An optoelectronic conversion component packaging device

By designing and collecting components in the photoelectric conversion component packaging equipment, cleaning debris on the tool and collecting debris, the pin roughness and short circuit problems caused by debris on the tool are solved, which improves the stability and yield of the components and reduces production costs.

CN120002912BActive Publication Date: 2025-07-25HARBIN INST OF TECH (SHENYANG) INTELLIGENT IND TECH CO LTD
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Patent Information

Application Number
CN202510482781.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-04-17
Publication Date
2025-07-25
Estimated Expiration
2045-04-17

AI Technical Summary

Technical Problem

When the existing photoelectric conversion component packaging equipment cuts the substrate pins, debris attached to the tool causes the pin surface roughness to increase, forming burrs, which in turn causes short circuit problems and affect component stability and equipment performance.

Method used

A photoelectric conversion component packaging device is designed, which includes cleaning components and collection components. Debris on the tool is cleaned by cleaning brushes, and cleaned debris through the collection box to keep the tool clean and avoid debris adhering.

Benefits of technology

Maintain the cleanliness of the tool, avoid the increase in pin surface roughness and short circuit problems, improve the stability and yield of the photoelectric conversion components, and reduce production costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention belongs to the technical field of photoelectric conversion component packaging, and specifically is a photoelectric conversion component packaging device, comprising a work cabinet, wherein a fixed mold is fixedly connected inside the work cabinet, and the fixed mold is used to receive a substrate to be plastic-sealed. A manipulator is slidably connected to the inner wall of the work cabinet. The present invention cleans the debris attached to a tool by rotating a cleaning brush, thereby maintaining the cleanliness of the tool, so that the tool is kept clean when it is used again, and avoids the problem that when the tool on the existing photoelectric conversion component packaging device is used again, the debris attached to the tool increases the surface roughness of the cut pin and causes burrs after the substrate is cut, and further avoids the problem that the metal burrs on the pins of the formed photoelectric conversion component form a short circuit between the circuit boards after the pins are connected to the circuit board, so that the pin surface of the photoelectric conversion component after cutting is no longer attached with debris, and the stability of the photoelectric conversion component is guaranteed.
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Description

Technical Field

[0001] The present invention belongs to the technical field of optoelectronic conversion component packaging, and specifically relates to an optoelectronic conversion component packaging device. Background Art

[0002] With the continuous progress of electronic technology, optoelectronic conversion components, as the core components of electronic products, play an increasingly important role in electronic products. In the existing optoelectronic conversion component packaging device, a worker uses a manipulator to place the bonded substrate into a plastic packaging mold, inject epoxy resin molten liquid into the plastic packaging mold, take it out after cooling and shaping, and cut the pins on the substrate with a tool to separate the pins from the substrate, thereby separating and forming multiple optoelectronic conversion components packaged on the substrate.

[0003] When using the tool in the above-mentioned optoelectronic conversion component packaging device to cut the pins on the substrate, the tool inevitably contacts the pins. Since the pins are usually made of metal or alloy, when the tool cuts the pins, the pin material is deformed and fractured by applying pressure and shear force. During this process, the pins break and generate debris, and some debris adheres to the surface of the tool. As the tool cuts the leads again, the surface roughness of the cut pins increases and burrs appear, causing the metal burrs on the pins to form a short circuit between the circuit boards after the pins of the formed optoelectronic conversion components are connected to the circuit board, and at the same time, some of the debris adhering to the tool falls off onto the pins;

[0004] When using this optoelectronic conversion component, the pins of the optoelectronic conversion component are connected to the circuit board. At this time, some of the debris on the pins will fall onto the circuit board. When it comes into contact with the conductive part on the circuit board, a short circuit occurs, resulting in the inability of one or more functional modules of the optoelectronic conversion component to work properly, thereby affecting the performance of the device loaded with the optoelectronic conversion component.

[0005] Therefore, the present invention provides an optoelectronic conversion component packaging device. Summary of the Invention

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art.

[0007] The technical solution adopted by the present invention to solve its technical problems is as follows: An optoelectronic conversion component packaging device described in the present invention includes a working cabinet, inside which a fixed mold is fixedly connected. The fixed mold is used for receiving the substrate to be encapsulated. A manipulator is slidably connected to the inner wall of the working cabinet. The lower surface of the top of the working cabinet is fixedly connected with a first set of electric telescopic rods arranged in a circumferential array. One end of each first set of electric telescopic rods away from the working cabinet is fixedly connected with a movable mold. The fixed mold and the movable mold are matched in shape. The movable mold is fixedly connected with injection pipes arranged in a rectangular array and penetrating therethrough. One end of each injection pipe away from the movable mold is slidably connected to the top of the working cabinet. A cutting table is fixedly connected inside the working cabinet. The lower surface of the top of the working cabinet is fixedly connected with a second set of electric telescopic rods arranged in a circumferential array. One end of each second set of electric telescopic rods away from the working cabinet is fixedly connected with a cutting tool. A cleaning component is arranged between the cutting tool and the working cabinet for cleaning the debris attached to the cutting tool;

[0008] The cutting tool, the cutting table and the substrate are matched in shape, and a recovery groove is opened inside the working cabinet.

[0009] As a further solution of the present invention, the cleaning component includes a rotating rod. The rotating rod is rotatably connected to the lower surface of the top of the working cabinet and penetrates through the cutting tool. A guiding groove is opened on the surface of the rotating rod. A guiding rod is fixedly connected inside the cutting tool. The guiding rod is slidably connected in the guiding groove. A rotating inner cavity groove is opened on the top of the working cabinet. A transmission rod is rotatably connected to the top of the rotating inner cavity groove. A transmission gear is fixedly connected to the bottom of the transmission rod. A first belt is connected for transmission between the rotating rod and the transmission rod. A first guiding gear rod is rotatably connected inside the rotating inner cavity groove. A second guiding gear rod is rotatably connected inside the rotating inner cavity groove. The first guiding gear rod and the second guiding gear rod are meshed with each other. The first guiding gear rod and the second guiding gear rod are symmetrically arranged in a rectangular array inside the rotating inner cavity groove. A second belt is connected for transmission between the transmission rod and one of the second guiding gear rods close to the middle guiding gear rod one. A fourth belt is connected for transmission between a group of the first guiding gear rods. A third belt is connected for transmission between the first guiding gear rods close to the transmission rod. Cleaning brushes are rotatably connected to the lower surface of the top of the working cabinet in a rectangular array.

[0010] As a further solution of the present invention, the shape of the guiding rod is matched with the shape of the guiding groove. A limiting ring is arranged on the surface of the transmission rod. The limiting ring on the transmission rod abuts against the bottom of the rotating inner cavity groove.

[0011] As a further solution of the present invention, the cleaning brush penetrates through the top of the working cabinet. One end of the cleaning brush close to the top of the working cabinet is fixedly connected to the bottom of the first guiding gear rod and the second guiding gear rod and corresponds one by one.

[0012] As a further solution of the present invention, each of the cleaning brushes penetrates through the interior of the tool and contacts the interior of the tool.

[0013] As a further solution of the present invention, a collection assembly is provided on the work cabinet. The collection assembly includes a displacement groove opened at the top of the work cabinet. A telescopic groove is opened on the inner wall of the work cabinet, and the telescopic groove communicates with the displacement groove. A displacement block one is slidably connected inside the displacement groove. One end of the displacement block one away from the middle of the work cabinet is fixedly connected to a displacement block two. A threaded rod is rotatably connected to the inner wall of the telescopic groove. One end of the threaded rod close to the inner wall of the telescopic groove is fixedly connected to a rotating gear. A displacement sleeve is provided on the surface of the threaded rod. A threaded sleeve ring is fixedly connected to the inner wall of the displacement sleeve, and the threaded sleeve ring is threadedly connected to the threaded rod. One end of the displacement sleeve away from the rotating gear is fixedly connected to a collection box.

[0014] As a further solution of the present invention, a guiding rack is provided at one end of the displacement block one close to the transmission gear, and the guiding rack on the displacement block one meshes with the transmission gear.

[0015] As a further solution of the present invention, the displacement block two slides inside the telescopic groove. A transmission rack is provided at one end of the displacement block two close to the rotating gear, and the transmission rack on the displacement block two meshes with the rotating gear.

[0016] As a further solution of the present invention, a transmission thread groove is opened on the surface of the threaded rod, and the shape of the threaded sleeve ring matches the shape of the transmission thread groove on the threaded rod.

[0017] As a further solution of the present invention, the shape of the collection box matches the shape of the telescopic groove. The collection box slides inside the telescopic groove. The ratio of the length of the collection box to the length of the tool is two to one, and the width of the collection box matches the width of the tool.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The present invention cleans the debris attached to the tool by the rotation of the cleaning brush, maintaining the cleanliness of the tool, keeping it clean when the tool is used again, avoiding the problem that when the tool on the existing optoelectronic conversion component packaging equipment is used again, the debris attached to it causes an increase in the surface roughness of the cut pins and the appearance of burrs after cutting the substrate, and further avoiding the problem that after the pins of the formed optoelectronic conversion component are connected to the circuit board, the metal burrs on the pins will form a short circuit between the circuit boards, making the surface of the pins of the cut optoelectronic conversion component no longer attached with debris and ensuring the stability of the optoelectronic conversion component.

[0020] 2. The present invention collects the debris attached to the tool brushed out by the cleaning brush, avoiding the problem that the debris on the tool is scattered below after being brushed out by the cleaning brush, resulting in the photo - electric conversion component located below being attached with debris. Furthermore, after the photo - electric conversion component not attached with debris is connected to the circuit board, the photo - electric conversion component can operate normally, ensuring the performance of the equipment loaded with the photo - electric conversion component and improving the yield rate of the photo - electric conversion component.

[0021] 3. The present invention collects the debris on the tool through the collection box, ensuring the cleanliness of the working environment on the workbench. At the same time, the collected debris can be reused, reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be further described below with reference to the drawings.

[0023] Figure 1 is the elevation view of the overall device of the present invention;

[0024] Figure 2 is the sectional view of the overall device of the present invention;

[0025] Figure 3 is the schematic diagram of the positional relationship between the second electric telescopic rod and the tool of the present invention;

[0026] Figure 4 is the schematic diagram of the positional relationship between the transmission rod and the transmission gear of the present invention;

[0027] Figure 5 is the present invention Figure 4 magnified schematic diagram at A in;

[0028] Figure 6 is the schematic diagram of the positional relationship between the rotating rod and the first belt of the present invention;

[0029] Figure 7 is the schematic diagram of the positional relationship between the transmission rod and the second belt of the present invention;

[0030] Figure 8 is the present invention Figure 7 magnified schematic diagram at B in;

[0031] Figure 9 is the schematic diagram of the positional relationship between the first displacement block and the second displacement block of the present invention;

[0032] Figure 10 is the schematic diagram of the positional relationship between the displacement sleeve and the collection box of the present invention;

[0033] Figure 11 is the present invention Figure 10 magnified schematic diagram at C in.

[0034] Reference numerals: 1, working cabinet; 11, fixed mold; 12, substrate; 13, manipulator; 14, first electric telescopic rod; 15, movable mold; 16, injection pipe; 17, cutting table; 18, second electric telescopic rod; 19, cutting tool; 110, recovery tank;

[0035] 21, guide rod; 22, rotating rod; 23, guide groove; 24, rotating inner cavity groove; 25, transmission rod; 26, transmission gear; 27, first belt; 28, first guide gear rod; 29, second guide gear rod; 210, second belt; 211, third belt; 212, fourth belt; 213, cleaning brush;

[0036] 31, displacement groove; 32, telescopic groove; 33, first displacement block; 34, second displacement block; 35, threaded rod; 36, rotating gear; 37, displacement sleeve; 38, threaded sleeve ring; 39, collection box. Detailed implementation manners

[0037] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners. Embodiment

[0038] As Figures 1 to 11 shown, an optoelectronic conversion component packaging device according to an embodiment of the present invention includes a working cabinet 1. A fixed mold 11 is fixedly connected inside the working cabinet 1. The fixed mold 11 is used for receiving a substrate to be encapsulated. A manipulator 13 is slidably connected to the inner wall of the working cabinet 1. The lower surface of the top of the working cabinet 1 is fixedly connected with first electric telescopic rods 14 arranged in a circumferential array. One ends of the first electric telescopic rods 14 away from the working cabinet 1 are fixedly connected with movable molds 15. The fixed mold 11 and the movable mold 15 are matched in shape. Injection pipes 16 are fixedly connected through the movable mold 15 in a rectangular array. One ends of the injection pipes 16 away from the movable mold 15 are slidably connected to the top of the working cabinet 1. A cutting table 17 is fixedly connected inside the working cabinet 1. The lower surface of the top of the working cabinet 1 is fixedly connected with second electric telescopic rods 18 arranged in a circumferential array. One ends of the second electric telescopic rods 18 away from the working cabinet 1 are fixedly connected with cutting tools 19. A cleaning assembly is arranged between the cutting tool 19 and the working cabinet 1 for cleaning debris attached to the cutting tool 19;

[0039] The cutting tool 19, the cutting table 17 and the substrate 12 are matched in shape. A recovery tank 110 is opened inside the working cabinet 1.

[0040] Specifically, there are still some problems in the actual application of the above solution. When using the tool in the above optoelectronic conversion component packaging device to cut the pins on the substrate, the tool inevitably comes into contact with the pins. Since the pins are usually made of metal or alloy, when the tool cuts the pins, the pin material is deformed and fractured by applying pressure and shear force. During this process, the pins break and generate debris, and some of the debris adheres to the surface of the tool. As the tool cuts the leads again, it causes an increase in the surface roughness of the cut pins and the appearance of burrs. After the pins of the formed optoelectronic conversion component are connected to the circuit board, the metal burrs on the pins will form a short circuit between the circuit boards. At the same time, some of the debris attached to the tool falls off onto the pins. When using this optoelectronic conversion component, the pins of the optoelectronic conversion component are connected to the circuit board. At this time, some of the debris on the pins will fall onto the circuit board. When it comes into contact with the conductive part on the circuit board, a short circuit occurs, resulting in the inability of one or more functional modules of the optoelectronic conversion component to work properly, thereby affecting the performance of the device loaded with the optoelectronic conversion component.

[0041] Therefore, the present invention solves this problem by setting corresponding structures. The staff starts the controller, controls the movement of the manipulator 13 through the controller, places the substrate 12 on the fixed mold 11 through the manipulator 13, and then controls the manipulator 13 to move towards the direction close to the recovery groove 110 so as not to block the movement of the movable mold 15. At this time, the first electric telescopic rod 14 is started, and the first electric telescopic rod 14 extends, so that the movable mold 15 moves towards the direction close to the fixed mold 11 as the first electric telescopic rod 14 extends. At the same time, the injection tube 16 on the movable mold 15 is driven to move together with the movable mold 15 until the movable mold 15 abuts against the fixed mold 11, thereby sealing the area to be encapsulated on the substrate 12 to form an injection area. At this time, an external injection molding machine injects the epoxy resin molten liquid into the injection area through the injection tube 16. After it cools down, the first electric telescopic rod 14 is controlled to contract, so that the movable mold 15 no longer abuts against the fixed mold 11. At this time, the encapsulated substrate 12 is placed on the cutting table 17 through the manipulator 13, and then the manipulator 13 is controlled to move towards the direction close to the recovery groove 110. At this time, the second electric telescopic rod 18 is started, and the second electric telescopic rod 18 begins to extend, thereby driving the tool 19 to move towards the direction close to the cutting table 17 until the bottom of the tool 19 contacts the surface of the cutting table 17. During this process, the bottom of the tool 19 cuts the pins on the substrate 12, so that the multiple optoelectronic conversion components after encapsulation on the substrate 12 are separated and formed. At this time, the second electric telescopic rod 18 is controlled to contract, so that the tool 19 no longer abuts against the cutting table 17 as the second electric telescopic rod 18 contracts, and is cleaned by the cleaning component as the second electric telescopic rod 18 contracts, so that the debris generated by the tool 19 cutting the pins on the substrate 12 no longer adheres to the inside of the tool 19, maintaining the cleanliness inside the tool 19;

[0042] At this time, the control manipulator 13 moves the cut substrate 12 above the recovery tank 110 and releases the substrate 12, so that the cut substrate 12 falls into the recovery tank 110.

[0043] As Figures 1 to 8 shown, the cleaning component described in this embodiment includes a rotating rod 22. The rotating rod 22 is rotatably connected to the lower surface of the top of the work cabinet 1 and penetrates through the cutter 19. A guiding groove 23 is formed on the surface of the rotating rod 22. A guiding rod 21 is fixedly connected inside the cutter 19. The guiding rod 21 is slidably connected in the guiding groove 23. A rotating inner cavity groove 24 is formed on the top of the work cabinet 1. A transmission rod 25 is rotatably connected to the top of the rotating inner cavity groove 24. A transmission gear 26 is fixedly connected to the bottom of the transmission rod 25. A first belt 27 is connected between the rotating rod 22 and the transmission rod 25 for transmission. A first guiding gear rod 28 is rotatably connected inside the rotating inner cavity groove 24. A second guiding gear rod 29 is rotatably connected inside the rotating inner cavity groove 24. The first guiding gear rod 28 meshes with the second guiding gear rod 29. The first guiding gear rod 28 and the second guiding gear rod 29 are symmetrically arranged in a rectangular array in the rotating inner cavity groove 24. A second belt 210 is connected between the transmission rod 25 and one of the second guiding gear rods 29 close to the middle first guiding gear rod 28 for transmission. A fourth belt 212 is connected between a group of the first guiding gear rods 28 for transmission. A third belt 211 is connected between the first guiding gear rods 28 close to the transmission rod 25 for transmission. Cleaning brushes 213 are rotatably connected to the lower surface of the top of the work cabinet 1 in a rectangular array.

[0044] Specifically, the staff activates the second electric telescopic rod 18 to contract it. At this time, the cutting tool 19 contracts together with the second electric telescopic rod 18. During this process, the guide rod 21 on the cutting tool 19 slides within the guide groove 23 on the rotating rod 22. As the cutting tool 19 moves upward, the guide rod 21 moves together with the cutting tool 19. Furthermore, under the action of the guide rod 21 and the guide groove 23, the rotating rod 22 rotates. The rotation of the rotating rod 22 drives the transmission rod 25 to rotate through the transmission of the first belt 27. Then, it drives the transmission gear 26 to rotate together with the transmission rod 25. The rotation of the transmission rod 25 drives the second guide gear rod 29 connected to it through the drive of the second belt 210 to rotate, and then drives the first guide gear rod 28 meshing with it to rotate. The rotating first guide gear rod 28 drives all the first guide gear rods 28 and the second guide gear rods 29 to rotate through the transmission of the third belt 211 and the fourth belt 212. Then, the cleaning brushes 213 fixed to them rotate together. When the cutting tool 19 passes through the cleaning brushes 213, the rotation of the cleaning brushes 213 cleans the debris attached to the cutting tool 19, maintaining the cleanliness of the cutting tool 19, ensuring that it remains clean when used again, and avoiding the problem that when the cutting tool 19 on the existing optoelectronic conversion component encapsulation equipment is used again, the debris attached to it causes an increase in the surface roughness and burrs on the pins after cutting the substrate 12. Further, it avoids the problem that after the pins of the formed optoelectronic conversion component are connected to the circuit board, the metal burrs on the pins will form a short circuit between the circuit boards, making the surface of the pins of the cut optoelectronic conversion component no longer adhere to debris and ensuring the stability of the optoelectronic conversion component.

[0045] As Figures 4 to 6 shown, in this embodiment, the shape of the guide rod 21 matches the shape of the guide groove 23. A limiting ring is provided on the surface of the transmission rod 25, and the limiting ring on the transmission rod 25 abuts against the bottom of the rotating inner cavity groove 24.

[0046] Specifically, when the shape of the guide rod 21 matches the shape of the guide groove 23, the guide rod 21 can slide within the guide groove 23 as the cutting tool 19 moves together, thereby driving the rotating rod 22 to rotate. The function of the limiting ring on the transmission rod 25 is to prevent the transmission rod 25 from falling out of the rotating inner cavity groove 24.

[0047] As Figure 3 shown, in this embodiment, the cleaning brush 213 penetrates through the top of the working cabinet 1. One end of the cleaning brush 213 close to the top of the working cabinet 1 is fixedly connected to the bottoms of the first guide gear rod 28 and the second guide gear rod 29 and corresponds one by one.

[0048] Specifically, when the first guide gear rod 28 and the second guide gear rod 29 rotate, the cleaning brush 213 fixed to them can also rotate together with their rotation.

[0049] As Figures 2 to 3 shown, in this embodiment, each of the cleaning brushes 213 penetrates through the interior of the tool 19 and contacts the interior of the tool 19.

[0050] Specifically, when the tool 19 is displaced together with the contraction of the second electric telescopic rod 18, at this time, the side of the tool 19 that cuts the leads on the substrate 12 can be cleaned by the cleaning brush 213. Embodiment

[0051] As Figures 2 to 11 shown, compared with the first comparative embodiment, another implementation manner of the present invention is:

[0052] As Figures 9 to 11 shown, in this embodiment, a collection component is provided on the work cabinet 1. The collection component includes a displacement groove 31, the displacement groove 31 is opened at the top of the work cabinet 1, a telescopic groove 32 is opened on the inner wall of the work cabinet 1, the telescopic groove 32 communicates with the displacement groove 31, a displacement block one 33 is slidably connected inside the displacement groove 31, one end of the displacement block one 33 away from the middle of the work cabinet 1 is fixedly connected with a displacement block two 34, a threaded rod 35 is rotatably connected to the inner wall of the telescopic groove 32, one end of the threaded rod 35 close to the inner wall of the telescopic groove 32 is fixedly connected with a rotating gear 36, a displacement sleeve 37 is arranged on the surface of the threaded rod 35, a threaded sleeve ring 38 is fixedly connected to the inner wall of the displacement sleeve 37, the threaded sleeve ring 38 is threadedly connected with the threaded rod 35, and a collection box 39 is fixedly connected to one end of the displacement sleeve 37 away from the rotating gear 36.

[0053] Specifically, the sliding of the displacement block one 33 drives the displacement block two 34 to slide along with the guiding groove 23, so that the rotating gear 36 rotates as the displacement block two 34 slides. Furthermore, the rotation of the rotating gear 36 causes the threaded sleeve ring 38 threadedly connected thereto to move, and then drives the displacement sleeve 37 fixed to the threaded sleeve ring 38 to displace together with the threaded sleeve ring 38, so that the collection box 39 slides in the telescopic groove 32 as the displacement sleeve 37 displaces. When the tool 19 moves upward, at this time, the collection box 39 moves in a direction away from the rotating gear 36. Furthermore, the collection box 39 collects the debris attached to the tool 19 brushed out by the cleaning brush 213, avoiding the problem that the debris on the tool 19 is scattered below after being brushed out by the cleaning brush 213, resulting in the photoelectric conversion component located below being attached with debris. Furthermore, after the photoelectric conversion component not attached with debris is connected to the circuit board, the photoelectric conversion component can operate normally, ensuring the performance of the equipment loaded with the photoelectric conversion component and improving the yield rate of the photoelectric conversion component.

[0054] At the same time, the collection box 39 collects the debris on the tool 19, ensuring the cleanliness of the working environment on the workbench. At the same time, the collected debris can be reused, reducing the production cost.

[0055] As Figure 9 shown, one end of the first displacement block 33 close to the transmission gear 26 is provided with a guiding rack, and the guiding rack on the first displacement block 33 meshes with the transmission gear 26.

[0056] Specifically, the rotation of the transmission rod 25 drives the rotation of the transmission gear 26, and then through the meshing of the transmission gear 26 with the guiding rack on the first displacement block 33, the first displacement block 33 slides in the displacement groove 31.

[0057] As Figure 9 shown, the second displacement block 34 of this embodiment slides in the telescopic groove 32. One end of the second displacement block 34 close to the rotating gear 36 is provided with a transmission rack, and the transmission rack on the second displacement block 34 meshes with the rotating gear 36.

[0058] Specifically, when the first displacement block 33 slides in the displacement groove 31, at this time, the sliding of the first displacement block 33 drives the second displacement block 34 fixed thereon to displace together, so that the second displacement block 34 slides in the telescopic groove 32, and then the second displacement block 34 drives the transmission rack fixed thereon to displace together. The rotation of the rotating gear 36 is driven by the meshing of the transmission rack on the second displacement block 34 with the rotating gear 36.

[0059] As Figure 10 and Figure 11 shown, a transmission thread groove is formed on the surface of the threaded rod 35 of this embodiment, and the shape of the threaded sleeve ring 38 matches the shape of the transmission thread groove on the threaded rod 35.

[0060] Specifically, the shape of the threaded sleeve ring 38 matches the shape of the transmission thread groove on the threaded rod 35, so that when the threaded rod 35 rotates, the threaded sleeve ring 38 displaces along the shape of the transmission thread groove on the threaded rod 35.

[0061] As Figure 9 and 10 shown, the shape of the collection box 39 of this embodiment matches the shape of the telescopic groove 32. The collection box 39 slides in the telescopic groove 32. The ratio of the length of the collection box 39 to the length of the cutter 19 is two to one, and the width of the collection box 39 matches the width of the cutter 19.

[0062] Specifically, part of the collection box 39 can be retracted into the collection box 39, so that when the cutter 19 moves downward, the collection box 39 does not contact it. The ratio of the length of the collection box 39 to the length of the cutter 19 is two to one, so that the collection box 39 is always below the cutter 19 when the cleaning brush 213 cleans the debris attached to the cutter 19, and the debris cleared is collected by the collection box 39.

[0063] The working principle is as follows:

[0064] The staff member starts the controller, controls the movement of the manipulator 13 through the controller, places the substrate 12 on the fixed mold 11 through the manipulator 13, and then controls the manipulator 13 to move towards the direction close to the recovery tank 110 so as not to block the movement of the movable mold 15. At this time, the first electric telescopic rod 14 is started to extend, so that the movable mold 15 moves towards the direction close to the fixed mold 11 along with the extension of the first electric telescopic rod 14, and at the same time drives the injection tube 16 on the movable mold 15 to move together with the movable mold 15 until the movable mold 15 contacts the fixed mold 11, thereby sealing the area to be encapsulated on the substrate 12 to form an injection area. At this time, an external injection molding machine injects the epoxy resin molten liquid into the injection area through the injection tube 16. After it cools down, the first electric telescopic rod 14 is controlled to contract so that the movable mold 15 no longer contacts the fixed mold 11. At this time, the encapsulated substrate 12 is placed on the cutting table 17 through the manipulator 13, and then the manipulator 13 is controlled to move towards the direction close to the recovery tank 110. At this time, the second electric telescopic rod 18 is started, and the second electric telescopic rod 18 begins to extend, thereby driving the cutter 19 to move towards the direction close to the cutting table 17 until the bottom of the cutter 19 contacts the surface of the cutting table 17. During this process, the bottom of the cutter 19 cuts the pins on the substrate 12, so that the multiple photo - electric conversion components after encapsulation on the substrate 12 are separated and formed. At this time, the second electric telescopic rod 18 is controlled to contract, so that the cutter 19 moves together with the contraction of the second electric telescopic rod 18;

[0065] During this process, the guide rod 21 on the cutter 19 slides in the guide groove 23 on the rotating rod 22. Along with the upward displacement of the cutter 19, the guide rod 21 moves together with the cutter 19. Thus, under the action of the guide rod 21 and the guide groove 23, the rotating rod 22 rotates. The rotation of the rotating rod 22 drives the transmission rod 25 to rotate through the transmission of the first belt 27, and then drives the transmission gear 26 to rotate together with the transmission rod 25. The rotation of the transmission rod 25 drives the second guide gear rod 29 connected to it through transmission to rotate through the drive of the second belt 210, and then drives the first guide gear rod 28 meshing with it to rotate. The rotating first guide gear rod 28 drives all the first guide gear rod 28 and the second guide gear rod 29 to rotate through the transmission of the third belt 211 and the fourth belt 212, so that the cleaning brush 213 fixed to them rotates together. When the cutter 19 passes through the cleaning brush 213, the rotation of the cleaning brush 213 cleans the debris attached to the cutter 19, so that the debris generated by the cutter 19 cutting the pins on the substrate 12 no longer adheres to the inside of the cutter 19, keeping the inside of the cutter 19 clean and making the cutter 19 clean when it is used again;

[0066] During the rotation of the rotating transmission rod 25 that drives the transmission gear 26 fixed thereto, due to the engagement between the transmission gear 26 and the guiding rack on the first displacement block 33, the first displacement block 33 slides within the displacement groove 31. The sliding of the first displacement block 33 drives the second displacement block 34 to slide together with the guiding groove 23, causing the rotating gear 36 to rotate as the second displacement block 34 slides. Furthermore, the rotation of the rotating gear 36 causes the threaded collar 38 threadedly connected thereto to move, thereby driving the displacement sleeve 37 fixed to the threaded collar 38 to displace together with the threaded collar 38, causing the collection box 39 to slide within the telescopic groove 32 as the displacement sleeve 37 displaces. When the tool 19 moves upward, at this time, the collection box 39 moves in a direction away from the rotating gear 36, and thus the collection box 39 collects the debris attached to the tool 19 that is brushed out by the cleaning brush 213.

[0067] While the collection box 39 collects the debris attached to the tool 19 that is brushed out by the cleaning brush 213, at this time, the control manipulator 13 moves the cut substrate 12 above the recovery groove 110 and releases the substrate 12, thereby causing the cut substrate 12 to fall into the recovery groove 110.

[0068] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and all these changes and improvements fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A photoelectric conversion component packaging device, comprising a work cabinet (1), wherein a manipulator (13) is slidably connected to the inner wall of the work cabinet (1), characterized in that: A fixed mold (11) is fixedly connected to the interior of the working cabinet (1), and the fixed mold (11) is used to receive the substrate (12) to be plastic-sealed; The lower surface of the top of the working cabinet (1) is fixedly connected to electric telescopic rods (14) arranged in a circular array, and one end of the electric telescopic rods (14) away from the working cabinet (1) is fixedly connected to a movable mold (15); The shapes of the fixed mold (11) and the movable mold (15) match each other; The movable mold (15) is provided with injection tubes (16) arranged in a rectangular array and passing through and fixedly connected thereto, and the ends of the injection tubes (16) away from the movable mold (15) are slidably connected to the top of the working cabinet (1); A cutting table (17) is fixedly connected to the interior of the work cabinet (1); two electric telescopic rods (18) are fixedly connected to the lower surface of the top of the work cabinet (1) in a circular array; a cutter (19) is fixedly connected to one end of the electric telescopic rod (18) away from the work cabinet (1); A cleaning component is provided between the tool (19) and the work cabinet (1) for cleaning debris attached to the tool (19); A cutting table (17) is fixedly connected to the interior of the working cabinet (1), and the cutting table (17) is used to receive the substrate (12) after plastic sealing; After plastic packaging, the substrate (12) and the cutter (19) match in shape; The cleaning assembly comprises a rotating rod (22), the rotating rod (22) being rotatably connected to the top lower surface of the working cabinet (1) and penetrating the cutting tool (19); A guide groove (23) is formed on the surface of the rotating rod (22), a guide rod (21) is fixedly connected inside the tool (19), and the guide rod (21) is slidably connected inside the guide groove (23); The top of the working cabinet (1) is provided with a rotating inner cavity groove (24), the top of the rotating inner cavity groove (24) is rotatably connected to a transmission rod (25), the interior of the rotating inner cavity groove (24) is rotatably connected to a guide gear rod 1 (28), the interior of the rotating inner cavity groove (24) is rotatably connected to a guide gear rod 2 (29), and the guide gear rod 1 (28) is meshed with the guide gear rod 2 (29); A belt 2 (210) is connected between the transmission rod (25) and a guide gear rod 2 (29) close to the middle guide gear rod 1 (28), a belt 4 (212) is connected between a group of guide gear rods 1 (28), and a belt 3 (211) is connected between the guide gear rods 1 (28) close to the transmission rod (25); The working cabinet (1) is provided with a collecting component, the collecting component comprising a displacement groove (31), and the displacement groove (31) is opened on the top of the working cabinet (1); On the inner wall of the work cabinet (1), a telescopic groove (32) communicating with the displacement groove (31) is opened. Inside the displacement groove (31), a first displacement block (33) is slidably connected. One end of the first displacement block (33) away from the middle of the work cabinet (1) is fixedly connected to a second displacement block (34). On the inner wall of the telescopic groove (32), a threaded rod (35) is rotatably connected. One end of the threaded rod (35) close to the inner wall of the telescopic groove (32) is fixedly connected to a rotating gear (36). On the surface of the threaded rod (35), a displacement sleeve (37) is arranged. Inside the displacement sleeve (37), a threaded sleeve ring (38) is fixedly connected.

2. The encapsulation device for an optoelectronic conversion component according to claim 1, wherein On the surface of the transmission rod (25), a limiting ring is arranged. The limiting ring on the transmission rod (25) abuts against the bottom of the rotating inner cavity groove (24).

3. The encapsulation device for an optoelectronic conversion component according to claim 1, characterized in that, On the lower surface of the top of the work cabinet (1), cleaning brushes (213) are rotatably connected in a rectangular array. The cleaning brushes (213) penetrate through the top of the work cabinet (1). One end of the cleaning brushes (213) close to the top of the work cabinet (1) is fixedly connected to the bottoms of a first guide gear rod (28) and a second guide gear rod (29) respectively and in one-to-one correspondence.

4. The optoelectronic conversion component packaging device according to claim 3, characterized in that Each cleaning brush (213) penetrates through the inside of the cutter (19) and contacts the inside of the cutter (19).

5. The encapsulation device for an optoelectronic conversion component according to claim 1, characterized in that, At the bottom of the transmission rod (25), a transmission gear (26) is fixedly connected. One end of the first displacement block (33) close to the transmission gear (26) is provided with a guide rack, and the guide rack meshes with the transmission gear (26).

6. The encapsulation device for an optoelectronic conversion component according to claim 1, wherein, The second displacement block (34) slides in the telescopic groove (32). One end of the second displacement block (34) close to the rotating gear (36) is provided with a transmission rack, and the transmission rack meshes with the rotating gear (36).

7. The encapsulation device for an optoelectronic conversion component according to claim 1, wherein On the surface of the threaded rod (35), a transmission threaded groove is opened. The shape of the threaded sleeve ring (38) matches the shape of the transmission threaded groove on the threaded rod (35).

8. The optoelectronic conversion component packaging device according to claim 1, wherein One end of the displacement sleeve (37) away from the rotating gear (36) is fixedly connected to a collection box (39). The shape of the collection box (39) matches the shape of the telescopic groove (32). The collection box (39) slides in the telescopic groove (32). The ratio of the length of the collection box (39) to the length of the cutter (19) is two to one. The width of the collection box (39) matches the width of the cutter (19).

Citation Information

Patent Citations

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