Component substitution analysis method and device, terminal equipment and readable storage medium

Abstract

The invention provides a component replacement analysis method and device, terminal equipment and a readable storage medium, and the method comprises the steps: automatically obtaining a symbol file, a packaging file and a specification parameter of a to-be-replaced component according to the model of the to-be-replaced component; extracting symbol information of the to-be-replaced component according to the symbol file, and extracting packaging information of the to-be-replaced component according to the packaging file; determining a target replacement component of the to-be-replaced component according to the symbol information, the packaging information and the specification parameters; according to a substitution analysis scoring rule, scoring the target substitution component; and displaying the list of the target replacement components and the corresponding scoring results according to the sequence of the scores from high to low. The target replacement component is determined by combining the symbol file, the packaging file and the specification parameter of the to-be-replaced component, and the target replacement component is automatically scored, so that the efficiency and accuracy of selecting the target replacement component are improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic design automation design technology, and in particular to a component substitution analysis method, device, terminal equipment and readable storage medium. Background Art

[0002] In modern electronic design, KiCad is a GPL electronic design automation (EDA) software package, which is now widely used as an open source tool. However, the problem of component selection and substitution analysis faced in the design process is still a challenge. Traditional substitution analysis often relies on manually looking up component specifications and comparing performance parameters, and then comparing the symbol packages of the devices one by one to see if they meet the substitution conditions. The lack of substitution analysis of linked model files is not only time-consuming, but also prone to errors. With the rapid iteration of electronic products and changes in market demand, it is particularly important to find suitable replacement components quickly and effectively. Summary of the invention

[0003] The main purpose of the present invention is to provide a component substitution analysis method, apparatus, terminal device and readable storage medium, aiming to solve the technical problem of how to quickly and effectively find suitable replacement components.

[0004] In a first aspect, the present invention provides a component replacement analysis method, comprising:

[0005] Automatically obtain the symbol file, package file and specification parameters of the component to be replaced according to the model of the component to be replaced;

[0006] Extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file;

[0007] Determining a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters;

[0008] Scoring the target alternative components according to the alternative analysis scoring rules;

[0009] The list of target replacement components and the corresponding scoring results are displayed in descending order of scores.

[0010] In a specific embodiment, extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file, includes:

[0011] Analyze the expression structure of the symbol file to extract the symbol information of the component to be replaced; wherein the symbol information includes the number of pins, pin names and pin numbers of the component to be replaced;

[0012] The packaging file is analyzed to extract packaging information of the component to be replaced; wherein the packaging information includes the size, position, direction and layout of the pad of the component to be replaced.

[0013] In a specific embodiment, determining the target replacement component of the component to be replaced according to the symbol information, the packaging information and the specification parameters includes:

[0014] Automatically compare the symbol information, the package information and the performance index of each component in the target application software database according to the symbol information, the package information and the specification parameters; wherein the performance index includes electrical characteristics, frequency response and temperature range;

[0015] According to a preset first threshold condition, components whose symbol information, packaging information and performance indicators meet the first threshold condition are screened out as target replacement components.

[0016] In a specific embodiment, scoring the target replacement component according to the replacement analysis scoring rule includes:

[0017] According to the substitution analysis scoring rules, weights are assigned to the matching degrees of various parameter indicators of each target substitution component, and a comprehensive score of each target substitution component is calculated.

[0018] In a specific embodiment, the parameter index matching includes the consistency of the number of symbol pins, the similarity of the symbol pin names, the matching of the package pad size, the matching of the package pad position, the matching of the package assembly dimensions, the matching of the specification parameters and the degree of consistency of the performance indicators.

[0019] In a specific embodiment, before displaying the list of target replacement components and the corresponding scoring results in descending order of scores, the method further includes:

[0020] obtaining a second threshold condition;

[0021] The target replacement components whose scoring results are lower than the second threshold condition are excluded.

[0022] In a specific embodiment, before automatically acquiring the symbol file, package file, and specification parameters of the component to be replaced according to the model of the component to be replaced, the method further includes:

[0023] The model of the component to be replaced input by the user is obtained through the target application software.

[0024] In a second aspect, the present invention provides a component replacement analysis device, comprising:

[0025] An acquisition module, used for automatically acquiring the symbol file, package file and specification parameters of the component to be replaced according to the model of the component to be replaced;

[0026] An extraction module, used for extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file;

[0027] A determination module, used for determining a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters;

[0028] A scoring module, used for scoring the target replacement components according to the replacement analysis scoring rules;

[0029] The display module is used to display the list of target replacement components and the corresponding scoring results in descending order of scores.

[0030] In a third aspect, the present invention provides a terminal device, comprising: a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein when the processor executes the computer program, a component substitution analysis method as described in the first aspect is implemented.

[0031] In a fourth aspect, the present invention provides a computer-readable storage medium storing a computer program, wherein when the computer program is running, the device where the computer-readable storage medium is located is controlled to execute a component replacement analysis method as described in the first aspect.

[0032] Compared with the prior art, the beneficial effects of the present invention are:

[0033] (1) By combining the symbol files, package files and specification parameters of the components to be replaced, the target replacement components are determined, which not only improves the efficiency and accuracy of the target replacement component selection, but also provides a flexible solution for the design team in rapid iteration. In addition, it not only reduces the design delays caused by the unavailability of target replacement components, but also helps to reduce project costs.

[0034] (2) By automatically scoring the target replacement components and reducing the number of manual judgment steps, the target replacement components that support direct Pin to Pin replacement can be quickly and accurately selected. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a flow chart of a component replacement analysis method provided by one embodiment of the present invention;

[0036] Figure 2 is a flow chart of a component replacement analysis method provided by another embodiment of the present invention;

[0037] Figure 3 It is a structural schematic diagram of a component replacement analysis device provided by one embodiment of the present invention;

[0038] Figure 4 It is a structural diagram of a terminal device provided by an embodiment of the present invention.

[0039] in:

[0040] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0041] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] See also Figure 1 , Figure 1 It is a flow chart of a component replacement analysis method provided by one embodiment of the present invention.

[0046] A component replacement analysis method according to an embodiment of the present invention comprises the following steps:

[0047] S100: Automatically obtain symbol files, package files and specification parameters of the components to be replaced according to the models of the components to be replaced.

[0048] In this embodiment, according to the model of the component to be replaced, the symbol file and package file and the component specification parameters of the component to be replaced can be automatically queried in the model and specification parameter database.

[0049] In a specific embodiment, before step S100, the component replacement analysis method further includes the following steps:

[0050] S600: Obtain, through target application software, the model of the component to be replaced input by the user.

[0051] In this embodiment, the target application software may be electronic design automation (EDA) software, such as KiCad software, PADS software, Altium Designer software, etc. The embodiment of the present invention is described by taking KiCad software as an example.

[0052] See also Figure 2 , Figure 2 The following is a flow chart of a component replacement analysis method provided by another embodiment of the present invention. The user can input the model of the component to be replaced in the target application software, and then the target application software automatically searches the existing symbol files and package files, and component specification parameters in the model and specification parameter database.

[0053] S200: extracting symbol information of the component to be replaced according to the symbol file, and extracting packaging information of the component to be replaced according to the packaging file.

[0054] In this embodiment, the symbol information of the components to be replaced is automatically extracted from the symbol file, and the package information of the components to be replaced is automatically extracted from the package file to determine the important parameter information of the components to be replaced. Specifically, useful symbol information including the number of pins, pin name, symbol description, etc. is interpreted and analyzed from the symbol file, and package information such as the pad size layout, assembly size direction, etc. of the package is interpreted and analyzed from the package file, and the data source of the components to be replaced is determined in combination with the component specification parameter values.

[0055] In a specific embodiment, the step S200 extracts the symbol information of the component to be replaced according to the symbol file, and extracts the packaging information of the component to be replaced according to the packaging file, including the following steps:

[0056] S210, analyzing the expression structure of the symbol file, and extracting the symbol information of the component to be replaced; wherein the symbol information includes the number of pins, pin names and pin numbers of the component to be replaced.

[0057] In this embodiment, the symbol file of the component to be replaced is read, and the number of pins, each pin number and pin name of the component to be replaced are directly obtained by automatically analyzing the expression structure of the symbol file, and the corresponding relationship between the component pins is established. The pin number is used to identify the electrical connection, and the pin name helps to understand the electrical function.

[0058] S220, analyzing the packaging file to extract packaging information of the component to be replaced; wherein the packaging information includes the size, position, direction and layout of the pad of the component to be replaced.

[0059] In this embodiment, pad information in the PCB package file of the component to be replaced is automatically extracted, such as the size, position, direction and layout of the pad.

[0060] S300: Determine a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters.

[0061] In this embodiment, the models and parameter values ​​of stock components are compared from the model and specification parameter database to select target replacement component models that meet the replacement conditions.

[0062] In a specific embodiment, the step S300 determines the target replacement component of the component to be replaced according to the symbol information, the packaging information and the specification parameters, and includes the following steps:

[0063] S310, automatically comparing the symbol information, packaging information and performance indicators of each component in the target application software database according to the symbol information, the packaging information and the specification parameters; wherein the performance indicators include electrical characteristics, frequency response and temperature range;

[0064] S320. According to a preset first threshold condition, select components whose symbol information, packaging information, and performance indicators meet the first threshold condition as target replacement components.

[0065] In this embodiment, the first threshold condition includes a parameter index matching threshold for symbol information, package information, and performance index. The target replacement components are preliminarily screened out through the first threshold condition.

[0066] See also Figure 1 and Figure 2 ,By comparing the symbol information of the component to be replaced with the symbol information of the target replacement component, the consistency of the number of symbol pins, the similarity of the symbol pin names and the compatibility of the pin functions are determined.

[0067] By comparing the package information of the components to be replaced with the package information of the target replacement components, the compatibility of the pad size and direction position is analyzed to ensure that the target replacement components can be successfully soldered on the original PCB package. In addition, extracting the directional characteristics and assembly layer identification of the components to be replaced helps to determine whether the target replacement components have similar assembly dimensions and consistent directional polarity.

[0068] After completing the comparison of symbol information and package information, the stage of comparing component specifications and parameters is entered. The performance indicators of each component are automatically compared, including electrical characteristics (such as voltage, current, power), frequency response, temperature range, etc. In this process, the parameter database is automatically matched and queried, and the components to be replaced are horizontally compared with the target replacement components to determine the target replacement components of the components to be replaced.

[0069] S400: Score the target replacement component according to a replacement analysis scoring rule.

[0070] In a specific embodiment, the step S400 scores the target replacement component according to the replacement analysis scoring rule, including the following steps:

[0071] S410: According to the substitution analysis scoring rule, a weight is assigned to the matching degree of each parameter index of each target substitution component, and a comprehensive score of each target substitution component is calculated.

[0072] In a specific embodiment, the parameter index matching includes the consistency of the number of symbol pins, the similarity of the symbol pin names, the matching of the package pad size, the matching of the package pad position, the matching of the package assembly dimensions, the matching of the specification parameters and the degree of consistency of the performance indicators.

[0073] In this embodiment, according to the consistency of the number of symbol pins, the similarity of symbol pin names, the compatibility of pin functions, the matching degree of package pad size, the matching degree of pad position, the matching degree of pad direction, the matching degree of component specifications and performance indicators, weights are assigned to each parameter indicator of each target replacement component, and its comprehensive score is calculated. The score will be displayed to the designer to facilitate the selection of the most suitable replacement options.

[0074] S500: Display the list of target replacement components and corresponding scoring results in descending order of scores.

[0075] In this embodiment, after obtaining the comprehensive score of each target replacement component, it is displayed to the user in descending order. The user can view the list of target replacement components and the corresponding scoring results, and can quickly and accurately select the target replacement components that support direct Pin to Pin replacement.

[0076] The above steps are implemented through automated tools, and the entire substitution analysis process is automatically and efficiently executed by the target application software. Users only need to enter the model of the substitute component, and the target application software will automatically provide a list of alternative components and their detailed comparative analysis results, which will greatly improve design efficiency and accuracy; at the same time, it can also predict possible component shortages in the early stages of design, provide timely solutions for the design team, and further optimize the product development process and reduce costs.

[0077] In a specific embodiment, before displaying the list of target replacement components and the corresponding scoring results in order from high to low scores in step S500, the component replacement analysis method further includes the following steps:

[0078] S700, obtaining a second threshold condition;

[0079] S800: Exclude the target replacement components whose scoring results are lower than the second threshold condition.

[0080] In this embodiment, to ensure accuracy, the target application software provides an input interface for the user to set a second threshold condition to exclude target replacement components with scores lower than the second threshold condition.

[0081] In summary, compared with the prior art, the component replacement analysis method provided by the embodiment of the present invention has the following beneficial effects:

[0082] (1) By combining the symbol files, package files and specification parameters of the components to be replaced, the target replacement components are determined, which not only improves the efficiency and accuracy of the target replacement component selection, but also provides a flexible solution for the design team in rapid iteration. In addition, it not only reduces the design delays caused by the unavailability of target replacement components, but also helps to reduce project costs.

[0083] (2) By automatically scoring the target replacement components and reducing the number of manual judgment steps, the target replacement components that support direct Pin to Pin replacement can be quickly and accurately selected.

[0084] See also Figure 3 , Figure 3 It is a structural schematic diagram of a component replacement analysis device provided by one embodiment of the present invention.

[0085] A component replacement analysis device according to an embodiment of the present invention includes:

[0086] An acquisition module, used for automatically acquiring the symbol file, package file and specification parameters of the component to be replaced according to the model of the component to be replaced;

[0087] An extraction module, used for extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file;

[0088] A determination module, used for determining a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters;

[0089] A scoring module, used for scoring the target replacement components according to the replacement analysis scoring rules;

[0090] The display module is used to display the list of target replacement components and the corresponding scoring results in descending order of scores.

[0091] A component replacement analysis device provided in an embodiment of the present invention can execute all steps and functions of a component replacement analysis method provided in any of the above embodiments, and the specific functions of the device are not described in detail herein.

[0092] See also Figure 4 , Figure 4 It is a structural diagram of a terminal device provided by an embodiment of the present invention.

[0093] The terminal device includes: a processor, a memory, and a computer program stored in the memory and configured to be run by the processor. When the processor executes the computer program, the steps of a component replacement analysis method in each of the above embodiments are implemented, for example: Figure 1 Alternatively, the processor implements the functions of each module in the above-mentioned device embodiments when executing the computer program.

[0094] Exemplarily, the computer program may be divided into one or more modules, and the one or more modules are stored in the memory and executed by the processor to complete the present invention. The one or more modules may be a series of computer program instruction segments that can perform specific functions, and the instruction segments are used to describe the execution process of the computer program in the terminal device. For example, the computer program may be divided into several modules, and the specific functions of each module have been described in detail in a component replacement analysis method provided in any of the above embodiments, and the specific functions of the device will not be repeated here.

[0095] The terminal device may be a computing device such as a desktop computer, a notebook, a PDA, and a cloud server. The terminal device may include, but is not limited to, a processor and a memory. Those skilled in the art may understand that the schematic diagram is only an example of a terminal device and does not constitute a limitation on a terminal device. The terminal device may include more or fewer components than shown in the figure, or may combine certain components, or different components. For example, the terminal device may also include input and output devices, network access devices, buses, etc.

[0096] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the terminal device, and uses various interfaces and lines to connect the various parts of the entire terminal device.

[0097] The memory can be used to store the computer program and / or module, and the processor realizes various functions of the component replacement analysis method by running or executing the computer program and / or module stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, an application required for at least one function (such as a sound playback function, an image playback function, etc.), etc.; the data storage area can store data created according to the use of the mobile phone (such as audio data, a phone book, etc.), etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (SecureDigital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0098] An embodiment of the present invention further provides a computer-readable storage medium, which stores a computer program. When the computer program is running, the device where the computer-readable storage medium is located is controlled to execute a component replacement analysis method in each of the above embodiments.

[0099] If the module integrated in the terminal device is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present invention implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium, etc.

[0100] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A component replacement analysis method, characterized in that: include: Automatically obtain the symbol file, package file and specification parameters of the component to be replaced according to the model of the component to be replaced; Extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file; Determining a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters; Scoring the target alternative components according to the alternative analysis scoring rules; The list of target replacement components and the corresponding scoring results are displayed in descending order of scores.

2. A component replacement analysis method according to claim 1, characterized in that: The step of extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file, comprises: Analyze the expression structure of the symbol file to extract the symbol information of the component to be replaced; wherein the symbol information includes the number of pins, pin names and pin numbers of the component to be replaced; The packaging file is analyzed to extract packaging information of the component to be replaced; wherein the packaging information includes the size, position, direction and layout of the pad of the component to be replaced.

3. A component replacement analysis method according to claim 1, characterized in that: The step of determining a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters includes: Automatically compare the symbol information, the package information and the performance index of each component in the target application software database according to the symbol information, the package information and the specification parameters; wherein the performance index includes electrical characteristics, frequency response and temperature range; According to a preset first threshold condition, components whose symbol information, packaging information and performance indicators meet the first threshold condition are screened out as target replacement components.

4. A component replacement analysis method according to claim 1, characterized in that: Scoring the target alternative components according to the alternative analysis scoring rules includes: According to the substitution analysis scoring rules, weights are assigned to the matching degrees of various parameter indicators of each target substitution component, and a comprehensive score of each target substitution component is calculated.

5. A component replacement analysis method according to claim 4, characterized in that: The parameter index matching includes the consistency of the number of symbol pins, the similarity of the symbol pin names, the matching of the package pad size, the matching of the package pad position, the matching of the package assembly dimensions, the matching of the specification parameters and the degree of consistency of the performance index.

6. A component replacement analysis method according to any one of claims 1 to 5, characterized in that: Before displaying the list of target replacement components and the corresponding scoring results in descending order of scores, the method further includes: obtaining a second threshold condition; The target replacement components whose scoring results are lower than the second threshold condition are excluded.

7. A component replacement analysis method according to any one of claims 1 to 5, characterized in that: Before automatically acquiring the symbol file, package file and specification parameters of the component to be replaced according to the model of the component to be replaced, the method further includes: The model of the component to be replaced input by the user is obtained through the target application software.

8. A component replacement analysis device, characterized in that: include: An acquisition module, used for automatically acquiring the symbol file, package file and specification parameters of the component to be replaced according to the model of the component to be replaced; An extraction module, used for extracting the symbol information of the component to be replaced according to the symbol file, and extracting the packaging information of the component to be replaced according to the packaging file; A determination module, used for determining a target replacement component for the component to be replaced according to the symbol information, the packaging information and the specification parameters; A scoring module, used for scoring the target replacement components according to the replacement analysis scoring rules; The display module is used to display the list of target replacement components and the corresponding scoring results in descending order of scores.

9. A terminal device, characterized in that: include: A processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor implements a component replacement analysis method as claimed in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein when the computer program is executed, the device where the computer-readable storage medium is located is controlled to execute a component replacement analysis method as described in any one of claims 1 to 7.

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