TDFIT-based radome thermal power and electricity integrated simulation analysis method

Abstract

The invention discloses a TDFIT-based radome thermal power and electricity integrated simulation analysis method, which comprises the following steps: carrying out flow field simulation analysis on a radome, and establishing a three-dimensional model of the radome; taking the actually measured temperature and the stress condition as boundary conditions, and performing thermodynamic and static simulation processing to obtain node coordinate-node temperature and node coordinate-node displacement mapping data; according to the temperature and material mapping relation, a TDFIT algorithm is adopted to carry out temperature distributed equivalent medium characterization analysis on the radome, and node coordinate-material parameter mapping data of the radome are obtained; and in combination with node coordinate-node displacement mapping data, processing the discrete grid model by adopting a spatial interpolation algorithm, and finally loading the node coordinate-material parameter mapping data to the antenna housing model to complete thermodynamic integrated simulation calculation.

Description

Technical Field

[0001] The present invention belongs to the technical field of electromagnetic communication, and in particular relates to a TDFIT-based simulation analysis method for thermal-electrical integration of a radome. Background Art

[0002] Under ideal conditions, the radome should not have a negative impact on the electrical performance of the radar antenna system, but it is difficult to avoid in actual service. As hypersonic aircraft pursue higher Mach numbers, larger flight airspace, and stronger service performance, the radome at the front of the aircraft not only bears more severe aerodynamic and aerodynamic heat loads during service, but also places higher requirements on the "transparency" of the radome and the stability of its electromagnetic performance.

[0003] However, mechanics, thermodynamics, and electromagnetism are multidisciplinary issues, and the coupling of thermoelectric parameters is difficult, which leads to the independence of mechanical / thermal design and electromagnetic design in the traditional design method of the radome, which makes the research on thermoelectric integration analysis and design of the radome relatively lagging, and has become an important factor restricting the high-level design of the radome and even hypersonic aircraft. Because the thermoelectric integration analysis of the radome has a series of problems such as unclear coupling relationship and limited analysis methods, the current analysis of the integrated performance of the radome mainly relies on thermoelectric integration tests. However, environmental tests have the disadvantages of limited test conditions and test conditions, long test cycles and huge costs. Although common commercial simulation software on the market, such as CST, has high-frequency electrical large-scale analysis functions, it cannot complete complete thermoelectric simulation. COMSOL and ANSYS have thermoelectric coupling analysis functions, but they mostly use finite element method to solve electromagnetic problems. The finite element method has high solution accuracy when solving electromagnetic scattering and radiation problems of electrically large-scale media, but the calculation efficiency is extremely low. Accurate thermo-electric integration analysis is not only an important basis for exploring the service safety of radomes, but also an important basis for guiding the structural design and experiments of radomes. Therefore, for antenna array-matching layer-radomes with unclear coupling relationships and large electrical dimensions, it is necessary to carry out thermo-electric integration simulation evaluation in the service environment, which is of great significance for supporting the design of good mechanical and electromagnetic performances. Summary of the invention

[0004] Purpose of the invention / technical problem: The present invention aims at the technical problems existing in the prior art. The present invention proposes a TDFIT-based simulation analysis method for the thermal-electrical integration of a radome, which can realize the electromagnetic performance evaluation of a radome model with both temperature and shape changes.

[0005] Technical solution: To achieve the above technical objectives, the present invention is implemented through the following technical solution: A TDFIT-based antenna cover thermal-electrical integration simulation analysis method, comprising the following steps: S1, conduct flow field simulation analysis on the radome and establish a three-dimensional model of the radome; S2, taking the measured temperature and force data of the radome as boundary conditions, and through thermal simulation processing, obtaining the mapping data of the node coordinates-node temperature and node coordinates-node displacement of the radome; S3, then, combining the mapping relationship between temperature and material parameters, the TDFIT algorithm is used to characterize and analyze the temperature distributed equivalent medium of the radome, and the mapping data of the node coordinates and material parameters of the radome are obtained; S4, according to the mapping data of node coordinates and node displacements, a discrete model of the deformed radome is obtained by using a spatial interpolation method; S5, combining the node coordinate-material parameter mapping data of step S3, loading the material parameters onto the discrete model to complete the thermodynamic integrated simulation calculation.

[0006] Furthermore, the specific process of performing temperature distribution equivalent medium characterization analysis on the radome in step S3 is as follows: S31, tetrahedral meshing is performed on each node of the three-dimensional model of the radome to obtain the tetrahedral mesh topology of the three-dimensional model of the radome, and then the medium parameters corresponding to the four vertices of the tetrahedral mesh are obtained; (the medium parameters corresponding to the four points of the tetrahedral mesh are averaged as the medium parameters of the tetrahedron, and different tetrahedrons correspond to different medium parameters, so as to characterize the medium distribution of the temperature distributed medium).

[0007] S32, the medium parameters of the four vertices of a single tetrahedral mesh are averaged and used as the medium parameters of the tetrahedral mesh to characterize the medium distribution of the temperature distributed medium; (that is, the corresponding relationship between the tetrahedron and the medium parameters is obtained, thereby achieving an approximate characterization of the temperature distributed equivalent medium through the tetrahedral mesh).

[0008] S33, the three-dimensional model of the radome is divided into right hexahedrons to obtain cubic unit cells; when there is no tetrahedron in the cell, the cell equivalent medium parameter adopts the background medium parameter ε0; when there is a tetrahedron in the cell, the cell equivalent medium parameter ε is obtained by the following formula: , In the formula, ε i represents the medium parameter of the i-th tetrahedron in the cell, and n is the number of tetrahedral meshes in the cell.

[0009] Furthermore, the specific steps of the spatial interpolation method in step S4 include: S41, dividing the original point cloud data into regions in space by establishing an octree, and each leaf node carries information of discrete points in the corresponding region; S42, locating the leaf node where the to-be-interpolated point is located, and interpolating the to-be-interpolated point using the discrete data on the leaf node; S43, respectively calculating the distances between the to-be-interpolated point and all discrete points carried by the leaf node where the to-be-interpolated point is located; S44, calculate the weight of each interpolation point by the following formula , , in, is any positive real number, usually 2, It represents the distance from the discrete point to the interpolation point and is calculated by the following formula, where N represents the number of discrete points; , In the formula, are the interpolation point coordinates, are the coordinates of discrete points; S34, calculate the shape variable of the point to be interpolated by the following formula , , in, Represents the spatial coordinates as The shape of the point, For the The weight of a discrete point, Indicates The shape variable information of each discrete point.

[0010] Furthermore, in step S2, the mapping data of the node displacement coordinates-node temperature includes stress, deformation displacement and temperature distribution on the structural grid.

[0011] Beneficial effects: Compared with the prior art, the present invention adopts the time-domain finite integration technology TDFIT, and the core technical advantages are: 1. Through the material mapping of point cloud to hexahedron, the corresponding relationship between any node and medium in the spatial range is constructed, breaking the limitation of the prior art that only layered calculation can be performed under high temperature; 2. The temperature change model and the deformation model adopt the octree space partitioning technology and the inverse distance weighted interpolation technology, which can more accurately characterize the medium parameters of each node and the deformation variable information of the deformation model under temperature change conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the simulation process of thermal-electrical integration of the antenna cover in TDFIT of the present invention.

[0013] Figure 2 A coordinate information diagram of each node of the tetrahedron-divided radome in an embodiment of the present invention.

[0014] Figure 3This is a diagram of a thermal simulation temperature node information output file in an embodiment of the present invention.

[0015] Figure 4 The left figure shows the curve of the material dielectric constant changing with temperature, and the right figure shows the curve of the material loss tangent changing with temperature.

[0016] Figure 5 Schematic diagram of material mapping from tetrahedron to hexahedron in an embodiment of the present invention, where A means there is no tetrahedron in the cell; B means there is one tetrahedron in the cell; and C means there are four tetrahedrons in the cell.

[0017] Figure 6 Schematic diagram of the principle of the octree space partitioning method described in an embodiment of the present invention.

[0018] Figure 7 This is the temperature distributed equivalent medium degradation model described in the embodiment of the present invention.

[0019] Figure 8 It is a schematic diagram of the layered model of the antenna cover described in an embodiment of the present invention.

[0020] Fig. 9 This is a gain comparison diagram (phi=0 degree plane) of the antenna cover with non-uniform distribution of medium parameters under different algorithms according to the embodiment of the present invention.

[0021] Fig.10 Schematic diagram of the positional relationship between the antenna and the plate after different simulations according to the embodiment of the present invention, where (a) is FASTEM simulation and (b) is CST simulation.

[0022] Fig.11 1 is a comparison curve diagram of the wave transmittance of the multilayer flat plate calculated by FASTEM and CST simulation in the embodiment of the present invention.

[0023] Fig.12 It is a schematic diagram of the electromagnetic modeling simulation process based on point cloud deformation input described in an embodiment of the present invention.

[0024] Fig.13 Schematic diagram of the deformation of the flat plate along the Y direction in an embodiment of the present invention.

[0025] Fig.14 The figure is a comparison diagram of the flat plate cover model before and after deformation in the embodiment of the present invention. The left figure is a schematic diagram of the flat plate without deformation; the right figure is a schematic diagram of the flat plate after deformation.

[0026] Fig.15The figure below is a comparison of the E-surface and H-surface gain results of the flat cover model before and after deformation in the embodiment of the present invention. The left figure is a comparison of the E-surface far-field gain before and after deformation at 17 GHz; the right figure is a comparison of the H-surface far-field gain before and after deformation at 17 GHz.

[0027] Fig.16 1 is a comparison chart of the E-surface results of the normal radome and the thermal radome at 17 GHz in an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means a limitation on the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise specified, the relative arrangement, expressions and numerical values ​​of the components and steps described in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The techniques, methods and devices known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the techniques, methods and devices should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0029] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations).

[0030] In the present invention, the material whose dielectric constant is non-uniformly distributed due to temperature is called temperature distributed equivalent medium. When performing thermal simulation, the directly obtained result is the temperature information corresponding to a series of spatial coordinates. Temperature changes will bring about changes in material properties. The impact on electromagnetic simulation is reflected in the impact on dielectric constant and magnetic permeability. Therefore, the impact of temperature on material parameters is reflected in the material modeling of the TDFIT algorithm, in which the key lies in grid mapping. The technical solution of the present invention is specifically described below.

[0031] 1. The logical process of the technical solution of the present invention is as follows: Figure 1 As shown: First, a flow field simulation analysis is performed to establish a three-dimensional model of the antenna cover. After post-processing, the node coordinate-temperature data of the antenna cover is exported. The obtained node coordinate-temperature data is imported and mapped to the solid domain surface as the boundary condition for solving the structural field. Then, heat transfer analysis and static simulation analysis are performed to solve the stress, deformation displacement and temperature distribution on the structural grid. The calculation results of the thermodynamic analysis and static analysis are extracted as node displacement coordinate information, and the temperature distribution is extracted as a node temperature mapping table. Finally, the node coordinate displacement information and the node temperature mapping table are imported for thermal-electrical integration simulation calculation. The thermal-electrical integration simulation process is as follows: Figure 1 shown.

[0032] When the present invention performs thermal simulation on the antenna cover, the directly obtained result is a series of temperature information corresponding to the spatial coordinates. The temperature change will bring about the change of material properties, and the impact on the electromagnetic simulation is reflected in the influence on the dielectric constant and magnetic permeability. When the antenna cover is subjected to force simulation, the directly obtained result is a series of deformation information corresponding to the spatial coordinates, and the shape change is directly reflected in the appearance of the model. Based on this, the present invention mainly includes two parts of work when mapping the medium corresponding to the point cloud to the hexahedron: point cloud data division in space and local interpolation calculation.

[0033] (1) Point cloud data division in space: tetrahedron to straight hexahedron mesh mapping

[0034] The spatial point cloud data is divided into octrees. Each leaf node stores the point cloud data in the corresponding area to prepare for subsequent interpolation acceleration.

[0035] When performing thermal simulation, different parameters will output different mesh topology information, such as tetrahedral mesh, hexahedral mesh, wedge mesh, etc. Since the tetrahedral mesh has a simple structure and is convenient for calculating and processing medium parameters, the present invention gives priority to the conversion of temperature data corresponding to the tetrahedral mesh output by thermal simulation to medium parameters on the hexahedral mesh of electromagnetic simulation.

[0036] Take the radome as an example. When the radome is heated on the surface and temperature distribution is generated, the corresponding medium parameters change from uniform distribution to non-uniform distribution. In order to use tetrahedrons to represent medium information, an approximate method is adopted to average the medium parameters corresponding to the four points of the tetrahedron grid as the medium parameters of the tetrahedron. Different tetrahedrons correspond to different medium parameters, so as to represent the medium distribution of temperature-distributed media. Figure 2 The figure shows the medium parameter table output by the radome according to the tetrahedral mesh processing. Figure 3 Shown is the node-temperature correspondence diagram after thermal simulation.

[0037] Furthermore, based on the determination of the radome material, the medium parameter and the temperature are in a one-to-one correspondence, and the specific medium parameter value can be obtained by looking up the table.

[0038] When the present invention uses the TDFIT algorithm to perform electromagnetic simulation, the target is divided into a straight hexahedron, and each small cubic unit obtained is called a cell. When the cell is filled with a medium, whether the tetrahedron is in the cell is used as a criterion, such as Figure 5 As shown in the figure, if a tetrahedron is in the cell, the medium parameters of the tetrahedron are obtained and filled into the cell; if there are multiple tetrahedrons, the average value is taken and filled into the grid cell; if there are none, the background medium is filled. In this way, the material mapping of the tetrahedron to the hexahedron can be realized, and then the electromagnetic simulation of the temperature distributed equivalent medium can be realized. The details are as follows: Figure 5 In the figure, A, B, and C are three different types of cells in the filling process. The background medium of the cell is ε0. There is no tetrahedron in cell A, there is a tetrahedron b1 in cell B, and there are 4 tetrahedrons c1, c2, c3, and c4 in cell C (there can be up to n tetrahedrons). The equivalent medium parameter ε of the three cells can be calculated by the following formula. When there is no tetrahedron in the cell, the cell equivalent medium parameter uses the background medium parameter ε0; when there is a tetrahedron in the cell, the equivalent medium parameter ε of the cell is obtained by the following formula, , Where ε0 represents the background medium parameter, ε i represents the tetrahedral medium parameters within the cell, and n is the number of tetrahedral grids within the cell.

[0039] In order to more accurately characterize the parameters of distributed materials, it is proposed to directly use the medium parameters corresponding to the point cloud as input to avoid using the tetrahedral grid to average the medium parameters. This can more accurately characterize the medium parameter information that changes with spatial position. Figure 4As shown in the figure, since temperature and medium parameters have a corresponding relationship, the specific values ​​are obtained by actual measurement, and the corresponding relationship between node information and medium parameter information can be obtained. When filling the medium, the center point of the cell represents the cell, and the data of the points near the cell are directly searched. The local interpolation method is used to accurately solve the medium parameter information of the interpolation point.

[0040] (2) Local interpolation algorithm

[0041] The present invention adopts the IDW spatial interpolation algorithm, assuming that each sampling point has a certain local influence ability, and the specific calculation process is as follows: for Given N points on , they will be interpolated to the point On, among them .definition Local interpolation function ,in , then for other points on the two-dimensional plane, their interpolation is regarded as the weighted average of the local interpolation function, as shown below:

[0042] In the above formula, yes The interpolation of represents a weight function that satisfies the following conditions: ,

[0043] There are many weight functions that meet the conditions. The expression of the weight function used in the present invention is as follows: , in, , is x and The Euclidean distance between them, u determines the continuity of interpolation. When u>1, the weight function is first-order differentiable, and In this way, the mapping of point cloud to hexahedral medium can be realized, and then the electromagnetic simulation of temperature distributed equivalent medium can be realized.

[0044] Example 1: Radiation characteristics of a radome with non-uniform distribution of medium parameters

[0045] by Figure 8 As an example, the radome is a layered model, the radome medium parameters are shown in Table 1, the voltage source excitation is set, the excitation waveform is a modulated Gaussian signal of 9.5GHz~10.5GHz, and the directional pattern gain at 10GHz is observed. FEKO is a traditional commercial software based on the full-wave analysis method. The calculation results of the present invention are compared with the calculation results of FEKO. The calculation results are shown in Table 1. Fig. 9 shown.

[0046] Table 1 Radome medium parameter list

[0047] Note: ε1~ε3 represent the relative dielectric constants of the upper, middle and lower targets respectively.

[0048] Depend on Fig. 9 It can be seen that the main lobe gain of the present invention is 2.9dBi, the main lobe gain calculated by FEKO is 3.35dBi, and the calculation results of the antenna cover with non-uniform distribution of medium parameters in FASTEM software and FEKO software are basically consistent, which proves the correctness of the FASTEM distributed material algorithm of the present invention.

[0049] 2. Wave transmission performance of multi-layer flat plate under point cloud input

[0050] Since there is no method for calculating temperature-distributed equivalent media in current commercial software, an equivalent method is used to verify the accuracy of the FASTEM method of the present invention in calculating temperature-distributed equivalent media.

[0051] First, the target structure of FASTEM calculation is a gradient material with a dielectric constant gradually increasing from 6 to 10 along the z direction (the target is 1 entity). In order to facilitate comparison with commercial software, since CST cannot set the temperature distributed equivalent medium, the calculation model is simplified during CST calculation, and the temperature distributed equivalent medium calculated by FASTEM is equivalent to the superposition of three layers of flat plates (the target is 3 entities). The dielectric constants of the three layers of flat plates along the positive direction of the z axis are 6, 8, and 10 respectively. The structures of the two are shown as follows Fig.10 The target size and material information calculated by CST are shown in Table 2:

[0052] Table 2 Size and material information of CST calculation target

[0053] When calculating the flat panel, the excitation is a modulated Gaussian of 4.5-5.5 GHz, and the antenna is a 7*7 electric dipole array. When the observation frequency is 5 GHz, the variation of the wave transmittance of the multilayer flat panel with the incident angle (-30~30°) calculated by different calculation software is shown in Table 3 below.

[0054] Table 3 Comparison of wave transmission performance of flat panels

[0055] like Fig.11 As shown in FIG. 1 , the wave transmittance comparison of the FASTEM and CST calculation plates of the present invention at 5 GHz. Fig.11It can be seen that when the incident angle changes in the range of -30° to 30°, the wave transmittance change trends of the equivalent flat plate calculated by CST and FASTEM are consistent. In the point cloud input mode, the error between the calculation result of the flat plate by FASTEM and that by CST is small. Therefore, the calculation result of the FASTEM according to the point cloud input mode of the present invention is more accurate.

[0056] Example 2: Deformable material simulation case

[0057] For the convenience of verification, the present invention takes a single-layer flat cover as an example, constructs a flat cover model with a size of , and a dielectric constant of 2.2. The model before deformation is shown in the figure, and only the flat plate is deformed along the Y direction. The deformation process is explained below using a two-dimensional graph as an example. Fig.13 As shown, the left figure is the main view of the plate, and then the plate is deformed along the Y direction, and no deformation occurs in the other two directions. The main view of the model after deformation is as follows Fig.13 As shown in the right figure, the main view changes from a rectangle to a parallelogram, and the height of the plate does not change. Fig.14 Shown is a comparison of the models before and after the flat cover is deformed.

[0058] The excitation is a dipole 20×16 array antenna excited by a voltage source, in which the length of a single voltage source is 0.441mm, the size of the ground plate is, and the excitation source is a Gaussian pulse of 14~20GHz, which causes the flat cover to deform. A simple deformation geometry model and a deformation geometry model formed by a node displacement file are constructed respectively, and the far-field radiation gain is observed and compared to verify the function of deformation material modeling.

[0059] Depend on Fig.14 The deformed model shows that the interpolated model is in line with expectations. Fig.15 It can be seen that the main lobe gain of the model before the radome deformation is 10.73dBi, and the main lobe gain of the model after the deformation is 10.05dBi, but the main lobe angle is offset by about 2.5°. The gain curve of the model pattern before the E-plane and H-plane deformation and the model after the deformation show a large difference. Thermoelectric integration simulation analysis: The present invention performs a thermoelectric integration simulation comparison of the antenna-radome based on the provided deformation temperature change data. The simulation parameters are shown in Tables 4 and 5 below:

[0060] Table 4 Model node displacement table

[0061] Table 5 Model node temperature table

[0062] As shown in Table 6, it is a mapping table of construction material and temperature.

[0063] Table 6 Material temperature mapping table

[0064] The antenna-radome results on the E and H surfaces are plotted and compared as shown in Table 7. The frequency increases from top to bottom.

[0065] Table 7 Comparison of maximum gain, transmittance and other parameters of antenna, normal radome and thermal radome

[0066] It can be seen from Table 7 that the frequency of the E and H surfaces increases from top to bottom. From the simulation results, it can be seen that the electromagnetic response results of the radomes of the E and H surfaces are relatively similar, and the trend of change with frequency is also the same. The aiming line error of the radome under normal environment and the radome under thermal environment is extremely small. As the frequency increases, the transmittance and 3dB bandwidth of the normal radome and the thermal radome deteriorate more seriously. Under certain frequency conditions, the main lobe gain and 3dB bandwidth of the normal radome and the thermal radome are slightly different, but as the frequency increases, the main lobe gain and transmittance of the radome under thermal constraints deteriorate more than those under normal environment.

[0067] The present invention maps the influence of temperature change and deformation on the radome into the change of medium parameters and position of each node in space, so as to achieve the purpose of integrated force, heat and electricity analysis of the radome. This method can more accurately characterize the medium parameter information that changes with temperature and the position information that changes with space, has a wider range of applications and higher calculation accuracy; the integrated analysis of the radome can effectively simulate the change of electrical performance of the aircraft during high-speed flight, avoid repeated cycles of design and testing during the design process, can effectively shorten the iteration time and cost of the radome design, and has high engineering value.

[0068] The above descriptions are only some embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A TDFIT-based simulation analysis method for thermal-electrical integration of a radome, characterized in that The following steps are involved: S1, conduct flow field simulation analysis on the radome and establish a three-dimensional model of the radome; S2, taking the measured temperature and force data of the radome as boundary conditions, and through thermal simulation processing, obtaining the mapping data of the node coordinates-node temperature and node coordinates-node displacement of the radome; S3, then, combining the mapping relationship between temperature and material parameters, the TDFIT algorithm is used to characterize and analyze the temperature distributed equivalent medium of the radome, and the mapping data of the node coordinates and material parameters of the radome are obtained; S4, according to the mapping data of node coordinates and node displacements, a discrete model of the deformed radome is obtained by using a spatial interpolation method; S5, combining the node coordinate-material parameter mapping data of step S3, loading the material parameters onto the discrete model to complete the thermodynamic integrated simulation calculation.

2. The TDFIT-based thermal-electrical integration simulation analysis method for a radome according to claim 1, characterized in that: The specific process of performing temperature distribution equivalent medium characterization analysis on the radome in step S3 is as follows: S31, tetrahedral meshing is performed on each node of the three-dimensional model of the radome to obtain the tetrahedral mesh topology of the three-dimensional model of the radome, and then the medium parameters corresponding to the four vertices of the tetrahedral mesh are obtained; (the medium parameters corresponding to the four points of the tetrahedral mesh are averaged as the medium parameters of the tetrahedron, and different tetrahedrons correspond to different medium parameters, so as to characterize the medium distribution of the temperature distributed medium) S32, the medium parameters of the four vertices of a single tetrahedral mesh are averaged and used as the medium parameters of the tetrahedral mesh to characterize the medium distribution of the temperature distributed medium; (that is, the corresponding relationship between the tetrahedron and the medium parameters is obtained, so that the approximate characterization of the temperature distributed equivalent medium through the tetrahedral mesh is realized) S33, the three-dimensional model of the radome is divided into right hexahedrons to obtain cubic unit cells; when there is no tetrahedron in the cell, the cell equivalent medium parameter adopts the background medium parameter ε0; when there is a tetrahedron in the cell, the cell equivalent medium parameter ε is obtained by the following formula: ， In the formula, ε i represents the medium parameter of the i-th tetrahedron in the cell, and n is the number of tetrahedral meshes in the cell.

3. The TDFIT-based thermal-electrical integration simulation analysis method for a radome according to claim 2 is characterized in that: The specific steps of the spatial interpolation method in step S4 include: S41, dividing the original point cloud data into regions in space by establishing an octree, and each leaf node carries information of discrete points in the corresponding region; S42, locating the leaf node where the to-be-interpolated point is located, and interpolating the to-be-interpolated point using the discrete data on the leaf node; S43, respectively calculating the distances between the to-be-interpolated point and all discrete points carried by the leaf node where the to-be-interpolated point is located; S44, calculate the weight of each interpolation point by the following formula , ， in, is any positive real number, usually 2, It represents the distance from the discrete point to the interpolation point and is calculated by the following formula, where N represents the number of discrete points; ， In the formula, are the interpolation point coordinates, are the coordinates of discrete points; S34, calculate the shape variable of the point to be interpolated by the following formula , ， in, The spatial coordinates are The shape of the point, For the The weight of the discrete points, Indicates The shape variable information of each discrete point.

4. The TDFIT-based thermal-electrical integration simulation analysis method for a radome according to claim 1 is characterized in that: In step S2, the mapping data of the node displacement coordinates-node temperature includes stress, deformation displacement and temperature distribution on the structural grid.

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