Method for monitoring the temperature of an electronic device and control unit for performing same

Abstract

A method for monitoring a temperature of an electronic device (110) is described. The method comprises: (i) specifying a position (111) for temperature monitoring in the region of the electronic device (110); (ii) determining a parameter value of a parameter related to the actual temperature (113) at the location (111); and (iii) calculating the temperature (112) at the position (111) on the basis of the parameter value by means of a calibrated model, the calibrated model being implemented in a control unit and calibrated such that the sum of the actual temperature (113) at the position (111) and a predefined tolerance threshold value is less than or equal to the calculated temperature (112). Furthermore, a corresponding control unit is described.

Description

Technical Field

[0001] The present disclosure relates to a method for monitoring the temperature of an electronic device and a corresponding control unit for executing the method. Background Art

[0002] Overheating of electronic components or products can cause severe damage to the component itself or to products connected to it. In the worst case, overheating can lead to fire and is therefore a serious safety risk. For this reason, the requirements for functional safety in this field are very high, especially for products that operate with high power or current and can therefore generate a lot of heat, such as inverters, battery management systems or electric vehicle chargers.

[0003] Usually, the system or product to be monitored is equipped with temperature sensors at key locations. However, this requires the laborious determination of the corresponding positions for the sensors already in the design phase, wherein these positions cannot be changed after the sensors are installed. The use of sensors also brings considerable costs. In addition, sensors often cannot be used at specific locations simply due to their spatial size, so that even all required locations cannot be monitored. Summary of the invention

[0004] It is therefore an object of the present disclosure to provide an efficient method for monitoring the temperature of an electronic device, which method in particular requires only a small number of temperature sensors or even no temperature sensors at all.

[0005] This object is achieved by a method and a control unit according to the independent claims. Advantageous embodiments and developments of the method and of the control unit are respectively derived from the dependent claims, the following description and the drawings.

[0006] According to one aspect of the present disclosure, a method for monitoring the temperature of an electronic device is provided. The method includes: (i) presetting a location for temperature monitoring in an area of ​​the electronic device; (ii) determining a parameter value of a parameter related to the actual temperature at the location; and (iii) calculating the temperature at the location based on the parameter value with the aid of a calibrated model, so that the sum of the actual temperature at the location and a pre-set tolerance threshold is less than or equal to the calculated temperature. The method can be implemented by a computer.

[0007] According to another aspect of the present disclosure, a control unit is provided, in which a calibrated model is implemented and the control unit is configured to perform the above method. The control unit may have a modeling unit including the calibrated model.

[0008] In the context of the present disclosure, the term "electronic device" may in particular denote an electronic component or an electronic assembly of a system, such as a motor vehicle. The motor vehicle may have the electronic device and the control unit. The electronic device may be configured to operate at high power and / or high current. The operation of the electronic assembly may cause high heat generation. The electronic device may be or include, for example, a contactor, an inverter, a battery management system, a fuse (e.g. a thermal fuse) or an electric vehicle charger. The electronic device may have one or more power components, such as one or more contactors, one or more inverters and / or one or more fuses. The electronic device may have a geometric arrangement of one or more power components, in particular on a printed circuit board and / or in a housing. The electronic device may be a control device.

[0009] In the context of the present disclosure, the term "in the area of ​​the electronic device" may particularly refer to at least one of: a location inside the electronic device, a location on the surface of the electronic device, and a location in the environment of the electronic device. The environment may, for example, include a distance of less than 50 centimeters, particularly less than 10 centimeters, particularly less than 1 centimeter from the electronic device.

[0010] In the context of the present disclosure, a "position for temperature monitoring" is in particular a position which is particularly relevant to the level of safety requirements to be met, for example compared to other positions in the area of ​​the electronic device. At the position for temperature monitoring, for example, particularly large and / or particularly rapid heating may occur, in particular compared to other positions in the area of ​​the electronic device. More than one position for temperature monitoring may be predetermined, for example two, three, four, five or more, in particular more than ten, in particular more than one hundred. One or more positions may be predetermined with respect to a geometric arrangement of one or more power components. One or more positions may be predetermined with respect to a printed circuit board or a circuit board on which at least one power component is arranged. One or more positions may be predetermined with respect to a housing in which and / or on which at least one power component is arranged. One or more positions may be one or more hot spots, in particular thermal hot spots. One or more positions may not be directly measurable.

[0011] In the context of the present disclosure, the term "determining" may in particular be or include measuring a parameter value by means of a corresponding measuring device (e.g., a sensor). The term may also include measuring a value related to the parameter value. Determining a parameter value may also be or include modeling the parameter value. Determining a parameter value may also be or include looking up the parameter value in a table.

[0012] In the context of the present disclosure, the term "parameter" may particularly refer to a characteristic variable of an electronic device. Corresponding parameter values ​​of a plurality of parameters may be determined, for example two, three, four, five or more than five parameters, in particular more than ten parameters. One or more parameters may be current, voltage, internal resistance, sleep time or ambient temperature, or may be variables representing the characteristic variables mentioned. One or more parameters may relate to characteristic variables other than device temperature. Alternatively, one or more parameters may include one or more device temperatures, in particular device temperatures at the location of a temperature sensor. One or more device temperatures may relate to a location in an area of ​​the electronic device that is different from one or more predetermined locations. One or more parameters may be input variables and / or model parameters of a calibrated model.

[0013] In the context of the present disclosure, the term "correlated" may in particular mean that the temperature at the location to be monitored is correlated with the parameter. In other words, a change in the parameter leads to an associated change in the temperature, and vice versa, in particular when further specified basic conditions are met. Thus, for example, the current flowing through an electronic device may be correlated with the temperature at the location to be monitored, since the flow of current causes heating, which in turn affects the temperature of the electronic components. Similarly, the voltage, the internal resistance and / or the ambient temperature may be correlated with the temperature at the location to be monitored.

[0014] In the context of the present disclosure, a "calibrated model" may particularly refer to a model whose results (i.e., for example, calculated temperatures) have been adapted or approximated to corresponding actual values ​​(e.g., corresponding actual temperatures) by means of experimental data and / or by means of simulations. Such calibration may be performed by selecting appropriate values ​​for model parameters.

[0015] In the context of the present disclosure, a calculated "temperature" may be a temperature in a predetermined operating state of the electronic device, in particular a temperature in a critical operating state. A critical operating state may be defined by a calculated temperature and / or an actual temperature that is above a predetermined temperature threshold. A critical operating state may include a situation where the actual temperature has a peak or maximum value and / or the actual temperature exceeds 80° C., in particular 100° C., in particular 120° C. The calculated temperature may be associated with the operating state when the calibrated model was calibrated.

[0016] In the context of the present disclosure, the term "tolerance threshold" can particularly represent a predetermined safety distance. The tolerance threshold can set a minimum distance between the actual temperature and the calculated temperature. The distance can be set so that the distance is always maintained during the operation of the device, especially during the normal, trouble-free operation of the device. The tolerance threshold can also be set so that the tolerance threshold is observed under certain critical operating conditions, but it is not necessarily necessary to observe the tolerance threshold in other cases. The tolerance threshold is preferably a positive number, but can also be a negative number or zero. The tolerance threshold can also be defined as variable, especially depending on the corresponding operating state of the electronic device. In addition to the literal meaning, the expression "the sum of the actual temperature at this position and the predetermined tolerance threshold is less than or equal to the calculated temperature" can also be understood as "the temperature calculated by means of a calibrated model is at least greater than the temperature determined by means of a temperature distribution model and / or by means of a thermal examination of a real example of the electronic device by a predetermined tolerance threshold", especially when the determined temperature and the calculated temperature involve the same operating state.

[0017] In the context of the present disclosure, the term "control unit" may particularly denote a device configured to control a process or a procedure. The control unit may have a processor in which arithmetic operations are performed and control signals are generated. The control unit may have a modeling unit containing a calibrated model.

[0018] By means of the described method for monitoring temperature and a corresponding control unit, the need for one or more temperature sensors can be eliminated compared to purely sensor-based temperature monitoring, while still ensuring suitable temperature monitoring. For example, the following temperature modeling can be implemented, in which not every power component of the electronic device is monitored by a physical temperature sensor attached to the corresponding power component. Thus, expensive temperature measurements can be replaced by other measurement signals that are provided anyway (e.g., voltage measurements or current measurements). In addition, the temperature at locations that cannot be measured directly (e.g., because there is not enough space to accommodate the temperature sensor) can be modeled. Temperature signals at a large number of desired locations in the area of ​​the electronic device can be generated with little effort.

[0019] Therefore, temperature modeling can help to comply with certain safety requirements (such as legal safety requirements) for the operation of electronic equipment. Note that the tolerance threshold or safety distance can represent an additional safety factor. Such safety requirements can, for example, relate to preventing overheating, fire or explosion.

[0020] According to one embodiment, the calibrated model is calibrated with the aid of a temperature distribution model of the electronic device and / or with the aid of a thermal examination of a real example of the electronic device. For example, the real example can be thermally examined within the scope of a test bench measurement. The calibration can be performed according to the operating state of the electronic device. Calibrating the calibrated model for a predetermined operating state may require that the temperature distribution model models this operating state and / or that the real example assumes this operating state.

[0021] The calibrated model can be implemented on the control unit, in particular on the modeling unit of the control unit. Therefore, there can be two models: one is a relatively complex and computationally intensive temperature distribution model of the electronic device, which is used to calibrate a simpler model for use as a calibrated model. The temperature distribution model can be, for example, a 3D model of the electronic device or a part of the electronic device. It can be implemented on an external computer with a stronger computing power than the control unit. The simpler model may require less computing power than the temperature distribution model, so that the corresponding temperature value can be calculated faster, in particular in real time. The calibration of the calibrated model can ensure that the calculated temperature value has the required accuracy and / or the required reliability.

[0022] According to one embodiment, the real example is a worst-case example and / or the temperature distribution model is based on a worst-case scenario. It can thereby be ensured that the calculated temperature value is not lower than or at least only slightly lower than the actual temperature value, even if the actual temperature value originates from an example of the electronic device that is not conducive to heating. In other words, all possible operating states and / or design profiles of the electronic device can be considered in terms of compliance with the tolerance threshold.

[0023] In the context of the present disclosure, a "worst case example" may be an implementation of an electronic device or a part of an electronic device, during the operation of which particularly high temperatures may be generated, in particular at one or more safety-critical locations of the electronic device, in particular at one or more predetermined locations. The part of the electronic device may include or consist of one or more power components, in particular all power components. The temperature may be particularly high compared to other average or conventional examples of the electronic device. The worst case example may be characterized by one or more attributes that are located at the boundaries or edges of a tolerance range. Such a tolerance range may be predetermined by a data table associated with the electronic device and / or by a data table associated with one or more power components. For example, a worst case example may be an example at the end of a predetermined service life and / or an example whose attributes correspond to attributes expected at the end of a predetermined service life. The worst case example may be an example whose internal resistance is relatively high, in particular compared to a conventional or average example.

[0024] A “worst case scenario” may be defined by one or more worst case examples and / or by particularly adverse operating conditions.

[0025] According to one specific embodiment, at least one power component of the real example is a worst-case power component, in particular all power components of the real example are worst-case power components. With this approach, which is contrary to the usual professional approach, the tolerance threshold can be adhered to particularly easily.

[0026] According to one embodiment, a temperature distribution model is created based on worst-case power components, in particular assuming that all power components of the electronic device are worst-case power components.

[0027] According to one embodiment, the real example is a conventional example and / or the temperature distribution model is based on a conventional scenario. In the context of the present disclosure, a "conventional example" may be an implementation of an electronic device or a portion thereof that generates an average temperature during operation of the electronic device, particularly at one or more safety-critical locations of the electronic device. The average value may be determined by comparing all qualifying examples. A "conventional scenario" may be defined by one or more conventional examples and / or by conventional operating conditions.

[0028] According to one embodiment, the calibrated model is characterized by a smaller dimension than the temperature distribution model. In particular, the calibrated model can be one-dimensional, or the dimension can be between one and two. For example, the calibrated model can be implemented in the context of a plurality of interacting nodes, wherein the heat exchange between the nodes is modeled. The calculation time of the calibrated model can thereby be reduced, so that the required computing power of the control unit is relatively small. Real-time modeling is also possible.

[0029] According to one embodiment, the method further comprises: (i) setting a safety requirement level for the electronic device, (ii) checking whether the parameter meets the safety requirement level, and (iii) performing a rationality check on the parameter if the parameter does not meet the safety requirement level.

[0030] In the context of the present disclosure, the term "rationality check" may particularly mean providing further reasons and / or facts to support the accuracy and / or reliability of the calculation or estimation of the parameter. The parameters may be rationally checked such that a certain degree of reliability and / or a certain degree of accuracy is guaranteed, which may be predetermined by the safety requirement level.

[0031] For example, the rationality of the parameters can be checked by considering the dependence of the parameters on the aging of the electronic device and / or the dependence of the parameters on operating parameters such as the ambient temperature. In addition, worst-case assumptions can be made. Finally, it is also possible to consider using specific measured values ​​to support the rationality check of the parameter calculation or estimation. For example, the internal resistance of the electronic device can be determined as an additional input variable of the calibrated model by additional voltage measurements. Or the aging dependency can be defined by corresponding measured values. By checking the rationality of the parameters, the parameters can be made to meet the safety requirement level.

[0032] According to one embodiment, the rationality check of the parameter includes at least one of the following steps: when determining the parameter value, taking into account the dependence of the parameter on the aging of the electronic device; when determining the parameter value, taking into account the dependence of the parameter on the operating conditions, in particular the ambient temperature; when determining the parameter value, making a worst-case assumption; when determining the parameter value, taking into account the measured value of at least one characteristic variable different from the parameter.

[0033] According to one embodiment, the method further comprises setting a safety requirement level, wherein the tolerance threshold is predetermined so that the safety requirement level is met. For example, the tolerance threshold may affect at least one of the severity, probability of occurrence and controllability of the electronic device failure, in particular so that the combination of severity, probability of occurrence and controllability meets the safety requirement level. Appropriate selection of the tolerance threshold may ensure a safe distance between the actual temperature and a critical temperature value characterizing a faulty operating state.

[0034] According to one embodiment, the tolerance threshold is between 0° C. and 50° C., in particular between 5° C. and 50° C., in particular between 15° C. and 40° C. The tolerance threshold may take such a value when the electronic device is in an operating state in which the actual temperature at the location is relatively high and / or assumes a temperature maximum in normal operation. The tolerance threshold may also have a negative value, for example greater than -10° C. or greater than -5° C., in particular when the actual temperature at the location is relatively low in the current operating state.

[0035] According to an embodiment, the safety requirement level sets requirements for the operation of the electronic device with respect to at least one of the severity of a fault during operation of the electronic device, the probability of occurrence of the fault, and the controllability of the fault.

[0036] The severity of a fault may be characterized by a danger to a user and / or the environment. The "exposure" may be characterized by the frequency and / or duration of a fault or an operating state corresponding to the fault. The "controllability" may be determined by the proportion of users who have control over the condition corresponding to the fault. In the context of the present disclosure, a "fault" may particularly denote a faulty operating state of an electronic device, in which a user and / or his environment may be endangered, for example due to high temperatures, a fire hazard or an explosion hazard.

[0037] The safety requirement level can be determined, for example, by the Automotive Safety Integrity Level (ASIL), in particular ASIL-C or ASIL-D as defined in the ISO26262 standard. The safety requirement level determined by ASIL can be determined by risk analysis of potential hazards taking into account the severity, exposure, and controllability of the corresponding vehicle operating scenario. ASIL-D defines the highest safety requirement for electronic equipment, followed by ASIL-C.

[0038] According to one embodiment, a tolerance threshold value is predefined as a function of the respective operating state of the electronic device. For example, in critical operating states, in particular in which the actual temperature is particularly high, the tolerance threshold value may be higher than the tolerance threshold value in non-critical operating states (e.g. during cooling). Critical operating states may include situations in which the actual temperature has a peak value or a maximum value and / or the actual temperature exceeds 80° C., in particular 100° C., in particular 120° C. This embodiment may be advantageous because unnecessary power reductions, for example power reductions of the electronic device or a system containing the electronic device, may thereby be avoided. At the same time, safety requirement levels, in particular with respect to critical operating states, may be adhered to.

[0039] According to one embodiment, the operating duration and / or the service life of the electronic device is taken into account when calculating the temperature with the aid of a calibrated model. For example, the parameter may be the internal resistance, and service life-related changes in the internal resistance may be taken into account with the aid of an aging curve. For example, the aging curve may be determined based on measured values. This makes it possible to model the parameters more accurately and, for example, to reduce power reductions due to safety requirements that must be observed. As a worst-case assumption, for example, the internal resistance at the maximum possible service life may be set as the parameter value.

[0040] According to one embodiment, determining the parameter value includes: (i) determining a parameter range in which the actual parameter value lies, (ii) determining an unfavorable parameter value from the parameter range in which the calculated temperature is the largest, and (iii) setting the parameter value based on the unfavorable parameter value. The calculated temperature is particularly the highest compared to the calculated temperatures for other parameter values ​​from the parameter range. For example, the parameter value can be set equal to the unfavorable parameter value. This embodiment may be advantageous because a worst-case scenario is assumed that can ensure compliance with safety standards. For example, if the internal resistance increases during the service life of the electronic device, but the service life of the electronic device is unknown, the internal resistance at the end of the service life can be assumed.

[0041] According to one embodiment, the parameter comprises at least one of the following characteristic variables: current, voltage, internal resistance, sleep time and ambient temperature. The current can be in particular the current at the input and / or output of the power element of the electronic device. The voltage can be in particular the voltage between the input and output of the power element of the electronic device. All these parameters contribute to heat generation and can therefore indicate the temperature at the location to be monitored.

[0042] According to one specific embodiment, the parameter is determined based on the measured value, wherein if the measured value is not available, the parameter is determined using a predefined substitute value instead of the measured value, wherein in particular the temperature calculated for the predefined substitute value is at most as great as the temperature calculated for the measured value. For example, a constant maximum value can be assumed as the predefined substitute value, such as a constant maximum current. Alternatively, the predefined substitute value can be calculated based on other variables, wherein a corresponding tolerance is added.

[0043] Such an embodiment may also be advantageous because a worst-case scenario is assumed which can ensure compliance with safety standards. This embodiment may be advantageous because, for example, compliance with safety standards can be ensured even if a corresponding measuring device or sensor fails.

[0044] According to one embodiment, parameter values ​​of a plurality of parameters related to the temperature at the location are determined, and the temperature at the location is calculated based on the parameter values ​​of the plurality of parameters.

[0045] According to one embodiment, the plurality of parameters comprises a temperature measured by means of a temperature sensor at another location in the area of ​​the electronic device different from the location. Such an embodiment can be advantageous for determining the temperature at a location that cannot be directly measured in a particularly accurate and reliable manner.

[0046] According to one embodiment, the method further comprises controlling the electronic device so that the calculated temperature remains below a predetermined temperature limit value, in particular below 170° C., in particular below 150° C. The predetermined temperature limit value may be determined by a critical temperature when the electronic device overheats and / or when there is a risk of fire or explosion of the electronic device. The control may comprise at least one of cooling, shutting down and disconnecting the electronic device.

[0047] According to one embodiment, the current temperature and / or the future temperature at a location for temperature monitoring is calculated.

[0048] According to one specific embodiment, no temperature sensors are present in the area of ​​the electronics.

[0049] According to one embodiment, the parameter is not temperature.

[0050] According to one embodiment, the electronic device is at least one of a contactor, a fuse (particularly a thermal fuse), an inverter, a battery management system, and an electric vehicle (EV) charger. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Further advantages and advantageous embodiments and developments of the method and of the control unit will be apparent from the exemplary embodiments described below in conjunction with the drawings.

[0052] Figure 1 , Figure 2 and Figure 3 A control unit for monitoring temperature according to an embodiment of the present disclosure and a corresponding position to be monitored in an electronic device area are respectively shown.

[0053] Figure 4 A method for monitoring the temperature of an electronic device according to an embodiment of the present disclosure is shown.

[0054] Figures 5 to 10 The calculated temperatures and actual temperatures at locations for temperature monitoring of various electronic devices according to embodiments of the present invention are respectively compared.

[0055] Elements that are the same, of the same type or have the same function in the figures have the same reference numerals. In some figures, individual reference numerals may be omitted to improve clarity. The figures and the dimensional ratios of the elements shown in the figures should not be considered to be drawn to scale. On the contrary, individual elements may be shown exaggeratedly for better display and / or for better understanding. DETAILED DESCRIPTION

[0056] Before describing exemplary embodiments of the present invention in more detail with reference to the accompanying drawings, some basic considerations upon which the exemplary embodiments were developed will be generally described.

[0057] According to an exemplary embodiment, the temperature information required for the monitoring function is generated by a model-based approach using various other signals available in the system (such as current, voltage, internal resistance or ambient temperature of the component). In order to meet the requirements of functional safety using this approach, such as within the scope of ASIL-C or ASIL-D, the monitoring function is designed to have at least one of the following properties.

[0058] 1. Identify thermally critical components (hot spots) in the system and map them in the model with corresponding parameters (e.g., contactor as resistor). The corresponding parameters are assumed to be worst case (e.g., end-of-life internal resistance for contactor, protected by verification). For parameters that change during the service life or change abruptly under certain conditions, the behavior is mapped.

[0059] 2. Identify the available input signals and the corresponding ASIL integrity. Only input signals or information with the required ASIL level are allowed to be used for the model. This usually involves current, voltage or available temperature. If the ASIL level is not sufficient, the input signal will be protected accordingly (rationality check, etc.). Optionally, suitable measurement signals are inserted into the system to generate information for the model in a targeted manner (e.g. additional voltage measurement to calculate the internal resistance as input to the model).

[0060] 3. Calibrate or fit the model with the corresponding worst case components (eg contactors with high internal resistance) and the required design profile by means of simulations and measurements. Figure 4 An example of such a fitting approach is shown. In this case, the model always calculates a temperature that is higher than the actual temperature occurring at the corresponding location (safety distance). This safety distance is a prerequisite for achieving ASIL integrity (see Figures 5 to 10 Calculated and actual temperatures shown).

[0061] 4. Model a safety distance between actual and calculated temperature taking into account availability. This distance cannot be too high, otherwise unnecessary power reduction would occur due to identified overheating. Therefore, all design profiles or operating states must be achieved without restriction. To achieve this, add all tolerances and disturbances in the corresponding signal chain.

[0062] 5. Define appropriate substitute value strategies for possible fault situations. When the input signal fails, the model always reacts to too high a temperature. Therefore define substitute values, such as a constant maximum value for the current or calculate the current from other variables and add any tolerances.

[0063] By implementing these measures, temperature information with a corresponding integrity level can be provided.

[0064] Figure 1 , Figure 2 and Figure 3 A control unit 100 is shown, which is configured to execute a method for monitoring the temperature of an electronic device 110. The method comprises the following steps: (i) predefining a location 111 for temperature monitoring in the area of ​​the electronic device 110, (ii) determining an actual temperature 113 (not shown, see Figures 5 to 10 ) and (iii) calculating the temperature 112 at the position 111 (not shown, see Figures 5 to 10 ) is modeled so that the sum of the actual temperature 113 at the position 111 and a predetermined tolerance threshold value is less than or equal to the calculated temperature 112.

[0065] The electronic device 110 is a contactor, i.e. an electric switch or electromagnetically operated switch for high power. A contactor (e.g. a DC charging contactor) can, for example, switch a positive DC connection terminal and a negative DC connection terminal (DC+ contactor and DC- contactor). The two elements 110 represent switches of two electrical lines 114 that may be constructed separately.

[0066] A calibrated model is implemented in the control unit 100, which calculates the temperature 112 at one or more locations 111 to be monitored. For the modeling, various parameter values ​​are taken into account, which are detected by corresponding measuring devices or sensors 120, 121, 122, 123, 124 and transmitted to the control unit via signal lines 125.

[0067] exist Figure 1 In the embodiment shown, there is no temperature sensor in the area of ​​the electronic device 110, so the temperature at the location to be monitored 111 is calculated entirely based on other parameters. For example, a current measuring device 121 is arranged in each electrical line 114, which transmits the measured current value to the control unit 100 as a parameter value. In addition, the ambient temperature is transmitted to the control unit 110 as a parameter value by a temperature sensor 123 that is not arranged in the area of ​​the electronic device 110. The operating duration counter 120 transmits the operating duration and / or the service life as a parameter value to the control unit 110. Finally, the sleep time of the electronic device 110 is transmitted as an operating parameter by the corresponding sleep time counter 122.

[0068] exist Figure 2 In the embodiment shown, the temperature sensor 124 is located in the area of ​​the electronic device 110, and the temperature sensor 124 transmits the corresponding temperature value to the control unit 100 via the signal line 125. The control unit 100 determines the temperature value based on these temperature values ​​and the temperature information obtained from the control unit 100. Figure 1The temperature at the monitored location 111 is calculated based on other parameters known in the invention, namely, the ambient temperature, the sleep time and the current value in the electrical circuit 121. Compared with the temperature monitoring that only monitors the temperature of the electronic device 110 by means of a temperature sensor, Figure 2 In an embodiment, fewer temperature sensors are required in the area of ​​the electronic device. Figure 1 In contrast to a purely model-based approach, this implementation can also be called a hybrid approach.

[0069] at last, Figure 3 An embodiment is shown in which the temperature is calculated at locations 111 to be monitored in the area of ​​the electronic device 110 which cannot or are difficult to measure directly. The temperature at these locations 111 is calculated solely based on the temperature values ​​measured in the area of ​​the electronic device by means of sensors 124.

[0070] Figure 4 A method for monitoring the temperature of an electronic device according to an embodiment of the present disclosure is shown. First, a thermal test is performed using a conventional example and a worst-case example (step S1), and a 3D simulation is performed using a worst-case example (e.g., a worst-case contactor) (step S2). In a subsequent step S3, a hybrid data set is generated by coordinating and connecting the data from the 3D simulation and the thermal test with each other. In a further step S4, the test data and the 3D simulation data are interpolated to the 1DμC model node. In a subsequent step S5, the nominal resistance is corrected to the worst-case resistance for all parts of the hotspot list. In the next step S6, test data about the resistance at the beginning of the service life (beginning of life BOL), the resistance at the end of the service life (end of life EOL), and the resistance of the worst-case scenario (WC) are interpolated. In a further step S7, the 1DμC model is fitted using the hybrid data set. Finally, the model can be verified with respect to the data determined in step 1 and / or step 2 (step 8).

[0071] Figures 5 to 10 The calculated temperature 112 at the temperature monitoring location of the various electronic devices is respectively compared with the temperature measured during the test or the actual temperature 113. The temperature course 131 (in ° C.) is shown over time 130 (in seconds). The calculated temperature 112 is almost always greater than or equal to the actual temperature 113. Exceptions only concern non-critical phases or operating states where the actual temperature is particularly low (see, for example, Figure 5 and Figure 6 During the critical phase, when the actual temperature is particularly high, there is a safety distance or tolerance threshold of about 10°C to 40°C between the actual temperature and the calculated temperature.

[0072] exist Figure 5 In the case of a negative contactor, the electronic device is the negative contactor. Figure 6 The positive contactor is in the middle. Figure 7 The so-called thermal fuse is a battery isolation system with thermal melt technology. Figure 8 The middle is the shunt, Fig. 9 The A1 connector (negative) is in the middle. Fig.10 In the middle is the B1 connector (negative).

[0073] The present invention is not limited to the embodiments because of the description based on the embodiments. On the contrary, the present invention includes any new features and any combination of features, in particular including any combination of features in the embodiments and claims.

[0074] Reference numerals

[0075] 100 Control Unit

[0076] 110 Electronic equipment

[0077] 111 Position for temperature monitoring

[0078] 112 Calculated temperature

[0079] 113 Actual temperature

[0080] 114 Electric lines

[0081] 120 Operation duration counter

[0082] 121 Current measuring device

[0083] 122 Sleep time counter

[0084] 123 Ambient temperature sensor

[0085] 124 Equipment temperature sensor

[0086] 125 signal line

[0087] 130 Time

[0088] 131 Temperature

Claims

1. A method for monitoring the temperature of an electronic device (110), the method comprising: predefining a location (111) for temperature monitoring in the area of ​​the electronic device (110); determining a parameter value of a parameter related to an actual temperature (113) at the location (111); as well as The temperature (112) at the position (111) is calculated based on the parameter value using a calibrated model, wherein the calibrated model is implemented in a control unit and calibrated so that the sum of the actual temperature (113) at the position (111) and a predetermined tolerance threshold value is less than or equal to the calculated temperature (112).

2. The method according to the preceding claim, wherein the calibrated model is calibrated with the aid of a temperature distribution model of the electronic device (110) and / or with the aid of a thermal inspection of a real example of the electronic device (110).

3. The method according to claim 2, wherein the real example is a worst case example and / or wherein the temperature distribution model is based on a worst case scenario.

4. The method of any one of claims 2 or 3, wherein the calibrated model is characterized by smaller dimensions than the temperature distribution model.

5. A method according to any one of the preceding claims, wherein parameter values ​​of a plurality of parameters related to the temperature at the location (111) are determined, wherein the plurality of parameters include a temperature measured by means of a temperature sensor at another location in the area of ​​the electronic device that is different from the location (111), and wherein the temperature at the location (111) is calculated based on the parameter values ​​of the plurality of parameters.

6. The method according to any one of the preceding claims, further comprising: Setting a safety requirement level of the electronic device (110); Checking whether the parameters meet the safety requirement level; as well as If the parameters do not meet the safety requirement level, a plausibility check is performed on the parameters.

7. The method according to claim 6, wherein the rationality check of the parameter comprises at least one of the following steps: when determining the parameter value, taking into account the dependency of the parameter on the aging of the electronic device; When determining the parameter value, the dependency of the parameter on the operating conditions, in particular the ambient temperature, is taken into account; In determining the values ​​of said parameters, worst-case assumptions are made; When determining the parameter value, a measured value of at least one characteristic variable different from the parameter is taken into account.

8. The method according to any one of claims 1 to 5, further comprising: A safety requirement level of the electronic device (110) is set, wherein the tolerance threshold is predetermined so that the safety requirement level is met.

9. The method according to any one of claims 6 to 8, wherein the safety requirement level sets requirements for the operation of the electronic device (110) with respect to at least one of the following safety requirement characteristics: the severity of a failure during operation of the electronic device (110), the probability of occurrence of the failure, and the controllability of the failure.

10. The method according to any of the preceding claims, wherein the tolerance threshold value is predetermined as a function of a respective operating state of the electronic device (110).

11. The method according to claim 1, wherein an operating period and / or a service life of the electronic device (110) is taken into account when calculating the temperature with the aid of the calibrated model.

12. The method according to any of the preceding claims, wherein the parameter comprises at least one of the following characteristic variables: current, voltage, internal resistance, sleep time and ambient temperature.

13. A method according to any of the preceding claims, wherein the parameter is determined based on a measured value and wherein, if the measured value is not available, the parameter is determined using a predetermined substitute value instead of the measured value, wherein the temperature (112) calculated for the predetermined substitute value is at most as great as the temperature calculated for the measured value.

14. The method according to any one of the preceding claims, further comprising The electronic device (110) is controlled such that the calculated temperature (112) remains below a predefined temperature limit value, in particular below 150° C.

15. A control unit (100) in which a calibrated model is implemented and which is configured to perform the method according to any one of claims 1 to 14.

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