Electronic component transfer method and device, equipment and medium

Abstract

The invention discloses an electronic component transfer method, device and equipment and a medium, and belongs to the field of electronic components. Wherein the physical data of the electronic component is obtained before transfer, and the physical data can represent the current state of the electronic component, such as whether the electronic component falls off or not and whether the electronic component is damaged or not. After the physical data and the original data are matched, the accuracy of the updated data obtained by combining the physical data and the original data of the electronic component is high. Therefore, the electronic component on the first substrate is transferred according to the update data, the risk that the electronic component cannot be picked up or a bad component is picked up can be effectively reduced, and the accuracy of transferring the electronic component can be improved.

Description

Technical Field

[0001] The present application relates to the field of electronic components, and in particular to a method, device, equipment and medium for transferring electronic components. Background Art

[0002] Currently, when transferring electronic components, it is necessary to first sort the wafers according to the optical parameters of the electronic components to obtain sorted wafers, and then transfer the electronic components on the sorted wafers to the display substrate. However, the sorting cost is high and the steps are complicated.

[0003] However, if the wafer is used directly for transfer, there is a risk that the physical state of the wafer and the original data will differ greatly, resulting in poor accuracy in the transfer of the electronic components. Summary of the invention

[0004] The embodiments of the present application provide a method, device, equipment and medium for transferring electronic components. The technical solution is as follows:

[0005] According to a first aspect of the present application, a method for transferring electronic components is provided, for transferring a plurality of electronic components from a first substrate to a second substrate, the method comprising:

[0006] Acquire physical data of the plurality of electronic components on the first substrate, wherein the physical data of the electronic components includes: first position information and state information of the electronic components, wherein the first position information is used to indicate position information of the electronic components in the first substrate;

[0007] Acquire original data of the plurality of electronic components on the first substrate, wherein the original data of the electronic components includes: first position information and optical parameters of the electronic components;

[0008] After determining that the physical data of at least part of the electronic components matches the first position information in the original data, merging the physical data and the original data of a plurality of the electronic components to obtain updated data of the plurality of the electronic components, wherein the updated data of the electronic components includes: the first position information, the state information and the optical parameters of the electronic components;

[0009] Based on the update data, the plurality of electronic components are transferred from the first substrate to the second substrate.

[0010] Optionally, obtaining physical data of the plurality of electronic components on the first substrate includes:

[0011] Obtaining a physical image of the first substrate;

[0012] Determining first position information of the plurality of electronic components on the first substrate based on the physical image of the first substrate;

[0013] Comparing the image of each electronic component in the physical image of the first substrate with the image in the defective component database to determine whether each electronic component is a defective component;

[0014] When it is determined that the electronic component is not a defective component, determining that the state information of the electronic component is a first value;

[0015] When it is determined that the electronic component is a defective component, the state information of the electronic component is determined to be a second value.

[0016] Optionally, transferring the plurality of electronic components from the first substrate to the second substrate based on the update data comprises:

[0017] The electronic component whose status information in the update data is the first value is transferred from the first substrate to the second substrate.

[0018] Optionally, the method further comprises:

[0019] Based on the physical data of the plurality of electronic components, a plurality of groups of first positioning elements are determined in the plurality of electronic components; a group of the first positioning elements includes a plurality of first positioning elements arranged continuously, and the state information of the first positioning elements is the second value;

[0020] Based on the original data and the first position information of each of the first positioning elements, determining whether each of the first positioning elements has no optical parameters;

[0021] After determining that each of the first positioning elements does not have an optical parameter, it is determined that the physical data of at least part of the electronic components matches the first position information in the original data.

[0022] Optionally, the method further comprises:

[0023] Acquire first position information of a plurality of second positioning elements on the first substrate, wherein the second positioning elements have a specified pattern;

[0024] Based on the physical data and the first position information of each of the second positioning elements, determining whether the state information of each of the second positioning elements is the second value;

[0025] After determining that the state information of each of the second positioning elements is the second value, it is determined that the physical data of at least part of the electronic components matches the first position information in the original data.

[0026] Optionally, the method further comprises:

[0027] Acquire first position information and grayscale values ​​of a plurality of arrangement points in the first substrate based on the physical image of the first substrate;

[0028] Based on the grayscale value of each of the arrangement points, a plurality of first arrangement points and at least one second arrangement point are determined from the plurality of arrangement points; the electronic components are arranged at the first arrangement points, and the electronic components are not arranged at the second arrangement points;

[0029] Determine a matching rate of the first substrate based on the original data, the first position information of each of the first arrangement points, and the first position information of each of the second arrangement points, wherein the matching rate of the first substrate is used to characterize a matching degree between the physical data and the original data;

[0030] After the matching rate of the first substrate is greater than or equal to a matching rate threshold, it is determined that the physical data of at least part of the electronic components matches the first position information in the original data.

[0031] Optionally, determining the matching rate of the first substrate based on the original data, the first position information of each of the first arrangement points, and the first position information of each of the second arrangement points includes:

[0032] Based on the original data and the first position information of each of the first arrangement points, the number of first correct points in the plurality of first arrangement points is determined; the original data records the optical parameters of the electronic components at the first correct points;

[0033] Based on the original data and the first position information of each of the second arrangement points, the number of second correct points in the at least one second arrangement point is determined; the original data does not record the optical parameters corresponding to the second correct points;

[0034] A matching rate of the first substrate is determined based on the number of the first correct points, the number of the second correct points, and the total number of the arranged points.

[0035] Optionally, the method further comprises:

[0036] After receiving the position deviation alarm signal, or after a first specified time interval, acquiring the first position information of the target electronic component and the current physical image of the first substrate; the target electronic component is the electronic component that the transfer device theoretically needs to transfer;

[0037] Based on the current physical image of the first substrate, determining first position information of an actual grabbing point of the transfer device;

[0038] Determining an offset of the first substrate based on the first position information of the target electronic component and the first position information of the actual grasping point;

[0039] Based on the offset of the first substrate, correcting the first position information of the plurality of electronic components that are not transferred on the first substrate to correct the update data;

[0040] Based on the corrected update data, the plurality of electronic components are transferred from the first substrate to the second substrate.

[0041] Optionally, based on the current physical image of the first substrate, determining first position information of an actual grabbing point of the transfer device includes:

[0042] Acquire a plurality of partitions of the first substrate, wherein at least one special electronic component having a special pattern is distributed in one of the partitions;

[0043] Based on the current physical image of the first substrate and the multiple partitions of the first substrate, determine the partition where the actual grabbing point of the transfer device is located;

[0044] Based on the first position information of the special electronic component in the partition where the actual grasping point of the transfer device is located, the first position information of the actual grasping point of the transfer device is determined.

[0045] Optionally, the first substrate has a plurality of grid partitions; the method further comprises:

[0046] After receiving the position deviation alarm signal, or after a first specified time interval, the first position information of the target electronic component and the current physical map of at least part of the grid partitions are obtained; the target electronic component is the electronic component that the transfer device theoretically needs to transfer; at least part of the grid partitions include: the grid partition where the actual grabbing point of the transfer device is located;

[0047] Determining first position information of actual grabbing points of the transfer device based on the current physical map of at least part of the grid partitions;

[0048] Determining an offset of the first substrate based on the first position information of the target electronic component and the first position information of the actual grasping point;

[0049] Based on the offset of the first substrate, correcting the first position information of the plurality of electronic components that are not transferred on the first substrate to correct the update data;

[0050] Based on the corrected update data, the plurality of electronic components are transferred from the first substrate to the second substrate.

[0051] Optionally, determining the first position information of the actual grabbing point of the transfer device based on the current physical map of at least part of the grid partitions includes:

[0052] Based on the current physical map of at least part of the grid partition, determining the relative position of the target grid partition where the actual grasping point of the transfer device is located in the first substrate;

[0053] Based on the relative position of the target grid partition in the first substrate and the relative position of the actual grasping point of the transfer device relative to the target grid partition, first position information of the actual grasping point of the transfer device is determined.

[0054] In a second aspect, a device for transferring electronic components is provided, the device comprising:

[0055] a first acquisition module, configured to acquire physical data of the plurality of electronic components on the first substrate, wherein the physical data of the electronic components includes: first position information and state information of the electronic components, wherein the first position information is used to indicate position information of the electronic components in the first substrate;

[0056] A second acquisition module is used to acquire original data of the plurality of electronic components on the first substrate, wherein the original data of the electronic components includes: first position information and optical parameters of the electronic components;

[0057] a merging module, configured to merge the physical data of a plurality of electronic components with the original data after determining that the physical data of at least part of the electronic components matches the first position information in the original data, so as to obtain updated data of the plurality of electronic components, wherein the updated data of the electronic components includes: the first position information, the state information and the optical parameters of the electronic components;

[0058] A transfer module is used to transfer the plurality of electronic components from the first substrate to the second substrate based on the update data.

[0059] In a third aspect, a computer device is provided, comprising: a memory and a processor, wherein at least one computer program is stored in the memory, and the at least one computer program is loaded and executed by the processor to implement any of the above methods.

[0060] According to a fourth aspect, a computer-readable storage medium is provided, wherein at least one computer program is stored in the computer-readable storage medium, and the at least one computer program is loaded and executed by a processor to implement any of the above methods.

[0061] In a fifth aspect, a computer program product is provided, comprising a computer program / instruction, wherein the computer program / instruction implements any of the above methods when executed by a processor.

[0062] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0063] In the transfer method of electronic components provided in the embodiment of the present application, the physical data of the electronic components is obtained before the transfer, and the physical data can characterize the current state of the electronic components, such as whether the electronic components have fallen, whether the electronic components are damaged, etc. After matching the physical data with the original data, the updated data obtained by combining the physical data and the original data of the electronic components has a high accuracy. In this way, the electronic components on the first substrate are transferred according to the updated data, which can effectively reduce the risk of not picking up the electronic components or picking up defective components, thereby improving the accuracy of the transfer of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0065] Figure 1 is a flow chart of a method for transferring an electronic component provided in an embodiment of the present application;

[0066] Figure 2 is a flow chart of another electronic component transfer method provided in an embodiment of the present application;

[0067] Figure 3 is a physical schematic diagram of a first substrate provided in an embodiment of the present application;

[0068] Figure 4 yes Figure 3 A physical numerical image of a first substrate provided;

[0069] Figure 5 yes Figure 3 Another physical numerical image of the first substrate provided;

[0070] Figure 6 yes Figure 3 Another physical numerical image of the first substrate provided;

[0071] Figure 7 is a flow chart of another electronic component transfer method provided in an embodiment of the present application;

[0072] Figure 8is a flow chart of another electronic component transfer method provided in an embodiment of the present application;

[0073] Fig. 9 is a flow chart of an electronic component partitioning algorithm provided in an embodiment of the present application;

[0074] Fig.10 yes Figure 3 A schematic diagram of a first partition in a first substrate is provided;

[0075] Fig.11 yes Figure 3 A schematic diagram of a second partition in a first substrate is provided;

[0076] Fig.12 It is a flow chart of a method for inspecting the partition positioning of electronic components provided in an embodiment of the present application;

[0077] Fig.13 is a schematic diagram of a grid partition in a first substrate provided in an embodiment of the present application;

[0078] Fig.14 is a schematic diagram of another grid partition in a first substrate provided in an embodiment of the present application;

[0079] Fig.15 is a flow chart of another electronic component transfer method provided in an embodiment of the present application;

[0080] Fig.16 It is a schematic diagram of an electronic component transfer device provided in an embodiment of the present application.

[0081] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0082] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0083] In the related art, the electronic components on the wafer are usually sorted and then transferred to the product substrate. The sorting process refers to mixing the electronic components on the wafer according to certain grouping rules and transferring them to the intermediate substrate to obtain a sorted sheet (bin sheet). Since the sorted sheet is the product after the bad components are removed and the normal components are transferred, there are only a very small number of bad components in the sorted sheet. When transferring the electronic components, it is only necessary to remove the transferred electronic components at the corresponding position to fix the crystal, and there is no need to consider the accuracy of crystal removal.

[0084] However, the sorting cost is high and the steps are complicated. If the wafer is used directly for transfer, the original data may not reflect the actual situation of the wafer due to the large difference between the actual wafer and the original data, resulting in poor accuracy of electronic component transfer.

[0085] An embodiment of the present application provides a method for transferring electronic components, which is used to transfer a plurality of electronic components from a first substrate to a second substrate.

[0086] Optionally, the first substrate may be an original substrate, and the second substrate may be a product substrate.

[0087] The first substrate can be used as a carrier for manufacturing electronic components. For example, the first substrate can be a substrate for a wafer. The number of electronic components that can be formed on a wafer is determined by actual production needs and production capacity. Exemplarily, the number of electronic components in a wafer can be 500k-650k. The second substrate can be used as a carrier for fixing electronic components. For example, the second substrate can be a display substrate in a display module or display screen. Exemplarily, the number of electronic components on a display substrate can be about 20k. That is, the embodiment of the present application can cancel sorting and directly transfer electronic components from the original substrate to the product substrate.

[0088] It should be noted that the transfer method provided in the embodiment of the present application is not limited to this. The transfer method can also be applied to fields involving chip transfer, such as chip sorting at the raw material manufacturing end, chip transfer at the module manufacturing end, and chip placement machine placement.

[0089] Optionally, the electronic component may be a light emitting diode (LED), for example, a mini light emitting diode (Mini Light Emitting Diode, Mini-LED), or a micro light emitting diode (Micro Light Emitting Diode, Micro-LED), and the electronic component may also be an integrated circuit (IC), but is not limited thereto.

[0090] Please refer to Figure 1 , Figure 1 : is a flow chart of a method for transferring an electronic component provided in an embodiment of the present application, the method comprising:

[0091] Step 101: Acquire physical data of a plurality of electronic components on a first substrate.

[0092] The physical data is used to reflect the current status of the multiple electronic components on the first substrate. The physical data of the electronic components includes: first position information and state information of the electronic components.

[0093] The first position information in the physical data is used to indicate the position information of the electronic component in the first substrate. Exemplarily, the first position information may include the row coordinates and column coordinates of the electronic component in the first substrate, the row coordinates of the electronic component being the row number of the electronic component in the first substrate, and the column coordinates of the electronic component being the column number of the electronic component in the first substrate.

[0094] The status information in the physical data is the status of the electronic component determined based on the appearance information of the electronic component. Exemplarily, the status information may include: a first value for indicating that the electronic component is a normal component (OK), and a second value for indicating that the electronic component is a defective component (NG). Defective components may be electronic components that are damaged, rotated, or have a low degree of overlap with the image of normal components. In addition, the status information may also include: a third value for indicating that there is no electronic component at the position corresponding to the first position information, so as to characterize the situation where the electronic component has fallen off.

[0095] Step 102: Acquire original data of a plurality of electronic components on a first substrate.

[0096] The original data is used to reflect the original conditions of the multiple electronic components on the first substrate. For example, when the first substrate is a raw material provided by a manufacturer, the original data can reflect the conditions of the first substrate when it leaves the factory. The original data of the electronic components include: first position information and optical parameters of the electronic components.

[0097] The first position information in the original data is also used to indicate the position information of the electronic component in the first substrate. For details, please refer to the content of step 101, which will not be described in detail here.

[0098] The optical parameters in the original data can be used to indicate the luminous characteristics of the plurality of electronic components on the first substrate. The optical parameters may include at least one of the original parameters such as wavelength, brightness, color coordinates, voltage, current, etc., or the optical data may include parameters after data deformation of these original parameters.

[0099] Optionally, the raw data of the electronic components may be data provided by the manufacturer of the first substrate. Exemplarily, the manufacturer of the first substrate may determine the first position information and optical parameters of the plurality of electronic components by performing optical property testing and automatic optical inspection (AOI) on the first substrate. The test results may be stored in a local memory or a cloud server, and the first substrate data may be read from the local memory or received from a computer device.

[0100] Step 103: after determining that the physical data of at least some electronic components matches the first position information in the original data, merge the physical data and the original data of multiple electronic components to obtain updated data of the multiple electronic components.

[0101] At least some of the electronic components can play a positioning role, ensuring that when the first position information in the physical data is the same as the first position information in the original data, the electronic component indicated is the same electronic component, thereby making the merging of the physical data and original data of multiple electronic components more accurate, and further making the updated data more accurate.

[0102] The update data of the electronic component includes: first position information, state information and optical parameters of the electronic component. Thus, the row and column information, current state and luminous characteristics of the electronic component can be determined through the update data of the electronic component.

[0103] Step 104: Based on the updated data, transfer the plurality of electronic components from the first substrate to the second substrate.

[0104] In the process of transferring electronic components, not only can bad components be eliminated in time according to the status information in the updated data, thus avoiding the bad components from being transferred to the second substrate, but also the position without electronic components can be identified according to the status information in the updated data, thus avoiding the situation where the original data indicates that there are electronic components at a certain position but the electronic components fall and cannot be transferred. That is, the transfer of electronic components based on the updated data in the embodiment of the present application can avoid the above two situations affecting the accuracy of the transfer of electronic components, thereby improving the yield of the final transferred product, and further improving the display quality when the second substrate is a display substrate.

[0105] Optionally, the transfer technology used in the embodiments of the present application includes but is not limited to acupuncture transfer technology, swing arm transfer technology, laser transfer technology, etc.

[0106] In summary, the embodiment of the present application provides a method for transferring electronic components, in which the physical data of the electronic components is obtained before the transfer, and the physical data can characterize the current state of the electronic components, such as whether the electronic components have fallen, and whether the electronic components are damaged. After matching the physical data with the original data, the updated data obtained by combining the physical data and the original data of the electronic components has a high accuracy. In this way, the electronic components on the first substrate are transferred according to the updated data, which can effectively reduce the risk of not picking up the electronic components or picking up defective components, thereby improving the accuracy of the transfer of the electronic components.

[0107] The present application also provides another method for transferring electronic components. Figure 2 , Figure 21 is a flow chart of another method for transferring electronic components provided in an embodiment of the present application, the method is used to transfer multiple electronic components from a first substrate to a second substrate, the method comprising:

[0108] Step 201: Obtain a physical image of a first substrate.

[0109] Optionally, the present application may use a transfer device with an AOI function to photograph the first substrate to obtain a physical image of the first substrate. The transfer device may also identify the images of multiple electronic components in the physical image of the first substrate to confirm the appearance information of the electronic components, thereby confirming the status of the multiple electronic components. The appearance information may include: whether the electronic component is damaged, whether the electronic component is rotated, whether the electronic component has fallen off, whether the electronic component has a special pattern, etc.

[0110] It should be noted that the physical image of the first substrate can be an actual image of the first substrate taken by the transfer device, or can be an image processed from the actual image. Exemplarily, the present application can perform grayscale processing on the actual image.

[0111] Step 202: Determine first position information of a plurality of electronic components on the first substrate based on the physical image of the first substrate.

[0112] Optionally, the present application may establish a coordinate system for the first substrate according to the physical image of the first substrate, and determine the row and column coordinates of the plurality of electronic components in the coordinate system, thereby obtaining first position information of the plurality of electronic components.

[0113] Step 203: Compare the image of each electronic component in the physical image of the first substrate with the image in the defective component database to determine whether each electronic component is a defective component.

[0114] In a possible implementation, the defective component database can be established by pre-collecting a large number of defective component images and then processing the large number of defective component images. The defective component database includes images of various types of defective components. By comparing the images of each electronic component in the physical image with the images in the defective component database one by one through an image recognition algorithm, it can be determined whether each electronic component is a defective component.

[0115] Exemplarily, if the similarity between the image of a certain electronic component in the physical image and the image of a defective component in the defective component database is greater than or equal to the similarity threshold, the electronic component can be determined to be a defective component. If the similarity between the image of a certain electronic component in the physical image and the images of various defective components in the defective component database is less than the similarity threshold, the electronic component can be determined to be a normal component.

[0116] In another possible implementation, the image of each electronic component in the physical image may be compared with the pre-collected image of the normal component one by one through an image recognition algorithm to determine whether each electronic component is a normal component.

[0117] For example, if the similarity between the image of a certain electronic component in the physical image and the image of a normal component is greater than or equal to the similarity threshold, the electronic component can be determined to be a normal component. If the similarity between the image of a certain electronic component in the physical image and the image of a normal component is less than the similarity threshold, the electronic component can be determined to be a defective component.

[0118] Optionally, the grayscale information of the image of each arrangement point can be determined based on the physical image of the first substrate. Since the grayscale information corresponding to the arrangement points where electronic components are arranged is significantly different from the grayscale information corresponding to the arrangement points where no electronic components are arranged, it can be determined whether each electronic component has fallen off based on the grayscale information.

[0119] Optionally, when the first substrate is produced, some special electronic components may be manufactured. The special electronic components are unusable electronic components and are only used as positioning marks. The special electronic components have special patterns. Exemplarily, the shapes of the special patterns may include but are not limited to arrows, triangles, circles, and squares. Alternatively, the special electronic components may also be unetched electronic components. In this way, if the image of the special electronic component has a low similarity to the image of the normal component, the special electronic component may be determined as a defective component.

[0120] The special electronic components can be arranged in a certain pattern in the first substrate to improve positioning efficiency. For example, the special electronic components can be arranged at equal distances in the row direction and the column direction of the first substrate.

[0121] Please refer to Figure 3 , Figure 3 : is a physical schematic diagram of a first substrate provided in an embodiment of the present application. The first substrate has a plurality of arrangement points arranged in an array, and at least some of the plurality of arrangement points can arrange a plurality of electronic components. Here, Figure 3 It is not the actual image of the first substrate, but an image after the actual image is recognized and the features such as the appearance information of each electronic component are annotated. The text on the arrangement point is used to indicate the features of the arrangement point, where "OK" is used to indicate that a normal component is arranged at the arrangement point, "NG" is used to indicate that a defective component is arranged at the arrangement point, "empty" is used to indicate that there is no electronic component at the arrangement point, and "special" is used to indicate that an electronic component with a special pattern is arranged at the arrangement point. However, this application does not limit the text annotated in the physical schematic diagram.

[0122] Step 204: When it is determined that the electronic component is not a defective component, determine that the state information of the electronic component is a first value.

[0123] After identifying the features such as the appearance information of the electronic component, the features such as the appearance information can be converted into a numerical value, and the numerical value can be used as the status information of the electronic component, so that the status of the electronic component can be confirmed more conveniently. When it is determined that the electronic component is not a defective component, it can be confirmed that the electronic component is a normal component available for use. Exemplarily, the first numerical value corresponding to the status information of the normal component can be "1".

[0124] Step 205: When it is determined that the electronic component is a defective component, determine that the state information of the electronic component is a second value.

[0125] When the electronic component is determined to be a defective component, it can be confirmed that the electronic component cannot be used. Exemplarily, the second value corresponding to the status information of the defective component can be "0".

[0126] In this application, the status information of the electronic components can be marked in the physical image to obtain a physical value image. Figure 4 , Figure 4 yes Figure 3 A physical numerical diagram of a first substrate is provided, wherein "1" is used to indicate that a normal component is arranged at the arrangement point, "0" is used to indicate that a defective component is arranged at the arrangement point, and "-2" is used to indicate that there is no electronic component at the arrangement point. However, the present application does not limit the specific values ​​marked in the physical schematic diagram. The physical numerical diagram can visualize the status information and position distribution of multiple electronic components on the first substrate.

[0127] Table 1

[0128]

[0129]

[0130] Optionally, this application can also color the physical numerical image, please refer to Figure 5 , Figure 5 yes Figure 3 Another physical numerical diagram of the first substrate is provided, in which the arrangement points where the electronic components with the same status information are located are processed as blocks of the same color, and the arrangement points where the electronic components with different status information are located are processed as blocks of different colors, so that the distribution of electronic components in various states can be intuitively displayed. For example, there are some defective components distributed in the edge area of ​​the first substrate, which is due to the low process precision of the edge area during the manufacturing process of the first substrate, or the low integrity of the electronic components in the edge area when the first substrate is cut.

[0131] Optionally, the present application can convert the physical numerical image into a table file of physical data for backup. Please refer to Table 1, which is a physical data table provided in an embodiment of the present application, and Table 1 records the row coordinates, column coordinates and status information of each position in the physical numerical image. In addition, other appearance information of the electronic components identified based on the physical image can also be recorded in the physical data table for backup, for example, whether the electronic components are damaged, whether the electronic components are rotated, etc.

[0132] Step 206: Acquire original data of the plurality of electronic components on the first substrate.

[0133] The relevant contents of step 206 refer to the aforementioned step 102, and the detailed description is omitted here.

[0134] Optionally, the present application can generate an original numerical map based on the original data, and mark the first numerical value at the arrangement point of the electronic components with optical parameters to form a Figure 4 The original numerical diagram can be used to compare with the physical numerical diagram, which is more intuitive.

[0135] The embodiment of the present application may adopt a variety of matching methods, wherein step 207 to step 214 is an exemplary matching method provided by the present application, but the present application is not limited thereto.

[0136] Step 207 : determining a plurality of groups of first positioning elements in the plurality of electronic components based on the physical data of the plurality of electronic components.

[0137] A group of first positioning elements can be used as a positioning mark to match physical data and original data. A group of first positioning elements includes a plurality of first positioning elements arranged in a row. Since a plurality of first positioning elements in a group of first positioning elements are arranged in a row, a group of first positioning elements has aggregation in the physical numerical map. In addition, a plurality of groups of first positioning elements can be symmetrically distributed on the first substrate. In this way, the positions of each group of first positioning elements can be quickly located based on the physical numerical map. The first positioning element is an electronic component with a low degree of overlap with the normal component image. Therefore, in the process of acquiring physical data, the first positioning element will be identified as a defective component, and the state information of the first positioning element is the second value.

[0138] For example, Figure 5 As shown, a group of positioning elements includes: 3*3 first positioning elements, and the 3*3 first positioning elements are continuously clustered and arranged in a rectangle. Multiple groups of positioning elements are symmetrically distributed along the central axis of the first substrate in the row direction, and multiple groups of positioning elements are symmetrically distributed along the central axis of the first substrate in the column direction.

[0139] Optionally, a group of first positioning elements includes at least one special electronic element, so that the efficiency of positioning using multiple groups of first positioning elements can be improved. Figure 5 As shown, in a group of first positioning elements, the electronic component corresponding to the upper left corner of the rectangle is a special electronic component, and the remaining first positioning elements may be unusable electronic components such as defective components.

[0140] Step 208: Based on the original data and the first position information of each first positioning element, determine whether each first positioning element has no optical parameters.

[0141] Since the first positioning element is an unusable electronic component, when the manufacturer of the first substrate tests the first substrate, the arrangement points where the first positioning elements are located will be regarded as voids. Therefore, in the original data, the arrangement points determined based on the first position information of each first positioning element have no corresponding optical parameters.

[0142] Step 209: after determining that each first positioning element does not have an optical parameter, determine that the physical data of each first positioning element matches the first position information in the original data.

[0143] After determining that each first positioning element has no optical parameters and the status information in the physical data of each first positioning element is the second value, it can be confirmed that the original data and the physical data of each first positioning element are one-to-one corresponding, that is, each first positioning element in the original numerical map and the physical numerical map is aligned, then it is preliminarily determined that the physical data and the original data match successfully.

[0144] It should be noted that after determining that the optical parameters exist in at least one first positioning element, it is determined that the first positioning match is unsuccessful, and step 202 is performed again to re-determine the physical data of the first substrate.

[0145] Step 210: Acquire first position information of a plurality of second positioning elements on the first substrate.

[0146] The second positioning element has a specified pattern, that is, the second positioning element is the special electronic element mentioned above. The second positioning element can be used as another positioning mark for matching the physical data and the original data.

[0147] In the present application, the method for obtaining the first position information of the plurality of second positioning elements includes multiple situations, and two situations are taken as examples below:

[0148] In the first case, since the second positioning element is an unusable electronic component, when the manufacturer of the first substrate tests the first substrate, the arrangement point where the second positioning element is located will be regarded as a hole. That is, the test result does not contain the original data of the second positioning element. Therefore, the present application needs to import independent special electronic component information into the transfer device so that the transfer device can retrieve and use it. The special electronic component information includes the first position information of multiple special electronic components, or the special electronic component information can also include the status information of multiple special electronic components, and the status information of multiple special electronic components is the second value.

[0149] In the second case, a step of identifying special electronic components can be added during the process of testing the first substrate by the manufacturer of the first substrate, for example, the special electronic components can be identified by an image recognition algorithm. In this way, the original data can include the first position information of multiple special electronic components, and there is no need to import the special electronic component information separately.

[0150] Optionally, the number of second positioning elements can be greater than the number of groups of first positioning elements, and the density of distribution of multiple second positioning elements can be greater than the density of distribution of multiple groups of first positioning elements. In this way, the first positioning match based on the first positioning element is coarse positioning, and the second positioning match based on the second positioning element is fine positioning. For example, some wafer manufacturers currently manufacture 4 to 6 groups of first positioning elements and 11 second positioning elements on the wafer. With the upgrading of the wafer manufacturer's own technology, some wafers include more than 400 second positioning elements, which can effectively improve the positioning accuracy.

[0151] It should be noted that some electronic components can serve as both the first positioning element and the second positioning element. For example, the first positioning element at the upper left corner of a group of first positioning elements can also serve as the second positioning element. This ensures the continuity of the two positioning matches.

[0152] Step 211: Based on the physical data and the first position information of each second positioning element, determine whether the state information of each second positioning element is the second value.

[0153] The second positioning element is an electronic element with a low degree of overlap with the normal element image. Therefore, in the process of acquiring the physical data, the second positioning element will be identified as a defective element, and the state information of the second positioning element should be the second value. Therefore, by judging whether the state information of each second positioning element is the second value, it can be confirmed whether the original data and the physical data of each second positioning element are matched successfully.

[0154] Step 212: after determining that the state information of each second positioning element is the second value, determine that the physical data of each second positioning element matches the first position information in the original data.

[0155] After determining that the status information of each second positioning element is the second numerical value, it can be confirmed that the original data and the physical data of each second positioning element are one-to-one corresponding, that is, each second positioning element in the original numerical map and the physical numerical map is aligned, then it can be determined that the second positioning match between the physical data and the original data is successful.

[0156] Optionally, after determining that the physical data of each second positioning element matches the first position information in the original data, the state information of the second positioning element can be updated from the second value to the fourth value, and the updated state information of the electronic component can be marked in the physical image to obtain an updated physical value image. Figure 6 , Figure 6 yes Figure 3 Another physical numerical diagram of the first substrate is provided, where "-1" is used to indicate that a second positioning element is arranged at the arrangement point, so that the second positioning element can be quickly identified during the subsequent transfer process.

[0157] Step 213: after determining that the status information of each second positioning element is not all the second value, determine whether manual re-determination is required.

[0158] After determining that the status information of each second positioning element is not all the second value, it can be determined that the second positioning match between the physical data and the original data is unsuccessful, and therefore an automatic re-judgment or a manual re-judgment is required. The automatic re-judgment refers to executing step 202 again to re-determine the physical data of the first substrate, and the manual re-judgment refers to manually confirming the first position information of the second positioning element.

[0159] In the present application, whether to conduct a manual re-judgment can be determined based on the number of automatic re-judgments, so that when multiple matches are unsuccessful, the first position information of each second positioning element can be manually aligned with the physical data. For example, when it is determined that the number of automatic re-judgments exceeds two, it can be determined as a manual re-judgment, and when it is determined that the number of automatic re-judgments is less than or equal to two, it can be determined as an automatic re-judgment.

[0160] Step 214: After the manual re-judgment is determined, the first position information of the second positioning element is manually confirmed to match the physical data of each second positioning element with the first position information in the original data.

[0161] After it is determined that manual re-judgment is not to be used, step 202 is performed again to re-determine the physical data of the first substrate.

[0162] Step 215 : after determining that the physical data of at least some electronic components matches the first position information in the original data, merge the physical data and the original data of the plurality of electronic components to obtain updated data of the plurality of electronic components.

[0163] At least some of the electronic components are the first positioning components and the second positioning components. The two positioning matches can ensure that the accuracy of merging the physical data and the original data of multiple electronic components is high, thereby making the accuracy of the updated data higher.

[0164] Step 216: Transfer the electronic component whose status information in the update data is the first value from the first substrate to the second substrate.

[0165] The electronic components whose status information in the updated data is the first value are normal components. Based on the updated data, the accuracy of electronic component transfer can be effectively improved, thereby improving the yield of the final transferred product, and further improving the display quality when the second substrate is a display substrate.

[0166] It should be noted that the steps of the method for transferring electronic components in the embodiment of the present application can also be increased or decreased accordingly according to the situation. For example, steps 210 to 214 can be deleted according to the actual situation, that is, the embodiment of the present application can also perform positioning matching only through the first positioning element. Alternatively, steps 207 to 209 can be deleted according to the actual situation, that is, the embodiment of the present application can also perform positioning matching only through the second positioning element. Any technician familiar with the technical field can easily think of a method of change within the technical scope disclosed in this application, which should be covered within the scope of protection of this application, so it will not be repeated.

[0167] In summary, the embodiment of the present application provides a method for transferring electronic components, in which the physical data of the electronic components is obtained before the transfer, and the physical data can characterize the current state of the electronic components, such as whether the electronic components have fallen, and whether the electronic components are damaged. After matching the physical data with the original data, the updated data obtained by combining the physical data and the original data of the electronic components has a high accuracy. In this way, the electronic components on the first substrate are transferred according to the updated data, which can effectively reduce the risk of not picking up the electronic components or picking up defective components, thereby improving the accuracy of the transfer of the electronic components.

[0168] The present application also provides another method for transferring electronic components. Figure 7 , Figure 7 1 is a flow chart of another method for transferring electronic components provided in an embodiment of the present application, the method is used to transfer multiple electronic components from a first substrate to a second substrate, the method comprising:

[0169] Step 701: Acquire physical data of a plurality of electronic components on a first substrate.

[0170] The relevant contents of step 701 refer to the aforementioned step 101, or refer to steps 201 to 205, and the detailed description is omitted here.

[0171] Step 702: Acquire original data of a plurality of electronic components on a first substrate.

[0172] The relevant contents of step 702 refer to the aforementioned step 102, and detailed description is omitted here.

[0173] Steps 703 to 706 are another exemplary matching method provided in this application.

[0174] Step 703: Acquire first position information and grayscale values ​​of a plurality of arrangement points in the first substrate based on the physical image of the first substrate.

[0175] A plurality of arrangement points are arranged in an array, at least some of the plurality of arrangement points are used to arrange a plurality of electronic components, and one arrangement point is only used to arrange one electronic component.

[0176] The first position information of the arrangement point is used to indicate the position information of the arrangement point in the first substrate. Here, the first position information of the arrangement point is consistent with the first position information of the electronic component arranged on the arrangement point. The gray value of the arrangement point refers to the average gray value of the image of the area corresponding to the arrangement point in the physical image.

[0177] Step 704: Based on the grayscale value of each arrangement point, determine a plurality of first arrangement points and at least one second arrangement point from the plurality of arrangement points.

[0178] The first arrangement point has electronic components arranged thereon, and the second arrangement point has no electronic components arranged thereon. The grayscale value of the image of the first arrangement point is significantly different from the grayscale value of the image of the second arrangement point, so whether each arrangement point has electronic components arranged thereon can be quickly determined based on the grayscale value.

[0179] Step 705: Determine the matching rate of the first substrate based on the original data, the first position information of each first arrangement point, and the first position information of each second arrangement point. The matching rate of the first substrate is used to characterize the matching degree between the physical data and the original data.

[0180] In an exemplary embodiment, the method for determining the matching rate of the first substrate may include the following sub-steps:

[0181] Sub-step 7051: Based on the original data and the first position information of each first arrangement point, determine the number of first correct points in the plurality of first arrangement points. The original data records the optical parameters of the electronic components at the first correct points.

[0182] In the original data, if the position indicated by the first position information of a first arrangement point has optical parameters, it proves that the position is also arranged with electronic components, that is, the physical data of the first arrangement point matches the original data, so the first arrangement point is the first correct point. Otherwise, the first arrangement point is not the first correct point.

[0183] Sub-step 7052: Based on the original data and the first position information of each second arrangement point, determine the number of second correct points in at least one second arrangement point. The original data does not record the optical parameters corresponding to the second correct points.

[0184] In the original data, if the position indicated by the first position information of a second arrangement point does not have an optical parameter, it proves that the position also does not have an electronic component arranged, that is, the physical data of the second arrangement point matches the original data, so the second arrangement point is the second correct point. Otherwise, the second arrangement point is not the second correct point.

[0185] Sub-step 7053: determining the matching rate of the first substrate based on the number of the first correct points, the number of the second correct points, and the total number of arranged points.

[0186] Matching rate = (number of first correct points + number of second correct points) / total number of arrangement points. In other words, the matching rate refers to the probability of successful matching among multiple arrangement points, so the matching rate can represent the matching degree between the physical data and the original data.

[0187] Step 706: after the matching rate of the first substrate is greater than or equal to the matching rate threshold, determine that the physical data of at least part of the electronic components matches the first position information in the original data.

[0188] It should be noted that, in the physical image, the arrangement points where the defective components and special components are located will be identified as the first arrangement points where electronic components are arranged. However, since the defective components and special components are electronic components that cannot be used, the optical parameters of the defective components and special components are not recorded in the original data. Therefore, the arrangement points where the defective components and special components are located cannot be matched successfully. Moreover, if some electronic components fall off, the corresponding arrangement points will also fail to match successfully. Therefore, when setting the matching rate threshold, the present application needs to take the above two situations into consideration. Exemplarily, the matching rate threshold can be 90%.

[0189] Optionally, when determining the matching rate of the first substrate, the arrangement points corresponding to some defective components and special components can be excluded, and only the probability of successful matching of the arrangement points other than these arrangement points is calculated. Exemplarily, some defective components can be defective components other than special components in multiple first positioning components, as well as defective components at the edge of the first substrate. This can improve the accuracy of the matching rate, that is, improve the accuracy of reflecting the matching degree between the original data and the physical data. Correspondingly, the matching rate threshold can also be set higher.

[0190] Step 707: after determining that the physical data of at least some electronic components matches the first position information in the original data, merge the physical data and the original data of multiple electronic components to obtain updated data of the multiple electronic components.

[0191] At least some of the electronic components are arranged at the correct positions, which can ensure that the accuracy of merging the physical data and original data of multiple electronic components is high, thereby making the updated data more accurate.

[0192] Step 708: Transfer the electronic component whose status information in the update data is the first value from the first substrate to the second substrate.

[0193] The relevant contents of step 708 refer to the aforementioned step 216, and the detailed description is omitted here.

[0194] In summary, the embodiment of the present application provides a method for transferring electronic components, in which the physical data of the electronic components is obtained before the transfer, and the physical data can characterize the current state of the electronic components, such as whether the electronic components have fallen, and whether the electronic components are damaged. After matching the physical data with the original data, the updated data obtained by combining the physical data and the original data of the electronic components has a high accuracy. In this way, the electronic components on the first substrate are transferred according to the updated data, which can effectively reduce the risk of not picking up the electronic components or picking up defective components, thereby improving the accuracy of the transfer of the electronic components.

[0195] When the first substrate is a wafer substrate, since the number of electronic components in a wafer usually exceeds 500K, the time for transferring the electronic components usually exceeds 24 hours, or even exceeds 45 hours. In an exemplary embodiment, the transfer device can be a needle-piercing crystal bonder. During the process of transferring the electronic components by the needle-piercing crystal bonder, the transfer device picks up the electronic components from the wafer and pushes / punctures the carrier film to achieve the purpose of peeling the electronic components off the film material. The long-term and huge amount of pushing / puncturing will cause the film material to deform and thus affect the accuracy of picking up the electronic components. For example, the electronic components may be misplaced in rows or columns. At the same time, since the rule for transferring electronic components is usually to randomly pick up electronic components, it may also cause a large number of chip islands, making it impossible for the transfer device to accurately determine whether the electronic components are normal chips that need to be picked up.

[0196] In the embodiments of the present application, the misalignment of electronic components can be corrected by various methods, which are described below with two exemplary embodiments:

[0197] In the first exemplary embodiment, please refer to Figure 8 , Figure 8 is a flow chart of another method for transferring electronic components provided in an embodiment of the present application, the method comprising:

[0198] Step 801: After receiving a position deviation alarm signal, or after a first specified time interval, obtain first position information of a target electronic component and a current physical image of a first substrate.

[0199] The target electronic component is the electronic component that the transfer device theoretically needs to transfer. During the process of the transfer device transferring the target electronic component based on the updated data, if the transfer device cannot pick up the electronic component at the position corresponding to the target electronic component, a position offset alarm signal will be issued, indicating that the electronic component on the first substrate may be misaligned, resulting in the inability to pick up the target electronic component. Therefore, the embodiment of the present application responds to the position offset alarm signal to execute steps 801 to 805 to deal with the situation where misalignment has occurred, that is, offset correction.

[0200] In the embodiment of the present application, executing steps 801 to 805 in response to the first specified time interval means that calibration is performed once every certain period of time, that is, timed calibration. Timed calibration can put risks in advance, thereby ensuring the accuracy of transferring electronic components for a long time. For example, the first specified time can be 4 hours or 3 hours.

[0201] It should be noted that the method for obtaining the current physical image of the first substrate can be specifically referred to the content of step 201, and no further details will be given here. The current physical image of the first substrate can be a physical image of the entire first substrate, or a local physical image of a partition of the first substrate containing actual gripping points. The use of a local physical image can improve the efficiency of offset correction and timing correction, thereby improving production capacity.

[0202] Step 802: Determine first position information of an actual grasping point of a transfer device based on a current physical image of the first substrate.

[0203] The actual grasping point is the arrangement point where the transfer device actually takes the wafer based on the first position information of the target electronic component. In an exemplary embodiment, the method for determining the first position information of the actual grasping point of the transfer device may include the following sub-steps:

[0204] Sub-step 8021: obtaining a plurality of partitions of the first substrate, wherein at least one special electronic component having a special pattern is distributed in one partition.

[0205] Taking the first substrate as a wafer substrate as an example, since there are many electronic components on the wafer, by dividing the first substrate into multiple partitions, the partition where the actual grasping point is located can be quickly located, thereby improving the efficiency of determining the first position information of the actual grasping point. Here, obtaining multiple partitions of the first substrate is to determine the range contained in each partition.

[0206] Optionally, the multiple partitions of the first substrate may include: at least one of the first partition and the second partition, the multiple first partitions correspond one-to-one to the multiple groups of first positioning elements, and the multiple second partitions correspond to the multiple second positioning elements. Here, a group of first positioning elements includes at least one special electronic component, and the second positioning element is the special electronic component. The area of ​​each partition or the number of electronic components covered may be equal or unequal, that is, each partition may be evenly divided or unevenly divided. The shape of each partition may include but is not limited to a rectangle.

[0207] Based on this, the present application embodiment provides an electronic component partitioning algorithm, please refer to Fig. 9 , Fig. 9 : is a flowchart of an electronic component partitioning algorithm provided in an embodiment of the present application, the method comprising:

[0208] Step 901: Receive a partition planning instruction.

[0209] The partition planning instruction is used to instruct to perform partition planning on the first substrate.

[0210] Step 901 can be performed simultaneously with step 103 , that is, when the physical data and the original data are merged, steps 901 to 904 are executed. Similarly, step 901 can be performed simultaneously with step 215 , or step 901 can be performed simultaneously with step 707 .

[0211] Step 902: Divide into a plurality of first partitions according to the plurality of groups of first positioning elements, and determine identifiers of the plurality of first partitions.

[0212] The range of the first partition can be determined according to a corresponding set of first positioning elements. The division rules of the first partition include multiple situations:

[0213] In the first case, please refer to Fig.10 , Fig.10 yes Figure 3 A schematic diagram of a first partition in a first substrate is provided. The application can use the edge of a group of first positioning elements as the edge of the first partition to determine multiple first partitions. The multiple first partitions after division are arranged in rows and columns, and the identifiers of the multiple first partitions are determined according to the arrangement order of the multiple first partitions.

[0214] For example, Fig.10 The first substrate is divided into 25 first partitions according to the left edge and the upper edge of a group of first positioning elements, and the number of arrangement points in each second partition is different. The identifications of each first partition are: 1-1, 1-2, 1-3...1-25. It should be noted that Fig.10 Only the identifier of the first partition of the first row is illustrated, and the identifiers of the other first partitions can be sorted in sequence, which will not be described in detail here.

[0215] In the second case, the present application may divide the first partition according to the center of a group of first positioning elements. Fig.10 A group of 3*3 first positioning elements is shown, and the center thereof is the first positioning element in the second row and the second column.

[0216] In the third case, the present application may divide the first partition according to the arrangement points of a group of first positioning elements after deviating from multiple rows and columns. The first partition may include a corresponding group of first positioning elements, or a group of first positioning elements may also exceed the scope of the corresponding first partition.

[0217] Step 903: Divide the plurality of second partitions according to the plurality of second positioning elements, and determine identifiers of the plurality of second partitions.

[0218] The range of the second partition can be determined according to the corresponding second positioning element. For the division rules of the second partition, please refer to Fig.11 , Fig.11 yes Figure 3A schematic diagram of a second partition in a first substrate is provided. The present application can use the second positioning element as the center or a vertex of the second partition to determine multiple second partitions. The multiple second partitions after division are arranged in rows and columns, and the identifiers of the multiple second partitions are determined according to the arrangement order of the multiple second partitions.

[0219] For example, Fig.10 The second positioning element with coordinates (X, Y) is used as the vertex of the upper left corner of the second partition, and the matrix covered by (X, Y) ~ (X+M, Y+N) is divided into a second partition, where M and N are both positive integers. In this way, the first substrate can be divided into 100 second partitions, each of which includes 5*5 arrangement points. The identifications of the second partitions are: 2-1, 2-2, 2-3...2-100. It should be noted that Fig.11 Only the identifiers of the second partitions in the first row are illustrated, and the identifiers of the other second partitions can be sorted in sequence, which will not be described in detail here.

[0220] Step 904: import multiple identifiers of first partitions and multiple identifiers of second partitions.

[0221] The identifier of the first partition can be used to determine the range included in the first partition, and the identifier of the second partition can be used to determine the range included in the second partition. Fig.10 and Fig.11 Taking the first partition and the second partition shown as an example, after the identifier of the first partition and the identifier of the second partition are transferred into the transfer device, each layout point of the 5*5 area corresponds to two identifiers. The identifier of the first partition is used to indicate the large area where the layout positioning is located, and the identifier of the second partition is used to indicate the small area where the layout positioning is located.

[0222] Sub-step 8022: based on the current physical image of the first substrate and the multiple partitions of the first substrate, determine the partition where the actual grasping point of the transfer device is located.

[0223] The multiple partitions of the first substrate can be the identification of the first partition and the identification of the second partition. When the current physical image of the first substrate is the physical image of the first substrate as a whole, the first partition and the second partition where the actual grasping point is located can be quickly confirmed based on the identification of the first partition and the identification of the second partition that are called in.

[0224] In the case where the current physical image of the first substrate is a physical image of a part of the first substrate, as well as in the case of chip islands, the partition where the actual grasping point is located may be incorrectly determined. Based on this, the present application provides a method for inspecting the partition positioning of electronic components, which is performed based on eight partitions adjacent to the partition where the actual grasping point is located. Please refer to Fig.12 , Fig.12: is a flow chart of a method for inspecting the partition positioning of an electronic component provided in an embodiment of the present application, the method comprising:

[0225] Step 1201: Based on the current physical image of the first substrate and the identifiers of the plurality of first partitions, determine the first partition where the actual grasping point of the transfer device is located.

[0226] The range included in each first partition can be determined according to the identification of the first partition, so that the first partition where the actual grabbing point is located and the corresponding identification of the first partition can be confirmed in the current physical image of the first substrate.

[0227] Step 1202: Check whether the first partition where the actual grasping point is located is correct.

[0228] In one possible implementation, the present application can determine eight first partitions adjacent to the first partition where the actual grasping point is located, and based on the identifiers of these eight first partitions, the identifier of the first partition corresponding to the actual grasping point can be determined. By checking whether the identifier is consistent with the identifier determined in step 1201, it can be confirmed whether the first partition where the actual grasping point is located is correct.

[0229] In another possible implementation, the present application can determine the identifiers of each second partition in the first partition where the actual grasping point is located. By checking whether the identifiers of these second partitions are consistent with the identifiers of each second partition corresponding to the identifier of the first partition obtained in step 1201, it can be confirmed whether the first partition where the actual grasping point is located is correct.

[0230] Step 1203: after confirming that the first partition where the actual grasping point is located is correct, determine the second partition where the actual grasping point of the transfer device is located based on the current physical image of the first substrate and the identifiers of the plurality of second partitions.

[0231] The range of each second partition can be determined according to the identification of the second partition, so that the second partition where the actual grabbing point is located and the corresponding identification of the second partition can be confirmed in the current physical image of the first substrate.

[0232] After confirming that the first partition where the actual grasping point is located is wrong, step 1201 is executed again.

[0233] Step 1204: Check whether the second partition where the actual grasping point is located is correct.

[0234] The present application can determine eight second partitions adjacent to the second partition where the actual grasping point is located. Based on the identifiers of these eight second partitions, the identifier of the second partition corresponding to the actual grasping point can be determined. By checking whether the identifier is consistent with the identifier determined in step 1203, it can be confirmed whether the second partition where the actual grasping point is located is correct.

[0235] Step 1205: After confirming that the second partition where the actual grasping point is located is correct, determine that the partition where the transfer device actually grasps the point is located is successfully inspected.

[0236] It should be noted that after confirming that the second partition where the actual grasping point is located is wrong, step 1203 is executed again.

[0237] Optionally, in the case where steps 801 to 805 are executed in response to the first specified time interval, it can be determined whether the partition where the transfer device actually grabs the point determined by sub-step 8022 is located is consistent with the partition where the target electronic component is located, so that it can be quickly confirmed whether the first substrate has shifted after the first specified time interval. It should be noted that the present application also has the situation where the partition remains unchanged and only the misalignment occurs within the partition. For this case, it is necessary to compare the first position information of the actual grabbing point of the transfer device with the first position information of the target electronic component after determining it, so as to determine whether the first substrate has shifted after the first specified time interval.

[0238] Sub-step 8023: Determine the first position information of the actual grasping point of the transfer device based on the first position information of the special electronic component in the partition where the actual grasping point of the transfer device is located.

[0239] Since the transfer device only transfers the normal components on the first substrate, the special electronic components remain on the first substrate. Therefore, during the long transfer process, the special electronic components can be used as reference components for locating the actual grasping points. Fig.11 Taking the first substrate shown as an example, since multiple partitions are divided by special electronic components, after determining the partition where the actual grasping point is located, the first position information of the special electronic component in the partition can be confirmed. In this way, the first position information of the actual grasping point can be confirmed based on the offset of the actual grasping point relative to the special electronic component in the same partition.

[0240] Step 803: Determine the offset of the first substrate based on the first position information of the target electronic component and the first position information of the actual grasping point.

[0241] The offset of the first substrate may include: an offset in the row direction and an offset in the column direction. The offset of the first substrate can be determined by obtaining the difference between the row coordinates in the first position information of the target electronic component and the actual grasping point, and the difference between the column coordinates in the first position information of the target electronic component and the actual grasping point.

[0242] Step 804 : Based on the offset of the first substrate, correct the first position information of the plurality of electronic components that have not been transferred on the first substrate to correct the update data.

[0243] Based on the offset of the first substrate, the row coordinates and column coordinates in the first position information of the multiple electronic components that have not been transferred can be corrected respectively, so that the transfer device can pick up the target electronic components based on the corrected update data, avoiding the misalignment of the electronic components.

[0244] Optionally, when correcting the update data, the update data of the transferred electronic components can be removed or marked to avoid repeated picking up of the same arrangement point in the future. When correcting the update data, the first position information of multiple electronic components before correction, as well as parameters such as offset, can also be saved as process documents to trace the cause when the subsequent product yield is poor.

[0245] Step 805 : Based on the corrected update data, transfer the plurality of electronic components from the first substrate to the second substrate.

[0246] The relevant contents of step 805 refer to the aforementioned step 104, and the detailed description is omitted here.

[0247] In summary, the embodiment of the present application provides a method for transferring electronic components. After receiving a position offset alarm signal, or after a first specified time interval, a current physical image of the first substrate is obtained, and the current physical image of the first substrate can characterize the current state and position of each electronic component on the first substrate, so as to perform offset correction or timing correction on the update data of the first substrate. Among them, the offset correction can be corrected in time after the position offset is identified, and the timing correction can detect whether there is an offset and correct it every certain period of time, thereby effectively reducing the risk of not picking up electronic components or picking up defective components, and thus improving the accuracy of electronic component transfer.

[0248] In a second exemplary embodiment, the first substrate has a plurality of grid partitions, see Fig.13 , Fig.13 It is a schematic diagram of a grid partition in a first substrate provided in an embodiment of the present application, and the multiple grid partitions include: at least one of a physical grid A1 and a visual grid A2. Among them, the physical grid A1 refers to the grid possessed by the first substrate itself, for example, a pattern of the physical grid A1 is pre-manufactured on the first substrate. The physical grid A1 can divide the first substrate into multiple first grid partitions, and assign a first grid identifier to each first grid partition, then the physical grid A1 is a real grid that can be observed in the physical image of the first substrate. The visual grid A2 refers to using the visual algorithm of the transfer device itself to divide the first substrate into multiple second grid partitions, and assigning a second grid identifier to each grid partition, then the visual grid A2 is a virtual grid divided using the visual algorithm.

[0249] The areas of each grid partition or the number of electronic components covered may be equal or unequal, that is, each grid partition may be evenly divided or unevenly divided. The shape of each grid partition may include but is not limited to a rectangle.

[0250] For a grid partitioning situation, please refer to Fig.13 , the number of first grid partitions divided by the physical grid A1 and the number of first grid partitions divided by the visual grid A2 in one first grid partition can be equal. The physical grid A1 can divide the first substrate into 9 first grid partitions, and the visual grid A2 can further divide each first grid partition into 9 second grid partitions, so the first substrate has 81 second grid partitions.

[0251] For another grid partitioning situation, please refer to Fig.14 , Fig.14 This is a schematic diagram of another grid partition in the first substrate provided by an embodiment of the present application. The number of first grid partitions divided by the physical grid A1 and the number of first grid partitions divided by the visual grid A2 in one first grid partition may not be equal. The physical grid A1 can divide the first substrate into 9 first grid partitions, and the visual grid A2 can further divide each first grid partition into 6 second grid partitions, so the first substrate has 54 second grid partitions.

[0252] It should be noted that Fig.13 and Fig.14 The grid partitions shown all use both the physical grid A1 and the visual grid A2, which can take into account the intuitiveness of the physical grid A1 and the adjustability of the visual grid A2, thereby improving the efficiency and accuracy of the grid partition positioning. In addition, only the physical grid A1 or the visual grid A2 can also be used, and this application does not limit this.

[0253] In this application, grid partitioning can be applied to Figure 7 In the electronic component transfer method shown, when determining the matching rate of the first substrate, multiple grid partitions can be used for auxiliary positioning, that is, according to the arrangement order of the multiple grid partitions, the number of first correct points and second correct points in each grid partition is confirmed one by one. This can avoid errors in the determined matching rate of the first substrate due to too many electronic components in the first substrate.

[0254] Grid partitioning can also be used for offset correction or timing correction, please refer to Fig.15 , Fig.15 is a flow chart of another method for transferring electronic components provided in an embodiment of the present application, the method comprising:

[0255] Step 1501: after receiving a position deviation alarm signal, or after a first specified time interval, obtain first position information of a target electronic component and a current physical image of at least part of a grid partition.

[0256] At least some of the grid partitions include: the grid partitions where the actual grabbing points of the transfer device are located. That is, the current physical image of at least some of the grid partitions can be a physical image of the entire first substrate, or a partial physical image of the grid partitions in the first substrate where the actual grabbing points are located. The use of partial physical images can improve the efficiency of offset correction and timing correction, thereby improving production capacity.

[0257] It should be noted that the grid partitions are divided in advance, and the first grid identifier and the second grid identifier can be called in step 1501 to determine information such as the ranges included in the multiple first grid partitions and the multiple second grid partitions.

[0258] For other relevant contents of step 1501, please refer to the aforementioned step 801, and detailed description is omitted here.

[0259] Step 1502: Determine first position information of actual grabbing points of the transfer device based on the current physical map of at least part of the grid partitions.

[0260] In an exemplary embodiment, the method for determining the first position information of the actual grasping point of the transfer device may include the following sub-steps:

[0261] Sub-step 15021: Based on the current physical map of at least part of the grid partitions, determine the relative position of the target grid partition where the transfer device actually grasps the point in the first substrate.

[0262] According to the current physical map of at least part of the grid partitions, and the first grid identifier and the second grid identifier that are called in, the target grid partition of the actual grabbing point can be quickly confirmed, and the target grid partition can include a first grid partition and a second grid partition. Since the grid partitions are divided in advance, the relative positions of the grid partitions in the first substrate and the ranges included in the grid partitions have been confirmed during the division.

[0263] Optionally, in the case where steps 1501 to 1505 are executed in response to the first specified time interval, it can be determined whether the target grid partition determined by sub-step 15021 is consistent with the grid partition where the target electronic component is located, so that it can be quickly confirmed whether the first substrate has shifted after the first specified time interval. It should be noted that the present application also has the situation where the grid partition remains unchanged and only the misalignment occurs within the grid partition. For this case, it is necessary to determine the first position information of the actual grasping point of the transfer device and compare it with the first position information of the target electronic component to determine whether the first substrate has shifted after the first specified time interval.

[0264] Sub-step 15022: Determine first position information of the actual grasping point of the transfer device based on the relative position of the target grid partition in the first substrate and the relative position of the actual grasping point of the transfer device relative to the target grid partition.

[0265] Through grid partitioning, the actual grasping point can be quickly located to the target grid partition. Based on the range contained in the target grid partition, the vertex or edge of the edge of the target grid partition is used as the reference position, and the relative position of the actual grasping point with respect to the target grid partition can be quickly confirmed, thereby determining the first position information of the actual grasping point of the transfer device.

[0266] Optionally, the actual grasping point is positioned using both the grid partition and the special electronic component to improve positioning efficiency and transfer accuracy. Exemplarily, since a plurality of special electronic components are usually provided on the first substrate, the present application can use the special electronic component in the target grid partition as a reference component, and by confirming the relative position of the actual grasping point relative to the reference component, the first position information of the actual grasping point of the transfer device can be determined.

[0267] Step 1503: Determine the offset of the first substrate based on the first position information of the target electronic component and the first position information of the actual grasping point.

[0268] The relevant contents of step 1503 refer to the aforementioned step 803, and the detailed description is omitted here.

[0269] Step 1504: Based on the offset of the first substrate, correct the first position information of the plurality of electronic components that have not been transferred on the first substrate to correct the update data.

[0270] The relevant contents of step 1504 refer to the aforementioned step 804, and the detailed description is omitted here.

[0271] Step 1505: Transfer the plurality of electronic components from the first substrate to the second substrate based on the corrected update data.

[0272] The relevant contents of step 1505 refer to the aforementioned step 805, and the detailed description is omitted here.

[0273] In summary, the embodiment of the present application provides a method for transferring electronic components. After receiving a position offset alarm signal, or after a first specified time interval, a current physical image of at least part of the grid partition is obtained, and the physical image can characterize the current state and position of each electronic component in at least part of the grid partition, so as to perform offset correction or timing correction on the update data of the first substrate. Among them, the offset correction can be corrected in time after the position offset is identified, and the timing correction can detect whether there is an offset and correct it every certain period of time, thereby effectively reducing the risk of not picking up electronic components or picking up defective components, and thus improving the accuracy of electronic component transfer.

[0274] On the other hand, the present application embodiment provides an electronic component transfer device, please refer to Fig.16 , Fig.16 1 is a schematic diagram of an electronic component transfer device provided in an embodiment of the present application, wherein the transfer device 1600 includes:

[0275] The first acquisition module 1610 is used to acquire physical data of multiple electronic components on the first substrate. The physical data of the electronic components includes: first position information and state information of the electronic components. The first position information is used to indicate position information of the electronic components in the first substrate.

[0276] The second acquisition module 1620 is used to acquire original data of a plurality of electronic components on the first substrate, where the original data of the electronic components includes: first position information and optical parameters of the electronic components.

[0277] The merging module 1630 is used to merge the physical data and the original data of multiple electronic components after determining that the physical data of at least some electronic components match the first position information in the original data to obtain updated data of the multiple electronic components. The updated data of the electronic components includes: the first position information, status information and optical parameters of the electronic components.

[0278] The transfer module 1640 is configured to transfer the plurality of electronic components from the first substrate to the second substrate based on the update data.

[0279] On the other hand, an embodiment of the present application provides a computer device, which includes: a memory and a processor, wherein at least one computer program is stored in the memory, and the at least one computer program is loaded and executed by the processor to implement any method provided in the above embodiments.

[0280] On the other hand, a computer-readable storage medium is provided, in which at least one computer program is stored. The at least one computer program is loaded and executed by a processor to implement the method provided in any of the above embodiments.

[0281] On the other hand, a computer program product is provided, including a computer program / instruction, and when the computer program / instruction is executed by a processor, the method provided in any of the above embodiments is implemented.

[0282] In this application, the term "at least one of A and B" is only a description of the association relationship of the associated objects, indicating that there can be three kinds of relationships. For example, at least one of A and B can be represented by: A exists alone, A and B exist at the same time, and B exists alone. Similarly, "at least one of A, B, and C" means that there can be seven kinds of relationships, which can be represented by: A exists alone, B exists alone, C exists alone, A and B exist at the same time, A and C exist at the same time, C and B exist at the same time, and A, B, and C exist at the same time. Similarly, "at least one of A, B, C, and D" means that there can be fifteen kinds of relationships, which can be represented by: A exists alone, B exists alone, C exists alone, D exists alone, A and B exist at the same time, A and C exist at the same time, A and D exist at the same time, C and B exist at the same time, D and B exist at the same time, C and D exist at the same time, A, B, and C exist at the same time, A, B, and D exist at the same time, A, C, and D exist at the same time, B, C, and D exist at the same time, and A, B, C, and D exist at the same time.

[0283] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0284] In the present application, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0285] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A method for transferring an electronic component, characterized in that: For transferring a plurality of electronic components from a first substrate to a second substrate, the method comprising: Acquire physical data of the plurality of electronic components on the first substrate, wherein the physical data of the electronic components includes: first position information and state information of the electronic components, wherein the first position information is used to indicate position information of the electronic components in the first substrate; Acquire original data of the plurality of electronic components on the first substrate, wherein the original data of the electronic components includes: first position information and optical parameters of the electronic components; After determining that the physical data of at least part of the electronic components matches the first position information in the original data, merging the physical data and the original data of a plurality of the electronic components to obtain updated data of the plurality of the electronic components, wherein the updated data of the electronic components includes: the first position information, the state information and the optical parameters of the electronic components; Based on the update data, the plurality of electronic components are transferred from the first substrate to the second substrate.

2. The method according to claim 1, characterized in that Acquiring physical data of the plurality of electronic components on the first substrate includes: Obtaining a physical image of the first substrate; Determining first position information of the plurality of electronic components on the first substrate based on the physical image of the first substrate; Comparing the image of each electronic component in the physical image of the first substrate with the image in the defective component database to determine whether each electronic component is a defective component; When it is determined that the electronic component is not a defective component, determining that the state information of the electronic component is a first value; When it is determined that the electronic component is a defective component, the state information of the electronic component is determined to be a second value.

3. The method according to claim 2, characterized in that The step of transferring the plurality of electronic components from the first substrate to the second substrate based on the update data comprises: The electronic component whose status information in the update data is the first value is transferred from the first substrate to the second substrate.

4. The method according to claim 2, characterized in that: The method further comprises: Based on the physical data of the plurality of electronic components, a plurality of groups of first positioning elements are determined in the plurality of electronic components; a group of the first positioning elements includes a plurality of first positioning elements arranged continuously, and the state information of the first positioning elements is the second value; Based on the original data and the first position information of each of the first positioning elements, determining whether each of the first positioning elements has no optical parameters; After determining that each of the first positioning elements does not have an optical parameter, it is determined that the physical data of each of the first positioning elements matches the first position information in the original data.

5. The method according to claim 4, characterized in that The method further comprises: Acquire first position information of a plurality of second positioning elements on the first substrate, wherein the second positioning elements have a specified pattern; Based on the physical data and the first position information of each of the second positioning elements, determining whether the state information of each of the second positioning elements is the second value; After determining that the state information of each of the second positioning elements is the second value, it is determined that the physical data of each of the second positioning elements matches the first position information in the original data.

6. The method according to claim 2, characterized in that The method further comprises: Acquire first position information and grayscale values ​​of a plurality of arrangement points in the first substrate based on the physical image of the first substrate; Based on the grayscale value of each of the arrangement points, a plurality of first arrangement points and at least one second arrangement point are determined from the plurality of arrangement points; the electronic components are arranged at the first arrangement points, and the electronic components are not arranged at the second arrangement points; Based on the original data, the first position information of each of the first arrangement points, and the first position information of each of the second arrangement points, determining a matching rate of the first substrate, wherein the matching rate of the first substrate is used to characterize a matching degree between the physical data and the original data; After the matching rate of the first substrate is greater than or equal to a matching rate threshold, it is determined that the physical data of at least part of the electronic components matches the first position information in the original data.

7. The method according to claim 6, characterized in that The determining the matching rate of the first substrate based on the original data, the first position information of each of the first arrangement points, and the first position information of each of the second arrangement points includes: Based on the original data and the first position information of each of the first arrangement points, the number of first correct points in the plurality of first arrangement points is determined; the original data records the optical parameters of the electronic components at the first correct points; Based on the original data and the first position information of each of the second arrangement points, the number of second correct points in the at least one second arrangement point is determined; the original data does not record the optical parameters corresponding to the second correct points; A matching rate of the first substrate is determined based on the number of the first correct points, the number of the second correct points, and the total number of the arranged points.

8. The method according to any one of claims 1 to 7, characterized in that: The method further comprises: After receiving the position deviation alarm signal, or after a first specified time interval, acquiring the first position information of the target electronic component and the current physical image of the first substrate; the target electronic component is the electronic component that the transfer device theoretically needs to transfer; Based on the current physical image of the first substrate, determining first position information of an actual grabbing point of the transfer device; Determining an offset of the first substrate based on the first position information of the target electronic component and the first position information of the actual grasping point; Based on the offset of the first substrate, correcting the first position information of the plurality of electronic components that are not transferred on the first substrate to correct the update data; Based on the corrected update data, the plurality of electronic components are transferred from the first substrate to the second substrate.

9. The method according to claim 8, characterized in that Determining first position information of an actual grabbing point of the transfer device based on the current physical image of the first substrate includes: Acquire a plurality of partitions of the first substrate, wherein at least one special electronic component having a special pattern is distributed in one of the partitions; Based on the current physical image of the first substrate and the multiple partitions of the first substrate, determine the partition where the actual grabbing point of the transfer device is located; Based on the first position information of the special electronic component in the partition where the actual grasping point of the transfer device is located, the first position information of the actual grasping point of the transfer device is determined.

10. The method according to any one of claims 1 to 7, characterized in that: The first substrate has a plurality of grid partitions; the method further comprises: After receiving the position deviation alarm signal, or after a first specified time interval, the first position information of the target electronic component and the current physical map of at least part of the grid partitions are obtained; the target electronic component is the electronic component that the transfer device theoretically needs to transfer; at least part of the grid partitions include: the grid partition where the actual grabbing point of the transfer device is located; Determining first position information of actual grabbing points of the transfer device based on the current physical map of at least part of the grid partitions; Determining an offset of the first substrate based on the first position information of the target electronic component and the first position information of the actual grasping point; Based on the offset of the first substrate, correcting the first position information of the plurality of electronic components that are not transferred on the first substrate to correct the update data; Based on the corrected update data, the plurality of electronic components are transferred from the first substrate to the second substrate.

11. The method according to claim 10, characterized in that Determining first position information of an actual grabbing point of the transfer device based on the current physical map of at least part of the grid partitions includes: Based on the current physical map of at least part of the grid partition, determining the relative position of the target grid partition where the actual grasping point of the transfer device is located in the first substrate; Based on the relative position of the target grid partition in the first substrate and the relative position of the actual grasping point of the transfer device relative to the target grid partition, first position information of the actual grasping point of the transfer device is determined.

12. A transfer device for electronic components, characterized in that: The transfer device comprises: a first acquisition module, configured to acquire physical data of the plurality of electronic components on the first substrate, wherein the physical data of the electronic components includes: first position information and state information of the electronic components, wherein the first position information is used to indicate position information of the electronic components in the first substrate; A second acquisition module is used to acquire original data of the plurality of electronic components on the first substrate, wherein the original data of the electronic components includes: first position information and optical parameters of the electronic components; a merging module, configured to merge the physical data of a plurality of electronic components with the original data after determining that the physical data of at least part of the electronic components matches the first position information in the original data, so as to obtain updated data of the plurality of electronic components, wherein the updated data of the electronic components includes: the first position information, the state information and the optical parameters of the electronic components; A transfer module is used to transfer the plurality of electronic components from the first substrate to the second substrate based on the update data.

13. A computer device, characterized in that: The computer device comprises: a memory and a processor, wherein at least one computer program is stored in the memory, and the at least one computer program is loaded and executed by the processor to implement the method according to any one of claims 1 to 11.

14. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores at least one computer program, and the at least one computer program is loaded and executed by a processor to implement the method according to any one of claims 1 to 11.

15. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the method according to any one of claims 1 to 11 is implemented.

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