Display device and method of manufacturing same

Abstract

A display device and a method of manufacturing the same are provided. The display device includes a display panel including a first region including a display region, a second region spaced apart from the first region, and a bendable third region between the first region and the second region. The bonding layer is in the first region, the second region, and the third region and is positioned on a lower surface of the display panel. The panel bottom cover is in the first region and bonded to the bonding layer, and the support film is in the second region and bonded to the bonding layer. A gap separating the panel bottom cover and the support film from each other is located in the third region.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2023-0156817 filed in the Korean Intellectual Property Office on November 13, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a display device and a method of manufacturing the display device. Background Art

[0004] The development of our information society has increased the demand for display devices that can display images and information in various forms. For example, display devices are applied to electronic devices such as smart phones, digital cameras, notebook computers, navigation devices, and smart TVs.

[0005] Various types of display devices such as liquid crystal displays (LCDs) and organic light emitting displays (OLEDs) are currently being used. OLEDs display images using organic light emitting elements that generate light through the recombination of electrons and holes. OLEDs may include a plurality of transistors that provide a driving current to the organic light emitting elements.

[0006] Attempts have recently been made to minimize the thickness of display devices to make them lighter. Summary of the invention

[0007] Aspects of the present disclosure may provide a display device with reduced thickness and manufacturing cost, and may provide a method for manufacturing a display device. However, the aspects of the present disclosure are not limited to those described herein. In view of the detailed description of the present disclosure given below, the above and other aspects of the present disclosure will become more clear.

[0008] According to aspects of the present disclosure, a display device may include a display panel, a bonding layer, a panel bottom cover and a supporting film, the display panel including a first area including a display area, a second area spaced apart from the first area and a flexible third area positioned between the first area and the second area, the bonding layer being arranged in the first area, the second area and the third area of ​​the display panel and positioned on the lower surface of the display panel, the panel bottom cover being arranged in the first area of ​​the display panel and bonded to the bonding layer, the supporting film being arranged in the second area of ​​the display panel and bonded to the bonding layer, wherein a gap separating the panel bottom cover and the supporting film from each other is provided in the third area.

[0009] In an embodiment, the bonding layer may include a fixing adhesive layer positioned on a lower surface of the display panel and a photo-peelable adhesive layer positioned on a lower surface of the fixing adhesive layer.

[0010] In an embodiment, the bonding layer may include an optical coupling adhesive layer positioned on a lower surface of the display panel and a photo-peelable adhesive layer positioned on a lower surface of the optical coupling adhesive layer.

[0011] In an embodiment, the adhesive strength of the optical coupling adhesive layer after light irradiation may be 250 gf / inch or more, and the adhesive strength of the photo-peelable adhesive layer after light irradiation may be 50 gf / inch or less.

[0012] In an embodiment, the display device may further include a protective layer formed on a lower surface of the photo-peelable adhesive layer in the third region.

[0013] In an embodiment, the panel bottom cover may include an adhesive member bonded to the bonding layer in the first region, a heat dissipation member bonded to the adhesive member and dissipating heat of the display panel, and a bending adhesive member bonded to the heat dissipation member and fixing the display panel in a bent configuration when the display panel is bent.

[0014] In an embodiment, the supporting film may further include a burr pattern protruding downward from a lower surface of the supporting film along an inner surface located around the gap.

[0015] In an embodiment, an angle formed by an inner surface of the supporting film adjacent to the third region and a lower surface of the bonding layer may be 70 degrees or less.

[0016] In an embodiment, the display device may further include a driving chip arranged in the second region of the display panel and positioned on an upper surface of the display panel facing the lower surface.

[0017] In an embodiment, the display device may further include a flexible printed circuit board electrically connected to the driving chip of the second area, and a substrate cover layer formed on a lower surface of the flexible printed circuit board.

[0018] In an embodiment, an end portion of the flexible printed circuit board may be bonded to an edge of the display panel in the second region, and the substrate covering layer is positioned on a lower surface of the flexible printed circuit board at the edge of the display panel and contacts a side surface of the display panel, a side surface of the bonding layer, and a side surface of the supporting film located in the second region.

[0019] In an embodiment, the substrate cover layer may further include a cover portion extending from a lower surface of the substrate cover layer toward a side surface of the supporting film in contact with the substrate cover layer and covering a portion of a lower region of the supporting film.

[0020] According to another aspect of the present disclosure, a display device is provided, including: a display panel, a bonding layer, a supporting film, a flexible printed circuit board and a substrate covering layer, the display panel including a first area including a display area, a second area spaced apart from the first area and a bendable third area positioned between the first area and the second area, the bonding layer is arranged in the first area, the second area and the third area of ​​the display panel and positioned on the lower surface of the display panel, the supporting film is arranged in the second area of ​​the display panel and bonded to the bonding layer, the flexible printed circuit board has an end portion bonded to a distal area of ​​the display panel in the second area, and the substrate covering layer is formed on the lower surface of the flexible printed circuit board.

[0021] In an embodiment, the bonding layer may include a first adhesive layer positioned on a lower surface of the display panel and a second adhesive layer positioned on a lower surface of the first adhesive layer, and the second adhesive layer is a photo-peelable adhesive layer.

[0022] In an embodiment, the display device may further include a protective layer formed on a lower surface of the photo-peelable adhesive layer in the third region.

[0023] In an embodiment, the substrate cover layer may further include a cover portion extending from a lower surface of the substrate cover layer toward a side surface of the supporting film in contact with the substrate cover layer and covering a portion of a lower region of the supporting film.

[0024] In an embodiment, the display device may further include a panel bottom cover disposed in the first region of the display panel and bonded to the bonding layer.

[0025] In an embodiment, the panel bottom cover may include an adhesive member bonded to the bonding layer in the first region, a heat dissipation member bonded to the adhesive member and dissipating heat of the display panel, and a bending adhesive member bonded to the heat dissipation member and fixing the display panel in a bent configuration when the display panel is bent, the third region includes a gap as a space formed between the supporting film and the heat dissipation member, and the supporting film also includes a burr pattern protruding downward from the lower surface of the supporting film along the inner surface located around the gap.

[0026] In an embodiment, the display device may further include a driving chip arranged in the second region of the display panel and positioned on an upper surface of the display panel.

[0027] According to another aspect of the present disclosure, a method for manufacturing a display device is provided, the display device having a display panel, the display panel including a first area including a display area, a second area spaced apart from the first area, and a bendable third area including a gap located between the first area and the second area, the method including: preparing a display panel, wherein a bonding layer is formed on the entire lower surface of the display panel in the first area to the third area and a supporting film layer is bonded to the bonding layer; forming a cutting line in the supporting film layer as a boundary between the second area and the third area; selectively irradiating light onto the first area and the third area of ​​the supporting film layer in which the cutting line is formed; forming the supporting film layer as a supporting film in the second area by peeling off and removing the supporting film layer of the first area and the third area irradiated with light; and forming a panel bottom cover on the bonding layer in the first area at a position spaced apart from the supporting film of the second area by the gap.

[0028] In an embodiment, the bonding layer may include a first adhesive layer positioned on a lower surface of the display panel and a second adhesive layer positioned on a lower surface of the first adhesive layer, and the second adhesive layer is a photo-peelable second adhesive layer.

[0029] In an embodiment, the first adhesive layer may be a fixed adhesive layer whose adhesive strength is maintained without changing due to light irradiation, or an optical coupling adhesive layer. The optical coupling adhesive layer may have an adhesive strength of 100 gf / inch or less before light irradiation, and may increase the adhesive strength to 250 gf / inch or more after light irradiation.

[0030] In an embodiment, the second adhesive layer may be formed as a photo-peelable second adhesive layer having an adhesive strength of 250 gf / inch or more before light irradiation, and the adhesive strength is reduced to 50 gf / inch or less after light irradiation.

[0031] In an embodiment, the cutting line may be formed by cutting the supporting film layer through a laser process.

[0032] In an embodiment, in the step of forming the cutting line, a burr pattern protruding from the supporting film may be formed in the cutting region where the cutting line is formed.

[0033] In an embodiment, in the step of forming the cutting line, a cutting surface is formed in the supporting film layer, and an inclined angle formed between the cutting surface and a lower surface of the second adhesive layer may be 70 degrees or less.

[0034] In an embodiment, in the irradiating light, a mask including light-transmitting portions corresponding to the first and third regions and a light-blocking portion corresponding to the second region may be arranged based on the cutting line.

[0035] In an embodiment, forming the panel bottom cover includes forming an adhesive member on the second adhesive layer of the bonding layer in the first area and forming a heat dissipation member connected to the adhesive member to radiate heat from the display panel, and forming a bending adhesive member connected to the heat dissipation member to fix the display panel in a bent configuration when the display panel is bent.

[0036] In an embodiment, in the third region, the method may further include forming a protective layer on at least one of an upper surface of the display panel and a lower surface of the second photo-peelable adhesive layer.

[0037] In an embodiment, the method may further include forming a driving chip arranged in the second region of the display panel and positioned on an upper surface of the display panel.

[0038] In an embodiment, the method may further include forming a flexible printed circuit board electrically connected to the driving chip and having an end portion connected to a distal region of the display panel in the second region, and forming a substrate covering layer positioned on a lower surface of the flexible printed circuit board in the end region of the display panel and contacting a side surface of the display panel located in the second region, a side surface of the bonding layer, and a side surface of the supporting film.

[0039] In an embodiment, in the step of forming the substrate cover layer, the substrate cover layer may be formed with a covering portion extending from a lower surface of the substrate cover layer toward a side of the support film contacting with a side of the substrate cover layer and covering a portion of a lower region of the support film.

[0040] According to the present disclosure, a bonding layer can be formed on the entire lower surface of the display panel. Therefore, the panel bottom cover, the supporting film and the lower protective layer in different areas can all be bonded to the lower surface of the display panel using one bonding layer. That is, since only one bonding layer is provided, the number of parts for bonding the above elements can be reduced, thereby reducing the thickness and manufacturing cost. In addition, since the process of bonding each of the above elements is simplified, the efficiency of the manufacturing process can be improved.

[0041] In addition, in the manufacturing process, the supporting film layer can be bonded, and then the light-peelable adhesive layer whose adhesive strength is reduced by light irradiation is peeled off. Therefore, the supporting film layer does not remain to cause defects or damage to the peeling surface. Therefore, the defect rate can be reduced, and problems such as tearing during the peeling process can be suppressed.

[0042] On the other hand, if the supporting film is arranged in the first region, the position of the neutral plane may change due to the supporting film when the display panel is bent or folded. However, in the present disclosure, since the supporting film is not arranged in the first region, the position of the neutral plane can remain unchanged.

[0043] In addition, if the supporting film is positioned in the first region, the overall thickness may increase due to the increase of the stacking structure in the first region including the display region. However, according to the present disclosure, the supporting film is arranged in the second region as the non-display region and is not arranged in the first region including the display region. Therefore, the stacking structure in the first region including the display region can be reduced, thereby reducing the overall thickness of the display device.

[0044] Furthermore, since the supporting film is not disposed in the first region, the stacked structure in the first region including the display region can be reduced, thereby reducing manufacturing costs.

[0045] In addition, the supporting film is not arranged in the first area, but is arranged on the lower surface of the display panel at a position corresponding to the driving chip in the second area. Therefore, the display panel can be protected in the second area, and the problems of cracks and driving chip defects can be solved.

[0046] Furthermore, since the panel bottom cover is positioned in the first region, the display panel can be stably supported in the second region.

[0047] In addition, a cover portion is formed adjacent to the supporting film of the second region to seal a portion of the lower surface of the supporting film. Therefore, moisture can be prevented from penetrating into the flexible printed circuit board and the driving chip connected to the flexible printed circuit board, thereby preventing corrosion caused by moisture.

[0048] However, the effects of the present disclosure are not limited to the above-mentioned effects, and various other effects are included in the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] These and / or other aspects will become clear and more readily understood from the following description of exemplary embodiments taken in conjunction with the accompanying drawings.

[0050] Figure 1 is a perspective view of a display device according to an embodiment.

[0051] Figure 2 yes Figure 1 A plan view of a display device.

[0052] Figure 3 yes Figure 1 A rear view of the display device.

[0053] Figure 4 yes Figure 3 A rear view of a display panel in a display device.

[0054] Figure 5 is a cross-sectional view schematically showing a stacked structure in an embodiment of a display panel.

[0055] Figure 6yes Figure 5 An enlarged cross-sectional view of the stacking structure of a display panel.

[0056] Figure 7 is along Figure 2 and Figure 3 A cross-sectional view taken along line X1-X1'.

[0057] Figure 8 yes Figure 7 Magnified view of the first area.

[0058] Fig. 9 yes Figure 7 An enlarged view of the boundary area between the second area and the third area.

[0059] Fig.10 yes Figure 7 An enlarged view of the display panel, bonding layer, supporting film and panel bottom cover in the first to third areas.

[0060] Fig.11 yes Figure 7 An enlarged view of a portion of the diagram showing the second area and the flexible printed circuit board bonding area.

[0061] Fig.12 It is in a bent state Figure 7 A cross-sectional view of a display device.

[0062] Fig.13 is a flowchart of a method of manufacturing a display device according to an embodiment of the present disclosure.

[0063] Fig.14 is a perspective view of an embodiment of a mother substrate for a display device.

[0064] Fig.15 yes Fig.14 A rear view of the mother substrate shown in FIG.

[0065] Fig.16 , Fig.17 , Fig.18 , Fig.19 , Fig. 20 and Fig.21 is Fig.13 A cross-sectional view of a structure formed during a manufacturing process. DETAILED DESCRIPTION

[0066] Now, exemplary embodiments will be described more fully below with reference to the accompanying drawings. The exemplary embodiments illustrate the principles and aspects of the present disclosure, but the present disclosure should not be construed as being limited to the specific embodiments set forth herein. On the contrary, the exemplary embodiments are described so that the present disclosure will be thorough and complete and will be understood by those skilled in the art.

[0067] In the entire specification and drawings, the same reference numerals refer to the same components. In the drawings, the thickness of layers and regions and the size or shape of elements may be exaggerated or changed for clarity or convenience of explanation.

[0068] When the present disclosure refers to a layer being "on" another layer or substrate, the layer can be directly on the other layer or substrate, or intervening layers may also be present. Likewise, elements referred to as being "below," "to the left," or "to the right" of other elements include the case where the element is directly adjacent to the other element, or where layers or other materials are interposed between the elements.

[0069] Although the terms "first", "second", etc. may be used herein to describe various elements, the elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the teachings of the present disclosure, the first element discussed below may be referred to as the second element. Similarly, the second element may also be referred to as the first element.

[0070] The features of each of the various embodiments of the present disclosure may be combined with each other in part or in whole, and may interact with each other in various technical aspects, and the corresponding embodiments may be implemented independently of each other, or may be implemented together in association with each other.

[0071] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0072] Figure 1 is a perspective view of a display device 1 according to an embodiment. Figure 2 yes Figure 1 1 is a plan view of the display device 1 shown in FIG. Figure 3 yes Figure 1 2 is a rear view of the display device 1 shown in FIG. Figure 4 yes Figure 3 FIG. 1 is a rear view of the display panel 100 in the display device 1. Here, Figures 1 to 4 The display device 1 is shown before being bent or folded.

[0073] The display device 1 may be applied to a portable terminal or the like. Examples of portable terminals may include tablet PCs, smart phones, personal digital assistants (PDAs), portable multimedia players (PMPs), game consoles, and watch-type electronic devices. However, the present disclosure is not limited to a specific type of display device 1. For example, in other embodiments of the present disclosure, the display device 1 may be used in small and medium-sized electronic devices such as PCs (such as notebook computers), car navigation devices, and cameras, as well as in large electronic devices such as televisions and outdoor billboards.

[0074] In an embodiment, the display panel 100 in the display device 1 may have a rectangular shape. The display panel 100 may have a rectangular shape in a plan view, and may include two short sides, two long sides, and a rectangular panel surface formed by the short sides and the long sides.

[0075] The display panel 100 is shown as a rectangular planar shape in which each corner where the long side and the short side intersect is a right angle. However, the present disclosure is not limited thereto. The corners of the display panel 100 may alternatively be bent, and the planar shape of the display panel 100 may alternatively be round or may have various other shapes.

[0076] exist Figure 1 , the short side of the display panel 100 extends in the first direction x, the long side of the display panel 100 extends in the second direction y, and the direction perpendicular to the panel surface of the display panel 100 is described herein as a third direction z. In addition, unless otherwise defined below, in this specification, “above”, “top”, “upper surface” and “upper side” of the display panel 100 refer to the direction in which the arrow of the third direction z points, and “below”, “bottom”, “lower surface” and “lower side” of the display panel 100 refer to the direction opposite to the direction in which the arrow of the third direction z points.

[0077] The display panel 100 may include a self-luminous element. In an exemplary embodiment, the self-luminous element may include at least one of an organic light emitting diode, a quantum dot light emitting diode, an inorganic material-based micro light emitting diode (e.g., a micro LED), and an inorganic material-based nano light emitting diode (e.g., a nano LED). For convenience of description, each element of the display panel 100 will be described in detail below using an example including a self-luminous element as an organic light emitting element.

[0078] The display panel 100 may be divided or zoned based on an image display function, in which case the display panel 100 may include a display area DA that displays an image and a non-display area NDA that does not display an image. The non-display area NDA may be positioned around the display area DA and may surround the display area DA.

[0079] The display panel 100 may alternatively be divided or zoned based on bendability, in which case the display panel 100 may include a first area A1, a second area A2, and a third area A3.

[0080] The first area A1 may be spaced apart from the second area A2, may include the display area DA, and may be foldable. For example, the end of the first area A1 can be folded upward or downward based on the folding axis FX extending along the first direction x. That is, if based on Figure 1To explain, the first area A1 can be folded by moving the end of the first area A1 in a direction in which an arrow of the third direction z points (ie, an upward direction) or in a direction opposite to the direction in which the arrow of the third direction z points (ie, a downward direction).

[0081] The second area A2 may be spaced apart from the first area A1 and may be a part of the non-display area NDA. The third area A3 may include a gap G positioned between the first area A1 and the second area A2 and may be another part of the non-display area NDA. The gap G may be formed to cross the non-display area NDA along a first direction x which is a short side direction of the display panel 100.

[0082] The display panel 100 can be bent based on the bending axis BX extending along the first direction x in the third area A3, and a portion of the display panel 100 can be bent downward based on the bending axis BX in the third area A3. Since a portion of the non-display area NDA of the display panel 100 is bent toward the bottom of the display panel 100, the portion of the non-display area NDA visible from above the display device 1 can be reduced, and the frame width of the display device 1 can be reduced.

[0083] A driving chip IC may be disposed on the display panel 100 in the second area A2 , and a pad connected to the driving chip IC may be disposed in the second area A2 .

[0084] The driver chip IC may include at least one driving device, such as a data driver that transmits a data signal to a data line, a gate driver that transmits a gate signal to a gate line, and a signal controller that controls the operation of the data driver and the gate driver. The display device 1 may include any number of driver chips and is not limited to a single driver chip IC as shown in the illustrated example.

[0085] The driver chip IC may be mounted on the display panel 100 using a chip on plastic method. The driver chip IC may be mounted on the display panel 100 using a pressurizing device. The driver chip IC may be mounted on the display panel 100 using an anisotropic conductive film. Alternatively, in an embodiment, the driver chip IC may be mounted on the display panel 100 using an ultrasonic bonding method instead of a separate anisotropic conductive film.

[0086] Ultrasonic bonding is a method of bonding two metals by applying pressure and ultrasonic vibration. When the driver chip IC is mounted on the display panel 100 using the ultrasonic bonding method, a process of applying pressure and ultrasonic vibration to the driver chip IC may be performed. However, the present disclosure is not limited to the above-mentioned embodiments. In an embodiment, the driver chip IC may be mounted on a flexible printed circuit board FPCB in the form of a chip on film.

[0087] An end portion of the flexible printed circuit board FPCB may be attached to the second area A2 of the display panel 100 and extend from an edge of the second area A2.

[0088] An anisotropic conductive film or the like may connect the flexible printed circuit board FPCB to the pad provided on the display panel 100. The process of connecting the flexible printed circuit board FPCB to the display panel 100 may include a process of applying pressure to the flexible printed circuit board FPCB.

[0089] The main circuit board MP may be electrically connected to the display panel 100 through the flexible printed circuit board FPCB, and may exchange signals with the driving chip IC. The main circuit board MP may provide image data, control signals, power supply voltage, etc. to the display panel 100 or the flexible printed circuit board FPCB. The main circuit board MP may include active components and passive components.

[0090] Figure 5 is a cross-sectional view schematically showing a stacking structure of the display panel 100 . Figure 6 yes Figure 5 An enlarged cross-sectional view of the stacking structure of the display panel 100 is shown.

[0091] The display panel 100 may include a base substrate 110 , a driving layer 120 , an organic light emitting element layer 130 , and an encapsulation layer 140 .

[0092] The base substrate 110 provides a lower surface 101 of the display panel 100. The base substrate 110 may be a flexible substrate and may be made of a flexible polymer material. For example, the base substrate 110 may be made of a plastic having excellent heat resistance and durability such as polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyarylate, polyetherimide, polyethersulfone, or polyimide. The following describes a case where the base substrate 110 includes polyimide as an example.

[0093] The driving layer 120 includes an element for providing a signal to the organic light emitting element layer 130. The driving layer 120 may include various signal lines, for example, a scan line (not shown), a data line (not shown), a power line (not shown), and an emission line (not shown). The driving layer 120 may include a plurality of transistors and capacitors. The transistor may include a switching transistor (not shown) and a driving transistor Qd provided in each pixel (not shown).

[0094] exist Figure 6 , a driving transistor Qd formed in the driving layer 120 is shown as an example. The driving transistor Qd includes an active layer 211, a gate electrode 213, a source electrode 215, and a drain electrode 217.

[0095] The active layer 211 may be disposed on the base substrate 110. The active layer 211 may include polycrystalline silicon. Alternatively, the active layer 211 may include single crystal silicon, low temperature polycrystalline silicon, or amorphous silicon. However, the present disclosure is not limited thereto, and the active layer 211 may include an oxide semiconductor.

[0096] The driving layer 120 may further include a first insulating layer 221 disposed on the active layer 211 , and the gate electrode 213 may be located on the first insulating layer 221 .

[0097] The first insulating layer 221 may insulate the active layer 211 and the gate electrode 213 from each other. The first insulating layer 221 may include an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. The first insulating layer 221 may be a single layer or a multilayer consisting of stacked layers of different materials.

[0098] The gate electrode 213 may be positioned on the first insulating layer 221 and may overlap the active layer 211. The gate electrode 213 may include gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), or molybdenum (Mo).

[0099] The driving layer 120 may further include a second insulating layer 223 on the gate electrode 213, and the source electrode 215 and the drain electrode 217 may be disposed on the second insulating layer 223. The second insulating layer 223 may include at least one of the above insulating materials for the first insulating layer 221.

[0100] The source electrode 215 and the drain electrode 217 may be connected to the active layer 211 through contact holes CH1 and CH2 extending through the first and second insulating layers 221 and 223, respectively. The source electrode 215 and the drain electrode 217 may have a metal multilayer structure of, but not limited to, titanium (Ti) / aluminum (Al) / titanium (Ti).

[0101] The driving layer 120 may further include a protective layer 230 disposed on the source electrode 215 and the drain electrode 217. In some embodiments, the protective layer 230 may be a planarization layer. For example, the protective layer 230 may include an organic insulating material or an inorganic insulating material, or may be implemented as a composite of an organic insulating material and an inorganic insulating material.

[0102] although Figure 6 The structure of the switching transistor is not shown in the figure, but the switching transistor (not shown) and the driving transistor Qd may have substantially the same structure or a similar structure. However, the present disclosure is not limited thereto, and the switching transistor (not shown) and the driving transistor Qd may have different structures. For example, the active layer (not shown) of the switching transistor (not shown) and the active layer 211 of the driving transistor Qd may be made of different materials, or may be arranged at different layers within the display panel 100.

[0103] The driving layer 120 may be positioned in the display area DA of the display panel 100, and may also be positioned in the non-display area NDA. A portion of the driving layer 120 positioned in the non-display area NDA, for example, a portion positioned in the non-display area NDA of the first area A1, in the second area A2, and in the third area A3 may include a wiring and a pad unit electrically connected to the driving chip IC, and may also include a wiring and a pad unit electrically connected to the flexible printed circuit board FPCB.

[0104] The organic light emitting element layer 130 may include an organic light emitting element LD as a self-luminous element. The organic light emitting element LD may be provided as a top emission type, and may emit light in a thickness direction of the display panel 100 as a third direction z.

[0105] The organic light emitting element LD may include a first electrode AE, an organic layer OL, and a second electrode CE.

[0106] The first electrode AE ​​may be arranged on the protective layer 230. The first electrode AE ​​may be connected to the drain electrode 217 through a contact hole CH3 extending through the protective layer 230. The first electrode AE ​​may be a pixel electrode or an anode. The first electrode AE ​​may be a transflective electrode or a reflective electrode. When the organic light emitting element LD is a top emission type, the first electrode AE ​​may be a reflective electrode. The first electrode AE ​​may include any one or more of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), and chromium (Cr), or an alloy thereof.

[0107] The first electrode AE ​​may be a single layer made of metal oxide or metal, or a multilayer structure having a plurality of layers. For example, the first electrode AE ​​may have a single layer structure of, but not limited to, indium tin oxide (ITO), silver (Ag), or a metal mixture (e.g., a mixture of Ag and Mg); indium tin oxide (ITO) / magnesium (Mg) or indium tin oxide (ITO) / magnesium fluoride (MgF 2 ) double-layer structure; or a triple-layer structure of indium tin oxide (ITO) / silver (Ag) / indium tin oxide (ITO).

[0108] The organic layer OL may include an organic emission layer (EML) made of a low molecular organic material or a high molecular organic material. The organic emission layer may emit light in response to a current flowing through the organic emission layer. Optionally, in addition to the organic emission layer, the organic layer OL may further include a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL).

[0109] Holes and electrons respectively from the first electrode AE ​​and the second electrode CE may be injected into the organic emission layer inside the organic layer OL. The holes and electrons are combined in the organic emission layer to form excitons, and light is emitted when the excitons transition from an excited state to a ground state.

[0110] The second electrode CE may be located on the organic layer OL. The second electrode CE may be a common electrode or a cathode. The second electrode CE may be a transmissive electrode or a transflective electrode. When the second electrode CE is a transflective electrode, the second electrode CE may include lithium (Li), lithium fluoride (LiF), calcium (Ca), aluminum (Al), magnesium (Mg), barium fluoride (BaF 2 ), barium (Ba), silver (Ag) or a compound or mixture thereof (e.g., a mixture of Ag and Mg) or a material having a multilayer structure such as lithium fluoride (LiF) / calcium (Ca) or lithium fluoride (LiF) / aluminum (Al). When the second electrode CE is a transmissive electrode, the second electrode CE may include a transparent metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO) or indium tin zinc oxide (ITZO), or may include molybdenum (Mo), titanium (Ti) or silver (Ag).

[0111] The organic light emitting element layer 130 may further include a pixel defining layer PDL disposed on the protective layer 230. The pixel defining layer PDL may be formed with an opening exposing the first electrode AE, and the opening may define an emission area LTA in a plan view.

[0112] The encapsulation layer 140 may be disposed on the organic light emitting element layer 130. The encapsulation layer 140 may protect the organic light emitting element layer 130 by blocking penetration of external moisture and oxygen.

[0113] The encapsulation layer 140 may be formed as a thin film encapsulation and may include one or more organic layers and one or more inorganic layers. For example, the encapsulation layer 140 may include a first inorganic layer 141 on the second electrode CE, an organic layer 145 on the first inorganic layer 141 , and a second inorganic layer 143 on the organic layer 145 .

[0114] The first inorganic layer 141 may also be disposed on the organic light emitting element LD, and may prevent moisture, oxygen, etc. from penetrating into the organic light emitting element LD. In some embodiments, the first inorganic layer 141 may include an inorganic material, and the inorganic material may include, for example, silicon oxide (SiO x ), silicon nitride (SiN x ) and silicon oxynitride (SiON x ) any one or more of.

[0115] The organic layer 145 may be located on the first inorganic layer 141. The organic layer 145 may have an upper surface having improved flatness compared to the lower structure. The organic layer 145 may include an organic material, and the organic material may include, for example, any one of epoxy, acrylate, and urethane acrylate.

[0116] The second inorganic layer 143 may be located on the organic layer 145. The second inorganic layer 143 may perform a role substantially the same as or similar to that of the first inorganic layer 141, and may be made of a material substantially the same as or similar to that of the first inorganic layer 141. The second inorganic layer 143 may completely cover the organic layer 145. In some embodiments, the second inorganic layer 143 and the first inorganic layer 141 may contact each other outside the display area DA to form an inorganic-inorganic bond. When the inorganic-inorganic bond is formed, moisture can be effectively prevented from being introduced into the display device 1 from the outside of the display device 1.

[0117] Although each of the first inorganic layer 141, the organic layer 145, and the second inorganic layer 143 Figure 6 In the figure, it is shown as a single layer, but the present disclosure is not limited thereto. That is, at least one of the first inorganic layer 141, the organic layer 145, and the second inorganic layer 143 may also be formed as a multi-layer structure.

[0118] The encapsulation layer 140 may not completely cover the non-display area NDA of the display panel 100. For example, the encapsulation layer 140 may not be positioned in a portion of the first area A1 of the display panel 100 between the third area A3 and the display area DA, and may not be positioned in the second area A2 and the third area A3. Alternatively, the encapsulation layer 140 may be positioned in a portion of the first area A1 of the display panel 100 between the third area A3 and the display area DA, and may not be positioned in the second area A2 and the third area A3. For the convenience of description, a case where the encapsulation layer 140 is positioned in the display area DA of the display panel 100 and is not positioned in a portion of the first area A1 between the third area A3 and the display area DA and is not positioned in the second area A2 and the third area A3 will be described as an example.

[0119] Figure 7 is along Figure 2 and Figure 3 1 and is a cross-sectional view taken along line X1-X1' of FIG. 1 , and specifically is a cross-sectional view of the display panel 100 on which the panel bottom cover 300, the supporting film 400, and the substrate cover layer 500 are positioned in the first to third areas A1 to A3.

[0120] The panel bottom cover 300 is bonded to the bonding layer 410 in the first area A1 and is laterally spaced apart from the supporting film 400. The panel bottom cover 300 may be bonded to the lower surface 101 of the display panel 100 through the bonding layer 410 and may support the display panel 100.

[0121] A polarizer 310 is positioned on the panel bottom cover 300 with the display panel 100 interposed therebetween. The polarizer 310 can increase the contrast of an image on the display panel 100 by expressing pure black, and is positioned on the upper surface 102 of the display panel 100 to improve visibility of a displayed image.

[0122] The panel bottom cover 300 may include an adhesive member 320 attached to the bonding layer 410 , a heat dissipation member 330 for effectively dissipating heat of the display panel 100 , and a bending adhesive member 340 for controlling and fixing the display panel 100 in a bent configuration when the display panel 100 is bent.

[0123] The adhesive member 320 is interposed between the bonding layer 410 and the heat dissipation member 330 to attach the panel bottom cover 300 to the bonding layer 410. The adhesive member 320 may be an adhesive layer made of a pressure sensitive adhesive (PSA), and may attach the panel bottom cover 300 to the bonding layer 410. For example, the adhesive member 320 may include, but is not limited to, an acrylic or silicone adhesive. The adhesive member 320 may be formed as a pressure-sensitive adhesive layer further including a light absorbing material such as a black pigment or a black dye to absorb light incident from the outside.

[0124] The heat dissipation member 330 may be bonded by the bonding member 320, and may include a metal layer 331 and a plating layer 332 formed on at least one of the upper and lower surfaces of the metal layer 331. The metal layer 331 may be, but is not limited to, a thin film made of one or more metals selected from copper, nickel, ferrite, and silver having excellent thermal conductivity. The plating layer 332 may be made of a metal that is the same as or different from the metal forming the metal layer 331. Although Figure 7 The plating layer 332 formed on both the upper and lower surfaces of the metal layer 331 is shown, but alternatively, the plating layer 332 may be formed only on one surface of the metal layer 331 .

[0125] The heat dissipation member 330 may also be, but is not limited to, a composite layer including, for example, a first layer including graphite or carbon nanotubes and a second layer made of a metal thin film such as copper, nickel, ferrite, or silver that can shield electromagnetic waves and has excellent thermal conductivity.

[0126] When the display panel 100 is bent, the bending adhesive member 340 may restrict and fix the bent configured display panel 100. In the bent configured display panel 100, the position of the display panel 100 may be fixed by attaching the supporting film 400 to the bending adhesive member 340. The bending adhesive member 340 may include, but is not limited to, acrylic or silicone adhesive.

[0127] The panel bottom cover 300 may further include a buffer member (not shown). The buffer member may be positioned on the heat dissipation member 330 and the curved adhesive member 340. The buffer member (not shown) may be formed as a cushion layer to support the display panel 100, and may absorb external impact to prevent damage to the display panel 100. For example, the buffer member (not shown) may be made of a polymer resin such as polyurethane, polycarbonate, polypropylene, or polyethylene, or may be made of an elastic material such as a sponge formed by foaming rubber, a urethane-based material, or an acrylic-based material.

[0128] The supporting film 400 is spaced apart from the heat dissipation member 330 of the panel bottom cover 300. In particular, the gap G is located in the third area A3 and provides a space between the supporting film 400 of the second area A2 and the heat dissipation member 330 of the first area A1.

[0129] Figure 7 A flat configuration of the display panel 100 is shown in which the supporting film 400 is spaced apart from the heat dissipation member 330 in a horizontal direction and a gap G is located between the supporting film 400 and the heat dissipation member 330. The supporting film 400 and the heat dissipation member 330 spaced apart from each other may be parallel to each other.

[0130] The supporting film 400 is bonded to the lower surface 101 of the display panel 100 through the bonding layer 410 in the second area A2 at a position corresponding to and overlapping the driving chip IC in the vertical direction.

[0131] The supporting film 400 may be made of, for example, at least one of polyethylene terephthalate (PET), polycarbonate (PC), and polymethyl methacrylate (PMMA). The supporting film 400 may be specifically made of polyethylene terephthalate (PET), but the present disclosure is not limited thereto.

[0132] The supporting film 400 may be made of a film having high tensile modulus or high light transmittance.

[0133] When the supporting film 400 is made of a film having a high tensile modulus, the supporting film 400 can support the flexible display panel 100 , protect the lower surface 101 of the display panel 100 , and prevent the formation of cracks during a process of mounting a driving chip IC on the display panel 100 .

[0134] When the driver chip IC is mounted in the second area A2 of the display panel 100, pressure may be applied to the second area A2. Here, since the supporting film 400 disposed on the lower surface 101 of the display panel 100 corresponding to the second area A2 has a high tensile modulus, it is possible to prevent the pressure applied during the process of mounting the driver chip IC from forming cracks in the wiring in the non-display area NDA.

[0135] When the supporting film 400 is made of a film having high light transmittance, the light transmittance of the supporting film 400 may be, but is not limited to, about 80% or more.

[0136] When the supporting film 400 is made of a film having a high light transmittance, the driver chip IC can be mounted on the display panel 100 by high-voltage bonding in the second area A2 to which the supporting film 400 is bonded. It is possible to check whether the driver chip IC has been correctly mounted by observing the bonding through the supporting film 400 using an optical microscope or the like. Here, since the light transmittance of the supporting film 400 positioned in the second area A2 to which the driver chip IC is mounted is high, it is possible to more easily check the mounting state of the driver chip IC. Therefore, it is possible to detect or solve the defect problem caused by the compression of the driver chip IC.

[0137] In the case where the first area A1 is spaced apart from the second area A2, the display panel 100 may be folded along the folding axis FX. Here, if the supporting film 400 is arranged in the foldable first area A1, the supporting film 400 may change the position of the neutral plane when the display panel 100 is bent or folded. Figure 7 In the embodiment of FIG. 4 , the supporting film 400 is not arranged in the first area A1 , and thus the supporting film 400 does not change the position of the neutral plane in the first area A1 .

[0138] If the supporting film 400 is positioned in the first area A1, the overall thickness of the display device 1 may increase because the stacking structure included in the display area DA increases in the first area A1. However, according to the present disclosure, the supporting film 400 is arranged in the second area A2 as the non-display area NDA, and is not arranged in the first area A1 including the display area DA. Therefore, the stacking structure in the first area A1 and the display area DA can be reduced, thereby reducing the overall thickness of the display device 1.

[0139] In addition, since the supporting film 400 is not disposed in the first area A1 , the stacked structure in the first area A1 and the display area DA can be reduced, thereby reducing the manufacturing cost.

[0140] According to the present disclosure, the supporting film 400 is not arranged in the first area A1, but is positioned on the lower surface 101 of the display panel 100 at a position corresponding to the driving chip IC of the second area A2. Therefore, the display panel 100 can be protected in the second area A2, and the problems of cracks and driving chip defects can be solved.

[0141] The bonding layer 410 may be formed on the entire lower surface 101 of the display panel 100 in all the regions A1 to A3 including the first region A1, the second region A2, and the third region A3 in a horizontal direction. The bonding layer 410 bonds the panel bottom cover 300 to the lower surface 101 of the display panel 100 in the first region A1, and bonds the supporting film 400 to the lower surface 101 of the display panel 100 in the second region A2. In addition, the bonding layer 410 may bond a lower protective layer 600b, which will be described later, to the lower surface 101 of the display panel 100 in the third region A3.

[0142] Since the bonding layer 410 is formed on the entire lower surface 101 of the display panel 100, the panel bottom cover 300, the supporting film 400, and the lower protective layer 600b located in different areas A1 to A3 can all be bonded to the lower surface 101 of the display panel 100 using one bonding layer 410. That is, since only one bonding layer 410 is provided, the number of parts for bonding the above elements can be reduced, thereby reducing the thickness and manufacturing cost of the display device 1. In addition, since the process of bonding each of the above elements is simplified, the efficiency of the manufacturing process can be improved.

[0143] The bonding layer 410 may have adhesiveness capable of attaching the supporting film 400 , and may have a high storage modulus.

[0144] Figure 7 The bonding layer 410 in the embodiment includes a first adhesive layer 420 positioned on the lower surface 101 of the display panel 100 and a second adhesive layer 430 positioned on the lower surface of the first adhesive layer 420. The first adhesive layer 420 is interposed between the lower surface 101 of the display panel 100 and the second adhesive layer 430, and is bonded to the lower surface 101 of the display panel 100.

[0145] The first adhesive layer 420 may be a fixed adhesive layer whose adhesive strength is maintained without change due to light irradiation, or an optical coupling adhesive layer whose adhesive strength is increased by light irradiation. When the first adhesive layer 420 is an optical coupling adhesive layer, the adhesive strength of the first adhesive layer 420 may be 100 gf / inch or less before light irradiation, and may be 250 gf / inch or more after light irradiation.

[0146] The second adhesive layer 430 is interposed between the first adhesive layer 420 and the panel bottom cover 300 in the first area A1, and between the first adhesive layer 420 and the supporting film 400 in the second area A2. The second adhesive layer 430 is interposed between the first adhesive layer 420 and the lower protective layer 600b in the third area A3.

[0147] The second adhesive layer 430 may be a light-peelable adhesive layer whose adhesive strength is reduced by light irradiation. When the second adhesive layer 430 is a light-peelable adhesive layer, the adhesive strength of the second adhesive layer 430 may be 250 gf / inch or more before light irradiation, and may be reduced to 50 gf / inch or less after light irradiation. In this case, the second adhesive layer 430 can be easily peeled off during the manufacturing process. Therefore, the process convenience can be improved, and since the removed second adhesive layer 430 does not leave residue or damage on the peeled surface, the defect rate can be reduced.

[0148] The second adhesive layer 430 may include, for example, one or more of polyester acrylate resin, unsaturated polyester resin, polyurethane acrylate resin, epoxy acrylate resin, epoxy resin, polyether acrylate resin, and polythiol acrylate resin. Most preferably, the second adhesive layer 430 may include an ultraviolet (UV) removable adhesive, but the present disclosure is not limited thereto.

[0149] When the storage modulus of the bonding layer 410 is high, since the bonding layer 410 having the high storage modulus is positioned where pressure is applied in the second area A2 of the display panel 100 , cracks formed by pressure can be prevented during a process of mounting a driving chip IC.

[0150] The substrate cover layer 500 may be disposed on the lower surface of the flexible printed circuit board FPCB at a position in contact with the bonding layer 410 and the supporting film 400 of the second area A2 and the display panel 100. The substrate cover layer 500 may be formed using various forms of organic layers and may include, for example, one or more of an acrylic resin and a urethane resin. However, the present disclosure is not limited thereto.

[0151] The lower protective layer 600b may be disposed on the bonding layer 410 at a position corresponding to the third area A3. The upper protective layer 600a may be positioned on the upper surface 102 of the display panel 100 to overlap with the lower protective layer 600b. In addition, each of the protective layers 600a and 600b may be disposed at a position between the first area A1 and the second area A2.

[0152] The upper protective layer 600 a is positioned between the polarizer 310 in the first area A1 and the driving chip IC in the second area A2 in a horizontal direction, and is disposed on the upper surface 102 of the display panel 100 .

[0153] The upper protective layer 600 a may serve as a neutral plane adjusting layer on the non-display area NDA of the display panel 100 and thus may also be referred to as a neutral plane adjusting layer 600 a hereinafter.

[0154] The neutral plane adjustment layer 600a may overlap the bendable third area A3 of the non-display area NDA of the display panel 100. The neutral plane adjustment layer 600a may be formed only in the third area A3. Alternatively, a portion of the neutral plane adjustment layer 600a may also be formed to overlap the first area A1 and / or the second area A2.

[0155] The neutral plane adjustment layer 600a can prevent cracks from forming in the wiring within the driving layer 120 by relieving the stress applied to the driving layer 120 in the bendable third area A3. More specifically, the driving layer 120 may include wiring passing through the non-display area NDA of the first area A1 and the third area A3, and the elements in the driving layer 120 may be electrically connected to the driving chip IC through the wiring. The neutral plane adjustment layer 600a can adjust the position of the neutral plane to prevent tensile stress from acting on the wiring positioned in the third area A3. Here, the neutral plane refers to a surface on which neither compressive stress nor tensile stress acts when the third area A3 of the display panel 100 is bent. For example, when the third area A3 is bent, compressive stress acts on the inner side of the bending curvature, and tensile stress acts on the outer side. Therefore, from the inner side of the curvature toward the outer side, the direction of stress gradually changes from the compressive direction to the tensile direction. At a certain critical point, there is a transition point where neither compressive stress nor tensile stress acts, and this point becomes the neutral plane. The neutral plane adjusting layer 600 a can adjust the neutral plane so that compressive stress acts on the wiring in the driving layer 120 , thereby reducing the risk of crack formation.

[0156] The neutral plane adjustment layer 600a may be made of an organic material. The organic material may be, for example, a photosensitive organic material. For example, the neutral plane adjustment layer 600a may include one or more of an acrylic resin and a urethane resin.

[0157] Although the neutral plane adjustment layer 600a is spaced apart from the driver chip IC in the drawings, the present disclosure is not limited thereto. The neutral plane adjustment layer 600a may also extend to the area where the driver chip IC is arranged, and may cover a portion of the driver chip IC. In this case, the connection reliability between the driver chip IC and the display panel 100 can be improved.

[0158] The lower protective layer 600b is positioned between the adhesive member 320 of the first area A1 and the supporting film 400 of the second area A2 and is bonded to the bonding layer 410 positioned in the third area A3. Specifically, the lower protective layer 600b may be bonded to the light-peelable adhesive layer of the second adhesive layer 430 as the bonding layer 410.

[0159] The lower protective layer 600b may be made of the same material as that of the upper protective layer 600a, and may include, for example, one or more of acrylic resin and urethane resin. The lower protective layer 600b may also be made of a material different from that of the upper protective layer 600a.

[0160] The lower protective layer 600b may be bonded to the photo-peelable adhesive layer of the second adhesive layer 430 as the bonding layer 410 in the third area A3, and may support the lower surface 101 of the display panel 100 and protect the lower surface 101 of the display panel 100. Although both the upper protective layer 600a and the lower protective layer 600b are shown in the illustrated embodiment, the present disclosure is not limited thereto, and one or both of the upper protective layer 600a and the lower protective layer 600b may be omitted in other embodiments.

[0161] Figure 8 is focused on Figure 7 An enlarged view of the first area A1. Fig. 9 yes Figure 7 An enlarged view of a boundary area between the second area A2 and the third area A3. Fig.10 yes Figure 7 1 and 2 are enlarged views of the display panel 100, the bonding layer 410, the supporting film 400, and the panel bottom cover 300 in the first to third areas A1 to A3. Fig.11 yes Figure 7 FIG. 4 is an enlarged view of the second area A2 and the flexible printed circuit board bonding area.

[0162] Figure 8 The panel bottom cover 300 may include an inner surface or side surface 301 adjacent to the gap G, an upper surface 302 facing the lower surface 413 of the bonding layer 410, and a lower surface 303 opposite to the upper surface 302. The upper surface 302 of the panel bottom cover 300 may contact the light-peelable adhesive layer of the second adhesive layer 430 as the bonding layer 410.

[0163] The angle formed by the inner surface 301 of the panel bottom cover 300 and the lower surface 413 of the bonding layer 410 may be a right angle. In this case, the panel bottom cover 300 may have a Figure 8 However, the shape of the panel bottom cover 300 is not limited to the rectangular shape.

[0164] like Fig. 9 The supporting film 400 shown in FIG. 4 includes an inner surface or side surface 401 adjacent to the gap G, an upper surface 402 facing the lower surface 413 of the bonding layer 410, and a lower surface 403 opposite to the upper surface 402. The upper surface 402 of the supporting film 400 may contact the optically removable adhesive layer of the second adhesive layer 430 as the bonding layer 410.

[0165] The inclination angle θ formed by the inner surface 401 of the supporting film 400 exposed to the gap G in the third area A3 and the lower surface 413 of the bonding layer 410 may be an acute angle. For example, the inclination angle θ may be between 0 and 70 degrees. However, the present disclosure is not limited thereto. For example, Fig. 9 The inclination angle θ in φ may be smaller than an angle formed by the inner surface 301 of the panel bottom cover 300 and the lower surface 413 of the bonding layer 410 , but the present disclosure is not limited thereto.

[0166] The supporting film 400 may further include a burr pattern BU protruding downward from the lower surface 403 along the inner surface 401 adjacent to the gap G. The burr pattern BU of the supporting film 400 may be formed in the process of irradiating the laser on the supporting film 400 during the manufacturing process. The burr pattern BU may be formed by melting a portion of the supporting film 400 due to the heat energy of the laser. The burr pattern BU of the supporting film 400 may protrude downward from the lower surface 403 of the supporting film 400. The burr pattern BU may extend in the same direction (e.g., along the first direction x) as the gap G.

[0167] Fig.10 The bonding layer 410 may include an upper surface 412 contacting the lower surface 101 of the display panel 100 and a lower surface 413 opposite to the upper surface 412 .

[0168] The panel bottom cover 300 of the first area A1, the supporting film 400 of the second area A2, and the lower protective layer 600b of the third area A3 may be arranged on the lower surface 413 of the bonding layer 410. That is, the adhesive member 320, the lower protective layer 600b, and the supporting film 400 may be bonded together to the light-peelable adhesive layer of the second adhesive layer 430 as the bonding layer 410.

[0169] Fig.11 The substrate cover layer 500 may include a cover layer side surface 501, a cover layer upper surface 502, and a cover layer lower surface 503. The cover layer side surface 501 contacts the corresponding side surfaces 411a, 401a, and 103 of the bonding layer 410, the supporting film 400, and the display panel 100. The cover layer upper surface 502 contacts the lower surface of the flexible printed circuit board FPCB, and the cover layer lower surface 503 is opposite to the cover layer upper surface 502.

[0170] The cover layer upper surface 502 may support the flexible printed circuit board FPCB from below, and the cover layer side surface 501 may support and protect the bonding layer 410 , the supporting film 400 , and the corresponding side surfaces 411 a , 401 a , and 103 of the display panel 100 .

[0171] The substrate cover layer 500 may further include a cover portion 504 extending from the cover layer lower surface 503 toward the side surface 401a of the supporting film 400. The cover portion 504 may cover, i.e., seal a portion of the lower surface 403 of the supporting film 400. Therefore, it is possible to prevent moisture from penetrating into the flexible printed circuit board FPCB and the driving chip IC connected to the flexible printed circuit board FPCB, thereby preventing corrosion due to moisture.

[0172] Fig.12 It is in a bent state Figure 7 1 is a cross-sectional view of a display device 1, more specifically, a cross-sectional view of a non-display area NDA of the display device 1 in a bent state.

[0173] Reference Fig.12 The display panel 100 of the display device 1 can be bent around a bending axis BX (see Figure 1 ) to place the second area A2 of the display panel 100 below the first area A1 of the display panel 100. The bending axis BX (see Figure 1 ) extends in the first direction x in the third area A3. Since the gap G overlapping the third area A3 is located between the panel bottom cover 300 and the supporting film 400, the third area A3 of the display panel 100 can be bent more easily. Here, the bending brings the supporting film 400 into contact with the bending adhesive member 340 of the panel bottom cover 300, so that the display panel 100 in a bent configuration can be fixed by the bending adhesive member 340.

[0174] Depending on the position where the supporting film 400 is attached to the curved adhesive member 340, the alignment state can be changed. For example, the display panel 100 and the supporting film 400 may have respective edges aligned in a row in the vertical direction. Alternatively, as Fig.12 As shown in FIG. 1 , moving the supporting film 400 to the right and fixing the supporting film 400 in this position may allow the supporting film 400 to form a step on the display panel 100 .

[0175] Since a portion of the non-display area NDA of the display panel 100 is bent, the area of ​​the non-display area NDA of the display device 1 visible from the top of the display device 1 is reduced, and it is possible to reduce the border width around the display area DA of the display device 1. In addition, the neutral plane adjustment layer 600a located on the display panel 100 overlapping the third area A3 may be selected to prevent the formation of cracks in the wiring of the display panel 100 in the third area A3, and thereby improve the reliability of the display device 1.

[0176] Now except Figures 1 to 12 In addition, refer to Figures 13 to 21 A method of manufacturing the display device 1 according to the present disclosure will be described.

[0177] The method of manufacturing the display device 1 according to the present disclosure may include: Fig.13 The operations shown in .

[0178] First, the display panel 100 ( Fig.13 The display panel 100 may be specifically attached with a bonding layer 410 and a supporting film 400.

[0179] Reference Fig.14 and Fig.15 , a mother substrate 2000 may be prepared, a bonding layer 410 may be formed on a lower surface of the mother substrate 2000 , and a supporting film layer 400 a in an original state may be bonded to the bonding layer 410 to produce a mother substrate structure MS.

[0180] The mother substrate structure MS may include a plurality of display units 1000 and a dummy region except for the display units 1000 .

[0181] Each display unit 1000 may be separated from the mother substrate 2000 to form the display panel 100. Each display unit 1000 may include a first area A1, a second area A2, and a third area A3. The cross-sectional stacking structure of each display unit 1000 may be similar to Figure 5 or Figure 6 The cross-sectional stacking structure of the display panel 100 shown in FIG. 1 is the same.

[0182] The dummy area may be a portion other than the display unit 1000 and an area to be removed by a laser cutting process.

[0183] After manufacturing the mother substrate structure MS, a cutting process may be performed by irradiating laser onto the mother substrate structure MS. In the cutting process, the display unit 1000 may be separated by removing the dummy region from the mother substrate structure MS. Each of the separated display units 1000 may be prepared as a display panel 100 to which a bonding layer 410 and a supporting film layer 400a are attached.

[0184] Second, a cutting line 650 ( Fig.13 Here, the cutting line 650 may be formed after the display unit 1000 is separated from the mother substrate structure MS, or the display unit 1000 may be separated from the mother substrate structure MS after the cutting line 650 is formed.

[0185] Reference Figures 16 to 18, the cutting line 650 may be formed in the supporting film layer 400a by cutting the supporting film layer 400a by irradiating the laser L1 from below the supporting film layer 400a. The cutting line 650 may be specifically formed in the supporting film layer 400a by irradiating the laser L1 along the first direction x, which is the short side direction of the display panel 100. The cutting line 650 may be a boundary line between the second area A2 and the third area A3.

[0186] The cutting line region 650a is a region formed around the cutting line 650 in the process of irradiating the supporting film layer 400a with the laser L1. The burr pattern BU may be formed on the cutting surface of the supporting film layer 400a in the cutting line region 650a, and may be formed because the thermal energy of the laser L1 melts a portion of the supporting film layer 400a. Here, the laser L1 may be, but is not limited to, a CO laser having high energy efficiency. 2 The burr pattern BU may extend in the same direction as the cutting line 650 along a boundary between the third area A3 and the second area A2.

[0187] Third, a polarizer 310 ( Fig.13 The polarizer 310 may be specifically formed on the upper surface 102 of the display panel 100 in the first area A1.

[0188] Fourth, an upper protective layer 600a ( Fig.13 The upper protective layer 600a may be formed on the upper surface 102 of the display panel 100 in the third area A3. Fig.13 In the exemplary process of FIG. 4 , only the upper protective layer 600 a is formed, but an operation of forming a lower protective layer 600 b on the bonding layer 410 may be further included.

[0189] Fifth, a driving chip IC and a flexible printed circuit board FPCB ( Fig.13 The driving chip IC may be mounted on the upper surface 102 of the display panel 100 in the second area A2, and an end portion of the flexible printed circuit board FPCB may be coupled to the display panel 100 in the second area A2.

[0190] Sixth, a substrate cover layer 500 ( Fig.13 The substrate cover layer 500 may be formed on the lower surface of the flexible printed circuit board FPCB and adjacent to the edge of the display panel 100. Here, the flexible printed circuit board FPCB and the substrate cover layer 500 may be connected to the display panel 100. Figure 7 are the same as those shown in Figures 19 to 21 Not shown.

[0191] Seventh, can irradiate light ( Fig.13Operation S170 in FIG. Fig.19 , a mask 700 capable of selectively passing light may be placed under the supporting film layer 400a having the cutting line 650, and then light may be irradiated. Portions of the bonding layer 410 and the supporting film layer 400a positioned in the first area A1 and the third area A3 may be target light irradiation areas, and light may be irradiated onto the target light irradiation areas through the light-transmitting portion 701 of the mask 700. Portions of the bonding layer 410 and the supporting film layer 400a positioned in the second area A2 may be non-light irradiation areas, and the light-blocking portion 702 of the mask 700 may prevent light from irradiating the non-light irradiation areas. Here, light irradiation may be irradiation of UV light.

[0192] After irradiating UV light as described above, the adhesive strength of the light-peelable adhesive layer of the second adhesive layer 430 as the bonding layer 410 can be weakened in the first area A1 and the third area A3 irradiated with light. On the other hand, the adhesive strength of the light-peelable adhesive layer of the bonding layer 410 can be maintained in the second area A2 not irradiated with light. For example, the adhesive strength of the light-peelable adhesive layer may be 250gf / inch or more before UV light irradiation, but may be reduced to 50gf / inch or less after UV light irradiation. Therefore, the supporting film layer 400a in the target light irradiation area can be easily removed. Therefore, the supporting film layer 400a can be removed from the stripping area 800 as the target light irradiation area, so that the removed portion of the supporting film layer 400a does not cause defects or leave damage to the stripping surface. Therefore, the defect rate can be reduced. In addition, problems such as tearing during the stripping process can be suppressed. The adhesive strength can also be reduced to 20gf / inch or less, but the present disclosure is not limited thereto.

[0193] Here, when the first adhesive layer 420 of the bonding layer 410 is a fixed adhesive layer, UV light irradiation does not change the adhesive strength of the first adhesive layer 420. When the first adhesive layer 420 is an optical coupling adhesive layer, the adhesive strength of the first adhesive layer 420 may be 100 gf / inch or less before light irradiation, and may increase to 250 gf / inch or more after light irradiation. Therefore, strong adhesive strength can be provided to maintain the bonding state, and detachment of the bonding layer 410 can be prevented.

[0194] Eighth, the supporting film 400 may be formed in the non-light irradiation region (operation S180). Fig. 20, the portions of the supporting film layer 400a positioned in the first area A1 and the third area A3 as the target light irradiation area can be removed by peeling them off along the cutting line 650. Since the second adhesive layer 430 positioned in the first area A1 and the third area A3 as the target light irradiation area is formed as a light-peelable adhesive layer, its adhesive strength can be reduced by light irradiation. Therefore, the supporting film layer 400a in the first area A1 and the third area A3 can be easily peeled off and removed. The area where the supporting film layer 400a has been removed is formed as a peeling area 800.

[0195] Since the non-light irradiated area is not irradiated with light, the bonding layer 410 positioned in the second area A2 as the non-light irradiated area maintains or has high adhesive strength. Therefore, the bonding layer 410 and the supporting film layer 400a positioned in the second area A2 can remain bonded to each other. Here, the area where the bonding layer 410 and the supporting film layer 400a remain bonded to each other can be formed as a bonding area 900, and the supporting film layer 400a of the second area A2 that is not peeled off can be formed as a supporting film 400.

[0196] Ninth, the panel bottom cover 300 may be formed (operation S190). Fig.21 In the panel bottom cover 300 , the adhesive member 320 is bonded to the second adhesive layer 430 of the bonding layer 410 at a position corresponding to the first area A1 in the peeling area 800 , and is spaced apart from the supporting film 400 of the bonding area 900 .

[0197] Finally, the supporting film 400 of the second area A2 and the panel bottom cover 300 of the first area A1 share a bonding layer 410 formed throughout the first area A1 to the third area A3. The supporting film 400 of the second area A2 and the panel bottom cover 300 of the first area A1 can be bonded to the lower surface 101 of the display panel 100 through the bonding layer 410 with a gap G located in the third area A3 between them. Through these processes, the display device 1 according to the present disclosure can be manufactured.

[0198] In this way, according to the manufacturing method of the present disclosure, the manufacturing cost of the display device 1 can be reduced, and the display device 1 having a reduced thickness can be provided.

[0199] At the end of the detailed description, those skilled in the art will appreciate that many changes and modifications can be made to the exemplary embodiments without substantially departing from the principles of the present disclosure. Therefore, the exemplary embodiments are used only in a general and descriptive sense, and not for limiting purposes. Each component specifically shown in the embodiments may be modified for a specific application, and these modifications and differences related to the application should be interpreted as included within the scope defined in the appended claims.

Claims

1. A display device, comprising: a display panel including a first region including a display area, a second region spaced apart from the first region, and a bendable third region positioned between the first region and the second region; a bonding layer, the bonding layer being arranged in the first region, the second region, and the third region of the display panel, the bonding layer being positioned on a lower surface of the display panel; a panel bottom cover arranged in the first region of the display panel and bonded to the bonding layer; as well as a supporting film arranged in the second region of the display panel and bonded to the bonding layer, Wherein, a gap separating the panel bottom cover and the supporting film from each other is located in the third area.

2. The display device according to claim 1, wherein: The bonding layer includes a fixing adhesive layer positioned on the lower surface of the display panel and a photo-peelable adhesive layer positioned on a lower surface of the fixing adhesive layer.

3. The display device according to claim 1, wherein: The bonding layer includes an optical coupling adhesive layer positioned on the lower surface of the display panel and a photo-peelable adhesive layer positioned on a lower surface of the optical coupling adhesive layer.

4. The display device according to claim 3, wherein: The optical coupling adhesive layer may have an adhesive strength of 250 gf / inch or more after light irradiation, and the photo-peelable adhesive layer may have an adhesive strength of 50 gf / inch or less after the light irradiation.

5. The display device according to claim 3, further comprising: A protective layer is formed on a lower surface of the photo-peelable adhesive layer in the third region.

6. The display device according to claim 1, wherein: The panel bottom cover comprises: a bonding member bonded to the bonding layer in the first region; a heat dissipation member bonded to the adhesive member and dissipating heat of the display panel; and A curved adhesive member is bonded to the heat dissipation member to secure the display panel in a curved configuration when the display panel is curved.

7. The display device according to claim 1, wherein: The supporting film further includes a burr pattern protruding downward from a lower surface of the supporting film along an inner surface adjacent to the gap.

8. The display device according to claim 1, wherein: An angle formed by an inner surface of the supporting film adjacent to the third region and a lower surface of the bonding layer is 70 degrees or less. 9 . The display device according to claim 1 , further comprising a driving chip arranged in the second region of the display panel and positioned on an upper surface of the display panel facing the lower surface.

10. The display device according to claim 9, further comprising: A flexible printed circuit board, the flexible printed circuit board being electrically connected to the driving chip; as well as A substrate cover layer is formed on a lower surface of the flexible printed circuit board.

11. The display device according to claim 10, wherein: An end portion of the flexible printed circuit board is bonded to an edge of the display panel in the second region, and the substrate covering layer is positioned on the lower surface of the flexible printed circuit board at the edge of the display panel and contacts a side surface of the display panel located in the second region, a side surface of the bonding layer, and a side surface of the supporting film.

12. The display device according to claim 11, wherein: The substrate cover layer further includes a cover portion extending from a lower surface of the substrate cover layer toward the side surface of the supporting film in contact with the substrate cover layer and covering a portion of a lower region of the supporting film.

13. A display device, comprising: a display panel including a first region including a display area, a second region spaced apart from the first region, and a bendable third region positioned between the first region and the second region; a bonding layer, the bonding layer being arranged in the first region, the second region, and the third region of the display panel, the bonding layer being positioned on a lower surface of the display panel; a supporting film arranged in the second region of the display panel and bonded to the bonding layer; a flexible printed circuit board having an end portion bonded to a distal end region of the display panel in the second region; as well as A substrate cover layer is formed on a lower surface of the flexible printed circuit board.

14. The display device according to claim 13, wherein: The bonding layer includes a first adhesive layer positioned on the lower surface of the display panel and a second adhesive layer positioned on a lower surface of the first adhesive layer, and the second adhesive layer is a photo-peelable adhesive layer.

15. The display device according to claim 14, further comprising: A protective layer is formed on a lower surface of the photo-peelable adhesive layer in the third region.

16. The display device according to claim 13, wherein: The substrate cover layer further includes a cover portion extending from a lower surface of the substrate cover layer toward a side surface of the supporting film in contact with the substrate cover layer and covering a portion of a lower region of the supporting film. 17 . The display device of claim 13 , further comprising a panel bottom cover disposed in the first region of the display panel and bonded to the bonding layer.

18. The display device according to claim 17, wherein: The panel bottom cover includes: an adhesive member bonded to the bonding layer in the first region, a heat dissipation member bonded to the adhesive member and dissipating the heat of the display panel, and a bending adhesive member bonded to the heat dissipation member and fixing the display panel in a bent configuration when the display panel is bent, the third region includes a gap as a space formed between the supporting film and the heat dissipation member, and the supporting film also includes a burr pattern protruding downward from the lower surface of the supporting film along the inner surface adjacent to the gap. 19 . The display device of claim 18 , further comprising a driving chip disposed in the second region of the display panel and positioned on an upper surface of the display panel.

20. A method for manufacturing a display device, the display device having a display panel, the display panel including a first region including a display region, a second region spaced apart from the first region, and a bendable third region including a gap between the first region and the second region, the method comprising: preparing the display panel, wherein a bonding layer is formed on the entire lower surface of the display panel in the first region to the third region and a supporting film layer is bonded to the bonding layer; forming a cutting line in the supporting film layer as a boundary between the second area and the third area; selectively irradiating light onto the first region and the third region of the supporting film layer where the cutting line is formed; forming a supporting film in the second region by peeling and removing the supporting film layer in the first region and the third region irradiated with the light; and A panel bottom cover is formed on the bonding layer in the first region at a position spaced apart from the supporting film via the gap.

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