Method, apparatus and assembly for manufacturing embedded optical device for photonic assembly

Abstract

The method for manufacturing an embedded optical device in a photonic component of the present invention relates to a method for manufacturing an embedded optical device, wherein the optical devices are produced using a thermoplastic material); a constant temperature system for manufacturing the optical device; an open type constant temperature containing structure or cavity; an autonomous thermoplastic material dispensing unit; a controlled temperature and ambient gas unit; and a cooling unit. The invention also relates to a system for manufacturing embedded optical devices using continuous thermal processing.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing embedded optical devices, which uses thermoplastic materials to produce these optical devices; a thermostatic system for manufacturing said optical devices; an open thermostatic containment structure or cavity; an autonomous thermoplastic material dispensing unit; a temperature and ambient gas control unit, preferably gas-tight; and a cooling unit. The present invention also relates to a system for manufacturing embedded optical devices using continuous thermal processing.

[0002] More specifically, the invention relates to a method for manufacturing an embedded optical device for a photonic assembly suitable for emitting or capturing electromagnetic radiation of a given frequency, wherein the optical device is composed of a semiconductor having a melting temperature T m The invention also relates to a containing structure, an autonomous thermoplastic material dispensing unit and a device for manufacturing embedded optical devices for photonic components, which are suitable for emitting or capturing electromagnetic radiation of a given frequency, wherein the optical device is made of a thermoplastic material having a melting temperature T m The photonic component is made of a thermoplastic material suitable for transmitting the electromagnetic radiation, and the photonic component is located on a physical carrier. Background Art

[0003] The concept of wafer-level optics defined by EV Group (https: / / www.evgroup.com / technologies / wafer-level-optics / ) allows the design and manufacture of miniaturized wafer-level optics using advanced technologies similar to those used for semiconductors. The final product is a miniaturized optical device. There are a variety of manufacturing technologies that allow the development of these optics, most of which are based on lithography and lens molding.

[0004] There is also wafer-level packaging (WLP), https: / / ams.com / advanced-packaging. As defined by AMS-OSRAM AG, this is a process whereby components of a photonic assembly are connected to an integrated circuit (IC) before the wafer in which the IC is fabricated is cut into cubes. In WLP, the upper and lower layers of the package and the solder bumps are attached to the integrated circuit as long as they are in the wafer. This process differs from the more traditional process where the wafer is cut into individual circuits (die) before the package components are attached.

[0005] Wafer-level chip-scale package (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies.

[0006] In addition to these wafer-level concepts, there are optical packaging, with various definitions and different types, such as defined by Tolga Tekin et al. in "Review of Packaging of Optoelectronic, Photonic, and MEMS Components" (Tolga Tekin, July 2011, Review of Packaging of Optoelectronic, Photonic, and MEMS Components, IEEE Journal of Selected Topics in Quantum Electronics 17(3):704-719, DOI: 10.1109 / JSTQE.2011.2113171). These range from external components such as boxes or envelopes that serve as protection for the optical components of the system to an external "housing" for a group of optical / electronic / mechanical components whose function is to protect them.

[0007] As can be seen, some packages are used only to house, connect or protect the components of the photonic assembly, but there are also packages with built-in optics to give the emitter optical functionality in the same package (such as in an overmolded die on a lead frame), which can be found in Tolga Tekin et al.

[0008] The concept of embedded optics can be defined in several ways. It can be assumed that an embedded lens is a lens manufactured directly on the element to be given an optical function, and also a lens embedded in the component package. Embedded optics can be manufactured using injection molding, CNC machining, 3D printing and even as mentioned above using photolithography.

[0009] At present, among the manufacturing processes using materials that require heating and melting, on the one hand, the injection manufacturing method stands out. In this manufacturing method, the pressure at which the material reaches the closed cavity is usually problematic at the level of filling the closed cavity, because this gradient causes the material to not arrive at the optimal temperature and thus not be able to fill the entire closed cavity in a fluid manner, leaving difficult-to-reach areas unfilled. In addition, the material is heated and melted, then sent to the closed cavity with a certain pressure to fill the closed cavity and to be able to reach the designed shape by cooling the closed cavity. In this method, the material undergoes a thermal gradient from its distribution to the filling of the closed cavity, as described in the patents mentioned below.

[0010] Patent WO2008100146A2 relates to a method for encapsulating an electronic component mounted on a carrier using low pressure, comprising the following process steps: A) placing the electronic component in a mold cavity, B) heating an encapsulation material, C) forcing the encapsulation material to move to the mold cavity, D) filling the mold cavity, and E) cooling the encapsulation material in the mold cavity. The invention also relates to a device that can perform this method.

[0011] Patent WO2005120799A1 relates to a method for encapsulating electronic components mounted on a carrier, comprising the following process steps: a) heating an encapsulating material, B) forcing the encapsulating material to move to a mold cavity, C) filling the mold cavity, and D) cooling the encapsulating material in the mold cavity. Thus, by using at least one temperature barrier to produce different temperature zones that are at least partially thermally separated from each other, temperature regulation of the encapsulating material occurs during the period when individual sections of the path are covered by the encapsulating material. The invention also relates to a device for encapsulating electronic components mounted on a carrier.

[0012] Patent WO2010008287A1 relates to a method for encapsulating electronic components mounted on a carrier, which includes the following process steps: using a closing force to move multiple mold parts toward each other, thereby surrounding the electronic components with a mold cavity, applying pressure to a liquid encapsulating material, filling the mold cavity with encapsulating material, and curing the encapsulating material, wherein the pressure on the encapsulating material is measured, and the closing force of the mold parts and the applied pressure are dependent on each other.

[0013] Patent US20020147865A1 relates to a dispenser attachment for a microscope objective, which is located in a device for writing three-dimensional structures in a lithography fluid by laser lithography, and the lithography fluid can be cured by laser irradiation.

[0014] On the other hand, additive manufacturing, also known as 3D printing, also stands out, where the material needs to be heated and melted during the manufacturing process to give it the desired shape, and this material is in direct contact with the air when dispensed, so from the moment of dispensing using the dispensing system, the material experiences very high temperature gradients, which leads to rough surfaces and low precision of the manufactured components, and post-processing is usually required to minimize such defects. The patent mentioned below shows such thermal gradients experienced by the material from the moment of dispensing.

[0015] Patent WO2013017284A2 relates to a method and device for producing a three-dimensional object made of a curable material that is either liquid or liquefiable in its initial state. The three-dimensional object is produced by discharging material to be cured while discharging the curable material.

[0016] Patent US20140197576A1 relates to a device and a method for producing a three-dimensional object from a solidifiable material by sequentially discharging droplets onto an object carrier of the object to be produced.

[0017] Patent US9539765 relates to a method for discharging a volume flow consisting of continuous droplets to produce a three-dimensional object of a curable material present in a fluid phase, applying pressure to the material so as to discharge the material in the form of droplets from a circulatory outlet opening, thereby gradually building up the three-dimensional object in a construction chamber.

[0018] Patent US9889604B2 relates to a device for producing a three-dimensional object from a hardenable material, the device having a construction space for constructing the object, a temperature control unit for controlling the temperature of the construction space, and a preparation unit for preparing the hardenable material so that the material is in a fluid phase. A pressure generating unit applies pressure to the fluid phase in the preparation unit so that the hardenable material is discharged through an outlet in the form of droplets. The temperature-controlled construction space is surrounded by a construction space frame, in which at least the discharge unit, the preparation unit and an object support for producing the object are accommodated.

[0019] Generally, a photonic component (eg, LED) is mounted on a carrier (usually a printed circuit board (PCB)) so that the electrical connection between the photonic component and the carrier is made through a connector that forms an arc. In methods using plastic injection technology, such arc breakage is not uncommon. Summary of the invention

[0020] The object of the present invention is to overcome these disadvantages. This is achieved by a method of manufacturing an embedded optical device for a photonic assembly of the above type, characterized by using a containment structure comprising a thermostatic cavity and a support structure, the thermostatic cavity being suitable for being filled with the thermoplastic material, wherein the thermostatic cavity is open, the support structure being suitable for supporting the physical carrier on the cavity so that the photonic assembly is inside the cavity, wherein the thermostatic cavity is partially open when the physical carrier is supported by the support structure, wherein the method comprises the following steps:

[0021] [a] melting the thermoplastic material,

[0022] [b] positioning the physical carrier with the photonic component on the support structure such that the photonic component is inside the constant temperature chamber and the constant temperature chamber is partially open,

[0023] [c] filling the constant temperature cavity with the molten thermoplastic material in a filling unit, wherein the constant temperature cavity is maintained at a temperature above T by a temperature control system during the step of filling the constant temperature cavitym Temperature T c Down,

[0024] [d] Once the constant temperature chamber is filled, cool the constant temperature chamber to below the T m ,

[0025] [e] Using an ejector to eject the photonic component coated with the thermoplastic material from the constant temperature chamber.

[0026] Generally speaking, methods using 3D printing technology do not use any type of cavity. On the contrary, methods of injecting polymer materials use a closed cavity. It should be well understood what it means to say that a cavity is closed: it is closed in the sense that the molten thermoplastic material cannot leave the cavity. However, considering that the cavity has holes that allow air to escape, the cavity is not airtight, that is, the cavity is "not closed to air, but closed to the thermoplastic material". In the present description and claims, the expressions "closed cavity" and "cavity open" are used in the sense that the cavity is closed or open to the molten thermoplastic material.

[0027] In fact, it has been seen that the arc of the contact that electrically connects the photonic component to the physical carrier is structurally very fragile and easily breaks if subjected to mechanical stress. The method according to the invention allows to produce an optical device that does not subject the connector to any substantial mechanical stress at all and even has a surface (the inner surface of the thermostatic cavity) that can be used to produce an optically functional surface. Since the cavity is open and at a temperature above the melting temperature T m Temperature T c An extremely "smooth" filling of the cavity is thus ensured, since the polymer material remains fluid and at the lowest possible desired viscosity throughout the filling of the cavity. The connector is therefore not subject to any negative stresses.

[0028] Preferably, the pressure within the chamber is ambient pressure.

[0029] Preferably, said electromagnetic radiation is visible and / or infrared radiation.

[0030] Preferably, the filling unit is a temperature and ambient gas controlled unit, wherein the gas is preferably an oxygen-free gas. Advantageously, the gas is at a higher temperature T than the temperature of the constant temperature chamber. g Down.

[0031] Preferably, step [d] is performed in a cooling unit.

[0032] Preferably, step [a] of melting the thermoplastic material is performed in an autonomous material dispensing unit which advantageously has a temperature control system.

[0033] Preferably, step [c] of filling said constant temperature chamber with said molten thermoplastic material is performed by gravity.

[0034] Preferably, the filling unit has an inlet region and an outlet region adapted to allow entry and exit of the containing structure, respectively.

[0035] Preferably, the physical carrier comprises at least one hole, and in said step [c] of filling said constant temperature cavity, said molten thermoplastic material leaves said constant temperature cavity through said hole to form a top suitable for holding said optical device on said physical carrier.

[0036] Preferably, the thermoplastic material is a cycloolefin polymer and the temperature T c Between 100°C and 420°C, preferably between 220°C and 260°C.

[0037] Preferably, the thermoplastic material is polycarbonate, and the temperature T c Between 100°C and 420°C, preferably between 260°C and 310°C.

[0038] Preferably, the thermoplastic material is polymethyl methacrylate, and the temperature T c Between 100°C and 420°C, preferably between 100°C and 180°C.

[0039] The object of the present invention is a containment structure, characterized in that it comprises: [a] a constant temperature cavity suitable for being filled with a molten thermoplastic material, wherein the constant temperature cavity is open; [b] a support structure, which is suitable for supporting a physical carrier with a photonic component on the constant temperature cavity, so that the photonic component is inside the constant temperature cavity, wherein when the physical carrier is supported by the support structure, the constant temperature cavity is partially open; and [c] a temperature control system, which is suitable for maintaining the constant temperature cavity at a temperature above the melting temperature T of the thermoplastic material. m Temperature T c Down.

[0040] Preferably, the containing structure comprises an ejector, and the ejector is suitable for ejecting the photonic component coated by the thermoplastic material from the constant temperature chamber.

[0041] Preferably, the containing structure comprises a plurality of constant temperature chambers.

[0042] Another object of the present invention is an autonomous thermoplastic material dispensing unit, characterized in that it comprises a thermoplastic material dispensing unit adapted to melt said plastic material and keep it above T m Temperature T dThe temperature of the system is controlled under the pressure, and it distributes the molten thermoplastic material by gravity.

[0043] Another object of the present invention is a device for manufacturing an embedded optical device for a photonic component of the above type, the device being characterized in that it comprises a containing structure and a filling unit, wherein the containing structure in turn comprises: [a] a constant temperature cavity suitable for filling with molten thermoplastic material, wherein the constant temperature cavity is open, [b] a supporting structure suitable for supporting a physical carrier with the photonic component on the cavity so that the photonic component is inside the cavity, wherein the constant temperature cavity is partially open when the physical carrier is supported by the supporting structure, and [c] a temperature control system suitable for maintaining the constant temperature cavity at a temperature above the melting temperature T of the thermoplastic material. m Temperature T c Down.

[0044] Such a containment device may include various preferred solutions:

[0045] -Preferably, the containing structure comprises an ejector, and the ejector is suitable for ejecting the photonic component coated with the thermoplastic material from the constant temperature chamber.

[0046] -Preferably, the containing structure comprises a plurality of constant temperature chambers.

[0047] - Preferably, it comprises an autonomous thermoplastic material dispensing unit, said dispensing unit in turn comprising a thermoplastic material adapted to melt said plastic material and keep it above T m Temperature T d The temperature of the system is controlled under the pressure, and the molten thermoplastic material is distributed by gravity.

[0048] - Preferably, said autonomous thermoplastic material dispensing unit comprises a reservoir suitable for containing an oxygen-free gas.

[0049] - Preferably, the filling unit is a controlled temperature and ambient gas unit, wherein the gas is advantageously an oxygen-free gas.

[0050] - Preferably, the control temperature and ambient gas unit has a temperature T suitable for maintaining the gas at a higher temperature T than the temperature of the constant temperature chamber g Temperature control system below.

[0051] - Preferably, the filling unit has an inlet area and an outlet area adapted to allow entry and exit, respectively, of the containing structure.

[0052] - Preferably, it comprises a cooling unit.

[0053] - Preferably, the outlet region is connected to an inlet of the cooling unit.

[0054] - Preferably, a heating plate allowing regulating the temperature of the cavity.

[0055] In general, the device according to the invention is suitable for carrying out the method according to the invention.

[0056] Other preferred embodiments of the present invention are as follows:

[0057] 1 A method for manufacturing embedded optical devices for photonic components, said method being based on the use of thermoplastic materials producing these optical devices in a continuous thermal process having

[0058] at least one controlled temperature and ambient gas unit, preferably gas-tight,

[0059] ●Open constant temperature containment structure or cavity,

[0060] ●Autonomous thermoplastic material dispensing unit,

[0061] ● and cooling unit,

[0062] wherein the preferably airtight controlled temperature and ambient gas unit has a temperature control system and comprises at least an open thermostatic containment structure or chamber, an autonomous thermoplastic material dispensing unit and an inlet area and an outlet area for the open thermostatic containment structure or chamber,

[0063] ● wherein the open thermostatic containment structure or chamber has at least one temperature control system,

[0064] - wherein said autonomous thermoplastic material dispensing unit can process said curable materials in liquid or liquefiable phase in order to dispense them and has a temperature control system.

[0065] 2. The open constant temperature containment structure or chamber according to paragraph 1, characterized in that it contains at least:

[0066] ● an inlet system for said thermoplastic material,

[0067] a supporting and / or fixing structure for positioning at least said physical carrier in which an optoelectronic component as part of said photonic component is accommodated,

[0068] ●Temperature control system,

[0069] an ejector capable of ejecting the final embedded photonic assembly from the open thermostatic containment structure or cavity,

[0070] a movement system (or absence thereof) for moving from the preferably airtight controlled temperature and ambient gas unit to the cooling unit,

[0071] ●Optical devices.

[0072] 3. An open constant temperature containment structure or cavity according to paragraph 2, characterized in that it contains at least several cavities in the form of an array, which will form the optical device to be embedded.

[0073] 4. An autonomous thermoplastic material dispensing unit according to paragraph 1, characterized in that the open thermostatic containment structure or cavity is filled with fluid thermoplastic material using the effect of gravity.

[0074] 5. A preferably gas-tight controlled temperature and ambient gas unit according to paragraph 1, characterised in that an oxygen-free gas is used to prevent ignition.

[0075] 6. A preferably airtight controlled temperature and ambient gas unit according to paragraph 1, characterized in that it allows dispensing of the fluid thermoplastic material without subjecting it to temperature gradients.

[0076] 7. A preferably airtight controlled temperature and ambient gas unit according to paragraph 1, characterized in that its temperature is higher than the temperature of the open thermostatic containment structure or chamber.

[0077] 8. A cooling unit according to paragraph 1, characterized in that it can accommodate at least the open constant temperature containment structure or cavity filled with thermoplastic material.

[0078] 9. A cooling unit according to paragraph 1, characterized in that it performs a process of cooling the material so that it is subjected to a thermal gradient together with the open thermostatic containment structure or cavity.

[0079] 10. A cooling unit according to paragraph 1, characterized in that its temperature is lower than the temperature of the preferably gas-tight control temperature and ambient gas unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] To supplement the ongoing description and to facilitate a better understanding of the characteristics of the invention, a set of drawings is attached as an integral part of said description, in which the following are depicted by way of illustration and not limitation:

[0081] Figure 1 A schematic diagram of a system for manufacturing embedded optical devices according to the present invention is shown, the system having an open thermostatic chamber for a single optical device, an autonomous material dispensing unit, a displacement system and a preferably gas-tight controlled environment gas unit.

[0082] Figure 2 A schematic diagram of a photonic assembly consisting of a physical carrier in which an emitter with control electronics, connections and communication channels for the flow of the thermoplastic material through the assembly is mounted is shown.

[0083] Figure 3 A schematic diagram of a system for fabricating embedded optics is shown with a constant temperature chamber filled with thermoplastic material for a single optic.

[0084] Figure 4 A schematic diagram of a thermostatic chamber for a single optical device filled with thermoplastic material located in a cooling unit is shown.

[0085] Figure 5 A schematic diagram of a photonic assembly having a single optical device fabricated in accordance with the present invention is shown.

[0086] Figure 6 A schematic diagram of a photonic assembly consisting of an array of emitters is shown.

[0087] Figure 7 A schematic diagram of a system for manufacturing embedded optical devices according to the present invention is shown, wherein the system has a constant temperature chamber for an optical device array.

[0088] Figure 8 A schematic diagram of a system for manufacturing embedded optical devices for optical device arrays according to the present invention is shown, wherein photonic components are to be embedded.

[0089] Fig. 9 A schematic diagram of a system for fabricating embedded optics for an optics array is shown, wherein the cavity is filled with a thermoplastic material.

[0090] Fig.10 A schematic diagram of a system for manufacturing embedded optical devices for an optical device array according to the present invention is shown, wherein the cavity is filled with thermoplastic material and is located in a cooling unit.

[0091] Fig.11 A schematic diagram of an embedded photonic component having an optical device array manufactured according to the present invention is shown.

[0092] Fig.12 A schematic diagram of an embodiment of the present invention is shown, which depicts a system for manufacturing embedded optical devices according to the present invention, the system having a constant temperature chamber for a single previously manufactured optical device, with an autonomous material dispensing unit, a displacement system and a preferably airtight controlled environment gas unit.

[0093] Fig.13 A schematic diagram of a previously manufactured optical device is shown.

[0094] Fig.14 A schematic diagram of a system for manufacturing an embedded optical device according to the present invention is shown, wherein the optical device manufactured in advance is in a constant temperature chamber.

[0095] Fig.15A schematic diagram of a system for fabricating embedded optical devices is shown, wherein a previously fabricated optical device is in a constant temperature chamber filled with a thermoplastic material.

[0096] Fig.16 A schematic diagram of a system for manufacturing embedded optical devices is shown, wherein the previously manufactured optical device is in a constant temperature chamber filled with thermoplastic material located in a cooling unit.

[0097] Fig.17 A schematic diagram of a photonic assembly made according to the present invention and embedded with a previously made optical device is shown.

[0098] Fig.18 A schematic diagram of another system for manufacturing embedded optical devices is shown, the system having a temperature control and monitoring system, a heating plate and a displacement system of an autonomous plastic dispensing unit. DETAILED DESCRIPTION

[0099] The present invention describes a method for manufacturing embedded optics for photonic components, where a photonic component is understood to mean any system consisting of a physical carrier in which electronic and electrical components are mounted and interconnected to each other, an emitter or detector and the optics required to give the component an optical function. Such embedded optics are not limited to a single optic, as it is also envisaged to manufacture arrays of optics, as well as embedding optics previously manufactured as a single optic or in array form.

[0100] The method of manufacturing embedded optical devices for photonic components uses thermoplastic materials to produce these optical devices, uses a constant temperature system to manufacture them, and uses an open constant temperature containment structure or cavity, an autonomous thermoplastic material dispensing unit, a preferably airtight controlled temperature and environmental gas unit and a cooling unit.

[0101] A major advantage of our system for manufacturing embedded optical devices for photonic assemblies according to the invention is that the material does not experience any temperature gradient between melting and filling the cavity and consists of a continuous thermal treatment from the moment it is heated and melted until it is dispensed and fills the open isothermal cavity, thereby maintaining the fluid state of the material in an optimal way. The open isothermal cavity is located inside a preferably airtight controlled temperature and ambient gas unit, which allows maintaining the temperature of the open isothermal cavity and the ambient temperature in a controlled manner. Unlike current processes, in the process according to the invention, the material, together with the open isothermal cavity, is subjected to a thermal gradient for cooling at the moment when the cavity is located in a cooling unit, rather than at the time of dispensing.

[0102] Another advantage present in the system for manufacturing embedded optical devices for photonic assemblies according to the present invention is that the dispensing of the material is carried out using a material dispensing unit, which allows the material to fall into the system due to gravity for filling the open thermostatic chamber, so that no external pressure is required for this purpose. Therefore, the state of the electrical, electronic and optical components that are part of the photonic assembly is protected, since it is ensured that the entry of the material into the open thermostatic chamber does not damage these components due to pressure.

[0103] Furthermore, in the process of manufacturing an embedded optical device for a photonic assembly according to the present invention, the cooling process is carried out in a cooling unit to which the open constant temperature cavity with the material to be cooled reaches, so that the embedded optical device for a photonic assembly in question is obtained by using a displacement system, so that the open constant temperature cavity with the material, rather than the material, directly experiences the thermal gradient. The cooling unit can be located directly below, above, to the side of, or even separate from the controlled ambient gas unit, so its position is not limited.

[0104] With reference to the above-mentioned drawings and according to the numbering adopted, there can be seen therein a preferred embodiment of the invention, comprising the parts and elements indicated and described in detail hereinafter.

[0105] In this sense, in one embodiment of the invention, a system for manufacturing an embedded optical device consists of an open thermostatic containment structure or chamber (1) provided with a temperature control system, containing a negative image (2) of the embedded optical device to be manufactured, an inlet system (3) for the thermoplastic material, a support and / or fixing structure (4) for positioning the physical carrier, in which the optoelectronic components (if any) as part of the photonic assembly are contained, and an autonomous thermoplastic material dispensing unit (5). The containment structure may or may not be located on a displacement system (6) that allows displacement of the containment structure in the X, Y and Z directions. In turn, the thermostatic containment structure (1) as the inlet system (3) for the material and the autonomous thermoplastic material dispensing unit (5) are located in a preferably gas-tight controlled atmosphere gas unit (7), which allows the atmosphere when dispensing the material to be at a specific and controllable temperature. The controlled atmosphere gas unit (7) has an opening that allows entry or exit of the thermostatic containment structure, and it is preferably always closed in a gas-tight manner.

[0106] The containment structure is thermostated to a temperature suitable for enabling the thermoplastic material used to create the embedded optical device to fill the cavity without undergoing a change in its fluidity or altering its chemical properties.

[0107] In a particular case of the invention, the optoelectronic component of the photonic assembly consists of a physical carrier in which a transmitter with control electronics (8), connecting cables (9) and connecting channels (10) for the flow of thermoplastic material through the component are arranged.

[0108] In a particular case of the present invention, the method for manufacturing an embedded optical device for a photonic assembly begins by placing the optoelectronic component of the photonic assembly in a supporting and / or fixing structure (4) of a thermostatic containment structure (1), wherein the supporting and / or fixing structure is located in a preferably airtight controlled environment gas unit (7).

[0109] The cavity (2) is filled with the thermoplastic material via an inlet system (3) for the thermoplastic material using an autonomous thermoplastic material dispensing unit (5), thereby filling the cavity of the embedded optical device (11).

[0110] The next step in the method for manufacturing an embedded optical device for a photonic assembly comprises cooling / curing the thermoplastic material in the cavity (2). To this end, the thermostatic containment structure (1) is shifted from the controlled ambient gas unit (7) to the cooling unit (12) using the outlet and the displacement element to cure the thermoplastic material in the cavity, thereby obtaining a finished photonic assembly with the embedded optical device.

[0111] In a particular aspect of the invention, the photonic component consists of an array of optoelectronic components (15) arranged on a physical carrier (14).

[0112] In this particular case of the invention, the thermostatic containment structure (1) provided with a temperature control system consists of several cavities (2) which will form the optical device to be embedded and which may or may not be located on a displacement system (6) which allows the displacement of the cavities in the X, Y and Z directions. In turn, the thermostatic containment structure (1) as the inlet system (3) for the material and the autonomous thermoplastic material dispensing unit (5) are located in a preferably gas-tight controlled atmosphere gas unit (7), which allows the atmosphere when dispensing the material to be at a specific and controlled temperature. This controlled atmosphere gas unit (7) has an opening allowing the entry or exit of the thermostatic containment structure and it always remains closed in a preferably gas-tight manner.

[0113] In a particular case of the present invention, the method for manufacturing an embedded optical device for a photonic assembly begins by placing the optoelectronic component of the photonic assembly in a supporting and / or fixing structure (4) of a thermostatic containment structure (1), wherein the supporting and / or fixing structure is located in a preferably airtight controlled environment gas unit (7).

[0114] The cavity of the embedded optical device (11) is filled with the thermoplastic material by means of an autonomous thermoplastic material dispensing unit (5) through an inlet system (3) for thermoplastic material.

[0115] For this particular case of the invention, the next step in the method for manufacturing an embedded optical device for a photonic assembly comprises cooling / curing the thermoplastic material in the thermostatic containment structure. To this end, the thermostatic containment structure is displaced from the controlled ambient gas unit to a cooling unit (12) by means of the outlet and the displacement element, in order to cure the thermoplastic material in the cavity, thereby obtaining the photonic assembly with the embedded optical device, the cooling unit being located directly below, above, to the side of or even separate from the controlled ambient gas unit.

[0116] Once the thermoplastic material is solidified, the final embedded photonic component (17) is ejected using an ejector provided by the constant temperature containment structure.

[0117] In a particular aspect of the invention, the photonic assembly consists of a single optoelectronic assembly or an array of optoelectronic assemblies, which may or may not include an emitter arranged on a physical carrier with control electronics, connecting cables and communication channels for the flow of thermoplastic material through the assembly.

[0118] In this particular case of the invention, the thermostatic containment structure provided with a temperature control system consists of one or more chambers (2) for positioning an optical device (20) previously manufactured using any manufacturing method (such as but not limited to CNC machining, 3D printing, injection molding) and which may or may not be located on a displacement system (6) allowing displacement of the chamber in the X, Y and Z directions. In turn, the thermostatic containment structure as an inlet system for the material and the autonomous thermoplastic material dispensing unit are located in a preferably gas-tight controlled atmosphere gas unit (7), which allows the atmosphere when dispensing the material to be at a specific and controllable temperature. The controlled atmosphere gas unit has an opening allowing entry or exit of the thermostatic containment structure and it always remains closed in a preferably gas-tight manner.

[0119] In a particular case of the present invention, the method for manufacturing an embedded optical device for a photonic assembly begins by placing the optoelectronic component of the photonic assembly in a supporting and / or fixing structure (4) and placing the previously manufactured optical device (20) in a thermostatic containment structure (1), which is located in a preferably airtight controlled environment gas unit (7).

[0120] The cavity for receiving thermoplastic material is filled by means of an autonomous thermoplastic material dispensing unit (5) via an inlet system (3) for thermoplastic material, thereby filling the cavity (11) and thus embedding the previously manufactured optical component.

[0121] The next step in the method for manufacturing an embedded optical device for a photonic assembly comprises cooling / curing the thermoplastic material in the cavity (2). To this end, the thermostatic containment structure is displaced from the controlled ambient gas unit to a cooling unit (12) by means of the outlet and the displacement element, in order to cure the thermoplastic material in the cavity, thereby obtaining a photonic assembly with the embedded optical device, the cooling unit being located directly below, above, to the side of or even separate from the controlled ambient gas unit.

[0122] Once the thermoplastic material is cured, the final embedded photonic component (17) is ejected using an ejector (13) provided for the isothermal containment structure.

[0123] exist Fig.18 In the particular case of the invention depicted in , the system for manufacturing embedded optical devices for photonic assemblies comprises a temperature control and monitoring system (22) which allows to know, using infrared light, the complete temperature image of the cavity and of the thermoplastic material itself deposited in the air; a heating plate (23) which allows to adjust the temperature of the cavity according to the needs of the thermoplastic material to be used; and an autonomous thermoplastic material dispensing unit (5) which can be displaced in the X, Y and Z directions using a displacement system (24) to adjust the position of the material inlet according to the cavity to be used.

Claims

1. A method for manufacturing an embedded optical device for a photonic component suitable for emitting or capturing electromagnetic radiation of a given frequency, wherein the optical device is composed of a material having a melting temperature T m The method comprises: a receiving structure comprising a thermostatic cavity and a support structure, wherein the thermostatic cavity is suitable for being filled with the thermoplastic material, wherein the thermostatic cavity is open, and the support structure is suitable for supporting the physical carrier on the cavity so that the photonic component is inside the cavity, wherein when the physical carrier is supported by the support structure, the thermostatic cavity is partially open, and wherein the method comprises the following steps: [a] melting the thermoplastic material, [b] positioning the physical carrier with the photonic component on the support structure such that the photonic component is inside the constant temperature chamber and the constant temperature chamber is partially open, [c] filling the constant temperature cavity with the molten thermoplastic material in a filling unit, wherein the constant temperature cavity is maintained at a temperature above T by a temperature control system during the step of filling the constant temperature cavity m Temperature T c Down, [d] Once the constant temperature chamber is filled, cool the constant temperature chamber to below the T m , [e] Using an ejector to eject the photonic component coated with the thermoplastic material from the constant temperature chamber.

2. The method according to claim 1, characterized in that The filling unit is a controlled temperature and ambient gas unit, wherein the gas is preferably an oxygen-free gas.

3. The method according to claim 2, characterized in that The gas is at a temperature T higher than the temperature of the constant temperature chamber g Down.

4. The method according to any one of claims 1 to 3, characterized in that The step [d] is performed in a cooling unit.

5. The method according to any one of claims 1 to 4, characterized in that Said step [a] of melting said thermoplastic material is performed in an autonomous material dispensing unit preferably having a temperature control system.

6. The method according to any one of claims 1 to 5, characterized in that Said step [c] of filling said constant temperature chamber with said molten thermoplastic material is performed by gravity.

7. The method according to any one of claims 1 to 6, characterized in that The filling unit has an inlet area and an outlet area adapted to allow entry and exit of the containing structure, respectively.

8. The method according to any one of claims 1 to 7, characterized in that The physical carrier comprises at least one hole, and in said step [c] of filling said constant temperature cavity, said molten thermoplastic material leaves said constant temperature cavity through said hole, forming a top portion suitable for holding said optical device on said physical carrier.

9. The method according to any one of claims 1 to 8, characterized in that The thermoplastic material is a cycloolefin polymer, and the temperature T c Between 100°C and 420°C, preferably between 220°C and 260°C.

10. The method according to any one of claims 1 to 8, characterized in that The thermoplastic material is polycarbonate, and the temperature T c Between 100°C and 420°C, preferably between 260°C and 310°C.

11. The method according to any one of claims 1 to 8, characterized in that The thermoplastic material is polymethyl methacrylate, and the temperature T c Between 100°C and 420°C, preferably between 100°C and 180°C.

12. A containing structure, characterized in that The invention comprises: [a] a constant temperature cavity suitable for being filled with a molten thermoplastic material, wherein the constant temperature cavity is open; [b] a support structure suitable for supporting a physical carrier with a photonic component on the constant temperature cavity, so that the photonic component is inside the constant temperature cavity, wherein when the physical carrier is supported by the support structure, the constant temperature cavity is partially open; and [c] a temperature control system suitable for maintaining the constant temperature cavity at a temperature above the melting temperature T of the thermoplastic material. m Temperature T c Down.

13. The containing structure according to claim 12, characterized in that An ejector is included, and the ejector is suitable for ejecting the photon component covered by the thermoplastic material from the constant temperature chamber.

14. The containing structure according to claim 12 or 13, characterized in that Contains multiple constant temperature chambers.

15. An autonomous thermoplastic material dispensing unit, characterized in that comprising a material adapted to melt the plastic material and maintain it above T m Temperature T d The temperature of the system is controlled under the pressure, and it distributes the molten thermoplastic material by gravity.

16. An apparatus for manufacturing an embedded optical device for a photonic component suitable for emitting or capturing electromagnetic radiation of a given frequency, the optical device being composed of a material having a melting temperature T m The device is made of a thermoplastic material, the thermoplastic material is suitable for transmitting the electromagnetic radiation, the photonic component is located on a physical carrier, and the device is characterized in that it comprises a containing structure and a filling unit, wherein the containing structure further comprises: [a] a constant temperature cavity suitable for filling with molten thermoplastic material, wherein the constant temperature cavity is open, [b] a supporting structure, which is suitable for supporting the physical carrier with the photonic component on the cavity, so that the photonic component is inside the cavity, wherein when the physical carrier is supported by the supporting structure, the constant temperature cavity is partially open, and [c] a temperature control system, which is suitable for maintaining the constant temperature cavity at a temperature higher than the melting temperature T of the thermoplastic material. m Temperature T c Down.

17. The device according to claim 16, characterized in that The containing structure comprises an ejector, and the ejector is suitable for ejecting the photon component covered by the thermoplastic material from the constant temperature chamber.

18. The device according to claim 16 or 17, characterized in that The containing structure comprises a plurality of constant temperature chambers.

19. The device according to any one of claims 16 to 18, characterized in that The dispensing unit comprises an autonomous thermoplastic material dispensing unit, the dispensing unit comprising a thermoplastic material dispensing unit adapted to melt the plastic material and keep it at a temperature above T m Temperature T d The temperature of the system is controlled under the pressure, and the molten thermoplastic material is distributed by gravity.

20. The device according to claim 19, characterized in that The autonomous thermoplastic material dispensing unit comprises a reservoir adapted to contain an oxygen-free gas.

21. The device according to any one of claims 16 to 20, characterized in that The filling unit is a controlled temperature and ambient gas unit, wherein the gas is preferably an oxygen-free gas.

22. The device according to claim 21, characterized in that The temperature and ambient gas control unit has a temperature T adapted to maintain the gas at a higher temperature T than the temperature of the constant temperature chamber. g Temperature control system below.

23. The device according to any one of claims 16 to 22, characterized in that The filling unit has an inlet area and an outlet area adapted to allow entry and exit of the containing structure, respectively.

24. The device according to any one of claims 16 to 23, characterized in that Contains cooling unit.

25. The device according to claims 23 and 24, characterized in that The outlet region is connected to an inlet of the cooling unit.

26. The device according to any one of claims 16 to 25, characterized in that A heating plate is included that allows the temperature of the chamber to be regulated.

27. The device according to any one of claims 16 to 26, characterized in that Suitable for carrying out the method according to any one of claims 1 to 11.

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