Device and method for uniform rotational deposition of chip thin films

Abstract

The present invention relates to the field of chip coating technology, and discloses a chip thin film uniform rotation deposition device and method, including a deposition chamber; a U-shaped seat, the U-shaped seat is rotatably installed in the deposition chamber, and the outer wall of the U-shaped seat is installed with a first drive component; a steering shaft, the steering shaft is rotatably installed on the inner wall of the U-shaped seat, and the steering shaft on one side passes through the side wall of the U-shaped seat and is connected to the first drive component, and the first drive component is used to drive the steering shaft to rotate; a rectangular groove, the rectangular groove is fixedly connected to the other end of the steering shaft, and a second drive component is installed in the rectangular groove; two single-mode seats, the two single-mode seats are located in the U-shaped seat, and the two single-mode seats are slidably connected to the second drive component, and the second drive component is used to drive the single-mode seats to slide up and down. By arranging the U-shaped seat and the single-mode seat, and making the single-mode seat rotate with the U-shaped seat, the chip on the single-mode seat can be fully contacted with the reaction gas, and the chip film can be uniformly deposited.

Description

Technical Field

[0001] The present invention relates to the technical field of chip coating, and more specifically, to a device and method for uniformly rotating deposition of chip thin films. Background Art

[0002] The LED chip is a solid-state semiconductor device. The heart of the LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire wafer is encapsulated with epoxy resin. It is also called the LED light-emitting chip. It is the core component of the LED lamp. Its main function is to convert electrical energy into light energy.

[0003] LED chips, the core components of LEDs, are typically coated with a thin film to protect them from acidic and alkaline corrosion and oxidation. This prevents degradation of the LED chip caused by these corrosion and oxidation. However, the deposition process on both the front and back sides of the chip cannot be completed on the same machine. This requires repeated chip transport, increasing process costs and potentially damaging the chip.

[0004] Those skilled in the art have conducted research and improvements on this. For example, patent publication number CN111748800B discloses a thin film deposition device and a thin film deposition method. This technical solution controls the lifting and lowering of the carrier ring and the carrier platform as well as the supply direction of the reaction gas to achieve thin film deposition. However, this technical solution cannot ensure uniform contact between the chip and the reaction gas, and it is difficult to ensure the quality of the coating.

[0005] To this end, we propose a device and method for uniform rotational deposition of chip thin films. Summary of the Invention

[0006] The purpose of the present invention is to provide a chip thin film uniform rotation deposition device and method to solve the problems existing in the prior art. By setting a U-shaped seat and a single-mode seat, and making the single-mode seat rotate with the U-shaped seat, the chip on the single-mode seat can be fully contacted with the reaction gas, and the chip film can be uniformly deposited.

[0007] To achieve the above-mentioned purpose, the present invention provides the following solutions: The present invention provides a chip thin film uniform rotating deposition device, comprising: a deposition chamber; a U-shaped seat, the U-shaped seat is rotatably installed inside the deposition chamber, and the outer wall of the U-shaped seat is installed with a first drive assembly; two steering shafts, the two steering shafts are rotatably installed on the opposite inner walls of the U-shaped seat, and the steering shaft on one side passes through the side wall of the U-shaped seat and is connected to the first drive assembly, and the first drive assembly is used to drive the steering shaft to rotate; two rectangular grooves, the two rectangular grooves are arranged between the two steering shafts, and the ends of the two rectangular grooves away from each other are fixedly connected to the ends opposite to the two steering shafts, and a second drive assembly is installed in the rectangular groove; two single-mode seats, the two single-mode seats are located in the U-shaped seat, and the two single-mode seats are slidably connected to the second drive assembly, and the second drive assembly is used to drive the single-mode seat to slide up and down.

[0008] According to a chip thin film uniform rotating deposition device provided by the present invention, the outer wall of the U-shaped seat is fixedly connected to a protective shell, and a first drive component is installed in the protective shell. The first drive component includes a worm gear, a worm and a steering motor. The steering motor is fixedly connected in the protective shell, and the output end of the steering motor is connected to the worm. One end of the steering shaft on one side passes through the side wall of the U-shaped seat and extends to the inside of the protective shell to be connected to the worm gear, and the worm gear is meshed with the worm.

[0009] According to a chip thin film uniform rotation deposition device provided by the present invention, the second driving component includes a screw, a screw motor and a limit rod, the screw is rotatably installed in the rectangular groove on one side, and the limit rod is fixedly installed in the rectangular groove on the other side, the lower end of the screw is connected to the output end of the screw motor, the screw motor is fixed below the rectangular groove, and the single mold base is installed between the screw and the limit rod.

[0010] According to a chip thin film uniform rotation deposition device provided by the present invention, the upper and lower sections of the screw rod are respectively threadedly connected to nut seats, the limit rod is symmetrically sleeved with sliding sleeves, and the single mold seat is fixedly connected between the nut seat and the sliding sleeve.

[0011] According to a chip thin film uniform rotation deposition device provided by the present invention, the threads of the upper and lower sections of the lead screw have opposite rotation directions.

[0012] According to the chip thin film uniform rotation deposition device provided by the present invention, the single mold base is provided with a plurality of grooves arranged in an array.

[0013] According to a chip thin film uniform rotation deposition device provided by the present invention, a cover is installed on the top of the deposition chamber, and a gas supply pipe is installed on the side wall of the deposition chamber.

[0014] According to a chip thin film uniform rotation deposition device provided by the present invention, a driving motor is installed at the bottom of the deposition chamber, a sealed bearing is installed between the output end of the driving motor and the deposition chamber, and the driving motor is connected to the U-shaped seat.

[0015] According to a chip thin film uniform rotation deposition device provided by the present invention, the bottom wall of the U-shaped seat is connected to a plurality of universal ball heads, and the lower ends of the plurality of universal ball heads abut against the bottom wall of the inner cavity of the deposition chamber.

[0016] According to the present invention, a method for uniform rotary deposition of a thin film on a chip is provided, comprising the following steps: cleaning and loading the chips, cleaning the chip surfaces and placing them one by one in the single-die holder; preparing a vacuum environment, evacuating the deposition chamber, and introducing nitrogen into the deposition chamber; introducing a reaction gas, exciting the reaction gas into plasma, and then introducing the reaction gas into the deposition chamber, thereby preparing a thin film on the chip surface; single-layer rotary deposition, the single-die holder is rotatably installed in the U-shaped holder, and the single-die holder rotates with the U-shaped holder, so that the plasma can evenly bombard the chip surface, thereby forming a thin film of a preset thickness; the die holder is closed and flipped, and two groups of the single-die holders are driven by the second drive component to approach each other and merge, and then flipped by the first drive component, thereby realizing chip face change, and the single-die holder continues to deposit a thin film on the other side after resetting; exhaust gas is filtered and discharged; chip unloading, restoring the deposition chamber to a normal air pressure state, and taking out the chip that has completed the coating.

[0017] The present invention discloses the following technical effects:

[0018] In the present invention, the reaction gas enters the deposition chamber and can bombard the chip surface, thereby forming a thin film on the chip. The single-mode seat rotates synchronously with the U-shaped seat, which helps to make the reaction gas evenly bombard the chip surface and ensure the uniformity of the thin film. The present invention can adjust the distance between the two groups of single-mode seats through the second drive component. After closing, they can be flipped to achieve the change of chip surface. After resetting, the thin film deposition on the other side of the chip continues, which can achieve comprehensive deposition of the chip and ensure the processing quality. The induced draft fan is used for airflow traction, and the filter element is used for filtering and purification to ensure a good working environment. The present invention has a reasonable design. By providing a plurality of array-arranged grooves on the single-mode seat, multiple chips can be accommodated for deposition at the same time, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 It is a schematic diagram of the process of the present invention;

[0021] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0022] Figure 3 It is a side view of the U-shaped seat in the present invention;

[0023] Among them, 1. Deposition chamber; 2. Air supply pipe; 3. Vacuum pump; 4. Drive motor; 5. U-shaped seat; 6. Universal ball joint; 7. Steering shaft; 8. Rectangular groove; 9. Screw; 10. Screw motor; 11. Nut seat; 12. Limit rod; 13. Sleeve; 14. Single-mode seat; 15. Protective shell; 16. Steering motor; 17. Worm; 18. Worm gear; 19. Draft fan; 20. Filter element; 21. Groove; 22. Cover. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] The excitation device is a core component used to convert the reaction gas used for coating (such as Ar, N2, SiH4, etc.) into high-energy plasma. Common plasma excitation methods include radio frequency (RF) excitation, microwave excitation, DC discharge, etc. This device uses an RF excitation device, but is not limited to this method. The excitation device includes a high-frequency power supply (RF power supply), an electrode system, a matching network (impedance matcher) and a gas distribution system. The high-frequency power supply (RF power supply) provides a high-frequency AC electric field (usually a frequency of 13.56MHz) for ionizing the reaction gas. It is set outside the deposition chamber and connected to the internal electrode through a matching network.

[0026] The electrodes in the electrode system are connected to a high-frequency power supply to form an electric field loop.

[0027] The matching network (impedance matcher) is used to adjust the impedance matching between the power supply and the plasma load to ensure efficient energy transfer to the reaction gas and reduce reflected power.

[0028] The gas distribution system evenly introduces the reaction gas into the deposition chamber through the gas supply pipe. The gas inlet is usually located near the electrode to ensure that the gas is fully ionized in the electric field area.

[0029] High-frequency electric field: RF plasma generators generate high-frequency electric fields, typically between 100kHz and 100MHz. This high-frequency electric field causes gas molecules to vibrate and collide, gradually ionizing them into plasma.

[0030] Ionization process: Under the influence of a high-frequency electric field, gas molecules gain enough energy to overcome the intermolecular bond energy and ionize, forming positive ions and electrons. These ions and electrons move in the electric field and collide with other gas molecules, further ionizing them and forming more plasma.

[0031] Plasma characteristics: The plasma generated by the RF plasma generator is relatively stable and is suitable for scientific research fields such as material surface treatment and thin film preparation. Due to the presence of high-frequency electric fields, the temperature and energy distribution of the plasma are relatively uniform, making it suitable for industrial applications that require precise control.

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] like Figure 1-Figure 3 As shown, the present invention provides a chip thin film uniform rotating deposition device, including a deposition chamber 1; a U-shaped seat 5, the U-shaped seat 5 is rotatably installed inside the deposition chamber 1, the outer wall of the U-shaped seat 5 is fixedly connected to a protective shell 15, and a first drive assembly is installed in the protective shell 15; a steering shaft 7, the steering shaft 7 is rotatably installed on the inner wall of the U-shaped seat 5, and the steering shaft 7 on one side passes through the side wall of the U-shaped seat 5 and is connected to the first drive assembly, and the first drive assembly is used to drive the steering shaft 7 to rotate; a rectangular groove 8, the rectangular groove 8 is fixedly connected to the other end of the steering shaft 7, and a second drive assembly is installed in the rectangular groove 8; two single-die seats 14, the two single-die seats 14 are located in the U-shaped seat 5, and the two single-die seats 14 are slidably connected to the second drive assembly, and the second drive assembly is used to drive the single-die seats 14 to slide up and down.

[0034] The single-die holder 14 is provided with a plurality of grooves 21 arranged in an array, into which the chips are placed. A cover 22 is installed on the top of the deposition chamber 1 to seal the top of the deposition chamber 1 and prevent gas leakage. A gas supply pipe 2 is installed on the side wall of the deposition chamber 1 to facilitate the introduction of reaction gases and nitrogen into the deposition chamber 1.

[0035] A drive motor 4 is mounted at the bottom of the deposition chamber 1. A sealed bearing is installed between the output end of the drive motor 4 and the deposition chamber 1. The drive motor 4 is connected to a U-shaped seat 5 to drive the U-shaped seat to rotate. The bottom wall of the U-shaped seat 5 is connected to several universal ball joints 6, the lower ends of which abut against the bottom wall of the inner cavity of the deposition chamber 1.

[0036] The U-shaped base 5 is rotated by a drive motor 4, and the single-mode base 14 rotates synchronously with the base 5, ensuring that the plasma evenly bombards the chip surface, thereby forming a film of a predetermined thickness. The bottom wall of the U-shaped base 5 is connected to multiple universal ball joints 6. The lower ends of the universal ball joints 6 abut the bottom wall of the deposition chamber 1, reducing friction and resistance during rotation while maintaining the stability of the U-shaped base 5. The drive motor 4 is fixedly mounted at the bottom center of the deposition chamber 1. A sealed bearing is installed between the output end of the drive motor 4 and the deposition chamber 1 to ensure that the motor does not leak gas during rotation.

[0037] The first drive assembly includes a worm gear 18, a worm 17 and a steering motor 16. The steering motor 16 is fixedly connected to the inner wall of the protective shell 15. The output end of the steering motor 16 is connected to the worm 17. One end of the steering shaft 7 on one side passes through the side wall of the U-shaped seat 5 and extends to the inside of the protective shell 15 and is connected to the worm gear 18. The worm gear 18 is engaged with the worm 17.

[0038] The outer wall of the U-shaped seat 5 is connected to a protective shell 15, the inner wall of the protective shell 15 is connected to a steering motor 16, the output end of the steering motor 16 is connected to a worm 17, and one end of the steering shaft 7 extending into the protective shell 15 is connected to a worm gear 18, which is meshed with the worm gear 17.

[0039] A worm gear 18 and worm 17 are used to control the rotation of the single-mode holder 14. The worm gear 17 is connected to the output terminal of the drive motor 4, which drives the worm gear 17 to rotate. This rotational motion is transmitted to the worm gear 18 via helical teeth. The worm gear 18 is connected to the steering shaft 7, which is connected to the single-mode holder 14 via a rectangular slot 8. When the worm gear 18 rotates, the steering shaft 7 rotates with it, in turn driving the single-mode holder 14 to rotate. The worm gear 18 and worm 17 mechanism is housed within a protective housing 15, which protects it from dust and impurities, ensuring stable operation.

[0040] The second drive assembly includes a screw rod 9, a screw motor 10 and a limit rod 12. The screw rod 9 is rotatably installed in the rectangular groove 8 on one side, and the limit rod 12 is fixedly installed in the rectangular groove 8 on the other side. The lower end of the screw rod 9 is connected to the output end of the screw motor 10, and the screw motor 10 is fixed below the rectangular groove 8. A single mold base 14 is installed between the screw rod 9 and the limit rod 12.

[0041] Steering shafts 7 are rotatably connected to the outer wall of the U-shaped base 5. A rectangular slot 8 is connected to each of the two steering shafts 7 on the adjacent side. A screw rod 9 is rotatably connected to the rear rectangular slot 8. A screw motor 10 is connected to the lower end of the screw rod 9. Nut seats 11 are threadedly connected to the upper and lower ends of the screw rod 9's outer wall. A limit rod 12 is connected to the front rectangular slot 8. Sliding sleeves 13 are sleeved on the upper and lower outer walls of the limit rod 12. A single mold base 14 is fixedly connected between the nut seats 11 and the sliding sleeve 13. The upper and lower ends of the screw rod 9 have opposite thread rotation directions, allowing the two nut seats 11 to move closer or farther relative to each other, thereby merging or separating the two single mold bases 14.

[0042] A method for uniform rotational deposition of a chip thin film comprises the following steps:

[0043] Step 1: Clean and load the chips. After cleaning the chip surface, place them one by one in the groove 21 of the single mold base 14. The single mold base 14 is set in the deposition chamber 1. The single mold base 14 is provided with several grooves 21 arranged in an array, which can accommodate multiple chips for deposition at the same time, thereby improving production efficiency.

[0044] Step 2: Prepare a vacuum environment. Connect the deposition chamber 1 to the vacuum pump 3 through a pipeline to perform a vacuum operation, and introduce nitrogen into the deposition chamber 1 for replacement.

[0045] Step 3: Introduce reaction gas, excite the reaction gas into plasma and then introduce it into the deposition chamber 1, so as to prepare a thin film on the chip surface. The high-energy particles in the plasma can bombard the chip surface, thereby forming a thin film on the chip.

[0046] Step 4: Single-layer rotation deposition: the driving motor 4 drives the U-shaped seat 5 to rotate, and the single-mode seat 14 rotates synchronously with the U-shaped seat 5, so that the plasma can evenly bombard the chip surface, thereby forming a thin film of preset thickness.

[0047] Step 5: The mold base is closed and flipped. The two sets of single mold bases 14 are merged and flipped, thereby changing the chip surface. After the single mold base 14 is reset, the thin film deposition on the other side continues.

[0048] After thin film deposition is complete on one side of the chip, the steering motor 16 starts, driving the worm 17 to rotate. The rotation of the worm 17 is transmitted to the worm gear 18 via the helical teeth, which in turn rotates the steering shaft 7. The steering shaft 7 is connected to the single-die holder 14 via the rectangular slot 8. The rotation of the steering shaft 7 causes the single-die holder 14 to flip, thus changing the chip side. After thin film deposition is complete on the other side of the chip, the steering motor 16 rotates in the opposite direction, driving the worm 17 and worm gear 18 in the opposite direction. This resets the steering shaft 7 and single-die holder 14, preparing for the next round of thin film deposition.

[0049] Step 6: Filter and discharge the waste gas. After the film deposition is completed, the induced draft fan 19 is used to pull the airflow, and the filter element 20 is used to filter and purify the residual waste gas and then discharge it to ensure a good working environment.

[0050] Step 7: Chip unloading, restore the deposition chamber 1 to normal pressure, and take out the coated chip.

[0051] The specific working process is as follows:

[0052] When performing thin film deposition, the chips are first cleaned and loaded, and the chip surface is cleaned to ensure that the chip surface is clean and free of impurities. This is the basis for uniform thin film deposition. The chips are then placed one by one in the groove 21 of the single-mode seat 14 in the deposition chamber 1. The groove 21 is used to limit the chip to prevent it from slipping during the deposition process. A vacuum environment is then prepared, and the vacuum pump 3 is connected through a pipeline to evacuate the deposition chamber 1 to remove air and other impurities in the room. Nitrogen is introduced into the deposition chamber 1 for replacement to further purify the indoor environment. The reaction gas used for coating is converted into a plasma state through an excitation device, and then introduced into the deposition chamber 1 along the gas supply pipe 2. The high-energy particles in the plasma can bombard the chip surface, thereby forming a thin film on the chip. The U-shaped seat 5 is driven to rotate by the drive motor 4, and the single-mode seat 14 rotates synchronously with the U-shaped seat 5. This rotation method helps to make the plasma bombard the chip surface evenly, ensuring the uniformity of the film. After completing the thin film deposition on one side of the chip, the two sets of single-mode holders 14 are merged and flipped to achieve the chip face change. After flipping, the single-mode holders 14 are reset and the thin film deposition on the other side of the chip is continued, thereby achieving full deposition of the chip. After completion, the induced draft fan 19 is used to pull the air flow, and the residual exhaust gas is filtered and purified through the filter element 20. The purified exhaust gas is discharged outdoors to reduce pollution to the environment. The deposition chamber 1 is restored to a normal air pressure state, the cover 22 is opened, and the chip after coating is taken out.

[0053] By using the screw motor 10 to drive the screw 9 to rotate, the upper and lower sets of nut seats 11 can be moved closer or farther relative to each other. The sliding sleeve 13 cooperates with the limit rod 12 to limit and guide, thereby controlling the spacing between the two sets of single-mode seats 14. After the two sets of single-mode seats 14 are closed, the worm 17 is engaged with the worm gear 18 to drive the steering shaft 7 to drive the rectangular slot 8 to flip, thereby realizing the chip flipping. When the two sets of single-mode seats 14 are separated, the chip is coated and deposited. During this process, the drive motor 4 can drive the U-shaped seat 5 to rotate, and the single-mode seat 14 rotates accordingly. The plasma formed by the reaction gas can be evenly deposited on the chip surface to ensure the processing quality.

[0054] The present invention is capable of accommodating multiple chips for deposition at the same time by designing a rotating deposition device, thereby improving production efficiency. The reaction gas used for coating is converted into a plasma state through an excitation device, and then introduced into the deposition chamber 1 along the gas supply pipe 2. The high-energy particles in the plasma can bombard the chip surface, thereby forming a thin film on the chip. The single-mode seat 14 rotates synchronously with the U-shaped seat 5, which helps to make the plasma evenly bombard the chip surface and ensure the uniformity of the thin film. The spacing between the two groups of single-mode seats 14 is adjustable. After closing, they can be flipped over to achieve the change of chip surface. After resetting, the thin film deposition on the other side of the chip continues, which can achieve comprehensive deposition of the chip and ensure processing quality. The airflow is pulled by the induced draft fan 19, and the filtration and purification are carried out in conjunction with the filter element 20 to ensure a good working environment.

[0055] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0056] The embodiments described above are merely descriptions of preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Without departing from the spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by persons skilled in the art should fall within the scope of protection defined by the claims of the present invention.

Claims

1. A chip thin film uniform rotation deposition device, characterized in that: include: Deposition chamber (1); A U-shaped seat (5), the U-shaped seat (5) being rotatably mounted inside the deposition chamber (1), and a first driving assembly being mounted on an outer wall of the U-shaped seat (5); Two steering shafts (7), the two steering shafts (7) are rotatably mounted on opposite inner walls of the U-shaped seat (5), wherein the steering shaft (7) on one side passes through the side wall of the U-shaped seat (5) and is connected to the first drive assembly, and the first drive assembly is used to drive the steering shaft (7) to rotate; Two rectangular grooves (8), the two rectangular grooves (8) are arranged between the two steering shafts (7), the ends of the two rectangular grooves (8) away from each other are fixedly connected to the ends opposite to the two steering shafts (7), and a second drive assembly is installed in the rectangular grooves (8); Two single-mode seats (14), the two single-mode seats (14) are located in the U-shaped seat (5), the two single-mode seats (14) are slidably connected to the second driving component, and the second driving component is used to drive the single-mode seats (14) to slide up and down.

2. The chip thin film uniform rotation deposition device according to claim 1, characterized in that: The outer wall of the U-shaped seat (5) is fixedly connected to a protective shell (15), and a first drive assembly is installed in the protective shell (15). The first drive assembly includes a worm wheel (18), a worm (17) and a steering motor (16). The steering motor (16) is fixedly connected in the protective shell (15), and the output end of the steering motor (16) is connected to the worm (17). One end of the steering shaft (7) on one side passes through the side wall of the U-shaped seat (5) and extends to the inside of the protective shell (15) to be connected to the worm wheel (18), and the worm wheel (18) is meshed with the worm (17).

3. The chip thin film uniform rotation deposition device according to claim 1, characterized in that: The second driving assembly comprises a screw rod (9), a screw rod motor (10) and a limit rod (12); the screw rod (9) is rotatably mounted in the rectangular groove (8) on one side; the limit rod (12) is fixedly mounted in the rectangular groove (8) on the other side; the lower end of the screw rod (9) is connected to the output end of the screw rod motor (10); the screw rod motor (10) is fixed below the rectangular groove (8); and the single-mode base (14) is mounted between the screw rod (9) and the limit rod (12).

4. The chip thin film uniform rotation deposition device according to claim 3, characterized in that: The upper and lower sections of the screw rod (9) are respectively threadedly connected to a nut seat (11); the upper and lower sections of the limiting rod (12) are symmetrically sleeved with a sliding sleeve (13); and the single-mode seat (14) is fixedly connected between the nut seat (11) and the sliding sleeve (13).

5. The chip thin film uniform rotation deposition device according to claim 4, characterized in that: The upper and lower sections of the screw rod (9) have threads that rotate in opposite directions.

6. The chip thin film uniform rotation deposition device according to claim 1, characterized in that: The single mold base (14) is provided with a plurality of mold grooves (21) arranged in an array.

7. The chip thin film uniform rotation deposition device according to claim 1, characterized in that: A sealing cover (22) is installed on the top of the deposition chamber (1), and an air supply pipe (2) is installed on the side wall of the deposition chamber (1).

8. The chip thin film uniform rotation deposition device according to claim 1, characterized in that: A driving motor (4) is installed at the bottom of the deposition chamber (1), a sealed bearing is installed between the output end of the driving motor (4) and the deposition chamber (1), and the driving motor (4) is connected to the U-shaped seat (5) for driving the U-shaped seat (5) to rotate.

9. The chip thin film uniform rotation deposition device according to claim 1, characterized in that: The bottom wall of the U-shaped seat (5) is connected to a plurality of universal ball heads (6), and the lower ends of the plurality of universal ball heads (6) are in contact with the bottom wall of the inner cavity of the deposition chamber (1).

10. A chip thin film uniform rotation deposition method, based on the chip thin film uniform rotation deposition device according to any one of claims 1 to 9, characterized in that: The following steps are involved: Cleaning and loading the chips: After cleaning the surface of the chips, place them one by one in the single-die holder (14); preparing a vacuum environment, evacuating the deposition chamber (1), and introducing nitrogen into the deposition chamber (1); A reaction gas is introduced, and after the reaction gas is excited into plasma, the plasma is introduced into the deposition chamber (1), thereby preparing a thin film on the chip surface; Single-layer rotary deposition, the single-mode seat (14) is rotatably mounted in the U-shaped seat (5), and the single-mode seat (14) rotates along with the U-shaped seat (5), enabling plasma to evenly bombard the chip surface, thereby forming a thin film of a preset thickness; The mold base is closed and flipped, and the two groups of single mold bases (14) are driven by the second driving component to approach each other and merge, and then flipped under the drive of the first driving component, thereby realizing chip face change, and the single mold base (14) is reset and then continues to deposit thin films on the other side; Exhaust gas is filtered and discharged; The chips are unloaded, the deposition chamber (1) is restored to a normal pressure state, and the coated chips are taken out.

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