Fluid supply system, substrate processing apparatus, and substrate processing method

Abstract

A fluid supply system according to one embodiment of the present disclosure supplies a fluid into a processing container in which a substrate is processed, the fluid supply system comprising: a processing fluid supply unit that supplies a processing fluid; a fluid supply path which is connected to the processing fluid supply unit and the processing container and through which the temperature-adjusted processing fluid flows into the processing container; a first heating mechanism that is provided in the fluid supply path and heats the processing fluid to a first temperature; and a second heating mechanism that is provided in the fluid supply path and heats the processing fluid to a second temperature lower than the first temperature, in which the processing fluid supply unit has a flow rate adjustment mechanism that adjusts the flow rate of the processing fluid, and the fluid supply path has a first branch flow path and a second branch flow path that is provided in the fluid supply path and that heats the processing fluid to a second temperature lower than the first temperature. The first heating mechanism is used for enabling the processing fluid to flow into the processing container through the first heating mechanism; and a second branch flow path through which the processing fluid flows into the processing container through the second heating mechanism.

Description

Technical Field

[0001] The present disclosure relates to a fluid supply system, a substrate processing device and a substrate processing method. Background Art

[0002] A technique for drying a substrate using a supercritical fluid is known. Patent Document 1 discloses a structure for switching the temperature of a supercritical fluid supplied to a substrate.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2021-086857 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure provides a technology capable of supplying a treatment fluid with a controlled flow rate and temperature.

[0008] Solutions for solving problems

[0009] A fluid supply system involved in one embodiment of the present disclosure supplies fluid to a processing container in which a substrate is processed, and the fluid supply system comprises: a processing fluid supply part, which supplies processing fluid; a fluid supply path, which is connected to the processing fluid supply part and the processing container and is used to allow the processing fluid with adjusted temperature to flow into the processing container; a first heating mechanism, which is arranged on the fluid supply path and heats the processing fluid to a first temperature; and a second heating mechanism, which is arranged on the fluid supply path and heats the processing fluid to a second temperature lower than the first temperature, wherein the processing fluid supply part has a flow adjustment mechanism for adjusting the flow rate of the processing fluid, and the fluid supply path has: a first branch flow path, which is used to allow the processing fluid to flow into the processing container through the first heating mechanism; and a second branch flow path, which is used to allow the processing fluid to flow into the processing container through the second heating mechanism.

[0010] Effects of the Invention

[0011] According to the present disclosure, it is possible to supply a treatment fluid with a controlled flow rate and temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a diagram showing a substrate processing apparatus according to the first embodiment.

[0013] Figure 2 It is a timing chart showing the substrate processing method according to the first embodiment.

[0014] Figure 3 FIG. 1 is a diagram showing a substrate processing method according to a first embodiment.

[0015] Figure 4 FIG. 2 is a diagram showing a substrate processing method according to the first embodiment.

[0016] Figure 5 FIG. 3 is a diagram showing a substrate processing method according to the first embodiment.

[0017] Figure 6 FIG. 4 is a diagram showing the substrate processing method according to the first embodiment.

[0018] Figure 7 FIG. 5 is a diagram showing the substrate processing method according to the first embodiment.

[0019] Figure 8 FIG. 6 is a diagram showing the substrate processing method according to the first embodiment.

[0020] Fig. 9 FIG. 7 is a diagram showing a substrate processing method according to the first embodiment.

[0021] Fig.10 It is a diagram showing a substrate processing apparatus according to a second embodiment.

[0022] Fig.11 It is a timing chart showing the substrate processing method according to the second embodiment.

[0023] Fig.12 FIG. 1 is a diagram showing a substrate processing method according to a second embodiment.

[0024] Fig.13 FIG. 2 is a diagram showing a substrate processing method according to a second embodiment.

[0025] Fig.14 FIG. 3 is a diagram showing a substrate processing method according to a second embodiment.

[0026] Fig.15 FIG. 4 is a diagram showing a substrate processing method according to a second embodiment.

[0027] Fig.16 FIG. 5 is a diagram showing a substrate processing method according to a second embodiment.

[0028] Fig.17 FIG. 6 is a diagram showing a substrate processing method according to a second embodiment.

[0029] Fig.18FIG. 7 is a diagram showing a substrate processing method according to a second embodiment.

[0030] Fig.19 It is a diagram showing a substrate processing apparatus according to a first modified example of the second embodiment.

[0031] Fig. 20 It is a diagram showing a substrate processing apparatus according to a second modified example of the second embodiment.

[0032] Fig.21 It is a diagram showing a substrate processing apparatus according to a third embodiment.

[0033] Fig. 22 It is a diagram showing a substrate processing apparatus according to a fourth embodiment.

[0034] Fig.23 It is a diagram showing a substrate processing apparatus according to a fifth embodiment.

[0035] Fig.24 It is a diagram showing a substrate processing apparatus according to a sixth embodiment. DETAILED DESCRIPTION

[0036] Hereinafter, non-limiting embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the drawings, the same or corresponding components or parts are denoted by the same or corresponding reference numerals, and repeated descriptions are omitted.

[0037] [First embodiment]

[0038] (Substrate processing equipment)

[0039] Reference Figure 1 A substrate processing apparatus 10 according to the first embodiment will be described. Figure 1 It is a diagram showing a substrate processing apparatus 10 according to the first embodiment.

[0040] The substrate processing apparatus 10 includes a processing unit 11 , a fluid supply system 12 , a discharge unit 13 , and a control unit 14 .

[0041] The processing unit 11 includes a processing container 111 and a holding plate 112. The processing container 111 is a container having a processing space formed therein that can accommodate a substrate W having a diameter of, for example, 300 mm. The substrate W may be, for example, a semiconductor wafer. The holding plate 112 is disposed inside the processing container 111. The holding plate 112 holds the substrate W horizontally. The processing unit 11 may also include a pressure sensor for detecting the pressure inside the processing container 111, and a temperature sensor for detecting the temperature inside the processing container 111.

[0042] The fluid supply system 12 includes a processing fluid supply unit 121 and a temperature adjustment unit 122 .

[0043] The processing fluid supply unit 121 has a processing fluid supply source S11, a first supply flow path L11, an opening and closing valve V11, a throttle hole OR11, a second supply flow path L12, an opening and closing valve V12, a throttle hole OR12, an inert gas supply source S12, a third supply flow path L13 and an opening and closing valve V13.

[0044] The treatment fluid supply source S11 is a supply source of the treatment fluid. The treatment fluid may be, for example, carbon dioxide (CO2) in a liquid state.

[0045] The upstream of the first supply flow path L11 is connected to the processing fluid supply source S11, and the downstream is connected to the temperature adjustment unit 122. In the first supply flow path L11, an on-off valve V11 and an orifice OR11 are provided in order from the upstream.

[0046] The on-off valve V11 is a valve that switches the flow of the process fluid between flow and cutoff. The on-off valve V11 allows the process fluid to flow to the downstream temperature adjustment unit 122 when it is open, and does not allow the process fluid to flow to the downstream temperature adjustment unit 122 when it is closed.

[0047] The orifice OR11 has a function of reducing the flow rate of the process fluid in a liquid state to adjust the pressure. The orifice OR11 allows the process fluid with the adjusted pressure to flow to the temperature adjustment unit 122 at the downstream.

[0048] The second supply flow path L12 is provided in parallel with the first supply flow path L11. The second supply flow path L12 branches from the first supply flow path L11 at a position upstream of the on-off valve V11, and merges with the first supply flow path L11 at a position downstream of the orifice OR11. In the second supply flow path L12, the on-off valve V12 and the orifice OR12 are provided in order from the upstream.

[0049] The on-off valve V12 is a valve that switches the flow of the process fluid between flow and cutoff. The on-off valve V12 allows the process fluid to flow to the downstream temperature adjustment unit 122 when it is open, and does not allow the process fluid to flow to the downstream temperature adjustment unit 122 when it is closed.

[0050] The orifice OR12 has a function of reducing the flow rate of the process fluid in a liquid state to adjust the pressure. The orifice OR12 allows the process fluid with the adjusted pressure to flow to the temperature adjustment unit 122 at the downstream.

[0051] The inert gas supply source S12 is a supply source of an inert gas. The inert gas may be, for example, nitrogen (N2) gas.

[0052] The third supply flow path L13 is connected to the inert gas supply source S12 upstream and merges with the first supply flow path L11 downstream at a position downstream of the orifice OR11. An on-off valve V13 is provided in the third supply flow path L13. A one-way valve, a filter, etc. may also be provided in the third supply flow path L13.

[0053] The on-off valve V13 is a valve that switches the flow of the inert gas between flow and shutoff. The on-off valve V13 allows the inert gas to flow to the downstream temperature adjustment unit 122 when open, and does not allow the inert gas to flow to the downstream temperature adjustment unit 122 when closed.

[0054] The temperature adjustment unit 122 is connected to the processing fluid supply unit 121 and the processing container 111. The temperature adjustment unit 122 allows the fluid whose temperature is adjusted to flow into the interior of the processing container 111. The fluid includes the processing fluid and the inert gas. The temperature adjustment unit 122 has a first branch flow path L14, a second branch flow path L15, a bypass flow path L16, and a first exhaust flow path L17.

[0055] In the first branch flow path L14, a heating mechanism HE11, an on-off valve V15, a filter F11, and a temperature sensor T11 are provided in order from the upstream. A line heater LH11 is provided at a position downstream of the heating mechanism HE11 in the first branch flow path L14. Sensors such as temperature sensors and pressure sensors may also be provided at various positions in the first branch flow path L14.

[0056] In the second branch flow path L15, a heating mechanism HE12, an on-off valve V16, and a filter F12 are provided in order from the upstream. A line heater LH12 is provided at a position downstream of the heating mechanism HE12 in the second branch flow path L15. Sensors such as temperature sensors and pressure sensors may also be provided at various positions in the second branch flow path L15.

[0057] The first branch flow path L14 branches from the second branch flow path L15 between the heating mechanism HE12 and the on-off valve V16 . The second branch flow path L15 merges with the first branch flow path L14 at a position immediately before the processing container 111 .

[0058] The heating mechanism HE11 and the heating mechanism HE12 are provided in series. The heating mechanism HE11 heats the fluid supplied from the treatment fluid supply unit 121 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

[0059] The on-off valve V15 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V15 allows the fluid to flow to the downstream processing container 111 when it is open, and does not allow the fluid to flow to the downstream processing container 111 when it is closed.

[0060] The filter F11 filters the fluid flowing in the first branch flow path L14 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate is processed using the fluid.

[0061] The temperature sensor T11 is provided at a position downstream of the confluence portion between the first branch flow path L14 and the second branch flow path L15. The temperature sensor T11 is provided, for example, immediately before the processing container 111. The temperature sensor T11 detects the temperature of the fluid flowing in the first branch flow path L14.

[0062] The line heater LH11 heats the first branch flow path L14 downstream of the heating mechanism HE11. The line heater LH11 suppresses a temperature drop of the fluid heated to the first temperature by the heating mechanism HE11 when flowing through the first branch flow path L14.

[0063] The heating mechanism HE12 heats the fluid supplied from the treatment fluid supply unit 121 to a second temperature, and supplies the fluid at the second temperature downstream. The second temperature is a temperature lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0064] The on-off valve V16 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V16 allows the fluid to flow to the downstream processing container 111 when it is open, and does not allow the fluid to flow to the downstream processing container 111 when it is closed.

[0065] The filter F12 filters the fluid flowing in the second branch flow path L15 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate is processed using the fluid.

[0066] The line heater LH12 heats the second branch flow path L15 downstream of the heating mechanism HE12. The line heater LH12 suppresses a temperature drop of the fluid heated to the second temperature by the heating mechanism HE12 when flowing in the second branch flow path L15.

[0067] In the temperature adjustment section 122, when the on-off valve V15 is closed and the on-off valve V16 is opened, the fluid heated to the second temperature by the heating mechanism HE12 is supplied to the processing container 111 through the second branch flow path L15. In addition, when the on-off valve V16 is closed and the on-off valve V15 is opened, the fluid heated to the second temperature by the heating mechanism HE12 and then heated to the first temperature by the heating mechanism HE11 is supplied to the processing container 111 through the first branch flow path L14. In this way, by exclusively opening and closing the on-off valve V15 and the on-off valve V16, the temperature of the fluid flowing into the processing container 111 can be changed. In addition, when both the on-off valve V15 and the on-off valve V16 are opened, the fluid heated to the first temperature by the heating mechanism HE11 and the fluid heated to the second temperature by the heating mechanism HE12 are mixed and supplied to the processing container 111. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied to the processing container 111. By controlling the opening and closing of the on-off valve V15 and the on-off valve V16 in this manner, the temperature of the fluid flowing into the processing container 111 can be changed in three stages.

[0068] The bypass flow path L16 connects the position between the on-off valve V15 and the filter F11 in the first branch flow path L14 with the position between the on-off valve V16 and the filter F12 in the second branch flow path L15. The bypass flow path L16 is provided with a throttle hole OR13. The bypass flow path L16 is provided with a pipeline heater LH13. The bypass flow path L16, the throttle hole OR13 and the pipeline heater LH13 may not be provided.

[0069] The orifice OR13 has a function of reducing the flow velocity of the fluid flowing through the bypass flow path L16 to adjust the pressure.

[0070] The line heater LH13 heats the bypass flow path L16.

[0071] The first discharge flow path L17 is used to discharge the fluid in the first branch flow path L14. The first discharge flow path L17 branches from the first branch flow path L14 at a position between the heating mechanism HE11 and the on-off valve V15. The on-off valve V14 is provided in the first discharge flow path L17. The line heater LH14 is provided in the first discharge flow path L17. A throttling hole may also be provided in the first discharge flow path L17.

[0072] The on-off valve V14 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V14 allows the fluid to flow to the downstream first discharge flow path L17 when it is open, and does not allow the fluid to flow to the downstream first discharge flow path L17 when it is closed.

[0073] The line heater LH14 heats the first discharge flow path L17.

[0074] The discharge section 13 has a discharge flow path L18. The discharge flow path L18 is connected to the processing container 111. In the discharge flow path L18, a pressure sensor P11, a back pressure valve BV11, and an on-off valve V17 are provided in order from the upstream. A line heater LH15 is provided in the discharge flow path L18. Sensors such as temperature sensors and pressure sensors may also be provided at various positions of the discharge flow path L18.

[0075] The pressure sensor P11 detects the pressure of the fluid flowing in the discharge flow path L18 at a position immediately after the processing container 111. Thus, the pressure inside the processing container 111 can be detected.

[0076] When the primary pressure of the discharge flow path L18 exceeds the set pressure, the back pressure valve BV11 adjusts the valve opening to allow the fluid to flow to the secondary side, thereby maintaining the primary pressure at the set pressure. For example, the set pressure of the back pressure valve BV11 is adjusted by the control unit 14 .

[0077] The on-off valve V17 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V17 allows the fluid to flow to the downstream discharge flow path L18 when it is open, and does not allow the fluid to flow to the downstream discharge flow path L18 when it is closed.

[0078] The line heater LH15 heats the discharge flow path L18.

[0079] The control unit 14 receives measurement signals from various sensors (temperature sensor T11, pressure sensor P11, etc.) and sends control signals to various functional elements. The control signals include, for example, opening and closing signals of the opening and closing valves V11 to V17, a set pressure signal of the back pressure valve BV11, and temperature signals of the line heaters LH11 to LH15. For example, the control unit 14 is configured to control the opening and closing of the opening and closing valves V11 and V12 according to the processing state of the substrate W in the processing container 111, thereby changing the flow rate of the fluid flowing into the processing container 111. For example, the control unit 14 is configured to control the opening and closing of the opening and closing valves V15 and V16 according to the processing state of the substrate W in the processing container 111, thereby changing the temperature of the fluid flowing into the processing container 111.

[0080] The control unit 14 is, for example, a computer, and includes a computing unit 141 and a storage unit 142. The storage unit 142 stores a program for controlling various processes performed in the substrate processing apparatus 10. The computing unit 141 controls the operation of the substrate processing apparatus 10 by reading out the program stored in the storage unit 142 and executing the program. The program may also be recorded in a storage medium readable by a computer and installed from the storage medium to the storage unit 142 of the control unit 14. Examples of storage media readable by a computer include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, and the like.

[0081] (Substrate processing method)

[0082] Reference Figures 2 to 9 The following will describe a substrate processing method performed using the substrate processing apparatus 10 . The substrate processing method described below is automatically performed under the control of the control unit 14 based on the processing recipe and control program stored in the storage unit 142 .

[0083] Figure 2 1 is a timing chart showing a substrate processing method according to the first embodiment. Figure 2 , the lower figure shows the opening and closing timings of the on-off valves V11, V12, V13, V14, V15, V16, and V17, and the upper figure shows the change in the detection value (pressure) of the pressure sensor P11 corresponding to the opening and closing timings.

[0084] Figures 3 to 9 1 is a diagram showing a substrate processing method according to a first embodiment. Figures 3 to 9 In the figure, the on-off valve in the open state is indicated by black, and the on-off valve in the closed state is indicated by hollow. Figures 3 to 9 In the figure, the flow path through which the fluid flows is indicated by a thick solid line.

[0085] <Waiting process>

[0086] In the standby process, an inert gas is supplied to the processing unit 11, the fluid supply system 12, and the exhaust unit 13. The inert gas may be, for example, N2 gas. Figure 3As shown, the opening and closing valves V13, V15, V16, and V17 are set to an open state, and the opening and closing valves V11, V12, and V14 are set to a closed state. Thus, the inert gas introduced from the inert gas supply source S12 into the first branch flow path L14 is heated to a first temperature by the heating mechanism HE11 and supplied to the processing container 111. In addition, the inert gas introduced from the inert gas supply source S12 into the second branch flow path L15 is heated to a second temperature by the heating mechanism HE12 and supplied to the processing container 111. Therefore, the first branch flow path L14 and the second branch flow path L15 are purged and heated by the inert gas, so that the processing temperature of the first substrate W after the standby process is substantially the same as the processing temperature of the second and subsequent substrates W. As a result, the deviation of the processing temperature between the substrates W can be suppressed. In the standby process, the inert gas is discharged from the processing container 111 via the exhaust flow path L18.

[0087] In the standby process, the substrate W is loaded into the processing container 111. Specifically, Figure 4 As shown in FIG. 1 , after the on-off valve V16 is set to an open state and the on-off valves V11, V12, V13, V14, V15, and V17 are set to a closed state, the substrate W is loaded into the processing container 111. That is, the substrate W is loaded into the processing container 111 without supplying an inert gas into the processing container 111. However, the substrate W may be loaded into the processing container 111 while supplying an inert gas into the processing container 111. The substrate W is cleaned and placed on the holding plate 112 in a state where the recessed portions of the pattern on the surface of the substrate W are filled with isopropyl alcohol (IPA).

[0088] <First Pressure Boosting Step>

[0089] After the standby process, the first pressure-increasing process is performed. In the first pressure-increasing process, the pressure in the processing container 111 is first increased by supplying the processing fluid at the first flow rate and the second temperature, and then the pressure in the processing container 111 is increased by supplying the processing fluid at the second flow rate and the second temperature. That is, in the first pressure-increasing process, the pressure is increased in two stages. The second flow rate may be a flow rate greater than the first flow rate.

[0090] In the pressure increase at the first flow rate, if Figure 5As shown, the on-off valves V11 and V16 are set to an open state, and the on-off valves V12, V13, V14, V15, and V17 are set to a closed state. Thus, the processing fluid of the processing fluid supply source S11 flows into the temperature adjustment part 122 via the first supply flow path L11, and is supplied to the processing container 111 via the second branch flow path L15. Therefore, the processing fluid of the first flow rate and the second temperature is supplied to the processing container 111. Thus, the temperature of the substrate W changes to the second temperature. In the pressure increase at the first flow rate, the on-off valve V17 is in a closed state, so the processing fluid does not flow out of the processing container 111. Therefore, the pressure in the processing container 111 gradually rises.

[0091] During the pressure increase at the first flow rate, the treated fluid whose flow velocity is reduced by the orifice OR13 flows from the second branch flow path L15 to the first branch flow path L14 via the bypass flow path L16. This prevents the treated fluid from flowing back from the confluence of the first branch flow path L14 and the second branch flow path L15 immediately before the treatment container 111 toward the upstream of the first branch flow path L14. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F11.

[0092] During the pressure increase at the first flow rate, the pressure in the processing container 111 is detected by the pressure sensor P11, and the pressure increase at the first flow rate is continued until the pressure in the processing container 111 reaches the first pressure Y1. When the pressure in the processing container 111 reaches the first pressure Y1, the pressure increase at the first flow rate is terminated, and the pressure increase is switched to the second flow rate.

[0093] In the pressure increase at the second flow rate, if Figure 6 As shown in Figure 1, the on-off valve V12 is set to the open state. The states of the other on-off valves are the same as Figure 5 The state shown in FIG. 1 is the same as that shown in FIG. 1 . Thus, the processing fluid of the processing fluid supply source S11 flows into the temperature adjustment unit 122 through the second supply flow path L12 in addition to the first supply flow path L11, and is supplied to the processing container 111 through the second branch flow path L15. Therefore, the flow rate of the processing fluid supplied to the processing container 111 increases to the second flow rate. During the pressure increase at the second flow rate, the on-off valve V17 is in a closed state, so the processing fluid does not flow out of the processing container 111. Therefore, the pressure in the processing container 111 gradually increases.

[0094] During the pressure increase at the second flow rate, the pressure of the treatment fluid supplied to the treatment container 111 is lower than the critical pressure. Therefore, the treatment fluid is supplied to the treatment container 111 in a gas state. Thereafter, as the filling of the treatment fluid into the treatment container 111 progresses, the pressure in the treatment container 111 gradually increases, and when the pressure in the treatment container 111 exceeds the critical pressure, the treatment fluid in the treatment container 111 becomes a supercritical state.

[0095] During the period of increasing the pressure at the second flow rate, the treated fluid whose flow velocity is reduced by the orifice OR13 flows from the second branch flow path L15 to the first branch flow path L14 via the bypass flow path L16. Thus, the treated fluid is prevented from flowing back toward the upstream of the first branch flow path L14 from the confluence of the first branch flow path L14 and the second branch flow path L15 immediately before the treatment container 111. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F11.

[0096] During the pressure increase at the second flow rate, the pressure in the processing container 111 is detected by the pressure sensor P11, and the pressure increase at the second flow rate is continued until the pressure in the processing container 111 reaches the second pressure Y2. When the pressure in the processing container 111 reaches the second pressure Y2, the first pressure increase step is terminated and the process proceeds to the second pressure increase step.

[0097] <Second Pressure Boosting Step>

[0098] After the first pressure increasing step, a second pressure increasing step is performed. In the second pressure increasing step, the pressure in the processing container 111 is increased by supplying the processing fluid at the second flow rate and the first temperature. Specifically, Figure 7 As shown, the on-off valves V11, V12, and V15 are set to an open state, and the on-off valves V13, V14, V16, and V17 are set to a closed state. As a result, the processing fluid of the processing fluid supply source S11 flows into the temperature adjustment unit 122 via the first supply flow path L11 and the second supply flow path L12, and is supplied to the processing container 111 via the first branch flow path L14. Therefore, the processing fluid at the second flow rate and the first temperature is supplied to the processing container 111. As a result, the temperature of the substrate W is rapidly changed to the first temperature.

[0099] In the second pressure-increasing step, the treated fluid whose flow rate is reduced by the orifice OR13 flows from the first branch flow path L14 to the second branch flow path L15 via the bypass flow path L16. Thus, the treated fluid is prevented from flowing back from the confluence of the first branch flow path L14 and the second branch flow path L15 immediately before the treatment container 111 toward the upstream of the second branch flow path L15. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F12.

[0100] During the second pressure increasing step, the pressure in the processing container 111 is detected by the pressure sensor P11, and the second pressure increasing step is continued until the pressure in the processing container 111 reaches the third pressure Y3. When the pressure in the processing container 111 reaches the third pressure Y3, the second pressure increasing step is terminated and the flow step is started.

[0101] <Distribution Process>

[0102] After the second pressure increasing step, a circulation step is performed. In the circulation step, a processing fluid having a second flow rate and a first temperature is supplied from the processing fluid supply source S11 into the processing container 111, and the IPA is replaced by the processing fluid in the concave portion of the pattern on the substrate W in the processing container 111. Specifically, Figure 8 As shown, the on-off valves V11, V12, V15, and V17 are set to an open state, and the on-off valves V13, V14, and V16 are set to a closed state. As a result, the processing fluid of the processing fluid supply source S11 flows into the temperature adjustment unit 122 via the first supply flow path L11 and the second supply flow path L12, and is supplied to the processing container 111 via the first branch flow path L14. The processing fluid supplied to the processing container 111 is discharged from the processing container 111 via the discharge flow path L18. By performing the circulation process, the replacement of the IPA with the processing fluid in the concave portion of the pattern of the substrate W is promoted.

[0103] In the circulation process, the treated fluid whose flow velocity is reduced by the orifice OR13 flows from the first branch flow path L14 to the second branch flow path L15 via the bypass flow path L16. Thus, the treated fluid is prevented from flowing back from the confluence of the first branch flow path L14 and the second branch flow path L15 immediately before the treatment container 111 toward the upstream of the second branch flow path L15. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F12.

[0104] When the replacement of the IPA with the processing fluid is completed in the concave portion of the pattern, the circulation step is ended and the process proceeds to the decompression step.

[0105] <Decompression process>

[0106] After the circulation process, a decompression process is performed. In the decompression process, the processing fluid is discharged from the processing container 111. Specifically, Fig. 9 As shown, the on-off valves V14 and V17 are set to an open state, and the on-off valves V11, V12, V13, V15, and V16 are set to a closed state. When the pressure in the processing container 111 becomes lower than the critical pressure of the processing fluid through the decompression process, the processing fluid in a supercritical state is vaporized and separated from the concave portion of the pattern. Thus, the drying process for a substrate W is completed.

[0107] After the decompression process, the process proceeds to the standby process. For example, after the process proceeds to the standby process, the processed substrate W is carried out from the processing container 111. Specifically, after the decompression process, the inert gas is supplied to the processing container 111 via the first branch flow path L14 and the second branch flow path L15. Next, the substrate W is carried out from the processing container 111 while the inert gas is supplied to the processing container 111. The inert gas is continuously supplied to the processing container 111 even after the substrate W is carried out from the processing container 111. In this way, when the substrate W is carried out from the processing container 111 while the inert gas is supplied to the processing container 111, the processing container 111 becomes positively pressurized, and therefore, when the processing container 111 is opened, an airflow from the inside of the processing container 111 to the outside is formed. Therefore, the residue in the processing container 111 can be discharged to the outside of the processing container 111 to be removed. However, when the substrate W is unloaded from the processing container 111 , the supply of the inert gas into the processing container 111 may be stopped.

[0108] According to the first embodiment described above, the fluid supply system 12 has a processing fluid supply unit 121 and a temperature adjustment unit 122. The processing fluid supply unit 121 has a flow adjustment mechanism (opening and closing valves V11, V12, orifices OR11, OR12) for adjusting the flow rate of the processing fluid. The temperature adjustment unit 122 has a first branch flow path L14 for allowing a processing fluid at a first temperature to flow into the processing container 111, and a second branch flow path L15 for allowing a processing fluid at a second temperature to flow into the processing container 111. Thus, the flow rate and temperature of the processing fluid supplied to the processing container 111 can be controlled separately and independently, so that the processing fluid with controlled flow rate and temperature can be supplied to the processing container 111. As a result, the process margin in the substrate processing method performed using the substrate processing device 10 can be expanded.

[0109] In addition, according to the first embodiment, a temperature adjustment unit 122 (heating mechanisms HE11, HE12) is provided at a position downstream of the confluence of the first supply flow path L11 and the second supply flow path L12 and the third supply flow path L13. In this case, the inert gas of the inert gas supply source S12 is heated to a first temperature by the heating mechanism HE11 and then circulates in the first branch flow path L14. Therefore, in the first branch flow path L14 downstream of the heating mechanism HE11, the temperature uniformity along the flow direction of the fluid is improved. In contrast, in the case of allowing the inert gas of normal temperature to flow in the first branch flow path L14, even if the first branch flow path L14 is heated by the pipeline heater LH11, a temperature distribution along the flow direction of the fluid is easily generated in the first branch flow path L14.

[0110] In addition, the inert gas from the inert gas supply source S12 is heated to the second temperature by the heating mechanism HE12 and then circulates in the second branch flow path L15. Therefore, in the second branch flow path L15 downstream of the heating mechanism HE12, the temperature uniformity along the flow direction of the fluid is improved. In contrast, when the inert gas at a normal temperature flows in the second branch flow path L15, even if the second branch flow path L15 is heated by the line heater LH12, a temperature distribution along the flow direction of the fluid is easily generated in the second branch flow path L15.

[0111] In addition, according to the first embodiment, a large flow rate of heated inert gas is supplied to the processing container 111 via the first branch flow path L14 and the second branch flow path L15, thereby promoting the drying of the IPA remaining in the first branch flow path L14, the second branch flow path L15 and the processing container 111.

[0112] In addition, according to the first embodiment, in the standby process before the process fluid of the process fluid supply source S11 is supplied into the process container 111 through the first branch flow path L14 and the second branch flow path L15, the heated inert gas is circulated in the first branch flow path L14 and the second branch flow path L15. In this case, the first branch flow path L14 and the second branch flow path L15 are heated by the inert gas, so that the process temperature of the first substrate W processed after the standby process is substantially the same as the process temperature of the second and subsequent substrates W. As a result, the deviation of the process temperature between the substrates W can be suppressed.

[0113] [Second embodiment]

[0114] (Substrate processing equipment)

[0115] Reference Fig.10 A substrate processing apparatus 20 according to the second embodiment will be described. Fig.10 It is a diagram showing a substrate processing apparatus 20 according to the second embodiment.

[0116] The substrate processing apparatus 20 includes a processing unit 21 , a fluid supply system 22 , a discharge unit 23 , and a control unit 24 .

[0117] The processing unit 21 may be the same as the processing unit 11. The processing unit 21 includes a processing container 211 and a holding plate 212.

[0118] The fluid supply system 22 includes a processing fluid supply unit 221 and a temperature adjustment unit 222 .

[0119] The processing fluid supply unit 221 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 221 includes a processing fluid supply source S21, a first supply flow path L21, an on-off valve V21, an orifice OR21, a second supply flow path L22, an on-off valve V22, an orifice OR22, an inert gas supply source S22, a third supply flow path L23, and an on-off valve V23.

[0120] The temperature adjustment unit 222 is connected to the processing fluid supply unit 221 and the processing container 211. The temperature adjustment unit 222 allows the fluid whose temperature is adjusted to flow into the interior of the processing container 211. The fluid includes the processing fluid and the inert gas. The temperature adjustment unit 222 has a first branch flow path L24, a second branch flow path L25, a bypass flow path L26, a first exhaust flow path L27, and a second exhaust flow path L28.

[0121] In the first branch flow path L24, a heating mechanism HE21, an on-off valve V25, a filter F21, and a temperature sensor T21 are provided in order from the upstream. A line heater LH21 is provided at a position downstream of the heating mechanism HE21 in the first branch flow path L24. Sensors such as temperature sensors and pressure sensors may also be provided at various positions in the first branch flow path L24.

[0122] In the second branch flow path L25, an on-off valve V24, a heating mechanism HE22, an on-off valve V26, and a filter F22 are sequentially provided from upstream. A pipeline heater LH22 is provided downstream of the heating mechanism HE22 in the second branch flow path L25. Sensors such as temperature sensors and pressure sensors may also be provided at various positions in the second branch flow path L25.

[0123] The second branch flow path L25 branches from the first branch flow path L24 between the processing fluid supply unit 221 and the heating mechanism HE21. The second branch flow path L25 merges with the first branch flow path L24 at a position immediately before the processing container 211.

[0124] The heating mechanism HE21 is provided in parallel with the heating mechanism HE22. The heating mechanism HE21 heats the fluid supplied from the treatment fluid supply unit 221 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

[0125] The on-off valve V25 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V25 allows the fluid to flow to the downstream processing container 211 when it is open, and does not allow the fluid to flow to the downstream processing container 211 when it is closed.

[0126] The filter F21 filters the fluid flowing in the first branch flow path L24 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0127] The temperature sensor T21 is disposed downstream of the confluence portion between the first branch flow path L24 and the second branch flow path L25. The temperature sensor T21 is disposed, for example, immediately before the processing container 211. The temperature sensor T21 detects the temperature of the fluid flowing in the first branch flow path L24.

[0128] The line heater LH21 heats the first branch flow path L24 downstream of the heating mechanism HE21. The line heater LH21 suppresses a temperature drop of the fluid heated to the first temperature by the heating mechanism HE21 when flowing in the first branch flow path L24.

[0129] The on-off valve V24 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V24 allows the fluid to flow to the downstream heating mechanism HE22 when it is open, and does not allow the fluid to flow to the downstream heating mechanism HE22 when it is closed.

[0130] The heating mechanism HE22 heats the fluid supplied from the treatment fluid supply unit 221 to a second temperature, and supplies the fluid at the second temperature downstream. The second temperature is a temperature lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0131] The on-off valve V26 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V26 allows the fluid to flow to the downstream processing container 211 when it is open, and does not allow the fluid to flow to the downstream processing container 211 when it is closed.

[0132] The filter F22 filters the fluid flowing in the second branch flow path L25 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0133] The line heater LH22 heats the second branch flow path L25 downstream of the heating mechanism HE22. The line heater LH22 suppresses a temperature drop of the fluid heated to the second temperature by the heating mechanism HE22 when flowing in the second branch flow path L25.

[0134] In the temperature adjustment section 222, when the on-off valve V25 is closed and the on-off valve V26 is opened, the fluid heated to the second temperature by the heating mechanism HE22 is supplied to the processing container 211 through the second branch flow path L25. In addition, when the on-off valve V26 is closed and the on-off valve V25 is opened, the fluid heated to the first temperature by the heating mechanism HE21 is supplied to the processing container 211 through the first branch flow path L24. In this way, by exclusively opening and closing the on-off valve V25 and the on-off valve V26, the temperature of the fluid flowing into the processing container 211 can be changed. In addition, when both the on-off valve V25 and the on-off valve V26 are opened, the fluid heated to the first temperature by the heating mechanism HE21 and the fluid heated to the second temperature by the heating mechanism HE22 are mixed and supplied to the processing container 211. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied to the processing container 211. By controlling the opening and closing of the on-off valve V25 and the on-off valve V26 in this manner, the temperature of the fluid flowing into the processing container 211 can be changed in three stages.

[0135] The bypass flow path L26 connects the position between the on-off valve V25 and the filter F21 in the first branch flow path L24 with the position between the on-off valve V26 and the filter F22 in the second branch flow path L25. The bypass flow path L26 is provided with a throttle hole OR23. The bypass flow path L26 is provided with a pipeline heater LH23. The bypass flow path L26, the throttle hole OR23 and the pipeline heater LH23 may not be provided.

[0136] The orifice OR23 has a function of reducing the flow rate of the fluid flowing through the bypass flow path L26 to adjust the pressure.

[0137] The line heater LH23 heats the bypass flow path L26.

[0138] The first discharge flow path L27 is used to discharge the fluid in the first branch flow path L24. The first discharge flow path L27 branches from the first branch flow path L24 at a position between the heating mechanism HE21 and the on-off valve V25. The on-off valve V27 is provided in the first discharge flow path L27. The line heater LH24 is provided in the first discharge flow path L27. A throttling hole may also be provided in the first discharge flow path L27.

[0139] The on-off valve V27 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V27 allows the fluid to flow to the downstream first discharge flow path L27 when it is open, and does not allow the fluid to flow to the downstream first discharge flow path L27 when it is closed.

[0140] The line heater LH24 heats the first discharge flow path L27.

[0141] The second discharge flow path L28 is used to discharge the fluid in the second branch flow path L25. The second discharge flow path L28 branches from the second branch flow path L25 at a position between the heating mechanism HE22 and the on-off valve V26. The on-off valve V28 is provided in the second discharge flow path L28. The pipeline heater LH25 is provided in the second discharge flow path L28. A throttling hole may also be provided in the second discharge flow path L28.

[0142] The on-off valve V28 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V28 allows the fluid to flow to the downstream second discharge flow path L28 when it is open, and does not allow the fluid to flow to the downstream second discharge flow path L28 when it is closed.

[0143] The line heater LH25 heats the second discharge flow path L28.

[0144] The discharge section 23 has a discharge flow path L29. The discharge flow path L29 is connected to the processing container 211. In the discharge flow path L29, a pressure sensor P21, a back pressure valve BV21, and an on-off valve V29 are provided in order from the upstream. A pipeline heater LH26 is provided in the discharge flow path L29. Sensors such as temperature sensors and pressure sensors may also be provided at various positions of the discharge flow path L29.

[0145] The pressure sensor P21 detects the pressure of the fluid flowing in the discharge flow path L29 at a position immediately after the processing container 211. Thus, the pressure inside the processing container 211 can be detected.

[0146] When the primary pressure of the discharge flow path L29 exceeds the set pressure, the back pressure valve BV21 adjusts the valve opening to allow the fluid to flow to the secondary side, thereby maintaining the primary pressure at the set pressure. For example, the set pressure of the back pressure valve BV21 is adjusted by the control unit 24 .

[0147] The on-off valve V29 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V29 allows the fluid to flow to the downstream discharge flow path L29 when it is open, and does not allow the fluid to flow to the downstream discharge flow path L29 when it is closed.

[0148] The line heater LH26 heats the discharge flow path L29.

[0149] The control unit 24 receives measurement signals from various sensors (temperature sensor T21, pressure sensor P21, etc.) and sends control signals to various functional elements. The control signals include, for example, opening and closing signals of the opening and closing valves V21 to V29, a set pressure signal of the back pressure valve BV21, and temperature signals of the line heaters LH21 to LH26. For example, the control unit 24 is configured to control the opening and closing of the opening and closing valves V21 and V22 according to the processing state of the substrate W in the processing container 211, thereby changing the flow rate of the fluid flowing into the processing container 211. For example, the control unit 24 is configured to control the opening and closing of the opening and closing valves V25 and V26 according to the processing state of the substrate W in the processing container 211, thereby changing the temperature of the fluid flowing into the processing container 211.

[0150] The control unit 24 is, for example, a computer, and includes a computing unit 241 and a storage unit 242. The storage unit 242 stores a program for controlling various processes performed in the substrate processing apparatus 20. The computing unit 241 controls the operation of the substrate processing apparatus 20 by reading out the program stored in the storage unit 242 and executing the program. The program may also be recorded in a storage medium readable by a computer and installed from the storage medium to the storage unit 242 of the control unit 24. Examples of storage media readable by a computer include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, and the like.

[0151] (Substrate processing method)

[0152] Reference Figures 11 to 18 The following will describe a substrate processing method performed using the substrate processing apparatus 20. The substrate processing method described below is automatically performed under the control of the control unit 24 based on the processing recipe and control program stored in the storage unit 242.

[0153] Fig.11 2 is a timing chart showing a substrate processing method according to the second embodiment. Fig.11 In the figure, the lower figure shows the opening and closing timing of the opening and closing valves V21, V22, V23, V24, V25, V26, V27, V28, and V29, and the upper figure shows the change in the detection value (pressure) of the pressure sensor P21 corresponding to the opening and closing timing.

[0154] Figures 12 to 18 2 is a diagram showing a substrate processing method according to a second embodiment. Figures 12 to 18 In the figure, the on-off valve in the open state is indicated by black, and the on-off valve in the closed state is indicated by hollow. Figures 12 to 18 In the figure, the flow path through which the fluid flows is indicated by a thick solid line.

[0155] <Waiting process>

[0156] In the standby process, an inert gas is supplied to the processing unit 21, the fluid supply system 22, and the exhaust unit 23. The inert gas may be, for example, N2 gas. Fig.12 As shown, the opening and closing valves V23, V24, V25, V26, and V29 are set to an open state, and the opening and closing valves V21, V22, V27, and V28 are set to a closed state. Thus, the inert gas introduced from the inert gas supply source S22 into the first branch flow path L24 is heated to a first temperature by the heating mechanism HE21 and supplied to the processing container 211. In addition, the inert gas introduced from the inert gas supply source S22 into the second branch flow path L25 is heated to a second temperature by the heating mechanism HE22 and supplied to the processing container 211. Therefore, the first branch flow path L24 and the second branch flow path L25 are purged and heated by the inert gas, so that the processing temperature of the first substrate W after the standby process is substantially the same as the processing temperature of the second and subsequent substrates W. As a result, the deviation of the processing temperature between the substrates W can be suppressed. In the standby process, the inert gas is discharged from the processing container 211 via the exhaust flow path L29.

[0157] In the standby process, the substrate W is loaded into the processing container 211. Specifically, Fig.13 As shown in FIG. 2 , after the on-off valves V24 and V26 are opened and the on-off valves V21, V22, V23, V25, V27, V28, and V29 are closed, the substrate W is loaded into the processing container 211. That is, the substrate W is loaded into the processing container 211 without supplying the inert gas into the processing container 211. However, the substrate W may be loaded into the processing container 211 while supplying the inert gas into the processing container 211. The substrate W is cleaned and placed on the holding plate 212 in a state where the recessed portions of the pattern on the surface of the substrate W are filled with IPA.

[0158] <First Pressure Boosting Step>

[0159] After the standby process, the first pressure-increasing process is performed. In the first pressure-increasing process, the pressure in the processing container 211 is first increased by supplying the processing fluid at the first flow rate and the second temperature, and then the pressure in the processing container 211 is increased by supplying the processing fluid at the second flow rate and the second temperature. That is, in the first pressure-increasing process, the pressure is increased in two stages. The second flow rate may be a flow rate greater than the first flow rate.

[0160] In the pressure increase at the first flow rate, if Fig.14As shown, the on-off valves V21, V24, and V26 are set to an open state, and the on-off valves V22, V23, V25, V27, V28, and V29 are set to a closed state. Thus, the processing fluid of the processing fluid supply source S21 flows into the temperature adjustment part 222 via the first supply flow path L21, and is supplied to the processing container 211 via the second branch flow path L25. Therefore, the processing fluid of the first flow rate and the second temperature is supplied to the processing container 211. Thus, the temperature of the substrate W changes to the second temperature. In the pressure increase at the first flow rate, the on-off valve V29 is in a closed state, so the processing fluid does not flow out of the processing container 211. Therefore, the pressure in the processing container 211 gradually rises.

[0161] During the pressure increase at the first flow rate, the treated fluid whose flow rate is reduced by the orifice OR23 flows from the second branch flow path L25 to the first branch flow path L24 via the bypass flow path L26. This prevents the treated fluid from flowing back from the confluence of the first branch flow path L24 and the second branch flow path L25 immediately before the treatment container 211 toward the upstream of the first branch flow path L24. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F21.

[0162] During the pressure increase at the first flow rate, the pressure in the processing container 211 is detected by the pressure sensor P21, and the pressure increase at the first flow rate is continued until the pressure in the processing container 211 reaches the first pressure Y1. When the pressure in the processing container 211 reaches the first pressure Y1, the pressure increase at the first flow rate is terminated, and the pressure increase at the second flow rate is switched.

[0163] In the pressure increase at the second flow rate, if Fig.15 As shown, the on-off valve V22 is set to the open state. The states of other on-off valves are the same as Fig.14 The state shown in FIG. 2 is the same. Thus, the processing fluid of the processing fluid supply source S21 flows into the temperature adjustment section 222 via the second supply flow path L22 in addition to the first supply flow path L21, and is supplied to the processing container 211 via the second branch flow path L25. Therefore, the flow rate of the processing fluid supplied to the processing container 211 rises to the second flow rate. During the pressure increase at the second flow rate, the on-off valve V29 is in a closed state, so the processing fluid does not flow out of the processing container 211. Therefore, the pressure in the processing container 211 gradually rises.

[0164] During the pressure increase at the second flow rate, the pressure of the treatment fluid supplied to the treatment container 211 is lower than the critical pressure. Therefore, the treatment fluid is supplied to the treatment container 211 in a gas state. Thereafter, as the filling of the treatment fluid into the treatment container 211 progresses, the pressure in the treatment container 211 gradually increases, and when the pressure in the treatment container 211 exceeds the critical pressure, the treatment fluid in the treatment container 211 becomes a supercritical state.

[0165] During the period of increasing the pressure at the second flow rate, the treated fluid whose flow rate is reduced by the orifice OR23 flows from the second branch flow path L25 to the first branch flow path L24 via the bypass flow path L26. Thus, the treated fluid is prevented from flowing back toward the upstream of the first branch flow path L24 from the confluence of the first branch flow path L24 and the second branch flow path L25 immediately before the treatment container 211. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F21.

[0166] During the pressure increase at the second flow rate, the pressure in the processing container 211 is detected by the pressure sensor P21, and the pressure increase at the second flow rate is continued until the pressure in the processing container 211 reaches the second pressure Y2. When the pressure in the processing container 211 reaches the second pressure Y2, the first pressure increase step is terminated and the process proceeds to the second pressure increase step.

[0167] <Second Pressure Boosting Step>

[0168] After the first pressure increasing step, a second pressure increasing step is performed. In the second pressure increasing step, the pressure in the processing container 211 is increased by supplying the processing fluid at the second flow rate and the first temperature. Specifically, Fig.16 As shown, the on-off valves V21, V22, V25, and V28 are set to an open state, and the on-off valves V23, V24, V26, V27, and V29 are set to a closed state. As a result, the processing fluid of the processing fluid supply source S21 flows into the temperature adjustment unit 222 via the first supply flow path L21 and the second supply flow path L22, and is supplied to the processing container 211 via the first branch flow path L24. Therefore, the processing fluid of the second flow rate and the first temperature is supplied to the processing container 211. As a result, the temperature of the substrate W is rapidly changed to the first temperature.

[0169] In the second pressure-increasing step, the treated fluid whose flow velocity is reduced by the orifice OR23 flows from the first branch flow path L24 to the second branch flow path L25 via the bypass flow path L26. Thus, the treated fluid is prevented from flowing back toward the upstream of the second branch flow path L25 from the confluence of the first branch flow path L24 and the second branch flow path L25 immediately before the treatment container 211. Therefore, it is possible to prevent the residue of IPA and the like from contaminating the downstream of the filter F22.

[0170] In the second pressure-increasing process, the processing fluid in the second branch flow path L25 is discharged, so that the second branch flow path L25 is depressurized. Since the heat storage capacity of the heating mechanism HE22 set to the second temperature lower than the first temperature is small, when the second branch flow path L25 is depressurized, the temperature of the heating mechanism HE22 drops significantly due to the pressure drop, and it takes time for the temperature of the heating mechanism HE22 to return to the second temperature. Therefore, in the second pressure-increasing process, while the processing fluid is circulated in the first branch flow path L24, the on-off valves V24 and V26 are set to the closed state and the on-off valve V28 is set to the open state, thereby depressurizing the second branch flow path L25 and restoring the temperature of the heating mechanism HE22 to the second temperature. In this way, since the second exhaust flow path L28 and the on-off valve V28 are provided, the preparation of the heating mechanism HE2 for the next substrate W can be implemented in parallel with the processing of the substrate W in the processing container 211.

[0171] During the second pressure increasing step, the pressure in the processing container 211 is detected by the pressure sensor P21, and the second pressure increasing step is continued until the pressure in the processing container 211 reaches the third pressure Y3. When the pressure in the processing container 211 reaches the third pressure Y3, the second pressure increasing step is terminated and the flow step is started.

[0172] <Distribution Process>

[0173] After the second pressure increasing step, a circulation step is performed. In the circulation step, a processing fluid having a second flow rate and a first temperature is supplied from the processing fluid supply source S21 to the processing container 211, and the IPA is replaced by the processing fluid in the concave portion of the pattern on the substrate W in the processing container 211. Specifically, Fig.17 As shown, the on-off valves V21, V22, V25, V28, and V29 are set to an open state, and the on-off valves V23, V24, V26, and V27 are set to a closed state. Thus, the processing fluid of the processing fluid supply source S21 flows into the temperature adjustment unit 222 via the first supply flow path L21 and the second supply flow path L22, and is supplied to the processing container 211 via the first branch flow path L24. The processing fluid supplied to the processing container 211 is discharged from the processing container 211 via the discharge flow path L29. By performing the circulation process, the replacement of the IPA with the processing fluid in the concave portion of the pattern of the substrate W is promoted.

[0174] In the circulation process, the treated fluid whose flow rate is reduced by the orifice OR23 flows from the first branch flow path L24 to the second branch flow path L25 via the bypass flow path L26. Thus, the treated fluid is prevented from flowing back from the confluence of the first branch flow path L24 and the second branch flow path L25 immediately before the processing container 211 toward the upstream of the second branch flow path L25. Therefore, it is possible to prevent the residue of IPA from contaminating the downstream of the filter F22. The pressure reduction in the second branch flow path L25 is also continuously performed in the circulation process.

[0175] When the replacement of the IPA with the processing fluid is completed in the concave portion of the pattern, the circulation step is ended and the process proceeds to the decompression step.

[0176] <Decompression process>

[0177] After the circulation process, a decompression process is performed. In the decompression process, the processing fluid is discharged from the processing container 211. Specifically, Fig.18 As shown, the on-off valves V27, V28, and V29 are set to an open state, and the on-off valves V21, V22, V23, V24, V25, and V26 are set to a closed state. When the pressure in the processing container 211 becomes lower than the critical pressure of the processing fluid through the decompression process, the processing fluid in a supercritical state is vaporized and separated from the concave portion of the pattern. Thus, the drying process for a substrate W is completed.

[0178] In the decompression process, the treated fluid in the first branch flow path L24 is discharged through the first discharge flow path L27, and the treated fluid in the second branch flow path L25 is discharged through the second discharge flow path L28. That is, the treated fluid in the first branch flow path L24 and the treated fluid in the second branch flow path L25 are discharged from different discharge flow paths. Thus, the treated fluid at the first temperature is prevented from mixing with the treated fluid at the second temperature.

[0179] After the decompression process, the process proceeds to the standby process. For example, after the process proceeds to the standby process, the processed substrate W is carried out from the processing container 211. Specifically, after the decompression process, the inert gas is supplied to the processing container 211 via the first branch flow path L24 and the second branch flow path L25. Next, the substrate W is carried out from the processing container 211 while the inert gas is supplied to the processing container 211. The inert gas is continuously supplied to the processing container 211 even after the substrate W is carried out from the processing container 211. In this way, when the substrate W is carried out from the processing container 211 while the inert gas is supplied to the processing container 211, the processing container 211 becomes positively pressurized, so when the processing container 211 is opened, an airflow from the inside of the processing container 211 to the outside is formed. Therefore, the residue in the processing container 211 can be discharged to the outside of the processing container 211 to be removed. However, when the substrate W is unloaded from the processing container 211 , the supply of the inert gas into the processing container 211 may be stopped.

[0180] According to the second embodiment described above, the fluid supply system 22 has a processing fluid supply unit 221 and a temperature adjustment unit 222. The processing fluid supply unit 221 has a flow adjustment mechanism (opening and closing valves V21, V22, orifices OR21, OR22) for adjusting the flow rate of the processing fluid. The temperature adjustment unit 222 has a first branch flow path L24 for allowing the processing fluid of the first temperature to flow into the processing container 211, and a second branch flow path L25 for allowing the processing fluid of the second temperature to flow into the processing container 211. Thus, the flow rate and temperature of the processing fluid supplied to the processing container 211 can be controlled separately and independently, so that the processing fluid with controlled flow rate and temperature can be supplied to the processing container 211. As a result, the process margin in the substrate processing method performed using the substrate processing device 10 can be expanded.

[0181] In addition, according to the second embodiment, a temperature adjustment unit 222 (heating mechanisms HE21, HE22) is provided at a position downstream of the confluence of the first supply flow path L21 and the second supply flow path L22 and the third supply flow path L23. In this case, the inert gas of the inert gas supply source S22 is heated to a first temperature by the heating mechanism HE21 and then circulates in the first branch flow path L24. Therefore, in the first branch flow path L24 downstream of the heating mechanism HE21, the temperature uniformity along the flow direction of the fluid is improved. In contrast, in the case of allowing the inert gas of normal temperature to flow in the first branch flow path L24, even if the first branch flow path L24 is heated by the pipeline heater LH21, a temperature distribution along the flow direction of the fluid is easily generated in the first branch flow path L24.

[0182] In addition, the inert gas of the inert gas supply source S22 is heated to the second temperature by the heating mechanism HE22 and then circulates in the second branch flow path L25. Therefore, in the second branch flow path L25 downstream of the heating mechanism HE22, the temperature uniformity along the flow direction of the fluid is improved. In contrast, when the inert gas of normal temperature flows in the second branch flow path L25, even if the second branch flow path L25 is heated by the line heater LH22, a temperature distribution along the flow direction of the fluid is easily generated in the second branch flow path L25.

[0183] In addition, according to the second embodiment, a large flow rate of heated inert gas is supplied to the processing container 211 via the first branch flow path L24 and the second branch flow path L25, thereby promoting the drying of the IPA remaining in the first branch flow path L24, the second branch flow path L25 and the processing container 211.

[0184] In addition, according to the second embodiment, in the standby process before the process fluid of the process fluid supply source S21 is supplied into the process container 211 through the first branch flow path L24 and the second branch flow path L25, the heated inert gas is circulated through the first branch flow path L24 and the second branch flow path L25. In this case, the first branch flow path L24 and the second branch flow path L25 are heated by the inert gas, so that the process temperature of the first substrate W processed after the standby process is substantially the same as the process temperature of the second and subsequent substrates W. As a result, the deviation of the process temperature between the substrates W can be suppressed.

[0185] [First Modification of Second Embodiment]

[0186] Reference Fig.19 A substrate processing apparatus 20A according to a first modified example of the second embodiment will be described. Fig.19 It is a diagram showing a substrate processing apparatus 20A according to a first modified example of the second embodiment.

[0187] The difference between the substrate processing apparatus 20A and the substrate processing apparatus 20 is that the heating mechanism HE21 and the heating mechanism HE22 are respectively connected to the processing fluid supply part, and the substrate processing apparatus 20A does not have the bypass flow path L26. The other structures of the substrate processing apparatus 20A can be the same as those of the substrate processing apparatus 20. The following mainly describes the differences from the substrate processing apparatus 20.

[0188] The substrate processing apparatus 20A includes a processing unit 21 , a fluid supply system 22A, a discharge unit 23 , and a control unit 24 .

[0189] The fluid supply system 22A includes a processing fluid supply unit 221A, a processing fluid supply unit 221B, and a temperature adjustment unit 222A.

[0190] The processing fluid supply unit 221A includes a processing fluid supply source S21A, a first supply channel L21A, an opening and closing valve V21A, a throttle hole OR21A, an inactive gas supply source S22A, a third supply channel L23A, and an opening and closing valve V23A. The processing fluid supply source S21A, the first supply channel L21A, the opening and closing valve V21A, the throttle hole OR21A, the inactive gas supply source S22A, the third supply channel L23A, and the opening and closing valve V23A may be the same as the processing fluid supply source S21, the first supply channel L21, the opening and closing valve V21, the throttle hole OR21, the inactive gas supply source S22, the third supply channel L23, and the opening and closing valve V23, respectively.

[0191] The processing fluid supply part 221B has a processing fluid supply source S21B, a first supply flow path L21B, an opening and closing valve V21B, a throttle hole OR21B, a second supply flow path L22B, an opening and closing valve V22B, a throttle hole OR22B, an inactive gas supply source S22B, a third supply flow path L23B and an opening and closing valve V23B. The processing fluid supply source S21B, the first supply flow path L21B, the opening and closing valve V21B, the throttling hole OR21B, the second supply flow path L22B, the opening and closing valve V22B, the throttling hole OR22B, the inert gas supply source S22B, the third supply flow path L23B and the opening and closing valve V23B can be respectively the same as the processing fluid supply source S21, the first supply flow path L21, the opening and closing valve V21, the throttling hole OR21, the second supply flow path L22, the opening and closing valve V22, the throttling hole OR22, the inert gas supply source S22, the third supply flow path L23 and the opening and closing valve V23.

[0192] The temperature adjustment unit 222A is different from the temperature adjustment unit 222 in that the heating mechanism HE21 is connected to the processing fluid supply unit 221A, and the heating mechanism HE22 is connected to the processing fluid supply unit 221B.

[0193] In the substrate processing device 20A, by controlling the opening and closing of the on-off valves V21A, V23A, V21B, V22B, and V23B, switching is performed between the processing fluid supply parts 221A and 221B that supply fluid to the temperature adjustment part 222A. For example, when the on-off valve V21A is opened, the processing fluid is supplied from the processing fluid supply part 221A to the first branch flow path L24. For example, when the on-off valve V23A is opened, an inactive gas is supplied from the processing fluid supply part 221A to the first branch flow path L24. For example, when at least one of the on-off valve V21B and the on-off valve V22B is opened, the processing fluid is supplied from the processing fluid supply part 221B to the second branch flow path L25. For example, when the on-off valve V23B is opened, an inactive gas is supplied from the processing fluid supply part 221B to the second branch flow path L25. In the substrate processing apparatus 20A, for example, the processing fluid supplying parts 221A and 221B that supply the fluid to the temperature adjusting part 222A are switched according to the process to be performed.

[0194] [Second Modification of Second Embodiment]

[0195] Reference Fig. 20 A substrate processing apparatus 20B according to a second modified example of the second embodiment will be described. Fig. 20 It is a diagram showing a substrate processing apparatus 20B according to a second modification of the second embodiment.

[0196] The substrate processing apparatus 20B is different from the substrate processing apparatus 20 in that an orifice OR24 and an orifice OR25 are provided.

[0197] The orifice OR24 is provided in the first branch flow path L24 downstream of the filter F21 and upstream of the confluence point of the first branch flow path L24 and the second branch flow path L25. The pressure loss of the orifice OR24 is greater than the pressure loss of the orifice OR23. In other words, the flow path area of ​​the orifice OR24 is smaller than the flow path area of ​​the orifice OR23.

[0198] The orifice OR25 is provided in the second branch flow path L25 downstream of the filter F22 and upstream of the confluence point of the first branch flow path L24 and the second branch flow path L25. The pressure loss of the orifice OR25 is greater than the pressure loss of the orifice OR23. In other words, the flow path area of ​​the orifice OR25 is smaller than the flow path area of ​​the orifice OR23.

[0199] In the substrate processing device 20B, when the on-off valve V25 is closed and the on-off valve V26 is opened, the fluid heated to the second temperature by the heating mechanism HE22 is supplied to the processing container 211 through the second branch flow path L25. At this time, the fluid whose flow rate is reduced by the throttle hole OR23 flows from the second branch flow path L25 to the first branch flow path L24 via the bypass flow path L26. Thus, the fluid is prevented from flowing back from the processing container 211 toward the first branch flow path L24. Therefore, it is possible to suppress the contamination of the first branch flow path L24 by the residue of IPA. In addition, the first branch flow path L24 downstream of the filter F21 is provided with a throttle hole OR24 having a pressure loss greater than the pressure loss of the throttle hole OR23. In this case, the pressure of the second branch flow path L25 between the on-off valve V26 and the filter F22, the pressure upstream of the throttle hole OR24 of the first branch flow path L24, and the pressure downstream of the throttle hole OR24 of the first branch flow path L24 become lower in sequence. Therefore, it is possible to further prevent the fluid from flowing back from the processing container 211 toward the first branch flow path L24.

[0200] In addition, when the on-off valve V26 is closed and the on-off valve V25 is opened, the fluid heated to the first temperature by the heating mechanism HE21 is supplied to the processing container 211 through the first branch flow path L24. At this time, the fluid whose flow rate is reduced by the throttle hole OR23 flows from the first branch flow path L24 to the second branch flow path L25 via the bypass flow path L26. Thus, the fluid is prevented from flowing back from the processing container 211 toward the second branch flow path L25. Therefore, it is possible to suppress the contamination of the second branch flow path L25 by the residue of IPA, etc. In addition, a throttle hole OR25 having a pressure loss greater than the pressure loss of the throttle hole OR23 is provided at the position downstream of the second branch flow path L25 and the filter F22. In this case, the pressure of the first branch flow path L24 between the on-off valve V25 and the filter F21, the pressure upstream of the throttle hole OR25 of the second branch flow path L25, and the pressure downstream of the throttle hole OR25 of the second branch flow path L25 become lower in sequence. Therefore, it is possible to further prevent the fluid from flowing back from the processing container 211 toward the second branch flow path L25.

[0201] [Third embodiment]

[0202] Reference Fig.21 A substrate processing apparatus 30 according to a third embodiment will be described. Fig.21 It is a diagram showing a substrate processing apparatus 30 according to a third embodiment.

[0203] The substrate processing apparatus 30 includes a processing unit 31 , a fluid supply system 32 , a discharge unit 33 , and a control unit 34 .

[0204] The processing unit 31 may be the same as the processing unit 11 . The processing unit 31 includes a processing container 311 and a holding plate 312 .

[0205] The fluid supply system 32 includes a processing fluid supply unit 321 and a temperature adjustment unit 322 .

[0206] The processing fluid supply unit 321 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 321 includes a processing fluid supply source S31, a first supply flow path L31, an on-off valve V31, an orifice OR31, a second supply flow path L32, an on-off valve V32, an orifice OR32, an inert gas supply source S32, a third supply flow path L33, and an on-off valve V33.

[0207] The temperature adjustment unit 322 is connected to the processing fluid supply unit 321 and the processing container 311. The temperature adjustment unit 322 allows the fluid whose temperature is adjusted to flow into the interior of the processing container 311. The fluid includes the processing fluid and the inert gas. The temperature adjustment unit 322 has a first flow path L34, a second flow path L35, a bypass flow path L36 and a first exhaust flow path L37.

[0208] The first flow path L34 is connected to the side of the processing container 311. The first flow path L34 is used to supply fluid from the side of the processing container 311 toward the substrate W. In the first flow path L34, a heating mechanism HE31, a throttle hole OR33, a filter F31, and an on-off valve V34 are sequentially arranged from upstream. A line heater LH31 is arranged at a position downstream of the heating mechanism HE31 in the first flow path L34. Sensors such as temperature sensors and pressure sensors may also be arranged at various positions of the first flow path L34.

[0209] The heating mechanism HE31 heats the fluid supplied from the processing fluid supply unit 321 to a predetermined temperature, and supplies the fluid at the predetermined temperature downstream.

[0210] The orifice OR33 has a function of reducing the flow rate of the fluid flowing through the first flow path L34 to adjust the pressure.

[0211] The filter F31 filters the fluid flowing in the first flow path L34 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0212] The on-off valve V34 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V34 allows the fluid to flow to the downstream processing container 311 when it is open, and does not allow the fluid to flow to the downstream processing container 311 when it is closed.

[0213] The line heater LH31 heats the first flow path L34 downstream of the heating mechanism HE31. The line heater LH31 suppresses a temperature drop when the fluid heated to a predetermined temperature by the heating mechanism HE31 flows in the first flow path L34.

[0214] The second flow path L35 branches from the first flow path L34 at a position between the filter F31 and the on-off valve V34. The second flow path L35 is connected to the bottom of the processing container 311. The second flow path L35 is used to supply fluid from the bottom of the processing container 311 toward the substrate W. The on-off valve V35 is provided in the second flow path L35. The pipeline heater LH32 is provided in the second flow path L35. Sensors such as temperature sensors and pressure sensors can also be provided at various positions of the second flow path L35.

[0215] The on-off valve V35 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V35 allows the fluid to flow to the downstream processing container 311 when it is open, and does not allow the fluid to flow to the downstream processing container 311 when it is closed.

[0216] The line heater LH32 heats the second flow path L35. The line heater LH32 suppresses a temperature drop when the fluid heated to a predetermined temperature by the heating mechanism HE31 flows in the second flow path L35.

[0217] The bypass flow path L36 allows a position downstream of the on-off valve V34 in the first flow path L34 to communicate with a position downstream of the on-off valve V35 in the second flow path L35. An orifice OR34 is provided in the bypass flow path L36. A line heater LH33 is provided in the bypass flow path L36.

[0218] The orifice OR34 has a function of reducing the flow velocity of the fluid flowing through the bypass flow path L36 to adjust the pressure.

[0219] The line heater LH33 heats the bypass flow path L36.

[0220] In the temperature adjustment section 322, when the on-off valve V34 is closed and the on-off valve V35 is opened, the fluid heated to a predetermined temperature by the heating mechanism HE31 is supplied from the bottom of the processing container 311 through the second flow path L35 into the processing container 311. At this time, the fluid whose flow rate is reduced by the orifice OR34 flows from the second flow path L35 into the first flow path L34 via the bypass flow path L36. Thus, the fluid is prevented from flowing back from the processing container 311 toward the first flow path L34. Therefore, it is possible to suppress the contamination of the first flow path L34 by the residue of IPA.

[0221] In addition, when the on-off valve V35 is closed and the on-off valve V34 is opened, the fluid heated to a predetermined temperature by the heating mechanism HE31 is supplied from the side of the processing container 311 through the first flow path L34 into the processing container 311. At this time, the fluid whose flow rate is reduced by the orifice OR34 flows from the first flow path L34 to the second flow path L35 via the bypass flow path L36. Thus, the fluid is prevented from flowing back from the processing container 311 to the second flow path L35. Therefore, it is possible to suppress the contamination of the second flow path L35 by the residue of IPA and the like.

[0222] The first discharge flow path L37 is used to discharge the fluid in the first flow path L34. The first discharge flow path L37 branches from the first flow path L34 at a position between the filter F31 and the on-off valve V34. In the first discharge flow path L37, the on-off valve V36 and the orifice OR35 are provided in order from the upstream. The first discharge flow path L37 is provided with a pipeline heater LH34. The orifice OR35 may not be provided.

[0223] The on-off valve V36 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V36 allows the fluid to flow to the downstream first discharge flow path L37 when it is open, and does not allow the fluid to flow to the downstream first discharge flow path L37 when it is closed.

[0224] The orifice OR35 has a function of reducing the flow rate of the fluid flowing through the first discharge flow path L37 to adjust the pressure.

[0225] The line heater LH34 heats the first discharge flow path L37.

[0226] The discharge section 33 has a discharge flow path L38. The discharge flow path L38 is connected to the processing container 311. In the discharge flow path L38, a back pressure valve BV31 and an on-off valve V37 are sequentially provided from the upstream. A pipeline heater LH35 is provided in the discharge flow path L38. Sensors such as temperature sensors and pressure sensors may also be provided at various positions of the discharge flow path L38.

[0227] The back pressure valve BV31 , the on-off valve V37 , and the line heater LH35 may be the same as the back pressure valve BV11 , the on-off valve V17 , and the line heater LH15 , respectively.

[0228] The control unit 34 receives measurement signals from various sensors and sends control signals to various functional elements in the same manner as the control unit 14. The control unit 34 is, for example, a computer and includes a calculation unit 341 and a storage unit 342. The calculation unit 341 and the storage unit 342 may be the same as the calculation unit 141 and the storage unit 142, respectively.

[0229] [Fourth embodiment]

[0230] Reference Fig. 22A substrate processing apparatus 40 according to a fourth embodiment will be described. Fig. 22 It is a diagram showing a substrate processing apparatus 40 according to a fourth embodiment.

[0231] The substrate processing apparatus 40 includes a processing unit 41 , a fluid supply system 42 , a discharge unit 43 , and a control unit 44 .

[0232] The processing unit 41 may be the same as the processing unit 11. The processing unit 41 includes a processing container 411 and a holding plate 412.

[0233] The fluid supply system 42 includes a processing fluid supply unit 421 and a temperature adjustment unit 422 .

[0234] The processing fluid supply unit 421 may be the same as the processing fluid supply unit 121. The processing fluid supply unit 421 includes a processing fluid supply source S41, a first supply flow path L41, an on-off valve V41, an orifice OR41, a second supply flow path L42, an on-off valve V42, an orifice OR42, an inert gas supply source S42, a third supply flow path L43, and an on-off valve V43.

[0235] The temperature adjustment unit 422 is connected to the processing fluid supply unit 421 and the processing container 411. The temperature adjustment unit 422 allows the fluid whose temperature is adjusted to flow into the interior of the processing container 411. The fluid includes the processing fluid and the inactive gas. The temperature adjustment unit 422 has a first branch flow path L44, a second branch flow path L45, a first bypass flow path L46, a first exhaust flow path L47, a second exhaust flow path L48, a third branch flow path L421 and a second bypass flow path L422.

[0236] The first branch flow path L44 is connected to the side of the processing container 411. The first branch flow path L44 is used to supply fluid from the side of the processing container 411 toward the substrate W. In the first branch flow path L44, a heating mechanism HE41, an on-off valve V45, a filter F41, and an on-off valve V50 are sequentially arranged from upstream. A line heater LH41 is arranged at a position downstream of the heating mechanism HE41 in the first branch flow path L44. Sensors such as temperature sensors and pressure sensors may also be arranged at various positions of the first branch flow path L44.

[0237] The heating mechanism HE41 is provided in parallel with the heating mechanism HE42. The heating mechanism HE41 heats the fluid supplied from the treatment fluid supply unit 421 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

[0238] The on-off valve V45 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V45 allows the fluid to flow to the downstream filter F41 when it is open, and does not allow the fluid to flow to the downstream filter F41 when it is closed.

[0239] The filter F41 filters the fluid flowing in the first branch flow path L44 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0240] The on-off valve V50 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V50 allows the fluid to flow to the downstream processing container 411 when it is open, and does not allow the fluid to flow to the downstream processing container 411 when it is closed.

[0241] The line heater LH41 heats the first branch flow path L44 downstream of the heating mechanism HE41. The line heater LH41 suppresses a temperature drop of the fluid heated to the first temperature by the heating mechanism HE41 when flowing in the first branch flow path L44.

[0242] The second branch flow path L45 branches from the first branch flow path L44 at a position between the treatment fluid supply unit 421 and the heating mechanism HE41. The second branch flow path L45 merges with the first branch flow path L44 at a position between the filter F41 and the on-off valve V50.

[0243] In the second branch flow path L45, an on-off valve V44, a heating mechanism HE42, an on-off valve V46, and a filter F42 are sequentially provided from upstream. A pipeline heater LH42 is provided at a position downstream of the heating mechanism HE42 in the second branch flow path L45. Sensors such as temperature sensors and pressure sensors may also be provided at various positions in the second branch flow path L45.

[0244] The on-off valve V44 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V44 allows the fluid to flow to the downstream heating mechanism HE42 when it is open, and does not allow the fluid to flow to the downstream heating mechanism HE42 when it is closed.

[0245] The heating mechanism HE42 heats the fluid supplied from the treatment fluid supply unit 421 to a second temperature, and supplies the fluid at the second temperature downstream. The second temperature is a temperature lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0246] The on-off valve V46 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V46 allows the fluid to flow to the downstream filter F42 when it is open, and does not allow the fluid to flow to the downstream filter F42 when it is closed.

[0247] The filter F42 filters the fluid flowing in the second branch flow path L45 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0248] The line heater LH42 heats the second branch flow path L45 downstream of the heating mechanism HE42. The line heater LH42 suppresses a temperature drop of the fluid heated to the second temperature by the heating mechanism HE42 when flowing in the second branch flow path L45.

[0249] The first bypass flow path L46 connects the position between the on-off valve V45 and the filter F41 in the first branch flow path L44 with the position between the on-off valve V46 and the filter F42 in the second branch flow path L45. The first bypass flow path L46 is provided with an orifice OR43. The first bypass flow path L46 is provided with a line heater LH43. The first bypass flow path L46, the orifice OR43, and the line heater LH43 may not be provided.

[0250] The orifice OR43 has a function of reducing the flow rate of the fluid flowing through the first bypass flow path L46 to adjust the pressure.

[0251] The line heater LH43 heats the first bypass flow path L46.

[0252] In the temperature adjustment section 422, when the on-off valve V45 is closed and the on-off valve V46 is opened, the fluid heated to the second temperature by the heating mechanism HE42 is supplied to the processing container 411 through the second branch flow path L45. At this time, the fluid whose flow rate is reduced by the throttle hole OR43 flows from the second branch flow path L45 to the first bypass flow path L46 into the first branch flow path L44. Thus, the fluid is prevented from flowing back from the confluence of the first branch flow path L44 and the second branch flow path L45 toward the upstream of the first branch flow path L44. Therefore, it is possible to suppress the contamination of the first branch flow path L44, the filter F41, etc.

[0253] In addition, when the on-off valve V46 is closed and the on-off valve V45 is opened, the fluid heated to the first temperature by the heating mechanism HE41 is supplied to the processing container 411 through the first branch flow path L44. At this time, the fluid whose flow rate is reduced by the throttle hole OR43 flows from the first branch flow path L44 to the second branch flow path L45 via the first bypass flow path L46. Thus, the fluid is prevented from flowing back from the confluence of the first branch flow path L44 and the second branch flow path L45 toward the upstream of the second branch flow path L45. Therefore, it is possible to suppress the contamination of the second branch flow path L45, the filter F42, etc.

[0254] In this way, by exclusively opening and closing the on-off valve V45 and the on-off valve V46, the temperature of the fluid flowing into the processing container 411 can be changed. In addition, when both the on-off valve V45 and the on-off valve V46 are opened, the fluid heated to the first temperature by the heating mechanism HE41 and the fluid heated to the second temperature by the heating mechanism HE42 are mixed and supplied to the processing container 411. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied to the processing container 411. In this way, by controlling the opening and closing of the on-off valve V45 and the on-off valve V46, the temperature of the fluid flowing into the processing container 411 can be changed in three stages.

[0255] The first discharge flow path L47 is used to discharge the fluid in the first branch flow path L44. The first discharge flow path L47 branches from the first branch flow path L44 at a position between the heating mechanism HE41 and the on-off valve V45. The on-off valve V47 is provided in the first discharge flow path L47. The line heater LH44 is provided in the first discharge flow path L47. A throttle hole may also be provided in the first discharge flow path L47.

[0256] The on-off valve V47 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V47 allows the fluid to flow to the downstream first discharge flow path L47 when it is open, and does not allow the fluid to flow to the downstream first discharge flow path L47 when it is closed.

[0257] The line heater LH44 heats the first discharge flow path L47.

[0258] The second discharge flow path L48 is used to discharge the fluid in the second branch flow path L45. The second discharge flow path L48 branches from the second branch flow path L45 at a position between the heating mechanism HE42 and the on-off valve V46. The on-off valve V48 is provided in the second discharge flow path L48. The pipeline heater LH45 is provided in the second discharge flow path L48. A throttling hole may also be provided in the second discharge flow path L48.

[0259] The on-off valve V48 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V48 allows the fluid to flow to the downstream second discharge flow path L48 when it is open, and does not allow the fluid to flow to the downstream second discharge flow path L48 when it is closed.

[0260] The line heater LH45 heats the second discharge flow path L48.

[0261] The third branch flow path L421 branches from the first branch flow path L44 at a position between the filter F41 and the on-off valve V50 and is connected to the bottom of the processing container 411. The third branch flow path L421 is used to supply fluid from the bottom of the processing container 411 toward the substrate W.

[0262] The third branch flow path L421 is provided with an on-off valve V421. The third branch flow path L421 is provided with a line heater LH421. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions of the third branch flow path L421.

[0263] The on-off valve V421 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V421 allows the fluid to flow to the downstream processing container 411 when it is open, and does not allow the fluid to flow to the downstream processing container 411 when it is closed.

[0264] The line heater LH421 heats the third branch flow path L421 and suppresses a temperature drop of the fluid heated to the first temperature by the heating mechanism HE41 and the fluid heated to the second temperature by the heating mechanism HE42 when the fluid flows in the third branch flow path L421.

[0265] The second bypass flow path L422 connects a position downstream of the on-off valve V50 in the first branch flow path L44 with a position downstream of the on-off valve V421 in the third branch flow path L421. An orifice OR422 is provided in the second bypass flow path L422. A line heater LH422 is provided in the second bypass flow path L422.

[0266] The orifice OR422 has a function of reducing the flow rate of the fluid flowing through the second bypass flow path L422 to adjust the pressure.

[0267] The line heater LH422 heats the second bypass flow path L422.

[0268] In the temperature adjustment section 422, when the on-off valve V50 is closed and the on-off valve V421 is opened, the fluid is supplied to the processing container 411 through the third branch flow path L421. At this time, the fluid whose flow rate is reduced by the orifice OR422 flows from the third branch flow path L421 to the first branch flow path L44 via the second bypass flow path L422. Thus, the fluid is prevented from flowing back from the processing container 411 toward the upstream of the first branch flow path L44. Therefore, it is possible to suppress the contamination of the first branch flow path L44 by the residue of IPA, etc.

[0269] In addition, when the on-off valve V42 is closed 1 and the on-off valve V50 is opened, the fluid is supplied to the processing container 411 through the first branch flow path L44. At this time, the fluid whose flow rate is reduced by the throttle hole OR422 flows from the first branch flow path L44 to the third branch flow path L421 via the second bypass flow path L422. Thus, the fluid is prevented from flowing back from the processing container 411 toward the upstream of the third branch flow path L421. Therefore, it is possible to suppress the contamination of the third branch flow path L421 by the residue of IPA, etc.

[0270] The discharge section 43 has a discharge flow path L49. The discharge flow path L49 is connected to the processing container 411. In the discharge flow path L49, a back pressure valve BV41 and an on-off valve V49 are sequentially arranged from the upstream. A pipeline heater LH46 is arranged in the discharge flow path L49. Sensors such as temperature sensors and pressure sensors may also be arranged at various positions of the discharge flow path L49.

[0271] The back pressure valve BV41 , the on-off valve V49 , and the line heater LH46 may be the same as the back pressure valve BV11 , the on-off valve V17 , and the line heater LH15 , respectively.

[0272] The control unit 44 receives measurement signals from various sensors and sends control signals to various functional elements in the same manner as the control unit 14. The control unit 44 is, for example, a computer and includes a calculation unit 441 and a storage unit 442. The calculation unit 441 and the storage unit 442 may be the same as the calculation unit 141 and the storage unit 142, respectively.

[0273] [Fifth embodiment]

[0274] Reference Fig.23 A substrate processing apparatus 50 according to a fifth embodiment will be described. Fig.23 It is a diagram showing a substrate processing apparatus 50 according to a fifth embodiment.

[0275] The substrate processing apparatus 50 includes a processing unit 51 , a fluid supply system 52 , a discharge unit 53 , and a control unit 54 .

[0276] The processing unit 51 may be the same as the processing unit 11. The processing unit 51 includes a processing container 511 and a holding plate 512.

[0277] The fluid supply system 52 includes a processing fluid supply unit 521 and a temperature adjustment unit 522 .

[0278] The treatment fluid supply unit 521 may be the same as the treatment fluid supply unit 121. The treatment fluid supply unit 521 includes a treatment fluid supply source S51, a first supply flow path L51, an on-off valve V51, an orifice OR51, a second supply flow path L52, an on-off valve V52, an orifice OR52, an inert gas supply source S52, a third supply flow path L53, and an on-off valve V53.

[0279] The temperature adjustment unit 522 is connected to the processing fluid supply unit 521 and the processing container 511. The temperature adjustment unit 522 allows the fluid whose temperature is adjusted to flow into the interior of the processing container 511. The fluid includes the processing fluid and the inert gas. The temperature adjustment unit 522 has a first branch flow path L54, a second branch flow path L55, a first bypass flow path L56, a first exhaust flow path L57, a third branch flow path L521 and a second bypass flow path L522.

[0280] The first branch flow path L54 is connected to the side of the processing container 511. The first branch flow path L54 is used to supply fluid from the side of the processing container 511 toward the substrate W. In the first branch flow path L54, a heating mechanism HE51, an on-off valve V55, a filter F51, and an on-off valve V60 are sequentially arranged from the upstream. A pipeline heater LH51 is arranged at a position downstream of the heating mechanism HE51 in the first branch flow path L54. Sensors such as temperature sensors and pressure sensors can also be arranged at various positions of the first branch flow path L54.

[0281] In the second branch flow path L55, a heating mechanism HE52, an on-off valve V56, and a filter F52 are provided in order from the upstream. A pipeline heater LH52 is provided at a position downstream of the heating mechanism HE52 in the second branch flow path L55. Sensors such as temperature sensors and pressure sensors may also be provided at various positions in the second branch flow path L55.

[0282] The first branch flow path L54 branches from the second branch flow path L55 at a position between the heating mechanism HE52 and the on-off valve V56. The second branch flow path L55 merges with the first branch flow path L54 at a position between the filter F51 and the on-off valve V60.

[0283] The heating mechanism HE51 and the heating mechanism HE52 are provided in series. The heating mechanism HE51 heats the fluid supplied from the treatment fluid supply unit 521 to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

[0284] The on-off valve V55 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V55 allows the fluid to flow to the downstream filter F51 when it is open, and does not allow the fluid to flow to the downstream filter F51 when it is closed.

[0285] The filter F51 filters the fluid flowing in the first branch flow path L54 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0286] The on-off valve V60 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V60 allows the fluid to flow to the downstream processing container 511 when it is open, and does not allow the fluid to flow to the downstream processing container 511 when it is closed.

[0287] The line heater LH51 heats the first branch flow path L54 downstream of the heating mechanism HE51. The line heater LH51 suppresses a temperature drop of the fluid heated to the first temperature by the heating mechanism HE51 when flowing in the first branch flow path L54.

[0288] The heating mechanism HE52 heats the fluid supplied from the treatment fluid supply unit 521 to a second temperature, and supplies the fluid at the second temperature downstream. The second temperature is a temperature lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0289] The on-off valve V56 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V56 allows the fluid to flow to the downstream filter F52 when it is open, and does not allow the fluid to flow to the downstream filter F52 when it is closed.

[0290] The filter F52 filters the fluid flowing in the second branch flow path L55 to remove foreign matter contained in the fluid. Thus, when the substrate W is dried using the fluid, generation of particles on the surface of the substrate W can be suppressed.

[0291] The line heater LH52 heats the second branch flow path L55 downstream of the heating mechanism HE52. The line heater LH52 suppresses a temperature drop of the fluid heated to the second temperature by the heating mechanism HE52 when flowing in the second branch flow path L55.

[0292] The first bypass flow path L56 connects the position between the on-off valve V55 and the filter F51 in the first branch flow path L54 with the position between the on-off valve V56 and the filter F52 in the second branch flow path L55. The first bypass flow path L56 is provided with an orifice OR53. The first bypass flow path L56 is provided with a line heater LH53.

[0293] The orifice OR53 has a function of reducing the flow rate of the fluid flowing through the first bypass flow path L56 to adjust the pressure.

[0294] The line heater LH53 heats the first bypass flow path L56.

[0295] In the temperature adjustment section 522, when the on-off valve V55 is closed and the on-off valve V56 is opened, the fluid heated to the second temperature by the heating mechanism HE52 is supplied to the processing container 511 through the second branch flow path L55. At this time, the fluid whose flow rate is reduced by the throttle hole OR53 flows from the second branch flow path L55 to the first bypass flow path L56 into the first branch flow path L54. Thus, the fluid is prevented from flowing back from the confluence of the first branch flow path L54 and the second branch flow path L55 toward the upstream of the first branch flow path L54. Therefore, it is possible to suppress the contamination of the first branch flow path L54, the filter F51, etc.

[0296] In addition, when the on-off valve V56 is closed and the on-off valve V55 is opened, the fluid heated to the first temperature by the heating mechanism HE51 is supplied to the processing container 511 through the first branch flow path L54. At this time, the fluid whose flow rate is reduced by the throttle hole OR53 flows from the first branch flow path L54 to the second branch flow path L55 via the first bypass flow path L56. Thus, the fluid is prevented from flowing back from the confluence of the first branch flow path L54 and the second branch flow path L55 toward the upstream of the second branch flow path L55. Therefore, it is possible to suppress the contamination of the second branch flow path L55, the filter F52, etc.

[0297] In this way, by exclusively opening and closing the on-off valve V55 and the on-off valve V56, the temperature of the fluid flowing into the processing container 511 can be changed. In addition, when both the on-off valve V55 and the on-off valve V56 are opened, the fluid heated to the first temperature by the heating mechanism HE51 and the fluid heated to the second temperature by the heating mechanism HE52 are mixed and supplied to the processing container 511. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied to the processing container 511. In this way, by controlling the opening and closing of the on-off valve V55 and the on-off valve V56, the temperature of the fluid flowing into the processing container 511 can be changed in three stages.

[0298] The first discharge flow path L57 is used to discharge the fluid in the first branch flow path L54. The first discharge flow path L57 branches from the first branch flow path L54 at a position between the heating mechanism HE51 and the on-off valve V55. The on-off valve V54 is provided in the first discharge flow path L57. The line heater LH54 is provided in the first discharge flow path L57. A throttle hole may also be provided in the first discharge flow path L57.

[0299] The on-off valve V54 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V54 allows the fluid to flow to the downstream first discharge flow path L57 when it is open, and does not allow the fluid to flow to the downstream first discharge flow path L57 when it is closed.

[0300] The line heater LH54 heats the first discharge flow path L57.

[0301] The third branch flow path L521 branches from the first branch flow path L54 at a position between the filter F51 and the on-off valve V60. The third branch flow path L521 is connected to the bottom of the processing container 511. The third branch flow path L521 is used to supply fluid from the bottom of the processing container 511 toward the substrate W.

[0302] The third branch flow path L521 is provided with an on-off valve V521. The third branch flow path L521 is provided with a line heater LH521. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions of the third branch flow path L521.

[0303] The on-off valve V521 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V521 allows the fluid to flow to the downstream processing container 511 when it is open, and does not allow the fluid to flow to the downstream processing container 511 when it is closed.

[0304] The line heater LH521 heats the third branch flow path L521. The line heater LH521 suppresses a drop in temperature of the fluid heated to the first temperature by the heating mechanism HE51 and the fluid heated to the second temperature by the heating mechanism HE52 when the fluid flows in the third branch flow path L521.

[0305] The second bypass flow path L522 connects a position downstream of the on-off valve V60 in the first branch flow path L54 with a position downstream of the on-off valve V521 in the third branch flow path L521. An orifice OR522 is provided in the second bypass flow path L522. A line heater LH522 is provided in the second bypass flow path L522.

[0306] The orifice OR522 has a function of reducing the flow rate of the fluid flowing through the second bypass flow path L522 to adjust the pressure.

[0307] The line heater LH522 heats the second bypass flow path L522.

[0308] In the temperature adjustment section 522, when the on-off valve V60 is closed and the on-off valve V521 is opened, the fluid is supplied to the processing container 511 through the third branch flow path L521. At this time, the fluid whose flow rate is reduced by the orifice OR522 flows from the third branch flow path L521 to the first branch flow path L54 via the second bypass flow path L522. Thus, the fluid is prevented from flowing back from the processing container 511 toward the upstream of the first branch flow path L54. Therefore, it is possible to suppress the contamination of the first branch flow path L54 by the residue of IPA.

[0309] In addition, when the on-off valve V521 is closed and the on-off valve V60 is opened, the fluid is supplied to the processing container 511 through the first branch flow path L54. At this time, the fluid whose flow rate is reduced by the orifice OR522 flows from the first branch flow path L54 to the third branch flow path L521 via the second bypass flow path L522. Thus, the fluid is prevented from flowing back from the processing container 511 toward the upstream of the third branch flow path L521. Therefore, it is possible to suppress the contamination of the third branch flow path L521 by the residue of IPA, etc.

[0310] The discharge section 53 has a discharge flow path L58. The discharge flow path L58 is connected to the processing container 511. In the discharge flow path L58, a back pressure valve BV51 and an on-off valve V57 are sequentially provided from the upstream. A pipeline heater LH55 is provided in the discharge flow path L58. Sensors such as temperature sensors and pressure sensors may also be provided at various positions of the discharge flow path L58.

[0311] The back pressure valve BV51 , the on-off valve V57 , and the line heater LH55 may be the same as the back pressure valve BV11 , the on-off valve V17 , and the line heater LH15 , respectively.

[0312] The control unit 54 receives measurement signals from various sensors and sends control signals to various functional elements in the same manner as the control unit 14. The control unit 54 is, for example, a computer and includes a calculation unit 541 and a storage unit 542. The calculation unit 541 and the storage unit 542 may be the same as the calculation unit 141 and the storage unit 142, respectively.

[0313] [Sixth embodiment]

[0314] Reference Fig.24 A substrate processing apparatus 60 according to a sixth embodiment will be described. Fig.24 It is a diagram showing a substrate processing apparatus 60 according to a sixth embodiment.

[0315] The substrate processing apparatus 60 includes a processing unit 61 , a fluid supply system 62 , a discharge unit 63 , and a control unit 64 .

[0316] The processing unit 61 may be the same as the processing unit 11. The processing unit 61 includes a processing container 611 and a holding plate 612.

[0317] The fluid supply system 62 includes a processing fluid supply unit 621A, a processing fluid supply unit 621B, and a temperature adjustment unit 622 .

[0318] The treatment fluid supply unit 621A and the treatment fluid supply unit 621B may be respectively the same as the treatment fluid supply unit 221A and the treatment fluid supply unit 221B. The treatment fluid supply unit 621A comprises a treatment fluid supply source S61A, a first supply channel L61A, an on-off valve V61A, a throttle hole OR61A, an inactive gas supply source S62A, a third supply channel L63A, and an on-off valve V63A. The treatment fluid supply unit 621B comprises a treatment fluid supply source S61B, a first supply channel L61B, an on-off valve V61B, a throttle hole OR61B, a second supply channel L62B, an on-off valve V62B, a throttle hole OR62B, an inactive gas supply source S62B, a third supply channel L63B, and an on-off valve V63B.

[0319] The temperature adjustment unit 622 is connected to the processing fluid supply unit 621A, the processing fluid supply unit 621B and the processing container 611. The temperature adjustment unit 622 allows the fluid whose temperature is adjusted to flow into the interior of the processing container 611. The fluid includes the processing fluid and the inactive gas. The temperature adjustment unit 622 has a first branch flow path L64, a second branch flow path L65, a bypass flow path L66, a first exhaust flow path L67, a second exhaust flow path L68 and a third branch flow path L621.

[0320] The first branch flow path L64 is connected to the processing fluid supply part 621A. Fluid is supplied to the first branch flow path L64 from the processing fluid supply part 621A. The first branch flow path L64 is connected to the side of the processing container 611. The first branch flow path L64 is used to supply fluid from the side of the processing container 611 toward the substrate W. In the first branch flow path L64, a heating mechanism HE61, an opening and closing valve V65, a filter F61, and an opening and closing valve V70 are arranged in sequence from the upstream. A pipeline heater LH61 is arranged at a position downstream of the heating mechanism HE61 in the first branch flow path L64. Sensors such as temperature sensors and pressure sensors can also be arranged at various positions of the first branch flow path L64.

[0321] The heating mechanism HE61 is provided in parallel with the heating mechanism HE62. The heating mechanism HE61 heats the fluid supplied from the treatment fluid supply unit 621A to a first temperature and supplies the fluid at the first temperature downstream. The first temperature may be, for example, 100°C or higher and 120°C or lower.

[0322] The on-off valve V65 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V65 allows the fluid to flow to the downstream filter F61 when it is open, and does not allow the fluid to flow to the downstream filter F61 when it is closed.

[0323] The filter F61 filters the fluid flowing in the first branch flow path L64 to remove foreign matter contained in the fluid, thereby preventing particles from being generated on the surface of the substrate W when the substrate W is dried using the fluid.

[0324] The on-off valve V70 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V70 allows the fluid to flow to the downstream processing container 611 when it is open, and does not allow the fluid to flow to the downstream processing container 611 when it is closed.

[0325] The line heater LH61 heats the first branch flow path L64 downstream of the heating mechanism HE61. The line heater LH61 suppresses a temperature drop of the fluid heated to the first temperature by the heating mechanism HE61 when flowing in the first branch flow path L64.

[0326] The second branch flow path L65 is connected to the treatment fluid supply unit 621B. Fluid is supplied to the second branch flow path L65 from the treatment fluid supply unit 621B. The second branch flow path L65 merges with the first branch flow path L64 at a position between the filter F61 and the on-off valve V70. In the second branch flow path L65, a heating mechanism HE62, an on-off valve V66, and a filter F62 are provided in sequence from upstream. A pipeline heater LH62 is provided at a position downstream of the heating mechanism HE62 in the second branch flow path L65. Sensors such as temperature sensors and pressure sensors may also be provided at various positions of the second branch flow path L65.

[0327] The heating mechanism HE62 heats the fluid supplied from the treatment fluid supply unit 621B to a second temperature, and supplies the fluid at the second temperature downstream. The second temperature is a temperature lower than the first temperature. The second temperature may be, for example, 80°C or higher and 90°C or lower.

[0328] The on-off valve V66 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V66 allows the fluid to flow to the downstream filter F62 when it is open, and does not allow the fluid to flow to the downstream filter F62 when it is closed.

[0329] The filter F62 filters the fluid flowing in the second branch flow path L65 to remove foreign matter contained in the fluid. Thus, when the substrate W is dried using the fluid, generation of particles on the surface of the substrate W can be suppressed.

[0330] The line heater LH62 heats the second branch flow path L65 downstream of the heating mechanism HE62. The line heater LH62 suppresses a temperature drop of the fluid heated to the second temperature by the heating mechanism HE62 when flowing in the second branch flow path L65.

[0331] The bypass flow path L66 connects the position between the on-off valve V65 and the filter F61 in the first branch flow path L64 with the position between the on-off valve V66 and the filter F62 in the second branch flow path L65. The bypass flow path L66 is provided with an orifice OR63. The bypass flow path L66 is provided with a line heater LH63.

[0332] The orifice OR63 has a function of reducing the flow rate of the fluid flowing through the bypass flow path L66 to adjust the pressure.

[0333] The line heater LH63 heats the bypass flow path L66.

[0334] In the temperature adjustment section 622, when the on-off valve V65 is closed and the on-off valve V66 is opened, the fluid heated to the second temperature by the heating mechanism HE62 is supplied to the processing container 611 through the second branch flow path L65. At this time, the fluid whose flow rate is reduced by the throttle hole OR63 flows from the second branch flow path L65 to the first branch flow path L64 via the bypass flow path L66. Thus, the fluid is prevented from flowing back from the confluence of the first branch flow path L64 and the second branch flow path L65 toward the upstream of the first branch flow path L64. Therefore, it is possible to suppress the contamination of the first branch flow path L64, the filter F61, etc.

[0335] In addition, when the on-off valve V66 is closed and the on-off valve V65 is opened, the fluid heated to the first temperature by the heating mechanism HE61 is supplied to the processing container 611 through the first branch flow path L64. At this time, the fluid whose flow rate is reduced by the throttle hole OR63 flows from the first branch flow path L64 to the second branch flow path L65 via the bypass flow path L66. Thus, the fluid is prevented from flowing back from the confluence of the first branch flow path L64 and the second branch flow path L65 toward the upstream of the second branch flow path L65. Therefore, it is possible to suppress the contamination of the second branch flow path L65, the filter F62, etc.

[0336] In this way, by exclusively opening and closing the on-off valve V65 and the on-off valve V66, the temperature of the fluid flowing into the processing container 611 can be changed. In addition, when both the on-off valve V65 and the on-off valve V66 are opened, the fluid heated to the first temperature by the heating mechanism HE61 and the fluid heated to the second temperature by the heating mechanism HE62 are mixed and supplied to the processing container 611. In this case, a fluid at an intermediate temperature between the first temperature and the second temperature can be supplied to the processing container 611. In this way, by controlling the opening and closing of the on-off valve V65 and the on-off valve V66, the temperature of the fluid flowing into the processing container 611 can be changed in three stages.

[0337] The first discharge flow path L67 is used to discharge the fluid in the first branch flow path L64. The first discharge flow path L67 branches from the first branch flow path L64 at a position between the heating mechanism HE61 and the on-off valve V65. The on-off valve V67 is provided in the first discharge flow path L67. The line heater LH64 is provided in the first discharge flow path L67. A throttle hole may also be provided in the first discharge flow path L67.

[0338] The on-off valve V67 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V67 allows the fluid to flow to the downstream first discharge flow path L67 when it is open, and does not allow the fluid to flow to the downstream first discharge flow path L67 when it is closed.

[0339] The line heater LH64 heats the first discharge flow path L67.

[0340] The second discharge flow path L68 is used to discharge the fluid in the second branch flow path L65. The second discharge flow path L68 branches from the second branch flow path L65 at a position between the heating mechanism HE62 and the on-off valve V66. The on-off valve V68 is provided in the second discharge flow path L68. The pipeline heater LH65 is provided in the second discharge flow path L68. A throttling hole may also be provided in the second discharge flow path L68.

[0341] The on-off valve V68 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V68 allows the fluid to flow to the downstream second discharge flow path L68 when it is open, and does not allow the fluid to flow to the downstream second discharge flow path L68 when it is closed.

[0342] The line heater LH65 heats the second discharge flow path L68.

[0343] The third branch flow path L621 branches from the first branch flow path L64 at a position between the filter F61 and the on-off valve V70. The third branch flow path L621 is connected to the bottom of the processing container 611. The third branch flow path L621 is used to supply fluid from the bottom of the processing container 611 toward the substrate W.

[0344] The third branch flow path L621 is provided with an on-off valve V621. The third branch flow path L621 is provided with a line heater LH621. Sensors such as a temperature sensor and a pressure sensor may be provided at various positions of the third branch flow path L621.

[0345] The on-off valve V621 is a valve that switches the flow of the fluid between flow and cutoff. The on-off valve V621 allows the fluid to flow to the downstream processing container 611 when it is open, and does not allow the fluid to flow to the downstream processing container 611 when it is closed.

[0346] The line heater LH621 heats the third branch flow path L621. The line heater LH621 suppresses a temperature drop when the fluid heated to the first temperature by the heating mechanism HE61 and the fluid heated to the second temperature by the heating mechanism HE62 flow in the third branch flow path L621.

[0347] In the temperature adjustment section 622, when the on-off valve V70 is closed and the on-off valve V621 is opened, the fluid is supplied to the processing container 611 through the third branch flow path L621. In addition, when the on-off valve V621 is closed and the on-off valve V70 is opened, the fluid is supplied to the processing container 611 through the first branch flow path L64.

[0348] The discharge section 63 has a discharge flow path L69. The discharge flow path L69 is connected to the processing container 611. In the discharge flow path L69, a back pressure valve BV61 and an on-off valve V69 are sequentially provided from the upstream. A pipeline heater LH66 is provided in the discharge flow path L69. Sensors such as temperature sensors and pressure sensors may also be provided at various positions of the discharge flow path L69.

[0349] The back pressure valve BV61 , the on-off valve V69 , and the line heater LH66 may be the same as the back pressure valve BV11 , the on-off valve V17 , and the line heater LH15 , respectively.

[0350] The control unit 64 receives measurement signals from various sensors and sends control signals to various functional elements in the same manner as the control unit 14. The control unit 64 is, for example, a computer and includes a calculation unit 641 and a storage unit 642. The calculation unit 641 and the storage unit 642 may be the same as the calculation unit 141 and the storage unit 142, respectively.

[0351] In addition, in the above-mentioned embodiment, the opening and closing valves V11 and V21 are examples of the first supply valve, and the opening and closing valves V12 and V22 are examples of the second supply valve. The opening and closing valves V15 and V25 are examples of the first opening and closing valve, the opening and closing valves V16 and V26 are examples of the second opening and closing valve, and the opening and closing valve V24 is an example of the third opening and closing valve. The opening and closing valve V27 is an example of the first discharge valve, the opening and closing valve V28 is an example of the second discharge valve, and the opening and closing valve V29 is an example of the third discharge valve. The heating mechanisms HE11 and HE21 are examples of the first heating mechanism, and the heating mechanisms HE12 and HE22 are examples of the second heating mechanism. The throttle holes OR13 and OR23 are examples of the first throttling section. The first branch flow paths L14 and L24 and the second branch flow paths L15 and L25 are examples of fluid supply paths.

[0352] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the appended claims and the gist thereof.

[0353] This international application claims priority based on Japanese Patent Application No. 2022-168324 filed on October 20, 2022, the entire contents of which are incorporated herein by reference.

[0354] Description of Reference Numerals

[0355] 10, 20: substrate processing device; 11, 21: processing unit; 111, 211: processing container; 12, 22: fluid supply system; 121, 221: processing fluid supply unit; 122, 222: temperature adjustment unit; HE11, HE21: heating mechanism; HE12, HE22: heating mechanism; L14, L24: first branch flow path; L15, L25: second branch flow path; V11, V21: opening and closing valve; V12, V22: opening and closing valve.

Claims

1. A fluid supply system for supplying a fluid into a processing container in which a substrate is processed, the fluid supply system comprising: a treatment fluid supply unit for supplying treatment fluid; a fluid supply path connected to the processing fluid supply part and the processing container, and used for allowing the processing fluid with adjusted temperature to flow into the processing container; A first heating mechanism, which is disposed in the fluid supply path and heats the treatment fluid to a first temperature; as well as a second heating mechanism disposed in the fluid supply path and heating the treatment fluid to a second temperature lower than the first temperature; The processing fluid supply unit has a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid. The fluid supply path has: a first branch flow path, which is used to allow the processing fluid to flow into the processing container through the first heating mechanism; as well as The second branch flow path is used to allow the processing fluid to flow into the processing container through the second heating mechanism.

2. The fluid supply system according to claim 1, wherein: A first opening and closing valve is provided in the first branch flow path and downstream of the first heating mechanism. A second on-off valve is provided in the second branch flow path and downstream of the second heating mechanism. A bypass flow path for connecting the first branch flow path and the second branch flow path is provided at a position downstream of the first opening and closing valve and the second opening and closing valve in the fluid supply path. The bypass flow path is provided with a first throttle hole.

3. The fluid supply system according to claim 1, wherein: A control unit is provided, wherein the control unit controls each part of the fluid supply system. A first opening and closing valve is provided in the first branch flow path and downstream of the first heating mechanism. A second on-off valve is provided in the second branch flow path and downstream of the second heating mechanism. The control unit is configured to change a temperature of the processing fluid flowing into the processing container by exclusively opening and closing the first opening and closing valve and the second opening and closing valve.

4. The fluid supply system according to any one of claims 1 to 3, wherein: The first heating mechanism and the second heating mechanism are arranged in series, The first branch flow path is connected to a first discharge flow path, and the first discharge flow path is used to discharge the treated fluid in the first branch flow path.

5. The fluid supply system according to claim 2 or 3, wherein: The first heating mechanism and the second heating mechanism are arranged in parallel, A first discharge flow path having a first discharge valve is connected to the first branch flow path, and the first discharge flow path is used to discharge the treatment fluid in the first branch flow path. A second discharge flow path having a second discharge valve is connected to the second branch flow path, and the second discharge flow path is used to discharge the treated fluid in the second branch flow path. A third on-off valve is provided in the second branch flow path at a position upstream of the second heating mechanism.

6. The fluid supply system according to claim 5, wherein: A control unit is provided, wherein the control unit controls each part of the fluid supply system. The control unit performs the following steps: Loading the substrate into the processing container; After the carrying-in step is performed, the second on-off valve and the third on-off valve are opened to supply the processing fluid at the second temperature into the processing container; After the step of supplying the processing fluid at the second temperature, closing the second opening and closing valve and the third opening and closing valve and opening the first opening and closing valve to supply the processing fluid at the first temperature into the processing container; as well as The second discharge valve is opened to reduce the pressure in the second branch flow path. Here, the step of reducing the pressure in the second branch flow channel and the step of supplying the processing fluid at the first temperature into the processing container are performed in parallel.

7. The fluid supply system according to claim 2 or 3, wherein: A control unit is provided, wherein the control unit controls each part of the fluid supply system. The control unit controls opening and closing of the first opening and closing valve and the second opening and closing valve according to a processing state of the substrate in the processing container, thereby changing a temperature of the processing fluid flowing into the processing container.

8. The fluid supply system according to any one of claims 1 to 3, wherein: A control unit is provided, wherein the control unit controls each part of the fluid supply system. The treatment fluid supply unit has a first supply flow path and a second supply flow path arranged in parallel, The flow rate adjustment mechanism includes a first supply valve provided in the first supply flow path and a second supply valve provided in the second supply flow path. The control unit controls opening and closing of the first supply valve and the second supply valve according to a processing state of the substrate in the processing container, thereby changing a flow rate of the processing fluid flowing into the processing container.

9. The fluid supply system according to claim 2 or 3, wherein: A control unit is provided, wherein the control unit controls each part of the fluid supply system. The control unit performs the following steps: Loading the substrate into the processing container; Controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, and opening the second on-off valve to supply the processing fluid at the second temperature and the first flow rate into the processing container; as well as After the process of supplying the processing fluid at the first flow rate and the second temperature into the processing container, the flow adjustment mechanism is controlled to supply the processing fluid at the second flow rate to the fluid supply path, and the first on-off valve is opened to supply the processing fluid at the first temperature and the second flow rate into the processing container.

10. A substrate processing device comprising: The fluid supply system according to claim 7; and a discharge portion having a third discharge valve for discharging the treatment fluid in the treatment container, The control unit performs the following steps: Loading the substrate into the processing container; Controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, opening the second on-off valve and closing the third discharge valve to supply the processing fluid at the second temperature and the first flow rate into the processing container, thereby increasing the pressure in the processing container; as well as After the process of increasing the pressure in the processing container, the flow adjustment mechanism is controlled to supply the processing fluid to the fluid supply path at a second flow rate, the second on-off valve is closed and the first on-off valve is opened to supply the processing fluid at the first temperature and the second flow rate into the processing container, thereby increasing the pressure in the processing container.

11. A substrate processing method, wherein a fluid supply system is used to supply a fluid into a processing container in which a substrate is processed. The fluid supply system comprises: a treatment fluid supply unit for supplying treatment fluid; a fluid supply path connected to the processing fluid supply part and the processing container, and used for allowing the processing fluid with adjusted temperature to flow into the processing container; A first heating mechanism, which is disposed in the fluid supply path and heats the treatment fluid to a first temperature; as well as a second heating mechanism disposed in the fluid supply path and heating the treatment fluid to a second temperature lower than the first temperature; The processing fluid supply unit has a flow rate adjustment mechanism for adjusting the flow rate of the processing fluid. The fluid supply path has: a first branch flow path, which is used to allow the processing fluid to flow into the processing container through the first heating mechanism; as well as a second branch flow path for allowing the processing fluid to flow into the processing container through the second heating mechanism, The fluid supply system supplies a fluid into a processing container in which a substrate is processed to process the substrate.

12. The substrate processing method according to claim 11, wherein: A first opening and closing valve is provided in the first branch flow path and downstream of the first heating mechanism. A second on-off valve is provided in the second branch flow path and downstream of the second heating mechanism. A bypass flow path for connecting the first branch flow path with the second branch flow path is provided at a position downstream of the first opening and closing valve and the second opening and closing valve in the fluid supply path. The bypass flow path is provided with a first throttle hole.

13. The substrate processing method according to claim 11, wherein: A first opening and closing valve is provided in the first branch flow path and downstream of the first heating mechanism. A second on-off valve is provided in the second branch flow path and downstream of the second heating mechanism. The substrate processing method includes changing a temperature of the processing fluid flowing into the processing container by exclusively opening and closing the first opening and closing valve and the second opening and closing valve.

14. The substrate processing method according to any one of claims 11 to 13, wherein: The first heating mechanism and the second heating mechanism are arranged in series, The first branch flow path is connected to a first discharge flow path, and the first discharge flow path is used to discharge the treated fluid in the first branch flow path.

15. The substrate processing method according to claim 12 or 13, wherein: The first heating mechanism and the second heating mechanism are arranged in parallel, A first discharge flow path having a first discharge valve is connected to the first branch flow path, and the first discharge flow path is used to discharge the treatment fluid in the first branch flow path. A second discharge flow path having a second discharge valve is connected to the second branch flow path, and the second discharge flow path is used to discharge the treated fluid in the second branch flow path. A third on-off valve is provided in the second branch flow path at a position upstream of the second heating mechanism.

16. The substrate processing method according to claim 15, wherein: Including the following processes: Loading the substrate into the processing container; After the loading process is performed, the second on-off valve and the third on-off valve are opened to supply the processing fluid at the second temperature into the processing container; After the step of supplying the processing fluid at the second temperature, closing the second opening and closing valve and the third opening and closing valve and opening the first opening and closing valve to supply the processing fluid at the first temperature into the processing container; as well as The second discharge valve is opened to reduce the pressure in the second branch flow path. Here, the step of reducing the pressure in the second branch flow channel and the step of supplying the processing fluid at the first temperature into the processing container are performed in parallel.

17. The substrate processing method according to claim 12 or 13, wherein: The method further includes the step of controlling the opening and closing of the first opening and closing valve and the second opening and closing valve according to a processing state of the substrate in the processing container, thereby changing a temperature of the processing fluid flowing into the processing container.

18. The substrate processing method according to any one of claims 11 to 13, wherein: The treatment fluid supply unit has a first supply flow path and a second supply flow path arranged in parallel, The flow rate adjustment mechanism includes a first supply valve provided in the first supply flow path and a second supply valve provided in the second supply flow path. The substrate processing method includes the step of controlling opening and closing of the first supply valve and the second supply valve according to a processing state of the substrate in the processing container, thereby changing a flow rate of the processing fluid flowing into the processing container.

19. The substrate processing method according to claim 12 or 13, wherein: Including the following processes: Loading the substrate into the processing container; Controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, and opening the second on-off valve to supply the processing fluid at the second temperature and the first flow rate into the processing container; as well as After the process of supplying the processing fluid at the first flow rate and the second temperature into the processing container, the flow adjustment mechanism is controlled to supply the processing fluid at the second flow rate to the fluid supply path, and the first on-off valve is opened to supply the processing fluid at the first temperature and the second flow rate into the processing container.

20. The substrate processing method according to claim 17, wherein: A discharge portion is provided, wherein the discharge portion has a third discharge valve for discharging the treatment fluid in the treatment container, The substrate processing method comprises the following steps: Loading the substrate into the processing container; Controlling the flow rate adjustment mechanism to supply the processing fluid to the fluid supply path at a first flow rate, opening the second on-off valve and closing the third discharge valve to supply the processing fluid at the second temperature and the first flow rate into the processing container, thereby increasing the pressure in the processing container; as well as After the process of increasing the pressure in the processing container, the flow adjustment mechanism is controlled to supply the processing fluid to the fluid supply path at a second flow rate, the second on-off valve is closed and the first on-off valve is opened to supply the processing fluid at the first temperature and the second flow rate into the processing container, thereby increasing the pressure in the processing container.

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