Chip resistor and manufacturing method of chip resistor

Abstract

A chip resistor comprises a substrate, a resistance value unit formed on the substrate, and an electrode unit electrically connected with the resistance value unit. The substrate comprises a first surface and a second surface which are located on the two sides, and two side faces which are connected with the two opposite sides of the first surface and the second surface respectively. The resistance unit is formed on the first surface and comprises two resistance blocks arranged at intervals. The electrode unit comprises two electrode blocks which are attached to the side faces and extend to the first surface and the second surface, and a connecting electrode which is connected between the resistor blocks. And each electrode block is provided with a side connecting part attached to the side surface, a first part which is bent from the side connecting part to the first surface and is connected with the resistor block, and a second part which is bent from the side connecting part to the second surface. The invention also provides a manufacturing method of the chip resistor.

Description

Technical Field

[0001] The present invention relates to a passive component and a manufacturing method, and in particular to a chip resistor and a manufacturing method of the chip resistor. Background Art

[0002] See also Figure 1 , is an existing resistor device 1, which includes a substrate 11, an electrode unit 12 formed on the substrate 11, and a resistance unit 13 formed on the substrate 11 and connected to the electrode unit 12. The substrate 11 includes a first surface 111 and a second surface 112 located on opposite sides, and two side surfaces 113 respectively connected to the first surface 111 and the second surface 112 on opposite sides. Among them, the electrode unit 12 includes two electrode plates 121 respectively attached to the side surfaces 113 and both bent and extended to the first surface 111 and the second surface 112. Each of the electrode plates 121 has a side portion 126 attached to the corresponding side surface 113, a first section 127 bent from the side portion 126 to extend to the first surface 111, and a second section 128 bent from the side portion 126 to extend to the second surface 112. The resistance unit 13 includes a resistance layer 131 connected to the first section 127 of the electrode plate 121 , so that the resistance device 1 can provide a required resistance value after being electrically connected to other devices through the electrode plate 121 .

[0003] When the conventional resistor device 1 is in operation, heat energy is bound to be generated. The heat dissipation mechanism of the conventional resistor device 1 is usually to allow the heat energy generated by the resistor layer 131, which mainly generates heat energy, to be dissipated through the substrate 11 toward the second section 128 of the electrode plate 121. However, in the case where the heat energy is relatively concentrated in the resistor layer 131, it is found in actual operation that the heat energy is not smoothly and effectively dissipated along the default path, so that the related equipment installed with the conventional resistor device 1 cannot meet the heat dissipation requirements of higher power, so it must be improved. Summary of the invention

[0004] The object of the present invention is to provide a chip resistor and a method for manufacturing the chip resistor which can optimize the heat dissipation effect during operation.

[0005] The chip resistor of the present invention comprises a substrate, a resistance unit formed on the substrate, and an electrode unit formed on the substrate and electrically connected to the resistance unit.

[0006] The substrate includes a first surface and a second surface respectively located at opposite sides, and two side surfaces respectively connected to opposite sides of the first surface and the second surface.

[0007] The resistance unit is formed on the first surface of the substrate and includes two resistance blocks spaced apart from each other along a reference line.

[0008] The electrode unit includes two electrode blocks attached to the side surfaces and extending to the first surface and the second surface, and a connecting electrode formed on the first surface and connected to the resistor blocks along the reference line. Each electrode block has a side connection portion attached to the corresponding side surface, a first portion extending from the side connection portion to the first surface and connected to the corresponding resistor block, and a second portion extending from the side connection portion to the second surface.

[0009] The purpose of the present invention and the solution to its technical problems can be further achieved by adopting the following technical measures.

[0010] Preferably, in the aforementioned chip resistor, a projection range of the second portion of each of the electrode blocks toward the first surface is larger than a projection range of the first portion toward the first surface.

[0011] Preferably, the aforementioned chip resistor, wherein the chip resistor further includes a protection unit stacked on the first surface of the substrate and shielding the outer side of the resistance unit.

[0012] Preferably, in the aforementioned chip resistor, each of the electrode blocks of the electrode unit further has an externally visible portion stacked on the first portion, and the protection unit shields the resistor block and the connecting electrode.

[0013] The manufacturing method of the chip resistor of the present invention includes a preparation step, a formation step, a shielding step, an attachment step, a cleaning step, a covering step, and a bonding step.

[0014] The preparation step is to prepare a substrate, wherein the substrate comprises a first surface and a second surface respectively located at opposite sides, and two side surfaces respectively connected to opposite sides of the first surface and the second surface.

[0015] The forming step is to form a connecting electrode and two first metal parts respectively located at opposite sides of the connecting electrode on the first surface of the substrate, and to form second metal parts respectively located opposite to the first metal parts on the second surface of the substrate.

[0016] The shielding step is to define an unshielded area on the first surface of the substrate located on opposite sides of the connecting electrode and extending to the first metal part, and to form a shielding layer shielding the connecting electrode, the first metal part, and the unshielded area.

[0017] The attachment step is to form two resistor blocks on the first surface outside the shielding layer.

[0018] The clearing step is to clear the shielding layer.

[0019] The covering step covers the connecting electrode, the resistor block, and a portion of the first metal portion with a protective layer.

[0020] The joining step is to form two external electrode parts on the first metal part, each part of which extends to the protective layer, and to form two side metal parts on opposite sides of the side surface adjacent to the substrate, which simultaneously connect the first metal part, the second metal part, and the external electrode part, so that the first metal part, the second metal part, the external electrode part, and the side metal part respectively located on opposite sides are connected together to form two electrode blocks.

[0021] Another method for manufacturing a chip resistor of the present invention includes a preparation step, a formation step, a masking step, an attachment step, a cleaning step, a covering step, a first bonding step, and a second bonding step.

[0022] The preparation step is to prepare a substrate, wherein the substrate comprises a first surface and a second surface respectively located at opposite sides, and two side surfaces respectively connected to opposite sides of the first surface and the second surface.

[0023] The forming step is to form a connecting electrode and two first metal parts respectively located at opposite sides of the connecting electrode on the first surface of the substrate, and to form second metal parts respectively located opposite to the first metal parts on the second surface of the substrate.

[0024] The shielding step is to define an unshielded area on the first surface of the substrate located on opposite sides of the connecting electrode and extending to the first metal part, and to form a shielding layer shielding the connecting electrode, the first metal part, and the unshielded area.

[0025] The attachment step is to form two resistor blocks on the first surface outside the shielding layer.

[0026] The clearing step is to clear the shielding layer.

[0027] The covering step covers the connecting electrode, the resistor block, and a portion of the first metal portion with a protective layer.

[0028] The first bonding step is to form two external electrode portions on the first metal portion, each portion of which extends to the protective layer.

[0029] The second joining step is to form two side metal parts that simultaneously connect the first metal part, the second metal part, and the external electrode part on opposite sides of the side surface adjacent to the substrate after the first joining step, so that the first metal part, the second metal part, the external electrode part, and the side metal part located on opposite sides are connected together to form two electrode blocks.

[0030] Preferably, in the manufacturing method of the aforementioned chip resistor, each of the electrode blocks has a side connection portion attached to the corresponding side surface, a first portion bent from the side connection portion and extending to the first surface and connected to the resistor block, and a second portion bent from the side connection portion and extending to the second surface, and a projection range of the second portion of each electrode block toward the first surface is larger than a projection range of the first portion toward the first surface.

[0031] The beneficial effect of the present invention is that the chip resistor of the present invention can form a separation effect between the electrode blocks through the connecting electrode, thereby allowing the heat energy generated by the resistor block to be separated into two hot spots at the position between the electrode blocks, so that the heat energy is more easily conducted to the second part by the heat conduction effect of the electrode block and dissipated, thereby optimizing the heat dissipation effect during operation. In addition, the manufacturing method of the chip resistor of the present invention can manufacture the chip resistor of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a perspective view illustrating a conventional resistor device;

[0033] Figure 2 is a three-dimensional diagram illustrating an embodiment of a chip resistor of the present invention;

[0034] Figure 3 is a block flow chart illustrating a first method embodiment of a method for manufacturing a chip resistor of the present invention;

[0035] Figure 4-1 and Figure 4-2 This is a step diagram, with Figure 3 Describe the various steps of the first method embodiment;

[0036] Figure 5 is a schematic diagram illustrating a masking step of the first method embodiment;

[0037] Figure 6 is a schematic diagram illustrating the heat dissipation mechanism of the embodiment of the article when in operation;

[0038] Figure 7 This is a schematic diagram from a top-down angle, with Figure 6 Describing the function of a connecting electrode of an electrode unit of the embodiment of the article;

[0039] Figure 8 is a block flow chart illustrating a second method embodiment of a method for manufacturing a chip resistor of the present invention; and

[0040] Figure 9-1 and Figure 9-2 It is a flow chart, with Figure 8 A first bonding step and a second bonding step of the second method embodiment are described. DETAILED DESCRIPTION

[0041] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0042] See also Figure 2 , is an embodiment of the chip resistor of the present invention, which adopts Figure 3 The present invention is a chip resistor manufacturing method of the first method embodiment, which includes a preparation step 71, a formation step 72, a masking step 73, an attachment step 74, a cleaning step 75, a covering step 76, and a bonding step 77.

[0043] See also Figure 3 , Figure 4-1 and Figure 4-2 The preparation step 71 is to prepare a substrate 2, wherein the substrate 2 includes a first surface 21 and a second surface 22 located on opposite sides, and two side surfaces 23 connected to the first surface 21 and the second surface 22 on opposite sides. The substrate 2 is selected from ceramic, alumina, aluminum nitride, zirconium oxide toughened alumina (ZTA, zirconia toughened alumina), etc., which have high mechanical strength and good heat dissipation. In the first method embodiment, the case where the substrate 2 is made of ceramic material is used for illustration.

[0044] The forming step 72 is to form a connecting electrode 42 and two first metal parts 411' respectively located on opposite sides of the connecting electrode 42 on the first surface 21 of the substrate 2 by sintering or sputtering. Then, the second metal parts 412' respectively opposite to the first metal parts 411' are formed on the second surface 22 of the substrate 2 by the same method. If the sintering process is adopted, the copper (alloy) paste can be applied to a specific position (i.e., the position opposite to the first metal part 411' on the second surface 22), and then sintered at a high temperature; if the sputtering process is adopted, the position where the connecting electrode 42, the first metal part 411' and the second metal part 412' are not required to be formed can be shielded, thereby sputtering a copper metal layer of sufficient thickness at the required position for forming the connecting electrode 42, the first metal part 411' and the second metal part 412', and the forming step 72 can be completed at one time.

[0045] The masking step 73 is as follows Figure 5 As shown, an unshielded area Z extending between opposite sides of the connecting electrode 42 and the first metal portion 411' is defined on the first surface 21 of the substrate 2, and a shielding layer S is formed outside the unshielded area Z and shields the connecting electrode 42 and the first metal portion 411'.

[0046] The attachment step 74 is to form two resistor blocks 31 spaced apart from each other along a reference line L on the first surface 21 in a range outside the shielding layer S (i.e., the non-shielding area Z) (see FIG. 1 ). Figure 2 , Figure 4-1 Specifically, the resistor block 31 is usually formed by sputtering, such as nickel-chromium alloy, and the material is not limited thereto, thereby generating the required resistance value, that is, providing the main electrical properties. The connecting electrode 42 is connected between the resistor blocks 31 along the reference line L.

[0047] The sputtering process performed in the attachment step 74 will uniformly plate a material layer of equal thickness on the shielding layer S and the position where the resistor block 31 is to be formed except the shielding layer S. The removal step 75 removes the shielding layer S by solvent cleaning, thereby removing the material layer plated on the shielding layer S together with the shielding layer S. Then, the position where the shielding layer S is not formed (i.e., the non-shielding area Z), that is, the predetermined position of the resistor block 31, will leave the material layer to be plated to form the resistor block 31.

[0048] Re-read Figure 3 and Figure 4-2The covering step 76 covers the connecting electrode 42, the resistor block 31, and a portion of the first metal portion 411' with a protective layer 51. Specifically, the protective layer 51 is made of epoxy resin, mainly using its material properties of high thermal conductivity and high insulation, but not limited thereto, so as to provide a protective effect of resistance to the external environment on the connecting electrode 42, the resistor block 31, and the first metal portion 411'.

[0049] The bonding step 77 is to form two outer electrode parts 413' on the first metal part 411', with a part extending to the protective layer 51, and to form two side metal parts 410' on opposite sides of the side surface 23 adjacent to the substrate 2, which are connected to the first metal part 411', the second metal part 412', and the outer electrode part 413', so that the first metal part 411', the second metal part 412', the outer electrode part 413', and the side metal part 410' located on opposite sides are connected together to form two electrode blocks 41. The electrode block 41 can be made of low-temperature silver paste, so as to be made by a simple coating technique.

[0050] Re-read Figure 2 And cooperate Figure 6 The manufactured article embodiment comprises the substrate 2, a resistance unit 3 formed on the substrate 2, an electrode unit 4 formed on the substrate 2 and electrically connected to the resistance unit 3, and a protection unit 5 stacked on the substrate 2 and shielding the outside of the resistance unit 3. The resistance unit 3 includes the resistor block 31, the electrode unit 4 includes the electrode block 41 and the connecting electrode 42, and the protection unit 5 is the protection layer 51.

[0051] Each of the electrode blocks 41 has a side connection portion 410 attached to the corresponding side surface 23, a first portion 411 extending from the side connection portion 410 to the first surface 21 and connected to the corresponding resistor block 31, a second portion 412 extending from the side connection portion 410 to the second surface 22, and an external portion 413 superimposed on the first portion 411. The projection range of the second portion 412 of each electrode block 41 toward the first surface 21 is greater than the projection range of the first portion 411 toward the first surface 21. Specifically, each of the electrode blocks 41 is as follows: Figure 4-2 The side metal portion 410' (corresponding to the side connection portion 410), the first metal portion 411' (corresponding to the first portion 411), the second metal portion 412' (corresponding to the second portion 412), and the external electrode portion 413' (corresponding to the external display portion 413) are collectively constituted.

[0052] See also Figure 6 and Figure 7 When the article embodiment is in operation, the heat energy generated by the resistor block 31 will be dissipated on the first surface 21 due to the presence of the connecting electrode 42. Figure 7 As shown, the ground is divided into two main hot spots H. Figure 6 As shown, the heat energy that has been dispersed into two main hot spots H is more likely to pass through the first portion 411 of the electrode block 41 with better thermal conductivity, and then be guided to the second portion 412 via the side portion 410. In addition, the range covered by the second portion 412 of the electrode block 41 on the second surface 22 is substantially larger than the range covered by the first portion 411 on the first surface 21. Since the heat energy is mainly discharged in a direction away from the second surface 22, the second portion 412 with a larger coverage area can be used to optimize the heat dissipation performance by increasing the heat dissipation area.

[0053] See also Figure 8 , Figure 9-1 and Figure 9-2 , is a second method embodiment of the manufacturing method of the chip resistor of the present invention. The difference between the second method embodiment and the first method embodiment is that after the covering step 76 corresponding to the first method embodiment, the second method embodiment further includes a first bonding step 77' and a second bonding step 78' performed in sequence. The first bonding step 77' is to form two external electrode parts 413' on the first metal part 411', each of which has a portion extending outside the protective layer 51. The second bonding step 78' is to form two side metal parts 410' that simultaneously connect the first metal part 411', the second metal part 412', and the external electrode part 413' on opposite sides of the side surface 23 adjacent to the substrate 2, so that the first metal part 411', the second metal part 412', the external electrode part 413', and the side metal part 410' located on opposite sides are connected together to form the electrode block 41.

[0054] Specifically, the second method embodiment is only different in the order of forming the side metal part 410', so it can be used to meet process requirements such as differences in the timing of cutting grains, and can also be freely selected according to the parameter conditions of the manufacturing equipment. In addition, it can also be made into the article embodiment with the same specifications and the same quality as the first method embodiment.

Claims

1. A chip resistor, comprising a substrate, the substrate comprising a first surface and a second surface located at opposite sides, and two side surfaces connected to the first surface and the second surface at opposite sides, wherein: The chip resistor also includes: a resistance unit formed on the first surface of the substrate and comprising two resistance blocks spaced apart from each other along a reference line; and An electrode unit is formed on the substrate and electrically connected to the resistance unit, and includes two electrode blocks attached to the side surfaces and both extending to the first surface and the second surface, and a connecting electrode formed on the first surface and connected between the resistance blocks along the reference line, each of the electrode blocks having a side connection portion attached to the corresponding side surface, a first portion bent from the side connection portion and extending to the first surface and connected to the corresponding resistance block, and a second portion bent from the side connection portion and extending to the second surface.

2. The chip resistor according to claim 1, characterized in that: A projection range of the second portion of each electrode block toward the first surface is larger than a projection range of the first portion toward the first surface.

3. The chip resistor according to claim 1 or 2, characterized in that: The chip resistor further includes a protection unit which is stacked on the first surface of the substrate and shields the outer side of the resistance unit.

4. The chip resistor according to claim 3, characterized in that: Each of the electrode blocks of the electrode unit further comprises an externally visible portion stacked on the first portion, and the protection unit shields the resistor block and the connecting electrode.

5. A method for manufacturing a chip resistor, comprising a preparation step, wherein the preparation step is to prepare a substrate, wherein the substrate comprises a first surface and a second surface located at opposite sides, and two side surfaces connected to opposite sides of the first surface and the second surface, wherein: The manufacturing method of the chip resistor further comprises: forming a connecting electrode and two first metal parts respectively located at opposite sides of the connecting electrode on the first surface of the substrate, and forming second metal parts respectively located opposite to the first metal parts on the second surface of the substrate; A shielding step, defining an unshielded area on the first surface of the substrate located between the two opposite sides of the connecting electrode and extending to the first metal portion, and forming a shielding layer shielding the connecting electrode, the first metal portion, and the area outside the unshielded area; An attachment step of forming two resistor blocks on the first surface outside the shielding layer; A clearing step, clearing the shielding layer; A covering step of covering the connecting electrode, the resistor block, and a portion of the first metal portion with a protective layer; and In the bonding step, two external electrode parts having a portion extending to the protective layer are respectively formed on the first metal part, and two side metal parts connecting the first metal part, the second metal part, and the external electrode part are respectively formed on opposite sides of the side surface adjacent to the substrate, so that the first metal part, the second metal part, the external electrode part, and the side metal part respectively located on opposite sides are connected together to form two electrode blocks.

6. A method for manufacturing a chip resistor, comprising a preparation step, wherein the preparation step is to prepare a substrate, wherein the substrate comprises a first surface and a second surface located at opposite sides, and two side surfaces connected to opposite sides of the first surface and the second surface, respectively; characterized in that: The manufacturing method of the chip resistor further comprises: forming a connecting electrode and two first metal parts respectively located at opposite sides of the connecting electrode on the first surface of the substrate, and forming second metal parts respectively located opposite to the first metal parts on the second surface of the substrate; A shielding step, defining an unshielded area on the first surface of the substrate located between the two opposite sides of the connecting electrode and extending to the first metal portion, and forming a shielding layer shielding the connecting electrode, the first metal portion, and the area outside the unshielded area; An attachment step of forming two resistor blocks on the first surface outside the shielding layer; A clearing step, clearing the shielding layer; A covering step of covering the connecting electrode, the resistor block, and a portion of the first metal portion with a protective layer; A first bonding step of forming two external electrode portions, each of which has a portion extending to the protective layer, on the first metal portion; and A second joining step, after the first joining step, two side metal parts that simultaneously connect the first metal part, the second metal part, and the external electrode part are respectively formed on opposite sides of the side surface adjacent to the substrate, so that the first metal part, the second metal part, the external electrode part, and the side metal part located on opposite sides are connected together to form two electrode blocks.

7. The method for manufacturing a chip resistor according to claim 5 or 6, characterized in that: Each of the electrode blocks has a side connection portion attached to the corresponding side surface, a first portion bent from the side connection portion and extending to the first surface and connected to the resistor block, and a second portion bent from the side connection portion and extending to the second surface, and a projection range of the second portion of each of the electrode blocks toward the first surface is larger than a projection range of the first portion toward the first surface.

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