Optoelectronic tweezers chip

Abstract

The present application relates to the technical field of optical tweezers technology, and more particularly to an optoelectronic tweezers chip. The technical scheme comprises an upper cover plate, a lower cover plate and a support column, which together form an optoelectronic tweezers operation chamber for optoelectronic control. The upper cover plate comprises a support layer, a conductive layer and a surface modification film. The upper cover plate is provided with a liquid injection hole and a liquid outlet hole. The lower cover plate comprises a support layer, a conductive layer, a photoconductive layer and a surface modification film. The photoconductive layer is a light-induced material. The lower cover plate can further comprise a second conductive layer and a second surface modification film. The support column is used to enclose a sealed operation chamber. When viewed from the upper cover plate to the lower cover plate direction, it is ensured that the liquid injection hole and the liquid outlet hole do not overlap with the area of the support column. Through the improvement of the structure design and the selection of materials, the present application realizes the flexible adjustment of the chamber height, the effective prevention of the adhesion phenomenon, the improvement of the manufacturing durability and the efficient control of various small objects.

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