 112 located on the side of the upper part of the smaller size of the "convex"-shaped component 3 and the edge of the upper part of the component 3. In this way, it is convenient to assemble the support frame 11 on the circuit board 2, and the support plate 112 and the first device 31 at the part of the support frame 11 corresponding to the step surface 311 of the first device 31 have no influence on each other, and the support plate 112 at this part will not cause damage to the first device 31. Correspondingly, the first device 31 will not affect the stability of the support plate 112.

[0127] As an embodiment, the support plate 112 serving as the reinforcement portion 10a can extend along the length direction of the step surface 311 of the first device 31. In this way, the available space formed between the step surface 311 at the edge of the first device 31 and the cover plate 12 can be utilized, and a longer support plate 112 can be arranged above the step surface 311 at the edge of the first device 31. This can increase the supporting force of the support plate 112 on the cover plate 12, enhance the supporting effect of the support plate 112, improve the stability of the cover plate 12, and improve the reliability of the shielding cover 1.

[0128] In order to utilize the available space above the entire step surface 311 of the side of the first device 31, the support plate 112 extending along the length direction of the step surface 311 of the first device 31 (i.e., extending along the edge of the first device 31) may at least cover the edge of the first device 31. Taking the support plate 112 located on one side of the first device 31 as an example, the support plate 112 at least covers the entire side edge range of the side of the first device 31 in its length direction.

[0129] For example, refer to Fig. 9 As shown, Fig. 9It is shown that the support plate 112 located on one side of the first device 31 covers the entire side range of the side of the first device 31. It can be understood that, for the case where at least two of the circumferential sides of the first device 31 have step surfaces 311, for example, taking the stacked chip set as an example, all four circumferential sides of the first device 31 can have step surfaces 311, and the support plate 112 can be set on at least one side of the first device 31, or the support plate 112 can be set on at least two sides of the first device 31, for example, the support plate 112 is set on each circumferential side of the first device 31, so as to improve the utilization rate of the available space formed between the step surface 311 of the first device 31 and the cover plate 12, and enhance the support force of the support plate 112 on the cover plate 12.

[0130] In addition, according to the layout design of the components 3 around the first device 31, the support plate 112 extending along the edge of the first device 31 can be extended to connect with both sides of the frame 111, thereby extending the length of the support plate 112, improving the strength and rigidity of the support frame 11, and improving the supporting force of the support plate 112 on the cover plate 12, thereby increasing the strength and stability of the shielding cover 1.

[0131] As mentioned above, the support plate 112 can be completely located in the available space formed between the step surface 311 of the first device 31 and the opposite cover plate 12, or a part of the structure of the support plate 112 is located in the available space, and another part of the structure of the support plate 112 is located in the gap between the first device 31 and the adjacent component 3. In order to expand the coverage of the support plate 112 and enhance the support force of the support plate 112 on the cover plate 12, the support plate 112 can extend to the area outside the available space above the step surface 311.

[0132] Fig.10 for Figure 3 Schematic diagram of the local section at AA. Fig.10 As shown, specifically, taking the extension of the support plate 112 along the length direction of the step surface 311 as an example, in the width direction of the step surface 311, part of the projection area of ​​the support plate 112 on the circuit board 2 is located in the area covered by the step surface 311, that is, part of the width area of ​​the support plate 112 is located above the step surface 311 of the first device 31, and another part of the width area of ​​the support plate 112 extends to the side area of ​​the first device 31. In this way, the width of the support plate 112 is increased, the area of ​​the support plate 112 is expanded, and the support force of the support plate 112 on the cover plate 12 can be enhanced.

[0133] Continue to refer to Fig.10As shown, in actual application, if the thickness of the component 3 adjacent to the first device 31 is smaller than the thickness of the first device 31, and the space formed between the component 3 adjacent to the first device 31 and the cover plate 12 is larger, then the support plate 112 located above the step surface 311 of the first device 31 can extend to above the component 3 adjacent to the first device 31, that is, part of the projection area of ​​the support plate 112 on the circuit board 2 is located within the coverage area of ​​the component 3 adjacent to the first device 31.

[0134] Combination Fig. 9 As shown, in the width direction of the support plate 112, by extending the support plate 112 to cover the space above the component 3 located on the side of the first device 31, the space formed between the component 3 on the side of the first device 31 and the cover plate 12 is also utilized, thereby increasing the width of the support plate 112, expanding the area of ​​the support plate 112, and enhancing the supporting force of the support plate 112 on the cover plate 12.

[0135] In addition, combined Figure 7 and Fig.10 As shown, in the case where the thickness of the component 3 arranged on the side of the first device 31 is less than the thickness of the first device 31, in order to reduce the space occupied by the shielding cover 1, the cover plate 12 can be designed so that the area corresponding to the first device 31 on the cover plate 12 is raised relative to the surrounding area in the direction away from the circuit board 2, and on the basis of maintaining a suitable gap between the first device 31 and the cover plate 12, the gap between the cover plate 12 and the component 3 around the first device 31 is reduced, thereby reducing the space occupied by the shielding cover 1. The holes saved by the shielding cover 1 can be used to layout other components in the electronic device.

[0136] For the structure in which the area corresponding to the first device 31 on the cover plate 12 protrudes in a direction away from the circuit board 2 relative to its surrounding area, the cover plate 12 forms a height difference between the step surface 311 corresponding to the first device 31 and the part of the component 3 on the side of the first device 31. By extending the support plate 112 to the space above the component 3 on the side of the first device 31, for the support plate 112 extending horizontally along the component surface 21 of the circuit board 2, the partial structure of the support plate 112 located above the step surface 311 of the first device 31 is suspended, while the partial structure of the support plate 112 located above the component 3 on the side of the first device 31 is attached to the inner surface of the cover plate 12.

[0137] Fig.11 This is a schematic diagram of the structure of another circuit board assembly provided in an embodiment of the present application. Fig.11As shown, as another embodiment of providing a reinforcing portion 10a on the cover body 10, the reinforcing portion 10a on the cover body 10 may be a recessed portion 1211 provided on the cover plate 12, and the recessed portion 1211 is located in the area of ​​the cover plate 12 corresponding to the step surface 311 of the first device 31. The recessed portion 1211 may be provided directly opposite to the step surface 311 of the first device 31, and the projection of the recessed portion 1211 on the circuit board 2 may be completely located in the step surface 311 of the first device 31. Alternatively, a portion of the recessed portion 1211 is located in the area of ​​the cover plate 12 directly opposite to the step surface 311, and another portion of the recessed portion 1211 is located in the gap between the first device 31 and the adjacent component 3.

[0138] The cover plate 12 is recessed toward the circuit board 2 in an area where the recess 1211 is provided. The cover plate 12 is locally deformed at the location of the recess 1211, thereby changing the material extension direction of the area above the step surface 311 of the cover plate 12 corresponding to the first device 31. The recess 1211 on the cover plate 12 generates a force on the surrounding area that is opposite to the direction of gravity of the cover plate 12, thereby supporting the area around the recess 1211 on the cover plate 12, enhancing the stability of the area around the recess 1211, preventing the area around the recess 1211 from collapsing, enhancing the strength and stability of the cover plate 12, and improving the reliability of the cover body 10.

[0139] Among them, similar to the support plate 112 on the aforementioned support frame 11, in the extension direction of the board surface of the circuit board 2, there should be a spacing between the recessed portion 1211 on the cover plate 12 and the edge of the upper part of the first device 31 to prevent the recessed portion 1211 and the first device 31 from interfering. In addition, the recessed portion 1211 on the cover plate 12 can extend along the length direction of the step surface 311 of the first device 31, and the recessed portion 1211 can at least cover the edge of the first device 31. In the width direction of the recessed portion 1211, the recessed portion 1211 can extend to the space on the side of the first device 31. In the case where the thickness of the component 3 on the side of the first device 31 is small, the recessed portion 1211 can extend to cover the upper space of the component 3 on the side of the first device 31, which will not be repeated here.

[0140] Exemplarily, the recessed portion 1211 may be a continuous groove structure extending along the length direction of the step surface 311 on the cover plate 12, or the recessed portion 1211 may be a plurality of pit structures arranged at intervals along the length direction of the step surface 311. In the case where each side of the first device 31 in the circumferential direction has the step surface 311, the recessed portion 1211 arranged on the cover plate 12 corresponds to at least one side of the first device 31. Taking the case where the recessed portion 1211 is arranged at the portion of the cover plate 12 corresponding to each side of the circumferential direction of the first device 31 as an example, the recessed portion 1211 may form an annular groove structure, or the recessed portion 1211 may be a plurality of pit structures arranged at intervals and formed into an annular shape.

[0141] It should be understood that in the case where the recessed portion 1211 is provided on the cover plate 12 as the reinforcing portion 10a, the cover plate 12 and the support frame 11 can be processed and formed separately, and the cover plate 12 is connected to the support frame 11 to form the cover body 10; or, the cover plate 12 and the support frame 11 can be an integrally formed structure, for example, the cover body 10 is an integrally formed part, and the reinforcing portion 10a is formed on the cover body 10 by processing the recessed portion 1211 in the area of ​​the cover body 10 corresponding to the step surface 311 of the first device 31. Exemplarily, the reinforcing portion 10a can be formed on the cover body 10 by a stamping process.

[0142] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0143] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A circuit board, characterized in that: One side surface of the circuit board in the thickness direction is a component surface, and a plurality of components are arranged on the component surface; the other side surface of the circuit board in the thickness direction is a printed surface, and a printed conductor is arranged on the printed surface; The components arranged on the component surface include a CPU chip, a DDR chip, and an EEPROM chip, and the components arranged on the component surface include a first device having a step surface, and the step surface faces away from the component surface.

2. The circuit board according to claim 1, characterized in that: The plane size of the CPU chip is larger than the plane size of the DDR chip, and the DDR chip is stacked on the CPU chip to form the first device.

3. A shielding cover, used for mounting on a side surface of a circuit board where components are provided, characterized in that: The invention comprises a cover body, wherein the cover body is used to be arranged on the circuit board, a shielding area is enclosed between the cover body and the circuit board, and at least part of the components are located in the shielding area; the components located in the shielding area include at least one first component, and the first component has a step surface facing the cover body; Wherein, a reinforcement portion is arranged on the cover body, and at least a part of the reinforcement portion is located in a region of the cover body facing the step surface.

4. The shielding cover according to claim 3, characterized in that: The cover body comprises a support frame and a cover plate, wherein the support frame is supported on the circuit board, and the cover plate is covered on the support frame.

5. The shielding cover according to claim 4, characterized in that: The support frame includes a frame and at least one support plate. The frame is arranged around the edge of the shielding area. The support plate is connected to the inner side of the frame. The support plate forms the reinforcement part.

6. The shielding cover according to claim 4, characterized in that: The cover plate is provided with a recessed portion, the recessed portion protrudes toward the step surface, and the recessed portion forms the reinforcement portion.

7. The shielding cover according to any one of claims 3 to 6, characterized in that: In the extension direction of the board surface of the circuit board, there is a distance between the surface of the first component close to the cover body and the reinforcing portion.

8. The shielding cover according to any one of claims 3 to 7, characterized in that: The reinforcing portion extends along a length direction of the step surface and covers at least an edge of the first component.

9. The shielding cover according to claim 8, characterized in that: A partial area of ​​the projection of the reinforcing portion on the circuit board is located in the area covered by the step surface.

10. The shielding cover according to claim 9, characterized in that: In the width direction of the step surface, the thickness of the component arranged adjacent to the first component is smaller than the thickness of the first component; a partial area of ​​the projection of the reinforcement portion on the circuit board is located within the coverage area of ​​the component adjacent to the first component.

11. The shielding cover according to claim 5, characterized in that: The frame includes a side wall, a fixed edge and an overlapping edge, the side wall is supported on the circuit board, the fixed edge and the overlapping edge are respectively located at two ends of the side wall, the fixed edge is attached to the circuit board, and the overlapping edge is attached to the cover plate.

12. The shielding cover according to claim 11, characterized in that: The fixed edge is located outside the area surrounded by the side walls, the overlapping edge is located inside the area surrounded by the side walls, and the support plate is connected to the overlapping edge.

13. The shielding cover according to claim 12, characterized in that: The cover plate comprises a plate body, and at least a part of the outer edge of the plate body extends a side edge, and the side edge is attached to the side wall.

14. The shielding cover according to any one of claims 3 to 13, characterized in that: The surface of the circuit board on which the first device is arranged is the component surface of the circuit board. The shielding cover is used to be arranged on the component surface of the circuit board. The step surface is oriented away from the component surface of the circuit board.

15. The shielding cover according to any one of claims 3 to 14, characterized in that: The first device is a stacked chip set including at least two stacked chips.

16. The shielding cover according to claim 15, characterized in that: The stacked chipset includes a CPU chip and a DDR chip arranged in a stacked manner, or the stacked chipset includes a CPU chip and an EEPROM chip arranged in a stacked manner, or the stacked chipset includes a DDR chip and an EEPROM chip arranged in a stacked manner, or the stacked chipset includes a CPU chip, a DDR chip and an EEPROM chip arranged in a stacked manner, or the stacked chipset includes a CPU chip, a DDR chip and an EEPROM chip arranged in sequence.

17. The shielding cover according to claim 15 or 16, characterized in that: The step surface is formed between the chip located at the upper layer and the chip located at the lower layer.

18. A circuit board assembly, characterized in that: It comprises a circuit board and the shielding cover according to any one of claims 3 to 17, a plurality of components are arranged on one side surface of the circuit board, and the shielding cover is provided to cover at least part of the components.

19. An electronic device, characterized in that: Comprising at least one circuit board assembly as claimed in claim 18.

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