Method and system for checking packaging contour of component based on document identification

Abstract

The invention provides a method and a system for checking a component packaging outline based on document identification, and aims to solve the problems of low efficiency and high error rate in the conventional packaging checking. Component packaging model diagrams and sizes in a product manual are automatically read and extracted through a document recognition module, a CAD module generates a 1: 1 proportion line block diagram and a background-free picture accordingly, an EDA module performs 1: 1 screenshot on a bonding pad layer, and a comparison calculation module compares the two screenshots through an advanced algorithm to calculate the coincidence rate so as to judge the correctness of an EDA packaging diagram. According to the method, various manual formats can be recognized, accurate CAD drawing and complete EDA screenshot are ensured, and the calculation precision reaches the sub-pixel level. If manual information is missing, manual input can be performed, a report display result is generated after calculation, and related pictures and screenshots are stored in a specific area to facilitate subsequent operation. The method can be applied to electronic equipment or a computer readable medium, automatic packaging inspection is achieved, and efficiency and accuracy are improved.

Description

Technical Field

[0001] The invention belongs to the field of computer technology, and in particular relates to a method and system for inspecting component package contours based on document recognition. Background Art

[0002] With the continuous development of electronic technology, PCB circuit board design occupies a vital position in the manufacture of electronic equipment. In the PCB design process, EDA software tools have become the main modeling method, and the modeling of component packaging is a key link. The accuracy of the component packaging model is directly related to the success or failure of the entire PCB circuit board design.

[0003] At present, the existing component packaging inspection methods in the industry have serious limitations. The existing inspection methods only evaluate the rationality and manufacturability of the package pad spacing dimensions based on international or industry standards, but cannot effectively check the correctness of the package dimensions. The inspection work of this key step is almost entirely dependent on manual comparison. The package measurement system equipped with most EDA tools has extremely simple functions and can usually only measure basic parameters such as distance and angle. It is impossible to accurately measure the complex shapes of the package pads. When faced with complex component packaging models, manual inspection not only takes a lot of time, but is also prone to missed inspections and misjudgments. This series of problems has led to a huge waste of manpower, material resources and financial resources, seriously affecting the efficiency and quality of electronic design, and increasing the cost and risk of product development.

[0004] For example, in some high-density PCB design projects, a large number of tiny components are required, whose package structures are complex, with a large number of pins and small pitches. When manually checking the packages of these components, it is difficult to ensure that the size and shape of each package meet the requirements due to visual fatigue of the human eye and the accuracy limitations of the measuring tools. Once a package error occurs, it may cause serious problems such as poor welding and short circuits during the PCB manufacturing process, and even make the entire PCB board scrapped, causing huge economic losses to the company. Summary of the invention

[0005] One of the embodiments of the present invention provides a method for checking component package contours based on document recognition, including: reading a product manual, automatically identifying and capturing a component package model diagram recommended in the manual, and identifying and extracting all dimensions of the package model diagram; using a CAD tool to generate a 1:1 scale outline line diagram of the package model based on the read package model diagram and dimension table, and generating a 1:1 scale picture without background; taking a 1:1 scale screenshot of the pad layer of the corresponding package model drawn in the EDA tool; comparing the 1:1 scale screenshot of the EDA package with the 1:1 scale package line diagram generated by the CAD tool, and calculating the overlap rate as a basis for judging the correctness of the EDA package diagram.

[0006] In one of the embodiments, the document recognition module is capable of recognizing component product manuals in various formats, including but not limited to PDF, DOC and other formats.

[0007] In one of the embodiments, the CAD pad package line diagram generation module can draw package outlines of several shapes according to the identified size information when generating the line diagram.

[0008] In one of the embodiments, the EDA package 1:1 scale image generation module ensures the integrity and accuracy of the screenshots during the screenshot process, without losing any pad information.

[0009] In one of the embodiments, the lesson preparation block uses an image recognition algorithm to calculate the overlap rate and compare the contour lines and the pad diagram.

[0010] In one of the embodiments, if the product manual cannot read the package or does not have the package information, an interface for manually inputting the size parameters is provided to ensure the generation of the line drawing.

[0011] The present invention also provides an embodiment, a system for component package contour inspection based on document recognition, which is applied to any method for inspecting component packages by generating package contour line diagrams through document recognition, and includes: a document recognition module of a component product manual, which is used to read the product manual, automatically identify and intercept the component package model diagram recommended in the manual, and identify and extract all the dimensions of the package model diagram; a CAD pad package line diagram generation module, which uses a CAD tool to generate a 1:1 scale external contour line diagram of the package model based on the read package model diagram and dimension table, and generates a 1:1 scale picture without background; an EDA package 1:1 scale picture generation module, which takes a screenshot of the pad layer of the corresponding package model drawn in the EDA tool at a 1:1 scale; and a comparison calculation module, which compares the 1:1 scale screenshot of the EDA package with the 1:1 scale package line diagram generated by the CAD tool, and calculates the overlap rate as a basis for judging the correctness of the EDA package diagram.

[0012] In one of the embodiments, the line diagram and pictures generated by the CAD pad package line diagram generation module and the screenshots generated by the EDA package 1:1 scale picture generation module are stored in a specific storage area.

[0013] The present invention also provides an embodiment, comprising: one or more processors; a storage device, on which one or more programs are stored, and when the one or more programs are executed by the one or more processors, the one or more processors implement any one of the methods described.

[0014] The present invention further provides an embodiment, a computer storage medium storing a computer program. When the computer program is executed by a processor, any one of the methods described above is implemented.

[0015] The method and system for component package outline inspection based on document recognition provided in the above embodiments have the following beneficial effects:

[0016] The method and system for component package contour inspection based on document recognition of the present invention have many significant beneficial effects. In terms of efficiency improvement, the traditional manual inspection method is extremely time-consuming when facing complex component packages, especially when processing a large number of package models, the speed of manual operation is far from meeting the demand. The present invention greatly shortens the inspection time through a series of processes such as automated document recognition, CAD line diagram generation, EDA package screenshots, and image comparison and calculation of overlap rate. For example, in a PCB design project containing many different types of components, it may take hours or even days of manual inspection time. The method of the present invention can be quickly completed in a short time, significantly improving the efficiency of the entire design process, enabling the project to be promoted faster and enter the next stage of production or testing in advance. In terms of accuracy assurance, manual comparison in the past was easily affected by factors such as human eye visual fatigue, measurement tool accuracy limitations, and personal experience differences, resulting in frequent missed detections and misjudgments. The present invention uses advanced image recognition and analysis algorithms to perform accurate image comparison and calculation of overlap rates, which can accurately detect subtle differences in package size and shape. Whether it is the complex shape of the package pad or the slight size deviation, it can be accurately identified, effectively avoiding errors caused by human negligence, ensuring the accuracy of component packaging, greatly reducing the risk of PCB manufacturing defects and product failures caused by packaging errors, and improving the overall quality and reliability of the product. From the perspective of resource conservation, it reduces the reliance on a large number of manpower and reduces labor costs. At the same time, due to the improved accuracy of inspection, the scrapping and rework of PCB boards caused by packaging errors are avoided, the waste of raw materials and delays in production time are reduced, thereby achieving effective savings in material and financial resources, and bringing significant economic benefits and competitive advantages to enterprises. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0018] Figure 1A working step diagram of a method for inspecting component package outlines based on document recognition provided by a first embodiment of the present invention;

[0019] Figure 2 A system block diagram of component package outline inspection based on document recognition provided in the second embodiment of the present invention.

[0020] Figure 3 It is a schematic diagram of the hardware structure of the electronic device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0023] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0024] Example 1

[0025] refer to Figure 1-Figure 2 The component package outline inspection method based on document recognition of the present invention mainly consists of the following key parts:

[0026] Document recognition of component product manuals: A special document recognition module is designed, which has strong format compatibility and can read product manuals in various common formats, such as PDF, DOC, PPT, etc. During the reading process, advanced image recognition and text extraction technology is used to automatically identify and accurately intercept the component package model diagram recommended in the manual. At the same time, intelligent algorithms are used to deeply analyze the image content, accurately identify and extract all the dimensional information of the package model diagram, including various geometric parameters such as length, width, height, radius, angle, etc., to provide a detailed data basis for the subsequent generation of line frame diagrams. For example, for product manuals in PDF format, the module locates the page area containing the package model diagram by parsing the PDF file structure, and then uses OCR (optical character recognition) technology to extract the dimension annotation text in the figure, and combines the image analysis algorithm to determine the actual size of the figure.

[0027] CAD pad package line diagram generation: Based on the package model diagram and dimension table obtained by the document recognition module, the CAD tool is called to generate a 1:1 scale outline line diagram of the package model. In the CAD software environment, the automatic drawing function is realized through programming, and the package outlines of various complex shapes, such as rectangles, circles, polygons, and various irregular shapes, are accurately drawn according to the extracted dimension information. After the drawing is completed, the graphics processing function of the CAD software is used to generate a 1:1 scale background-free picture for subsequent comparison operations. In this process, the high-precision drawing engine and rich graphics editing functions of the CAD software are fully utilized to ensure the accuracy and standardization of the line diagram. For example, when drawing the outline of a chip package with a complex pin layout, the position and shape of each pin are accurately drawn according to the dimension information to ensure the smoothness of the lines and the tightness of the connection. The generated line diagram can truly reflect the actual package shape of the components.

[0028] EDA package 1:1 scale image generation: For the pad layer of the corresponding package model drawn in the EDA tool, a special screenshot function module is developed to take screenshots at a 1:1 scale. During the screenshot process, a high-precision image capture algorithm is used to ensure the integrity and accuracy of the screenshot without losing any pad information, including tiny pad details and pin connection parts. At the same time, the screenshot is preprocessed as necessary, such as removing noise, adjusting contrast, etc., to improve image quality for subsequent comparison and analysis. For example, when processing a component package in a multi-layer PCB design, the pad information of each layer can be accurately captured and merged into a complete EDA package screenshot, providing an accurate data source for comparison with the CAD line drawing.

[0029] CAD line drawing and EDA package image overlap comparison and overlap rate calculation: Using advanced image recognition and analysis algorithms, the 1:1 scale screenshot of the EDA package and the 1:1 scale package line drawing generated by the CAD tool are accurately compared. During the comparison process, the two images are first registered to align them in space, and then the grayscale value or color value of the image is compared pixel by pixel to determine the overlapping area and the non-overlapping area. The overlap rate is obtained by calculating the ratio of the area of ​​the overlapping area to the area of ​​the entire image. This overlap rate will serve as a key basis for judging the correctness of the EDA package drawing. For example, an image registration algorithm based on feature point matching is used to find the common feature points in the two images, such as the center of the pad, the vertex of the contour, etc., and then the images are transformed and aligned according to these feature points, and then the pixel difference method is used to calculate the overlap rate to ensure the accuracy and reliability of the comparison results.

[0030] In this embodiment, the steps are included: first, the document recognition module is started, and the product manual of the component is imported into the system. The module first automatically recognizes the document format, whether it is PDF, DOC or other common formats, it can be quickly parsed. For manuals in PDF format, the PDF parsing library is used to extract text and image information; for manuals in DOC format, the content is obtained by calling the interface of the office software. In the recognition process, an intelligent image recognition algorithm is used in combination with a deep learning model to accurately locate and intercept the package model diagram. For example, a convolutional neural network (CNN) is used to classify and identify graphic elements in an image, and image areas that meet the characteristics of the package model are screened out. At the same time, OCR technology and natural language processing algorithms are used to extract the dimension annotation text in the figure, convert it into digital information, and construct a dimension table. If the product manual cannot read the package or there is no package information, the system will pop up a manual input interface, prompting the user to enter the size parameters in the specified format to ensure that the generation of the line frame diagram is not affected.

[0031] Then, according to the package model diagram and dimension table obtained by the document recognition module, the CAD software is started and the corresponding automated drawing script is called. The script uses the drawing commands of the CAD software according to the dimension information to accurately draw the 1:1 scale outline line frame diagram of the package model. In the drawing process, different drawing strategies are adopted for packages of different shapes. For example, for circular packages, the command to draw a circle is used and the size is determined according to the radius parameter; for rectangular packages, a rectangle is drawn by specifying the length and width. After the drawing is completed, the layer management and graphic editing functions of the CAD software are used to remove unnecessary auxiliary lines and backgrounds to generate a 1:1 scale picture without background. At the same time, the picture is optimized, such as adjusting the line thickness, color contrast, etc., to improve the clarity and readability of the image, and provide a good visual effect for subsequent comparison.

[0032] In the EDA software environment, a special screenshot tool plug-in is developed. After the user selects the pad layer of the package model that needs to be reviewed, click the screenshot button of the plug-in, and the tool will take a screenshot of the pad layer at a 1:1 ratio. During the screenshot process, a high-precision image capture algorithm is used to ensure that the resolution and accuracy of the screenshot meet the comparison requirements. At the same time, the screenshot is pre-processed, such as using an image filtering algorithm to remove noise and adjusting the contrast through histogram equalization to make the pads and lines in the image clearer. For component packages in multi-layer PCB designs, the tool will capture the pad information of each layer separately and merge them into a complete EDA package screenshot to ensure that all pad information can participate in the comparison.

[0033] Next, the 1:1 scale package line diagram generated by CAD and the 1:1 scale screenshot of the EDA package are imported into the image comparison tool. The tool first uses a feature-based image registration algorithm, such as SIFT (Scale Invariant Feature Transform) or SURF (Speeded Up Robust Features) algorithm, to extract key feature points in the two images and match and align them. Then, the grayscale value or color value of the two images is compared pixel by pixel using the pixel difference method or other similarity measurement algorithms to determine the overlapping and non-overlapping areas. The overlap rate is obtained by calculating the ratio of the area of ​​the overlapping area to the area of ​​the entire image. For example, when calculating the overlap rate, the number of pixels in the overlapping area is divided by the total number of pixels and multiplied by 100% to obtain the percentage value. Finally, the comparison tool generates a report containing the overlap result image and the overlap ratio percentage value. The overlap result image is marked with different colors to indicate the overlapping and non-overlapping areas, so that users can intuitively view the correctness of the package. Users can judge whether there are problems with the EDA package diagram based on the overlap rate and the result image. If the overlap rate is lower than the set threshold, the user will be prompted that there may be a package error, which requires further inspection and correction. Throughout the implementation process, the various modules work closely together, and data transmission is efficient and stable. Through automated processes and advanced algorithms, the errors and tediousness of manual operations are effectively avoided, the efficiency and accuracy of component package inspection are greatly improved, and reliable protection is provided for PCB circuit board design.

[0034] The present invention also provides an embodiment, a system for component package contour inspection based on document recognition, which is applied to any method for inspecting component packages by generating package contour line diagrams through document recognition, and includes: a document recognition module of a component product manual, which is used to read the product manual, automatically identify and intercept the component package model diagram recommended in the manual, and identify and extract all the dimensions of the package model diagram; a CAD pad package line diagram generation module, which uses a CAD tool to generate a 1:1 scale external contour line diagram of the package model based on the read package model diagram and dimension table, and generates a 1:1 scale picture without background; an EDA package 1:1 scale picture generation module, which takes a screenshot of the pad layer of the corresponding package model drawn in the EDA tool at a 1:1 scale; and a comparison calculation module, which compares the 1:1 scale screenshot of the EDA package with the 1:1 scale package line diagram generated by the CAD tool, and calculates the overlap rate as a basis for judging the correctness of the EDA package diagram.

[0035] In one of the embodiments, the line diagram and pictures generated by the CAD pad package line diagram generation module and the screenshots generated by the EDA package 1:1 scale picture generation module are stored in a specific storage area.

[0036] The present invention also provides an embodiment, an electronic device, comprising: one or more processors; a storage device, on which one or more programs are stored, when the one or more programs are executed by the one or more processors, the one or more processors implement any one of the methods described.

[0037] See also Figure 3 , Figure 3 The hardware structure of an electronic device of another embodiment is illustrated, and the electronic device includes:

[0038] The processor 501 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0039] The memory 502 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 502 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 502, and the processor 501 calls and executes the intelligent monitoring method for reclaimed water reuse in the embodiment of this application;

[0040] Input / output interface 503, used to implement information input and output;

[0041] Communication interface 504, used to realize communication interaction between the device and other devices, which can be realized by wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.);

[0042] A bus 505 that transmits information between the various components of the device (e.g., the processor 501, the memory 502, the input / output interface 503, and the communication interface 504);

[0043] The processor 501 , the memory 502 , the input / output interface 503 and the communication interface 504 are connected to each other in communication within the device via the bus 505 .

[0044] The present invention further provides an embodiment, a computer storage medium storing a computer program. When the computer program is executed by a processor, any one of the methods described above is implemented.

[0045] The method and system for component package contour inspection based on document recognition of the present invention have many significant beneficial effects. In terms of efficiency improvement, the traditional manual inspection method is extremely time-consuming when facing complex component packages, especially when processing a large number of package models, the speed of manual operation is far from meeting the demand. The present invention greatly shortens the inspection time through a series of processes such as automated document recognition, CAD line diagram generation, EDA package screenshots, and image comparison and calculation of overlap rate. For example, in a PCB design project containing many different types of components, it may take hours or even days of manual inspection time. The method of the present invention can be quickly completed in a short time, significantly improving the efficiency of the entire design process, enabling the project to be promoted faster and enter the next stage of production or testing in advance. In terms of accuracy assurance, manual comparison in the past was easily affected by factors such as human eye visual fatigue, measurement tool accuracy limitations, and personal experience differences, resulting in frequent missed detections and misjudgments. The present invention uses advanced image recognition and analysis algorithms to perform accurate image comparison and calculation of overlap rates, which can accurately detect subtle differences in package size and shape. Whether it is the complex shape of the package pad or the slight size deviation, it can be accurately identified, effectively avoiding errors caused by human negligence, ensuring the accuracy of component packaging, greatly reducing the risk of PCB manufacturing defects and product failures caused by packaging errors, and improving the overall quality and reliability of the product. From the perspective of resource conservation, it reduces the reliance on a large number of manpower and reduces labor costs. At the same time, due to the improved accuracy of inspection, the scrapping and rework of PCB boards caused by packaging errors are avoided, the waste of raw materials and delays in production time are reduced, thereby achieving effective savings in material and financial resources, and bringing significant economic benefits and competitive advantages to enterprises.

[0046] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for inspecting component package outlines based on document recognition, characterized in that: include: Read the product manual, automatically identify and extract the component package model diagram recommended in the manual, and identify and extract all the dimensions of the package model diagram; Based on the read package model drawing and dimension table, use CAD tools to generate a 1:1 scale outline line drawing of the package model and generate a 1:1 scale picture without background; Take a screenshot of the pad layer of the corresponding package model drawn in the EDA tool at a 1:1 ratio; Compare the 1:1 scale screenshot of the EDA package with the 1:1 scale package line diagram generated by the CAD tool, calculate the overlap rate, calculate the overlap rate between the package outline line diagram and the pad layer, and judge the compliance of the package based on the overlap rate result.

2. The method for component package outline inspection based on document recognition according to claim 1, characterized in that: The document recognition module can recognize component product manuals in various formats, including but not limited to PDF, DOC and other formats.

3. The method for component package outline inspection based on document recognition according to claim 1, characterized in that: When generating a line diagram of a CAD pad package line diagram, a package outline of several shapes is drawn according to the recognized dimension information.

4. The method for component package outline inspection based on document recognition according to claim 1, characterized in that: The package model image and the pad layer image are processed by edge detection to extract the graphic contour; the extracted contours are matched according to morphological analysis to determine the overlapping areas of the corresponding parts.

5. The method for component package outline inspection based on document recognition according to claim 1, characterized in that: The image recognition algorithm is used to calculate the overlap rate and compare the contour lines and pad images.

6. The method for component package outline inspection based on document recognition according to claim 1, characterized in that: Including, when the product manual cannot read the packaging information, an interface for manually entering size parameters is provided for the generation of line drawing.

7. A system for inspecting component package outlines based on document recognition, applied to any method for inspecting component packages by generating package outline line diagrams through document recognition, characterized in that: include: The document recognition module of the component product manual is used to read the product manual, automatically identify and extract the component package model diagram recommended by the manual, and identify and extract all the dimensions of the package model diagram; The CAD pad package line diagram generation module generates a 1:1 scale outline line diagram of the package model based on the read package model diagram and dimension table using CAD tools, and generates a 1:1 scale picture without background; EDA package 1:1 scale image generation module, which takes a screenshot of the pad layer of the corresponding package model drawn in the EDA tool at a 1:1 scale; The comparison calculation module compares the 1:1 scale screenshot of the EDA package with the 1:1 scale package line diagram generated by the CAD tool to calculate the overlap rate.

8. The system for inspecting component packaging by generating a package outline line diagram through document recognition according to claim 7, characterized in that: The line diagram and pictures generated by the CAD pad package line diagram generation module and the screenshots generated by the EDA package 1:1 scale picture generation module are stored in a specific storage area.

9. An electronic device based on the method of claim 1, characterized in that: include: one or more processors; A storage device having one or more programs stored thereon, which, when the one or more programs are executed by the one or more processors, enables the one or more processors to implement the method according to claim 1.

10. A computer readable medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to claim 1 is implemented.

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