Endoscope device

Abstract

Provided is an endoscope device capable of increasing electric power without increasing the size of a connector portion. An endoscope device is provided with: a processor unit having a power transmission coil and a control board; and a mirror body unit having a power reception coil and an endoscope. The power transmission coil and the power reception coil at least partially overlap in the axial direction in a state where the processor unit and the mirror body unit are coupled to each other, and the power transmission coil can supply power to the power reception coil in a non-contact manner.

Description

Technical Field

[0001] The present invention relates to an endoscope device. Background Art

[0002] Some endoscope devices can be separated into a processor unit and a body unit. The body unit has an endoscope, and a camera module having multiple components such as a camera element and a lens is arranged on the front end of the endoscope. Cables for image signals, power cables, control cables, etc. are distributed on the flexible tube of the body unit.

[0003] The processor unit and the scope unit can be connected by a medium-sized electrical connector, etc. The connection portion is known to be a structure capable of contactless power supply, the connector of the scope unit has a power receiving coil, and the connector of the processor unit has a power transmitting coil.

[0004] Due to factors such as the improvement in the resolution of camera elements, the power consumption of the mirror body may increase in the future.

[0005] Patent Document 1 describes an endoscope device capable of contactless power supply as described above.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent No. 5978238 Summary of the invention

[0009] Problems to be solved by the invention

[0010] However, there is a problem in the conventional technology that it is difficult to increase the electric power without increasing the size of the connector portion.

[0011] For example, in the structure shown in Patent Document 1, the power transmission coil and the power reception coil are arranged so that the axial end faces are butted against each other. In such a structure, the coupling strength between the power transmission coil and the power reception coil is limited. Therefore, if the power consumption increases, there is a possibility of insufficient power, and it is necessary to increase the size of the connector part.

[0012] Furthermore, even if a spiral coil (a spiral shape arranged in a plane) is used, if the power consumption increases, there is a possibility that the power will be insufficient, and the size of the connector part must be increased.

[0013] An object of the present invention is to solve such problems and to provide an endoscope device capable of achieving an increase in electric power without increasing the size of a connector portion.

[0014] Solutions to Solve Problems

[0015] An example of an endoscope device according to the present invention includes:

[0016] a processor unit having a power transmission coil and a control substrate; and

[0017] The endoscope has a power receiving coil and a body portion.

[0018] When the processor unit and the mirror unit are coupled to each other, the power transmission coil and the power reception coil at least partially overlap in the axial direction, and the power transmission coil can supply power to the power reception coil in a contactless manner.

[0019] This specification includes the disclosure of Japanese Patent Application No. 2022-180061 which is the basis of the priority of this application.

[0020] Effects of the Invention

[0021] The endoscope device according to the present invention can increase the electric power without increasing the size of the connector portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a block diagram of the endoscope device according to the first embodiment of the present invention.

[0023] Figure 2 This is a detailed structure of the processor unit 20 and the mirror unit 30 .

[0024] Figure 3 2 is a perspective view showing a specific structure of the connector section 20 a included in the processor section 20 .

[0025] Figure 4 yes Figure 3 20a is a side view of the connector portion 20a.

[0026] Figure 5 yes Figure 3 A front view of the connector portion 20a.

[0027] Figure 6 1 is a perspective view showing a specific structure of the connector portion 30 a included in the mirror body portion 30 .

[0028] Figure 7 yes Figure 6 30a is a side view of the connector portion 30a.

[0029] Figure 8 yes Figure 6 A front view of the connector portion 30a.

[0030] Fig. 9 It is a diagram for explaining the relationship between the power transmission coil 21 and the power reception coil 31 .

[0031] Fig.102 is a perspective view showing a state in which the processor unit 20 and the mirror unit 30 are coupled to each other.

[0032] Fig.11 It is shown Fig.10 A top view of the state.

[0033] Fig.12 It is shown Fig.10 side view of the state. DETAILED DESCRIPTION

[0034] Next, embodiments of the present invention will be described with reference to the accompanying drawings.

[0035] [Implementation Method 1]

[0036] Figure 1 1 is a block diagram of an endoscope device according to Embodiment 1 of the present invention. The endoscope device 10 may be a device called an electronic endoscope or may be a device dedicated to medical treatment. The endoscope device 10 includes a processor unit 20 and a scope unit 30 .

[0037] The processor unit 20 includes a power transmission coil 21 and a control board 22. For example, the control board 22 functions as a control device capable of controlling the processor unit 20 or the entire endoscope device 10, and can be configured using a computer including a calculation unit and a storage unit.

[0038] The mirror body 30 includes a power receiving coil 31 and an endoscope 32. The endoscope 32 may have a known structure, for example, including a hard part that does not deform, a bending part that can be actively bent according to operation, and a flexible part that can be passively deformed, etc., starting from the front end. A camera element is installed on the hard part (hereinafter referred to as Figure 2 etc. for details).

[0039] The processor unit 20 or the scope unit 30 may also include an operation unit for operating the endoscope 32. The user of the endoscope device 10 can control the movement of the endoscope 32 by operating the operation unit. For example, the bending portion of the endoscope 32 is bent according to the operation of the operation unit. The bending portion can be realized by using a known mechanism incorporated in a conventional electronic scope, for example, the bending portion can be bent by pulling an operation wire linked to the rotation operation of a knob included in the operation unit.

[0040] The endoscope 32 can be inserted including the tip into any body cavity in the living body, for example, into the bronchus, bile duct, pancreas, hepatobiliary region, urinary region, etc.

[0041] The processor unit 20 and the mirror unit 30 are detachable from each other, that is, they are configured to be detachably coupled together. When the processor unit 20 and the mirror unit 30 are coupled to each other, the power transmission coil can supply power to the power reception coil in a contactless manner.

[0042] Figure 2 2 shows a more detailed structure of the processor unit 20 and the mirror unit 30. In the processor unit 20, the second controller 212 controls the power transmission coil 21, thereby controlling the electric power supplied to the mirror unit 30. The power supply for supplying electric power may be a battery built into the processor unit 20 or an external power supply.

[0043] In addition, the second controller 212 processes signals transmitted and received from the mirror portion 30. The post-stage signal processing circuit 270 processes input and output signals of the second controller 212. The first controller 211 controls the second controller 212 and the post-stage signal processing circuit 270.

[0044] In particular, the second controller 212 controls the laser driver 260, and the laser driver 260 controls the laser diode 250. The laser diode 250 transmits a control optical signal to the mirror portion 30, thereby controlling the operation of the mirror portion 30.

[0045] The photodiodes 221, 222, and 223 receive optical signals representing images from the mirror body 30 (e.g., images captured by the imaging element 40), convert them into electrical signals, and send them to the corresponding transimpedance amplifiers 231, 232, and 233, respectively, and further send them to the limiting amplifiers 241, 242, and 243 at the subsequent stage. The limiting amplifiers 241, 242, and 243 amplify the electrical signals and send them to the second controller 212. In this way, the second controller 212 obtains the image signal.

[0046] In the mirror body 30 , the first controller 311 controls the current monitoring unit 33 . The current monitoring unit 33 controls the circuit including the power receiving coil 31 and the resistor 34 , thereby controlling the electric power supplied from the processor unit 20 and supplying power to other parts of the mirror body 30 .

[0047] In addition, the first controller 311 receives an image signal from the image pickup element 40 and sends it to the laser drivers 361, 362, and 363. The laser drivers 361, 362, and 363 control the corresponding laser diodes 351, 352, and 353, respectively. The laser diodes 351, 352, and 353 send optical signals for image signals to the processor unit 20. For example, the optical signals from the laser diodes 351, 352, and 353 of the mirror unit 30 are received by the photodiodes 221, 222, and 223 of the processor unit 20, respectively.

[0048] The photodiode 320 receives the optical signal for control from the processor unit 20, converts it into an electrical signal, sends it to the transimpedance amplifier 330, and further sends it to the subsequent limiting amplifier 340. The limiting amplifier 340 amplifies the electrical signal and sends it to the second controller 312. In this way, the second controller 312 receives the control signal.

[0049] exist Figure 2 In the example of FIG. 4 , the imaging element 40 is not included in the mirror body 30, but as a modified example, the imaging element 40 may be included in the mirror body 30. Figure 2 Although not shown in the figure, the processor unit 20 and the mirror unit 30 each include an optical path for illumination light (described later). Light for illuminating the object to be photographed by the imaging element 40 is transmitted through the optical path.

[0050] Figures 3 to 5 The specific structure of the connector unit 20 a included in the processor unit 20 is shown. Figure 3 It is a perspective view. Figure 4 is a side view, Figure 5 It is the main view.

[0051] The connector portion 20a has a fitting recess 20b, into which a fitting protrusion 30b (hereinafter referred to as a fitting protrusion) of the mirror body portion 30 can be fitted. Figures 6 to 8 The fitting recess 20b has a coil support protrusion 26. The coil support protrusion 26 has a cylindrical convex surface extending in a predetermined axial direction, and the power transmission coil 21 is arranged along the convex surface (in Figure 3 and Figure 5 Only the position of the power transmission coil 21 is shown in FIG. 1 ). That is, the power transmission coil 21 is wound around the coil support protrusion 26 .

[0052] The power transmission coil 21 is formed in a solenoid shape rather than a spiral shape. In addition, in this specification, a spiral shape refers to, for example, a spiral shape formed by a coil being wound in a plane while changing the winding diameter, and a solenoid shape refers to, for example, a spiral shape formed by a coil being wound in a cylindrical surface while advancing in the axial direction. Thus, in this embodiment, the power transmission coil 21 is wound along the cylindrical surface.

[0053] A power transmission cable 25 is connected to the power transmission coil 21, and power is supplied to the power transmission coil 21 through the power transmission cable 25. In the present embodiment, the processor unit 20 includes two power transmission coils 21.

[0054] In addition, the photodiodes 221, 222, and 223 and the laser diode 250 ( Figure 5). In addition, the processor unit 20 may further include a light transmitting member for transmitting light between the processor unit 20 and the outside, and such a light transmitting member may also be arranged to face the fitting recess 20b.

[0055] The processor unit 20 has an optical path 27 for illumination light, and the optical path 27 is arranged to face the fitting recess 20b. The optical path 27 guides illumination light from a light source arranged inside or outside the processor unit 20 to the fitting recess 20b.

[0056] Figures 6 to 8 The specific structure of the connector portion 30 a included in the mirror body portion 30 is shown. Figure 6 It is a perspective view. Figure 7 is a side view, Figure 8 It is the main view.

[0057] The connector part 30a has a mating convex part 30b. As described above, the mating convex part 30b can be mated with the mating concave part 20b of the processor part 20. The mating convex part 30b is formed with a coil support concave part 36. The coil support concave part 36 has a cylindrical concave surface extending in a predetermined axial direction, and the power receiving coil 31 (in the middle of the concave surface) is arranged along the concave surface. Figure 6 and Figure 8 Only the position of the power receiving coil 31 is shown in FIG. 1 . That is, the power receiving coil 31 is wound around the coil supporting recess 36 .

[0058] The power receiving coil 31 is also formed in a solenoid shape instead of a spiral shape, similarly to the power transmitting coil 21. That is, in the present embodiment, the power receiving coil 31 is also wound along a cylindrical surface.

[0059] The power receiving coil 31 is connected to a power transmission cable 35 ( Figures 6 to 8 Not shown. Fig. 9 ), the power receiving coil 31 supplies power to other parts of the mirror body 30 via the power transmission cable 35. In the present embodiment, the mirror body 30 includes two power receiving coils 31.

[0060] The photodiode 320 and the laser diodes 351, 352 and 353 are arranged on the end surface of the engagement protrusion 30b. The mirror body 30 may also include a light transmission member for transmitting light between the mirror body 30 and the outside, and such a light transmission member may also be arranged on the end surface of the engagement protrusion 30b.

[0061] The mirror body 30 has an optical path 37 for illumination light, which is arranged along the end surface of the fitting protrusion 30b. The optical path 37 transmits illumination light transmitted from the processor unit 20 to other parts of the mirror body 30 (for example, an illumination unit arranged near the front end or the imaging element 40).

[0062] Combination Fig. 9The relationship between the power transmission coil 21 and the power receiving coil 31 will be described. The outer diameter of the power transmission coil 21 is formed to be smaller than the inner diameter of the power receiving coil 31, so that the power transmission coil 21 can be inserted into the power receiving coil 31 in a manner that they overlap each other (partially or entirely) in the axial direction. In this embodiment, the coil support protrusion 26 of the processor unit 20 is inserted into the coil support recess 36 of the mirror unit 30 by fitting the fitting protrusion 30b of the mirror unit 30 into the fitting recess 20b of the processor unit 20, so that the power transmission coil 21 is inserted into the power receiving coil 31.

[0063] In this way, when the processor unit 20 and the mirror unit 30 are coupled to each other, the power transmission coil 21 and the power receiving coil 31 at least partially overlap in the axial direction, and the power transmission coil 21 can provide non-contact power to the power receiving coil 31. The non-contact power supply method may be, for example, an electromagnetic induction method, a resonance method, or other methods.

[0064] Thus, by using the solenoid-shaped power transmission coil 21 and the power receiving coil 31 and configuring them to supply power in a state where they at least partially overlap in the axial direction, a large amount of electric power can be supplied. Therefore, the endoscope device 10 according to the first embodiment of the present invention can increase the electric power without increasing the size of the connector portion.

[0065] Figures 10 to 12 The state in which the processor unit 20 and the scope unit 30 (more specifically, the connector unit 20 a of the processor unit 20 and the connector unit 30 a of the scope unit 30 ) are coupled to each other is shown. Fig.10 It is a perspective view. Fig.11 It is a top view. Fig.12 It is a side view.

[0066] When the processor unit 20 and the mirror unit 30 are coupled to each other, as described above, the cylindrical convex surface of the coil support protrusion 26 and the cylindrical concave surface of the coil support recess 36 are mutually fitted. Further, in this state, as described above, the power transmission coil 21 and the power receiving coil 31 overlap in the axial direction, and the power transmission coil 21 can supply power to the power receiving coil 31 in a contactless manner.

[0067] In addition, in this state, the laser diode 250 of the processor unit 20 and the photodiode 320 of the mirror unit 30 can transmit and receive optical signals, thereby transmitting a control signal to the mirror unit 30. Furthermore, in this state, the laser diodes 351, 352, and 353 of the mirror unit 30 and the photodiodes 221, 222, and 223 of the processor unit 20 can transmit and receive optical signals, thereby transmitting an image signal to the processor unit 20.

[0068] Furthermore, in this state, the optical path 27 for illumination light of the processor unit 20 is coupled with the optical path 37 for illumination light of the scope unit 30. Thus, the illumination light is transmitted to the scope unit 30.

[0069] [Modifications]

[0070] Various modifications can be made to the above-mentioned Embodiment 1 within the scope of the present invention. Specifically, the following modifications can be made.

[0071] In the first embodiment, the number of the power transmission coil 21 and the number of the power reception coil 31 are two each, but the number of each may be one, or three or more each.

[0072] In the first embodiment, the processor unit 20 and the mirror unit 30 are coupled together by fitting the fitting recess 20 b and the fitting projection 30 b together, but they may be coupled by other means than fitting.

[0073] In addition, when using the fitting, the convex part and the concave part may be interchanged. For example, the processor part 20 may have a fitting convex part and a coil supporting concave part, and the mirror part 30 may have a fitting concave part and a coil supporting protrusion.

[0074] The transmission and reception of control signals and / or image signals between the processor unit 20 and the mirror unit 30 are not limited to being performed by optical signals. In addition, when optical signals are used, the transmission direction may be from the processor unit 20 to the mirror unit 30, or vice versa, from the mirror unit 30 to the processor unit 20 (both cases are included in the first embodiment).

[0075] The processor unit 20 may also include a coupling detection switch for detecting whether the processor unit 20 and the mirror unit 30 are coupled to each other. In addition, the mirror unit 30 may include such a coupling detection switch instead of the processor unit 20 or in addition thereto.

[0076] As a specific example of a coupling detection switch, one can use Figure 5 The switch plate 20c is shown. The switch plate 20c is arranged on the end surface of the fitting recess 20b of the processor unit 20, and is applied with a force toward the inside of the fitting recess 20b, for example, by a spring. When the processor unit 20 and the mirror unit 30 are coupled to each other, the switch plate 20c is pushed to move toward the fitting protrusion 30b of the mirror unit 30, so that the coupling can be detected. In addition, the specific structure of the coupling detection switch is not limited to this type of plate shape.

[0077] The processor unit 20 and the mirror unit 30 may also have a metal connection path for dissipating static electricity. The path may be provided separately from the coupling detection switch and the signal ground line.

[0078] The present disclosure includes the following specific matters.

[0079] [Specific matters 1]

[0080] An endoscope device comprising:

[0081] a processor unit having a power transmission coil and a control substrate; and

[0082] The endoscope has a power receiving coil and a body portion.

[0083] When the processor unit and the mirror unit are coupled to each other, the power transmission coil and the power reception coil at least partially overlap in the axial direction, and the power transmission coil can supply power to the power reception coil in a contactless manner.

[0084] [Specific matters 2]

[0085] The endoscope device according to specific item 1, wherein the power transmission coil and the power reception coil are wound along a cylindrical surface.

[0086] [Specific matters 3]

[0087] The endoscope device according to specific item 1, wherein:

[0088] One of the processor unit and the mirror unit has a cylindrical convex surface,

[0089] The other of the processor portion and the mirror body portion has a cylindrical concave surface,

[0090] The power transmission coil and the power reception coil are both arranged along the convex surface or the concave surface.

[0091] When the processor unit and the mirror unit are coupled to each other, the convex surface and the concave surface are fitted into each other.

[0092] [Specific matters 4]

[0093] The endoscope device according to specific item 1, wherein:

[0094] The processor unit includes a plurality of the power transmission coils.

[0095] The mirror body includes a plurality of the power receiving coils.

[0096] [Specific matter 5]

[0097] The endoscope device according to specific item 1, wherein:

[0098] One of the processor unit and the mirror unit includes a light emitting element,

[0099] The other of the processor unit and the mirror unit includes a light receiving element,

[0100] In a state where the processor unit and the mirror unit are coupled to each other, optical signals can be transmitted and received through the light emitting element and the light receiving element.

[0101] [Specific matter 6]

[0102] The endoscope device according to specific item 1, wherein:

[0103] The processor unit and the mirror unit each have an optical path for illumination light.

[0104] In a state where the processor unit and the mirror unit are coupled to each other, the optical paths are coupled.

[0105] [Specific matters 7]

[0106] The endoscope device according to specific item 1, wherein at least one of the processor unit and the scope unit includes a coupling detection switch capable of detecting whether the processor unit and the scope unit are coupled to each other.

[0107] Description of Reference Numerals

[0108] 10: endoscope device; 20: processor unit; 21: power transmission coil; 22: control substrate; 25: power transmission cable; 26: coil support protrusion; 27: optical path for illumination light; 30: mirror body; 31: power receiving coil; 32: endoscope; 33: current monitoring unit; 34: resistor; 35: power transmission cable; 36: coil support recess; 37: optical path for illumination light; 40: imaging element; 20a: connector unit; 20b: fitting recess; 20c: switch board; 211: first controller; 212: second controller; 221-223 : Photodiode (light receiving element); 231~233: transimpedance amplifier; 241~243: limiting amplifier; 250: laser diode (light emitting element); 260: laser driver; 270: post-stage signal processing circuit; 30a: connector part; 30b: mating protrusion; 311: first controller; 312: second controller; 320: photodiode (light receiving element); 330: transimpedance amplifier; 340: limiting amplifier; 351~353: laser diode (light emitting element); 361~363: laser driver.

[0109] All publications, patents, and patent applications mentioned in this specification are herein incorporated by reference in their entirety.

Claims

1. An endoscope device comprising: a processor unit having a power transmission coil and a control substrate; and A mirror body having a power receiving coil and an endoscope, When the processor unit and the mirror unit are coupled to each other, the power transmission coil and the power reception coil at least partially overlap in the axial direction, and the power transmission coil can supply power to the power reception coil in a contactless manner.

2. The endoscope device according to claim 1, wherein: The power transmission coil and the power reception coil are wound along a cylindrical surface.

3. The endoscope device according to claim 1, wherein: One of the processor unit and the mirror unit has a cylindrical convex surface, The other of the processor portion and the mirror body portion has a cylindrical concave surface, The power transmission coil and the power reception coil are both arranged along the convex surface or the concave surface. When the processor unit and the mirror unit are coupled to each other, the convex surface and the concave surface are fitted into each other.

4. The endoscope device according to claim 1, wherein: The processor unit includes a plurality of the power transmission coils. The mirror body includes a plurality of the power receiving coils.

5. The endoscope device according to claim 1, wherein: One of the processor unit and the mirror unit includes a light emitting element, The other of the processor unit and the mirror unit includes a light receiving element, In a state where the processor unit and the mirror unit are coupled to each other, optical signals can be transmitted and received through the light emitting element and the light receiving element.

6. The endoscope device according to claim 1, wherein: The processor unit and the mirror unit each have an optical path for illumination light. In a state where the processor unit and the mirror unit are coupled to each other, the optical paths are coupled.

7. The endoscope device according to claim 1, wherein: At least one of the processor unit and the scope unit includes a coupling detection switch capable of detecting whether the processor unit and the scope unit are coupled to each other.

Images