Coating die head structure optimization method, device, equipment, medium and program product

Abstract

The embodiment of the invention provides a coating die head structure optimization method and device, equipment, a medium and a program product. The method comprises the following steps: receiving condition parameters; the condition parameters comprise initial structure parameters of the coating die head; generating an initial coating die head structure model by adopting the initial structure parameters of the coating die head; the initial coating die head structure model is a three-dimensional model; determining a target topological optimization structure based on the initial coating die head structure model and condition parameters; the target topological optimization structure comprises internal and external sizes and shapes of a target coating die head; the target topological optimization structure meets constraint parameters in the condition parameters; displaying the target topological optimization structure so as to manufacture a target coating die head based on the target topological optimization structure; and the target coating die head enables the fluid to uniformly flow out.

Description

Technical Field

[0001] The present application relates to the field of computers, and in particular to a coating die structure optimization method, device, equipment, medium and program product. Background Art

[0002] The manufacturing process of lithium batteries requires the use of slurry for coating. The uniformity of coating directly affects the life and battery effect of lithium batteries. The uniformity of slurry coating is directly related to the coating die structure, so the coating die structure needs to be designed.

[0003] In the prior art, when optimizing the coating die structure, users usually adjust the size and shape of the coating die based on their experience to design different coating dies, and then test the multiple designed coating dies to select the coating die with better effect.

[0004] However, the prior art relies on the user's experience and is therefore limited by thinking; in addition, the prior art requires the design of multiple different coating dies, and only after testing can a better coating die be selected, which reduces work efficiency and wastes materials for manufacturing redundant coating dies. Summary of the invention

[0005] The embodiments of the present application provide a coating die structure optimization method, device, equipment, medium and program product to achieve the effect of improving work efficiency and saving materials.

[0006] In a first aspect, the present application provides a coating die structure optimization method, comprising:

[0007] receiving condition parameters, wherein the condition parameters include initial structure parameters of the coating die;

[0008] The initial coating die head structure model is generated by using the initial structure parameters of the coating die head; the initial coating die head structure model is a three-dimensional model;

[0009] Determine a target topology optimization structure based on the initial coating die structure model and condition parameters; the target topology optimization structure includes internal and external dimensions and shapes of the target coating die; the target topology optimization structure satisfies the constraint parameters in the condition parameters;

[0010] The target topology optimization structure is displayed to manufacture a target coating die based on the target topology optimization structure; the target coating die enables the fluid to flow out uniformly.

[0011] Optionally, determining a target topology optimization structure based on the initial coating die structure model and condition parameters includes:

[0012] Reading initial boundary parameters from the condition parameters; the initial boundary parameters include the initial inlet average velocity and initial inlet temperature of the fluid and the initial outlet average pressure;

[0013] Inputting the initial boundary parameters into a fluid dynamics simulation model to output initial physical field data; the initial physical field data includes an initial fluid state; the initial fluid state includes an initial outlet velocity distribution;

[0014] The target topology optimization structure is determined based on the initial physical field data and the initial coating die structure model.

[0015] Optionally, determining a target topology optimization structure based on the initial physical field data and the initial coating die structure model includes:

[0016] Reading the initial outlet velocity distribution of the fluid in the fluid domain of the initial coating die structure model from the initial physical field data; calculating the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm;

[0017] A target topology optimization structure is determined based on the initial uniform value.

[0018] Optionally, determining a target topology optimization structure based on the initial uniform value includes:

[0019] Reading a preset average value from the condition parameter;

[0020] If the initial uniform value is greater than or equal to the preset uniform value, adjusting the initial boundary parameter, and determining the target topology optimization structure based on the adjusted boundary parameter;

[0021] If the initial uniform value is less than the preset uniform value, the initial physical field data and the initial coating die structure model are input into a topology optimization program to output a target topology optimization structure.

[0022] Optionally, determining the target topology optimization structure based on the adjusted boundary parameters includes:

[0023] Inputting the adjusted boundary parameters into a fluid dynamics simulation model to output adjusted physical field data;

[0024] reading an adjusted outlet velocity distribution from the adjusted physical field data;

[0025] Calculating an adjusted uniform value based on the adjusted outlet velocity distribution and a fluid outlet velocity uniformity algorithm;

[0026] If the adjusted uniform value is greater than or equal to the preset uniform value, continue to perform the step of adjusting the boundary parameters to calculate the corresponding uniform value until there is an adjusted uniform value that is less than the preset uniform value, and input the corresponding physical field data into the topology optimization program, so as to optimize and output the target topology optimization structure based on the initial coating die structure model;

[0027] If the adjusted uniform value is less than the preset uniform value, the adjusted physical field data is input into the topology optimization program so as to optimize and output the target topology optimization structure based on the initial coating die structure model.

[0028] Optionally, the calculating the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm includes:

[0029] determining a maximum initial fluid velocity and a minimum initial fluid velocity in the fluid domain from the initial outlet velocity distribution;

[0030] Inputting the maximum initial fluid velocity and the minimum initial fluid velocity into the fluid outlet velocity uniformity algorithm, and calculating an initial difference between the maximum initial fluid velocity and the minimum initial fluid velocity;

[0031] The initial difference value is determined as an initial average value.

[0032] Optionally, the method further includes:

[0033] Controlling the target coating die to start coating;

[0034] Monitor the actual coating parameters of the target coating die head during coating; the actual coating parameters include at least one of the actual average outlet velocity value of the fluid, the actual average coating pressure and the actual coating temperature; in response to the actual coating parameters not meeting the preset coating parameters, issue an alarm to prompt.

[0035] In a second aspect, the present application provides a coating die structure optimization device, comprising:

[0036] A receiving module, used for receiving condition parameters; the condition parameters include initial structure parameters of the coating die;

[0037] A generating module, used to generate an initial coating die structure model using the coating die initial structure parameters; the initial coating die structure model is a three-dimensional model;

[0038] A determination module is used to determine a target topology optimization structure based on the initial coating die structure model and condition parameters; the target topology optimization structure includes internal and external dimensions and shapes of the target coating die; the target topology optimization structure satisfies the constraint parameters in the condition parameters;

[0039] The display module is used to display the target topology optimization structure so as to manufacture a target coating die head based on the target topology optimization structure; the target coating die head enables the fluid to flow out evenly.

[0040] In a third aspect, the present application provides an electronic device, including: a memory and a processor;

[0041] The memory stores computer-executable instructions;

[0042] The processor executes the computer-executable instructions stored in the memory, so that the processor executes the method as described in the first aspect or any one of the above-mentioned methods.

[0043] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer-executable instructions, and the computer-executable instructions are executed by a processor as described in the first aspect or any one of the above methods.

[0044] In a fifth aspect, the present application provides a computer program product, including a computer program, which is executed by a processor as described in the first aspect or any one of the above methods.

[0045] The coating die structure optimization method, device, equipment, medium and program product provided in the embodiments of the present application include: receiving condition parameters; the condition parameters include initial structure parameters of the coating die; using the initial structure parameters of the coating die to generate an initial coating die structure model; the initial coating die structure model is a three-dimensional model; determining a target topology optimization structure based on the initial coating die structure model and the condition parameters; the target topology optimization structure includes internal and external dimensions and shapes of the target coating die; the target topology optimization structure satisfies the constraint parameters in the condition parameters; displaying the target topology optimization structure to manufacture a target coating die based on the target topology optimization structure; the target coating die allows the fluid to flow out evenly. The conditional parameters in this application include the initial structural parameters of the coating die, so that the initial coating die structure model can be generated, and then the target topological optimization structure can be determined on this basis. The conditional parameters in this application also set constraint parameters so that the target topological optimization structure satisfies the constraint parameters, so that the target topological optimization structure is more reasonable and accurate, and then the target coating die is manufactured based on this. The target coating die can make the fluid flow out evenly, so it can ensure the stability and uniformity during coating, that is, it can ensure that when the fluid is coated at the slit outlet of the coating die, the outlet velocity of the fluid is consistent in the fluid domain of the coating die, so that the coating thickness is also consistent. The use of equipment to design the target topological optimization structure in this application can save manpower and is not limited by artificial thinking. At the same time, it abandons the method of determining a better coating die by testing from a large number of coating dies in the prior art, so that the materials generated by manufacturing a large number of coating dies can be saved, because only one target coating die needs to be manufactured in this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0047] Figure 1 A schematic diagram of the topological optimization structure of the coating die provided in this application;

[0048] Figure 2 A schematic diagram of a coating die structure optimization method provided in Example 1;

[0049] Figure 3 A schematic diagram of a coating die structure optimization method provided in Example 2;

[0050] Figure 4 A schematic diagram of a coating die structure optimization method provided in Example 4;

[0051] Figure 5 A schematic diagram of a coating die head structure optimization method provided in Example 5;

[0052] Figure 6 A schematic diagram of a coating die structure optimization method provided in Example 6;

[0053] Figure 7 A schematic diagram of a coating die head structure optimization method provided in Example 7;

[0054] Figure 8 An overall schematic diagram of a coating die structure optimization method provided in Example 8

[0055] Fig. 9 A schematic diagram of a coating die head structure optimization device provided in Example 9;

[0056] Fig.10 This is a schematic diagram of the structure of an electronic device provided in Example 9.

[0057] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0058] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0059] In the prior art, when optimizing the coating die structure, users usually adjust the size and shape of the coating die based on their experience to design different coating dies, and then test the multiple designed coating dies to select the coating die with better effect.

[0060] However, the existing technology relies on the user's experience, so it is limited by thinking; in addition, the existing technology requires the design of multiple different coating dies, and only after testing can a better coating die be selected, which reduces work efficiency and wastes materials for manufacturing redundant coating dies. It should be noted that most of the existing technologies adjust the external size and shape of the coating die, so the rationality is relatively low.

[0061] In order to solve the above problems, this application proposes a coating die head topology optimization structure method after a series of studies. In order to solve the problem of reducing work efficiency in the prior art, this application uses electronic equipment to determine the target topology optimization structure based on the initial coating die head structure model and conditional parameters, so that the target topology optimization structure can be quickly obtained, and then the target coating die head can be quickly obtained, thereby improving work efficiency; in order to solve the problem of waste of materials in the prior art by determining a better coating die head through experiments from a large number of coating die heads, the electronic equipment in this application only needs to determine a target topology optimization structure, so as to manufacture a target coating die head based on the above target topology optimization structure, so there is no need to manufacture multiple coating die heads in this application, so materials are saved. In addition, the present application also solves the problem of low rationality of the coating die. The target topology optimization structure obtained in the present application includes not only the external size and shape of the target coating die, but also its internal size and shape, that is, the size and shape of the internal cavity of the coating die. In addition, the conditional parameters in the present application also include constraint parameters, which are used to constrain the target topology optimization structure so that it is within a suitable range or state. Therefore, the target topology optimization structure in the present application is more reasonable and accurate; due to the improvement of its rationality and accuracy, the target coating die manufactured based on the target topology optimization structure is more reasonable. At the same time, it is more reasonable to optimize the internal and external sizes and shapes, so that the fluid can flow out evenly in the target coating die.

[0062] Figure 1 A schematic diagram of the topological optimization structure of the coating die provided in this application, such as Figure 1 As shown, the specific application scenario of the present application includes an electronic device 101 and a target coating die head 102 .

[0063] The electronic device 101 may be a computer or a server, etc., which is not limited here.

[0064] The target coating die head 102 and the electronic device 101 may be connected via a communication module in a wired or wireless manner.

[0065] In this scenario, specifically, the user can input condition parameters based on the electronic device 101, so that the electronic device 101 receives the condition parameters, and the condition parameters include the initial structure parameters of the coating die.

[0066] Furthermore, the electronic device 101 generates an initial coating die structure model using the coating die initial structure parameters.

[0067] Furthermore, the electronic device 101 determines a target topology optimization structure based on the initial coating die structure model and condition parameters.

[0068] Furthermore, the electronic device 101 displays the target topology optimized structure.

[0069] Furthermore, the user fine-tunes the target topology optimization structure to produce a target coating die 102 .

[0070] The coating die structure optimization method provided in the present application determines the target topology optimization structure through electronic equipment, thereby improving efficiency; in the present application, only one target coating die needs to be manufactured, thereby saving materials; in the present application, the target topology optimization structure includes not only external dimensions and shapes, but also internal dimensions and shapes, so that the target topology optimization structure is more reasonable and accurate, and the manufacture of the target coating die is also more reasonable and accurate, thereby making the fluid flow out evenly in the target coating die, thereby improving stability and uniformity.

[0071] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0072] Embodiment 1

[0073] The execution body of Examples 1 to 7 of the present application is a coating die structure optimization device, which is located in an electronic device.

[0074] Figure 2 Schematic diagram of a coating die head structure optimization method provided in Example 1. Figure 2 As shown, including:

[0075] S201, receiving condition parameters; the condition parameters include initial structure parameters of the coating die.

[0076] The condition parameters refer to any parameters required to determine the target topology optimization structure.

[0077] The coating die initial structural parameters refer to the parameters describing the initial geometric structure and topological characteristics of the coating die. The coating die initial structural parameters include: coating die initial length L, coating die initial width W, coating die initial height H, coating die initial slit outlet height h, wherein the slit outlet refers to the outlet from which the fluid flows out.

[0078] In one embodiment, the condition parameter may be input by a user on the electronic device, so that the electronic device may receive the condition parameter.

[0079] Among them, the condition parameters also include fluid property parameters and flow target parameters, among which, the fluid property parameters refer to parameters describing the physical properties of the fluid, including: fluid density and fluid viscosity, etc.; the flow target parameters refer to parameters describing the flow performance target of the coating die head, including: flow resistance, average inlet and outlet pressure difference, and at least one of the preset uniform values.

[0080] S202, generating an initial coating die structure model using the coating die initial structure parameters; the initial coating die structure model is a three-dimensional model.

[0081] In one embodiment, the electronic device inputs the initial structure parameters of the coating die into a modeling algorithm to generate an initial coating die structure model.

[0082] The initial coating die structure model refers to a three-dimensional structure model generated based on the initial structure parameters of the coating die.

[0083] S203, determining a target topology optimization structure based on the initial coating die structure model and conditional parameters; the target topology optimization structure includes internal and external dimensions and shapes of the target coating die; and the target topology optimization structure satisfies constraint parameters in the conditional parameters.

[0084] The target topology optimization structure refers to the final topology optimization structure obtained after dynamic optimization based on the initial coating die structure model.

[0085] The target topology optimization structure includes an exterior and an interior, and the interior is the coating die cavity. In this application, the target topology optimization structure includes internal and external dimensions and shapes. The dimensions refer to the length, height, width and slit outlet height of the coating die, which are the final dimensions. The shape refers to shape parameters, including curvature, angle, etc.

[0086] Among them, the constraint parameters refer to the parameters that constrain the target topology optimization structure, including the minimum volume parameter of the coating die cavity and the maximum volume parameter of the coating die cavity, etc., which are not limited here. For example, assuming that the minimum volume parameter of the coating die cavity is X1 and the maximum volume parameter of the coating die cavity is X2, the volume of the target coating die cavity is between X1 and X2.

[0087] In one embodiment, the electronic device can use a fluid dynamics simulation model and a topology optimization program to dynamically optimize a target topology optimized structure based on an initial coating die structure model and conditional parameters.

[0088] S204, displaying a target topology optimization structure, so as to manufacture a target coating die head based on the target topology optimization structure; the target coating die head enables the fluid to flow out uniformly.

[0089] Furthermore, the electronic device displays the target topology optimized structure, so that the user can directly manufacture the target coating die head based on the target topology optimized structure.

[0090] Among them, the target coating die head refers to the coating die head that is finally manufactured based on the target topology optimization structure.

[0091] The target coating die head includes a fluid inlet, a main body and a slit outlet, wherein the main body is manufactured from a target topologically optimized structure, and the fluid inlet and the slit outlet can be pre-set.

[0092] In one approach, the user can make fine adjustments based on the target topology optimization structure, and manufacture the target coating die head based on the fine-tuned topology optimization structure.

[0093] The present embodiment provides a coating die structure optimization method, comprising: receiving condition parameters; the condition parameters include initial structure parameters of the coating die; using the initial structure parameters of the coating die to generate an initial coating die structure model; the initial coating die structure model is a three-dimensional model; determining a target topology optimization structure based on the initial coating die structure model and the condition parameters; the target topology optimization structure includes internal and external dimensions and shapes of the target coating die; the target topology optimization structure satisfies the constraint parameters in the condition parameters; displaying the target topology optimization structure to manufacture a target coating die based on the target topology optimization structure; the target coating die allows the fluid to flow out evenly. The conditional parameters in this application include the initial structural parameters of the coating die, so that the initial coating die structure model can be generated, and then the target topological optimization structure can be determined on this basis. The conditional parameters in this application also set constraint parameters so that the target topological optimization structure satisfies the constraint parameters, so that the target topological optimization structure is more reasonable and accurate, and then the target coating die is manufactured based on this. The target coating die can make the fluid flow out evenly, so it can ensure the stability and uniformity during coating, that is, it can ensure that when the fluid is coated at the slit outlet of the coating die, the outlet velocity of the fluid is consistent in the fluid domain of the coating die, so that the coating thickness is also consistent. The use of equipment to design the target topological optimization structure in this application can save manpower and is not limited by artificial thinking. At the same time, it abandons the method of determining a better coating die by testing from a large number of coating dies in the prior art, so that the materials generated by manufacturing a large number of coating dies can be saved, because only one target coating die needs to be manufactured in this application.

[0094] Embodiment 2

[0095] This embodiment is a further refinement of any of the above embodiments. This embodiment is a further refinement of the target topology optimization structure determined based on the initial coating die structure model and conditional parameters.

[0096] Figure 3A schematic diagram of a coating die structure optimization method provided in Example 2. Figure 3 As shown, specifically including:

[0097] S301, reading initial boundary parameters from condition parameters; the initial boundary parameters include the initial inlet average velocity and initial inlet temperature of the fluid and the initial outlet average pressure.

[0098] The boundary parameters are parameters that describe the boundary conditions of the coating die.

[0099] The inlet average velocity refers to the average velocity of the fluid when it enters the body from the inlet. The initial inlet average velocity refers to the initial inlet average velocity preset in the condition parameters.

[0100] The inlet temperature refers to the temperature of the fluid at the inlet.

[0101] The average outlet pressure refers to the average pressure of the fluid at the slit outlet. It should be noted that the average outlet pressure can represent the average flow rate of the fluid at the slit outlet.

[0102] S302, inputting initial boundary parameters into a fluid dynamics simulation model to output initial physical field data; the initial physical field data includes an initial fluid state; the initial fluid state includes an initial outlet velocity distribution.

[0103] In this application, a fluid dynamics simulation model needs to be built in advance.

[0104] In one approach, initial boundary parameters are input into a fluid dynamics simulation model for initial solution to obtain initial physical field data.

[0105] The initial physical field data refers to the physical field data obtained under the initial boundary parameters.

[0106] The outlet velocity distribution refers to the velocity distribution of the fluid in the fluid domain at the slit outlet.

[0107] In the present application, the fluid dynamics simulation model solves the partial differential PDE equation to obtain initial physical field data.

[0108] Among them, the initial physical field data is the simulation result.

[0109] S303, determining a target topology optimization structure based on the initial physical field data and the initial coating die structure model.

[0110] In one approach, the initial physical field data needs to be analyzed to optimize or adjust the boundary parameters, and then the target topology optimization structure can be determined based on the initial coating die structure model.

[0111] The present embodiment provides a coating die structure optimization method, comprising: inputting initial boundary parameters in the condition parameters into a fluid dynamics simulation model, thereby outputting an initial physical field, and then determining a target topology optimization structure based on the initial physical field and the initial coating die structure model. In the present application, initial physical field data is obtained based on the fluid dynamics simulation model. Since the initial physical field data includes an initial fluid state, wherein the initial fluid state includes an outlet velocity distribution, the target topology optimization structure can be accurately determined based on the outlet velocity distribution, thereby enabling the fluid in the target coating die to flow out evenly.

[0112] Embodiment 3

[0113] This embodiment is a further refinement of any of the above embodiments. This embodiment is an optional method for determining the target topology optimization structure based on the initial physical field data and the initial coating die structure model, specifically including:

[0114] The initial outlet velocity distribution of the fluid in the fluid domain in the initial coating die structure model is read from the initial physical field data; the initial uniform value is calculated based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm; and the target topology optimization structure is determined based on the initial uniform value.

[0115] The fluid outlet velocity uniformity algorithm refers to the algorithm for calculating the uniform value of the fluid outlet velocity, as shown in formula (1):

[0116] (1):

[0117] in, It refers to the average value, max(V) is the maximum velocity in the fluid domain, and min(V) is the minimum velocity in the fluid domain.

[0118] The uniformity value refers to the uniformity of the fluid flowing in the fluid domain at the slit outlet. The smaller the uniformity value, the greater the uniformity of the fluid flowing in the fluid domain at the slit outlet.

[0119] The initial outlet velocity distribution refers to the outlet velocity distribution of the fluid in the slit outlet fluid domain in the initial coating die structure model.

[0120] The initial uniform value refers to the uniform value calculated in the initial outlet velocity distribution.

[0121] In one approach, the electronic device determines a target topology optimization structure based on the size of the initial uniform value.

[0122] This embodiment provides a coating die structure optimization method, including: reading the initial outlet velocity distribution of the fluid in the fluid domain in the initial coating die structure model from the initial physical field data; calculating the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm; and determining the target topology optimization structure based on the initial uniform value. In this application, the initial outlet velocity distribution is taken into account and the initial uniform value is calculated. Since the initial uniform value can characterize the consistency of the outlet velocity of the fluid in the fluid domain at this time, it is more reasonable and accurate to determine the target topology optimization structure based on the initial uniform value, so that the fluid in the target coating die can flow out evenly.

[0123] Embodiment 4

[0124] This embodiment is a further refinement of any of the above embodiments. This embodiment is an optional way to determine the target topology optimization structure based on the initial uniform value.

[0125] Figure 4 This is a schematic diagram of a coating die structure optimization method provided in Example 4. Figure 4 As shown, specifically including:

[0126] S401, reading a preset average value from a condition parameter.

[0127] The preset uniform value refers to the uniform value that the fluid outlet velocity is preset to achieve.

[0128] It should be noted that when the fluid is exported in the fluid domain, there may be a sub-area where the fluid is exported at V1 and another sub-area where the fluid is exported at V2, wherein V1 and V2 are very different, resulting in poor consistency of the outlet velocity, which in turn affects the uniformity of the outlet. Therefore, a uniform value to be achieved is pre-set in this application. When this preset uniform value is met, it means that the outlet velocity of the fluid in the fluid domain is basically consistent, which can ensure stability and uniformity. When this preset uniform value is not met, it means that the outlet velocity of the fluid in the fluid domain has poor consistency.

[0129] S402: If the initial uniform value is greater than or equal to the preset uniform value, adjust the initial boundary parameters, and determine the target topology optimization structure based on the adjusted boundary parameters.

[0130] It should be noted that if the initial uniform value is greater than or equal to the preset uniform value, it means that the outlet velocity consistency of the fluid in the fluid domain corresponding to the initial coating die structure model is poor and meets the preset uniform value.

[0131] Furthermore, the electronic device adjusts the boundary parameters and re-determines the target topology optimization structure based on the adjusted boundary parameters.

[0132] S403, if the initial uniform value is less than the preset uniform value, the initial physical field data and the initial coating die structure model are input into the topology optimization program to output the target topology optimization structure.

[0133] It should be noted that if the initial uniform value is less than the preset uniform value, it means that the outlet velocity of the fluid in the fluid domain corresponding to the initial coating die structure model is relatively consistent and meets the preset uniform value.

[0134] Furthermore, the electronic device inputs the initial physical field data and the initial coating die structure model into the topology optimization program, so that the topology optimization program performs optimization based on the initial coating die structure model to obtain a target topology optimization structure.

[0135] The present embodiment provides a coating die structure optimization method, including: reading a preset uniform value from a condition parameter; if the initial uniform value is greater than or equal to the preset uniform value, adjusting the initial boundary parameters, and determining the target topology optimization structure based on the adjusted boundary parameters; if the initial uniform value is less than the preset uniform value, inputting the initial physical field data and the initial coating die structure model into the topology optimization program to output the target topology optimization structure. In this application, by comparing the initial uniform value with the preset uniform value, when it is greater than or equal to the preset uniform value, it means that the consistency of the outlet velocity of the fluid in the fluid domain is poor at this time. In order to ensure uniformity, it is necessary to adjust the initial boundary parameters, and determine the target topology optimization structure based on the adjusted boundary parameters; when it is less than the preset uniform value, it means that the consistency of the outlet velocity of the fluid in the fluid domain is good at this time, and the initial physical field and the initial coating die structure model can be directly input into the topology optimization program to obtain the target topology optimization structure.

[0136] Embodiment 5

[0137] This embodiment is a further refinement of any of the above embodiments. This embodiment is an optional way to determine the target topology optimization structure based on the adjusted boundary parameters.

[0138] Figure 5 A schematic diagram of a coating die structure optimization method provided in Example 5. Figure 5 As shown, specifically including:

[0139] S501, inputting the adjusted boundary parameters into the fluid dynamics simulation model to output the adjusted physical field data.

[0140] It should be noted that the adjusted physical field data includes the adjusted fluid state, wherein the adjusted fluid state includes the adjusted outlet velocity distribution.

[0141] It should be noted that the fluid state may also include outlet pressure distribution.

[0142] S502, reading the adjusted outlet velocity distribution from the adjusted physical field data.

[0143] S503, calculating an adjusted uniform value based on the adjusted outlet velocity distribution and the fluid outlet velocity uniformity algorithm.

[0144] Specifically, the relevant speed is determined from the adjusted outlet speed distribution, and the adjusted uniform value is calculated based on the relevant speed and the fluid outlet speed uniformity algorithm.

[0145] S504, if the adjusted uniform value is greater than or equal to the preset uniform value, continue to execute the step of adjusting the boundary parameters to calculate the corresponding uniform value until there is an adjusted uniform value that is less than the preset uniform value, and input the corresponding physical field data into the topology optimization program to optimize the output target topology optimization structure based on the initial coating die head structure model.

[0146] It should be noted that if the electronic device determines that the adjusted uniform value is greater than or equal to the preset uniform value, it means that the consistency of the outlet velocity of the fluid in the fluid domain is still poor under the adjusted boundary parameters, then the electronic device continues to adjust the above boundary parameters and uses the fluid outlet velocity uniformity algorithm to calculate the corresponding uniform value, and repeats this process until a boundary parameter is adjusted so that its corresponding adjusted uniform value is less than the preset uniform value, indicating that at this time, under the adjusted boundary parameters, the outlet velocity of the fluid in the fluid domain is more consistent, and then the physical field data output from the fluid dynamics simulation model is input into the topology optimization program, so that the topology optimization program is optimized on the basis of the initial coating die structure model, thereby optimizing the target topology optimization structure.

[0147] It should be noted that in the present application, the boundary parameter of the electronic device is adjusted by fine-tuning on the basis of the boundary parameter adjusted last time, until a boundary parameter is adjusted so that the corresponding adjusted average value is smaller than the preset average value.

[0148] It should be noted that the initial coating die structure model can be input into the topology optimization program before adjusting the boundary parameters.

[0149] S505, if the adjusted uniform value is less than the preset uniform value, the adjusted physical field data is input into the topology optimization program, so as to optimize and output the target topology optimization structure based on the initial coating die structure model.

[0150] The present embodiment provides a coating die structure optimization method, in which the adjusted boundary parameters are input into the fluid dynamics simulation model, and then the adjusted physical field data is output, further, the adjusted outlet velocity distribution is read therein, and further, the adjusted uniform value is calculated, if the adjusted uniform value is greater than or equal to the preset uniform value, then the boundary parameters are adjusted to the step of calculating the corresponding uniform value until a uniform value is adjusted to be less than the preset uniform value, and then the target topology optimization structure is output using the topology optimization program; if the adjusted uniform value is less than the preset uniform value, then the corresponding adjusted physical field data is directly input into the topology optimization program to obtain each topology optimization structure. In the present application, the boundary parameters are continuously adjusted, and finally an adjusted uniform value is made less than the preset uniform value, so a reasonable and accurate target topology optimization structure can be obtained in the present application.

[0151] Embodiment 6

[0152] This embodiment is a further refinement of any of the above embodiments. This embodiment is an optional way to calculate the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm.

[0153] Figure 6 A schematic diagram of a coating die structure optimization method provided in Example 6. Figure 6 As shown, including:

[0154] S601, determining the maximum initial fluid velocity and the minimum initial fluid velocity in the fluid domain from the initial outlet velocity distribution.

[0155] Specifically, the fluid domain includes at least two sub-regions, and the electronic device determines that the fluid speed corresponding to a certain sub-region is the maximum initial fluid speed, and the fluid speed corresponding to another sub-region is the minimum initial fluid speed.

[0156] S602, inputting the maximum initial fluid velocity and the minimum initial fluid velocity into a fluid outlet velocity uniformity algorithm, and calculating an initial difference between the maximum initial fluid velocity and the minimum initial fluid velocity.

[0157] Furthermore, according to the above formula (1), the corresponding difference at this time is calculated, which is the initial difference.

[0158] S603: Determine the initial difference as the initial average value.

[0159] This embodiment provides a coating die structure optimization method. In this application, the maximum initial fluid velocity and the minimum initial fluid velocity are determined, and the initial uniform value is calculated, so as to reflect the outlet consistency of the fluid in the fluid domain.

[0160] Embodiment 7

[0161] This embodiment is a further refinement of any of the above embodiments. Figure 7 A schematic diagram of a coating die structure optimization method provided in Example 7 specifically includes:

[0162] S701, control the target coating die head to start coating.

[0163] S702, monitoring actual coating parameters of the target coating die head during coating; the actual coating parameters include at least one of an actual average outlet velocity value of the fluid, an actual average coating pressure, and an actual coating temperature.

[0164] The actual average velocity value of the fluid at the outlet refers to the average velocity value of the fluid at the outlet when the fluid is actually coated in the target coating die head.

[0165] The actual coating average pressure refers to the average pressure of the fluid when it is actually coated in the target coating die.

[0166] The actual coating temperature refers to the temperature of the fluid when it is actually coated in the target coating die.

[0167] S703, in response to the actual coating parameters not meeting the preset coating parameters, an alarm is issued to prompt.

[0168] The preset coating parameters refer to preset coating parameters, including preset outlet average speed value, preset coating average pressure and preset coating temperature.

[0169] Furthermore, if the electronic device monitors that the actual average outlet speed value does not meet the preset average outlet speed value in the preset coating parameters, an alarm is issued.

[0170] The present embodiment provides a coating die structure optimization method. In the present embodiment, the target coating die is controlled to start coating. In order to ensure uniformity and stability during the coating process, the actual coating parameters are monitored in the present embodiment. If the actual coating parameters do not meet the preset coating parameters, an alarm is issued to prompt the user.

[0171] Embodiment 8

[0172] Figure 8 This is a schematic diagram of an overall coating die structure optimization method provided in Example 8. Figure 8 As shown, specifically including:

[0173] S801, the electronic device receives condition parameters.

[0174] S802, the electronic device generates an initial coating die structure model using the coating die initial structure parameters.

[0175] S803, the electronic device reads the initial boundary parameter from the condition parameter.

[0176] S804, the electronic device inputs the initial boundary parameters into the fluid dynamics simulation model to output initial physical field data.

[0177] S805, the electronic device reads the initial outlet velocity distribution of the fluid in the fluid domain in the initial coating die structure model from the initial physical field data.

[0178] S806, the electronic device calculates an initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm.

[0179] S807, the electronic device reads a preset average value from the condition parameter.

[0180] S808, the electronic device determines whether the initial average value is greater than or equal to the preset average value; if so, execute S809; if not, execute S810.

[0181] S809, the electronic device adjusts the initial boundary parameters, and determines the target topology optimization structure based on the adjusted boundary parameters.

[0182] S810, the electronic device inputs the initial physical field data and the initial coating die structure model into a topology optimization program to output a target topology optimization structure.

[0183] In the above 809, the adjusted outlet velocity distribution is continued to be calculated, and the adjusted uniform value is calculated, and the adjusted uniform value is compared with the preset uniform value, so as to determine the target topology optimization structure.

[0184] Embodiment 9

[0185] The following is an embodiment of the device of the present application. Fig. 9 This is a schematic diagram of a coating die head structure optimization device provided in Example 9. Fig. 9 As shown, the coating die head structure optimization device 900 includes the following modules:

[0186] The receiving module 901 is used to receive condition parameters; the condition parameters include the initial structure parameters of the coating die;

[0187] A generating module 902 is used to generate an initial coating die structure model using the coating die initial structure parameters; the initial coating die structure model is a three-dimensional model;

[0188] The determination module 903 is used to determine the target topology optimization structure based on the initial coating die structure model and the condition parameters; the target topology optimization structure includes the internal and external dimensions and shape of the target coating die; the target topology optimization structure satisfies the constraint parameters in the condition parameters;

[0189] The display module 904 is used to display the target topology optimization structure so as to manufacture a target coating die head based on the target topology optimization structure; the target coating die head enables the fluid to flow out uniformly.

[0190] Optionally, when determining the target topology optimization structure based on the initial coating die structure model and condition parameters, the determination module 903 is specifically used to:

[0191] Reading initial boundary parameters from condition parameters; the initial boundary parameters include initial inlet average velocity and initial inlet temperature of the fluid and initial outlet average pressure;

[0192] Inputting initial boundary parameters into a fluid dynamics simulation model to output initial physical field data; the initial physical field data includes an initial fluid state; the initial fluid state includes an initial outlet velocity distribution;

[0193] The target topology optimization structure is determined based on the initial physical field data and the initial coating die structure model.

[0194] Optionally, when determining the target topology optimization structure based on the initial physical field data and the initial coating die structure model, the determination module 903 is specifically used to:

[0195] Reading the initial outlet velocity distribution of the fluid in the fluid domain in the initial coating die structure model from the initial physical field data; calculating the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm;

[0196] The target topology optimization structure is determined based on the initial uniform value.

[0197] Optionally, when determining the target topology optimization structure based on the initial uniform value, the determination module 903 is specifically used to:

[0198] Read the preset average value from the condition parameter;

[0199] If the initial uniform value is greater than or equal to the preset uniform value, the initial boundary parameters are adjusted, and the target topology optimization structure is determined based on the adjusted boundary parameters;

[0200] If the initial uniform value is less than the preset uniform value, the initial physical field data and the initial coating die structure model are input into the topology optimization program to output the target topology optimization structure.

[0201] Optionally, when determining the target topology optimization structure based on the adjusted boundary parameters, the determination module 903 is specifically used to:

[0202] Inputting the adjusted boundary parameters into the fluid dynamics simulation model to output adjusted physical field data;

[0203] reading an adjusted outlet velocity distribution from the adjusted physical field data;

[0204] Calculating an adjusted uniform value based on the adjusted outlet velocity distribution and the fluid outlet velocity uniformity algorithm;

[0205] If the adjusted uniform value is greater than or equal to the preset uniform value, continue to perform the step of adjusting the boundary parameters to calculate the corresponding uniform value until there is an adjusted uniform value that is less than the preset uniform value, and input the corresponding physical field data into the topology optimization program, so as to optimize and output the target topology optimization structure based on the initial coating die structure model;

[0206] If the adjusted uniform value is less than the preset uniform value, the adjusted physical field data is input into the topology optimization program so as to optimize and output the target topology optimization structure based on the initial coating die structure model.

[0207] Optionally, when the determination module 903 calculates the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm, it is specifically used to:

[0208] determining a maximum initial fluid velocity and a minimum initial fluid velocity in the fluid domain from the initial outlet velocity distribution;

[0209] Inputting the maximum initial fluid velocity and the minimum initial fluid velocity into a fluid outlet velocity uniformity algorithm, and calculating an initial difference between the maximum initial fluid velocity and the minimum initial fluid velocity;

[0210] The initial difference value is determined as the initial average value.

[0211] Optionally, the coating die head structure optimization device provided in this embodiment further includes: a control module and a monitoring module;

[0212] Wherein, the control module is used to control the target coating die head to start coating;

[0213] The monitoring module is used to monitor the actual coating parameters of the target coating die head during coating; the actual coating parameters include at least one of the actual average outlet velocity value of the fluid, the actual average coating pressure and the actual coating temperature; in response to the actual coating parameters not meeting the preset coating parameters, an alarm is issued to prompt.

[0214] Fig.10 This is a schematic diagram of the structure of an electronic device provided in Example 9. Fig.10 As shown, the electronic device 1000 provided in this embodiment includes: at least one processor 1001 and a memory 1002. The processor 1001 and the memory 1002 are connected via a bus 1003.

[0215] In a specific implementation process, at least one processor 1001 executes the computer-executable instructions stored in the memory 1002, so that at least one processor 1001 executes the above method.

[0216] The specific implementation process of the processor 1001 can be found in the above method embodiment, and its implementation principle and technical effect are similar, so this embodiment will not be repeated here.

[0217] In the above embodiments, it should be understood that the processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), etc. A general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc. The steps of the method disclosed in the invention may be directly embodied as being executed by a hardware processor, or may be executed by a combination of hardware and software modules in the processor.

[0218] The memory may include a high-speed memory (Random Access Memory, RAM), and may also include a non-volatile memory (NVM), such as at least one disk storage.

[0219] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, the bus in the drawings of this application is not limited to only one bus or one type of bus.

[0220] The present application also provides a computer program product, including a computer program, which implements the above method when executed by a processor.

[0221] The present application also provides a computer-readable storage medium, in which computer-executable instructions are stored. When a processor executes the computer-executable instructions, the above method is implemented.

[0222] The above-mentioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. The readable storage medium can be any available medium that can be accessed by a general or special-purpose computer.

[0223] An exemplary readable storage medium is coupled to a processor so that the processor can read information from the readable storage medium and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can be located in an application specific integrated circuit (ASIC). Of course, the processor and the readable storage medium can also exist in the device as discrete components.

[0224] The division of units is only a logical function division, and there may be other divisions in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0225] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0226] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0227] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, server, or network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0228] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, disk or optical disk and other media that can store program codes.

[0229] Finally, it should be noted that those skilled in the art will readily conceive of other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention, which follow the general principles of the present invention and include common knowledge or customary technical means in the art not disclosed by the present invention, are not limited to the precise structure described above and shown in the drawings, and may be modified and changed in various ways without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A coating die head structure optimization method, characterized in that: include: receiving condition parameters, wherein the condition parameters include initial structure parameters of the coating die; The initial coating die head structure model is generated by using the initial structure parameters of the coating die head; the initial coating die head structure model is a three-dimensional model; Determining a target topology optimization structure based on the initial coating die structure model and condition parameters; The target topology optimization structure includes the internal and external dimensions and shape of the target coating die head; the target topology optimization structure satisfies the constraint parameters in the conditional parameters; displaying the target topology optimized structure, so as to manufacture a target coating die head based on the target topology optimized structure; The targeted coating die allows for uniform fluid flow.

2. The method according to claim 1, characterized in that The step of determining a target topology optimization structure based on the initial coating die structure model and condition parameters includes: Reading initial boundary parameters from the condition parameters; the initial boundary parameters include the initial inlet average velocity and initial inlet temperature of the fluid and the initial outlet average pressure; Inputting the initial boundary parameters into a fluid dynamics simulation model to output initial physical field data; the initial physical field data includes an initial fluid state; the initial fluid state includes an initial outlet velocity distribution; The target topology optimization structure is determined based on the initial physical field data and the initial coating die structure model.

3. The method according to claim 2, characterized in that The determining of the target topology optimization structure based on the initial physical field data and the initial coating die structure model comprises: Reading the initial outlet velocity distribution of the fluid in the fluid domain of the initial coating die structure model from the initial physical field data; calculating the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm; A target topology optimization structure is determined based on the initial uniform value.

4. The method according to claim 3, characterized in that The step of determining a target topology optimization structure based on the initial uniform value comprises: Reading a preset average value from the condition parameter; If the initial uniform value is greater than or equal to the preset uniform value, adjusting the initial boundary parameter, and determining the target topology optimization structure based on the adjusted boundary parameter; If the initial uniform value is less than the preset uniform value, the initial physical field data and the initial coating die structure model are input into a topology optimization program to output a target topology optimization structure.

5. The method according to claim 4, characterized in that The step of determining the target topology optimization structure based on the adjusted boundary parameters includes: Inputting the adjusted boundary parameters into a fluid dynamics simulation model to output adjusted physical field data; reading an adjusted outlet velocity distribution from the adjusted physical field data; Calculating an adjusted uniform value based on the adjusted outlet velocity distribution and a fluid outlet velocity uniformity algorithm; If the adjusted uniform value is greater than or equal to the preset uniform value, continue to perform the step of adjusting the boundary parameters to calculate the corresponding uniform value until there is an adjusted uniform value that is less than the preset uniform value, and input the corresponding physical field data into the topology optimization program, so as to optimize and output the target topology optimization structure based on the initial coating die structure model; If the adjusted uniform value is less than the preset uniform value, the adjusted physical field data is input into the topology optimization program so as to optimize and output the target topology optimization structure based on the initial coating die structure model.

6. The method according to claim 3, characterized in that The calculating of the initial uniform value based on the initial outlet velocity distribution and the fluid outlet velocity uniformity algorithm comprises: determining a maximum initial fluid velocity and a minimum initial fluid velocity in the fluid domain from the initial outlet velocity distribution; Inputting the maximum initial fluid velocity and the minimum initial fluid velocity into the fluid outlet velocity uniformity algorithm, and calculating an initial difference between the maximum initial fluid velocity and the minimum initial fluid velocity; The initial difference value is determined as an initial average value.

7. The method according to any one of claims 1 to 6, characterized in that The method further comprises: Controlling the target coating die to start coating; Monitor the actual coating parameters of the target coating die head during coating; the actual coating parameters include at least one of the actual average velocity value of the fluid outlet, the actual average coating pressure and the actual coating temperature; in response to the actual coating parameters not meeting the preset coating parameters, issue an alarm to prompt.

8. A coating die head structure optimization device, characterized in that: include: A receiving module, used for receiving condition parameters; the condition parameters include initial structure parameters of the coating die; A generating module, used to generate an initial coating die structure model using the coating die initial structure parameters; the initial coating die structure model is a three-dimensional model; A determination module, used to determine a target topology optimization structure based on the initial coating die structure model and condition parameters; The target topology optimization structure includes the internal and external dimensions and shape of the target coating die head; the target topology optimization structure satisfies the constraint parameters in the conditional parameters; A display module, used for displaying the target topology optimization structure, so as to manufacture a target coating die head based on the target topology optimization structure; The targeted coating die allows for uniform fluid flow.

9. An electronic device, characterized in that: include: Memory and processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory, so that the processor performs the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, which are used to implement the method according to any one of claims 1 to 7 when executed by a processor.

11. A computer program product, characterized in that The invention comprises a computer program, which implements the method according to any one of claims 1 to 7 when being executed by a processor.

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