Wafer scheduling method based on general formula data and related equipment
By defining a common data structure and parser, converting the original data of recipes from different manufacturers into general data, solving the compatibility problem of virtual machine stations when applying recipes from different manufacturers, improving simulation accuracy and efficiency, and simplifying code development.
Patent Information
- Application Number
- CN202411846829.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-05-16
AI Technical Summary
The machine recipe format provided by semiconductor manufacturers is incompatible, which causes virtual machines to encounter difficulties when applying these recipes to wafer scheduling.
By defining the general data structure used for wafer scheduling by virtual machines, we obtain the original recipe data of each semiconductor machine manufacturer, and analyze and convert these data based on a preset parser to form recipe general data that conforms to the general data structure. Finally, the virtual machine uses these general data for wafer scheduling.
It realizes compatibility and interoperability of recipes of different manufacturers, improves the simulation accuracy and efficiency of virtual machine stations, reduces the workload of code development, and improves the readability and maintainability of programs.
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Figure CN120010989A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to a wafer scheduling method based on general recipe data and related equipment. Background Art
[0002] In the field of semiconductor technology, recipe refers to the process recipe or process recipe of semiconductor. It is a series of guidance documents that describe in detail the steps, parameters and material information required in the semiconductor processing process, and is also an operating guide to ensure that semiconductor machines can accurately perform specific processes. The SEMI E40 (SEMI standard: a series of standards for semiconductor equipment manufacturing issued by the International Semiconductor Equipment and Materials Industry Association) standard shows two main hierarchical structures of recipes: process recipe and sequence recipe. The process recipe defines the specific processing parameters of each processing unit, and the sequence recipe defines the processing order of the processing unit.
[0003] However, in actual applications, due to factors such as technology differences and customer demand diversity, semiconductor manufacturers cannot strictly follow the data structure defined in the SEMI E40 standard to define the machine recipe. Due to the inconsistency of recipe formats among manufacturers, virtual machines often encounter difficulties when applying these recipes for wafer scheduling. This difference brings great challenges to the application of virtual machines. Summary of the invention
[0004] In view of the shortcomings of the prior art, the present application provides a wafer scheduling method and related equipment based on universal recipe data to solve the problem of incompatible machine recipe formats provided by different manufacturers, thereby improving the simulation accuracy and efficiency of the virtual machine.
[0005] In order to achieve the above objectives and other advantages, the present application adopts the following technical solutions:
[0006] In a first aspect, the present application provides a wafer scheduling method based on general recipe data, which is applied to a semiconductor simulation system, comprising:
[0007] Define the common data structure used by the virtual machine for wafer scheduling;
[0008] Obtain the original recipe data of each semiconductor equipment manufacturer;
[0009] Parsing the recipe original data based on a preset parser and converting it into recipe general data that meets the requirements of the general data structure;
[0010] The virtual machine uses the recipe general data to perform wafer scheduling.
[0011] According to a wafer scheduling method based on universal recipe data provided in the present application, the universal data structure includes: at least one data unit including a recipe name field and a processing unit field, the data units are arranged in accordance with the wafer processing order, the recipe name field indicates the recipe name applied in the processing unit, and the processing unit field indicates an optional processing unit identifier.
[0012] According to a wafer scheduling method based on universal recipe data provided by the present application, when there are multiple processing units with the same capabilities, the processing unit field connects the multiple processing unit identifiers through a connector.
[0013] According to a wafer scheduling method based on universal recipe data provided by the present application, the step of parsing the recipe original data based on a preset parser and converting it into recipe universal data that meets the requirements of the universal data structure includes:
[0014] Identify the format of the recipe raw data;
[0015] Select the corresponding parser according to the recognized format;
[0016] The recipe raw data is parsed using the selected parser to extract the process parameter data required by the general data structure.
[0017] According to a wafer scheduling method based on universal recipe data provided by the present application, the step of converting into recipe universal data that meets the requirements of the universal data structure includes:
[0018] Define the mapping rules required to map the parsed process parameter data to the common data structure;
[0019] The mapping rule is applied to convert the process parameter data into recipe general data that meets the requirements of the general data structure.
[0020] According to a wafer scheduling method based on universal recipe data provided by the present application, the step of the virtual machine using the recipe universal data to perform wafer scheduling includes:
[0021] The virtual machine reads the recipe general data to obtain the processing unit and recipe name required for each step of wafer processing in the wafer processing sequence;
[0022] If there are multiple optional processing units, one of the processing units is selected, the wafer is transferred to the selected processing unit and processed according to the corresponding recipe name;
[0023] After the processing is completed, the wafer is transferred to the processing unit required for the next processing link for processing, and the processing is completed in all processing units according to the wafer processing sequence.
[0024] According to a wafer scheduling method based on universal recipe data provided by the present application, before the step of the virtual machine using the recipe universal data to perform wafer scheduling, the method further includes:
[0025] The converted recipe general data is cleaned and optimized, and the cleaned and optimized recipe general data is stored.
[0026] In a second aspect, the present application provides an electronic device, the electronic device comprising:
[0027] One or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processors execute the steps of the wafer scheduling method based on general recipe data as described above.
[0028] In a third aspect, the present application provides a computer-readable storage medium having a computer program / instruction stored thereon, which, when executed by a processor, implements the steps of a wafer scheduling method based on general recipe data as described in any one of the above.
[0029] In a fourth aspect, the present application provides a computer program product, including a computer program / instruction, which, when executed by a processor, implements the steps of any of the wafer scheduling methods based on general recipe data as described above.
[0030] The present application provides a wafer scheduling method and related equipment based on universal recipe data, which are applied to semiconductor simulation systems, by defining a universal data structure for wafer scheduling by a virtual machine; obtaining the original recipe data of each semiconductor machine manufacturer; parsing the original recipe data based on a preset parser, and converting it into the universal recipe data that meets the requirements of the universal data structure; the virtual machine uses the universal recipe data for wafer scheduling. The present application supports the application of wafer scheduling in a virtual machine by defining a structured and universal data structure, and can convert original recipe data in various formats into a unified data structure that can be understood and processed by the virtual machine, thereby achieving compatibility and interoperability of recipes from different manufacturers. Moreover, when facing new semiconductor equipment models or recipes of different structures in the future, only a single module needs to be adjusted or modified. Therefore, the workload of code development is greatly reduced, and the overall readability and maintainability of the program are effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other implementation methods can be obtained based on these drawings without paying any creative work.
[0032] Figure 1 It is a flow chart of a wafer scheduling method based on general recipe data and related equipment provided in an embodiment of the present application;
[0033] Figure 2 is a logical framework diagram of a semiconductor simulation system provided by an embodiment of the present application;
[0034] Figure 3 It is a structural schematic diagram of the electronic device provided by this application. DETAILED DESCRIPTION
[0035] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specifically cites the preferred embodiments and describes them in detail with the accompanying drawings.
[0036] It should be noted that it is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments without conflict. Unless otherwise defined, the technical terms or scientific terms involved in this application should be the usual meanings understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation and may represent the singular or plural. The terms "including", "comprising", "having" and any of their variations involved in this application are intended to cover non-exclusive inclusions; the terms "first", "second", "third", etc. involved in this application are merely to distinguish similar objects and do not represent a specific ordering of objects.
[0037] In the field of semiconductor manufacturing, machine recipes play a vital role. Recipes, also known as process recipes or process recipes, are a collection of manufacturing parameters that detail the precise steps and conditions that semiconductor machines should follow when performing specific processes. Semiconductor manufacturers rely on these precise recipes to ensure that machines can perform various complex manufacturing tasks as expected, thereby producing semiconductor products that meet quality standards.
[0038] A virtual machine is a software platform that simulates the operating environment of a real machine. It can simulate the semiconductor manufacturing process without relying on actual hardware. The applicant has found that in actual applications, semiconductor manufacturers do not strictly define the machine recipe in accordance with the data structure specified in the SEMI E40 standard. Each manufacturer often uses its own unique format and parameters when defining recipes. This difference poses a great challenge to the application of virtual machines, making it difficult for virtual machines to apply these recipes for wafer scheduling. Therefore, how to apply the recipes of various manufacturers for wafer scheduling has become a difficult problem that needs to be solved urgently for virtual machines. Based on this, the present application provides a wafer scheduling method and related equipment based on universal recipe data to solve the problem of incompatible machine recipe formats provided by different manufacturers, thereby improving the simulation accuracy and efficiency of virtual machines.
[0039] Reference Figure 1 As shown, the embodiment of the present application provides a wafer scheduling method based on universal recipe data, which is applied to a semiconductor simulation system. Figure 2As shown, the semiconductor simulation system integrates a general recipe generation module, a recipe parsing module, a scheduling module, etc. The recipe parsing module is used to parse the original recipe data of different machine manufacturers; the general recipe generation module defines the general data structure for wafer scheduling of the virtual machine, and generates the corresponding recipe general data according to the requirements of the general data structure; the scheduling module is used to simulate the processing and scheduling of the wafer according to the recipe general data. The module architecture of the semiconductor simulation system is divided in this way, which weakens the dependency of each module. For subsequent new semiconductor equipment models or recipe data with different data structures, it is only necessary to modify the logic implementation in the corresponding module, thereby reducing the workload of code development and effectively improving the overall readability and maintainability of the program.
[0040] The method includes:
[0041] Step S1: define a general data structure used by the virtual machine for wafer scheduling.
[0042] Specifically, design a general data structure to store recipe information. This data structure should be flexible enough to accommodate all possible information in recipes of different formats. For example, it can be a class, structure, dictionary, list, or a combination thereof.
[0043] Exemplarily, the general data structure includes: at least one data unit including a recipe name field processRecipeName and a processing unit field processModule, the data units are arranged in the order of wafer processing, the recipe name field processRecipeName indicates the recipe name applied in the processing unit, and the processing unit field processModule indicates the selectable processing unit identifier. Its data structure is as follows: [
[0045] {
[0046] "processRecipeName":null
[0047] "processModule":null
[0048] },
[0049] {
[0050] "processRecipeName":null
[0051] "processModule":null
[0052] },
[0053] {
[0054] "processRecipeName":null
[0055] "processModule":null
[0056] } ]
[0058] Step S2: Obtaining original recipe data of each semiconductor equipment manufacturer.
[0059] Specifically, for machines that support remote access or API interfaces, the original recipe data can be obtained from the information or technical documents provided by the semiconductor machine manufacturer through system docking. For machines that cannot be docked with the system, the original recipe data can be obtained from the information or technical documents provided by them. These data usually include key information such as process steps, parameter settings, and equipment configuration. The obtained original recipe data is verified, including checking whether the data format, parameter range, process steps, etc. meet the expected standards to ensure its accuracy and completeness. The verified recipe data needs to be properly stored and managed so that it can be called and modified in subsequent analysis.
[0060] Step S3: Parse the recipe original data based on a preset parser and convert it into recipe general data that meets the requirements of the general data structure.
[0061] In this embodiment, in step S3, the step of parsing the recipe original data based on a preset parser specifically includes:
[0062] Step S301: Identify the format of the recipe original data;
[0063] Step S302: Select a corresponding parser according to the recognized format;
[0064] Step S303: Use the selected parser to parse the recipe raw data to extract the process parameter data required by the general data structure.
[0065] Specifically, for files storing raw recipe data, such as JSON, XML, YAML, or text files, the system can identify the format by reading the file extension or parsing the data header information.
[0066] By designing a parsing module and building in multiple parsers, this parsing module can be applied to the software architecture of a virtual machine (or virtual manufacturing equipment, virtual processing equipment) semiconductor simulation system. The system selects the corresponding parser based on the format of the recipe raw data. These parsers can be specialized tools or libraries for specific data formats, such as script libraries for parsing CSV files, functions for parsing JSON data, etc. The parser will extract process parameter data that matches the general data structure based on the specific format and structure of the recipe raw data.
[0067] The parser can be encapsulated into a middleware or an interface. By calling the middleware or the interface, recipe files of different formats provided by various manufacturers can be uniformly parsed into a format of a common number structure that can be understood and processed by the virtual machine.
[0068] In this embodiment, in step S3, the step of converting into recipe general data that meets the requirements of the general data structure specifically includes:
[0069] Step S304: defining a mapping rule required to map the parsed process parameter data to a general data structure;
[0070] Step S305: Apply mapping rules to convert the process parameter data into recipe general data that meets the general data structure requirements.
[0071] Specifically, based on the analysis of the original recipe data and the requirements of the general data structure, the mapping rules required to map the parsed process parameter data to the general data structure are created. These mapping rules define how to convert the parsed process parameter data into corresponding fields in the target data structure.
[0072] According to the mapping rules defined in step S304, the process parameter data is converted into recipe general data conforming to the general data structure one by one or in batches by writing scripts or using data conversion tools, etc. This ensures that the original recipe data is accurately parsed and converted into recipe general data conforming to the general data structure requirements, thereby providing reliable, consistent and easy-to-use data support for the virtual machine.
[0073] For example, the recipe generic data converted to conform to the generic data structure requirements is as follows: [
[0075] {
[0076] "processRecipeName":"recipe_A,B"
[0077] "processModule":"A / B"
[0078] },
[0079] {
[0080] "processRecipeName":"recipe_C"
[0081] "processModule":"C"
[0082] },
[0083] {
[0084] "processRecipeName":"recipe_D,E"
[0085] "processModule":"D / E"
[0086] } ]
[0088] The recipe general data uses three processing units according to the wafer processing sequence, and each processing unit corresponds to a data unit {...}. Accordingly, the recipe general data is displayed with three data units. It should be noted that when there are multiple processing units with the same capability, the processing unit field connects multiple processing unit identifiers through a connector " / ", such as in the first data unit, there are processing units A and B with the same capability, and the field value is marked as "A / B", or, as in the third data unit, there are processing units D and E with the same capability, and the field value is marked as "D / E".
[0089] Step S4: the virtual machine uses the recipe general data to perform wafer scheduling.
[0090] Before step S4, the method further includes: cleaning and optimizing the converted recipe general data, and storing the cleaned and optimized recipe general data.
[0091] Clean the converted recipe general data to remove any redundant, duplicate or inconsistent data. Perform further optimization on the cleaned data, such as data sorting, data indexing, etc. Store the optimized recipe general data in an appropriate location, such as a database, file system or cloud storage, for subsequent use.
[0092] Semiconductor simulation systems need to define data interfaces that are compatible with common data structures. These interfaces will be used to read recipe common data from storage systems. These interfaces usually follow standard data access protocols such as REST API, Web services, etc. to ensure data accessibility and interoperability.
[0093] In this embodiment, step S4 specifically includes:
[0094] The virtual machine reads the recipe general data and obtains the processing unit and recipe name required for each step of wafer processing in the wafer processing sequence;
[0095] If there are multiple optional processing units, select one of the processing units, transfer the wafer to the selected processing unit and process it according to the corresponding recipe name;
[0096] After the processing is completed, the wafer is transferred to the processing unit required for the next processing link for processing, and the processing sequence of the wafer is followed until the processing of all processing units is completed.
[0097] Exemplarily, when simulating wafer scheduling according to the wafer processing sequence presented by the recipe general data in the above example, the specific scheduling process is: first read the first data unit of the recipe general data, select an available processing unit from processing unit A or B, and transfer the wafer to the selected processing unit for processing; after the first processing step is completed, read the second data unit of the recipe general data, and transfer the wafer to processing unit C for processing; after the second processing step is completed, read the third data unit of the recipe general data, and select an available processing unit from processing unit D or E for processing.
[0098] The virtual machine will also feed back relevant information to the semiconductor simulation system based on the data and results of the wafer processing process, so as to further optimize and improve the recipe general data. By continuously optimizing the recipe and wafer scheduling method, the efficiency and quality of wafer manufacturing can be continuously improved.
[0099] In summary, the present application provides a wafer scheduling method based on universal recipe data, which is applied to a semiconductor simulation system, by defining a universal data structure for wafer scheduling by a virtual machine; obtaining the original recipe data of each semiconductor machine manufacturer; parsing the original recipe data based on a preset parser, and converting it into recipe universal data that meets the requirements of the universal data structure; the virtual machine uses the recipe universal data for wafer scheduling. The present application supports the application of wafer scheduling in a virtual machine by defining a structured and universal data structure, and can convert original recipe data in various formats into a unified data structure that can be understood and processed by the virtual machine, thereby achieving compatibility and interoperability of recipes from different manufacturers. Moreover, when facing new semiconductor equipment models or recipes of different structures in the future, only a single module needs to be adjusted or modified. Therefore, the workload of code development is greatly reduced, and the overall readability and maintainability of the program are effectively improved.
[0100] Those skilled in the art will appreciate that, in the above method of specific implementation, the order in which the steps are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of the steps should be determined by their functions and possible internal logic.
[0101] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital processing, a cellular phone, a smart phone, a wearable device, and other similar computing devices.
[0102] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the wafer scheduling method based on general recipe data as provided in any one or more of the above embodiments. Figure 3 An exemplary structural diagram of the electronic device is disclosed. Figure 3As shown, the electronic device includes: one or more processors 1101, memory 1102, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.
[0103] The electronic device may further include: an input device 1103 and an output device 1104. The processor 1101, the memory 1102, the input device 1103 and the output device 1104 may be connected via a bus or other means. Figure 3 The example of connecting through bus is taken in the following.
[0104] The input device 1103 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 1104 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.
[0105] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).
[0106] In an embodiment of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the wafer scheduling method based on general recipe data provided in any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiment; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.
[0107] The memory 1102 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 1102, so as to implement the program instructions / modules corresponding to the method provided by any one or more embodiments in the embodiments of the present application.
[0108] The memory 1102 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 1102 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1102 may optionally include a memory remotely arranged relative to the processor 1101, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0109] It should be noted that more specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In the present application, a computer-readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.
[0110] Computer readable storage media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.
[0111] Computer program code for performing the operations of the present application may be written in one or more programming languages or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).
[0112] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.
[0113] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from a computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid state disk (SSD)), etc.
[0114] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.
[0115] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.
Claims
1. A wafer scheduling method based on general recipe data, characterized in that: Applied to semiconductor simulation systems, including: Define the common data structure used by the virtual machine for wafer scheduling; Obtain the original recipe data of each semiconductor equipment manufacturer; Parsing the recipe original data based on a preset parser and converting it into recipe general data that meets the requirements of the general data structure; The virtual machine uses the recipe general data to perform wafer scheduling.
2. The wafer scheduling method based on general recipe data according to claim 1, characterized in that: The general data structure includes: at least one data unit including a recipe name field and a processing unit field, the data units are arranged in a wafer processing order, the recipe name field indicates a recipe name applied in the processing unit, and the processing unit field indicates an optional processing unit identifier.
3. The wafer scheduling method based on general recipe data according to claim 2, characterized in that: When there are multiple processing units with the same capability, the processing unit field connects multiple processing unit identifiers through a connector.
4. The wafer scheduling method based on general recipe data according to claim 1, characterized in that: The step of parsing the recipe original data based on a preset parser and converting it into recipe general data that meets the requirements of the general data structure includes: Identify the format of the recipe raw data; Select the corresponding parser according to the recognized format; The recipe raw data is parsed using the selected parser to extract the process parameter data required by the general data structure.
5. The wafer scheduling method based on general recipe data according to claim 1 or 4, characterized in that: The step of converting into recipe general data that meets the requirements of the general data structure includes: Define the mapping rules required to map the parsed process parameter data to the common data structure; The mapping rule is applied to convert the process parameter data into recipe general data that meets the requirements of the general data structure.
6. The wafer scheduling method based on general recipe data according to claim 1 or 2, characterized in that: The step of the virtual machine using the recipe general data to perform wafer scheduling includes: The virtual machine reads the recipe general data to obtain the processing unit and recipe name required for each step of wafer processing in the wafer processing sequence; If there are multiple optional processing units, one of the processing units is selected, the wafer is transferred to the selected processing unit and processed according to the corresponding recipe name; After the processing is completed, the wafer is transferred to the processing unit required for the next processing link for processing, and the processing is completed in all processing units according to the wafer processing sequence.
7. The wafer scheduling method based on general recipe data according to claim 1, characterized in that: Before the step of the virtual machine using the recipe general data to perform wafer scheduling, the step further includes: The converted recipe general data is cleaned and optimized, and the cleaned and optimized recipe general data is stored.
8. An electronic device, characterized in that: The electronic device comprises: One or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor performs the steps of the wafer scheduling method based on general recipe data as described in any one of claims 1-7.
9. A computer-readable storage medium having a computer program / instruction stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the wafer scheduling method based on universal recipe data as described in any one of claims 1 to 7 are implemented.
10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instruction is executed by a processor, the steps of the wafer scheduling method based on universal recipe data as described in any one of claims 1 to 7 are implemented.