Piezoelectric vibration device

Abstract

Provided is a piezoelectric vibration device in which the characteristics of a piezoelectric vibrator can be confirmed without removing a molding resin. A piezoelectric vibration device (1) is provided with at least: a vibrator (2); a molded part (12) that protects at least the piezoelectric vibrator (2); the substrate (11) is composed of a first mounting surface (11a) and a second mounting surface (11b), wherein one main surface of the first mounting surface (11a) is provided with a wiring pattern including a plurality of connection terminals (11d), and the second mounting surface (11b) is provided with a plurality of external connection terminals (11g). In a piezoelectric vibration device (1), at least a piezoelectric vibrator (2) is connected to a plurality of connection terminals (11d), and the piezoelectric vibration device (1) is covered by a molded part (12) so as to include at least the piezoelectric vibrator (2). The substrate (11) has, on the second mounting surface side, an inspection terminal (11k) that is electrically connected to a connection terminal (11d) on which the piezoelectric vibrator (2) is mounted without passing through an external connection terminal (11g).

Description

Technical Field

[0001] The invention relates to a piezoelectric vibration device. Background Art

[0002] The piezoelectric vibration device includes, for example, a crystal oscillator using a crystal oscillator plate. The crystal oscillator has a crystal oscillator plate as a piezoelectric element, a holding member for holding the crystal oscillator plate, and a cover member for sealing the holding member. The crystal oscillator plate of the crystal oscillator is held in the holding member, which is a box-shaped member made of an insulator such as ceramic. The crystal oscillator plate in the holding member of the crystal oscillator is sealed by the cover member in a state where the electrodes of the crystal oscillator plate and the electrodes of the holding member are bonded.

[0003] With the miniaturization of various electronic devices, there is a demand for miniaturization of the package of the piezoelectric vibration device in which the piezoelectric element and the integrated circuit element are mounted on a substrate. Therefore, a piezoelectric vibration device in which the piezoelectric vibrator and the integrated circuit element of a stacked structure are mounted on the substrate is known. For example, the piezoelectric vibration device (electronic component) in which the piezoelectric vibrator (piezoelectric component) described in Patent Document 1 is built-in comprises: a substrate, a first insulator having an external connection terminal (mounting terminal) formed on the lower surface, and a second insulator having a wiring electrode electrically connected to the external connection terminal formed on the upper surface; a piezoelectric vibrator, which is arranged on the surface of the second insulator on which the wiring electrode is formed and is electrically connected to the wiring electrode; and a molding resin, which contains the piezoelectric vibrator and covers the second insulator.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-188825 Summary of the invention

[0007] Technical problem to be solved by the invention

[0008] The piezoelectric vibration device described in Patent Document 1 has a castellated structure recessed toward the inner side of the first insulator on the side surface of the first insulator. A castellated metal film electrically connected to the external connection terminal is formed on the castellated structure. The external connection terminal of the piezoelectric vibration device is extended to the side surface of the first insulator through the castellated metal film. That is, the castellated metal film functions as a part of the external connection terminal. Therefore, when the piezoelectric vibration device is connected to the terminal of the external substrate by solder, the solder adheres to the external connection terminal and the castellated metal film, thereby improving the bonding strength.

[0009] In addition, the castellated metal film located on the side of the first insulator is electrically connected to the piezoelectric vibrator after being molded by the molding resin via the external connection terminal. Therefore, the piezoelectric vibration device can use the castellated metal film to measure the characteristics of the piezoelectric vibrator after molding. The characteristics of the piezoelectric vibrator can be measured by bringing the probe of the inspection device into contact with the castellated metal film located on the side of the first insulator. On the other hand, it is difficult to provide a castellated metal film on the side of the substrate serving as the cut surface for a piezoelectric vibration device manufactured by a method in which a plurality of pieces are molded in a sheet-like state and then cut separately. Therefore, the piezoelectric element device manufactured by the method without the castellated metal film needs to remove the molding resin in order to confirm the characteristics of the piezoelectric vibrator after molding. However, the characteristics of the piezoelectric vibrator may change due to the removal of the molding resin.

[0010] An object of the present invention is to provide a piezoelectric vibration device capable of confirming the characteristics of a piezoelectric vibrator without removing a molding resin.

[0011] Solutions for solving the above technical problems

[0012] The present inventors have studied a piezoelectric vibration device that can confirm the characteristics of a piezoelectric vibrator without removing a mold resin. As a result of intensive studies, the present inventors have conceived the following configuration.

[0013] A piezoelectric vibration device comprises at least: a piezoelectric vibrator; a resin molded part that protects at least the piezoelectric vibrator; and a resin substrate that is composed of a component mounting surface having a wiring pattern including a plurality of pads on one main surface, and a mounting surface having a plurality of external connection terminals for connecting to the wiring pattern and to an external substrate on the other main surface parallel to the one main surface, at least the piezoelectric vibrator is mounted on the component mounting surface in a state connected to the plurality of pads, and at least a portion of the component mounting surface is covered by the resin molded part in a manner that at least includes the piezoelectric vibrator. The resin substrate has an inspection terminal on the mounting surface side that is connected to the pad on which the piezoelectric vibrator is mounted without passing through the external connection terminal.

[0014] In the above-mentioned structure, the piezoelectric vibration device has an inspection terminal electrically connected to a pad on which a piezoelectric vibrator is mounted on the mounting surface side of the resin substrate. The inspection terminal is located on the mounting surface side of the resin substrate that is not molded by the resin mold portion. Therefore, the piezoelectric vibration device can confirm the characteristics of the piezoelectric vibrator through the inspection terminal without removing the resin mold portion of the piezoelectric vibrator. In addition, the circuit for confirming the characteristics of the piezoelectric vibrator is composed of the pad, the inspection terminal, and a circuit wiring that electrically connects the pad to the inspection terminal. Therefore, the measurement result of the characteristics of the piezoelectric vibrator is only affected by the parasitic capacitance contained in the pad, the inspection terminal, and the circuit wiring that electrically connects the pad to the inspection terminal. That is, the circuit for checking the piezoelectric vibrator is configured so that the path from the inspection terminal to the piezoelectric vibrator is as simple as possible. As a result, the characteristics of the piezoelectric vibrator can be confirmed in a state where the influence of parasitic capacitance is suppressed.

[0015] Furthermore, the inspection terminal is located on the mounting surface side of the resin substrate. Therefore, the inspection terminal of the piezoelectric vibration device of the present invention can be provided in a mold-sealed piezoelectric vibration device in which a plurality of devices are manufactured collectively using a collective substrate and then separated into individual devices.

[0016] From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following configuration: the inspection terminal is arranged at a position that does not overlap with the pad on which the piezoelectric vibrator is mounted and the plurality of external connection terminals when viewed from a direction perpendicular to the mounting surface.

[0017] In the above configuration, when viewed from a direction perpendicular to the mounting surface, there is no overlap with the pad on which the piezoelectric vibrator is mounted and the plurality of external connection terminals. That is, the inspection terminal is not directly connected to the pad and the external connection terminal. Therefore, the circuit configuration for inspecting the piezoelectric vibrator is a simple path from the inspection terminal to the piezoelectric vibrator. In addition, the inspection terminal is electrically connected to the pad via circuit wiring. Therefore, the pad will not produce bumps and unevenness on the pad surface caused by direct connection with the inspection terminal, thereby preventing the generation of gaps and the like when the piezoelectric vibrator is mounted on the pad. Thus, the connection reliability between the piezoelectric vibrator and the pad can be maintained. In addition, the characteristics of the piezoelectric vibrator can be confirmed without removing the molding resin and suppressing the influence of parasitic capacitance.

[0018] From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following configuration: The resin substrate is made of any one of glass epoxy resin, polyimide resin, and fluororesin.

[0019] In the above configuration, the resin substrate is made of an insulating material that is easy to process. Therefore, the inspection terminal can be formed at a position that makes the circuit for inspecting the piezoelectric vibrator as simple as possible. In addition, compared with a substrate made of a ceramic material, the resin substrate can reduce the difference in thermal expansion coefficient with the molding resin, thereby reducing the influence of stress caused by the difference in thermal expansion coefficient. As a result, the characteristics of the piezoelectric vibrator can be confirmed while suppressing the influence of molding.

[0020] From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following configuration: The inspection terminal is electrically connected to a conductor filled in a through hole penetrating the resin substrate in a thickness direction, and the conductor is electrically connected to the piezoelectric vibrator.

[0021] In the above configuration, the inspection terminal is electrically connected to the conductor filled in the through hole of the resin substrate. Therefore, the piezoelectric vibrator device can ensure conduction from the mounting surface side to the component mounting surface side without the molding resin entering the interior of the through hole. In addition, the inspection terminal is connected to the pad in the shortest path from the component mounting surface to the mounting surface that passes through the resin substrate in the thickness direction. Therefore, the path from the inspection terminal to the piezoelectric vibrator is simply constructed. As a result, the characteristics of the piezoelectric vibrator can be confirmed without removing the molding resin and suppressing the influence of parasitic capacitance.

[0022] From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following configuration: At least the inspection terminal is covered with an insulating resin.

[0023] In the above configuration, even if the resin substrate contacts an external substrate, the inspection terminal covered with the insulating resin will not be electrically connected to the external substrate. Therefore, the piezoelectric vibrator device can prevent the change in the characteristics of the piezoelectric vibrator caused by the contact between the inspection terminal and the external substrate. On the other hand, the insulating resin covering the inspection terminal can be removed more easily than the molding resin. Therefore, when it is necessary to confirm the characteristics of the piezoelectric vibrator, the characteristics of the piezoelectric vibrator can be confirmed without removing the molding resin.

[0024] From another viewpoint, the piezoelectric vibration device of the present invention preferably includes the following configuration: In the resin substrate, at least a portion of the mounting surface is covered with an insulating resin.

[0025] In the above configuration, in addition to the inspection terminal, at least a portion of the mounting surface of the resin substrate is covered with an insulating resin, so that even if the resin substrate contacts an external substrate, the inspection terminal will not be electrically connected to the external substrate. In addition, the terminals other than the inspection terminal in the mounting surface, the wiring circuit, and the external connection terminals are protected by the insulating resin. Therefore, the piezoelectric vibration device can prevent the inspection terminal and the terminals other than the inspection terminal from contacting the external substrate. On the other hand, the insulating resin covering the inspection terminal can be removed more easily than the molding resin. Thus, in the case where it is necessary to measure the characteristics of the piezoelectric vibrator, the insulating resin can be removed to expose the inspection terminal. Thus, the characteristics of the piezoelectric vibrator can be confirmed without removing the molding resin.

[0026] Effects of the Invention

[0027] According to one embodiment of the present invention, the characteristics of the piezoelectric vibrator can be checked without removing the mold resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a plan view of the piezoelectric vibration device according to the first embodiment of the present invention.

[0029] Figure 2 It is a side view of the vibrator in the piezoelectric vibration device according to the first embodiment of the present invention.

[0030] Figure 3 yes Figure 2 B-section view in the figure.

[0031] Figure 4 This is a bottom view of the vibrator in the piezoelectric vibration device according to the first embodiment of the present invention.

[0032] Figure 5 The piezoelectric vibration device according to the first embodiment of the present invention is in a state where the piezoelectric vibration device is resin molded. Figure 1 A-axis section view.

[0033] Figure 6 This is a plan view showing a first mounting surface that is a component mounting surface of a resin substrate in the piezoelectric vibration device according to the first embodiment of the present invention.

[0034] Figure 7 It is a plan view of a modified example of the piezoelectric vibration device according to the first embodiment of the present invention.

[0035] Figure 8 This is a perspective plan view of a second mounting surface as a mounting surface of a resin substrate in the piezoelectric vibration device according to the first embodiment of the present invention as viewed from the first mounting surface side.

[0036] Fig. 9 yes Figure 6C-section view in the figure.

[0037] Fig.10 This is a plan view showing a state in which a part of insulating resin is removed from the second mounting surface of the resin substrate in the piezoelectric vibration device according to the first embodiment of the present invention.

[0038] Fig.11 It is a top view of a piezoelectric vibration device according to Embodiment 2 of the present invention.

[0039] Fig.12 It is a cross-sectional view in the longitudinal direction of a vibrator in a piezoelectric vibration device according to Embodiment 2 of the present invention.

[0040] Fig.13 It is a plan view showing a first mounting surface of a resin substrate in a piezoelectric vibration device according to a second embodiment of the present invention.

[0041] Fig.14 This is a perspective plan view of the second mounting surface of the resin substrate in the piezoelectric vibration device according to the second embodiment of the present invention as viewed from the first mounting surface side.

[0042] Fig.15 yes Fig.14 D-section view in. DETAILED DESCRIPTION

[0043] Hereinafter, each embodiment will be described with reference to the accompanying drawings. In each figure, the same reference numerals are given to the same parts, and the description of the same parts will not be repeated. In addition, the dimensions of the components in each figure do not faithfully represent the dimensions of the actual components and the dimensional ratios of the components. In addition, in the following embodiments, the "main surface" refers to the surface with the largest area in the object component, or the surface with the largest area when viewed in the thickness direction of the plate-like component.

[0044] In the following description of the piezoelectric vibrator device 1 as an embodiment of the present invention, the length direction of the vibrator 2, 22 and the substrate 11, 31 is set as the "X direction", the width direction is set as the "Y direction", and the direction orthogonal to the X direction and the Y direction as the opening direction of the frame portion 24 in the vibrator 22 and the direction perpendicular to the main surface in the substrate 11, 31 are set as the "Z direction". In addition, in this embodiment, the X direction and the Y direction are directions on the horizontal plane. The Z direction is a vertical direction. However, the definition of this direction is not intended to limit the direction of the piezoelectric vibrator device 1 when it is used.

[0045] In addition, in the following description, expressions such as "fixing", "connecting", "joining", and "installing" (hereinafter referred to as fixing, etc.) include not only cases where components are directly fixed to each other, but also cases where components are fixed via other components. That is, in the following description, the expression fixing, etc. includes the meaning of direct and indirect fixing, etc. of components to each other.

[0046] [Implementation Method 1]

[0047] <Configuration of Piezoelectric Vibration Device 1>

[0048] Next, use Figures 1 to 5 , a piezoelectric vibration device 1 according to Embodiment 1 of the piezoelectric vibration device of the present invention will be described. Figure 1 It is a plan view of the piezoelectric vibration device 1 according to the first embodiment of the present invention. Figure 2 It is a side view of the vibrator 2 in the piezoelectric vibration device 1 . Figure 3 yes Figure 2 B-section view in the figure. Figure 4 It is a bottom view of the vibrator 2 in the piezoelectric vibration device 1 . Figure 5 The piezoelectric vibration device 1 is in a state where it is resin molded. Figure 1 A-axis section view.

[0049] like Figure 1 As shown, the piezoelectric vibration device 1 includes a vibrator 2, an integrated circuit element 10, a substrate 11, and a molded portion 12 (see Figure 5 ).

[0050] like Figures 2 to 4 As shown, the vibrator 2 is a piezoelectric vibrator having a piezoelectric body that converts an applied force into a voltage or converts an applied voltage into a force. The vibrator 2 is a piezoelectric vibrator having a piezoelectric vibration plate 3, a first sealing member 6, and a second sealing member 7. The vibrator 2 has a sandwich structure in which the piezoelectric vibration plate 3 is sandwiched between the first sealing member 6 and the second sealing member 7.

[0051] like Figure 3 As shown, the piezoelectric vibration plate 3 is a rectangular plate-shaped component made of crystal as a piezoelectric material. The piezoelectric vibration plate 3 has a pair of excitation electrodes 4a on one main surface and the other main surface. In addition, the piezoelectric vibration plate 3 has a cutout portion 4b that passes through from one main surface to the other main surface in a manner that surrounds the pair of excitation electrodes 4a and retains a portion. As a result, the portion where the pair of excitation electrodes 4a are located constitutes a vibration portion 4 of a cantilever structure that can vibrate in the Z direction. The piezoelectric vibration plate 3 has a bonding material 5 on both main surfaces that is bonded to the first sealing component 6 and the second sealing component 7 in a manner that surrounds the vibration portion 4.

[0052] like Figure 2As shown, the first sealing member 6 and the second sealing member 7 are members for sealing the vibration portion 4 of the piezoelectric vibration plate 3. The first sealing member 6 and the second sealing member 7 are rectangular plate-shaped members made of the same crystal as the piezoelectric vibration plate 3. The first sealing member 6 and the second sealing member 7 are shaped so as to cover the entire main surface of the piezoelectric vibration plate 3 when the main surface is opposed to the main surface of the piezoelectric vibration plate 3. The first sealing member 6 and the second sealing member 7 have a bonding material 5 bonded to the bonding material 5 of the piezoelectric vibration plate 3 on one main surface.

[0053] One main surface of the piezoelectric vibration plate 3 is covered by the first sealing member 6. The other main surface of the piezoelectric vibration plate 3 is covered by the second sealing member 7. At this time, the bonding material 5 of the piezoelectric vibration plate 3 is diffusely bonded with the bonding material 5 of the first sealing member 6 and the second sealing member 7. Thus, the vibration portion 4 of the piezoelectric vibration plate 3 is hermetically sealed by the first sealing member 6 and the second sealing member 7.

[0054] like Figure 4 As shown, the second sealing member 7 has four vibrator mounting terminals 7a on the other main surface thereof, which are electrically connected to the electrodes of the substrate 11. The four vibrator mounting terminals 7a are plate-shaped terminals made of conductive metal and are located at the four corners of a rectangle.

[0055] The vibrator 2 thus constructed is a package having a three-layer structure in which the two main surfaces of the piezoelectric vibration plate 3 are sealed by the first sealing member 6 and the second sealing member 7, respectively. In addition, the vibrator 2 forms an internal space including the vibration part 4 of the piezoelectric vibration plate 3 by covering the two main surfaces of the piezoelectric vibration plate 3 with the first sealing member 6 and the second sealing member 7. That is, the vibration part 4 of the vibrator 2 including a pair of excitation electrodes 4a is hermetically sealed in the internal space of the package. Inert gas such as nitrogen is sealed in the internal space. The vibrator 2 oscillates at a predetermined frequency by an applied voltage.

[0056] like Figure 1 As shown, the integrated circuit element 10 is an IC for controlling the oscillator 2. The integrated circuit element 10 has an electronic circuit such as an oscillation circuit that generates a predetermined oscillation output by connecting to a temperature sensing element (thermistor) that detects the temperature state of the surroundings. The integrated circuit element 10 outputs the oscillation output generated by the oscillation circuit to the outside through the integrated circuit element mounting terminal 10a as a reference signal such as a clock signal. The portion of the integrated circuit element 10 other than the integrated circuit element mounting terminal 10a is covered with resin.

[0057] The substrate 11 is a resin substrate that electrically connects the vibrator 2 and the integrated circuit element 10 through a wiring pattern and forms an integral body. The substrate 11 is, for example, made of any one of glass epoxy resin, polyimide resin and fluororesin. The substrate 11 is a substrate composed of a single layer. One of the main surfaces of the pair of main surfaces in the substrate 11 is formed as a first mounting surface 11a having the wiring pattern, and the wiring pattern includes four connection terminals 11d, pads, connection pads, etc. formed of a conductor such as copper. The four connection terminals 11d are electrically connected to the wiring pattern including a plurality of pads on the first mounting surface 11a via internal wiring 11c. At least a portion of the internal wiring 11c is covered with insulating resin. In this way, since the single-layer substrate 11 has only the first mounting surface 11a and the second mounting surface 11b, the internal wiring 11c can be simply formed.

[0058] The vibrator 2 and the integrated circuit element 10 are mounted on the first mounting surface 11a of the substrate 11. The vibrator 2 is provided with a second sealing member 7 (see Figure 2 ) is disposed on the substrate 11 so as to face the first mounting surface 11a. The four vibrator mounting terminals 7a (see Figure 4 ) are electrically connected to the four connection terminals 11d of the first mounting surface 11a through the conductive solder H. Similarly, the integrated circuit element mounting terminal 10a of the integrated circuit element 10 is electrically connected to the wiring pattern of the first mounting surface 11a through the wire 10b and the wire connection pad, that is, the wire connection terminal 11p of the first mounting surface 11a. In this way, the vibrator 2 and the integrated circuit element 10 are arranged on the first mounting surface 11a of the substrate 11.

[0059] like Figure 5 As shown in the figure, the other main surface of the substrate 11 parallel to the one main surface is configured as a second mounting surface 11b having an external connection terminal 11g for mounting on an external substrate (not shown). The external connection terminal 11g is a plate-shaped terminal made of conductive metal. The external connection terminal 11g is electrically connected to the wiring pattern including a plurality of pads on the first mounting surface 11a via an internal wiring 11c (not shown).

[0060] The substrate 11 is configured to electrically connect the vibrator 2 and the integrated circuit element 10 mounted on the first mounting surface 11a to an external substrate (not shown) via a wiring pattern (not shown) on the first mounting surface 11a, internal wiring 11c, and external connection terminals 11g on the second mounting surface 11b. Thus, the vibrator 2 oscillates at a predetermined frequency by a voltage applied from the external substrate.

[0061] like Figure 5As shown, the molded portion 12 as a resin molded portion protects at least the vibrator 2 among the substrate 11, the vibrator 2 mounted on the substrate 11, and the integrated circuit element 10. The molded portion 12 is a thermosetting resin such as epoxy resin. The molded portion 12 covers at least a portion of the vibrator 2 among the substrate 11, the vibrator 2 mounted on the substrate 11, and the integrated circuit element 10 using the thermosetting epoxy resin. In the present embodiment, the molded portion 12 covers the first mounting surface 11a of the substrate 11, the vibrator 2 mounted on the first mounting surface 11a of the substrate 11, and the integrated circuit element 10. On the other hand, the second mounting surface 11b of the substrate 11 is not molded by the molded portion 12.

[0062] Next, use Figure 6 , the first mounting surface 11 a and the connection terminals 11 d of the substrate 11 will be described in detail. Figure 6 It is a plan view showing the first mounting surface 11 a which is a component mounting surface of the substrate 11 in the piezoelectric vibration device 1 .

[0063] like Figure 6 As shown in FIG. 1 , the first mounting surface 11a of the substrate 11 is a main surface that is electrically connected to the vibrator 2 and the integrated circuit element 10. The first mounting surface 11a has a recess 11f. The recess 11f is a rectangular recess that extends in the X direction and the Y direction when viewed from the Z direction. The recess 11f is a recess that allows the vibrator mounting terminal 7a (see FIG. 1 ) of the vibrator 2 to be inserted. Figure 2 ) are respectively arranged inside. The substantially L-shaped connection terminals 11d are respectively located in the recessed portions 11f. That is, the substrate 11 has four connection terminals 11d. The connection terminals 11d are plate-shaped terminals made of conductive metal.

[0064] The connection terminals 11d protrude from the bottom surface of each recess 11f in the Z direction. The main surfaces of the four connection terminals 11d (hereinafter, simply referred to as "connection terminals 11d") are configured as joint surfaces 11e that are respectively joined to the four vibrator mounting terminals 7a of the vibrator 2. The joint surfaces 11e are located closer to the second mounting surface 11b than the first mounting surface 11a. That is, the joint surface 11e is more recessed than the first mounting surface 11a. The joint surface 11e is not covered by the insulating base material of the substrate 11 and is exposed.

[0065] Furthermore, the internal wiring 11c is connected to the connection terminal 11d. The internal wiring 11c is made of a conductive metal. The internal wiring 11c connects the wiring pattern of the first mounting surface 11a with the external connection terminal 11g (see Figure 8 The internal wiring 11c is connected to each connection terminal 11d in the recess 11f.

[0066] Figure 7 FIG. 1 is a top view of a modified example of the piezoelectric vibration device 1. Figure 7As shown, the piezoelectric vibrator device 1 may also be a structure in which the vibrator mounting terminal 7a of the vibrator 2 is connected to the wire connection terminal 11p of the first mounting surface 11a by the wire 10b. The vibrator 2 is arranged on the first mounting surface 11a in such a manner that the vibrator mounting terminal 7a can be visually recognized when the first mounting surface 11a of the substrate 11 is observed from the Z direction. The vibrator mounting terminal 7a is electrically connected to the wiring pattern of the first mounting surface 11a through the wire 10b and the wire connection terminal 11p of the first mounting surface 11a. In this way, the vibrator 2 and the integrated circuit element 10 may be not only a structure in which the vibrator 2 and the integrated circuit element 10 are electrically connected to the wiring pattern of the substrate 11 using solder, a bonding material, an adhesive material, etc., but also a structure in which the vibrator 2 and the integrated circuit element 10 are electrically connected to the wiring pattern of the substrate 11 using the wire 10b. In addition, a metal bump may be used as a bonding material.

[0067] Next, use Figure 8 , the second mounting surface 11b and the external connection terminals 11g of the substrate 11 are described in detail. Figure 8 It is a plan view showing the second mounting surface 11 b which is the mounting surface of the substrate 11 in the piezoelectric vibration device 1 .

[0068] like Figure 8 As shown, the second mounting surface 11b of the substrate 11 is the main surface of the other side that is electrically connected to the external substrate not shown. The second mounting surface 11b has four external connection terminals 11g at the four corners. In addition, the second mounting surface 11b has four recesses 11j corresponding to the four external connection terminals 11g. The four recesses 11j are step portions that are recessed in a direction perpendicular to the second mounting surface 11b in an arbitrarily determined range. When viewed from the Z direction, the four recesses 11j are respectively located at the four corners that include the intersection of the long side and the short side of the substrate 11, that is, the vertex. In addition, each of the four recesses 11j is recessed in a range that includes a part of the long side and a part of the short side that are the outer edge of the substrate 11 extending from the vertex. The recesses 11j are of a shape that can respectively arrange the mounting terminals of the external substrate inside.

[0069] The external connection terminal 11g is configured as a terminal whose main surface on one side is joined to a connection terminal of an external substrate (not shown). The four external connection terminals 11g (hereinafter referred to as "external connection terminals 11g") are roughly rectangular plate-shaped terminals made of conductive metal. The external connection terminals 11g are respectively located in the four recesses 11j. The external connection terminals 11g are respectively formed in a roughly rectangular shape. The external connection terminal 11g has a bonding surface 11h on the main surface that is joined to the connection terminal of the external substrate. The bonding surface 11h is not covered by the insulating base material of the substrate 11 and is exposed. The bonding surface 11h is located closer to the first mounting surface 11a than the second mounting surface 11b. That is, the bonding surface 11h is more recessed than the first mounting surface 11a.

[0070] The internal wiring 11c is connected to the external connection terminal 11g. The internal wiring 11c passes through the inside of the substrate 11 and is located in the recess 11j. The external connection terminal 11g is joined to a connection terminal of an external substrate (not shown) by solder or the like.

[0071] Next, use Figure 6 , Figures 8 to 10 , the inspection terminal 11k in the substrate 11 is described. Fig. 9 yes Figure 6 C-section view in the figure. Fig.10 It is a plan view showing a state where a part of the insulating resin on the second mounting surface 11 b of the substrate 11 in the piezoelectric vibration device 1 is removed.

[0072] like Figure 6 , Figures 8 to 10 As shown, the inspection terminal 11k is a terminal used when confirming the characteristics of the vibrator 2 mounted on the first mounting surface 11a of the substrate 11. In the piezoelectric vibration device 1, a pair of inspection terminals 11k are provided so as to correspond to the two electrodes of the vibrator 2. In the following embodiments, the inspection terminal 11k refers to a pair of inspection terminals 11k unless otherwise specified.

[0073] A pair of inspection terminals 11k (hereinafter referred to as "inspection terminals 11k") are terminals electrically connected to the connection terminals 11d on the first mounting surface 11a side to which the vibrator 2 is electrically connected via a wiring circuit or the like. The inspection terminals 11k are located on the second mounting surface 11b side. In the present embodiment, the inspection terminals 11k are located on a substantially coplanar surface with the second mounting surface 11b. The inspection terminals 11k are connected to the conductors 11n (see Fig. 9 ), and the conductor 11n in the through hole covers at least the inner peripheral surface of the through hole (through hole) extending from the first mounting surface 11a side to the second mounting surface 11b side of the substrate 11. In this embodiment, the inspection terminal 11k is integrally formed with the conductor 11n filled in the through hole. The conductor 11n is preferably a conductor of the same type as the connection terminal 11d.

[0074] In addition, connection pads, which are annular conductors having an outer diameter larger than the inner diameter of the through hole, are located at both ends of the through hole. The inspection terminal 11k is electrically connected to the connection pads. With this configuration, when viewed from a direction perpendicular to the first mounting surface 11a of the substrate 11, since the area of ​​the inspection terminal 11k is smaller than that of the connection terminal 11d, etc., the degree of freedom of configuration is increased, and space saving of the substrate 11 can be achieved.

[0075] like Figure 6As shown in FIG. 1 , the inspection terminal 11k is located in an area surrounded by four connection terminals 11d, which are pads on which the vibrator 2 is mounted. At this time, the inspection terminal 11k is arranged at a position that does not overlap with the connection terminal 11d when viewed from a direction perpendicular to the first mounting surface 11a. That is, the end of the conductor 11n on the first mounting surface 11a side that is electrically connected to the inspection terminal 11k is not directly connected to the connection terminal 11d.

[0076] like Figure 8 As shown in FIG. 1 , the inspection terminal 11k is located in a region surrounded by the external connection terminal 11g. At this time, when viewed from a direction perpendicular to the first mounting surface 11a, the inspection terminal 11k is arranged at a position that does not overlap with the external connection terminal 11g. That is, the inspection terminal 11k is not directly connected to the external connection terminal 11g. Of course, the conductor 11n electrically connected to the inspection terminal 11k is not directly connected to the connection terminal 11d and the external connection terminal 11g.

[0077] like Figure 6 and Fig. 9 As shown in FIG. 1 , the end of the conductor 11n on the first mounting surface 11a side, to which a pair of inspection terminals 11k are respectively connected, is located on a substantially coplanar surface with the first mounting surface 11a. The end of the conductor 11n on the first mounting surface 11a side is electrically connected to one end of each different internal wiring 11m. The other end of each internal wiring 11m is electrically connected to the corresponding connection terminal 11d. That is, the end of the conductor 11n on the first mounting surface 11a side is electrically connected to the corresponding connection terminal 11d via the internal wiring 11m. The inspection terminal 11k and the internal wiring 11m are covered with an insulating resin.

[0078] The inspection terminal 11k is located on the substantially same plane as the second mounting surface 11b. The end of the conductor 11n on the first mounting surface 11a side to which the inspection terminal 11k is connected is electrically connected to the connection terminal 11d and the internal wiring, etc. That is, the pair of inspection terminals 11k are electrically connected to the connection terminal 11d on the first mounting surface 11a side, respectively, without passing through the external connection terminal 11g on the second mounting surface 11b side.

[0079] like Figure 8As shown, at least the inspection terminal 11k in the second mounting surface 11b is covered with an insulating resin. Furthermore, at least a portion of the second mounting surface 11b of the substrate 11 is covered with an insulating resin. That is, the inspection terminal 11k and at least a portion of the second mounting surface 11b are covered with an insulating resin. The insulating resin is a resin that can be removed from the inspection terminal 11k by a physical or scientific method. The insulating resin covering the inspection terminal 11k has a thickness that allows the inspection terminal 11k to be visually recognized from the outside through the insulating resin. Therefore, the piezoelectric vibration device 1 is configured to be able to grasp the position of the inspection terminal 11k covered by the insulating resin from above the insulating resin. As a result, the piezoelectric vibration device 1 can easily determine the removal object position for exposing the end of the inspection terminal 11k.

[0080] The inspection terminal 11k is electrically connected to the vibrator 2 via the conductor 11n, the internal wiring 11m, and the connection terminal 11d. The inspection terminal 11k is located in the non-molded portion 12 (see Figure 5 Therefore, the inspection terminal 11k can establish an electrical connection with the vibrator 2 molded by the mold portion 12 from the end portion on the second mounting surface 11b side.

[0081] The piezoelectric vibration device 1 having the inspection terminal 11k is configured to be electrically connected to an external substrate in a state where the vibrator 2 and the integrated circuit element 10 are molded by the molding portion 12. At this time, since the inspection terminal 11k located on the second mounting surface 11b side is covered with the insulating resin, even if the second mounting surface 11b of the substrate 11 contacts the external substrate, the inspection terminal 11k is not electrically connected to the external substrate. In addition, the terminals other than the inspection terminal 11k, the wiring circuit, and the external connection terminal on the second mounting surface 11b of the substrate 11 are protected by the insulating resin. Therefore, the piezoelectric vibration device 1 can prevent the inspection terminal 11k and the terminals other than the inspection terminal 11k from contacting the external substrate. On the other hand, the piezoelectric vibration device 1 is configured to be able to visually recognize the inspection terminal 11k through the insulating resin. Therefore, in order to expose the inspection terminal 11k, the piezoelectric vibration device 1 can easily remove the insulating resin covering the inspection terminal 11k.

[0082] like Fig.10 As shown, when measuring the characteristics of the vibrator 2 molded by the molded portion 12, the insulating resin covering the insulating region 11o of the inspection terminal 11k is removed. The piezoelectric vibrator device 1 makes the probes of the inspection device (not shown) contact the pair of inspection terminals 11k exposed on the second mounting surface 11b side of the substrate 11. The vibrator 2 is electrically connected to the inspection device via the pair of inspection terminals 11k, the conductor 11n, and the internal wiring 11m. The characteristics of the vibrator 2 are measured according to a predetermined procedure.

[0083] The piezoelectric vibration device 1 configured in this manner has a test terminal 11k that can be electrically connected to the vibrator 2 on the first mounting surface 11a side of the substrate 11. The test terminal 11k is located on the second mounting surface 11b side of the substrate 11 that is not molded by the mold portion 12. Therefore, the piezoelectric vibration device 1 can confirm the characteristics of the vibrator 2 through the test terminal 11k without removing the resin mold of the vibrator 2.

[0084] Furthermore, the circuit for testing the vibrator 2 is formed as short and simple as possible by the connection terminal 11d, the test terminal 11k, the conductor 11n electrically connecting the connection terminal 11d and the test terminal 11k, and the internal wiring 11m. Thus, the measurement result of the vibrator 2 is only affected by the parasitic capacitance included in the connection terminal 11d, the test terminal 11k, the conductor 11n electrically connecting the connection terminal 11d and the test terminal 11k, and the internal wiring 11m.

[0085] In addition, the inspection terminal 11k is electrically connected to the connection terminal 11d via the internal wiring 11m. Therefore, the connection terminal 11d does not have unevenness or the like caused by direct connection with the inspection terminal 11k, which is a conductor filled in the through hole of the substrate 11, thereby preventing the generation of gaps or the like when the vibrator 2 is mounted on the connection terminal 11d. Therefore, even if the inspection terminal 11k is provided, the connection reliability between the vibrator 2 and the connection terminal 11d is not impaired.

[0086] In addition, the inspection terminal 11k is electrically connected to the conductor 11n filled in the through hole formed in the substrate 11. Therefore, the piezoelectric vibration device 1 can ensure conduction from the first mounting surface 11a to the second mounting surface 11b without the molding resin entering the inside of the through hole. In addition, the inspection terminal 11k is connected to the connection terminal 11d by the shortest path that penetrates the substrate 11 in the thickness direction. Therefore, the path from the inspection terminal 11k to the vibrator 2 is simply constructed.

[0087] Therefore, the characteristics of the vibrator 2 can be checked without removing the mold resin and with the influence of the parasitic capacitance suppressed.

[0088] In addition, the substrate 11 is made of an insulating material that is easy to process, such as glass epoxy resin, polyimide resin, and fluororesin. Therefore, the inspection terminal 11k can be formed at a position that makes the circuit for inspecting the vibrator 2 as simple as possible. In addition, the substrate 11 can reduce the difference in thermal expansion coefficient with the molding resin compared to a substrate made of a ceramic material, so the influence of stress caused by the difference in thermal expansion coefficient can be reduced.

[0089] [Implementation Method 2]

[0090] <Configuration of Piezoelectric Vibration Device 21>

[0091] Next, use Figures 11 to 14 , a piezoelectric vibration device 21 according to a second embodiment of the piezoelectric vibration device of the present invention will be described. Fig.11 It is a plan view of a piezoelectric vibration device 21 according to Embodiment 2 of the present invention. Fig.12 1 is a cross-sectional view taken along the longitudinal direction of the vibrator 22 in the piezoelectric vibrator device 21 . Fig.13 1 is a plan view showing a first mounting surface of the substrate 31 in the piezoelectric vibration device 21 . Fig.14 1 is a plan view showing the second mounting surface of the substrate 31 in the piezoelectric vibration device 21 . Fig.15 yes Fig.14 In the following embodiments, the specific description of the same points as those in the embodiments already described is omitted, and the description will be centered around the different parts.

[0092] like Fig.11 As shown, the piezoelectric vibration device 21 includes a vibrator 22, an integrated circuit element 30, a substrate 31, and a molded portion 12 (see Figure 5 ).

[0093] like Fig.12 As shown in FIG. 1 , the vibrator 22 is a piezoelectric vibrator having a piezoelectric body that converts an applied force into a voltage or converts an applied voltage into a force. The vibrator 22 has a piezoelectric vibration plate 23 , a first sealing member 27 , and a second sealing member 28 .

[0094] The piezoelectric vibration plate 23 is a rectangular crystal vibration piece obtained by cutting the crystal in a specific direction. The piezoelectric vibration plate 23 includes a frame portion 24, a vibration portion 25, and a connection portion 26. The frame portion 24, the vibration portion 25, and the connection portion 26 of the piezoelectric vibration plate 23 are integrally formed. That is, the frame portion 24, the vibration portion 25, and the connection portion 26 constitute a single component.

[0095] The frame 24 is a member surrounding the vibrating portion 25. When viewed from above, i.e., in the Z direction, the frame 24 is composed of a rectangular plate. When viewed from the Z direction, the frame 24 is a frame-shaped member having a rectangular opening portion on each of the pair of main surfaces. That is, the frame 24 has a rectangular through hole 24c that penetrates from one main surface toward the other main surface.

[0096] The vibration part 25 is a piezoelectric body. The vibration part 25 is a plate having a substantially rectangular shape in a direction perpendicular to a pair of main surfaces having the largest area, i.e., in a plan view. The vibration part 25 is located within the frame of the frame part 24. A portion of the vibration part 25 is connected to the frame part 24 via a plate-shaped connecting part 26. The vibration part 25 is held in a cantilever supported state on the frame part 24 via the connecting part 26. The vibration part 25 has a pair of excitation electrodes 25a. The pair of excitation electrodes 25a is connected to the vibrator mounting terminal 24d.

[0097] The first sealing member 27 and the second sealing member 28 as sealing members are members for sealing the inside of the frame 24. When viewed from the Z direction, the first sealing member 27 and the second sealing member 28 are rectangular members. The first sealing member 27 and the second sealing member 28 are made of metal, for example. The first sealing member 27 and the second sealing member 28 are smaller than the frame 24 and larger than the opening of the frame 24. The first sealing member 27 and the second sealing member 28 are bonded to the bonding surface 24a of the main surface of the frame 24 by a bonding material 33 which is a thermoplastic adhesive. The first sealing member 27 and the second sealing member 28 block the opening of the frame 24.

[0098] The vibrator 22 configured as described above is configured as a three-layer structure including a piezoelectric vibration plate 23, a first sealing member 27 and a second sealing member 28 for closing an opening portion of the piezoelectric vibration plate 23. The vibrator 22 has an internal space S formed by the frame portion 24 of the piezoelectric vibration plate 23, the first sealing member 27 and the second sealing member 28. The vibrating portion 25 of the vibrator 22 is located in the internal space S. In addition, an inert gas such as nitrogen is sealed in the internal space S. The vibrator 22 oscillates at a predetermined frequency by a voltage applied from each vibrator mounting terminal 24d.

[0099] like Fig.11 As shown in FIG. 1 , the integrated circuit element 30 is an IC for controlling the oscillator 22. The configuration of the integrated circuit element 30 is the same as that of the integrated circuit element 10 of the first embodiment, and therefore the description thereof will be omitted.

[0100] The substrate 31 is a single-layer resin substrate that electrically connects the vibrator 22 and the integrated circuit element 30 through a wiring pattern (not shown) and forms an integral body. The substrate 31 uses, for example, any of glass epoxy resin, polyimide resin, and fluororesin, which are insulators that are easy to process such as cutting, as a base material. The substrate 31 can easily form a piezoelectric vibrator device 21 having an arbitrary shape. The substrate 31 is a rectangular plate.

[0101] like Fig.13 As shown, one main surface of the substrate 31 is configured as a first mounting surface 31a having the wiring pattern including pads and connection pads formed of a conductor such as copper. The vibrator 22 and the integrated circuit element 30 (see Fig.11 ). The two vibrator mounting terminals 24d of the vibrator 2 (see Fig.12 ) are electrically connected to the two connection terminals 31d of the first mounting surface 31a respectively through a conductive bonding material. The second sealing component 28 of the vibrator 2 is located at a position opposite to the first mounting surface 31a. The second sealing component 28 is in contact with the first mounting surface 31a. Similarly, the integrated circuit element mounting terminals 30a of the integrated circuit element 30 are electrically connected to the wiring patterns of the first mounting surface 31a of the substrate 31 respectively through a conductive bonding material.

[0102] like Fig.14 As shown in the figure, the other main surface of the substrate 31 parallel to the main surface is configured as a second mounting surface 31b having an external connection terminal 31f for mounting on an external substrate. The external connection terminal 31f is a plate-shaped terminal made of conductive metal. The wiring pattern of the first mounting surface 31a is electrically connected to the external connection terminal 31f via the internal wiring 31c.

[0103] like Fig.11 and Fig.12 As shown, the vibrator 22 mounted on the substrate 31 is electrically connected to the external substrate from the vibrator mounting terminal 24d via the connection terminal 31d on the first mounting surface 31a, the internal wiring 31c and the external connection terminal 31f on the second mounting surface 31b (see Fig.11 ). In addition, the vibrating portion 25 of the vibrator 22 is held in a cantilevered state by the frame portion 24 of the piezoelectric vibrating plate 23 via the connecting portion 26. Thus, the vibrating portion 25 oscillates at a predetermined frequency by a voltage applied from an external substrate.

[0104] The molded portion (not shown) protects at least the resonator 22 among the substrate 31, the resonator 22 mounted on the substrate 31, and the integrated circuit element 30. Since the molded portion is the same as the molded portion 12 in the first embodiment, the description thereof is omitted.

[0105] Next, use Fig.13 , the first mounting surface 31a and the connection terminals 31d of the substrate 31 are described in detail.

[0106] like Fig.13 As shown in FIG. 1 , two connection terminals 31d are located on the first mounting surface 31a. The connection terminals 31d are plate-shaped terminals made of conductive metal. The main surfaces of the two connection terminals 31d (hereinafter referred to as "connection terminals 31d") are configured to be respectively connected to the two vibrator mounting terminals 24d (refer to FIG. 24) of the vibrator 22. Fig.12 The bonding surface 31e is not covered by the insulating base material of the substrate 31 and is exposed.

[0107] Furthermore, the internal wiring 31c is connected to the connection terminal 31d. The internal wiring 31c is made of a conductive metal. The internal wiring 31c connects the wiring pattern of the first mounting surface 31a with the external connection terminal 31f (see Fig.14 The internal wiring 31c is connected to each connection terminal 31d.

[0108] Next, use Fig.14 , the second mounting surface 31b and the external connection terminals 31f of the substrate 31 are described in detail. Fig.141 is a plan view showing the second mounting surface 31b of the substrate 31 in the piezoelectric vibration device 21. In the present embodiment, four external connection terminals 31f are provided on the second mounting surface 31b.

[0109] like Fig.14 As shown, the second mounting surface 31b of the substrate 31 is the other main surface electrically connected to the external substrate. The second mounting surface 31b has four recesses 31g corresponding to the four external connection terminals 31f. The second mounting surface 31b and the external connection terminals 31f are the same as the second mounting surface 11b and the external connection terminals 11g in the first embodiment, so the description is omitted.

[0110] Next, use Figures 13 to 15 , the inspection terminal 31h in the substrate 31 is described.

[0111] like Fig.13 As shown in the figure, the inspection terminal 31h is a terminal used when measuring the characteristics of the vibrator 22 in the state of being mounted on the first mounting surface 31a of the substrate 31. A pair of inspection terminals 31h are provided in the piezoelectric vibrating device 21 in a manner corresponding to the two electrodes of the vibrator 22. In the following embodiments, unless otherwise specified, the inspection terminal 31h refers to a pair of inspection terminals 31h. The configuration of the inspection terminal 31h is the same as that of the inspection terminal 11k in the first embodiment, and therefore the description thereof is omitted.

[0112] When viewed from a direction perpendicular to the first mounting surface 31a, the inspection terminal 31h is arranged at a position that does not overlap with the connection terminal 31d, which is a pad on which the vibrator 22 is mounted. That is, the inspection terminal 31h is not directly connected to the connection terminal 31d. In addition, the end of the conductor 31k on the first mounting surface 31a side electrically connected to the inspection terminal 31h is not directly connected to the connection terminal 31d.

[0113] like Fig.14 As shown, when viewed from a direction perpendicular to the first mounting surface 31a, the inspection terminal 31h is arranged at a position that does not overlap with the external connection terminal 31f. That is, the inspection terminal 31h is not directly connected to the external connection terminal 31f. The inspection terminal 31h is electrically connected to the end of the conductor 31k in the through hole on the second mounting surface 31b side, and the conductor 31k in the through hole covers at least the inner peripheral surface of the through hole (through hole) extending from the first mounting surface 31a side of the substrate 31 toward the second mounting surface 31b side. Of course, the conductor 31k electrically connected to the inspection terminal 31h is not directly connected to the connection terminal 31d and the external connection terminal 31f.

[0114] like Fig.15As shown in FIG. 1 , the ends of the conductor 31k electrically connected to the pair of inspection terminals 31h on the first mounting surface 31a side are electrically connected to one end of different internal wirings 31j. The other end of each internal wiring 31j is electrically connected to the corresponding connection terminal 31d. That is, the pair of inspection terminals 31h are electrically connected to the corresponding connection terminals 31d via the conductor 31k and the internal wiring 31j.

[0115] The inspection terminal 31h is not electrically connected to the external connection terminal 31f and the internal wiring. That is, the inspection terminal 31h is not electrically connected to the connection terminal 31d on the second mounting surface 31b side via the external connection terminal 31f on the second mounting surface 31b side. The end of the inspection terminal 31h on the second mounting surface 31b side and the internal wiring 31c are covered with insulating resin. At least the inspection terminal 31h on the second mounting surface 31b is covered with insulating resin.

[0116] The inspection terminal 31h is electrically connected to the vibrator 2 via the conductor 31k, the internal wiring 31j, and the connection terminal 31d. In addition, the inspection terminal 31h is located on the second mounting surface 31b side that is not molded by the molded portion 12. Therefore, the inspection terminal 31h can establish an electrical connection with the vibrator 2 molded by the molded portion 12 from the end portion on the second mounting surface 31b side.

[0117] [Other embodiments]

[0118] In the above embodiment, the substrates 11 and 31 have the recesses 11j and 31g for each external connection terminal 11g and 31f. However, the substrate may not have a recess for each external connection terminal. A plurality of external connection terminals of the substrate may be located in one recess.

[0119] In the above embodiment, the piezoelectric vibration device 1 includes the vibrator 2 having a three-layer structure in which the piezoelectric vibration plate 3, the first sealing member 6, and the second sealing member 8 are stacked. However, the piezoelectric vibration device may include a vibrator having a structure of more than three layers. The vibrator may also be a four-layer vibrator in which a sensor such as a thermistor is further mounted on the main surface of the first sealing member.

[0120] Furthermore, in the above-described embodiments, the piezoelectric vibration devices 1 and 21 are formed of the single-layer substrates 11 and 31. However, the piezoelectric vibration device may be formed of a multilayer substrate having a plurality of layers.

[0121] Furthermore, in the above-described embodiment, the inspection terminals 11k and 31h have lands, but the inspection terminals do not necessarily have to have lands.

[0122] In addition, in the above-mentioned embodiment, the inspection terminals 11k and 31h are located on the substantially same plane as the second mounting surfaces 11b and 31b. However, the inspection terminal may be located closer to the first mounting surface than the second mounting surface. That is, the inspection terminal may be more recessed than the second mounting surface. In addition, the inspection terminal may be more protruding than the second mounting surface.

[0123] In the above embodiment, the vibrators 2 and 22 of the piezoelectric vibrating devices 1 and 21 and the integrated circuit elements 10 and 30 are molded by the molding portion 12. However, the vibrators and the integrated circuit elements of the piezoelectric vibrating devices may not be molded. The piezoelectric vibrating device may also be configured such that the vibrators and the integrated circuit elements are housed in a frame.

[0124] Furthermore, in the above-described embodiment, the inspection terminals 11k and 31h are covered with the insulating resin. However, the inspection terminals may not be covered with the insulating resin.

[0125] In the above embodiment, the inspection terminals 11k and 31h covered with insulating resin are configured to be visible from the outside. However, the inspection terminals covered with insulating resin may not be visible from the outside. The piezoelectric vibration device may have a mark or the like that can identify the position of the inspection terminal.

[0126] Although the embodiments of the present invention have been described above, the above embodiments are merely examples for implementing the present invention. Therefore, the present invention is not limited to the above embodiments, but can be implemented by appropriately modifying the above embodiments within the scope of the present invention.

[0127] Description of Reference Numerals

[0128] 1.21 Piezoelectric vibration device

[0129] 2.22 vibrators

[0130] 3.23 Piezoelectric vibration plate

[0131] 4.25 Vibration part

[0132] 4a, 25a excitation electrodes

[0133] 4b incision

[0134] 5. Bonding materials

[0135] 26 Connection

[0136] 6, 27 1st sealing component

[0137] 7, 28 second sealing member

[0138] 24 frame

[0139] 24c through hole

[0140] 10, 30 integrated circuit components

[0141] 10a, 30a integrated circuit component mounting terminals

[0142] 10b wire

[0143] 11.31 substrate

[0144] 11a, 31a 1st mounting surface

[0145] 11b, 31b Second mounting surface

[0146] 11c, 11m, 31c, 31j internal wiring

[0147] 11d, 31d connection terminals

[0148] 11g, 31f external connection terminals

[0149] 11e, 11h, 24a, 31e joint surface

[0150] 11f, 11j, 31g concave parts

[0151] 11k, 31h check terminal

[0152] 11n, 31k conductor

[0153] 11 o Insulation area

[0154] 11p Wire connection terminal

[0155] 12Molding Department

[0156] 33Jointing materials

[0157] 7a, 24d Vibrator mounting terminal

[0158] S interior space.

Claims

1. A piezoelectric vibration device, comprising at least: Piezoelectric vibrator; A resin molded portion for protecting at least the piezoelectric vibrator; A resin substrate, comprising a component mounting surface having a wiring pattern including a plurality of pads on one main surface, and a mounting surface having a plurality of external connection terminals for connecting to the wiring pattern and to an external substrate on another main surface parallel to the one main surface, At least the piezoelectric vibrator is mounted on the component mounting surface in a state of being connected to the plurality of pads, and at least a portion of the component mounting surface is covered by the resin mold portion so as to include at least the piezoelectric vibrator. The piezoelectric vibration device is characterized in that The resin substrate includes, on the mounting surface side, an inspection terminal electrically connected to a pad on which the piezoelectric vibrator is mounted, not via the external connection terminal.

2. The piezoelectric vibration device according to claim 1, wherein The inspection terminal is arranged at a position that does not overlap with the pad on which the piezoelectric vibrator is mounted and the plurality of external connection terminals when viewed from a direction perpendicular to the mounting surface.

3. The piezoelectric vibration device according to claim 1 or 2, wherein: The resin substrate is made of any one of glass epoxy resin, polyimide resin and fluororesin.

4. The piezoelectric vibration device according to claim 1 or 2, wherein: The inspection terminal is electrically connected to a conductor filled in a through hole penetrating the resin substrate in a thickness direction, and the conductor is electrically connected to the piezoelectric vibrator.

5. The piezoelectric vibration device according to claim 1 or 2, wherein: At least the inspection terminal is covered with insulating resin.

6. The piezoelectric vibration device according to claim 5, wherein: In the resin substrate, at least a portion of the mounting surface is covered with an insulating resin.

Images